CN100562395C - Wave soldering tin bath nozzle and wave soldering method - Google Patents
Wave soldering tin bath nozzle and wave soldering method Download PDFInfo
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- CN100562395C CN100562395C CNB2006100926585A CN200610092658A CN100562395C CN 100562395 C CN100562395 C CN 100562395C CN B2006100926585 A CNB2006100926585 A CN B2006100926585A CN 200610092658 A CN200610092658 A CN 200610092658A CN 100562395 C CN100562395 C CN 100562395C
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Abstract
A kind of wave soldering tin bath nozzle and wave soldering method, this nozzle comprise a spout, a preceding catch, and a back catch.This spout can upwards be gushed out the scolding tin of liquid state and form a crest.This back catch comprises that an edge with respect to a circuit board is uneven scolding tin rib, and this crest can form one and be uneven detin with the edge of this circuit board and stop the limit on this scolding tin rib.Whereby, when this circuit board is eaten tin by this crest, because the part pin on this circuit board is arranged normally parallel or vertical this board edge, and this detin termination limit is to be not parallel state with this board edge, therefore between the two adjacent pins is the scope that one in front and one in back detaches this crest respectively, make scolding tin be not easy to form short circuit and link to each other, just can reach the function that reduces tin bridge phenomenon.
Description
[technical field]
The present invention relates to a kind of Wave soldering apparatus and technology that is applied to the electronic component welding job, particularly relates to a kind of wave soldering tin bath nozzle and wave soldering method.
[background technology]
As Fig. 1,2, shown in 3, for general circuit plate 100 is carrying out the running signal of wave-soldering operation, usually comprise many integrated circuits 101 on this circuit board 100, connect various electronic components such as slot 102, wherein said integrated circuit 101 is the element of main computing, for example adopt ball pin trellis array (Ball Grid Array, BGA) potted element, need the complexity of wiring higher, therefore normally be configured in the middle part of this circuit board 100, to obtain broad wiring space, and the interface that described connection slot 102 normally inputs or outputs as signal, its wiring simply also usually needs to link to each other with the device of periphery, so the edge of close this circuit board 100 normally when disposing.
Described integrated circuit 101, connect slot 102, resistance, electric capacity, common electronic component such as diode is when welding, normally adopt a Wave soldering apparatus 200 to finish the contact welding, this Wave soldering apparatus 200 comprises a nozzle 201, pair of parallel is crossed in the conveyer belt 202 of this nozzle 201 tops, and majority is arranged at this to the loading plate between the conveyer belt 202 203, respectively can place a circuit board 100 on this loading plate 203, this nozzle 201 can upwards be gushed out the scolding tin of liquid state to form a crest 204, when described circuit board 100 passes through this crest 204 in regular turn, respectively the bottom surface of this circuit board 100 can contact with this crest 204 and eat tin, just can fill in into the contact hole by the scolding tin of liquid state, treat by after solder cools is solidified just finish weld job.
Yet; when respectively connecting slot 102 (as the PCIE slot; when the most pins 103 VGA interface) present close spacing (pitch 2.5mm is following); after passing through this crest 204; usually can find to have between the described pin 103 short circuit condition of scolding tin bridge formation connection; just refer between the two independent adjacent welds; after soldering, form the phenomenon that engages; industry is commonly referred to as " Xi Qiao " phenomenon 104; need disconnect the secondary operations of Xi Qiao by artificial use flatiron with unshorting; this is the problem place that has a strong impact on production quality and production efficiency; in addition; at this circuit board 100 aspect the time of this liquid state scolding tin crest 204; under the normal working temperature; being heated of described integrated circuit 101 eaten the tin time unsuitable oversize (about 3～4 seconds); described connection slot 102 then needs long being heated and eats the tin time (about 5～7 seconds) and could obtain to eat the full welding effect of tin; but generally the time span by this crest 204 is all the same; can't carry out wave-soldering respectively at the needs difference part of eating the tin time that is heated; so that eat tin and also be necessary aspect the time to improve being heated, could reduce part and weld and eat too short relation of tin time because of being heated and failure welding or the oversize situation damaged of causing are arranged.
[summary of the invention]
The objective of the invention is to be to provide a kind of bridge formation short circuit phenomenon that can effectively reduce between the pin, and can make being heated of different parts eat the tin time to obtain adjusting the wave soldering tin bath nozzle and the wave soldering method of improvement.
A kind of wave soldering tin bath nozzle of the present invention, be applicable to and be installed on the molten tin bath, and the scolding tin of liquid state upwards can be gushed out to form a crest, this crest can contact along the circuit board bottom surface that direction moves of advancing with one, this nozzle comprises one and is arranged at the back catch that preceding catch, in this molten tin bath is arranged in this molten tin bath and is interval in this preceding catch along a transverse direction with respect to this direct of travel, and one section spout between this forward and backward catch, it is characterized in that: this back catch has one and is not parallel to the scolding tin rib that this transverse direction extends.
