CN110616406A - Magnetron sputtering coating machine - Google Patents
Magnetron sputtering coating machine Download PDFInfo
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- CN110616406A CN110616406A CN201811441007.1A CN201811441007A CN110616406A CN 110616406 A CN110616406 A CN 110616406A CN 201811441007 A CN201811441007 A CN 201811441007A CN 110616406 A CN110616406 A CN 110616406A
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- 238000000576 coating method Methods 0.000 title claims abstract description 147
- 239000011248 coating agent Substances 0.000 title claims abstract description 146
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 187
- 238000012546 transfer Methods 0.000 claims abstract description 105
- 238000007599 discharging Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 10
- 239000007888 film coating Substances 0.000 claims description 7
- 238000009501 film coating Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000005477 sputtering target Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims 4
- 210000001503 joint Anatomy 0.000 claims 1
- 238000002203 pretreatment Methods 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 abstract description 11
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 238000011160 research Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 36
- 239000013077 target material Substances 0.000 description 10
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000012937 correction Methods 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention belongs to the technical field of magnetron sputtering, and particularly relates to a magnetron sputtering coating machine which comprises a hot temperature coating device, a cold temperature coating device, a feeding and discharging device and a transfer conveying device. The magnetron sputtering coating machine can select any temperature to carry out magnetron sputtering within the temperature range of-100-800 ℃, thereby greatly improving the operation temperature range of magnetron sputtering of materials to be coated and enabling the materials to be coated to repeatedly carry out coating operation between the hot temperature coating device 100 and the cold temperature coating device 200, thus greatly enriching the diversity of the coating forming environment and being beneficial to enterprises, universities or scientific research institutions to explore and mine the characteristics of magnetic material films, superlattice films and the like.
Description
Technical Field
The invention belongs to the technical field of magnetron sputtering, and particularly relates to a magnetron sputtering coating machine.
Background
In recent years, magnetic material thin films and superlattice thin films have attracted attention because they exhibit excellent characteristics in electrical, optical, magnetic, mechanical and thermal aspects, and thus have application prospects in semiconductor, solar, nano-device, sensor, laser, and the like.
In order to excavate the characteristics of the magnetic material film and the superlattice film, the magnetic material film and the superlattice film under different film forming environments need to be obtained, but the current magnetron sputtering film plating machine has the defects of single film forming environment and inconvenience for excavating the characteristics of the magnetic material film and the superlattice film.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a magnetron sputtering coating machine, which aims to solve the problem of single film forming environment.
The invention is realized by the following steps:
a magnetron sputtering coating machine comprises:
the hot-temperature coating device comprises a hot-temperature material valve, a hot-temperature coating chamber with a hot-temperature coating cavity, a hot-temperature fixing piece arranged in the hot-temperature coating cavity and used for fixing a material to be coated, a hot-temperature control assembly used for heating the hot-temperature fixing piece and capable of heating the hot-temperature fixing piece to any temperature of X-800 ℃, and at least one hot-temperature magnetron sputtering target arranged in the hot-temperature coating cavity and spaced from the hot-temperature fixing piece, wherein the hot-temperature coating chamber is provided with a hot-temperature material inlet and outlet for the material to be coated to enter and exit the hot-temperature coating cavity, and the hot-temperature material valve is used for opening/closing the hot-temperature material inlet and outlet;
