KR20190080326A - Apparatus and Method for treating substrate - Google Patents

Abstract

An embodiment of the present invention provides an apparatus and a method for supporting a substrate. The apparatus for supporting a substrate includes: a support plate having a mounting surface on which a substrate is placed; a decompressing unit decompressing a space between the substrate placed on the mounting surface and the mounting surface; and a pin member provided in an insertion groove formed on the mounting surface, wherein the pin member includes: a support pin supporting the substrate; and an elastic member coupled to the support pin. Therefore, the present invention is possible to prevent an air current from being introduced between the substrate and the mounting surface.

Description

[0001] APPARATUS AND METHOD FOR TREATING SUBSTRATE [0002]

The present invention relates to an apparatus and a method for supporting a substrate.

Various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture semiconductor devices. In these processes, a coating process is used as a process of forming a liquid film on a substrate. In general, the application step is a step of applying a treatment liquid onto a substrate to form a liquid film.

Before and after the liquid film is formed on the substrate, a baking process for baking the substrate is performed. The baking process is a process of heating the substrate at a process temperature or higher in a closed space, which blows organic substances onto the liquid film to stabilize the liquid film. This baking process must heat the entire area of the substrate to a uniform temperature.

FIG. 1 is a cross-sectional view showing a substrate placed in a general baking apparatus, and FIG. 2 is a plan view showing a flow of air introduced between the substrate and the seating surface in FIG. 1 and 2, the upper surface of the support plate 2 is provided with a seating surface 2a on which the substrate W is placed, and the seating surface 2a is provided with a plurality of support pins 4 and vacuum holes 6 are fixedly installed. The support pins 4 separate the substrate W and the seating surface 2a from each other. A pressure-reducing member 8 is provided in the vacuum hole 6 to reduce the space between the seating surface 2a and the substrate W. As a result, the substrate W is vacuum-adsorbed on the seating surface 2a and fixed to the support plate 2.

However, as the space between the substrate W and the seating surface 2a is depressurized, the airflow continuously flows into the space therebetween. As a result, the region where a large amount of airflow is brought into contact is lower in temperature than the region where a smaller amount of contact is made, which causes uneven baking of the substrate W. This also causes the substrate W to be baked at a temperature lower than the process temperature, resulting in a defective bake.

In addition, the method of supporting vacuum of the substrate W generates a warpage of the substrate W. For example, the vacuum hole 6 is located closer to the central region than the edge region of the substrate W, and the substrate W has a warp where the edge region is located higher than the central region. As a result, the substrate W is heated non-uniformly in each region, which causes a bake failure.

Korean Patent No. 10-07843890000

An object of the present invention is to provide an apparatus and a method that can uniformly heat treat the entire area of a substrate.

It is another object of the present invention to provide an apparatus and a method for uniformly performing heat treatment on a substrate on which warping occurs.

It is another object of the present invention to provide an apparatus and a method for preventing a substrate from being unevenly heat-treated due to the flow of airflow between the substrate and the seating surface.

Embodiments of the present invention provide an apparatus and method for supporting a substrate. The apparatus for supporting a substrate includes a support plate having a seating surface on which a substrate is placed, a decompression unit for decompressing a space between the substrate and the seating surface on the seating surface, and a pin member disposed in the insertion groove formed in the seating surface , The pin member includes a support pin for supporting the substrate and an elastic member coupled to the support pin.

The support pin can be lowered by depressurization of the space, and can be provided so as to be movable up and down by the elastic force of the elastic member. The elastic force may be smaller than the depressurizing pressure of the decompression unit and larger than the weight of the substrate placed on the seating surface.

The support pin may be provided to be movable between a protruding position where the upper end is positioned higher than the seating surface and an insertion position where the upper end is positioned at the same position as the seating surface or lower.

The decompression unit may further include a vacuum line connected to a vacuum hole provided in the support plate, and the vacuum hole may be positioned apart from the insertion groove.

Alternatively, the decompression unit may include a vacuum line connected to the insertion groove.

The apparatus further includes a lift member for moving the substrate up and down, wherein the lift member includes a lift pin positioned in a lift hole formed in the seating surface, and a lift pin having a lift position higher than the protruding position, And a lowering position which is equal to or lower than the lowering position.

The apparatus for heat-treating a substrate includes a support plate having a seating surface on which the substrate is placed, a heater provided on the support plate for heating the support plate, a decompression unit for decompressing a space between the substrate and the seating surface on the seating surface, And a pin member disposed in the insertion groove formed in the seating surface, wherein the pin member includes a support pin for supporting the substrate and an elastic member coupled to the support pin.

Wherein the supporting pin is lowered by the decompression of the space and is capable of being raised and lowered by the elastic force of the elastic member, the elastic force is smaller than the depressurizing pressure of the decompression unit, and is larger than the weight of the substrate placed on the seating surface have. The apparatus may further include a guide positioned on an upper surface of the support plate and having a ring shape surrounding the seating surface.

Also, as a method of processing a substrate using the above-described apparatus, there is a method including a first descending step in which a lift pin protruding from the seating surface moves down while supporting the substrate, the supporting pin protruded from the seating surface, A step of pre-heating the substrate by holding the substrate in a protruded state after receiving the substrate from the fin, a second descending step of depressurizing the space to bring the substrate into close contact with the seating surface, And a processing step of heating the substrate adhered to the seating surface to a process temperature.