And wave soldering method of the present invention is the welding that is applied to some electronic component pins on the circuit board, and described pin is to wear this circuit board bottom surface and along transverse direction arrangement, it is characterized in that the method includes the steps of:
(a) provide a molten tin bath that is installed with liquid scolding tin, sending out in this molten tin bath has the nozzle that liquid scolding tin upwards can be gushed out a crest, and the detin that this crest has not parallel this transverse direction stops the limit.
(b) make this circuit board bottom surface touch this crest and detach this detin at last and stop the limit perpendicular to one of this transverse direction direction of advancing along one.
Effect of the present invention is: when this circuit board passes through this crest, because the part pin on this circuit board is arranged normally parallel or vertical this board edge, and be to be not parallel state with this board edge along the crest that this scolding tin rib is upwards gushed out, therefore the part pin on this circuit board is not with a whole row, one permutation detaches this crest abreast, but break away from the mode that is in angle, so in whole row's pin, it between the two adjacent pins scope that one in front and one in back detaches this crest respectively, add bigger spacing is arranged between the staggered pin, scolding tin is not easy to form the bridge formation short circuit and links to each other, just can reach the generation that significantly reduces tin bridge phenomenon, in addition, by the alteration of form that makes this crest, can allow and eat the tin time by being heated of this crest and produce different time spans naturally, the part weld job that the difference of just satisfying the demand simultaneously is heated and is eaten the tin time.
[description of drawings]
Fig. 1 is the schematic diagram of a side-looking, and the situation of a Wave soldering apparatus and circuit board running in the past is described;
Fig. 2 is the schematic diagram of overlooking, illustrate above-mentioned this circuit board also not with a crest state of contact;
Fig. 3 is a schematic diagram, illustrates in above-mentioned this circuit board, and a pin that connects slot will break away from the state of this crest;
Fig. 4 is a stereogram, and the preferred embodiment of wave soldering tin bath nozzle of the present invention is described;
Fig. 5 is a schematic diagram, illustrates that the pin of a part contacts the state of a crest in above-mentioned this preferred embodiment;
Fig. 6 is a schematic diagram, illustrates that the pin of this part will break away from the state of this crest in above-mentioned this preferred embodiment;
Fig. 7 is a schematic diagram, illustrates that in above-mentioned this preferred embodiment, a trimmer makes the steeper situation of this crest slope; And
Fig. 8 is a schematic diagram, illustrates that in above-mentioned this preferred embodiment, this trimmer makes the milder situation of this crest slope.
[specific embodiment]
The present invention is described in detail below in conjunction with drawings and Examples.
As Fig. 4,5, shown in 7, wave soldering tin bath nozzle 300 of the present invention is applicable to and is installed on the molten tin bath 301, and the scolding tin of liquid state upwards can be gushed out to form a crest 30, these crest 30 tops are provided with a pair ofly advances along one that direction X is parallel to be crossed in the conveyer belt 302 of this liquid state scolding tin crest 30, reach one and be arranged at this loading plate between the conveyer belt 302 303, respectively can place a circuit board 40 on this loading plate 303, this crest 30 can contact with circuit board 40 bottom surfaces of moving along this direct of travel X, weld the function of each part 41 on this circuit board 40 whereby, this nozzle 300 comprises a spout 50, catch 60 before one, one back catch 70, one trimmer 80, and an adjustment bolt 81.
This spout 50 can upwards be gushed out the scolding tin of liquid state.
Should preceding catch 60 be to extend, and be arranged at the leading edge of this spout 50 along a transverse direction Y with respect to this direct of travel X.
This back catch 70 is to extend along this transverse direction Y, and be arranged at the trailing edge of this spout 50, this back catch 70 comprises that an edge with respect to this circuit board 40 is uneven scolding tin rib 71, this crest 30 is to be formed between this forward and backward catch 60,70, and can on this scolding tin rib 71, form one and be uneven detin with the edge of this circuit board 40 and stop limit 31, this circuit board 40 be in regular turn the top by this forward and backward catch 60,70 to weld.
This scolding tin rib 71 has two and is extended and crossing one first angle theta that forms to the center by two ends respectively
1 Waveform segment 711, when this crest 30 is gushed out when forming, it also will be the correspondingly-shaped that extends to form along described waveform segment 711 that this detin stops limit 31, and forms the first identical angle theta
1, in this preferred embodiment, this first angle theta
1Be one present 150 the degree obtuse angles.
This trimmer 80 is to extend to this spout 50 places from these back catch 70 belows, this adjustment bolt 81 is to be arranged in this trimmer 80 end faces, the user can advance by this spiral shell of adjusting bolt 81, the spiral shell dephasign is made the Height Adjustment of this trimmer 80 for this spout 50, and then changed the degree of depth and the width that this crest 30 is gushed out.
