JP2003165735A - Heat treatment apparatus for glass substrates - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact dryer capable of effectively and continuously drying glass substrates by heating. <P>SOLUTION: The dryer is characterized in that a plurality of substrate holding plates for placing one glass substrate on one plate are arranged in a heating chamber having a carrying-in opening and a carrying-out opening and being provided with heaters on the inner circumferential surfaces so as to be able to accumulate heat while circularly moving the plates through from the carrying-in opening to the carrying-out opening, and in that glass substrates which are sequentially and continuously carried in through the carrying-in opening are allowed to be placed on the substrate holding plates, to be circularly moved within the heating chamber while heating, and to be carried out through the carrying-out opening. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for a glass substrate, for example, a heat treatment apparatus used for baking or drying a glass substrate for a liquid crystal panel or a glass substrate for a color filter attached to the liquid crystal panel. It is about.

[0002]

2. Description of the Related Art Conventionally, an electronic device used for baking or drying a glass substrate for a liquid crystal display (LCD) on which an alignment film or a deflection film is formed or a glass substrate for a color filter (CF) used for the LCD. As a heat treatment device for use, there was a hot air circulation type heating device X as shown in FIG.

In the figure, reference numeral 100 denotes a box-shaped furnace body, in which an inner partition wall 120 is provided inside an outer wall 110 on which a heat insulating material (not shown) is attached, and a hot air supply passage 130 is formed between both walls 110, 120. At the same time, the hot air supply passage 130 and the heating chamber 140 formed in the internal partition wall 120 are communicated with each other.

In the heating chamber 140, there is provided a cassette 300 capable of accommodating glass substrates 200 which are subjected to heat treatment such as baking, drying and curing in a multi-layered state.

The cassette 300 has a frame structure, and a plurality of glass supporting portions (not shown) are formed in the vertical direction at predetermined intervals.

Then, the heater 4 is provided in the hot air supply passage 130.
00, fan 410 and filter 420 are installed to guide hot air
121 to send into the heating chamber 140 to heat the glass substrate 200,
The air that has passed through the ventilation holes 122 provided in the internal partition wall 120 is further heated by the heater 400 and forcedly circulated by the fan 410.

Since the heat treatment apparatus having such a structure has a large amount of treatment per required area, the productivity is relatively high, but dust generation due to blowing of hot air is apt to cause a problem, and particularly for electronic parts as described above. What is used is a glass substrate 20
Since even a small amount of dust attached to 0 affects the quality, it is desirable to remove dusting elements as much as possible.

Therefore, as shown in FIGS. 8 and 9, a far-infrared radiation heating type heat treatment apparatus Y utilizing radiative conduction of heat has been proposed.

In FIGS. 8 and 9, reference numeral 600 denotes a box-shaped furnace body, in which a large number of substrates which are divided into multiple stages by a partition plate 611 are provided inside a side wall 601 on which a heat insulating material (not shown) is attached. A room 610 is provided.

Sheet heaters 700 are stretched on the side wall 601 and the inner surface of each substrate storage chamber 610 so that each glass substrate 200 can be heated uniformly. An opening / closing lid 620 corresponding to each of the substrate storage chambers 610 is provided on the front surface of the furnace body 600. The opening / closing lid 620 is linked to an actuator (not shown).

A quartz tube 630 is arranged in the substrate storage chamber 610 and can hold the glass substrate 200.

Further, as shown in FIG. 9, an air supply port 800 is provided on one side wall and an exhaust port 810 is provided on the other side wall to supply volatile dust from the glass substrate 200 while supplying air little by little. I try to discharge it.

Since the far-infrared radiation heating type heat treatment apparatus Y does not generate dust from a heat source and has high cleanliness, it can be said that it is suitable for heat treatment of the glass substrate 200 used for electronic parts.

[0014]

However, the conventional far-infrared radiation heating type heat treatment apparatus Y described above still has the following problems.

