TW516336B - Temperature-controlled chamber, and vacuum processing apparatus using the same, and heating method to process the object, cooling method to process the object - Google Patents

Temperature-controlled chamber, and vacuum processing apparatus using the same, and heating method to process the object, cooling method to process the object Download PDF

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Publication number
TW516336B
TW516336B TW090128239A TW90128239A TW516336B TW 516336 B TW516336 B TW 516336B TW 090128239 A TW090128239 A TW 090128239A TW 90128239 A TW90128239 A TW 90128239A TW 516336 B TW516336 B TW 516336B
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Taiwan
Prior art keywords
temperature control
aforementioned
transfer
room
chamber
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TW090128239A
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Chinese (zh)
Inventor
Koichi Matsumoto
Susumu Arai
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Ulvac Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber

Abstract

The object of technology of the present invention is to provide a temperature-controlled chamber with small installation space which enables heating of glass substrate. The solution of the present invention is: heating means 291 through 292 and cooling means 391 through 393 are mounted within mounting bases 111 through 113, and 114 through 116, respectively, of the temperature control rooms 51, 52. A substrate 4 is carried to each of mount bases 111 through 113, and 114 through 116, in this order, by transfer mechanisms 211 through 212, 214 through 216 and carry mechanisms 261 through 263, and 264 through 266 and are heated or cooled gradually. When the directions of mounting bases 111 though 113, and 114 through 116 that are adjacent to a carry-in chamber 2 are changed, so that since two sides that face conveying chamber 2 of substrate 4 can be made orthogonal to a direction for a hand 93 to move by a telescopic motion of an arm 92, substrate 4 can be carried into carry-in chamber 2 and carried out in stabilized conditions.

Description

516336 A7 B7 五、發明説明（1 ) 【發明所屬之技術領域】 (請先閲讀背面之注意事項再填寫本頁) 本發明係關於處理室及真空處理裝置，特別是關於預 先加熱處理對象物，進行成膜之真空處理裝置。 【.先行技術】 從以往’在基板表面多數使用第1 5圖的圖號1〇0 所示之真空處理裝置來作爲在基板表面形成薄膜之裝置。 此真空處理裝置1 0 0係具有··搬送室1 0 2、2台 之搬出入室1 1 〇 i、1 1 〇 2及複數個處理室1 〇 3 i〜 1 0 34。各處理室1〇3ι〜1 0 34與搬出入室1 1〇ι 、1 1 0 2係介由真空管1 〇 7 ^〜1 0 7 6各自連接於搬 送室1〇2 。 與安裝有搬出入室1 1 Oi、1 1 〇2之真空管 1 0 7 i、1 0 7 6側相反側之壁上，各自設有用來將基板 搬入/搬出真空處理裝置1〇〇之門1 1 5 !、1 1 5 2。 2台之搬出入室1 1 〇i、1 1 〇2中，一台爲使用於基板 之搬入，另一台則爲使用於基板之搬出。 經濟部智慧財產局員工消費合作社印製 各處理室1 0 3i〜l 0 34係以噴鍍裝置等之成膜裝 置所構成，爲了達到使用這些的處理室1 0 3 ^〜1 0 3 4 而在基板表面形成多層薄膜，首先關閉所有的真空管 1071〜107 6及門1151、1152，將搬送室2及 各處理室1 0 3 1〜1 0 3 4的內部真空排氣作成預定之真 空度。 其次，在以關閉真空管1 0 7 i〜1 0 7 6之狀態下， 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） —4 — 516336 A7 B7 五、發明説明（2 ) (請先閱讀背面之注意事項再填寫本頁) 打開搬入側之搬出入室1 1 〇 i之門1 1 5 1，導入大氣至 搬出入室1 1 0 1內後，在此搬出入室1 1 〇 1內配置基板 ，再次關閉門1 1 5 :。 接著’將該搬出入室1 1 〇 :內部真空排氣至預定之真 空度後，打開搬出入室1 1 〇 i與搬送室1 〇 2之間的真空 管1 0 7 1，連接搬出入室1 1 〇ι內部與搬送室1 〇 2內 部。 在搬送室1 0 2內部設有搬送基板之機器人1 〇 6， 使用此機器人1 0 6由搬出入室1 1 〇 1取出基板至搬送室 1 0 2後，再次關閉真空管真空管1 〇 7 i，打開搬出入室 1 1 0 1之門1 1 5 i導入大氣，而將新的基板搬入至搬出 入室1 1〇丄內。 被運送到搬送室1 0 2內之基板係藉由搬送機器人運 送到最先的處理室1 0 3 1。 當在最先的處理室1 0 3 ^進行預定時間的成膜作業，則在 基板表面形成預定膜厚之薄膜。 經濟部智慧財產局員工消費合作社印製 其次，當將基板由最先的處理室1 〇 3 1送至下一個處 理室1 0 3 2，進行與最先的處理室1 〇 3 1相同之成膜作 業後，在依次地將基板送至剩下之處理室1 〇 3 3、 1〇3 4進行成膜作業時，在最後的處理室1 〇 3 5之成膜 作業結束後，在基板表面形成多層薄膜。 其次，打開搬出側的搬出入室1 1 〇 2之真空管 1〇7 6，由搬送室1 0 2將已形成多層薄膜之基板移至該 搬出入室1 1 ◦ 2內，再次關閉真空管1 〇 7 6。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -5- 516336 A7 _____ B7 五、發明説明（3 ) · 再來，打開搬出側的搬出入室1 1 〇 2之門1 1 5 2， 由真空處理裝置101取出已形成有多層薄膜之基板。 (請先閲讀背面之注意事項再填寫本頁} 然而，近年被要求高精準度之多層薄膜，爲了高精準 度地進行成膜作業’須要在將基板送到各處理室1 0 3 1，〜 1.0 3 4之前，預先加熱。 作爲在上述般的真空處理裝置設置加熱基板的裝置之 方法，例如被提案有：增大真空處理裝置，在搬出入室與 處理室之間新設置加熱基板的加熱室之方法；與連接兩個 搬送室，在一、方的搬送室連接加熱室之方法等。 但任一情況，皆產生使真空處理裝置大型化，真空處 理裝置及使用真空處理裝置之基板的製造成本變高之問題 〇 · 且，在使用矽基板作爲基板之情況下，具有、在搬入 側的搬出入室內設置燈加熱器，在將基板搬入至搬出入室 1 1 0 1後，邊進行真空排氣邊以燈加熱器的輻射熱加熱基 板之方法。 經濟部智慧財產局員工消費合作社印製 雖以此方法不須要使裝置大型化即可達到，但因透明 的基板係以燈加熱器的輻射熱不被加熱，故產生無法使坡 璃基板使用於成膜處理之問題。 【發明所欲解決之問題】 本發明係爲了解決上述以往技術之缺點而被創作者.， 其目的係在於提供能夠使用玻璃基板作爲對象基板使用之 真空處理裝置。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 一 516336 A7 B7 五、發明説明（4 ) 【用來解決課題之手段】 爲了解決上述課題，本發明係一種溫度控制室，係具 有：真空槽；及配置於前述真空槽內之搬送機構；及配置 於.前述搬送機構的下方位置之載置台；及設於前述載置台 內之溫度控制手段；以及插通於前述載置台內之移載機構 ’將處理對象物載置於前述真空槽內之載置台上，藉由前 述溫度控制手段進行溫度控制之溫度控制室，其特徵爲： 前述載置台係構成在水平面內改變方向。 本發明係一種溫度控制室，係具有：真空槽；及配置 於前述真空槽內之複數'個搬送機構；及在前述搬送機構的 下方位置，排列成一列之複數個載置台；及在前述載置台 內’各自設置的複數個溫度控制手段；以及各自插通於前 述載置台內之複數個移載機構，將已搬入到前述真空槽內 之處理對象物，由前述搬送機構轉移到前述移載機構後， 載置於前述載置台上，藉由前述溫度控制手段，將前述處 理對象物進行溫度控制後，再藉由前述移載機構，由載置 台轉移到前述搬送機構，再藉由前述搬送機構，依次地送 至前述被排列成一列之各載置台的溫度控制室，其特徵爲 :在前述被排列成一列之各載置台中，至少位於〜端之載 置台係構成在水平面內改變方向。 本發明係溫度控制室，前述溫度控制手段係藉由通電 而發熱之加熱手段，被使用於前述前述處理對象物之加熱 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） 3 JT I I (請先閲讀背面之注意事項再填寫本頁)516336 A7 B7 V. Description of the invention (1) [Technical field to which the invention belongs] (Please read the precautions on the back before filling out this page) The present invention relates to a processing chamber and a vacuum processing device, and in particular, to an object to be heated in advance, Vacuum processing equipment for film formation. [.Advanced technology] From the past, a vacuum processing apparatus shown in FIG. 15 of FIG. 15 was used as a device for forming a thin film on a substrate surface. This vacuum processing apparatus 100 includes a transfer chamber 10, 2 and a loading / unloading chamber 1 10i, 1 102, and a plurality of processing chambers 103 to 1034. Each of the processing chambers 1030 to 1 0 34 and the loading and unloading chambers 1 110 and 1 102 are respectively connected to the transfer chamber 10 through a vacuum tube 1 0 7 ^ to 1 0 7. On the walls opposite to the vacuum tubes 1 0 7 i and 1 10 6 with the loading / unloading chamber 1 1 Oi, 1 1 〇2, there are doors 1 1 for moving substrates in and out of the vacuum processing apparatus 100 respectively. 5!, 1 1 5 2. Of the two units 1101 and 1102, one is used for the substrate, and the other is used for the substrate. The processing chambers printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, each of the processing chambers 10 3i to 10 34 are made of film-forming equipment such as spray coating equipment. In order to use these processing chambers 1 0 3 ^ ~ 1 0 3 4 To form a multilayer film on the surface of the substrate, first close all the vacuum tubes 1071 to 1076 and the doors 1151 and 1152, and evacuate the internal vacuum of the transfer chamber 2 and each processing chamber 1 0 3 1 to 1 0 3 4 to a predetermined degree of vacuum. Secondly, in the state that the vacuum tube is closed between 10 7 i and 10 7 6, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X297 mm) — 4 — 516336 A7 B7 V. Description of the invention (2) (Please read the precautions on the back before filling in this page.) Open the door 1 1 〇i of the entrance / exit room 1 1 5 1 on the carry-in side, and introduce the atmosphere to the entrance / exit room 1 1 0 1, and then enter / exit the room 1 1 〇 1 here. Inside the board, close the door 1 1 5: again. Next, 'exit the carry-in / out room 1 1 〇: after the internal vacuum is exhausted to a predetermined vacuum degree, open the vacuum tube 1 0 7 1 between the carry-in / out room 1 1 〇i and the transfer room 1 〇2, and connect the carry-in / out room 1 1 〇 Inside and inside the transfer room 102. A robot 1 〇6 for transferring substrates is provided in the transfer room 102. Using this robot 10 to remove the substrate from the transfer room 1 1 〇1 to the transfer room 1 02, the vacuum tube 1 07 i is closed again and opened. The door 1 1 5 i of the loading / unloading room 1 110 is introduced into the atmosphere, and a new substrate is loaded into the loading / unloading room 1 110 °. The substrate transferred into the transfer chamber 102 is transferred to the first processing chamber 1031 by the transfer robot. When a film-forming operation is performed for a predetermined time in the first processing chamber 1003, a thin film having a predetermined film thickness is formed on the substrate surface. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the substrate is sent from the first processing chamber 1 0 3 1 to the next processing chamber 1 0 3 2, the same process as the first processing chamber 1 0 3 1 is performed. After the film operation, the substrates are sequentially sent to the remaining processing chambers 1 0 3 3 and 10 3 4 for film forming operation. After the film forming operation of the last processing chamber 1 0 3 5 is completed, the substrate surface is Form a multilayer film. Next, open the vacuum tube 1076 of the carry-in / out room 1 1 02 on the carry-out side, and transfer the substrate having the multilayer film formed in the carry-out room 1 2 to the carry-in / out room 1 1 ◦ 2 and close the vacuum tube 1 0 6 again. . This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -5- 516336 A7 _____ B7 V. Description of the invention (3) · Then, open the entrance door 1 1 〇2 on the exit side 1 1 5 2. Take out the substrate on which the multilayer film has been formed from the vacuum processing apparatus 101. (Please read the precautions on the back before filling out this page} However, in recent years, high-precision multilayer films have been required. In order to perform film-forming operations with high accuracy, it is necessary to send the substrate to each processing chamber 1 0 3 1, ~ Prior to 1.0 3 4, pre-heating. As a method for installing a substrate heating device in the above-mentioned vacuum processing device, for example, it is proposed to increase the vacuum processing device, and newly set a heating substrate heating chamber between the loading / unloading chamber and the processing chamber. Method; a method for connecting two transfer chambers, and a heating chamber connected to one or one of the transfer chambers, etc. However, in either case, a vacuum processing apparatus is enlarged, and a vacuum processing apparatus and a substrate using the vacuum processing apparatus are produced. The problem of high cost. When a silicon substrate is used as the substrate, a lamp heater is installed in the loading / unloading room on the loading side, and the vacuum exhaust is performed after the board is loaded into the loading / unloading room. The method of heating the substrate by the radiant heat of a lamp heater on the gas side. