CN105163482A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN105163482A CN105163482A CN201510548067.3A CN201510548067A CN105163482A CN 105163482 A CN105163482 A CN 105163482A CN 201510548067 A CN201510548067 A CN 201510548067A CN 105163482 A CN105163482 A CN 105163482A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pad
- pcb
- stiffening plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 claims abstract description 16
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 claims description 19
- 239000006071 cream Substances 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board. The printed circuit board comprises a first bonding pad, a second bonding pad, a first reinforcement plate and a second reinforcement plate, wherein the first bonding pad is arranged on a narrow plate frame region on the surface of the printed circuit board and/or a corner connection region of the surfaces of a narrow plate frame and a printed circuit board main body, and the surface of the first bonding pad is coated with soldering tin paste for welding the first reinforcement plate; the second bonding pad is arranged on a side cross section, corresponding to the narrow plate frame, of the printed circuit board and/or a side cross section of the circuit board on a connection corner of the narrow plate frame and the printed circuit board main body, and the surface of the second bonding pad is coated with soldering tin paste for welding the second reinforcement plate; the first reinforcement plate is arranged above the first bonding pad and welded with the first bonding pad; and the second reinforcement plate is arranged above the second bonding pad and welded with the second bonding pad. With the technical scheme provided by the embodiment of the invention, the bonding pads are arranged on the surface of the narrow plate frame of the printed circuit board and the side cross section, the reinforcement plates are welded above the bonding pads, and thus, the broken resistant ability of the narrow plate frame region of the printed circuit board is improved.
Description
Technical field
The embodiment of the present invention relates to printed circuit board (PCB) Strengthening Technology field, particularly relates to a kind of printed circuit board (PCB).
Background technology
The fast development of electronic product makes extra-thin electronic product be subject to popular favor.Usually, extra-thin electronic product is by thinner printed circuit board (PCB), and electronic product internal circuit configuration spatial design is obtained compacter, narrower realization.When printed circuit board space structural design obtain compact narrow time, circuit board sheet frame is becoming narrow in local, forms " L " shape, " C " shape or other shapes with the printed circuit board (PCB) in narrow boards frame region.Figure 1A and Figure 1B is the narrow boards mount structure schematic diagram of printed circuit board (PCB) in prior art, and wherein, in Figure 1A, printed circuit board (PCB) narrow boards frame 10 is regular rectangular shape; In Figure 1B, the narrow boards frame 11 of printed circuit board (PCB) is the banded circular arc connected between two bodies of printed circuit board (PCB).
Owing to there is the sheet frame narrowed suddenly in above-mentioned printed circuit board (PCB), in addition printed circuit board (PCB) is thinner, and narrow boards frame place stress is deteriorated, and narrow boards frame is stressed easily to fracture, add the defect rate of printed circuit panel products in production process, reduce the production efficiency of printed circuit board (PCB).
Summary of the invention
The embodiment of the present invention provides a kind of printed circuit board (PCB), to overcome the defect of the stressed frangibility of printed circuit board (PCB) narrow boards frame.
Embodiments provide a kind of printed circuit board (PCB), described printed circuit board (PCB) comprises:
First pad, be positioned at the turning join domain of printed circuit board surface narrow boards frame region and/or narrow boards frame and main body printed circuit board surface, the first bond pad surface is coated with scolding tin tin cream, for welding the first stiffening plate;
Second pad, be positioned on the printed circuit board (PCB) side cross section corresponding with narrow boards frame region, and/or on the side cross section of the circuit board of narrow boards frame and main body printed circuit board (PCB) connecting corner, the second bond pad surface is coated with scolding tin tin cream, for welding the second stiffening plate;
First stiffening plate, is positioned at the top of described first pad, with described first pad solder;
Second stiffening plate, is positioned at the top of described second pad, with described second pad solder.
Further, described first stiffening plate and described second stiffening plate one-body molded by one piece of stiffening plate, described second stiffening plate relative to described first stiffening plate bending arrange.
Further, the overlay area area ratio of described first stiffening plate and described first pad is 1:1; The overlay area area ratio of described second stiffening plate and described second pad is 1:1.
Further, described first pad and described second pad cover on a printed circuit with banded, latticed or integral type shape.
Further, described first pad is positioned at front and/or the reverse side of printed circuit board (PCB).
Further, described second pad is positioned on printed circuit board (PCB) side cross section or on two side cross sections.
Further, described first stiffening plate and described second stiffening plate are can by the metallic plate of scolding tin tin cream and pad solder.
Further, described stiffening plate and described pad are welded by paster welding procedure.