The second descending step may proceed when the substrate reaches the preheating temperature in the preheating step. The temperature of the heater in the preheating step and the processing step may be the same. A first elevating step of removing the decompression to lift the substrate from the seating surface when the processing step is completed and a second elevating step in which the lift pin is lifted and lowered to receive the substrate from the supporting pin, As shown in FIG.

In addition, a method of processing a substrate using the above-described apparatus includes a processing step of heating the substrate adhering to the seating surface to a process temperature, removing the reduced pressure, and causing the supporting pin to lift the substrate from the seating surface And a second lifting step in which the lifting pin located in the supporting plate protrudes and is lifted and lowered to receive the substrate from the supporting pin.

According to the embodiment of the present invention, the substrate is heat-treated in a state of being in close contact with the seating surface. Thus, it is possible to prevent the flow of airflow between the substrate and the seating surface, and the substrate can be uniformly heat-treated.

According to the embodiment of the present invention, since the entire area of the substrate is in close contact with the seating surface, it is possible to prevent the substrate from being warped.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of a substrate placed in a conventional bake apparatus;
FIG. 2 is a plan view showing the airflow introduced between the substrate and the seating surface of FIG. 1; FIG.
3 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
Fig. 4 is a view of the facility of Fig. 3 viewed from the direction AA. Fig.
5 is a view of the equipment of Fig. 3 viewed from the BB direction.
FIG. 6 is a view of the equipment of FIG. 3 viewed from the CC direction.
FIG. 7 is a cross-sectional view showing the substrate processing apparatus of FIG. 3;
8 is a plan view showing the substrate supporting unit of Fig.
9 is an enlarged cross-sectional view of the pin member of Fig. 7;
10 is a flow chart showing a process of bake processing a substrate using the apparatus of FIG.
11 to 16 are views showing a process of baking a substrate using the apparatus of FIG.
17 is a cross-sectional view showing another embodiment of the decompression unit of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. Thus, the shape of the elements in the figures has been exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. However, the present embodiment is applicable to various apparatuses in which an airflow is formed in a closed substrate processing space. Hereinafter, a case where a circular wafer is used as the substrate will be described as an example.

FIG. 3 is a plan view showing a substrate processing facility according to an embodiment of the present invention, FIG. 4 is a view of the equipment of FIG. 3 viewed from the direction AA, FIG. 5 is a view of the equipment of FIG. 3 is a view of the equipment of Fig. 3 viewed from the CC direction. 3 to 6, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has a resist application unit 410, a bake unit 420, and a transfer chamber 430. The resist application unit 410, the bake unit 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist coating unit 410 and the bake unit 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 therebetween. A plurality of resist coating units 410 are provided, and a plurality of resist coating units 410 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six resist application units 410 are provided is shown. A plurality of bake units 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six bake units 420 are provided is shown. Alternatively, however, the bake unit 420 may be provided in more or less numbers.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The application unit robot 432 is connected to the bake units 420, the resist application units 400, the first buffer 320 of the first buffer module 300 and the first buffer unit 500 of the second buffer module 500 And transfers the substrate W between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

The resist coating units 410 all have the same structure. However, the types of the sensitizing solution used in the respective resist coating units 410 may be different from each other. For example, a chemical amplification resist may be used as the sensitizing solution. The resist coating unit 410 applies the photosensitive liquid onto the substrate W. [ The resist coating unit 410 has a housing 411, a support plate 412, and a nozzle 413. The housing 411 has a cup shape with an open top. The support plate 412 is located in the housing 411 and supports the substrate W. [ The support plate 412 is rotatably provided. The nozzle 413 supplies the sensitizing solution onto the substrate W placed on the support plate 412. The nozzle 413 has a circular tube shape and can supply the photosensitive liquid to the center of the substrate W. [ Alternatively, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 413 may be provided as a slit. In addition, the resist coating unit 410 may further be provided with a nozzle 414 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W on which the photosensitive liquid is applied.

The bake unit 800 heat-treats the substrate W. The bake unit 800 heat-treats the substrate W before and after applying the photosensitive liquid. The bake unit 800 can heat the substrate W to a predetermined temperature so as to change the surface properties of the substrate W before applying the photosensitive liquid and form a process liquid film such as an adhesive on the substrate W have. The bake unit 800 can heat-treat the photosensitive liquid film in a reduced-pressure atmosphere on the substrate W coated with the photosensitive liquid. The volatile substance contained in the photosensitive liquid film can be volatilized. In this embodiment, the bake unit 800 is described as a unit for performing the heat treatment on the photosensitive liquid film.

The bake unit 800 includes a cooling plate 820 and a heating unit 1000. The cooling plate 820 cools the substrate W heated by the heating unit 1000. The cooling plate 820 is provided in the shape of a circular plate. Inside the cooling plate 820, cooling means such as cooling water or a thermoelectric element are provided. For example, the substrate W placed on the cooling plate 820 may be cooled to a temperature equal to or close to ambient temperature.

The heating unit 1000 heats the substrate W in a reduced pressure atmosphere at a normal pressure or lower. The heating unit 1000 is provided to the substrate processing apparatus 1000 for heating the substrate W. [ FIG. 7 is a cross-sectional view showing the substrate processing apparatus of FIG. 3; 7, the substrate processing apparatus 1000 includes a chamber 1100, a substrate support unit 1200, a heater unit 1400, an exhaust unit 1500, a decompression unit 1600, a pin member 1700, and And a guide 1800.