As Fig. 5, shown in 6, when this circuit board 40 passes through this crest 30, because normally parallel or vertical these circuit board 40 edges of the arrangement of each part 41 pin 411 are gone up in a bottom surface 42 (as shown in Figure 7) of this circuit board 40, and this detin termination limit 31 is to be not parallel state with these circuit board 40 edges, in this preferred embodiment, it is that inside symmetry is tiltedly stretched and is 150 degree angles (as shown in Figure 5) that this detin stops limit 31, therefore the pin 411 of each part 41 is not with a whole row, one permutation detaches this detin abreast and stops limit 31, but break away from the mode that is in angle, in this preferred embodiment, be to present 15 second angle theta of spending with one
2Break away from (as shown in Figure 6), so in whole row's pin 411, be the scope that one in front and one in back detaches this crest 30 respectively between the two adjacent pins 411, add to be between diagonally opposing corner, the staggered pin 411 and have bigger spacing, scolding tin can not form the bridge formation short circuit and link to each other under bigger spacing, just can significantly reduce " Xi Qiao " phenomenon.
In addition, by making this detin stop the alteration of form on limit 31, just can allow by last generation of the time of this crest 30 stroke different in size, the position that for example is 150 degree angles in the centre, this circuit board 40 is lacked (closely) along the distance of this direct of travel X, and away from the both sides of middle angle, this circuit board 40 is understood lengthening (far) gradually along the distance of this direct of travel X, so the former can be applicable to the parts such as integrated circuit that often are arranged on the centre position, make integrated circuit can not experience oversize being heated and eat the tin time, take place and can avoid damaging, relatively, the latter can obtain long being heated to eat the tin time.
As Fig. 7, shown in 8, and the another kind of mode of eating the tin time of being heated of adjusting is, when these adjustment bolt 81 spiral shells advance (as shown in Figure 7), this trimmer 80 can press down by interlock, make the crest 30 between this spout 50 and this back catch 70 tilt, this circuit board 40 and the contact-making surface of this crest 30 are diminished, be heated and eat tin time T 1 and also can shorten, on the contrary, when these adjustment bolt 81 spiral shells move back (as shown in Figure 8), this trimmer 80 can rise by interlock, this crest 30 can rise synchronously and be milder, make this circuit board 40 and the contact-making surface of this crest 30 become big, be heated eat tin time T 2 also can be longer, and then reach the function of adjusting by these 30 times of crest.
Shown in Fig. 4,5, and wave soldering method of the present invention can be finished by said nozzle 300, this method is the welding that is applied to some electronic component 41 pins 411 on the circuit board 40, and described pin 411 is to wear these circuit board 40 bottom surfaces and arrange along a transverse direction Y, and the method includes the steps of:
(a) provide a molten tin bath 301 that is installed with liquid scolding tin, be provided with the nozzle 300 that liquid scolding tin upwards can be gushed out a crest 30 in this molten tin bath 301, the detin that this crest 30 has not parallel this transverse direction Y stops the limit, this nozzle 300 comprise along one of this circuit board 40 advance that direction X is provided with in regular turn one before catch 60, a spout 50 and a back catch 70, and this back catch 70 has a scolding tin rib 71 that is not parallel to this transverse direction Y and this direct of travel X, and this crest 30 is to form this detins along this scolding tin rib 71 to stop limit 31.This scolding tin rib 71 has two and is extended and crossing one first angle theta that forms to the center by two ends respectively
1 Waveform segment 711, this first angle theta
1Be 150 °, the angle that this detin stops limit 31 and this transverse direction Y is 15 °, and this transverse direction Y is vertical mutually with this direct of travel X.
(b) make these circuit board 40 bottom surfaces touch this crest 30 and detach this detin at last and stop limit 31 along this direct of travel X.
So appoint both adjacent meetings to break away from the welding scope of this crest 30 respectively at the different time in the described pin 411.
Whereby, when the user welds through wave soldering tin bath nozzle 300 of the present invention, just can welding manner more in the past obtain the yield height, short circuit phenomenon is few, and the difference that can satisfy different parts simultaneously is heated and is eaten the tin time, and then quality on the raising processing procedure and production capacity, more do not need many extra manpowers to do the processing of dealing with problems arising from an accident of eliminating pin tin bridge phenomenon, reach the application target and the function of promoting industrial competitiveness.