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Although this method does not require a large device It can be achieved, but because the transparent substrate is not heated by the radiant heat of the lamp heater, there is a problem that the sloped glass substrate cannot be used for film formation processing. [Problems to be Solved by the Invention] The present invention is to solve the above-mentioned conventional problems The creator of the technology has its shortcomings. Its purpose is to provide a vacuum processing device that can use glass substrates as target substrates. This paper size applies to China National Standard (CNS) A4 specifications (210X297 mm) 516336 A7 B7 V. Description of the invention (4) [Means for solving the problem] In order to solve the above-mentioned problem, the present invention is a temperature control room having: a vacuum tank; and a transport mechanism disposed in the aforementioned vacuum tank; and disposed in the aforementioned transport mechanism And a temperature control means provided in the aforementioned mounting table; and a transfer mechanism 'plugged in the aforementioned mounting table' to place the processing object on the mounting table in the aforementioned vacuum tank, by The temperature control room for temperature control by the temperature control means is characterized in that the structure of the mounting platform is changed in a horizontal plane. The present invention is a temperature control room having: a vacuum tank; and a plurality of 'transport mechanisms' arranged in the aforementioned vacuum tank; and a plurality of mounting tables arranged in a row at a position below the aforementioned transport mechanism; and A plurality of temperature control means respectively provided in the mounting table; and a plurality of transfer mechanisms respectively inserted in the mounting table, and the processing objects that have been moved into the vacuum tank are transferred by the transfer mechanism to the foregoing After the transfer mechanism is placed on the mounting table, the temperature of the processing object is controlled by the temperature control means, and then the transfer mechanism is used to transfer the transfer object from the mounting table to the transfer mechanism. The conveying mechanism is sequentially sent to the temperature control room of each of the mounting tables arranged in a row, and is characterized in that among the mounting tables arranged in a row, at least the mounting tables located at the ~ end are formed in a horizontal plane. change direction. The present invention is a temperature control room. The foregoing temperature control means is a heating means for generating heat by being energized, and is used for heating the aforementioned processing object. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 3 JT II (Please read the notes on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製 516336 A7 _____ B7____ 五、發明説明（5 ) 本發明係溫度控制室，前述溫度控制手段係藉由冷卻 水的循環而冷卻之冷卻手段，被使用於前述前述處理對象 物之冷卻。 本發明係一種真空處理裝置，係具有溫度控制室、搬 送.室及搬出入室，處理對象物是通過前述溫度控制室，而 搬送於前述搬出入室與前述搬送室之間的真空處理裝置， 其特徵爲：前述溫度控制室係具有：各自連接於前述搬送 室與前述搬出入室之真空槽；及配置於前述真空槽內之搬 送機構；及配置於前述搬送機構的下方位置之載置台；及 設於前述載置台內之溫度控制手段；以及插通於前述載置 台內之移載機構，前述載置台係構成在水平面內改變方向 ，且將處理對象物載置於前述真空槽內之載置台上，藉由 .前述溫度控制手段進行溫度控制。 本發明係一種真空處理裝置，係具有溫度控制室、搬 送室及搬出入室，處理對象物是通過前述溫度控制室，而 搬送於前述搬出入室與前述搬送室之間的真空處理裝置， 其特徵爲：前述溫度控制室，係具有：各自連接於前述搬 送室與前述搬出入室之真空槽；及配置於前述真空槽內之 複數個搬送機構；及在前述搬送機構的下方位置，排列成 一列之複數個載置台；及在前述載置台內，各自設置的複 數個溫度控制手段；以及各自插通於前述載置台內之複數 個移載機構，在前述被排列成一列之各載置台中，至少位 於一端之載置台係構成在水平面內改變方向，將已搬入到 前述真空槽內之處理對象物，由前述搬送機構轉移到前述 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ' Iτ !ΊI—ί —11 (請先閲讀背面之注意事項再填^本頁) 訂 經濟部智慧財產局員工消費合作社印製 516336 A7 B7 五、發明説明（6 ) (請先閲讀背面之注意事項再填寫本頁) 移載機構後，載置於前述載置台上，藉由前述溫度控制手 段’將前述處理對象物進行溫度控制後，再藉由前述移載 機構，由載置台轉移到前述搬送機構，再藉由前述搬送機 構’依次地送至前述被排列成一列之各載置台。 .本發明係真空處理裝置，在前述搬送室內，設有具有 旋轉軸及被安裝於前述旋轉軸上之手臂的搬送機器人，前 述手臂係根據前述旋轉軸的旋轉，在水平面內旋轉或伸縮 ’而前述處理對象物是構成根據前述手臂的伸縮，在從前 述旋轉軸的中心朝在前述水平面內改變方向之載置台延伸 的直線上被搬送，前述旋轉中心是位於由前述溫度控制室 的前述載置台的排列方向遠離之位置。 經濟部智慧財產局員工消費合作社印製 本發明係真空處理裝置，至少具有兩個前述溫度控制 室，在前述溫度控制室中，一方的溫度控制室之前述溫度 控制手段係藉由通電而發熱之加熱手段，而另一方之前述 溫度控制室的前述溫度控制手段係藉由冷卻水的循環而冷 卻之冷卻手段，使用於前述加熱之溫度控制室與使用於前 述冷卻之溫度控制室係各自鄰接於前·述搬送室而連接著， 使用於前述加熱之溫度控制室的前述載置台所排列之列與 使用於前述冷卻之溫度控制室的前述載置台所排列之列係 相互平行。 本發明係一種處理對象物加熱方法，係在將平面形狀 爲矩形之處理對象物，從搬出入室通過溫度控制室移動至 搬送室爲止之間加熱，使用被配置於前述搬送室內之搬送 機器人，以使該搬送機器人的旋轉軸轉動而縮短該搬送機 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 516336 A7 B7 五、發明説明（7 ) (請先閱讀背面之注意事項再填寫本頁) 器人之手臂的事，將前述處理對象物搬入到前述搬送室內 之處理對象物加熱方法，其特徵爲：在搬入到前述搬送室 前，將前述處理對象物在水平面內改變方向，使前述處理 對象物之相對的兩邊與由前述搬送機器人的旋轉軸中心延 伸之輻射線正交後，將前述處理對象物轉移至前述搬送機 器人。 本發明係一種處理對象物冷卻方法，係在將平面形狀 爲矩形之處理對象物，使用被配置於搬送室內之搬送機器 人’以使該搬送機器人的旋轉軸轉動而伸長該搬送機器人 之手臂的事，將前述處理對象物搬送至溫度控制室，將前 述處理對象物通過溫度控制室移動至搬出入室爲止之間冷 卻之處理對象物冷卻方法，其特徵爲：將前述處理對象物 從前述搬送室朝前述溫度控制室搬送時，使前述處理對象 物之相對的兩邊與由前述搬送機器人的旋轉軸中心延伸之 輻射線正交之狀態下搬送，接著，改變前述處理對象物之 方向，朝搬出入室使其移動至直線上。 經濟部智慧財產局員工消費合作社印製 本發明係如上述搬地構成，在本發明之溫度控制室， 因處理對象物是在真空環境下被溫度控制，故能夠將處理 對象物加熱到高溫。 右在錯由溫度控制手段使載置台提筒溫度的狀態下載 置處理對象物的話，處理對象物係受到熱傳導而被加熱。 且與這相反，若藉由冷卻手段將載置台的溫度降低到較處 理對象物的溫度低而在此載置台上載置處理對象物的話， 可冷卻處理對象物。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 516336 A7 B7 五、發明説明（8 ) 在預先在載置台內設置靜電吸著裝置，載置處理對象 物之狀態下，若起動靜電吸著裝置的話，因處理對象物被 靜電吸著於載置台上，故能有效率地加熱/冷卻處理對象 物。 一般，在將處理對象物搬入至搬送室之搬送機器人的 手臂，安裝著保持處理對象物之手部。此手部係經常朝向 由旋轉軸的中心延伸之一輻射線的延伸方向，當藉由旋轉 軸的j疋轉手臂伸縮時’手部係住復移動於由旋轉軸的中心 延伸之輻射線上。 因此’搬送平面形狀爲矩形之處理對象物的情況，當 處理對象物的相對之邊對於手部的方向傾斜時，無法將處 理對象物載置於手部。 但，在本發明之濫度控制室，即使旋轉軸的中心與處 理封象物在温度控制室被搬送的方向遠離之情況，因將相 對於處理對象物的搬送室之兩邊正交配置於手部之移動方 向上，所以也能夠在已安定處理對象物的狀態下載置於手 部。 ‘， 因此，因不須要將傳送處理對象物之複數個載置台的 列，配置於由搬送機器人的旋轉軸中心延伸之輻射線上即 可，所以真空處理裝置的設置空間小，其製造成本低廉。. 在一個溫度控制室內設置複數個載置台之情況，因若 依處理對象物被搬送的順序將各載置台的溫度提高的話， 因處理對象物被階段式地加熱，所以即使處理對象物的最 終溫度爲高溫的情況，由於熱膨脹，處理對象物也不會損 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) •裝 —訂------AWI. 經濟部智慧財產局員工消費合作社印製 -11 - 516336 A7 B7 五、發明説明（9 ) 傷。 且，冷卻對象之處理對象物爲高溫的情況，預先在冷 卻手段內使溫水循環的話，當處理對象物被載置於載置台 而冷卻時，由於熱收，縮處理對象物也不會損傷。 、 .如此，若使用本發明之真空處理裝置的話，因能達接 複數個基板加熱至高溫，並且進行成膜處理，所以fg'夠縮 短處理之節拍時間。 【發明之實施形態】 以下參照第1圖，圖號5 i與5 2係各自顯示本發明之 一個例子的溫度控制室。 同圖的圖號1係本發明之一個例子的真空處理裝置， 此真空，處理裝置1係具有：上述的2台溫度控制室5 1、 5 2 ;搬送室2 ; 2台的搬出入室1 〇 :、1 〇 2 ;以及複 數台之處理室3 1〜32。 各溫度控制室5!、52係各自具有：真空槽9i、92 ;複數個載置台1 1 :〜1 1 3、1 1 4〜1 1 6 ;及複數個 搬送機構2 6 1〜2 6 3 ' 2 6 4〜2 6 6。在此，各溫度控 制室·係具有3個載置台1 1 1〜1 1 3、1 1 4〜1 1 6。 真空槽9 1、9 2係被形成細長形。真空槽9 !、9 2的 長方向之一端部與處理室3 1〜3 2的一側面係各自介由真 空管7 2〜7 7連接於搬送室2，真空槽9 1、9 2的另一端 部係介由真空管7 i、7 8連接於搬出入室；L 〇. \、1 〇 2。 載置台1 1 1〜1 1 3、1 1 4〜1 1 6係各自被配置於 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公慶） (請先閲讀背面之注意事項再填寫本頁) -CH I JT —1 I-1 I-I --I n I I -—I I—I I . 經濟部智慧財產局員工消費合作社印製 -12- 516336 A7 B7 五、發明説明（10 ) 真空槽9ι、92內，這些載置台lii〜113、ιι4〜 1 1 6係在與真空槽9 i、9 2的搬送室2連接之端部及連 接於搬出入室1 〇:、1 〇2之端部間，沿著真空槽9ι、 9 2之長方向排成一列。 各載置台1 li〜1 13、1 14〜1 16的平面形狀係 正方形或長方形等之矩形，這些載置台1 1 1〜1 1 3、 1 1 4〜1 1 6的相對之兩邊係與真空槽9 i、9 2的兩壁面 平行。 第3、4圖係顯示各溫度控制室5 i、5 2的真空槽 9 1、9 2的內部之槪略圖。在各載置台1 1 1〜1 1 3、 1 14〜1 16，各自設有由表面貫通至裡面之孔25^〜 2 5 3、2 5 4 〜2 5 6 ° 在各載置台1 ll〜1 ]_3、1 14〜1 ]„6的下方，各 自配置著移載機構2 li〜2 13、2 14〜2 16。移載機 構2 1 i〜2 1 3、2 1 4〜2 1 6係由前端部分歧成複數拫 之銷所構成，其前端部係各自從載置台1 1 ^〜1 1 3、 1 14〜1 16的下方插通於孔2 5ι〜2 53、2 54〜 2 5 6 內。 被配置於各真空槽9 ^、9 2內之載置台1 1 !〜1 1 :3 、1 1 4〜1 1 6中，除了鄰接於搬送室2之載置台1 1 3 、1 1 4以外之載置台1 1 !、1 1 2、1 1 5、1 1 6係各 自被固定於真空槽9 i、9 2的底壁，被配置於這些載置台 1 1 i、1 1 2、1 1 5、1 1 6的下方之移載機構2 1 1、 2 1 2、2 1 5、2 1 6係其端部是各自於真空槽9 .1、9 2 本紙張尺度適用中國國家標準（CNS) A4規格（210x297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 516336 A7 B7 五、發明説明（11 ) 被密封地導出，而連接於未圖示之升降機構上。 (請先閱讀背面之注意事項再填寫本頁) 另一方面，鄰接於搬送室2之載置台1 1 3、1 1 4係 被安裝於由真空槽9 1、9 2外部被密封地導入之旋轉軸 42!、422上，在這些的旋轉軸42!、422，設有支 撐.台 4 5 !、4 5 2。 被配置於鄰接於搬送室2之載置台1丄3、1 1 4的下 方之移載機構2 1 3、2 1 4係其下端部被安裝於支撐台 4 5 1、4 5 2，當旋轉軸4 2. 1、4 2 2旋轉時，支撐台 4 5i、4 52與載置台1 Is、1 14 一同在水平面內改變 方向。在被安裝於移載機構2 1 3、2 1 4之支擦台4 5 1 、4 5 2的下端部，安裝著未圖示之升降機構。 經濟部智慧財產局員工消費合作社印製 搬送機構2 6 !〜2 6 3、2 6 4〜2 6 6係各自設於在 真空槽9 ^、9 2的壁面中沿著真空槽9 ^、9 2的長方向之 兩壁面上。參照第1圖，搬送機構2 6 :〜2 6 3、2 6 4 .〜2 6 6係具有軸2 7丄〜2 7 3、2 7 4〜2 7 6.;及輥子 28i〜28 3、284 〜26。軸 27!〜273、274 〜 2 7 6係各自從真空槽9 ^、9 2外部被密封地導入至真空 槽9 1、9 2內部，輥子2 8 1〜2 8 3、2 8 4〜2 6係被 安裝於各軸2 7 ^〜2 7 3、2 7 4〜2 7 6之導入的前端。 輥子28ι〜2 83、2 84〜26係位於較載置台11 1〜 1 1 3 ' 1 1 4〜1 1 6的平坦表面更高之位置。 搬送機構2 6 i〜2 6 3、2 6 4〜2 6 6的軸2 7 1〜 2 7 3 ·、2 7 4〜2 7 6中，被密封地導出至真空槽9丄、 9 2外的部分係被安裝於未圖示之驅動機構上，當使此驅動 本紙張尺度適用中國國家標準（CNs ) a4規格（210X297公釐） -14- 經濟部智慧財產局員工消費合作社印製 516336 A7 _ B7 五、發明説明（12 ) 機構動作時，位於軸2 7 1〜2 7 3、2 7 4〜2 7 6的真空 槽9 i、9 2內之部分是在密封地保持真空槽9 1、9 2的狀 態下，相對於真空槽9 i、9 2的壁面，伸縮成直角。 第1〇（a)圖係顯不軸27 1〜27 3、274〜 2. 7 6已縮短的狀態，在此狀態下，輥子2 8 1〜2 8 3、 2 84〜26由載置台111〜113、114〜]_1(3的上 方退避。又，第10 (b)圖係顯示軸27i〜273、 2 7 4〜2 7 6已伸長之狀態，在此狀態下，輥子2 8 ^〜 28 3、284〜26是位於各載置台1 li〜1 13、 1 ]_4〜1 ]_6表面的四角之上方。 參照第3、4圖，在各載置台1 li〜1 13、1 14 〜1 1 6的表面附近，各自內藏著一對之電極2 3 23 3、234〜236，當在這一對之電極23 i〜23 3 、2 3 4〜2 3 6上施加正負電壓時，在已將處理對象物載 置於載置台1 1 1〜1 1 3、1 1 4〜1 1 6的表面之情況下 ’產生靜電吸著力。 這些載置台1 1!〜1 Is、1 14〜1 16中，如第3 圖所示，在一方的溫度控制室5 χ的載置台1 1 i〜1 1 3 ’各自內藏著由碳加熱器所構成之加熱手段2 9 1〜2 9 3 ，如第4圖所示，在另一方的溫度控制室5 2之各載置台 1 1 4〜1 1 6，各自內藏著由溫水循環裝置所構成之冷卻 手段3 9 1〜3 9 3。 參照第1圖，因載置台lli〜II3、II4〜lie 係構成藉由這些加熱手段2 9 1〜2 9 3或冷卻手段3 9 1 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁)1.1T printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 516336 A7 _____ B7____ 5. Description of the Invention (5) The present invention is a temperature control room. The aforementioned temperature control means is a cooling means cooled by the circulation of cooling water and is used in The cooling of the processing object. The present invention relates to a vacuum processing apparatus having a temperature control chamber, a transfer chamber, and a transfer-in and transfer-in chamber. The processing object is a vacuum processing apparatus transferred between the transfer-in and transfer-out chamber and the transfer chamber through the temperature control chamber. The above-mentioned temperature control room includes: a vacuum tank respectively connected to the above-mentioned transfer chamber and the above-mentioned carry-in / out chamber; and a transfer mechanism arranged in the above-mentioned vacuum tank; and a mounting table arranged below the transfer mechanism; and Temperature control means in the aforementioned mounting table; and a transfer mechanism inserted in the aforementioned mounting table, the aforementioned mounting table is configured to change direction in a horizontal plane, and the processing object is placed on the mounting table in the aforementioned vacuum tank, Temperature control is performed by the aforementioned temperature control means. The present invention relates to a vacuum processing device, which includes a temperature control room, a transfer room, and a carry-in / out room. The processing object is a vacuum processing device carried between the carry-in / out room and the carry-over room through the temperature control room. The aforementioned temperature control room includes: a vacuum tank respectively connected to the aforementioned transfer chamber and the aforementioned carry-in / out chamber; and a plurality of transport mechanisms arranged in the aforementioned vacuum tank; and a plurality of rows arranged in a row below the aforementioned transport mechanism Mounting platforms; and a plurality of temperature control means respectively provided in the aforementioned mounting platforms; and a plurality of transfer mechanisms respectively inserted in the aforementioned mounting platforms, among the aforementioned mounting platforms arranged in a row, at least The mounting platform at one end is configured to change the direction in the horizontal plane, and the processing object that has been moved into the vacuum tank is transferred from the aforementioned transport mechanism to the aforementioned paper size. The Chinese national standard (CNS) A4 specification (210X297 mm) is applied. Iτ! ΊI—ί —11 (Please read the notes on the back before filling this page) Printed by the Bureau ’s Consumer Cooperatives 516336 A7 B7 V. Description of Invention (6) (Please read the precautions on the back before filling this page) After transferring the mechanism, place it on the aforementioned mounting table and use the aforementioned temperature control method to After the object to be processed is temperature-controlled, it is transferred from the mounting table to the transfer mechanism by the transfer mechanism, and then sequentially transferred to the mounting tables arranged in a row by the transfer mechanism. The present invention is a vacuum processing device. In the transfer chamber, a transfer robot having a rotation axis and an arm mounted on the rotation axis is provided. The arm is rotated or retracted in a horizontal plane according to the rotation of the rotation axis. The processing object is configured to be transported on a straight line extending from a center of the rotation axis toward a mounting table that changes direction in the horizontal plane according to the expansion and contraction of the arm, and the rotation center is the mounting table located in the temperature control room. The arrangement direction is far from the position. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the present invention is a vacuum processing device having at least two of the aforementioned temperature control rooms. Among the aforementioned temperature control rooms, one of the aforementioned temperature control means of the temperature control room generates heat by being energized. The heating means, and the aforementioned temperature control means of the other aforementioned temperature control room are cooling means cooled by the circulation of cooling water, and the temperature control room used for the heating and the temperature control room used for the cooling are adjacent to each other. The transfer chambers are connected as described above, and the rows of the mounting tables used in the heated temperature control room and the rows of the mounting tables used in the cooled temperature control room are parallel to each other. The invention relates to a method for heating a processing object, which heats a processing object having a rectangular planar shape and moves from a loading / unloading room to a transfer room through a temperature control room to a transfer room. A transfer robot arranged in the transfer room is used to: Rotate the rotation axis of the conveying robot to shorten the conveying machine. The paper size of the conveying machine applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 516336 A7 B7 V. Description of the invention (7) (Please read the precautions on the back before filling This page) A method of heating a processing object by moving the processing object into the transportation chamber with the arm of a robot, characterized by changing the direction of the processing object in a horizontal plane before moving into the transportation chamber. After the two opposite sides of the processing object are orthogonal to a radiation line extending from the center of the rotation axis of the transfer robot, the processing object is transferred to the transfer robot. The present invention relates to a method for cooling a processing object, which is to extend a processing robot's arm by using a processing robot 'disposed in a transportation chamber to rotate a rotation axis of the processing robot when the processing object has a rectangular planar shape. A cooling method for a processing object that transports the processing object to a temperature control room and moves the processing object through the temperature control room to the temperature of the loading and unloading room, is characterized in that the processing object is moved from the transportation room toward When the temperature control room is transported, the two sides of the object to be processed are transported in a state orthogonal to the radiation line extending from the center of the rotation axis of the transport robot. Then, the direction of the object to be processed is changed, and the object is moved in and out of the room. It moves to a straight line. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The present invention is constructed as described above. In the temperature control room of the present invention, the processing object is temperature-controlled in a vacuum environment, so the processing object can be heated to a high temperature. On the right, if the processing object is loaded in a state where the temperature of the mounting table lifter is incorrectly controlled by the temperature control means, the processing object is heated by heat conduction. On the contrary, if the temperature of the mounting table is lowered to a temperature lower than the processing target by the cooling means, and the processing target is placed on the mounting table, the processing target can be cooled. This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) -10- 516336 A7 B7 V. Description of the invention (8) In the state where an electrostatic adsorption device is set in the mounting table in advance, the processing object is placed If the electrostatic adsorption device is activated, the object to be processed is electrostatically attracted to the mounting table, so the object to be processed can be efficiently heated / cooled. Generally, the arm of a transfer robot that carries a processing object into a transfer room is equipped with a hand that holds the processing object. This hand is often oriented in the direction of a radiation line extending from the center of the rotation axis. When the arm is extended and retracted by the rotation of the rotation axis of the rotation axis, the hand is tied to the radiation line extending from the center of the rotation axis. Therefore, in the case of 'transporting a processing object having a rectangular planar shape, when the opposite side of the processing object is inclined to the direction of the hand, the processing object cannot be placed on the hand. However, even in the case where the center of the rotation axis of the present invention is far away from the direction in which the image processing object is transported in the temperature control room, both sides of the transport chamber with respect to the processing object are disposed orthogonally to the hand. In the direction of movement of the part, it can be downloaded and placed on the hand while the processing object is settled. 'Therefore, since it is not necessary to arrange a plurality of stages for transferring a processing object on a radiation line extending from the center of the rotation axis of the transfer robot, the installation space of the vacuum processing apparatus is small, and its manufacturing cost is low. When a plurality of mounting tables are installed in one temperature control room, if the temperature of each mounting table is increased in the order in which the processing objects are transferred, the processing objects are heated in stages, so even if the processing objects are finally In the case of high temperature, due to thermal expansion, the object to be treated will not damage the paper. The Chinese standard (CNS) A4 specification (210X297 mm) is applicable (please read the precautions on the back before filling this page). ------ AWI. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -11-516336 A7 B7 V. Description of Invention (9) Injury. In addition, if the object to be cooled is high temperature, if warm water is circulated in the cooling means in advance, when the object to be cooled is placed on the mounting table and cooled, the object to be treated will not be damaged due to heat recovery. In this way, if the vacuum processing device of the present invention is used, since a plurality of substrates can be heated to a high temperature and a film forming process can be performed, fg 'can shorten the processing cycle time. [Embodiment of the invention] Referring to Fig. 1, the reference numerals 5i and 52 each show a temperature control room according to an example of the present invention. The drawing number 1 in the same figure is a vacuum processing device according to an example of the present invention. This vacuum processing device 1 has the above-mentioned two temperature control rooms 5 1 and 5 2, a transfer room 2, and two carry-in / out rooms 1 〇 :, 1 〇2; and a plurality of processing chambers 3 1 ~ 32. Each of the temperature control chambers 5! And 52 has: vacuum chambers 9i and 92; a plurality of mounting tables 1 1: ~ 1 1 3, 1 1 4 to 1 1 6; and a plurality of transfer mechanisms 2 6 1 to 2 6 3 '2 6 4 ~ 2 6 6. Here, each temperature control room / system has three mounting tables 1 1 1 to 1 1 3, 1 1 4 to 1 1 6. The vacuum tanks 9 1 and 9 2 are formed in an elongated shape. One end in the longitudinal direction of the vacuum chambers 9 and 9 2 and one side of the processing chambers 3 1 to 3 2 are connected to the transfer chamber 2 via vacuum tubes 7 2 to 7 7 respectively, and the other ends of the vacuum chambers 9 1 and 9 2 The department is connected to the loading / unloading room via vacuum tubes 7 i, 7 8; L 〇. \, 1 〇2. Mounting tables 1 1 1 ~ 1 1 3, 1 1 4 ~ 1 1 6 are each configured on this paper scale. Applicable to China National Standard (CNS) A4 specification (210X297 public holiday) (Please read the notes on the back before filling (This page) -CH I JT —1 I-1 II --I n II ——II—II. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-12- 516336 A7 B7 V. Description of the invention (10) Vacuum tank 9ι In 92, 92, these mounting tables lii ~ 113, ι4 ~ 1 1 6 are connected to the ends connected to the transfer chamber 2 of the vacuum tanks 9 i, 9 2 and the ends connected to the carry-in / out chambers 10: 1, 102. , Arranged in a row along the length of the vacuum grooves 9ι, 92. The planar shapes of the mounting tables 1 li to 1 13, 1 14 to 1 16 are rectangular such as squares or rectangles. The opposite sides of these mounting tables 1 1 1 to 1 1 3, 1 1 4 to 1 1 6 are vacuumed. Both wall surfaces of the grooves 9 i and 92 are parallel. Figures 3 and 4 are schematic views showing the interior of the vacuum tanks 9 1 and 9 2 of the temperature control chambers 5 i and 5 2. Each mounting table 1 1 1 ~ 1 1 3, 1 14 ~ 1 16 is provided with a hole penetrating from the surface to the inside 25 ^ ~ 2 5 3, 2 5 4 ~ 2 5 6 ° At each mounting table 1 ll ~ 1] _3, 1 14 ~ 1] „6, each with a transfer mechanism 2 li ~ 2 13, 2 14 ~ 2 16. The transfer mechanism 2 1 i ~ 2 1 3, 2 1 4 ~ 2 1 6 The pins are composed of pins with a plurality of tips at the front end, and the front ends are respectively inserted into the holes 2 from the bottom of the mounting table 1 1 ^ ~ 1 1 3, 1 14 ~ 1 16 2 5ι ~ 2 53, 2 54 ~ 2 5 6. Among the mounting tables 1 1! ~ 1 1: 3 and 1 1 4 to 1 1 6 which are arranged in the vacuum chambers 9 ^ and 9 2, except for the mounting tables 1 1 3 adjacent to the transfer chamber 2, 1 1!, 1 1 2, 1 1 2, 1 1 5, 1 1 6 are fixed to the bottom walls of the vacuum tanks 9 i and 9 2 respectively, and are placed on these mounting tables 1 1 i, 1 1 2, 1 1 5 and 1 1 6 below the transfer mechanism 2 1 1, 2 1 2, 2 1 5, 2 1 6 series ends are respectively in the vacuum tank 9.1, 9 2 This paper size applies to China National Standard (CNS) A4 specification (210x297 mm) (Please read the precautions on the back before filling out this page) Printed by the cooperative 516336 A7 B7 V. The description of the invention (11) is sealed out and connected to the lifting mechanism (not shown) (Please read the precautions on the back before filling this page) On the other hand, it is adjacent to the transfer room The 2 mounting tables 1 1 3 and 1 1 4 are mounted on the rotary shafts 42! And 422 which are sealedly introduced from the outside of the vacuum tanks 9 1 and 9 2. The rotary shafts 42! And 422 are provided with supports. .Stations 4 5!, 4 5 2. The transfer mechanism 2 1 3, 2 1 4 which is arranged below the placement tables 1 丄 3, 1 1 4 adjacent to the transfer chamber 2 is attached to the support table at its lower end. 4 5 1, 4 5 2 When the rotation axis 4 2.1, 4 2 2 rotates, the supporting tables 4 5i, 4 52 and the mounting tables 1 Is, 1 14 change direction in the horizontal plane together. They are installed during transfer A lifting mechanism (not shown) is installed at the lower end of the wiper table 4 5 1, 4 5 2 of the institution 2 1 3, 2 1 4. The printing and conveying mechanism 2 6! ~ 2 6 3, 2 6 4 to 2 6 6 are respectively provided on the two wall surfaces along the longitudinal direction of the vacuum tanks 9 ^, 9 2 among the wall surfaces of the vacuum tanks 9 ^, 92. Referring to the first figure, the transport mechanism 2 6 : ~ 2 6 3, 2 6 4. ~ 2 6 6 series have shafts 2 7 丄 ~ 2 7 3, 2 7 4 ~ 2 7 6 .; and rollers 28i ~ 28 3, 284 ~ 26. The shafts 27! To 273, 274 to 2 7 6 are sealedly introduced from the outside of the vacuum tank 9 ^, 9 2 to the inside of the vacuum tank 9 1, 9 2 and the rollers 2 8 1 to 2 8 3, 2 8 4 to 2 The 6 series is mounted on the front end of each shaft 2 7 ^ ~ 2 7 3, 2 7 4 ~ 2 7 6. The rollers 28m ~ 2 83, 2 84 ~ 26 are positioned higher than the flat surface of the mounting table 11 1 ~ 1 1 3 '1 1 4 ~ 1 1 6. The conveying mechanism 2 6 i ~ 2 6 3, 2 6 4 ~ 2 6 6 shafts 2 7 1 ~ 2 7 3 ·, 2 7 4 ~ 2 7 6 are sealed out to the outside of the vacuum tank 9 丄, 9 2 Part of the drive mechanism is installed on a drive mechanism (not shown). When this drive is used, the paper size is subject to Chinese National Standards (CNs) a4 (210X297 mm). -14- Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 516336 A7 _ B7 V. Description of the invention (12) When the mechanism is operating, the vacuum grooves 9 i, 9 2 located on the shafts 2 7 1 to 2 7 3, 2 7 4 to 2 7 6 are hermetically held in the vacuum grooves 9 1 And 9 2, expand and contract at right angles to the wall surfaces of the vacuum tanks 9 i and 9 2. The 10th (a) picture shows a state in which the axes 27 1 to 27 3, 274 to 2. 