That is, as described above, the glass substrate 20
Since a large number of substrate storage chambers 610 for individually storing 0 are provided, it is necessary to provide planar heaters 700 on all partition walls 611 of each storage chamber 610. Therefore, running costs are reduced in addition to the initial cost. The cost was high. Further, the front surface portion is entirely covered by the substrate storage chamber 61
Since the opening / closing lid 620 for each 0 must be provided, the furnace body 60
The heating from the front part of 0 was not possible.

It is an object of the present invention to provide a glass substrate heat treatment apparatus which solves the above-mentioned problems and which can perform continuous heat treatment in a space-saving and highly clean atmosphere with high productivity.

[0017]

According to the present invention as set forth in claim 1, one glass substrate is addressed to a heating chamber having a glass substrate carrying-in port and a carrying-out port and having a heater provided on the inner peripheral surface thereof. A plurality of substrate holding plates to be placed are arranged so that heat can be stored while circulatingly moving from the carry-in port through the carry-out port, and glass substrates sequentially and continuously loaded from the carry-in port are placed on the substrate holding plate. While being placed and heated on the substrate, the heating chamber is circulated and moved so that it can be carried out from the carry-out port.

Further, according to the present invention, a moving mechanism for circulatingly moving the substrate holding plate in the heating chamber is provided, and the moving mechanism includes a vertical moving mechanism for vertically moving the substrate holding plate, It is configured to combine with a horizontal movement mechanism that moves in the horizontal direction.

Further, in the present invention according to claim 3, the circulation movement path of the substrate holding plate is provided in the heating chamber.

Further, in the present invention according to claim 4, the heating chamber is provided with an air supply port and an exhaust port.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION A glass substrate heat treatment apparatus according to the present invention is provided with a glass substrate carry-in port and a carry-out port, and one glass substrate is placed in a heating chamber provided with a heater on the inner peripheral surface thereof. A plurality of substrate holding plates to be placed are arranged so that heat can be stored while circulatingly moving from the carry-in port through the carry-out port, and glass substrates sequentially and continuously loaded from the carry-in port are placed on the substrate holding plate. It can be carried out from the carry-out port by circulatingly moving in the heating chamber while being placed on and heated.

The heater in this embodiment uses a planar heater that radiates far infrared rays. The heater heats the substrate holding plate to store heat, and the far infrared rays from the heater are used as if they were hot plates. The heating by radiation and the heating from the substrate holding plate enable efficient and uniform heating.

Since the substrate holding plate circulates in the heating chamber, the heat storage state can be kept good and the glass substrate can be efficiently heated. As the substrate holding plate, a metal plate made of aluminum or the like having a high heat storage property can be used.

The glass substrate to be heat treated includes a liquid crystal display (LCD), a color filter (CF) for LCD, etc., and the heat treatment apparatus can be suitably used for such electronic parts.

In the present embodiment, as described above, the glass substrates sequentially and continuously loaded from the carry-in port are placed on the substrate holding plate and heated, while being circulated in the heating chamber and moved from the carry-out port. Since it is possible to carry out continuous processing to be carried out, the productivity is also very good.

A moving mechanism for circulatingly moving the substrate holding plate in the heating chamber is provided, and the moving mechanism moves the substrate holding plate in a vertical direction and in a horizontal direction. It is configured to combine with a horizontal movement mechanism.

Any mechanism may have a well-known structure, but it is desirable to dispose a drive mechanism outside the heating chamber to prevent dust and the like from being generated by sliding as much as possible.

Further, the circulation movement path of the substrate holding plate can be arranged in the heating chamber. In this case, since the substrate holding plate does not go out of the heating chamber,
It is possible to maintain a state where heat is always stored.

Alternatively, of the circulation moving paths, the path from the carry-in port to the carry-out port may be set as the heating chamber, and the path from the carry-out port to the carry-in port may be provided outside the heating chamber.

Further, in this case, it is preferable to secure a passage that maintains a clean atmosphere even outside the heating chamber.