The chamber 1100 provides a processing space 1110 for heat-treating the substrate W therein. The processing space 1110 is provided with an outer and an interrupted space. The chamber 1100 includes an upper body 1120, a lower body 1140, and a sealing member 1160.

The upper body 1120 is provided in a cylindrical shape with its bottom opened. A center hole 1122 and a peripheral hole 1124 are formed on the upper surface of the upper body 1120. The center hole 1122 is formed at the center of the upper body 1120. The center hole 1122 functions as an exhaust hole 1122 through which the atmosphere of the process space 1110 is exhausted. The peripheral holes 1124 are provided in a plurality of locations and are formed at positions deviated from the center of the upper body 1120. The peripheral holes 1124 function as an inlet hole 1124 through which the external air flows into the processing space 1110. The peripheral holes 1124 are positioned to surround the center hole 1122. The peripheral holes 1124 are spaced apart from each other along the circumferential direction. According to one example, the number of the peripheral holes 1124 may be four. The external air flow may be air.

Alternatively, the peripheral holes 1124 may be provided in three or more than five. The external airflow may also be an inert gas.

The lower body 1140 is provided in a cylindrical shape with its top opened. The lower body 1140 is positioned below the upper body 1120. [ The upper body 1120 and the lower body 1140 are positioned to face each other in the vertical direction. The upper body 1120 and the lower body 1140 are combined with each other to form a processing space 1110 therein. The upper body 1120 and the lower body 1140 are positioned such that their central axes coincide with each other with respect to the vertical direction. The lower body 1140 may have the same diameter as the upper body 1120. That is, the upper end of the lower body 1140 may be positioned opposite to the lower end of the upper body 1120.

One of the upper body 1120 and the lower body 1140 is moved to the open position and the shutoff position by the lifting member 1130 and the other is fixed in position. It is assumed that the position of the lower body 1140 is fixed and the upper body 1120 is moved between the open position and the shutoff position by the elevating member 1130. [ Here, the open position is a position where the processing space 1110 is opened by separating the upper body 1120 and the lower body 1140 from each other. The cutoff position is a position where the processing space 1110 is sealed from the outside by the lower body 1140 and the upper body 1120.

A sealing member 1160 is positioned between the upper body 1120 and the lower body 1140. The sealing member 1160 seals a gap between the upper body 1120 and the lower body 1140. The sealing member 1160 may be an O-ring member 1160 having an annular ring shape. The sealing member 1160 may be fixedly coupled to the upper end of the lower body 1140.

The substrate supporting unit 1300 supports the substrate W in the processing space 1110. [ The substrate supporting unit 1300 is fixedly coupled to the lower body 1140. The substrate support unit 1300 includes a support plate 1320 and a lift member. 8 is a plan view showing the substrate supporting unit of Fig. Referring to FIGS. 7 and 8, the support plate 1320 transfers heat generated from the heater unit 1400 to the substrate W. FIG. The support plate 1320 is provided in the shape of a circular plate. The upper surface of the support plate 1320 has a larger diameter than the substrate W. [ The upper surface of the support plate 1320 functions as a seating surface 1320a on which the substrate W is placed. A plurality of lift holes 1322, insertion grooves 1324, and vacuum holes 1326 are formed on the seating surface 1320a. The lift holes 1322, the insertion grooves 1324, and the vacuum holes 1326 are located in different areas. The lift holes 1322 and the vacuum holes 1326 are arranged so as to surround the center of the upper surface of the support plate 1320, respectively. Each of the lift holes 1322 is arranged to be spaced apart from each other along the circumferential direction. Each of the vacuum holes 1326 is arranged to be spaced apart from each other along the circumferential direction. For example, the lift holes 1322 and the vacuum holes 1326 may be arranged so as to have an annular ring shape in combination with each other. The lift holes 1322 are spaced equidistantly from each other, and the vacuum holes 1326 can be spaced equidistantly from each other. The insertion grooves 1324 are arranged differently from the lift holes 1322 and the vacuum holes 1326. The insertion grooves 1324 can be equally arranged in the entire area of the seating surface 1320a.

For example, three lift holes 1322 and one vacuum hole 1326 may be provided. The support plate 1320 may be provided with a material containing aluminum nitride (AlN).

The lift member 1340 moves the substrate W up and down on the support plate 1320. The lift member 1340 includes a lift pin 1342 and a driving member (not shown). A plurality of lift pins 1342 are provided, and each of the lift pins 1342 is provided in the form of a vertically-oriented pin. A lift pin 1340 is located in each lift hole 1322. A driving member (not shown) moves each of the lift pins 1342 between a lift position and a lift position. The elevating position is defined as a position where the upper end of the lift pin 1342 is higher than the seating surface 1320a and the lowering position is defined as a position where the upper end of the lift pin 1342 is the same as or lower than the seating surface 1320a. The driving member (not shown) may be located outside the chamber 1100. The driving member (not shown) may be a cylinder.

The heater unit 1400 heats the substrate W placed on the support plate 1320. The heater unit 1400 is positioned below the substrate W placed on the support plate 1320. [ The heater unit 1400 includes a plurality of heaters 1420. The heaters 1420 are located within the support plate 1320. Optionally, the heaters 1420 may be located on the bottom surface of the support plate 1320. The heaters 1420 are located on the same plane. Heaters 1420 heat different areas of the support surface. The areas of the support plate 1320 corresponding to the respective heaters 1420 as viewed from above can be provided in the heating zones. The temperature of each heater 1420 is independently adjustable. For example, the number of heating zones may be fifteen. The temperature of each heating zone is measured by a measuring member (not shown). The heater 1400 may be a thermoelectric element or a hot wire.