7 6 have been shortened. In this state, the rollers 2 8 1 to 2 8 3, 2 84 to 26 are placed by the mounting table 111 ~ 113, 114 ~] _1 (3 retreats from the top. In addition, the 10th (b) diagram shows the state where the shafts 27i ~ 273, 2 7 4 ~ 2 7 6 have been stretched, and in this state, the roller 2 8 ^ ~ 28 3, 284 ~ 26 are located above the four corners of the surface of each mounting table 1 li ~ 1 13, 1] _4 ~ 1] _6. Refer to Figures 3 and 4 and place each mounting table 1 li ~ 1 13, 1 14 ~ Near the surface of 1 1 6, a pair of electrodes 2 3 23 3, 234 to 236 are embedded in each. When positive and negative voltages are applied to the electrodes 23 i to 23 3, 2 3 4 to 2 3 6, When the object to be processed is placed on the surface of the mounting table 1 1 1 to 1 1 3, 1 1 4 to 1 1 6, an electrostatic attraction force is generated. These mounting tables 1 1! To 1 Is, 1 14 to In 1 16, as shown in FIG. 3, in one of the temperature control chambers 5 χ of the mounting tables 1 1 i to 1 1 3 ′, a heating means made of a carbon heater is contained 2 9 1 to 2 9 3 As shown in FIG. 4, in the other temperature control room 5 2 of each mounting table 1 1 4 to 1 1 6, each Built-in cooling means composed of warm water circulation device 3 9 1 ~ 3 9 3. Refer to Fig. 1, because the mounting tables lli ~ II3, II4 ~ lie are constituted by these heating means 2 9 1 ~ 2 9 3 or Cooling means 3 9 1 This paper size applies Chinese National Standard (CNS) A4 (210X 297 mm) (Please read the precautions on the back before filling this page)

516336 A7 B7 五、發明説明（13 ) 〜3 9 3來加熱或冷卻，故被靜電吸著於載置台1丨i〜 (請先聞讀背面之注意事項再填寫本頁) 1 1 3、1 1 4〜1 1 6表面之處理對象物係由於熱傳導而 被加熱或冷卻。 因此’溫度控制室5 1、5 2中，一'方的溫度控制室 5.1係被使用於處理對象物之加熱處理而另一方的溫度控制 室5 2係被使用於處理對象物之冷卻處理。 在各搬出入室1 0 1、1 〇 2的壁面設有門1 5 1、 1 5 2，將與被使用於加熱處理之溫度控制室5 1連接之搬 出入室1 0 i作爲搬入側，打開門1 5 ^搬入處理對象物， 而連接於被使用在冷卻處理之溫度控制室5 2之搬出入室 1 0 2作爲搬出側，打開門1 5 2搬出處理對象物。 在這些搬出入室1 〇 :、1 〇 2的兩壁面，設有具備輥 子1 8 i、1 8 2及軸1 7丄、1 7 2之傳送機構1 6 !、 1 6 2，這些輥子1 8 :、1 8 2係位於與溫度控制室5 :、 5 2之輥子2 8 i〜2 8 3、2 8 4〜2 8 6相同之高度。 經濟部智慧財產局員工消費合作社印製 在搬送室2之中心部，配置著搬送機器人6，此搬送 機器人6係具有旋轉軸9 1、手臂（手腕）9 2及手部 9 3。旋轉軸9 1係由搬送室2的底壁直立而配置著，手 臂9 21係被安裝於此旋轉軸9 2。 手邰9 3係被安裝於手臂9 2之前端，手部9 3係經 常朝向由搬送機器人6的旋轉軸9 1之中心8延伸之輻射 線方向。 構成當使旋轉軸9 1旋轉時，藉由該旋轉，手臂9 2 係與手部9 3 —同在水平面內旋轉移動，或手臂9 . 2伸縮 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -16- 516336 A7 B7 五、發明説明（14 ) ，而手部9 3在由搬送機器人6的旋轉軸9 1中心8延伸 出之輻射線上移動。 爲了達到使用如此的真空處理裝置1在平面形狀爲矩 形的基板（處理對象物）之表面形成多層薄膜，首先關閉 所，有的真空管1〇7 !〜1〇7 6及門1 5 !、1 5 2。 在各搬出入室l〇i、1〇2、各溫度控制室5!、52 、搬送室2以及各處理室3 1〜3 4，連接著真空排氣系統 3〇，在已關閉各真空管1 0 7 :〜1 0 7 6的狀態下，藉 由真空排氣系統3 0，將各溫度控制室5 i、5 2、搬送室 2以及各處理室3 3 4進行真空排氣。 其次，在已關閉真空管1 0 7 !〜1 0 7 6的狀態下， 打開搬入側的搬出入室1 Ο 1之門1 5 1，將大氣導入此搬 出入室1 0 i內，並且將由平面形狀爲矩形狀之玻璃所構成 之基板4 (處理對象物）搬入到搬出入室1 〇 i內，使基板 4載乘於該搬出入室1 〇 :之輥子1 8 i上。再來，關閉門 1 5 :，藉由真空排氣系統3 0，開始進行搬出入室1 〇丄 內之真空排氣。 第5圖係顯示此狀態之剖面圖。在此搬出入室1 〇 i之 最頂側設置燈加熱器1 9 ，因對於此燈加熱器1 9，輥子 1 8 i基板4係相對配置，所以當邊進行真空排氣邊通電於 燈加熱器時，基板4受到輻射熱所加熱（預備加熱）。 在搬出入室1 0 i變成預定的真空度以下處，打開真空 管7 ^，連接搬出入室1 〇 i與溫度控制室5. \。此時，溫 度控制室5 !之輥子2 8 ^〜2 8 3係如第1 〇 ( b.)圖所 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事 項再填· 裝--I :寫本頁) 經濟部智慧財產局員工消費合作社印製 516336 A7 B7 五、發明説明（15) 示’位於載置台1 1 1〜1 1 3的上方，在此狀態下，當使 搬出入室1 〇 1的輥子1 8 1與溫度控制室5 i之輥子2 8 1 〜2 8 3旋轉時，基板4係朝向溫度控制室5 ^水平地移動 (第6圖），被載乘於位在與搬出.入室1 〇 i鄰接的載置台 1 1 1的上方之輥子2 8 ^上（第7 ( a )圖）。 接著，當使插通於該載置台1 1 1的孔2 5 ^之移載機 構2 1 :上昇，已分歧之前端部較載置台χ 1 1的上方之輥 子2 8 1更高的位置突出時，基板4是由輥子2 8 ^轉移到 該前端部，被提至較輥子2 8 i更高之位置。 再來，當使輥子2 8 :由載置台1 1 ^的上方退避，使 移載機構2 1 !下降時，基板4是被載乘於載置台1 1 i的 表面（第7 ( c )圖）。 此載置台1 1 1之加熱手段2 9 1係在基板4被搬入到 搬出入室1 0 i前通電，藉由此加熱手段2 9 i，載置台 1 1 ^係被升高成第一加熱溫度（在此爲1 0 0 °C )以上。 因此，第7 ( c )圖所示之狀態下，當在載置台1 1 1 內之一對電極2 3 :上各自施加正負電壓，使基板4與載置 台1 1 1的表面緊密貼著時，基板4受到熱傳導所加熱。 在基板4的表面附著著氣體成分，當機板4被加熱時 ，在溫度控制室5 ^的真空槽9 ^內氣體被放出，但由於此 真空槽9 ^係經常藉由真空排氣系統3 0來進行真空排氣， 所以被放出之氣體係被排出至真空槽9 ^外。又，因此真空 槽9 ^與搬送室2係受到真空管7 2所遮斷，所以不會產生 被放出之氣體侵入到搬送室2之事。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) ^衣 II 訂 ΙΦ. 經濟部智慧財產局員工消費合作社印製 516336 Α7 Β7 五、發明説明（16 ) 在基板4已提昇到第一加熱溫度以上後，在停止朝電 極2 3 ^之施加而接除靜電吸著，使移載機構2 1 i上昇， 將基板4提到較輥子2 8 ^更高之位置後，在載置台1 1 : 的上方配置輥子2 8 !，而再次使移載機構2 1 :下降，將 基板4載乘於輥子2 8 ^上。 接著，再次使溫度控制室5 :的輥子旋轉，由鄰接於搬 出入室1 0 1的載置台1 1 1將基板4移動到被鄰接配置於 此載置台1 1 :的搬送室2側之載置台1 1 2的上方。該載 置台1 1 2係藉由加熱手段2 9 2預先加熱至第二加熱溫度 (在此爲2 0 0 °C )以上，以第7 ( a )〜（c )圖所示 之製程，將基板4載置於此載置台1 1 i，將基板4加熱至 第二加熱溫度（在此爲2 0 0 °c )。 接著，當以與上述相同之製程，將基板4由載置台 1 1 2移至輥子2 8 2，再次使溫度控制室5 i之輥子2 8 i 〜2 8 3旋轉時，基板4被移到鄰接於搬送室2之載置台 113上方之輥子2 83上。 鄰接於搬送室2之輥子2 8 3係藉由加熱手段2 9 3預 先加熱至第三加熱溫度（在此爲3 0 0 °C )以上’基板4 係以與上述第7 ( a )〜（c )圖所示之相同製程，被載 置於此載置台1 1 3，加熱至第二加熱溫度。 如此，在被使用於加熱處理之溫度控制室5 i ’在將基 板4送至搬送室2時，因載置台1 li〜1 I3是由搬出入 室1 0 1側至搬送室2側之順序被提局溫度，所以在基板4 由搬出入室1 Οι被送至搬送室2時，由於這些載置台 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ297公釐） (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -------.1!--____I— — — — — — I·__：___!1· 516336 A7 B7 五、發明説明（17 ) 1 1 1〜1 1 3而被階段式地加溫。因此，即使在將基板4 加熱到高溫之情況，由於熱膨脹基板4不會受損。 第1 1 ( a )圖係顯示基板4被加溫至第3加熱溫度 之狀態的平面圖。同圖的圖號A 1係顯示通過被一列配置於 溫度控制室5 1之各載置台1 1 1〜1 1 3的中心之直線， 同圖的圖號B係顯示藉由搬送機器人6之手臂9 2的伸縮 ，手部9 3朝溫度控制室5 ^移動之方向。 鄰接於搬送室2之載置台1 1 3上的基板4係其相對之 兩邊是與載置台1 1 3的相對之兩邊平行，而對於手部9 3 之移動的方向B則傾斜。 第8圖係顯示第1 1 ( a )圖的部分之剖面的槪略圖 。被加熱到第三加熱溫度之基板4係受到載置台1 1 3內之 一對電極2 3 3所靜電吸著，在此狀態下，使旋轉軸4 2 i 旋轉，如第1 1 (: b )圖所示，一同改變載置台1 1 3、基 板4及移載機構2 1 3之方向，將相對於基板4的搬送室2 之兩邊，與搬送機器人6的手部9 3之移動方向b正交。 其次，當使移載機構2 1 3上昇時，在上述基板4的兩 邊與搬送機器人6的手部9 3之移動方向b呈正交之狀態 下，由載置台1 1 3被提起。此時，搬送機器人6之手部 9 3係朝被使用於加熱處理的溫度控制室5 ^而被配置，當 打開真空管7 2連接溫度控制室5 i與搬送室2，伸長搬送 機器人6的手臂9 2時，手部9 3會朝溫度控制室5 χ移動 而被插入到基板4的下方。 再來，當使移載機構2 1 3下降時，與基板4的搬送室 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先聞讀背面之注意事項再填寫本頁)516336 A7 B7 V. Description of the invention (13) ~ 3 9 3 For heating or cooling, it is attracted to the mounting table by static electricity 1 丨 i ~ (Please read the precautions on the back before filling this page) 1 1 3, 1 1 4 ~ 1 1 6 The surface treatment object is heated or cooled due to heat conduction. Therefore, among the 'temperature control rooms 51 and 52', one of the temperature control rooms 5.1 is used for the heat treatment of the processing object, and the other temperature control room 5 2 is used for the cooling treatment of the processing object. Doors 1 5 1 and 1 2 are provided on the wall surfaces of each of the loading and unloading rooms 1 101 and 102. The loading and unloading rooms 1 0 i connected to the temperature control room 51 used for heat treatment are used as loading sides and the doors are opened. 1 5 ^ Carry in the processing object, and connect to the carrying out room 1 2 of the temperature control room 5 2 used in the cooling process as the carrying-out side, and open the door 15 2 to carry out the processing object. On both wall surfaces of the loading and unloading chambers 10: 2 and 102, there are conveying mechanisms 1 6!, 1 6 2 provided with rollers 1 8 i, 1 8 2 and shafts 1 7 and 1 2. These rollers 1 8 :, 1 8 2 are located at the same height as the rollers 2 8 i ~ 2 8 3, 2 8 4 ~ 2 8 6 in the temperature control room 5 :, 5 2. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the center of the transfer room 2, a transfer robot 6 is arranged. The transfer robot 6 has a rotation axis 9 1, an arm (wrist) 9 2 and a hand 9 3. The rotary shaft 9 1 is arranged upright from the bottom wall of the transfer chamber 2, and the arm 9 21 is mounted on the rotary shaft 92. The hand grip 9 3 is installed at the front end of the arm 9 2, and the hand 9 3 is always directed in a direction of a radiation line extending from the center 8 of the rotation axis 9 1 of the transfer robot 6. When the rotation axis 9 1 is rotated, the arm 9 2 rotates and moves in the same horizontal plane with the hand 9 3 by the rotation, or the arm 9. 2 expands and retracts. This paper scale applies the Chinese National Standard (CNS) A4 specification. (210X297 mm) -16- 516336 A7 B7 5. Description of the invention (14), and the hand 9 3 moves on a radiation line extending from the center 8 of the rotation axis 9 1 of the transfer robot 6. In order to use such a vacuum processing apparatus 1 to form a multilayer film on the surface of a rectangular substrate (object to be processed) in a planar shape, first, all vacuum tubes 1 07! 1 107 and doors 1 5! 1 are closed. 5 2. A vacuum exhaust system 30 is connected to each of the loading / unloading chambers 10i, 102, each of the temperature control chambers 5 !, 52, the transfer chamber 2 and each of the processing chambers 31 to 34, and each of the vacuum pipes 10 is closed. 7: In the state of 1 to 76, the temperature control chambers 5 i and 5 2, the transfer chamber 2, and the processing chambers 3 3 4 are evacuated by the vacuum exhaust system 30. Next, with the vacuum tube 10 7! To 10 7 6 closed, open the door 1 1 of the carry-in room 1 0 1 on the carry-in side, and introduce the atmosphere into the carry-out room 1 0 i. The substrate 4 (object to be processed) composed of rectangular glass is carried into the carrying-in / out room 10i, and the substrate 4 is carried on the roller 18i of the carrying-in / out room 10 :. Next, the door 15 is closed: The vacuum exhaust system 30 is used to start the vacuum exhaust in and out of the chamber 1 0 丄. Fig. 5 is a sectional view showing this state. A lamp heater 19 is installed on the top side of the entrance and exit room 10i. The lamp heater 19 and the roller 1 8i substrate 4 are oppositely arranged. Therefore, the lamp heater is energized while being evacuated. At this time, the substrate 4 is heated by the radiant heat (pre-heating). When the loading and unloading room 1 0 i becomes below the predetermined vacuum degree, open the vacuum tube 7 ^, and connect the loading and unloading room 1 0 i with the temperature control room 5. \. At this time, the rollers 2 8 ^ ~ 2 8 3 of the temperature control room 5 are as shown in Figure 10 (b.). The paper dimensions are applicable to the Chinese National Standard (CNS) A4 (210X297 mm) (please read the back first) Note for re-filling and loading --I: write this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 516336 A7 B7 V. Description of the invention (15) shows' located above the mounting table 1 1 1 ~ 1 1 3, In this state, when the rollers 1 8 1 carried in and out of the chamber 1 〇 and the rollers 2 8 1 ～ 2 8 3 of the temperature control room 5 are rotated, the substrate 4 moves horizontally toward the temperature control room 5 ^ (No. 6 (Picture), is carried on a roller 2 8 ^ above the mounting table 1 1 1 adjacent to the unloading / entering room 10i (Figure 7 (a)). Next, when the transfer mechanism 2 1 inserted through the hole 2 5 ^ of the mounting table 1 1 1 is raised, the end portion before the divergence is higher than the roller 2 8 1 above the mounting table χ 1 1 At this time, the substrate 4 is transferred to the front end portion by the roller 2 8 ^ and is lifted to a position higher than the roller 2 8 i. Furthermore, when the roller 2 8 is retracted from above the mounting table 1 1 ^ and the transfer mechanism 2 1! Is lowered, the substrate 4 is carried on the surface of the mounting table 1 1 i (Fig. 7 (c)) ). The heating means 2 9 1 of this mounting table 1 1 1 is energized before the substrate 4 is carried into the loading and unloading chamber 1 0 i. By this heating means 2 9 i, the mounting table 1 1 ^ is raised to the first heating temperature. (Here is 100 ° C). Therefore, in the state shown in FIG. 7 (c), when a positive and negative voltage is applied to each of the pair of electrodes 2 3: on the mounting table 1 1 1, the substrate 4 and the surface of the mounting table 1 1 1 are in close contact. The substrate 4 is heated by heat conduction. The gas component is attached to the surface of the substrate 4. When the plate 4 is heated, the gas is released in the vacuum chamber 9 ^ of the temperature control chamber 5. However, the vacuum chamber 9 ^ is often used by the vacuum exhaust system 3 0 for vacuum evacuation, so the released gas system is discharged out of the vacuum tank 9 ^. In addition, the vacuum tank 9 and the transfer chamber 2 are blocked by the vacuum tube 72, so that the emitted gas does not enter the transfer chamber 2. This paper size applies to Chinese National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling out this page) ^ Order II Φ. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 516336 Α7 Β7 5 Explanation of the invention (16) After the substrate 4 has been raised above the first heating temperature, the substrate 4 is stopped from being applied to the electrode 2 3 ^ and the electrostatic attraction is removed to raise the transfer mechanism 2 1 i. After the roller 2 8 ^ is higher, the roller 2 8! Is arranged above the mounting table 1 1:, and the transfer mechanism 2 1: is lowered again, and the substrate 4 is loaded on the roller 2 8 ^. Next, the rollers of the temperature control room 5 are rotated again, and the substrate 4 is moved from the mounting table 1 1 1 adjacent to the loading / unloading room 1 0 1 to the mounting table adjacent to the transfer room 2 side of the mounting table 1 1:. 1 1 2 above. The mounting table 1 1 2 is heated in advance to a second heating temperature (here, 200 ° C) by the heating means 2 9 2 and is manufactured by the processes shown in Figures 7 (a) to (c). The substrate 4 is placed on the mounting table 1 1 i, and the substrate 4 is heated to a second heating temperature (here, 200 ° C). Next, when the substrate 4 is moved from the mounting table 1 1 2 to the roller 2 8 2 by the same process as described above, and the rollers 2 8 i to 2 8 3 of the temperature control room 5 i are rotated again, the substrate 4 is moved to The roller 2 83 above the mounting table 113 adjacent to the transfer chamber 2 is placed on the roller 2 83. The rollers 2 8 3 adjacent to the transfer chamber 2 are heated in advance to a third heating temperature (here, 3 0 ° C) by the heating means 2 9 3. The substrate 4 is the same as the above-mentioned 7 (a) to ( c) The same process as shown in the figure is placed on this mounting table 1 1 3 and heated to the second heating temperature. In this way, when the temperature control room 5 i ′ used for the heat treatment is used to transfer the substrate 4 to the transfer room 2, the loading stages 1 li to 1 I3 are sequentially moved from the loading / unloading room 1 0 1 side to the transfer room 2 side. The temperature is raised, so when the substrate 4 is transported from the loading and unloading room 100m to the transferring room 2, the paper size of these mounting tables is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) (Please read the precautions on the back first) Refill this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -------. 1! --____ I— — — — — — I · __: ___! 1 · 516336 A7 B7 V. Description of the invention ( 17) 1 1 1 to 1 1 3 and are gradually heated. Therefore, even when the substrate 4 is heated to a high temperature, the substrate 4 is not damaged due to thermal expansion. FIG. 11 (a) is a plan view showing a state where the substrate 4 is heated to a third heating temperature. The drawing number A 1 in the same figure shows a straight line passing through the center of each of the mounting tables 1 1 1 to 1 1 3 arranged in the temperature control room 5 1, and the drawing number B in the same figure shows the arm of the transfer robot 6 9 2 telescopically, the hand 9 3 moves in the direction of the temperature control room 5 ^. The substrate 4 on the mounting table 1 1 3 adjacent to the transfer chamber 2 is such that the opposite sides thereof are parallel to the opposite sides of the mounting table 1 1 3 and the direction B of the movement of the hand 9 3 is inclined. Fig. 8 is a schematic drawing showing a cross section of a part of Fig. 11 (a). The substrate 4 heated to the third heating temperature is electrostatically attracted by a pair of electrodes 2 3 3 in the mounting table 1 1 3. In this state, the rotating shaft 4 2 i is rotated, as in the first 1 (: b As shown in the figure, the directions of the mounting table 1 1 3, the substrate 4 and the transfer mechanism 2 1 3 are changed together, and the two sides of the transfer chamber 2 with respect to the substrate 4 and the moving direction b of the hand 9 3 of the transfer robot 6 are changed. Orthogonal. Next, when the transfer mechanism 2 1 3 is raised, in a state where both sides of the substrate 4 and the moving direction b of the hand 9 3 of the transfer robot 6 are orthogonal to each other, the transfer table 1 1 3 is lifted. At this time, the hand portion 9 3 of the transfer robot 6 is disposed toward the temperature control room 5 ^ used for heat treatment. When the vacuum tube 7 2 is opened, the temperature control room 5 i is connected to the transfer room 2, and the arm of the transfer robot 6 is extended. At 9: 2, the hand 93 is moved toward the temperature control chamber 5x and inserted under the substrate 4. Then, when the transfer mechanism 2 1 3 is lowered, the paper size of the transfer room with the substrate 4 applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling in this page )

---扯衣— I 經濟部智慧財產局員工消費合作社印製--- Clothes — I Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs

Γ β 11111111 —ϋ ϋ I u I -20- 516336 A7 B7 五、發明説明（18 ) 2相對之兩邊是與安裝部9 5平行，即，在與手部9 3朝 溫度控制室5 1移動的方向呈正交之狀態下，基板4被載置 於手部9 3上。 第9 ( a )圖係此手部9 3之擴大平面圖。手部9 3 係具有載置基板4之載置部9 6、及將載置埠9 6連接於 手臂9 2之安裝部9 5，安裝部9 5係與藉由手臂9 2的 伸縮而手部9 3所移動之方向正交。又，載置部9 6的前 端係設有突起9 7。突起9 7與安裝部9 5之表面係較載 置著載置部9 6的基板4之表面更高，如第9 ( b )圖所 示，因被載乘於手部9 3之基板4係被配置於這些突起 9 7與安裝部9 5之間，所以基板4呈安定之狀態下被保 持於手部9 3。 接著，當縮短手臂9 2時，基板4與手部9 3 —同朝 搬送機器人6之旋轉軸9 1的中心8移動，由溫度控制室 5 ^被移到搬送室2內。又，關閉真空管7 2遮斷溫度控制 室5 ^與搬送室2，使搬送機器人6之旋轉軸9 1旋轉，一 同將手臂9 2、手部9 3與基板4朝最先的處理室3 ^配置 0 接著，打開真空管7 3連接最先的處理室3 i與搬送室 2，將基板4搬入到最先的處理室3 :。 各處理室3 2〜3 4係各自由成膜裝置所構成，當在最 先的處理室3 1內預定時間進行成膜處理時，在基板4的表 面形成薄膜。 此時，未處理之基板4是由搬入側之搬出入室1 〇 :依 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐)' " -21 - (請先閱讀背面之注意事項再填寫本頁) -----裝 I-----^訂_^ ί · 經濟部智慧財產局員工消費合作社印製 516336 A7 B7 五、發明説明（19 ) 次地被搬入，在溫度控制室5 ^內被階段式地加熱後，送到 搬送室2。 以最先的處理室3 ^在基板4的表面形成薄膜後，使用 搬送機器人6再次將基板4由搬送室2取出，將其搬入到 下一個處理室3 2，而再次進行成膜作業。然後當依次地將 基板4送到其他之處理室3 3、3 4，相同地進行成膜作業 時’在最後的處理室3 4之成膜作業結束後，在基板4之表 面形成有多層薄膜。 此時，在溫度控制室5 ^被加熱之基板4是被依次地搬 入到搬送室2，在各處理室3 i〜3 3內進行成膜處理。 在基板4之表面形成多層薄膜後，將基板4載置於搬 送機器人6的手部9 3上，由處理室3 4取出至搬送室2， 藉由搬送機器人6的旋轉軸9 1之轉動使手臂9 2在水平 面內旋轉，朝被使用於冷卻處理之溫度控制室5 2 —同配置 手部9 3與基板4。此時，鄰接於被使用於冷卻處理之溫 度控制室5 2的搬送室2之載置台1 1 4係相對於搬送室2 之兩邊是被配置成正交於搬送機器人6之手部9 3的移動 方向，當連接此溫度控制室5 2與搬送室2，延伸搬送機器 人6的手臂9 2時，基板4是與手部9 3 —同配置於載置 台1 1 4上。 在此狀態下，載置台1 1 4的兩邊；與被配置於此載置 台1 1 4上方之基板4的兩邊係各自平行。 其次，使移載機構2 1 4上昇，將基板4轉移到載機構 2 1 4後，縮短搬送機器人6之手臂9 2將手部9 3.返回搬 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 0 11_1 —^ϋ Bui · 訂—------- 經濟部智慧財產局員工消費合作社印製 -22- 516336 A7 B7 五、發明説明（20 ) 送室2，接著關閉真空管7 7，再次地遮斷搬送室2內與溫 度控制室5 2內。 再來，當使移載機構2 1 4下降時，基板4不會由移載 機構2 1 4露出之狀態下，被載乘於其表面（第1 2圖）。 在此，在被使用在冷卻處理之載置台1 1 4〜1 1 6之 冷卻手段3 9 ^〜3 9 3內，各自使不足1 0 0 °C之溫水循 環。因進行成膜處理後之基板4係較冷卻手段3 9 :〜 3 9 3內之溫水的溫度更高（在此爲3 0 0 °C以上），所以 當在第1 2圖所示之狀態下，使用載置台1 1 4內之一對電 極2 3 4而靜電吸著基板4，使基板4與載置台1 1 4在預 定時間緊密貼著時，基板4係首先被冷卻至不足第一冷卻 溫度（在此爲3 0 0 °C )。 第1圖之圖號A 2係顯示通過被使用於冷卻處理之溫度 控制室5 2之載置台1 1 4〜1 1 6的中心之直線，在鄰接 於搬送室2之載置台1 1 4上冷卻基板4後，使旋轉軸 4 2 2旋轉’將載置台1 1 4的兩邊、基板4的相對之兩邊 各自配置成與該直線A 2正交。 此時，被使用於冷卻處理之溫度控制室5 2的輕子 2 84〜2 8 6係由載置台1 1 4的上方退避，當改變基板 4與載置台1 1 4的方向後，解除靜電吸著，使移載機構 2 1 4上昇時，基板4是被提升到較搬送機構2 6 4的輥子 2 8 4更高之位置。 其次，當突出搬送機構2 6 4之軸2 7 4使輥子2 8 4 位於載置台1 1 4的表面四角，使移載機構2 1 4下降時， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 I - I — I 訂— —---------- -23- 516336 A7 B7 五、發明説明（21 ) (請先閲讀背面之注意事項再填寫本頁) 基板4再次地被載乘於輥子2 8 4。當在此狀態下使輥子 2 8 4〜2 8 6旋轉時，朝搬出入室1 〇 2移動基板4，將 其送到被鄰接配置於搬出入室1 〇 2側之載置台1 1 5上方 之輥子2 8 5上。 .其次’以與上述相同之製程，將基板4由輥子2 8 5轉 移到位於其下方之載置台1 1 5。 第1 3圖係顯示，在此載置台1 1 5上在定時間被電吸 著之基板4係被冷卻到不足第二冷卻溫度（在此爲 2〇〇°C ) 〇 其次，當與上述相同之製程，將基板4再次地轉移到 載置台1 1 5之輥子2 8 5，使輥子2 8 4〜2 8 6旋轉時， 基板4被送到與搬出入室1 0 2鄰接之載置台1 1 6上方， 當在此載置台1 1 6上預定時間被緊密配置時，被冷卻到不 足第三冷卻溫度（在此爲1 0 0 °C )。 如此，在被使用於冷卻處理之溫度控制室5 2，即使循 環各冷卻手段3 9 1〜3 9 3內之溫水的溫度係被作爲相同 之情況，被加熱至高溫的基板4係在各載置台1 1 4〜 經濟部智慧財產局員工消費合作社印製 1 1 6以一點預定時間一點預定時間緊密貼著之事，被階段 式地冷卻。 且.，因在冷卻手段3 9 :〜3 9 3內流動著溫水而並非 冷水，所以由搬送室2被送來之基板4係由於熱收縮不會 產生裂痕。 將基板4冷卻至不足第三冷卻溫度後，再次將基板4 轉移至載置台1 1 6上方之輥子2 8 6。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） - 24- 經濟部智慧財產局員工消費合作社印製 516336 A7 ________ B7_ 五、發明説明（22 ) 此日寺，搬出側之搬出入室1 0 2顯1 5 2被關閉，藉 由真空排氣系統3 0降至預定的真空度以下，打開真空管 7 8 ’連接搬出入室1 〇 2與溫度控制室5 2後，若使輥子 2 8 6旋轉將基板4送到搬出入室.1 0 2的話，基板4會被 移.到搬出入室1 0 2的輥子1 8 2上。 其；人’再彡人關閉真空官7 8 ’右在遮斷温度控制室5 2 與搬出入室1 0 2之狀態下打開門1 5 2的話，能將成膜後 之基板4取出到真空處理裝置.1外。 此時，被送到各處理室3 i〜3 4而在最後的處理室 3 4.形成多層薄膜之基板4係被返回搬送室2後，被送至使 用於冷卻處理之溫度控制室5 2，以各載置台1 1 4〜 1 1 6階段式地冷卻。 如此，若使用本發明之真空處理裝置1的話、能如第 2圖所示，在各溫度控制室5 i、5 2邊調整階段式的溫度 ，邊在各處理室3 i〜3 4進行成膜處理，且能連續處理複 數個基板4 1〜4 1 2。 且’因各溫度控制室5 1、5 2係受到真空排热系統經 常被真空排氣，所以即使大氣由搬出入室1 0 1、1 0 2侵 入到溫度控制室5 ^、5 2，藉由真空排氣系統3 0被真空 排氣，.不會產生大氣侵入到溫度控制室5 1、5 2及連接於 溫度控制室5 ^、5 2之搬送室2。 以上，說明過關於在各溫度控制室5 ^、5 2設置複數 個載置台1 1 ^〜1 1 3、1 1 4〜1 1 6之情況，但本發明 係不被限定於此者，可配合基板的材質及目的加熱溫度， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)Γ β 11111111 —ϋ ϋ I u I -20- 516336 A7 B7 V. Description of the invention (18) 2 Opposite sides are parallel to the mounting portion 95, that is, moving toward the temperature control room 51 with the hand 93 In a state where the directions are orthogonal, the substrate 4 is placed on the hand 93. Figure 9 (a) is an enlarged plan view of this hand 93. The hand portion 9 3 is a mounting portion 9 6 having a mounting substrate 4, and a mounting portion 9 5 connecting the mounting port 9 6 to the arm 9 2. The mounting portion 9 5 is connected to the arm by extension of the arm 9 2. The direction in which the portion 93 is moved is orthogonal. The front end of the mounting portion 96 is provided with a projection 97. The surface of the protrusion 9 7 and the mounting portion 95 is higher than the surface of the substrate 4 on which the mounting portion 96 is placed. As shown in FIG. 9 (b), the substrate 4 is carried on the hand portion 9 3. Since the substrate 4 is disposed between the protrusions 97 and the mounting portion 95, the substrate 4 is held by the hand portion 9 in a stable state. Next, when the arm 92 is shortened, the substrate 4 and the hand 9 3 are moved in the same direction as the center 8 of the rotation axis 9 1 of the transfer robot 6, and the temperature control room 5 ^ is moved into the transfer room 2. In addition, closing the vacuum tube 7 2 shuts off the temperature control chamber 5 ^ and the transfer chamber 2 and rotates the rotation axis 9 1 of the transfer robot 6 to rotate the arm 9 2, the hand 9 3 and the substrate 4 toward the first processing chamber 3 ^ Arrangement 0 Next, the vacuum tube 7 3 is opened to connect the first processing chamber 3 i and the transfer chamber 2, and the substrate 4 is transferred to the first processing chamber 3:. Each of the processing chambers 3 2 to 3 4 is composed of a film forming apparatus, and when a film forming process is performed in a predetermined time in the first processing chamber 31, a thin film is formed on the surface of the substrate 4. At this time, the unprocessed substrate 