Further, since the temperature of the substrate holding plate decreases when passing through the outside of the heating chamber, a hot plate is arranged on the moving path so that the substrate holding plate can be heated, and the substrate holding plate is again loaded into the heating chamber. Therefore, it is advisable to keep the glass substrate at a sufficient temperature when it is mounted.

It is desirable that the heating chamber be provided with an air supply port and an exhaust port so that dust and the like generated in the heating chamber can be quickly discharged.

[0033]

(First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view of a drying furnace A as a heat treatment apparatus for glass substrates according to the present embodiment, and FIG. 2 is a plan view of the drying furnace A.

As shown, the drying oven A according to this embodiment
The furnace body 1 is formed in a box shape by a wall body 11 having a structure in which heat insulation is filled between an outer frame panel and an inner frame panel made of metal,
It is arranged on the base B.

Then, the main drying oven A is arranged at the end of the conveying path of the glass substrate 2 which is the object to be processed, and the conveyed glass substrate 2 is heated from the in-furnace inlet 12 into the furnace body 1. After being carried into the chamber 8 and dried, the glass substrate 2 is carried out from the outside carry-out port 13 provided in the same direction as the inside carry-in port 12 and sent to the next step. The glass substrate 2 in this embodiment is a liquid crystal display (LC
It is used as a color filter (CF) for D).

The furnace main body 1 has a wall 11 whose inner surface is substantially entirely
A planar infrared radiation heater 9 is provided to form a heating chamber 8 having a heating / heat-retaining function. In the heating chamber 8, the glass substrate 2 is kept at a predetermined temperature (230 ° C. in this embodiment) for a predetermined time ( In this embodiment, heat treatment is performed for 30 minutes.

The front side wall 11a of the furnace body 1 is provided with a preheating chamber 3 in which a hot plate 4 is arranged on the bottom surface, and a substrate inlet 32 for the glass substrate 2 is provided below the front wall 31 of the preheating chamber 3. A substrate unloading port 33 is provided on the front wall 31 above the substrate unloading port 32. The box-shaped wall forming the preheating chamber 3 has the same heat insulating structure as the wall 11 of the furnace body 1.

The front side wall 11a of the furnace body 1 is
At a position facing the substrate carry-in port 32 and the substrate carry-out port 33,
The in-furnace carry-in port 12 and the outside-furnace carry-out port 13 are formed.

An air supply port 15 is provided on one side surface of the wall 11 of the heating chamber 8 and an exhaust port 16 is provided on the other side surface thereof. While supplying air little by little from the air supply port 15, the volatile dust generated when the glass substrate 2 is heated is exhausted by the exhaust port 16
So that it can be discharged quickly.

A feature of the present invention is that a plurality of substrate holding plates 5 on which one glass substrate 2 is placed are installed in the heating chamber 8 from the in-furnace inlet 12 to the out-of-furnace outlet 13. The glass substrate 2 is arranged so as to be able to store heat while being circulated and moved therethrough, and the glass substrates 2 sequentially and successively loaded from the substrate loading port 32 are placed on the substrate holding plate 5 and heated while being heated from the heating chamber 8. The glass substrate 2 can be carried out from the substrate carry-out port 33 by circulating it to the preheating chamber 3.

That is, as described above, the hot plate 4 is arranged in the preheating chamber 3, and the substrate holding plate 5 is placed on the hot plate 4 to heat the same, and the heated substrate is held. After the glass substrate 2 is placed on the plate 5 and preheated, the glass substrate 2 together with the substrate holding plate 5 is conveyed into the heating chamber 8.

Then, the substrate holding plate 5 is heated while moving upward in the heating chamber 8 while the glass substrate 2 is placed thereon, and is carried out from the outside-furnace outlet 13 to the space above the preheating chamber 3 and is not shown here. The glass substrate 2 is transferred to the substrate take-out device, descends, is placed on the hot plate 4, and stands by until the next glass substrate 2 is placed.

The substrate holding plate 5 is made of a metal having a high heat storage property, and is made of an aluminum plate in this embodiment. Alternatively, it may be, for example, copper, stainless steel, glass, or ceramic.