The exhaust unit 1500 guides the flow of the airflow introduced into the processing space 1110. Further, the exhaust unit 1500 exhausts the atmosphere of the processing space 1110. The exhaust unit 1500 includes an exhaust pipe 1530 and a guide plate 1540. The exhaust pipe 1530 has a tubular shape that is vertically oriented in the longitudinal direction. The exhaust pipe 1530 is positioned to pass through the upper wall of the upper body 1120. According to one example, the exhaust pipe 1530 can be positioned so as to be inserted into the center hole 1122. That is, the lower end of the exhaust pipe 1530 is located in the process space 1110, and the upper end of the exhaust pipe 1530 is located outside the process space 1110. A decompression member 1560 is connected to an upper end of the exhaust pipe 1530. The decompression member 1560 decompresses the exhaust pipe 1530. Accordingly, the atmosphere in the process space 1110 is exhausted sequentially through the through hole 1542 and the exhaust pipe 1530.

The guide plate 1540 has a plate shape having a through hole 1542 at its center. The guide plate 1540 has a circular plate shape extending from the lower end of the exhaust pipe 1530. The guide plate 1540 is fixedly coupled to the exhaust pipe 1530 so that the inside of the through hole 1542 and the inside of the exhaust pipe 1530 communicate with each other. The guide plate 1540 is positioned to face the support surface of the support plate 1320 at an upper portion of the support plate 1320. The guide plate 1540 is positioned higher than the lower body 1140. According to one example, the guide plate 1540 may be positioned at a height that faces the upper body 1120. The guide plate 1540 is positioned to overlap with the peripheral hole 1124 and has a diameter that is spaced apart from the inner surface of the upper body 1120. [ A gap is created between the side edge of the guide plate 1540 and the inner surface of the upper body 1120. This gap is provided to the flow path through which the airflow introduced through the peripheral hole 1124 is supplied to the substrate W.

The decompression unit 1600 is connected to the vacuum hole 1326. The decompression unit 1600 can decompress the vacuum hole 1326 to decompress the space 1330 between the substrate W and the seating surface 1320a. The decompression unit 1600 includes a vacuum line 1620, a pressure reducing member 1640, and a valve 1660. The vacuum line 1620 is provided as a line that branches from one line and is connected to each vacuum hole 1326. [ The pressure-reducing member 1640 is installed in the vacuum line 1620 to decompress each of the vacuum holes 1326 with the same force. For example, the pressure reducing member 1640 may be a pump. Valve 1660 opens and closes vacuum line 1620.

The pin member 1700 includes a support pin 1720 and an elastic member 1740. 9 is an enlarged cross-sectional view of the pin member of Fig. 7; Referring to FIG. 9, the support pin 1720 has a shorter length than the lift pin 1342. The support pin 1720 has a longitudinal direction parallel to the lift pin 1342. In each of the insertion grooves 1324, a support pin 1720 is positioned. The support pins 1720 are movable between the protruding position or the inserting position by the pressure-sensitive member 1640 and the elastic member 1740. The projecting position is a position where the upper end of the support pin 1720 protrudes above the seating surface 1320a and the insertion position is defined as a position where the upper end of the support pin 1720 is the same as or lower than the seating surface 1320a. According to one example, the upper end of the support pin 1720 in the projecting position may be lower than the upper end of the lift pin 1342 in the lift position. The elastic member 1740 is coupled to the support pin 1720 to provide an elastic force to the support pin 1720. The elastic member 1740 provides an elastic force such that the support pin 1720 is positioned at the protruding position. According to one example, the elastic force can be provided to be larger than the weight of the substrate W. [ Further, the elastic force may be smaller than the depressurizing pressure of the pressure-reducing member 1640. As a result, the support pin 1720 can be moved to the insertion position by the relief pressure of the pressure-reducing member 1640. The elastic member 1740 may be a spring.

Guide 1800 guides substrate W so that substrate W is in position. The guide is provided to have an annular ring shape surrounding the seating surface 1320a. The guide 1800 has a larger diameter than the substrate W. [ The inner surface of the guide 1800 has a downwardly inclined shape as it approaches the center axis of the support plate 1320. The substrate W over the inner surface of the guide 1800 is moved to the correct position along the inclined surface. Also, the guide 1800 can prevent a small amount of airflow flowing between the substrate and the seating surface.

Next, a method of baking the substrate W using the above-described substrate processing apparatus will be described. FIG. 10 is a flowchart showing a process of bake processing a substrate using the apparatus of FIG. 7, and FIGS. 11 to 16 are views showing a process of bake processing a substrate using the apparatus of FIG. 10 to 16, a method of processing the substrate W includes a first descending step S100, a preheating step S200, a second descending step S300, a processing step S400 , A first elevating step (S500), and a second elevating step (S600).

In the first descending step S100, the lift pin 1342 receives the substrate W from the applying robot 432 at the elevating position and moves downward to the lowering position. The substrate W is transferred to the support pin 1720 located at the protruding position in the lift pin 1342. [ When the substrate W is placed on the support pin 1720, the preheating step S200 proceeds.