the cold-temperature coating device comprises a cold-temperature material valve, a cold-temperature coating chamber with a cold-temperature coating cavity, a cold-temperature fixing piece arranged in the cold-temperature coating cavity and used for fixing a material to be coated, a cold-temperature control assembly used for cooling the cold-temperature fixing piece and capable of cooling the cold-temperature fixing piece to any temperature of-100 ℃ -X, and at least one cold-temperature magnetic control sputtering target arranged in the cold-temperature coating cavity and spaced from the cold-temperature fixing piece, wherein the cold-temperature coating chamber is provided with a cold-temperature material inlet and outlet for the material to be coated to enter and exit the cold-temperature coating cavity, and the cold-temperature material valve is used for opening/closing the cold-temperature material inlet and outlet;
the feeding and discharging device is used for supplying materials to be coated and for taking away the materials to be coated;
the transfer conveying device comprises a transfer conveying chamber with a transfer conveying cavity and a transfer conveying manipulator arranged in the transfer conveying cavity, wherein the transfer conveying chamber is provided with a hot end material inlet and outlet, a cold end material inlet and outlet and a feeding end material inlet and outlet, the hot end material inlet and outlet is butted with the hot temperature material inlet and outlet, the cold end material inlet and outlet is butted with the cold temperature material inlet and outlet, the transfer conveying manipulator is used for enabling a material to be coated to pass through the hot end material inlet and outlet and the hot temperature material inlet and outlet and enabling the material to be coated to be conveyed to the transfer conveying cavity from the hot temperature coating cavity or conveying the material to be coated to the hot temperature coating cavity from the transfer conveying cavity, the transfer conveying manipulator is used for enabling the material to be coated to pass through the cold end material inlet and outlet and the cold temperature material inlet and outlet and conveying the material to be coated from the cold temperature coating cavity to the transfer conveying cavity or conveying the material to be coated from the transfer conveying cavity to the hot temperature coating cavity The transfer conveying manipulator is also used for conveying the materials to be plated from the transfer conveying cavity to the feeding and discharging device through a feeding end and a discharging end of the materials to be plated or conveying the materials to be plated from the feeding and discharging device to the transfer conveying cavity;
wherein X is normal temperature.
The hot-temperature coating device can indirectly heat a material to be coated from normal temperature to 800 ℃ through the hot-temperature fixing piece, the cold-temperature coating device can indirectly cool the material to be coated from normal temperature to-100 ℃ through the cold-temperature fixing piece, in the specific use process, when the required working temperature of the material to be coated is in the temperature range of normal temperature to 800 ℃, the material to be coated is conveyed to the transfer conveying manipulator through the feeding and discharging device and then conveyed to the hot-temperature coating device through the transfer conveying manipulator, and when the required working temperature of the material to be coated is in the temperature range of-100 ℃ to normal temperature, the material to be coated is conveyed to the transfer conveying manipulator through the feeding and discharging device and then conveyed to the cold-temperature coating device through the transfer manipulator, so that the magnetron sputtering coating machine can select any temperature in the temperature range of-100 ℃ to 800 ℃ to carry out magnetron sputtering, thereby greatly improving the operation temperature range of the magnetron sputtering of the material to be coated and increasing the diversity of the film forming environment.
In addition, the transfer conveying mechanical arm can convey the material to be coated to and fro between the hot-temperature coating device and the cold-temperature coating device, in particular, the transfer conveying mechanical arm can convey the coating material from the hot-temperature coating device to the cold-temperature coating device and also can convey the coating material from the cold-temperature coating device to the hot-temperature coating device, thus, the magnetron sputtering coating machine can perform coating within the temperature range of-100 ℃ to the normal temperature once again after the materials to be coated are coated within the temperature range of normal temperature to 800 ℃, or after the material to be coated is coated within the temperature range of-100 ℃ to normal temperature once, the material to be coated is coated within the temperature range of normal temperature to 800 ℃ once again, or the material to be coated is repeatedly coated between the hot-temperature coating device and the cold-temperature coating device, thus further increasing the diversity of the film forming environment.