4 is moved in and out of the room 1 〇: The Chinese National Standard (CNS) 8 4 specification (210X297 mm) is applied according to the paper size '" -21-(Please read the note on the back first Please fill in this page again for matters) ----- Install I ----- ^ Order_ ^ ί · Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 516336 A7 B7 V. Description of Invention (19) was moved in again, in The temperature control chamber 5 is heated stepwise and then sent to the transfer chamber 2. After the film is formed on the surface of the substrate 4 in the first processing chamber 3, the substrate 4 is taken out of the transfer chamber 2 again using the transfer robot 6, and transferred to the next processing chamber 32, and the film formation operation is performed again. Then, when the substrate 4 is sequentially sent to the other processing chambers 3 3, 3 4 and the film forming operation is performed in the same manner, after the film forming operation of the last processing chamber 34 is completed, a multilayer film is formed on the surface of the substrate 4 . At this time, the heated substrates 4 in the temperature control chamber 5 are sequentially carried into the transfer chamber 2 and the film formation processing is performed in each of the processing chambers 3 to 3 3. After the multilayer film is formed on the surface of the substrate 4, the substrate 4 is placed on the hand 9 3 of the transfer robot 6 and taken out from the processing chamber 34 to the transfer chamber 2. The rotation axis 9 1 of the transfer robot 6 makes the The arm 9 2 rotates in a horizontal plane and faces the temperature control room 5 2 used for cooling processing. The hand 9 3 and the substrate 4 are arranged in the same manner. At this time, the mounting table 1 1 4 adjacent to the transfer room 2 used in the temperature control room 5 2 used for the cooling process is arranged orthogonal to the hands 9 3 of the transfer robot 6 with respect to both sides of the transfer room 2. In the moving direction, when the temperature control room 5 2 and the transfer room 2 are connected, and the arm 9 2 of the transfer robot 6 is extended, the substrate 4 is disposed on the mounting table 1 1 4 together with the hand 9 3. In this state, both sides of the mounting table 1 1 4 are parallel to both sides of the substrate 4 disposed above the mounting table 1 1 4. Secondly, raise the transfer mechanism 2 1 4 and transfer the substrate 4 to the transfer mechanism 2 1 4, then shorten the arm 9 of the transfer robot 9 2 and move the hand 9 3. Return to the paper. The Chinese standard (CNS) A4 applies Specifications (210X297 mm) (Please read the precautions on the back before filling out this page) 0 11_1 — ^ ϋ Bui · Order --------- Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-22- 516336 A7 B7 V. Description of the invention (20) The conveying chamber 2 is then closed, and the vacuum tube 7 7 is closed again to block the inside of the conveying chamber 2 and the temperature control chamber 5 2. Furthermore, when the transfer mechanism 2 1 4 is lowered, the substrate 4 is carried on the surface without being exposed by the transfer mechanism 2 1 4 (Fig. 12). Here, in the cooling means 3 9 ^ to 3 9 3 used in the cooling stage 1 1 4 to 1 16, warm water of less than 100 ° C is circulated. Since the substrate 4 after the film forming process is higher than the temperature of the warm water in the cooling means 3 9: ~ 3 9 3 (here, it is 300 ° C or more), so when it is shown in Figure 12 In the state, when one of the counter electrodes 2 3 4 in the mounting table 1 1 4 is used to electrostatically attract the substrate 4 and the substrate 4 and the mounting table 1 1 4 are closely attached for a predetermined time, the substrate 4 is first cooled to less than the first A cooling temperature (300 ° C in this case). Drawing number A 2 in FIG. 1 shows a straight line passing through the center of the mounting table 1 1 4 to 1 6 used in the temperature control room 5 2 used for cooling processing, and on the mounting table 1 1 4 adjacent to the transfer room 2 After the substrate 4 is cooled, the rotation axis 4 2 2 is rotated to arrange both sides of the mounting table 1 1 4 and opposite sides of the substrate 4 so as to be orthogonal to the straight line A 2. At this time, the lepton 2 84 ~ 2 8 6 used in the temperature control room 5 2 for cooling treatment is retracted from the top of the mounting table 1 1 4. When the directions of the substrate 4 and the mounting table 1 1 4 are changed, the static electricity is removed. When the transfer mechanism 2 1 4 is sucked up, the substrate 4 is lifted to a position higher than the rollers 2 8 4 of the transfer mechanism 2 6 4. Secondly, when the shaft 2 7 4 of the conveying mechanism 2 6 4 is protruded so that the rollers 2 8 4 are located at the four corners of the surface of the mounting table 1 1 4 and the transfer mechanism 2 1 4 is lowered, the paper size applies the Chinese National Standard (CNS) A4 Specifications (210X297 mm) (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs I-I — I Order — — ---------- -23- 516336 A7 B7 V. Description of the invention (21) (Please read the precautions on the back before filling this page) The substrate 4 is carried on the roller 2 8 4 again. When the rollers 2 8 4 to 2 8 6 are rotated in this state, the substrate 4 is moved toward the loading / unloading room 1 02 and sent to the rollers adjacent to the mounting table 1 1 5 which is arranged adjacent to the loading / unloading room 1 0 2 side. 2 8 5 on. Secondly, in the same process as described above, the substrate 4 is transferred from the roller 2 8 5 to the mounting table 1 15 located below it. FIG. 13 shows that the substrate 4 which is electrically attracted on the mounting table 1 15 at a fixed time is cooled to a temperature lower than the second cooling temperature (here 200 ° C.). Secondly, when compared with the above, In the same process, the substrate 4 is transferred to the roller 2 8 5 of the mounting table 1 1 5 and when the rollers 2 8 4 to 2 8 6 are rotated, the substrate 4 is sent to the mounting table 1 adjacent to the loading and unloading room 102. Above 16, when it is closely arranged on the mounting table 1 16 for a predetermined time, it is cooled to less than the third cooling temperature (here, 100 ° C.). In this way, in the temperature control room 5 2 used for the cooling process, even if the temperature of the warm water in the cooling means 3 9 1 to 3 9 3 is circulated, the substrate 4 heated to a high temperature is placed in each The mounting table 1 1 4 ~ Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 1 6 are closely adhered to each other at a predetermined time and a predetermined time, and are cooled in stages. In addition, since warm water is not flowing in the cooling means 3 9: to 3 9 3, the substrate 4 sent from the transfer chamber 2 is not cracked due to thermal contraction. After the substrate 4 is cooled to a temperature lower than the third cooling temperature, the substrate 4 is transferred to the roller 2 8 6 above the mounting table 1 1 6 again. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)-24- printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 516336 A7 ________ B7_ V. Description of the invention (22) On this day temple, move out of the room 1 0 2 display 1 5 2 is closed, and the vacuum exhaust system 30 is lowered to a predetermined degree of vacuum, and the vacuum tube 7 8 ′ is opened to connect the loading and unloading room 1 〇 2 and the temperature control room 5 2, if the roller 2 8 6 Rotate the substrate 4 to the loading and unloading room. When the substrate 102 is moved, the substrate 4 will be moved to the roller 1 8 2 that is moved out of the loading and unloading room 102. If the person 'returns the vacuum officer 7 8' to the right while opening the door 1 5 2 with the temperature control room 5 2 and the loading and unloading room 102 being opened, the film-formed substrate 4 can be taken out to a vacuum process. Device .1 outside. At this time, they are sent to each of the processing chambers 3 to 3 and 4 in the final processing chamber 3. The substrate 4 forming the multilayer film 4 is returned to the transfer chamber 2 and then sent to the temperature control chamber 5 2 for cooling processing. Each stage is cooled in stages from 1 4 to 1 1 6. In this way, if the vacuum processing apparatus 1 of the present invention is used, as shown in FIG. 2, the temperature can be adjusted in each of the temperature control chambers 5 i and 5 2 in each of the processing chambers 3 i to 3 4. Film processing, and multiple substrates 4 1 to 4 1 2 can be processed continuously. And 'Because each temperature control room 5 1, 5 2 is subjected to a vacuum exhaust system, it is often evacuated, so even if the atmosphere is moved into and out of the room 1 0 1, 1 2 into the temperature control room 5 ^, 5 2 The vacuum exhaust system 30 is evacuated by the vacuum, and does not generate atmospheric intrusion into the temperature control chambers 5 and 5 and the transfer chamber 2 connected to the temperature control chambers 5 and 52. As mentioned above, the case where a plurality of mounting tables 1 1 ^ ~ 1 1 3, 1 1 4 ~ 1 1 6 are provided in each of the temperature control rooms 5 ^, 5 2 has been described, but the present invention is not limited to this, and may be In accordance with the material of the substrate and the heating temperature, the paper size is applicable to China National Standard (CNS) A4 (210X297 mm) (Please read the precautions on the back before filling this page)

-25 516336 A7 五、發明説明（23 增減各溫度控制室的載置台之數量。 第1 4圖係顯示使用本發明之其他的溫度控制室5 $丄 5 5 2之真空處理裝置5 1 ，此真空處理裝置5 χ係具有 2台之溫度控制室5 5 i、5 5 2 ;及與第丄圖所示之真空 處.理系統1相同的搬送室2、各處理室3 i〜3 * '搬出入 室1〇1 、 1〇2 。 各溫度控制室5 5 i、5 5 2係不具有被直接固定在真 空槽9 !、9 2的底壁之載置台，僅具有被配置於旋轉軸上 之載置台6 li、6 12。 因此’在由溫度控制室5 5 1、5 5 2將基板搬出入至 搬送室2時，能夠藉由旋轉軸改變基板與載置台6 1 i、 6 1 2之方向。 再者，在上述的真空處理裝置1 ，搬送室2 '的平面形 狀呈六角形，但搬送室2之形狀係不被限於此，亦可呈例 如七角形或八角形等。 又’加熱手段也不被限定於碳加熱器，例如也能夠使 用銘加熱器。 例如能夠使用將發熱源之加熱線配置於加熱板內者、 與以2片之加熱板夾住加熱線者來作爲碳加熱器，但其構 造係不被限於此者。 又，若在作爲加熱手段2 9 i〜2 9 3來使用之碳加熱 器設置溫度感知器的話，能夠調整各載置台1 1 i〜1 1 3 之溫度，更正確地進行基板之溫度控制（加熱、冷卻）。 設置溫度感知器之位置係不被特別限定，例如與加熱 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -- 11 - (請先閱讀背面之注意事項再填寫本X) 訂 經濟部智慧財產局員工消費合作社印製 -26 516336 A7 B7 五、發明说明（24 ) 線相同，能夠配置於加熱板內，或在以2片加熱板夾住之 狀態下來配置。 (請先閲讀背面之注意事項再填寫本頁) 又，也能在使用於冷卻處理之載置台1 1 4〜1 1 6設 置溫度感知器。此情況’溫度感知器的安裝位置也不被特 別限定，例如能夠安裝於使冷卻手段3 9 i〜3 9 3的溫水 循環之溫水循環器上。 又，在加熱基板時，若預先追求將基板4的溫度在各 載置台1 1 i〜1 1 3上達到預定溫度（第--第三的加熱 溫度）所需之時間的話，即使在使用於處理之基板4上不 安裝感知器等，也能夠正確地進行基板4之溫度控制。 有例如準備已安裝溫度感知器溫度監視器基板，在使 此溫度監視器基板已加熱至預定的溫度之載置台上的狀態 下，藉由該溫度感知器測定溫度監視器之溫度的經過變化 ，而作成加熱時間與監視器之溫度的關係之圖表，根據該 圖表追求之方法作爲追求載置時間之方法。 經濟部智慧財產局員工消費合作社印製 且，在冷卻基板時，以上述相同之製程，預先作成基 板的載置時間與溫度變化之關係的圖表的話，能夠追求基 板被冷卻至預定溫度所需之載置時間。 以上，說明過關於將使用於加熱之各載置台2 9 :〜 2 9 3的溫度各自作成1 0 0 °C以上、2 0 〇 t以上、 3〇0 °C以上，但本發明係不限於此，載置台2 9 ^〜 2 9 3的溫度及在載置台2 9 ^〜2 9 3所加熱之基板4的 溫度（.第--第三的加熱溫度）係可依目的改變。 使冷卻手段3 9 1〜3 9 3內循環之溫水的溫度係不被 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -27- 516336 A7 B7 _ 五、發明説明（25 ) 特別限定者，但在基板4的處理溫度高之情況下，將由搬 送室2所搬入之基板4最初所載置之載置台1 1 4的冷卻手 段3 9 ^的溫度作成約1 0 0 t的話，因基板4的溫度與載 置台1 1 4的溫度之溫差小，所以在基板4不易產生裂痕。 又如第1圖所示，在使用於冷卻處理之溫度控制室設置複 數個載置台之情況下，能針對每個各載置台上之冷卻手段 改變循環的溫水之溫度。不論任何情況，循環於冷卻手段 3 9 i〜3 9 3內之溫水的溫度係在1 0 0 t以下之範圍爲 佳。 以上，已說明過關於在冷卻手段3 9、〜3 9 3內使溫 水循環之情況，但本發明係不限定於此，除了溫水以外， 可使用各種之熱媒體。 【發明之效果】 能夠將玻璃基板加熱處理至高溫而使用於成膜處理‘。 並且可縮小真空處理裝置之設置空間。 【圖面之簡單說明】 第1圖係說明使用本發.明之一個例子的溫度控制室之 真空處理裝置的平面圖。 第2圖係用來說明以使用本發明之一個例子的溫度控 制室之真空處理裝置處理連續基板的狀態之平面圖。 第3圖係本發明的溫度控制室中，使用於加熱處理之 溫度控制室的剖面圖。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公慶) ~ -28 - (請先閱讀背面之注意事項再填寫本頁) ί裝_ 訂 經濟部智慧財產局員工消費合作社印製 516336 A7 B7 五、發明説明（26 ) 第4圖係本發明的溫度控制室中，使用於冷卻處理之 溫度控制室的剖面圖。 (請先閱讀背面之注意事項再填寫本頁) 第5圖係用來說明已將基板搬入到搬入側的搬出入室 之狀態的剖面圖。 