In the preliminary heating step (S200), the substrate W placed on the support pins 1720 is heat-treated by the heater 1420. When the substrate W reaches the first temperature, the second descending step S300 proceeds. For example, the first temperature may be a preheating temperature.

As the second descending step S300 proceeds, the pressure-reducing member 1640 reduces the space 1330 between the substrate W and the seating surface 1320a. The depressurizing pressure of the pressure-reducing member 1640 moves the support pin 1720 from the protruding position to the insertion position, and the substrate W is placed in close contact with the seating surface 1320a. When the substrate W is vacuum-adsorbed on the seating surface 1320a, the processing step S400 is performed.

In the processing step (S400), the substrate W adhered to the seating surface 1320a is heated to the second temperature. For example, the second temperature may be the process temperature. The second temperature may be a temperature higher than the first temperature. During the preliminary heating step (S200) and the processing step (S400), the temperature of the heater (1420) is provided equally. As the distance between the seating surfaces 1320a approaches the substrate W, Can be heated. When the processing step S400 is completed, the first elevating step S500 is performed.

When the first elevating step S500 is performed, the reducing pressure provided in the space 1330 between the substrate W and the seating surface 1320a is removed. Thus, the support pin 1720 is moved to the protruding position, and the substrate W is positioned at a predetermined distance from the seating surface 1320a.

The second lift step S600 is performed to move the lift pin 1342 from the lowered position to the lift position and the substrate W is transferred to the lift pin 1342 from the support pin 1720. [ When the lift pin 1342 is moved to the lift position in a state supporting the substrate W, the application unit robot 432 takes over the substrate W from the lift pin 1342. [

In the above-described embodiment, the preheating step S200 is performed before the processing step S400 proceeds. As a result, the temperature of the substrate W is abruptly raised, and the substrate W is prevented from being damaged.

A first elevating step S500 is performed between the processing step S400 and the second elevating step S600. This can prevent the substrate W from being warped or damaged when the substrate W is forcibly lifted due to a pressure difference between the space 1330 between the substrate W and the seating surface 1320a and the processing space 1110 have.

It has been described that the vacuum hole 1326 and the insertion groove 1324 are located in different areas on the seating surface 1320a and the vacuum line 1620 is connected to the vacuum hole 1326 in the above- 17, a vacuum hole 1326 is not provided on the seating surface 1320a, and a vacuum line 1620 is provided in the insertion groove 1324 to move the support pin 1720 to the protruding position and the lowering position At the same time, the substrate W can be brought into close contact with the seating surface 1320a. In this case, the diameter of the insertion groove 1324 may be larger than the diameter of the support pin 1720.

Referring again to FIGS. 3 to 6, the developing module 402 includes a developing process for supplying a developing solution to obtain a pattern on the substrate W to remove a part of the photoresist, And a heat treatment process such as heating and cooling performed on the substrate. The development module 402 has a development unit 460, a bake unit 470, and a transfer chamber 480. [ The developing unit 460, the bake unit 470, and the transfer chamber 480 are sequentially disposed along the second direction 14. The developing unit 460 and the bake unit 470 are positioned apart from each other in the second direction 14 with the transfer chamber 480 therebetween. A plurality of developing units 460 are provided, and a plurality of developing units 460 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six developing units 460 are provided is shown. A plurality of bake units 470 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, an example in which six bake units 470 are provided is shown. Alternatively, however, the bake unit 470 may be provided in a greater number.

The transfer chamber 480 is positioned in parallel with the second buffer 330 of the first buffer module 300 in the first direction 12. In the transfer chamber 480, the developing robot 482 and the guide rail 483 are positioned. The delivery chamber 480 has a generally rectangular shape. The developing robot 482 includes bake units 470, developing units 460, a second buffer 330 and a cooling chamber 350 of the first buffer module 300 and a second buffer module 500, And the second cooling chamber 540 of the second cooling chamber 540. The guide rail 483 is arranged such that its longitudinal direction is parallel to the first direction 12. The guide rail 483 guides the developing robot 482 to linearly move in the first direction 12. The developing sub-robot 482 has a hand 484, an arm 485, a supporting stand 486, and a pedestal 487. The hand 484 is fixed to the arm 485. The arm 485 is provided in a stretchable configuration to allow the hand 484 to move in a horizontal direction. The support 486 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 485 is coupled to the support 486 such that it is linearly movable along the support 486 in the third direction 16. The support table 486 is fixedly coupled to the pedestal 487. The pedestal 487 is coupled to the guide rail 483 so as to be movable along the guide rail 483.

The developing units 460 all have the same structure. However, the types of developers used in the respective developing units 460 may be different from each other. The developing unit 460 removes a region of the photoresist on the substrate W irradiated with light. At this time, the area of the protective film irradiated with the light is also removed. Depending on the type of selectively used photoresist, only the areas of the photoresist and protective film that are not irradiated with light can be removed.

The developing unit 460 has a housing 461, a support plate 462, and a nozzle 463. The housing 461 has a cup shape with an open top. The support plate 462 is located in the housing 461 and supports the substrate W. [ The support plate 462 is rotatably provided. The nozzle 463 supplies the developer onto the substrate W placed on the support plate 462. The nozzle 463 has a circular tube shape and can supply developer to the center of the substrate W. [ Alternatively, the nozzle 463 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 463 may be provided with a slit. Further, the developing unit 460 may further be provided with a nozzle 464 for supplying a cleaning liquid such as deionized water to clean the surface of the substrate W to which the developer is supplied.