In order to move the glass substrate 2 and the substrate holding plate 5, a moving mechanism is provided in the heating chamber 8 of the furnace body 1 in this embodiment.

The moving mechanism includes a vertical moving mechanism C for moving the substrate holding plate 5 in the heating chamber 8 from the lower side to the upper side, and a horizontal moving mechanism (not shown) attached to the vertical moving mechanism.
It has and. The horizontal movement mechanism is the substrate holding plate 5.
From the preheating chamber 3 to the heating chamber 8 and from the heating chamber 8 to the preheating chamber 3
To move horizontally to.

It should be noted that any of the vertical moving mechanism C and the horizontal moving mechanism may have a well-known structure, but the drive mechanism portion is disposed at least outside the heating chamber 8 and is driven by sliding. It is desirable to prevent the generation of dust as much as possible.

For example, a walking beam system in which an object to be processed is conveyed by a combination of a fixed beam and a moving beam which moves up and down and moves forward and backward along the fixed beam can be considered.

As described above, since the moving mechanism in this embodiment moves the substrate holding plate 5 directly, the glass substrate 2 only mounted on the substrate holding plate 5 is described above. Since the moving mechanism is not touched and external damage due to contact with the moving mechanism is not applied, generation of defective products due to scratches can be suppressed.

As described above, the substrate holding plate 5 is
The preheating chamber 3 → heating chamber 8 → preheating chamber 3 circulates and moves, and there is a possibility that the temperature may be lowered only while coming out of the heating chamber 8 and descending in the preheating chamber 3, but since it is heated immediately by the hot plate 4, The substrate holding plate 5 always functions as a preheater in which a necessary and sufficient amount of heat is stored.

In FIG. 1 and FIG. 2, the circulation movement route R of the substrate holding plate 5 is shown by a thick arrow. Further, the thin arrow R1 indicates the flow of the glass substrate 2, and the thick arrow including the thin arrow indicates the movement path of the substrate holding plate 5 on which the glass substrate 2 is placed. Show.

As described above, in the drying furnace A of this embodiment, the substrate holding plate 5 that circulates in the preheating chamber 3 and the heating chamber 8 is provided, so that the glass substrate 2 is successively laid in spite of its compact structure. It is possible to continuously and efficiently dry.

The process from loading of one glass substrate 2 to the drying oven A to drying and unloading will be described below.

The glass substrate 2 carried into the preheating chamber 3 from the substrate carry-in port 32 by a predetermined carrying means (not shown).
Is placed on the substrate holding plate 5 heated by the hot plate 4 and first preheated.

Next, while being placed on the substrate holding plate 5, it is loaded into the heating chamber 8 through the in-furnace inlet 12, and is moved up and down by the vertically moving mechanism C for a predetermined time (30
It gradually moves upward and is heated.

At this time, since the glass substrate 2 is preheated uniformly by the substrate holding plate 5, the glass substrate 2 is efficiently heated in the heating chamber 8 and is provided on the entire inner wall of the heating chamber 8. The amount of electricity supplied to the planar infrared radiation heater 9 can also be reduced. Moreover, since the entire bottom surface of the glass substrate 2 is held by the substrate holding plate 5, the glass substrate 2 is uniformly heated without being bent. Therefore, there is no fear that the heat history is different and distorted. Volatile dust generated during heating is discharged from the exhaust port 16.

The glass substrate 2 that has been sufficiently heated by the planar infrared radiation heater 9 and dried in the heating chamber 8 is horizontally carried out from the outside carry-out port 13 to the space above the preheating chamber 3,
It is transported to the next process from the substrate unloading port 33 via the substrate unloading device (see FIG. 2).

As described above, according to this embodiment, it is possible to construct the drying furnace A which is compact and energy-saving and which can continuously and efficiently dry the glass substrate 2. The glass substrate 2 is the substrate holding plate 5
Since it is heated evenly above, the thermal history does not distort due to the difference, the generation of defective products due to such substrate deformation is suppressed, and the yield is expected to be improved.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. In addition,
The reference numerals used in the drawings are the same as those used in the first embodiment.