Therefore, the magnetron sputtering coating machine greatly increases the diversity of the film forming environment, and is beneficial to enterprises, universities or scientific research institutions to explore and mine the characteristics of magnetic material films, superlattice films and the like.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic top view of a magnetron sputtering coater according to an embodiment of the present invention;
FIG. 2 is a perspective view of a side view of a magnetron sputtering coater according to an embodiment of the present invention;
FIG. 3 is a perspective view of a thermal temperature coating apparatus in a magnetron sputtering coating machine according to an embodiment of the invention;
FIG. 4 is a perspective view of a transfer conveying device in a magnetron sputtering coating machine according to an embodiment of the present invention;
FIG. 5 is a perspective view of a cold-hot coating device in a magnetron sputtering coating machine according to an embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Hot temperature coating device | ||
| 110 | Thermal temperature coating chamber | ||
| 1101 | Hot-temperature coating cavity | 1102 | Hot-temperature material inlet and outlet |
| 120 | Thermal temperature fixing piece | 130 | Hot temperature control assembly |
| 140 | Hot warm material valve | 150 | Thermal temperature magnetic control sputtering target |
| 160 | Heat temperature shielding assembly | 170 | Heat temperature correction assembly |
| 200 | Cold-temperature film coating device | ||
| 210 | Cold-temperature film coating chamber | ||
| 2101 | Cold-temperature film coating cavity | 2102 | Cold and warm material inlet and outlet |
| 220 | Cold and warm fixing piece | 230 | Cold temperature control assembly |
| 240 | Cold and warm material valve | 250 | Cold temperature magnetic control sputtering target |
| 260 | Cold and warm shielding assembly | 270 | Cold temperature correction assembly |
| 300 | Material feeding and discharging device | ||
| 400 | Transfer conveying device | ||
| 410 | Transfer conveying chamber | ||
| 4101 | Transfer conveying cavity | 4102 | Hot end inlet and outlet |
| 4103 | Cold end charging and discharging port | ||
| 420 | Transfer conveying manipulator | ||
| 421 | Material grabbing mechanism | 422 | Telescopic driver |
| 423 | Rotary drive | ||
| 500 | Transfer material storage device | ||
| 510 | Transfer storage chamber | 520 | Transfer material storage valve |
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment of the invention provides a magnetron sputtering coating machine which is used for coating a material to be coated, wherein the material to be coated is generally in a plate structure.
Referring to fig. 1 to 5, the magnetron sputtering coating machine includes a hot-temperature coating device 100, a cold-temperature coating device 200, a material feeding and discharging device 300, and a transfer conveying device 400.
Specifically, the thermal temperature coating device 100 includes a thermal temperature coating chamber 110, a thermal temperature fixing member 120, a thermal temperature control assembly 130, a thermal temperature material valve 140, and at least one thermal temperature magnetron sputtering target 150, where the thermal temperature coating chamber 110 has a thermal temperature coating chamber 1101, the thermal temperature fixing member 120 is disposed in the thermal temperature coating chamber 1101 and is used to fix a material to be coated, the thermal temperature control assembly 130 is used to heat the thermal temperature fixing member 120 and can heat the thermal temperature fixing member 120 to any temperature of X-800 ℃, each thermal temperature magnetron sputtering target 150 is disposed in the thermal temperature coating chamber 1101 and is spaced from the thermal temperature fixing member 120, the thermal temperature coating chamber 110 is provided with a thermal temperature material inlet/outlet 1102 through which the material to be coated enters/exits the thermal temperature coating chamber, and the thermal temperature material valve 140 is used to open/close the thermal temperature material inlet/outlet 1102. It should be noted that, in this embodiment, in order to ensure that the hot-temperature deposition apparatus 100 can perform the magnetron sputtering deposition operation, the hot-temperature deposition apparatus 100 further includes a hot-temperature vacuum generator for implementing vacuum of the hot-temperature deposition chamber 1101, a hot-temperature gas process module for supplying gas such as argon, oxygen and/or nitrogen to the hot-temperature magnetron sputtering target 150, and the like.
The cold-temperature coating device 200 comprises a cold-temperature coating chamber 210, a cold-temperature fixing member 220, a cold-temperature control assembly 230, a cold-temperature material valve 240 and at least one cold-temperature magnetically-controlled sputtering target 250, wherein the cold-temperature coating chamber 210 is provided with a cold-temperature coating cavity 2101, the cold-temperature fixing member 220 is arranged in the cold-temperature coating cavity 2101 and used for fixing a material to be coated, the cold-temperature control assembly 230 is used for cooling the cold-temperature fixing member 220 and can cool the cold-temperature fixing member 220 to any temperature of-100 ℃ -X, each cold-temperature magnetically-controlled sputtering target 250 is arranged in the cold-temperature coating cavity 2101 and is arranged at an interval with the cold-temperature fixing member 220, the cold-temperature coating chamber 210 is provided with a cold-temperature material inlet and outlet 2102 for the material to enter and exit from the cold-temperature coating cavity 2101, and the. Similarly, in this embodiment, in order to ensure that the cold-temperature deposition apparatus 200 can perform the magnetron sputtering deposition operation, the hot-temperature deposition apparatus 100 further includes a cold-temperature vacuum generator for implementing vacuum of the cold-temperature deposition chamber 2101, a cold-temperature gas process module for supplying gas such as argon, oxygen and/or nitrogen to the cold-temperature magnetron sputtering target 250, and the like. In this embodiment, the cold temperature control assembly 230 uses liquid nitrogen for cooling.