The bake unit 470 of the developing module 402 heat-treats the substrate W. [ For example, the bake units 470 may include a post bake process in which the substrate W is heated before the development process is performed, a hard bake process in which the substrate W is heated after the development process is performed, And a cooling step for cooling the substrate W is performed. The bake unit 470 has a cooling plate 471 or a heating unit 472. The cooling plate 471 is provided with a cooling means 473 such as a cooling water or a thermoelectric element. Or the heating unit 472 is provided with a heating means 474 such as a heating wire or a thermoelectric element. The cooling plate 471 and the heating unit 472 may be provided in one bake unit 470, respectively. Optionally, some of the bake units 470 may include only the cooling plate 471, while others may only include the heating unit 472. [ Since the bake unit 470 of the developing module 402 has the same configuration as that of the bake unit 800 of the application module 401, detailed description thereof will be omitted.

The second buffer module 500 is provided as a path through which the substrate W is transferred between the coating and developing module 400 and the pre- and post-exposure processing module 600. The second buffer module 500 performs a predetermined process on the substrate W such as a cooling process or an edge exposure process. The second buffer module 500 includes a frame 510, a buffer 520, a first cooling chamber 530, a second cooling chamber 540, an edge exposure chamber 550, and a second buffer robot 560 I have. The frame 510 has a rectangular parallelepiped shape. The buffer 520, the first cooling chamber 530, the second cooling chamber 540, the edge exposure chamber 550, and the second buffer robot 560 are located within the frame 510. The buffer 520, the first cooling chamber 530, and the edge exposure chamber 550 are disposed at a height corresponding to the application module 401. The second cooling chamber 540 is disposed at a height corresponding to the development module 402. The buffer 520, the first cooling chamber 530, and the second cooling chamber 540 are sequentially arranged in a row along the third direction 16. The buffer 520 is disposed along the first direction 12 with the transfer chamber 430 of the application module 401. [ The edge exposure chamber 550 is spaced a certain distance in the second direction 14 from the buffer 520 or the first cooling chamber 530.

The second buffer robot 560 carries the substrate W between the buffer 520, the first cooling chamber 530, and the edge exposure chamber 550. A second buffer robot 560 is positioned between the edge exposure chamber 550 and the buffer 520. The second buffer robot 560 may be provided in a structure similar to that of the first buffer robot 360. The first cooling chamber 530 and the edge exposure chamber 550 perform a subsequent process on the substrates W that have been processed in the application module 401. The first cooling chamber 530 cools the substrate W processed in the application module 401. The first cooling chamber 530 has a structure similar to the cooling chamber 350 of the first buffer module 300. The edge exposure chamber 550 exposes its edge to the substrates W that have undergone the cooling process in the first cooling chamber 530. [ The buffer 520 temporarily stores the substrate W before the substrates W processed in the edge exposure chamber 550 are transported to a preprocessing module 601 described later. The second cooling chamber 540 cools the substrates W before the processed substrates W are transferred to the developing module 402 in the post-processing module 602 described later. The second buffer module 500 may further have a buffer added to the height corresponding to the development module 402. In this case, the substrates W processed in the post-processing module 602 may be temporarily stored in the added buffer and then conveyed to the developing module 402.

The pre- and post-exposure processing module 600 may process a process of applying a protective film for protecting the photoresist film applied to the substrate W during liquid immersion exposure, when the exposure apparatus 900 performs the liquid immersion exposure process. In addition, the pre- and post-exposure processing module 600 may perform a process of cleaning the substrate W after exposure. In addition, when the coating process is performed using the chemically amplified resist, the pre- and post-exposure processing module 600 can process the post-exposure bake process.

The pre-exposure post-processing module 600 has a pre-processing module 601 and a post-processing module 602. The pre-processing module 601 performs a process of processing the substrate W before the exposure process, and the post-process module 602 performs a process of processing the substrate W after the exposure process. The pre-processing module 601 and the post-processing module 602 are arranged so as to be partitioned into layers with respect to each other. According to one example, the preprocessing module 601 is located on top of the post-processing module 602. The preprocessing module 601 is provided at the same height as the application module 401. The post-processing module 602 is provided at the same height as the developing module 402. The preprocessing module 601 has a protective film application unit 610, a bake unit 620, and a transfer chamber 630. The protective film application unit 610, the transfer chamber 630, and the bake unit 620 are sequentially disposed along the second direction 14. [ The protective film applying unit 610 and the bake unit 620 are positioned apart from each other in the second direction 14 with the transfer chamber 630 therebetween. A plurality of protective film application units 610 are provided, and are arranged along the third direction 16 to form a layer with each other. Alternatively, a plurality of protective film application units 610 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of bake units 620 are provided and are disposed along the third direction 16 to form layers. Alternatively, the plurality of bake units 620 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 630 is positioned in parallel with the first cooling chamber 530 of the second buffer module 500 in the first direction 12. In the transfer chamber 630, a pre-processing robot 632 is located. The transfer chamber 630 has a generally square or rectangular shape. The preprocessing robot 632 is connected between the protective film application units 610, the bake units 620, the buffer 520 of the second buffer module 500 and the first buffer 720 of the interface module 700, The substrate W is transferred. The preprocessing robot 632 has a hand 633, an arm 634, and a support 635. The hand 633 is fixed to the arm 634. The arm 634 is provided with a retractable structure and a rotatable structure. The arm 634 is coupled to the support 635 so as to be linearly movable along the support 635 in the third direction 16.