Further, the electronic component in described printed circuit board surface is arranged on non-narrow boards frame region and non-described turning join domain.
The technical scheme that the embodiment of the present invention provides, by at the narrow boards frame region, front of printed circuit board (PCB) and/or the turning join domain of narrow boards frame and main body printed circuit board surface, and lay pad on the printed circuit board (PCB) side cross section corresponding with narrow boards frame region and/or on the side cross section of the circuit board of narrow boards frame and main body printed circuit board (PCB) connecting corner, weld reinforcement plate on pad, improve the intensity at printed circuit board (PCB) narrow boards frame place, make narrow boards frame place can bear larger stress, prevent printed circuit board (PCB) narrow boards frame place in assembling and product use procedure stressed and situation about fractureing, improve product quality.
Accompanying drawing explanation
Figure 1A is the first narrow boards mount structure schematic diagram of printed circuit board (PCB) in prior art;
Figure 1B is the second narrow boards mount structure schematic diagram of printed circuit board (PCB) in prior art;
Fig. 2 A is the structural representation of a kind of printed circuit board (PCB) that the embodiment of the present invention one provides;
Fig. 2 B is the structural representation of a kind of printed circuit board (PCB) that the embodiment of the present invention one provides;
Fig. 2 C is the cross-sectional view of a kind of printed circuit board (PCB) that the embodiment of the present invention one provides;
Fig. 3 is the structural representation of a kind of printed circuit board (PCB) that the embodiment of the present invention two provides;
Fig. 4 A is the first structural representation of the pad that the embodiment of the present invention two provides;
Fig. 4 B is the second structural representation of the pad that the embodiment of the present invention two provides;
Fig. 4 C is the third structural representation of the pad that the embodiment of the present invention two provides; .
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not entire infrastructure.
Embodiment one
Fig. 2 A is the structural representation of a kind of printed circuit board (PCB) that the embodiment of the present invention one provides; Fig. 2 B is by the structural representation of the printed circuit board (PCB) of welding with reinforcement plate on pad; Fig. 2 C is the cross-sectional view of cutting along the hatching AA ' of printed circuit board (PCB) in Fig. 2 B.See Fig. 2 A, Fig. 2 B and Fig. 2 C, described printed circuit board (PCB) comprises: the first pad 20, second pad 21, first stiffening plate 22 and the second stiffening plate 23.First pad 20 is positioned at printed circuit board surface narrow boards frame 24 region and/or narrow boards frame 24 has scolding tin tin cream 27, for welding the first stiffening plate 22 with turning join domain 26, first pad 20 surface-coated on main body printed circuit board (PCB) 25 surface; Second pad 21, be positioned on the printed circuit board (PCB) side cross section 28 corresponding with narrow boards frame 24 region, and/or narrow boards frame 24 is with on the side cross section 29 of the circuit board of main body printed circuit board (PCB) 25 connecting corner, the second pad 21 surface-coated has scolding tin tin cream 27, for welding the second stiffening plate 23; First stiffening plate 22, is positioned at the top of described first pad 20, welds with described first pad 20; Second stiffening plate 23, is positioned at the top of described second pad 21, welds with described second pad 21.
Wherein, narrow boards frame 24 refers to that the sheet frame that printed circuit board (PCB) is adjacent is compared, and width is less than the region of adjacent sheet frame.
Preferably, the first stiffening plate 22 and the second stiffening plate 23 one-body molded by one piece of stiffening plate, the second stiffening plate 23 relative to first stiffening plate 22 bend arrange.
As shown in Figure 2 B, first stiffening plate 22 and the second stiffening plate 23 are welded on the first pad 20 and the second pad 21 by scolding tin tin cream 27 respectively, first pad 20 is positioned at printed circuit board surface narrow boards frame 24 region and narrow boards frame 24 is positioned on the printed circuit board (PCB) side cross section 28 corresponding with narrow boards frame 24 region with turning join domain 26, second pad 21 on main body printed circuit board (PCB) 25 surface and on the side cross section 29 of the circuit board of narrow boards frame 24 and main body printed circuit board (PCB) 25 connecting corner.Hatching AA ' along printed circuit board (PCB) in Fig. 2 B cuts and obtains Fig. 2 C, in Fig. 2 C, printed circuit board base board 210 surface is upwards followed successively by the first pad 20, scolding tin tin cream 27 and the first stiffening plate 22, printed circuit board base board 210 side cross section is upwards followed successively by the second pad 21, scolding tin tin cream 27 and the second stiffening plate 23.
Preferably, the overlay area area ratio of the first stiffening plate 22 and the first pad 20 is 1:1; The overlay area area ratio of the second stiffening plate 23 and the second pad 21 is 1:1.