第6圖係用來說明將基板由搬出入室送到溫度控制室 的狀態之剖面圖。 第7 ( a )〜（c )圖係用來說明使基板載乘於載置 台的製程之剖面圖。 第8圖係用來說明被使用於加熱處理之載置台中，安 裝於旋轉軸的載置台之剖面圖。 第9 ( a ) 、（ b )圖係用來說明將基板載置於搬送 機器人的手部之製程的圖。 第1 〇 ( a ) 、（ b )圖係用來說明溫度控制室的移 載機構之剖面圖。 桌1 1 ( a ) 、（ b )圖係用來說明被安裝於旋轉軸 之載置台的轉動之剖面圖。 經濟部智慧財產局員工消費合作杜印製 第1 2圖係用來說明被使用於冷卻處理的載置台中， 被安裝於旋轉軸之載置台的剖面圖。 第1 3圖係用來說明被使用於冷卻處理的載置台中， 被安裝於真空槽底壁之載置台的圖。 第1 4圖係用來說明本發明之其他例的溫度控制室與 真空處理裝置之圖。 第1 5圖係說明以往的真空處理裝置之平面圖。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -29- 516336 A7 ________B7 五、發明説明（27 ) 【圖號說明】 1 ......真空處理裝置 2 ......搬送室 4 1〜4 1 2 ......處理對象物（基板） 5 1 ·••…溫度控制室（使用於加熱處理之溫度控制室） 5 2 ......溫度控制室（使用於冷卻處理之溫度控制室） 9 1、9 2 ......真空槽 1〇1、1 Ό 2 ......搬出入室 1 〜1 I:3、1 I4〜1 ι6 ......載置台 2 1 1〜2 13、2 14〜2 16……移載機構 2 6 1〜2 6 3、2 6 4〜2 6 6……搬送機構 2 9 i〜2 9 3 ......加熱手段（溫度控制手段） 3 9 1〜3 9 3 ......冷卻手段（溫度控制手段）_ β ......搬送機器人 8 ......搬送機器人之旋轉軸中心 9 1 ......搬送機器人之旋轉軸 9 2 ......手臂（手腕） (請先閱讀背面之注意事 •項再填· :寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)Α4規格（210x297公釐）-25 516336 A7 V. Description of the invention (23 Increase or decrease the number of mounting tables in each temperature control room. Figure 14 shows the use of the other temperature control room 5 $ 丄 5 5 2 of the vacuum processing device 5 1, This vacuum processing apparatus 5 χ has two temperature control chambers 5 5 i, 5 5 2; and the vacuum processing shown in the second figure. The same transfer chamber 2 and processing chambers 3 i ~ 3 * 'In and out of the chambers 101 and 102. Each of the temperature control chambers 5 5 i and 5 5 2 does not have a mounting table that is directly fixed to the bottom wall of the vacuum tank 9!, 9 2, and only has a rotation axis. The upper stage 6 li, 6 12. Therefore, when the substrate is carried in and out of the temperature control chamber 5 5 1, 5 5 2 into the transfer chamber 2, the substrate and the stage 6 1 i, 6 1 can be changed by the rotation axis. 2. In the above-mentioned vacuum processing apparatus 1, the planar shape of the transfer chamber 2 'is hexagonal, but the shape of the transfer chamber 2 is not limited to this, and may be, for example, a hexagon or an octagon. 'The heating means is not limited to a carbon heater, for example, a Ming heater can also be used. For example, a heat source can be used. The wire is placed in the heating plate, and the heating wire is sandwiched by two heating plates as a carbon heater, but the structure is not limited to this. If it is used as a heating means 2 9 i ~ 2 9 3 If a carbon heater is used to install a temperature sensor, the temperature of each mounting table 1 1 i to 1 1 3 can be adjusted, and the temperature of the substrate (heating, cooling) can be controlled more accurately. The position where the temperature sensor is installed is not affected by Special restrictions, such as the application of Chinese National Standard (CNS) A4 specifications (210X297mm) with the paper size of this paper.-11-(Please read the notes on the back before filling in this X) System-26 516336 A7 B7 V. Description of the invention (24) The wires are the same and can be placed in the heating plate or placed in the state sandwiched by two heating plates. (Please read the precautions on the back before filling this page) In addition, a temperature sensor can also be installed on the mounting tables 1 1 to 1 1 for cooling treatment. In this case, the mounting position of the temperature sensor is not particularly limited, and it can be mounted on the cooling means 3 9 i to 3 9 3 On the hot water circulator for warm water circulation. Also, when heating the substrate, if it is sought in advance that the temperature of the substrate 4 should reach a predetermined temperature (first to third heating temperature) on each of the mounting tables 1 1 to 1 1 3 In this case, the temperature control of the substrate 4 can be accurately performed even if a sensor or the like is not mounted on the substrate 4 used for processing. For example, a temperature sensor substrate having a temperature sensor installed is prepared, and the temperature monitor substrate is used. In the state of being heated to a predetermined temperature on the mounting table, the temperature sensor is used to measure the change of the temperature of the temperature monitor to create a graph of the relationship between the heating time and the temperature of the monitor. The method pursued according to the graph As a method to pursue placement time. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and when the substrate is cooled, using the same process described above, to prepare a graph of the relationship between the substrate placement time and temperature change, it is possible to pursue what is needed to cool the substrate to a predetermined temperature. Loading time. In the foregoing, it has been described that the temperatures of each of the mounting tables 2 9: to 2 3 3 used for heating are respectively 100 ° C or higher, 200 ° t or higher, and 300 ° C or higher, but the present invention is not limited to this. Therefore, the temperature of the mounting table 2 9 ^ ~ 2 9 3 and the temperature of the substrate 4 heated at the mounting table 2 9 ^ ~ 2 9 3 (the first-third heating temperature) can be changed according to the purpose. The temperature of the warm water circulating in the cooling means 3 9 1 ~ 3 9 3 is not subject to the Chinese standard (CNS) A4 specification (210X297 mm) of this paper size. -27- 516336 A7 B7 _ V. Description of the invention (25 ) It is particularly limited, but when the processing temperature of the substrate 4 is high, the temperature of the cooling means 3 9 4 of the mounting table 1 1 4 initially placed on the substrate 4 carried in the transfer chamber 2 is made about 1 0 0 t In this case, since the temperature difference between the temperature of the substrate 4 and the temperature of the mounting table 114 is small, cracks are unlikely to occur in the substrate 4. As shown in FIG. 1, in the case where a plurality of mounting tables are provided in a temperature control room used for cooling treatment, the temperature of the circulating warm water can be changed for each cooling method on each mounting table. In any case, it is preferable that the temperature of the warm water circulating in the cooling means 3 9 i to 3 9 3 is in the range of 100 t or less. As mentioned above, the case where hot water is circulated in the cooling means 39 and 3 to 3 3 has been described, but the present invention is not limited to this, and various heat media can be used other than warm water. [Effects of the Invention] The glass substrate can be heat-treated to a high temperature and used for film formation processing. In addition, the installation space of the vacuum processing device can be reduced. [Brief Description of Drawings] Fig. 1 is a plan view illustrating a vacuum processing apparatus using a temperature control room as an example of the present invention. Fig. 2 is a plan view for explaining a state in which a continuous substrate is processed by a vacuum processing apparatus using a temperature control chamber of an example of the present invention. Fig. 3 is a sectional view of a temperature control chamber used for heat treatment in the temperature control chamber of the present invention. This paper size applies to China National Standard (CNS) A4 specifications (210X297 public holidays) ~ -28-(Please read the precautions on the back before filling out this page) ί _ Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives 516336 A7 B7 V. Description of the invention (26) FIG. 4 is a sectional view of the temperature control room used for cooling treatment in the temperature control room of the present invention. (Please read the precautions on the back before filling out this page.) Figure 5 is a cross-sectional view illustrating the state where the board has been moved to the loading / unloading room on the loading side. Fig. 6 is a cross-sectional view for explaining a state in which the substrate is transferred from the carry-in / out room to the temperature control room. Figures 7 (a) to (c) are cross-sectional views for explaining a process of mounting a substrate on a mounting table. Fig. 8 is a cross-sectional view illustrating a mounting table mounted on a rotating shaft in a mounting table used for heat treatment. Figures 9 (a) and (b) are diagrams for explaining a process of placing a substrate on a hand of a transfer robot. Figures 10 (a) and (b) are cross-sectional views illustrating the transfer mechanism of the temperature control room. Tables 11 (a) and (b) are sectional views for explaining the rotation of a mounting table mounted on a rotating shaft. Printed by Du Intellectual Property Department of the Intellectual Property Bureau of the Ministry of Economic Affairs. Figure 12 is a cross-sectional view illustrating a mounting table used for cooling and a mounting table mounted on a rotating shaft. FIG. 13 is a diagram for explaining a mounting table used for a cooling process and a mounting table mounted on the bottom wall of a vacuum tank. Fig. 14 is a diagram for explaining a temperature control chamber and a vacuum processing apparatus according to another example of the present invention. Fig. 15 is a plan view illustrating a conventional vacuum processing apparatus. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -29- 516336 A7 ________B7 V. Description of the invention (27) [Illustration of drawing number] 1 ... Vacuum processing device 2 .... .. transfer room 4 1 ~ 4 1 2 ...... object to be processed (substrate) 5 1 · ••… temperature control room (temperature control room used for heat treatment) 5 2 ...... temperature Control room (temperature control room used for cooling treatment) 9 1, 9, 2 ...... Vacuum tank 10, 1 Ό 2 ...... Move out and enter the room 1 ~ 1 I: 3, 1 I 4 ~ 1 ι6 ... mounting table 2 1 1 ~ 2 13, 2, 14 ~ 2 16 ... transfer mechanism 2 6 1 ~ 2 6 3, 2 6 4 ~ 2 6 6 ... transfer mechanism 2 9 i ~ 2 9 3 ...... heating means (temperature control means) 3 9 1 ~ 3 9 3 ...... cooling means (temperature control means) _ β ...... transfer robot 8 ... ... Rotary axis center 9 1 of the transfer robot ...... Rotary axis 9 2 of the transfer robot ...... Arm (wrist) Page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) Α4 (21 0x297 mm)

Claims (1)