The characteristic feature of this embodiment is that the circulation path (indicated by a thick arrow) R of the substrate holding plate 5 having a preheating function is a path from the carry-in port to the carry-out port in the heating chamber 8. That is, the route from the carry-out port to the carry-in port is provided outside the heating chamber 8. Here, the path of the glass substrate 2 is also indicated by a thin arrow here.

That is, here, the preheating chamber 3 described in the first embodiment has been abolished, and the box-shaped furnace body 1 is also arranged in the middle of the transfer path of the glass substrate 2 so that the front wall 11a is provided. In addition to forming the furnace inlet 12 at the bottom,
The glass substrate 2 in front of (on the good side of) the substrate holding plate 5
A stage unit S for mounting on top is provided.

Further, the outside of the furnace outlet 13 is formed in the lower portion of the rear wall 11b of the furnace body 1, and while being placed on the substrate holding plate 5, it is carried into the furnace body 1 and heated and dried. The glass substrate 2 is carried out to the rear of the furnace body 1, separated from the substrate holding plate 5, and conveyed to the lower side.

The substrate holding plate 5 carried out from the furnace body 1 is reversed from the carrying path of the glass substrate 2 by a plate carrying path B'comprising a conveyor device 6 attached inside the base B as shown in the figure. It is conveyed in the direction and returns to the stage section S described above.

As described above, in this embodiment, the circulation path R of the substrate holding plate 5 is provided outside the heating chamber 8 from the outside-reactor carry-out port 13 to the inside-furnace carry-in port 12.

In this case, the plate carrying path B'is provided inside the base B to prevent heat from being radiated as much as possible so that the substrate holding plate 5 is not cooled below the limit as much as possible. It is desirable that a plate heater or the like is attached to itself and the plate transport path B ′ is provided with a heating means.

Further, the furnace body 1 of the drying furnace A according to this embodiment
As shown in the figure, the interior is partitioned into a first heating chamber 81 and a second heating chamber 82 by an internal partition wall 1c, and planar infrared radiation is radiated on the inner walls of both chambers 81 and 82 including the internal partition wall 1c. A heater 9 is attached.

Although not shown, the first and second heating chambers 81 and 82 are also provided with a moving mechanism similar to that of the first embodiment, so that the first and second heating chambers 81 and 82 are loaded into the first heating chamber 81. The substrate holding plate 5 and the glass substrate 2 rise vertically and horizontally by the horizontal movement mechanism across the internal partition wall 1c into the second heating chamber 82, and vertically descend the second heating chamber 82. Are carried out from the outside of the furnace.

Although not shown, the first and second heating chambers 81 and 82 are provided with the same air supply port and exhaust port as in the first embodiment.

In the present embodiment, although the furnace body 1 is slightly large, the carrying distance in the heating chamber 8 is long, so that it is preferably used for heating and drying the glass substrate 2 which requires a long heating time. The drying time can be adjusted by adjusting the driving speed of the moving mechanism.

As described above, also in this embodiment, the glass substrate 2 is preheated uniformly by the heated substrate holding plate 5 and is further efficiently heated in the heating chamber 8, so that the heating chamber 8 The amount of electricity supplied to the planar infrared radiation heater 9 provided on the entire inner wall can be reduced, and energy can be saved. Moreover, since the entire bottom surface of the glass substrate 2 is held by the substrate holding plate 5, the glass substrate 2 is uniformly heated without being bent, and there is no possibility that the heat history is distorted due to substrate deformation. The production of defective products is also suppressed, and the yield is expected to improve.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. The reference numerals used in the drawings are the same as those used in the first and second embodiments.

This embodiment is carried out by combining the first embodiment and the second embodiment, and the drying furnace A is installed in the middle of the conveying path of the glass substrate 2 and the substrate holding plate 5
The circulation movement is performed only in the heating chamber 8 of the furnace body 1.