The protective film coating unit 610 applies a protective film for protecting the resist film on the substrate W during liquid immersion exposure. The protective film application unit 610 has a housing 611, a support plate 612, and a nozzle 613. The housing 611 has a cup shape with its top opened. The support plate 612 is located in the housing 611 and supports the substrate W. [ The support plate 612 is rotatably provided. The nozzle 613 supplies a protective liquid for forming a protective film onto the substrate W placed on the supporting plate 612. The nozzle 613 has a circular tube shape and can supply the protective liquid to the center of the substrate W. [ Alternatively, the nozzle 613 may have a length corresponding to the diameter of the substrate W, and the discharge port of the nozzle 613 may be provided with a slit. In this case, the support plate 612 may be provided in a fixed state. The protective liquid includes a foamable material. The protective liquid may be a photoresist and a material having a low affinity for water. For example, the protective liquid may contain a fluorine-based solvent. The protective film applying unit 610 supplies the protective liquid to the central region of the substrate W while rotating the substrate W placed on the supporting plate 612. [

The bake unit 620 heat-treats the substrate W coated with the protective film. The bake unit 620 has a cooling plate 621 or a heating plate 622. The cooling plate 621 is provided with a cooling means 623 such as a cooling water or a thermoelectric element. Or heating plate 622 is provided with a heating means 624, such as a hot wire or a thermoelectric element. The heating plate 622 and the cooling plate 621 may be provided in a single bake unit 620, respectively. Optionally, some of the bake units 620 may include only the heating plate 622, while others may only include the cooling plate 621.

The post-processing module 602 has a cleaning chamber 660, a post-exposure bake unit 670, and a delivery chamber 680. The cleaning chamber 660, the transfer chamber 680, and the post-exposure bake unit 670 are sequentially disposed along the second direction 14. Therefore, the cleaning chamber 660 and the post-exposure bake unit 670 are positioned apart from each other in the second direction 14 with the transfer chamber 680 therebetween. A plurality of cleaning chambers 660 are provided and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of cleaning chambers 660 may be provided in the first direction 12 and the third direction 16, respectively. A plurality of post-exposure bake units 670 are provided, and may be disposed along the third direction 16 to form layers. Alternatively, a plurality of post-exposure bake units 670 may be provided in the first direction 12 and the third direction 16, respectively.

The transfer chamber 680 is positioned in parallel with the second cooling chamber 540 of the second buffer module 500 in the first direction 12 as viewed from above. The transfer chamber 680 has a generally square or rectangular shape. A post processing robot 682 is located in the transfer chamber 680. The post-processing robot 682 is connected to the cleaning chambers 660, the post-exposure bake units 670, the second cooling chamber 540 of the second buffer module 500, and the second And transfers the substrate W between the buffers 730. The postprocessing robot 682 provided in the postprocessing module 602 may be provided with the same structure as the preprocessing robot 632 provided in the preprocessing module 601. [

The cleaning chamber 660 cleans the substrate W after the exposure process. The cleaning chamber 660 has a housing 661, a support plate 662, and a nozzle 663. The housing 661 has a cup shape with an open top. The support plate 662 is located in the housing 661 and supports the substrate W. [ The support plate 662 is rotatably provided. The nozzle 663 supplies the cleaning liquid onto the substrate W placed on the support plate 662. As the cleaning liquid, water such as deionized water may be used. The cleaning chamber 660 supplies the cleaning liquid to the central region of the substrate W while rotating the substrate W placed on the support plate 662. Optionally, while the substrate W is rotating, the nozzle 663 may move linearly or rotationally from the central region of the substrate W to the edge region.

The post-exposure bake unit 670 uses the deep ultraviolet light to heat the substrate W subjected to the exposure process. The post-exposure baking step heats the substrate W and amplifies the acid generated in the photoresist by exposure to complete the property change of the photoresist. The post-exposure bake unit 670 has a heating plate 672. The heating plate 672 is provided with a heating means 674 such as a hot wire or a thermoelectric element. The post-exposure bake unit 670 may further include a cooling plate 671 therein. The cooling plate 671 is provided with a cooling means 673 such as a cooling water or a thermoelectric element. Further, a bake unit having only a cooling plate 671 may be further provided.

As described above, the pre-processing module 601 and the post-processing module 602 in the pre-exposure processing module 600 are provided to be completely separated from each other. The transfer chamber 630 of the preprocessing module 601 and the transfer chamber 680 of the postprocessing module 602 are provided in the same size and can be provided so as to completely overlap each other when viewed from above. In addition, the protective film application unit 610 and the cleaning chamber 660 may be provided to have the same size as each other and be provided so as to completely overlap each other when viewed from above. In addition, the bake unit 620 and the post-exposure bake unit 670 are provided in the same size and can be provided so as to completely overlap each other when viewed from above.

