CN110676372A - 一种芯片封装方法及芯片封装结构 - Google Patents
一种芯片封装方法及芯片封装结构 Download PDFInfo
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- CN110676372A CN110676372A CN201910967707.2A CN201910967707A CN110676372A CN 110676372 A CN110676372 A CN 110676372A CN 201910967707 A CN201910967707 A CN 201910967707A CN 110676372 A CN110676372 A CN 110676372A
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- wafer
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- packaging
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/03—Assembling devices that include piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910967707.2A CN110676372B (zh) | 2019-10-12 | 2019-10-12 | 一种芯片封装方法及芯片封装结构 |
Applications Claiming Priority (1)
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CN201910967707.2A CN110676372B (zh) | 2019-10-12 | 2019-10-12 | 一种芯片封装方法及芯片封装结构 |
Publications (2)
Publication Number | Publication Date |
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CN110676372A true CN110676372A (zh) | 2020-01-10 |
CN110676372B CN110676372B (zh) | 2020-09-01 |
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CN201910967707.2A Active CN110676372B (zh) | 2019-10-12 | 2019-10-12 | 一种芯片封装方法及芯片封装结构 |
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CN (1) | CN110676372B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105897210A (zh) * | 2016-04-01 | 2016-08-24 | 江苏长电科技股份有限公司 | 凹槽型表面声滤波芯片封装结构及其制造方法 |
CN107040231A (zh) * | 2016-02-04 | 2017-08-11 | 三星电机株式会社 | 声波滤波器装置、制造声波滤波器装置的封装件和方法 |
CN108389957A (zh) * | 2018-05-08 | 2018-08-10 | 苏州科阳光电科技有限公司 | 一种滤波器芯片封装结构和封装方法 |
DE102018113218B3 (de) * | 2018-06-04 | 2019-09-05 | RF360 Europe GmbH | Waferlevel-Package und Herstellungsverfahren |
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2019
- 2019-10-12 CN CN201910967707.2A patent/CN110676372B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107040231A (zh) * | 2016-02-04 | 2017-08-11 | 三星电机株式会社 | 声波滤波器装置、制造声波滤波器装置的封装件和方法 |
CN105897210A (zh) * | 2016-04-01 | 2016-08-24 | 江苏长电科技股份有限公司 | 凹槽型表面声滤波芯片封装结构及其制造方法 |
CN108389957A (zh) * | 2018-05-08 | 2018-08-10 | 苏州科阳光电科技有限公司 | 一种滤波器芯片封装结构和封装方法 |
DE102018113218B3 (de) * | 2018-06-04 | 2019-09-05 | RF360 Europe GmbH | Waferlevel-Package und Herstellungsverfahren |
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CN110676372B (zh) | 2020-09-01 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210204 Address after: 1219-11, building 3, No. 1366, Hongfeng Road, Kangshan street, Huzhou Economic and Technological Development Zone, Huzhou City, Zhejiang Province, 313000 Patentee after: Huzhou jianwenlu Technology Co.,Ltd. Address before: 310019 room 1004, 10th floor, building 4, No. 9, Jiuhuan Road, Jianggan District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Wenwenlu Technology Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A chip packaging method and chip packaging structure Effective date of registration: 20210528 Granted publication date: 20200901 Pledgee: Huzhou Jinsheng equity investment partnership (L.P.) Pledgor: Huzhou jianwenlu Technology Co.,Ltd. Registration number: Y2021330000478 |