The feeding and discharging device 300 is used for supplying materials to be coated and for taking away the materials to be coated, and the feeding and discharging device 300 is mainly used for supplying the materials to be coated which are not yet coated to the transfer handling device, receiving the materials to be coated which are completely coated from the transfer handling device after the materials to be coated are completed, and discharging the materials to be coated.
The transfer conveying device 400 comprises a transfer conveying chamber 410 with a transfer conveying cavity 4101 and a transfer conveying manipulator 420 arranged in the intermediate conveying cavity, wherein the transfer conveying chamber 410 is provided with a hot end material inlet/outlet 4102, a cold end material inlet/outlet 4103 and a feeding end material inlet/outlet for the material to be plated to enter and exit the transfer conveying cavity 4101, the hot end material inlet/outlet 4102 is butted with the hot temperature material inlet/outlet 1102, the cold end material inlet/outlet 4103 is butted with the cold temperature material inlet/outlet 2102, the transfer conveying manipulator 420 is used for conveying the material to be plated from the hot temperature plating cavity 1101 to the transfer conveying cavity 4101 or conveying the material to be plated from the transfer conveying cavity 4101 to the hot temperature plating cavity 1101 through the hot end material inlet/outlet 4102 and the hot temperature material inlet/outlet 1102, the transfer conveying manipulator 420 is used for conveying the material to be plated from the cold temperature plating cavity 2101 to the transfer conveying cavity 4101 or conveying the material to be plated from the transfer conveying cavity 4101 to the cold temperature plating cavity 2101, the transfer robot 420 is also used to transfer the material to be plated from the transfer chamber 4101 to the feed/discharge device 300 or from the feed/discharge device 300 to the transfer chamber 4101 through the feed end inlet/outlet.
Wherein X is normal temperature.
Based on the structural design of the invention, the hot-temperature coating device 100 can indirectly heat the material to be coated from normal temperature to 800 ℃ through the hot-temperature fixing piece 120, the cold-temperature coating device 200 can indirectly cool the material to be coated from normal temperature to-100 ℃ through the cold-temperature fixing piece 220, in the specific use process, when the required working temperature of the material to be coated is in the temperature range of normal temperature to 800 ℃, the material to be coated is conveyed to the transit conveying manipulator 420 through the feeding and discharging device 300 and then conveyed to the hot-temperature coating device 100 through the transit conveying manipulator 420, and when the required working temperature of the material to be coated is in the temperature range of-100 ℃ to normal temperature, the material to be coated is conveyed to the transit conveying manipulator 420 through the feeding and discharging device 300 and then the material to be coated is conveyed to the cold-temperature coating device 200 through the transit conveying manipulator 420, so that, the magnetron sputtering coating machine can select any temperature to carry out magnetron sputtering within the temperature range of-100-800 ℃, thereby greatly improving the operation temperature range of magnetron sputtering of materials to be coated and increasing the diversity of film forming environments.
In addition, based on the structural design of the invention, the transfer conveying manipulator can convey the material to be coated to and fro between the hot-temperature coating device 100 and the cold-temperature coating device 200, specifically, the transfer conveying manipulator can convey the coating material from the hot-temperature coating device 100 to the cold-temperature coating device 200 and also can convey the coating material from the cold-temperature coating device 200 to the hot-temperature coating device 100, so that the magnetron sputtering coating machine can perform coating in the temperature range of-100 ℃ to normal temperature once after the material to be coated completes coating in the temperature range of normal temperature to 800 ℃, or perform coating in the temperature range of normal temperature to 800 ℃ once again after the material to be coated completes coating in the temperature range of-100 ℃ to normal temperature, or make the material to be coated go back and forth between the hot-temperature coating device 100 and the cold-temperature coating device 200 for multiple times to perform coating operation, thus, the diversity of the film forming environment is further increased.