The interface module 700 transfers the substrate W between the exposure pre- and post-processing module 600 and the exposure apparatus 900. The interface module 700 has a frame 710, a first buffer 720, a second buffer 730, and an interface robot 740. The first buffer 720, the second buffer 730, and the interface robot 740 are located within the frame 710. The first buffer 720 and the second buffer 730 are spaced apart from each other by a predetermined distance and are stacked on each other. The first buffer 720 is disposed higher than the second buffer 730. The first buffer 720 is positioned at a height corresponding to the preprocessing module 601 and the second buffer 730 is positioned at a height corresponding to the postprocessing module 602. The first buffer 720 is arranged in a line along the first direction 12 with the transfer chamber 630 of the preprocessing module 601 while the second buffer 730 is arranged in the postprocessing module 602, Are arranged in a line along the first direction 12 with the transfer chamber 630 of the transfer chamber 630. [

The interface robot 740 is spaced apart from the first buffer 720 and the second buffer 730 in the second direction 14. The interface robot 740 carries the substrate W between the first buffer 720, the second buffer 730 and the exposure apparatus 900. The interface robot 740 has a structure substantially similar to that of the second buffer robot 560.

The first buffer 720 temporarily stores the substrates W processed in the preprocessing module 601 before they are transferred to the exposure apparatus 900. The second buffer 730 temporarily stores the processed substrates W in the exposure apparatus 900 before they are transferred to the post-processing module 602. The first buffer 720 has a housing 721 and a plurality of supports 722. The supports 722 are disposed within the housing 721 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 722. The housing 721 is movable in the direction in which the interface robot 740 is provided and in the direction in which the interface robot 740 and the preprocessing robot 632 transfer the substrate W to and from the support table 722, 632 are provided with openings (not shown) in the direction in which they are provided. The second buffer 730 has a structure substantially similar to that of the first buffer 720. However, the housing 4531 of the second buffer 730 has an opening (not shown) in the direction in which the interface robot 740 is provided and in a direction in which the postprocessing robot 682 is provided. The interface module may be provided with only the buffers and robots as described above without providing a chamber for performing a predetermined process on the substrate.

1320: Support plate 1320a:
1322: lift hole 1324: insertion groove
1326: vacuum hole 1330: interspace
1342: lift pin 1420: heater
1600: Decompression unit 1720: Support pin
1740: elastic member

Claims (15)

A substrate supporting unit for supporting a substrate,
A support plate having a seating surface on which the substrate is placed;
A decompression unit for decompressing a space between the substrate placed on the seating surface and the seating surface;
And a pin member disposed in the insertion groove formed in the seating surface,
The pin member
A support pin for supporting the substrate;
And an elastic member coupled to the support pin. The method according to claim 1,
The support pin can be lowered by the decompression of the space,
And is capable of being raised and lowered by the elastic force of the elastic member. 3. The method of claim 2,
Wherein the elastic force is smaller than the depressurizing pressure of the decompression unit and larger than the weight of the substrate placed on the seating surface. The method according to claim 2 or 3,
Wherein the support pin is provided to be movable between a protruding position where an upper end is positioned higher than the seating surface and an insertion position where an upper end is positioned at the same or lower than the seating surface. 4. The method according to any one of claims 1 to 3,
The vacuum unit further includes a vacuum line connected to a vacuum hole provided in the support plate,
And the vacuum hole is located apart from the insertion groove. 4. The method according to any one of claims 1 to 3,
Wherein the decompression unit includes a vacuum line connected to the insertion groove. 5. The method of claim 4,
The unit comprises:
Further comprising a lift member for moving the substrate up and down,
The lift member
A lift pin located in a lift hole formed in the seating surface;
And a driving member for moving the lift pin between a lift position higher than the protruding position and a lower position where the upper end is positioned at the same or lower than the seating surface. An apparatus for heat-treating a substrate,
A support plate having a seating surface on which the substrate is placed;
A heater provided on the support plate for heating the support plate;
A decompression unit for decompressing a space between the substrate placed on the seating surface and the seating surface;
And a pin member disposed in the insertion groove formed in the seating surface,
The pin member
A support pin for supporting the substrate;
And an elastic member coupled to the support pin. 9. The method of claim 8,
The support pin can be lowered by the decompression of the space,
Wherein the elastic member is provided so as to be able to move up and down by an elastic force of the elastic member,
Wherein the elastic force is smaller than the depressurizing pressure of the decompression unit and larger than the weight of the substrate placed on the seating surface. 10. The method according to claim 8 or 9,
The apparatus comprises:
Further comprising a guide having a ring shape surrounding the seating surface, the guide being located on the upper surface of the support plate. 10. A method of processing a substrate using the apparatus of claim 8,
A first descending step in which a lift pin protruding from the seating surface moves down while supporting the substrate;
Heating the substrate by holding the substrate in a state that the support pin projected from the seating surface receives the substrate from the lift pin and protrudes;
A second descending step of depressurizing the space to bring the substrate into close contact with the seating surface;
And a processing step of heating the substrate adhered to the seating surface to a processing temperature. 12. The method of claim 11,
Wherein the second descending step proceeds when the substrate reaches the preheating temperature in the preheating step. 13. The method of claim 12,
And the temperature of the heater is the same in the preheating step and the processing step. 14. The method according to any one of claims 11 to 13,
A first elevating step of removing the decompression to lift the substrate from the seating surface when the processing step is completed;
And a second lift step in which the lift pin is lifted and lowered so as to receive the substrate from the support pin. 10. A method of processing a substrate using the apparatus of claim 8,
A processing step of heating the substrate adhered to the seating surface to a process temperature;
A first elevating step of removing the decompression to lift the substrate from the seating surface by the support pin;
And a second lift step in which a lift pin located in the support plate protrudes and is lifted and lowered to receive the substrate from the support pin.

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