CN110616416A - 基板处理方法及基板处理装置 - Google Patents

基板处理方法及基板处理装置 Download PDF

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Publication number
CN110616416A
CN110616416A CN201910525969.3A CN201910525969A CN110616416A CN 110616416 A CN110616416 A CN 110616416A CN 201910525969 A CN201910525969 A CN 201910525969A CN 110616416 A CN110616416 A CN 110616416A
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substrate
chamber
film
processing apparatus
plasma
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Chinese (zh)
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田端雅弘
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H10P14/687Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC the materials being fluorocarbon compounds, e.g. (CHxFy) n or polytetrafluoroethylene
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

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