Based on the structural design of the invention, the magnetron sputtering coating machine greatly increases the diversity of the film forming environment, thus being beneficial to enterprises, universities or scientific research institutions to explore and mine the characteristics of magnetic material films, superlattice films and the like.
Eight of the hot temperature magnetron sputtering targets 150 and eight of the cold temperature magnetron sputtering targets 250 are provided.
Referring to fig. 2, in the implementation of the present invention, the magnetron sputtering coating machine further includes a transfer storage device 500, the transfer storage device 500 includes a transfer storage valve 520 and a transfer storage chamber 510, the transfer storage chamber 510 is provided with a storage chamber and a transfer chamber inlet/outlet for the material to be coated to enter and exit the storage chamber, and the transfer storage valve 520 is used for opening/closing the transfer chamber inlet/outlet. Meanwhile, the transfer chamber 410 is further provided with a wafer chamber inlet and outlet for the material to be plated to enter and exit the transfer chamber 4101 and butt-joint with the transfer chamber inlet and outlet, and the transfer robot 420 is further configured to transfer the material to be plated from the material storage chamber to the transfer chamber 4101 or transfer the material to be plated from the transfer chamber 4101 to the material storage chamber through the transfer chamber inlet and outlet and the wafer chamber inlet and outlet.
Based on the structural design, the transfer conveying manipulator 420 can firstly place the material to be coated in the material storage cavity for cooling if the temperature of the material to be coated is too high and needs a cooling time process in the process of conveying the material to be coated from the hot-temperature coating device 100 to the cold-temperature coating device 200, and then convey the material to be coated to the cold-temperature coating device 200 after cooling without influencing the coating of other materials to be coated to the hot-temperature coating device 100, so that the coating efficiency is improved. In the process of conveying the material to be coated from the cold-temperature coating device 200 to the hot-temperature coating device 100, if the temperature of the material to be coated is too cold and needs to be raised, the transfer conveying manipulator 420 may first place the material to be coated in the material storage chamber to be raised in temperature, and after the temperature is raised, send the material to be coated to the cold-temperature coating device 200 without affecting other materials to be coated to be sent to the cold-temperature coating device 200 for coating, thereby improving the coating efficiency.
Further, the transferring storage device 500 further includes a storage rack disposed in the transferring storage chamber 510 and a pretreatment assembly for pretreating a material to be coated. The pretreatment may include increasing cooling, heating rate, etc., thereby increasing coating efficiency.
Referring to fig. 4, in the embodiment of the present invention, the transfer robot 420 includes a material grabbing mechanism 421 for grabbing the material to be plated, a telescopic driver 422 for driving the material grabbing mechanism to reciprocate in a straight line in a horizontal plane, and a rotary driver 423 for driving the telescopic driver 422 to rotate horizontally in the horizontal plane.
Further, the hot end feed/discharge port 4102, the cold end feed/discharge port 4103, the feed end feed/discharge port, and the transfer chamber inlet/outlet are at the same level. Thus, the heat end inlet/outlet port 4102, the cold end inlet/outlet port 4103, the feed end inlet/outlet port, and the transfer chamber inlet/outlet port of the material grabbing mechanism 421 are beneficial to reducing the frequency of the upper and lower drivers driving the telescopic driver 422 to reciprocate up and down.
Referring to fig. 2 and fig. 3, in the embodiment of the present invention, the thermal temperature plating apparatus 100 further includes at least one thermal temperature shielding assembly 160 disposed corresponding to one thermal temperature magnetron sputtering target 150, respectively, the thermal temperature shielding assembly 160 is used for shielding the corresponding thermal temperature magnetron sputtering target 150 or at least shielding a portion of the corresponding thermal temperature magnetron sputtering target 150, and each thermal temperature shielding assembly 160 corresponds to one thermal temperature magnetron sputtering target 150. In specific implementation, each thermal-temperature magnetron sputtering target 150 can adopt different target materials, the target materials are selected according to needs in the film coating process, and the unnecessary target materials can be shielded by the thermal-temperature shielding assembly 160, so that the film forming material can be adjusted by users according to needs, and the characteristics of the magnetic material film and the superlattice film can be conveniently excavated. In addition, based on the structure, after one target material is used for film forming, another target material superposed film material can be added, so that the material richness of the film is increased, and the characteristics of the magnetic material film and the superlattice film are convenient to further develop.