That is, the movement path of the glass substrate 2 is the same as that of the second embodiment, and the circulation movement path (indicated by the thick arrow) R indicating the movement of the substrate holding plate 5 is in the heating chamber 8.
It vertically rises from the in-furnace inlet 12 provided at the lower part of the front side wall 11a of the furnace main body 1, then horizontally moves and vertically descends, and further horizontally moves from the position of the outside-rear outlet 13 into the furnace. Mouth 12
It is a route to.

As described above, in this embodiment, since the substrate holding plate 5 circulates only in the heating chamber 8 heated by the planar infrared radiation heater 9, a hot plate is not necessary.

Of course, also in this embodiment,
Although not shown, a moving mechanism similar to the first and second embodiments is provided in the furnace body 1, and the glass substrate 2 loaded into the heating chamber 8 through the in-furnace inlet 12 holds the substrate in the heating chamber 8. It is placed on the plate 5 and vertically rises, horizontally moved by the horizontal movement mechanism, and then vertically descended to be carried out from the outside furnace outlet 13. After this, the substrate holding plate 5 again moves horizontally toward the in-furnace inlet 12 as described above, and waits until the next glass substrate 2 is placed.

In this embodiment, the internal partition wall 1c is omitted. However, a partition wall whose lower portion is opened may be provided so as not to hinder the circulation of the substrate holding plate 5. In this case, since the heater can be provided on the surface of the partition wall, the heating efficiency for the glass substrate 2 can be improved.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIG. The reference numerals used in the drawings are the same as those used in the first to third embodiments.

In this embodiment, as in the third embodiment, the circulation movement of the substrate holding plate 5 is performed only in the heating chamber 8 of the furnace body 1, but the circulation movement direction is opposite.

That is, the conveyor path for the glass substrate 2 is constituted by the conveyor device 7, and the lower part of the furnace main body 1 is arranged so as to penetrate therethrough, and the inside of the furnace inlet 1 is located at the upper position of the front side wall 11a of the furnace main body 1.
2 is provided, and the rear side wall 1 at a position facing the carry-in port 12 in the furnace
An outside-reactor outlet 13 is provided in the upper portion of 1b, and a circulation movement path (indicated by a thick arrow) R indicating the movement of the substrate holding plate 5 is provided in the heating chamber 8 above the front side wall 11a of the furnace body 1. It vertically descends from the in-furnace inlet 12, then horizontally moves forward and rises vertically, and further horizontally moves backward from the position of the outer outlet 13 provided on the upper portion of the rear wall 11b and retreats, It is a route to the in-furnace inlet 12.

With such a structure, the glass substrate 2 placed on the conveyor device 7 and conveyed to the position just before the furnace body 1 is lifted by a separately provided lifting device (not shown). And the furnace inlet at the upper position
It is loaded into the heating chamber 8 from 12 and placed on the substrate holding plate 5.

Then, it moves in the heating chamber 8 together with the substrate holding plate 5, is carried out from the outside of the furnace outlet 13 provided on the upper portion of the rear wall 11b of the furnace main body 1, and a lifting device (not shown) separately provided. Then, it is lowered by, and is placed on the conveyor device 7 again and is conveyed to the next step.

As described above, in this embodiment as well, as in the third embodiment, the substrate holding plate 5 circulates only in the heating chamber 8 heated by the planar infrared radiation heater 9, so that no hot plate is required. Becomes

Of course, also in this embodiment,
Although not shown, the furnace body 1 is provided with a moving mechanism similar to the first and second embodiments.

Further, also in this embodiment, a partition wall having an opening in the lower portion may be provided so as not to hinder the circulation of the substrate holding plate 5.

[0084]

The present invention is carried out in the above-mentioned mode and has the following effects.