The technical scheme that the present embodiment provides, by at the narrow boards frame region, front of printed circuit board (PCB) and the turning join domain of narrow boards frame and main body printed circuit board surface, and lay pad on the printed circuit board (PCB) side cross section corresponding with narrow boards frame region and on the side cross section of the circuit board of narrow boards frame and main body printed circuit board (PCB) connecting corner, weld reinforcement plate on described pad, improve the intensity at printed circuit board (PCB) narrow boards frame place, narrow boards frame place is not easily stressed fractures in assembling and product use procedure to make printed circuit board (PCB).
Embodiment two
On the basis of embodiment one, in the execution mode of the present embodiment, as shown in Figure 3, the first pad 20 is positioned at printed circuit board surface narrow boards frame 24 region, and the second pad 20 is positioned on the printed circuit board (PCB) side cross section 28 corresponding with narrow boards frame 24 region.First pad 20 and the second pad 21 are welded with the first stiffening plate 22 and the second stiffening plate 23 respectively by scolding tin tin cream 27.First stiffening plate 22 and the second stiffening plate 23 one-body molded by one piece of stiffening plate, the second stiffening plate 23 relative to first stiffening plate 22 bend arrange.The overlay area area ratio of the first stiffening plate 22 and the first pad 20 is 1:1; The overlay area area ratio of the second stiffening plate 23 and the second pad 21 is 1:1.
Preferably, described first pad and described second pad cover on a printed circuit with banded, latticed or integral type shape.As shown in Figure 4 A, bond pad shapes is banded; As shown in Figure 4 B, bond pad shapes is latticed, and above-mentioned two kinds of bond pad shapes decrease scolding tin tin cream use amount, improves printed circuit board (PCB) narrow boards frame place intensity of knowing clearly, has saved production cost.Described integral type shape is that the coating of pad entirety is produced on its printed circuit board (PCB) region covered, as shown in Figure 4 C.After the pad of described integral type shape and described stiffening plate are welded by scolding tin tin cream, described stiffening plate is connected more firm with described pad, is more conducive to the intensity improving printed circuit board (PCB) narrow boards frame place.
Preferably, described first pad is positioned at front and/or the reverse side of printed circuit board (PCB).Described first pad is produced on the surface of printed circuit board (PCB), and surf zone is without any electronic component.Described first pad only can be laid in the front of printed circuit board (PCB) or the reverse side of printed circuit board (PCB).Meanwhile, described first pad can also be laid in the obverse and reverse of printed circuit board (PCB) simultaneously, and described first pad, by scolding tin tin cream and described first welding with reinforcement plate, further increases the intensity at printed circuit board (PCB) narrow boards frame place.
Preferably, described second pad is positioned on printed circuit board (PCB) side cross section or on two side cross sections.Described second pad is laid on the side cross section of printed circuit board (PCB), and described side transverse cross-sectional area does not have electronic component.Described second pad only can be produced on a side cross section of printed circuit board (PCB).Meanwhile, the second pad can also be laid in two side cross sections of printed circuit board (PCB) simultaneously, and the second pad, by scolding tin tin cream and the second welding with reinforcement plate, further increases the intensity at printed circuit board (PCB) narrow boards frame place.
Further, the first stiffening plate 22 and the second stiffening plate 23 are can by the metallic plate of scolding tin tin cream 27 with pad solder.Described metallic sheet material can be copper, iron or both alloys.For the ease of metallic plate and pad solder, can zinc-plated, silver-plated, gold-plated or interpolation rare metal at metal sheet surface.Exemplary, stiffening plate and pad are welded by paster welding procedure, and paster welding procedure not only but also scolding tin tin cream few by tin amount applies evenly, and stiffening plate and pad can be made while saving production cost more firmly to weld.Described stiffening plate can be steel plate, and described steel stiffening plate Thickness scope can be 0.1-1mm.
In stiffening plate and pad solder process, further, described stiffening plate and described pad are welded by paster welding procedure.
In above-described embodiment, the electronic component in described printed circuit board surface is arranged on non-narrow boards frame region and/or non-described turning join domain.Exemplary, first pad is positioned at the turning join domain of printed circuit board surface narrow boards frame region and narrow boards frame and main body printed circuit board surface, second pad is positioned on the side cross section of the circuit board of the printed circuit board (PCB) side cross section corresponding with narrow boards frame region and narrow boards frame and main body printed circuit board (PCB) connecting corner, the printed circuit board surface of above-mentioned laying first pad and the second pad and side cross section are without any electronic component, and electronic component is distributed in the region except described first pad of above-mentioned laying and described second pad.