Referring to fig. 2 and 3, in the embodiment of the present invention, the thermal temperature coating apparatus 100 further includes a thermal temperature correction assembly 170 for partially shielding the material to be coated fixed on the thermal temperature fixing member 120 to correct a coating region of the material to be coated. Thus, the heat temperature correction component 170 can correct the coating area of the material to be coated, so as to obtain the required coating area.
Referring to fig. 2 and 4, in the embodiment of the present invention, the cold temperature plating apparatus 200 further includes at least one cold temperature shielding assembly 260 respectively corresponding to one cold temperature magnetron sputtering target 250, the cold temperature shielding assembly 260 is used for shielding the corresponding cold temperature magnetron sputtering target 250, and each cold temperature shielding assembly 260 respectively corresponds to one cold temperature magnetron sputtering target 250. In specific implementation, each cold-temperature magnetron sputtering target 250 can adopt different target materials, the target materials are selected according to needs in the coating process, and the unnecessary target materials can be shielded by the cold-temperature shielding assembly 260, so that the film forming material can be adjusted by users according to needs, and the characteristics of the magnetic material film and the superlattice film can be conveniently excavated. In addition, based on the structure, after one target material is used for film forming, another target material superposed film material can be added, so that the material richness of the film is increased, and the characteristics of the magnetic material film and the superlattice film are convenient to further develop.
Referring to fig. 2 and 4, in the embodiment of the invention, the cold-temperature coating apparatus 200 further includes a cold-temperature correction assembly 270 for partially shielding the material to be coated fixed on the cold-temperature fixing member 220 to correct the coating region of the material to be coated. In this way, the cold temperature correction component 270 can correct the coating area of the material to be coated, thereby facilitating the acquisition of the required coating area.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A magnetron sputtering coating machine is characterized by comprising:
the hot-temperature coating device comprises a hot-temperature material valve, a hot-temperature coating chamber with a hot-temperature coating cavity, a hot-temperature fixing piece arranged in the hot-temperature coating cavity and used for fixing a material to be coated, a hot-temperature control assembly used for heating the hot-temperature fixing piece and capable of heating the hot-temperature fixing piece to any temperature of X-800 ℃, and at least one hot-temperature magnetron sputtering target arranged in the hot-temperature coating cavity and spaced from the hot-temperature fixing piece, wherein the hot-temperature coating chamber is provided with a hot-temperature material inlet and outlet for the material to be coated to enter and exit the hot-temperature coating cavity, and the hot-temperature material valve is used for opening/closing the hot-temperature material inlet and outlet;
the cold-temperature coating device comprises a cold-temperature material valve, a cold-temperature coating chamber with a cold-temperature coating cavity, a cold-temperature fixing piece arranged in the cold-temperature coating cavity and used for fixing a material to be coated, a cold-temperature control assembly used for cooling the cold-temperature fixing piece and capable of cooling the cold-temperature fixing piece to any temperature of-100 ℃ -X, and at least one cold-temperature magnetic control sputtering target arranged in the cold-temperature coating cavity and spaced from the cold-temperature fixing piece, wherein the cold-temperature coating chamber is provided with a cold-temperature material inlet and outlet for the material to be coated to enter and exit the cold-temperature coating cavity, and the cold-temperature material valve is used for opening/closing the cold-temperature material inlet and outlet;
the feeding and discharging device is used for supplying materials to be coated and for taking away the materials to be coated;
the transfer conveying device comprises a transfer conveying chamber with a transfer conveying cavity and a transfer conveying manipulator arranged in the transfer conveying cavity, wherein the transfer conveying chamber is provided with a hot end material inlet and outlet, a cold end material inlet and outlet and a feeding end material inlet and outlet, the hot end material inlet and outlet is butted with the hot temperature material inlet and outlet, the cold end material inlet and outlet is butted with the cold temperature material inlet and outlet, the transfer conveying manipulator is used for enabling a material to be plated to pass through the hot end material inlet and outlet and the hot temperature material inlet and outlet and enabling the material to be plated to be conveyed to the transfer conveying cavity from the hot temperature film coating cavity or conveying the material to be plated to the hot temperature film coating cavity from the transfer conveying cavity, and the transfer conveying manipulator is used for enabling the material to be plated to pass through the cold end material inlet and outlet and the cold temperature material inlet and outlet and conveying the material to be plated to be conveyed to the transfer conveying cavity from the cold temperature film coating cavity or conveying the material to be plated from the transfer conveying cavity The transfer conveying manipulator is also used for conveying the materials to be plated from the transfer conveying cavity to a feeding and discharging device through a feeding end and a discharging end of the materials to be plated or conveying the materials to be plated from the feeding and discharging device to the transfer conveying cavity;
wherein X is normal temperature.