Claims (10)
1. wave soldering tin bath nozzle, be applicable to and be installed on the molten tin bath, and the scolding tin of liquid state upwards can be gushed out to form a crest, this crest can contact along the circuit board bottom surface that direction moves of advancing with one, this nozzle comprise one along a transverse direction with respect to this direct of travel be arranged at that preceding catch, in this molten tin bath is arranged in this molten tin bath and with the isolated back of this preceding catch catch, and a spout of being located between this forward and backward catch, it is characterized in that:
This back catch has one and is not parallel to the scolding tin rib that this transverse direction extends, this nozzle also comprises a trimmer that extends to this spout from this back catch below, and an adjustment bolt that is arranged in this trimmer end face, the Height Adjustment that this trimmer can advance by this spiral shell of adjusting bolt, the spiral shell dephasign is made this trimmer for this spout.
2. wave soldering tin bath nozzle as claimed in claim 1 is characterized in that: the scolding tin rib of this back catch has two and is extended and the crossing waveform segment that forms one first angle to the center by two ends respectively.
3. wave soldering tin bath nozzle as claimed in claim 2, it is characterized in that: this crest is to be formed between this forward and backward catch, and on this scolding tin rib, forming detin termination limit, it is to extend into correspondingly-shaped along described waveform segment that this detin stops limit, and forms the first identical angle.
4. wave soldering tin bath nozzle as claimed in claim 2 is characterized in that: this first angle is an obtuse angle.
5. wave soldering tin bath nozzle as claimed in claim 4 is characterized in that: this first angle is 150 °.
6. wave soldering tin bath nozzle as claimed in claim 1 is characterized in that: this scolding tin rib is to be not parallel to this board edge.
7. a wave soldering method is applied to the welding of some electronic component pins on the circuit board, and described pin is to wear this circuit board bottom surface and along transverse direction arrangement, it is characterized in that this method includes the following step:
(a) provide a molten tin bath that is installed with liquid scolding tin, be provided with the nozzle that liquid scolding tin upwards can be gushed out a crest in this molten tin bath, the detin that this crest has not parallel this transverse direction stops the limit; And
(b) make this circuit board bottom surface touch this crest and detach this detin at last and stop the limit perpendicular to one of this transverse direction direction of advancing along one, this nozzle comprises a preceding catch that is provided with in regular turn along the direct of travel of this circuit board, one spout and a back catch, and this back catch has a scolding tin rib that is not parallel to this transverse direction and this direct of travel, this crest is to form this detin along this scolding tin rib to stop the limit, this nozzle also comprises a trimmer that extends to this spout from this back catch below, and an adjustment bolt that is arranged in this trimmer end face, this trimmer can advance by this spiral shell of adjusting bolt, the spiral shell dephasign is made the Height Adjustment of this trimmer for this spout.
8. wave soldering method as claimed in claim 7 is characterized in that: the scolding tin rib in this step (b) has two and is extended and the crossing waveform segment that forms one first angle to the center by two ends respectively.
9. wave soldering method as claimed in claim 8 is characterized in that: described first angle is 150 °.
10. wave soldering method as claimed in claim 7 is characterized in that: the angle that the detin in this step (a) stops limit and this transverse direction is 15 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100926585A CN100562395C (en) | 2006-06-13 | 2006-06-13 | Wave soldering tin bath nozzle and wave soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100926585A CN100562395C (en) | 2006-06-13 | 2006-06-13 | Wave soldering tin bath nozzle and wave soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101088692A CN101088692A (en) | 2007-12-19 |
| CN100562395C true CN100562395C (en) | 2009-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100926585A Active CN100562395C (en) | 2006-06-13 | 2006-06-13 | Wave soldering tin bath nozzle and wave soldering method |
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| CN (1) | CN100562395C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101829825B (en) * | 2010-05-18 | 2012-07-04 | 深圳市堃琦鑫华科技有限公司 | Intelligent wave soldering tin bath |
| CN107470731A (en) * | 2016-06-07 | 2017-12-15 | 苏州亿带亿路电子科技有限公司 | Pcb board welding equipment |
| CN107135614B (en) * | 2017-05-25 | 2019-01-25 | 杭州晶志康电子科技有限公司 | Printed circuit board patch processing technology |
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2006
- 2006-06-13 CN CNB2006100926585A patent/CN100562395C/en active Active
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| CN101088692A (en) | 2007-12-19 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUANXU ELECTRONICS CO., LTD. Free format text: FORMER OWNER: UNIVERSAL SCIENTIFIC INDUSTRIES CO., LTD Effective date: 20100712 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 000000 NANTOU COUNTY, TAIWAN PROVINCE, CHINA TO: 201203 NO.1558, ZHANGDONG ROAD, INTEGRATED CIRCUIT INDUSTRY ZONE HANGJIANG HIGH-TECH PARK, SHANGHAI CITY |
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| TR01 | Transfer of patent right |
Effective date of registration: 20100712 Address after: Zhangjiang hi tech park integrated circuit industry Zhang Road 201203 Shanghai City No. 1558 Patentee after: Huanxu Electronics Co., Ltd. Address before: 000000 China Taiwan Nantou County Patentee before: Huanlong Electric Co., Ltd. |