The technical scheme that the present embodiment provides, by laying pad in printed circuit board surface narrow boards frame region and side cross section, by scolding tin tin cream, the stiffening plate of pad with same homalographic is welded, enhance the intensity at printed circuit board (PCB) narrow boards frame place, make the narrow boards frame of printed circuit board (PCB) in assembling and larger stress can be born in using and non-frangibility.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.
Claims (9)
1. a printed circuit board (PCB), is characterized in that, comprising:
First pad, be positioned at the turning join domain of printed circuit board surface narrow boards frame region and/or narrow boards frame and main body printed circuit board surface, the first bond pad surface is coated with scolding tin tin cream, for welding the first stiffening plate;
Second pad, be positioned on the printed circuit board (PCB) side cross section corresponding with narrow boards frame region, and/or on the side cross section of the circuit board of narrow boards frame and main body printed circuit board (PCB) connecting corner, the second bond pad surface is coated with scolding tin tin cream, for welding the second stiffening plate;
First stiffening plate, is positioned at the top of described first pad, with described first pad solder;
Second stiffening plate, is positioned at the top of described second pad, with described second pad solder.
2. printed circuit board (PCB) according to claim 1, is characterized in that:
Described first stiffening plate and described second stiffening plate one-body molded by one piece of stiffening plate, described second stiffening plate relative to described first stiffening plate bending arrange.
3. printed circuit board (PCB) according to claim 1, is characterized in that,
The overlay area area ratio of described first stiffening plate and described first pad is 1:1;
The overlay area area ratio of described second stiffening plate and described second pad is 1:1.
4. printed circuit board (PCB) according to claim 1, is characterized in that, described first pad and described second pad cover on a printed circuit with banded, latticed or integral type shape.
5. printed circuit board (PCB) according to claim 1, is characterized in that, described first pad is positioned at front and/or the reverse side of printed circuit board (PCB).
6. printed circuit board (PCB) according to claim 1, is characterized in that, described second pad is positioned on printed circuit board (PCB) side cross section or on two side cross sections.
7. printed circuit board (PCB) according to claim 1, is characterized in that, described first stiffening plate and described second stiffening plate are can by the metallic plate of scolding tin tin cream and pad solder.
8. printed circuit board (PCB) according to claim 1, is characterized in that, described stiffening plate and described pad are welded by paster welding procedure.
9. printed circuit board (PCB) according to claim 1, is characterized in that, the electronic component in described printed circuit board surface is arranged on non-narrow boards frame region and/or non-described turning join domain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548067.3A CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510548067.3A CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105163482A true CN105163482A (en) | 2015-12-16 |
| CN105163482B CN105163482B (en) | 2017-11-07 |
Family
ID=54804207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510548067.3A Expired - Fee Related CN105163482B (en) | 2015-08-31 | 2015-08-31 | A kind of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163482B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714467A (en) * | 2016-11-25 | 2017-05-24 | 维沃移动通信有限公司 | Printed circuit board manufacturing method, printed circuit board and mobile terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298346A (en) * | 1996-05-08 | 1997-11-18 | Toshiba Corp | Flexible printed wiring board |
| CN202009534U (en) * | 2011-01-20 | 2011-10-12 | 瀚斯宝丽显示科技（南京）有限公司 | Reinforced structure for preventing break of flexible circuit board |
| CN202617505U (en) * | 2012-05-17 | 2012-12-19 | 厦门伊普斯电子有限公司 | A firmer flexible printed circuit |
| CN102869189A (en) * | 2012-09-18 | 2013-01-09 | 上海华勤通讯技术有限公司 | Printed circuit board (PCB) provided with reinforced bonding pad |
-
2015
- 2015-08-31 CN CN201510548067.3A patent/CN105163482B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09298346A (en) * | 1996-05-08 | 1997-11-18 | Toshiba Corp | Flexible printed wiring board |
| CN202009534U (en) * | 2011-01-20 | 2011-10-12 | 瀚斯宝丽显示科技（南京）有限公司 | Reinforced structure for preventing break of flexible circuit board |
| CN202617505U (en) * | 2012-05-17 | 2012-12-19 | 厦门伊普斯电子有限公司 | A firmer flexible printed circuit |
| CN102869189A (en) * | 2012-09-18 | 2013-01-09 | 上海华勤通讯技术有限公司 | Printed circuit board (PCB) provided with reinforced bonding pad |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714467A (en) * | 2016-11-25 | 2017-05-24 | 维沃移动通信有限公司 | Printed circuit board manufacturing method, printed circuit board and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105163482B (en) | 2017-11-07 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171107 |