2. The magnetron sputtering coating machine according to claim 1 further comprising a transfer storage device, wherein the transfer storage device comprises a transfer storage valve and a transfer storage chamber, the transfer storage chamber is provided with a storage chamber and a transfer chamber inlet and outlet for the material to be coated to enter and exit the storage chamber, and the transfer storage valve is used for opening/closing the transfer chamber inlet and outlet;
the transfer carrying chamber is also provided with a wafer chamber inlet and outlet for the material to be coated to enter and exit the transfer carrying cavity and be in butt joint with the transfer chamber inlet and outlet;
the transfer carrying manipulator is used for conveying the materials to be plated from the material storage cavity to the transfer carrying cavity or conveying the materials to be plated from the transfer carrying cavity to the material storage cavity through the transfer chamber inlet and outlet and the sheet chamber inlet and outlet.
3. The magnetron sputter coating machine of claim 2 wherein said staging storage means further comprises a storage rack disposed within said staging storage chamber and a pre-treatment assembly for pre-treating the material to be coated.
4. The magnetron sputtering coating machine according to claim 1 wherein said transfer robot comprises a grasping mechanism for grasping the material to be coated, a telescopic driver for driving said grasping mechanism to reciprocate linearly in the horizontal plane, and a rotary driver for driving said telescopic driver to rotate horizontally in the horizontal plane.
5. The magnetron sputter coating machine of claim 4 wherein said hot end inlet/outlet, said cold end inlet/outlet, said feed end inlet/outlet and said transfer chamber inlet/outlet are at the same level.
6. The magnetron sputtering coating machine according to any one of claims 1 to 5 wherein said thermal magnetron sputtering apparatus further comprises at least one thermal shield assembly disposed in correspondence with each of said thermal magnetron sputtering targets, said thermal shield assembly being adapted to shield a corresponding said thermal magnetron sputtering target or at least a portion of said thermal magnetron sputtering target.
7. The magnetron sputter coating machine as recited in claim 6 wherein said hot temperature coating apparatus further comprises a hot temperature correcting unit for partially shielding the material to be coated fixed to said hot temperature fixing unit to correct a coating region of the material to be coated.
8. The magnetron sputtering coating machine according to any one of claims 1 to 5 wherein said cold temperature coating device further comprises at least one cold temperature shielding assembly disposed corresponding to each of said cold temperature magnetron sputtering targets, said cold temperature shielding assembly being adapted to shield the corresponding cold temperature magnetron sputtering target.
9. The magnetron sputter coating machine as claimed in claim 8 wherein said cold temperature coating apparatus further comprises a cold temperature correcting member for partially shielding the material to be coated fixed to said cold temperature fixing member to correct a coating region of the material to be coated.
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| CN201811441007.1A CN110616406A (en) | 2018-11-29 | 2018-11-29 | Magnetron sputtering coating machine |
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| CN201811441007.1A CN110616406A (en) | 2018-11-29 | 2018-11-29 | Magnetron sputtering coating machine |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112281134A (en) * | 2020-10-30 | 2021-01-29 | 湘潭宏大真空技术股份有限公司 | Double-chamber high-efficiency film coating machine |
| CN114875374A (en) * | 2022-05-27 | 2022-08-09 | 安徽越好电子装备有限公司 | Transfer chamber, magnetron sputtering coating system and method |
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| CN114875374A (en) * | 2022-05-27 | 2022-08-09 | 安徽越好电子装备有限公司 | Transfer chamber, magnetron sputtering coating system and method |
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