(1) A plurality of substrate holding plates on which one glass substrate is placed are introduced into a heating chamber having a glass substrate carry-in port and a carry-out port and having a heater provided on the inner peripheral surface thereof. While arranging so that heat can be stored while circulatingly moving from the mouth through the carry-out port, the glass substrate sequentially carried in from the carry-in port is placed on the substrate holding plate and heated, while heating the inside of the heating chamber. Since the glass substrate can be circulated and carried out from the carry-out port, the glass substrate can be continuously heated and dried, and the glass substrate is uniformly preheated by the substrate holding plate to efficiently heat the glass substrate in the heating chamber. Therefore, the amount of electricity supplied to the heater provided on the entire inner wall of the heating chamber can be reduced. Moreover,
Since the entire bottom surface of the glass substrate is held on the substrate holding plate by the surface, the glass substrate is uniformly heated without bending, and there is no fear that the thermal history will be distorted differently.
Yield improvement is expected.

(2) In the present invention according to claim 2, a moving mechanism for circulatingly moving the substrate holding plate in the heating chamber is provided, and the moving mechanism includes a vertical moving mechanism for vertically moving the substrate holding plate. Since it is configured to combine with a horizontal moving mechanism that moves in the horizontal direction, while smoothly moving the substrate holding plate, touch the moving mechanism etc. for the glass substrate just mounted on the substrate holding plate. There is no danger of external damage.

(3) In the present invention as set forth in claim 3, since the circulation path of the substrate holding plate is provided in the heating chamber, the substrate holding plate does not come out of the heating chamber, so that heat is always stored. Can maintain a good condition.

(4) In the present invention as set forth in claim 4, since the heating chamber is provided with an air supply port and an exhaust port, volatile dust generated from the glass substrate by being heated is promptly discharged. By discharging, it is possible to prevent these dusts from adhering to the glass substrate.

[Brief description of drawings]

FIG. 1 is an explanatory view from a side view of a drying furnace according to a first embodiment.

FIG. 2 is a plan view of the drying furnace.

FIG. 3 is a side view of a drying furnace according to a second embodiment.

FIG. 4 is an explanatory view of the drying furnace in plan view.

FIG. 5 is a side view of a drying furnace according to a third embodiment.

FIG. 6 is an explanatory view from a side view of a drying oven according to a fourth embodiment.

FIG. 7 is an explanatory diagram showing an example of a conventional drying furnace.

FIG. 8 is a side view illustrating an example of a conventional drying furnace.

FIG. 9 is a plan view of the conventional drying oven.

[Explanation of symbols]

A drying oven B base 1 furnace body 2 glass substrates 5 Substrate holding plate

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) F27B 9/30 F27B 9/30 F27D 3/12 F27D 3/12 Z (72) Inventor Hiroki Yamaguchi, Kasuya, Fukuoka Prefecture 2781 Kuhara, Gunmayama-cho Showa Tetsuko Co., Ltd. F-Term in Thermodevices Division (Reference) 3L113 AA02 AB02 AC41 AC67 BA34 DA02 DA10 DA17 4G015 GB00 4K050 AA02 BA07 BA16 CA09 CG12 CG29 4K055 AA06 HA01 HA12

Claims (4)

[Claims] 1. A glass substrate carry-in port and a carry-out port are provided,
A plurality of substrate holding plates on which one glass substrate is placed are arranged in a heating chamber having a heater on the inner peripheral surface so that heat can be stored while circulatingly moving from the carry-in port through the carry-out port. Along with heating the glass substrates sequentially and continuously loaded from the loading port while heating them on the substrate holding plate, the glass substrates can be circulated in the heating chamber to be unloaded from the loading port. Heat treatment equipment. 2. A moving mechanism for circulatingly moving the substrate holding plate in the heating chamber, wherein the moving mechanism includes a vertical moving mechanism for moving the substrate holding plate in the vertical direction and a horizontal moving mechanism for moving the substrate holding plate in the horizontal direction. The heat treatment apparatus for a glass substrate according to claim 1, wherein the heat treatment apparatus has a combined structure. 3. The heat treatment apparatus for glass substrates according to claim 1, wherein a circulating movement path of the substrate holding plate is provided in the heating chamber. 4. The heat treatment apparatus for a glass substrate according to claim 1, wherein the heating chamber is provided with an air supply port and an exhaust port.