516336 A8 B8 C8 D8 夂、申請專利範圍 1 · 一種溫度控制室，係具有：真空槽；及 配置於前述真空槽內之搬送機構；及 配置於前述搬送機構的下方位置之載置台；及 設於前述載置台內之溫度控制手段；以及 插通於前述載置台內之移載機構， 將處理對象物載置於前述真空槽內之載置台上，II自 前述溫度控制手段進行溫度控制之溫度控制室，其特彳敦爲 前述載置台係構成在水平面內改變方向。 · 2 ♦—種溫度控制室，係具有：真空槽；及 配置於前述真空槽內之複數個搬送機構；及 在前述搬送機構的下方位置，排列成一列之複數丨固_ 置台；及 在前述載置台內，各自設置的複數個溫度控制手段；. 以及 各自插通於前述載置台內之複數個移載機構， 將已搬入到前述真空槽內之處理對象物，由前述搬送 機構轉移到前述移載機構後，載置於前述載置台上， 藉由前述溫度控制手段，將前述處理對象物進行溫度 控制後， 再藉由前述移載機構，由載置台轉移到前述搬送機構 再藉由前述搬送機構，依次地送至前述被排列成一列 之各載置台的溫度控制室，其特徵爲： (請先閱讀背面之注意事項再填寫本頁) met ·ϋϋ ·11 H··· · 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -31 - 516336 A8 B8 C8 D8 、申請專利乾圍 在前述被排列成一列之各載置台中，至少位於一端之 載置台係構成在水平面內改變方向。 (請先閲讀背面之注意事項再填寫本頁) 3 ·如申請專利範圍第1項之溫度控制室，其中，前 述溫度控制手段係藉由通電而發熱之加熱手段，被使用於 前述前述處理對象物之加熱。 4 ·如申請專利範圍第2項之溫度控制室，其中，前 述溫度控制手段係藉由通電而發熱之加熱手段，被使用於 前述前述處理對象物之加熱。 5 .如申請專利範圍第1項之溫度控制室，其中，前 述溫度控制手段係藉由冷卻水的循環而冷卻之冷卻手段， 被使用於前述前述處理對象物之冷卻。 6 .如申請專利範圍第2項之溫度控制室，其中，前 述溫度控制手段係藉由冷卻水的循環而冷卻之冷卻手段， 被使用於前述前述處理對象物之冷卻。 ^ 7 . —種真空處理裝置，係具有溫度控制室、搬送室 及搬出入室， 經濟部智慧財產局員工消費合作社印製 處理對象物是通過前述溫度控制室，而搬送於前述搬 出入室與前述搬送室之間的真空處理裝置，其特徵爲： 前述溫度控制室係具有：各自連接於前述搬送室與前 述搬出入室之真空槽； 及配置於前述真空槽內之搬送機構；及配置於前述搬 送機構的下方位置之載置台；及設於前述載置台內之溫度 控制手段；以及插通於前述載置台內之移載機構， 前述載置台係構成在水平面內改變方向，且將處理對 -32- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 516336 經濟部智慧財產局員工消費合作社印製 A8 B8 C8 D8 六、申請專利範圍 象物載置於前述真空槽內之載置台上，藉由前述溫度控制 手段進行溫度控制。 8 . —種真空處理裝置，係具有溫度控制室、搬送室 及搬出入室， 處理對象物是通過前述溫度控制室，而搬送於前述搬 出入室與前述搬送室之間的真空處理裝置，其特徵爲： 前述溫度控制室，係具有：各自連接於前述搬送室與 前述搬出入室之真空槽；及配置於前述真空槽內之複數個 搬送機構；及在前述搬送機構的下方位置，排列成一列之 複數個載置台；及在前述載置台內，各自設置的複數個溫 度控制手段；以及各自插通於前述載置台內之複數個移載 機構， 在前述被排列成一列之各載置台中，至少位於一端之 載置台係構成在水平面內改變方向， · 將已搬入到前述真空槽內之處理對象物，由前述搬送 機構轉移到前述移載機構後，載置於前述載置台上， 藉由前述溫度控制手段，將前述處理對象物進行溫度 控制後， 再藉由前述移載機構，由載置台轉移到前述搬送機構 5 再藉由前述搬送機構，依次地送至前述被排列$ _歹^ 之各載置台。 9 .如申請專利範圍第8項之真空處理裝置，其中， 在前述搬送室內，設有具有旋轉軸及被安裝於前述旋$專車由 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） - 33- ----------------------訂----- «0 (請先閱讀背面之注意事項再填寫本頁) 516336 A8 B8 C8 D8 六、申請專利範圍 經濟部智慧財產局員工消費合作社印製 上之手臂的搬送機器人，前述手臂係根據前述旋轉軸的旋 轉，在水平面內旋轉或伸縮，而前述處理對象物是構成根 據削述手臂的伸縮，在從前述旋轉軸的中心朝在前述水平 面內改變方向之載置台延伸的直線上被搬送，前述旋轉中 心是位於由前述溫度控制室的前述載置台的排列方向遠離 之位置。 1 0 _如申請專利範圍第8項之真空處理裝置，其中 ’至少具有兩個前述溫度控制室，在前述溫度控制室中， 一方的溫度控制室之前述溫度控制手段係藉由通電而發熱 之加熱手段’而另一方之前述溫度控制室的前述溫度控制 手段係藉由冷卻水的循環而冷卻之冷卻手段， 使用於前述加熱之溫度控制室與使用於前述冷卻之溫 度控制室係各自鄰接於前述搬送室而連接著， 使用於前述加熱之溫度控制室的前述載置台所排列之. 列與使用於前述冷卻之溫度控制室的前述載置台所排列之 列係相互平行。 1 1 · 一種處理對象物加熱方法，係在將平面形狀爲 矩形之處理對象物，從搬出入室通過溫度控制室移動至搬 送室爲止之間加熱，使用被配置於前述搬送室內之搬送機 器人，以使該搬送機器人的旋轉軸轉動而縮短該搬送機器 人之手臂的事，將前述處理對象物搬入到前述搬.送室內之 處理對象物加熱方法，其特徵爲： 在搬入到前述搬送室前，將前述處理對象物在水平面 內改變方向，使前述處理對象物之相對的兩邊與由前述搬 表紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝· 、11 ίβ -34- 516336 A8 B8 C8 ________D8 六、申請專利範圍~ ' -- 送機器人的旋轉軸中心延伸之輻射線正交後，將前述處理 對象物轉移至前述搬送機器人。 1 2 _ —種處理對象物冷卻方法，係在將平面形狀爲 矩形之處理封象物，使用被配置於搬送室內之搬送機器人 ’以使該搬送機器人的旋轉軸轉動而伸長該搬送機器人之 手臂的事’將前述處理對象物搬送至溫度控制室，將前述 處理對象物通過溫度控制室移動至搬出入室爲止之間冷卻 之處理對象物冷卻方法，其特徵爲： 將前述處理對象物從前述搬送室朝前述溫度控制室搬 送時’使前述處理對象物之相對的兩邊與由前述搬送機器 .人的旋轉軸中心延伸之輻射線正交之狀態下搬送， 接著，改變前述處理對象物之方向，朝搬出入室使其 移動至直線上。 (請先閲讀背面之注意事項存填寫本頁) —装. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ 35516336 A8 B8 C8 D8 夂, patent application scope 1 · A temperature control room with: a vacuum tank; and a transport mechanism arranged in the aforementioned vacuum tank; and a mounting table arranged below the aforementioned transport mechanism; and The temperature control means in the aforementioned mounting table; and a transfer mechanism inserted in the aforementioned mounting table to place the processing object on the mounting table in the aforementioned vacuum tank, and the temperature control is performed by the aforementioned temperature control means The chamber is configured to change directions in a horizontal plane for the aforementioned mounting platform. · 2 ♦ —A temperature control room with: a vacuum tank; and a plurality of transfer mechanisms arranged in the aforementioned vacuum tanks; and a plurality of fixed-position tables arranged in a row below the aforementioned transfer mechanisms; and Each of the plurality of temperature control means provided in the mounting table; and the plurality of transfer mechanisms respectively inserted in the aforementioned mounting table, and the processing objects that have been moved into the vacuum tank are transferred by the aforementioned transfer mechanism to the aforementioned After the transfer mechanism, it is placed on the mounting table, the temperature of the processing object is controlled by the temperature control means, and then the transfer mechanism is used to transfer from the mounting table to the transfer mechanism and then by the aforementioned The conveying mechanism is sequentially delivered to the temperature control room of each of the mounting tables arranged in a row, which is characterized by: (Please read the precautions on the back before filling this page) met · ϋϋ · 11 H ··· · Order economy Printed by the Consumers' Cooperative of the Ministry of Intellectual Property Bureau, the paper size is applicable to China National Standard (CNS) A4 (210X297 mm) -31-516336 A8 B8 C8, D8, patent application. Among the above-mentioned mounting platforms arranged in a row, at least one mounting platform is configured to change direction in a horizontal plane. (Please read the precautions on the back before filling this page) 3 · If the temperature control room in the first patent application scope, the aforementioned temperature control means is a heating means that generates heat by being energized, and is used in the aforementioned process object Material heating. 4. The temperature control room according to item 2 of the scope of patent application, wherein the temperature control means is a heating means that generates heat by being energized, and is used for heating the aforementioned treatment object. 5. The temperature control room according to item 1 of the scope of patent application, wherein the aforementioned temperature control means is a cooling means cooled by the circulation of cooling water, and is used for cooling the aforementioned treatment object. 6. The temperature control room according to item 2 of the patent application range, wherein the aforementioned temperature control means is a cooling means cooled by the circulation of cooling water, and is used for cooling the aforementioned treatment object. ^ 7. A vacuum processing device, which has a temperature control room, a transfer room, and a transfer-in / out room. The printed objects are printed and processed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and transferred to the transfer-in / out room and the transfer. The vacuum processing device between the chambers is characterized in that: the temperature control chamber is provided with: a vacuum tank respectively connected to the transfer chamber and the transfer-in / out chamber; and a transfer mechanism disposed in the vacuum chamber; and the transfer mechanism A mounting platform located below; and a temperature control means provided in the aforementioned mounting platform; and a transfer mechanism inserted in the aforementioned mounting platform, the aforementioned mounting platform is configured to change the direction in a horizontal plane, and the processing pair -32- This paper size applies the Chinese National Standard (CNS) A4 specification (210 × 297 mm) 516336 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A8 B8 C8 D8 6. The scope of the patent application The object is placed on the mounting table in the aforementioned vacuum tank , Temperature control by the aforementioned temperature control means. 8. A vacuum processing device having a temperature control room, a transfer room, and a loading / unloading room. The processing object is a vacuum processing device which is transported between the loading / unloading room and the transfer room through the temperature control room. The aforementioned temperature control room is provided with: a vacuum tank respectively connected to the aforementioned transporting chamber and the aforementioned loading / unloading chamber; and a plurality of transporting mechanisms arranged in the aforementioned vacuum tank; and a plurality of rows arranged in a row below the aforementioned transporting mechanism Mounting platforms; and a plurality of temperature control means respectively provided in the aforementioned mounting platforms; and a plurality of transfer mechanisms respectively inserted in the aforementioned mounting platforms, among the aforementioned mounting platforms arranged in a row, at least The mounting platform at one end is configured to change the direction in the horizontal plane. · The processing object that has been transferred into the vacuum tank is transferred from the transfer mechanism to the transfer mechanism and then placed on the mounting platform. The control means controls the temperature of the object to be processed, and then uses the transfer mechanism to control the temperature of the object to be processed. Mounting table is transferred to the conveying mechanism 5 and then by the conveying means, are arranged sequentially supplied to the respective stage $ _ ^ of bad. 9. The vacuum processing device according to item 8 of the scope of patent application, wherein the transportation room is provided with a rotating shaft and is mounted on the aforementioned rotary special car. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). )-33- ---------------------- Order ----- «0 (Please read the notes on the back before filling this page) 516336 A8 B8 C8 D8 VI. Application scope Patent transfer arm of the robot printed on the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the aforementioned arm is rotated or retracted in the horizontal plane according to the rotation of the aforementioned rotation axis, and the aforementioned processing object is constituted according to The expansion and contraction of the arm is carried on a straight line extending from the center of the rotation axis toward the mounting table that changes direction in the horizontal plane, and the rotation center is located away from the arrangement direction of the mounting table in the temperature control room. 1 0 _If the vacuum processing device of the scope of patent application No.8, which has' at least two of the aforementioned temperature control rooms, among the aforementioned temperature control rooms, one of the aforementioned temperature control means of the temperature control room generates heat by being energized. The heating means' and the temperature controlling means of the other temperature controlling room are cooling means cooled by the circulation of cooling water. The temperature controlling room used for the heating and the temperature controlling room used for the cooling are adjacent to each other. The transfer chambers are connected, and the rows of the mounting tables used in the heated temperature control room and the rows of the mounting tables used in the cooled temperature control room are parallel to each other. 1 1 · A method for heating a processing object is to heat a processing object having a rectangular planar shape and move it from a loading / unloading room through a temperature control room to a transfer room. A transfer robot disposed in the transfer room is used. The method of heating the processing object in the transfer and transfer chamber by rotating the rotation axis of the transfer robot to shorten the arm of the transfer robot is characterized in that: before transferring into the transfer chamber, Change the direction of the processing object in the horizontal plane so that the two opposite sides of the processing object and the paper size of the table to be moved apply the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling (This page) Installation, 11 ί β -34- 516336 A8 B8 C8 ________D8 VI. Application scope of patent ~ '-After the radiation line extending from the center of the rotation axis of the sending robot is orthogonal, transfer the aforementioned processing object to the aforementioned transferring robot. 1 2 _ —A method for cooling an object to be processed is to seal a processed object in a rectangular plane shape, and use a transport robot disposed in a transport chamber to rotate the rotation axis of the transport robot to extend the arm of the transport robot. A method of cooling a processing object that transfers the processing object to a temperature control room and moves the processing object through the temperature control room to the temperature of the loading and unloading room, wherein the processing object is transferred from the processing object. When the chamber is transported toward the temperature control chamber, the two opposite sides of the object to be processed are transported in a state orthogonal to the radiation line extending from the center of the rotation axis of the transporting machine and person. Then, the direction of the object to be processed is changed. Move it straight into and out of the room. (Please read the precautions on the back and fill in this page first) — Packing. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) _ 35
TW090128239A 2000-11-24 2001-11-14 Temperature-controlled chamber, and vacuum processing apparatus using the same, and heating method to process the object, cooling method to process the object TW516336B (en)

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