CN205077131U - High flux composite material chip precursor deposition equipment - Google Patents
High flux composite material chip precursor deposition equipment Download PDFInfo
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- CN205077131U CN205077131U CN201520821634.3U CN201520821634U CN205077131U CN 205077131 U CN205077131 U CN 205077131U CN 201520821634 U CN201520821634 U CN 201520821634U CN 205077131 U CN205077131 U CN 205077131U
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Abstract
The utility model relates to a high flux composite material chip precursor deposition equipment, including the target frame, install at target on openly of target frame, install permanent magnet, the relative substrate that sets up with the target on the target back, can cover mask on the substrate, be used for placing the platform, being used for the drive to place the drive arrangement of platform rotation and removal of substrate. The installation position that has a plurality of installation targets on the target frame. Equipment structure has been simplified, the consumption is little to gradient deposit or sequential aggradation that this high flux composite material chip precursor deposition equipment utilized a plurality of targets to pass through the different component materials of magnetron sputtering coating film technology, and the consumptive material is little, and the repeatability of technology improves and easy maintenance. Simultaneously this high flux composite material chip precursor deposition equipment can control monolayer material deposition thickness under atomic scale, conveniently realize multiple material atomic scale under the homogeneous mixing widened the application equipment scope.
Description
Technical field
The utility model relates to combinatorial material chip approach field, particularly a kind of high-throughput combined material chip presoma depositing device.
Background technology
Material is the basis of modern industry, and along with the development of science and technology, the research and development speed of novel material can not meet the active demand of contemporary industry development to novel material gradually in recent years.Since the nineties in last century, the inspiration that the people such as the Xiang Xiaodong in Lawrence Berkeley National laboratory are developed by biogene chip and large-scale integrated circuit, has developed high-throughput combinatorial material chip approach.The essence of high-throughput combinatorial material chip approach is that integrated Growth and characterization reaches 10 on one piece of substrate
8the material sample of individual different components, this technology changes the method for traditional material test " trial and error ", accelerates the research and development process of novel material greatly.The first-generation high-throughput combined material chip Preparation equipment of the people such as Xiang Xiaodong exploitation is by preparing chamber and adapter cavity forms, adopt ionic fluid or laser as material deposition source, deposition of material and situ heat treatment process can be completed in a vacuum, on 1 inch substrate, 2 can be deposited at most in conjunction with discrete mask plate
10the sample of individual different components.This equipment greatly improves flux prepared by material sample, and the people such as Xiang Xiaodong use this equipment to carry out the novel material rapid screening of the material system such as superconducting material, phase change material, and filters out a series of novel material with premium properties.
Be in the Chinese invention patent application " a kind of high-throughput composition material preparation facilities and preparation method " of CN104404468A (application number is 201410734080.3) at Authorization Notice No., disclose a kind of high-throughput composition material preparation facilities, this device comprises preparation chamber, storage target chamber, changes target chamber, situ heat treatment chamber, sample adapter cavity, prepare to the combined material chip of sample thermal treatment whole process from target replacing, deposition of material under can realizing vacuum, avoid the pollution causing sample under sample is exposed to atmospheric environment.This device adopts ion beam sputtering method to complete combined material chip presoma deposition, although ion source operates the preparation that comparatively simple, prepared sample repeatability is better, be suitable for high quality thin film, but equipment itself is safeguarded comparatively complicated, and expensive, market acceptance level is lower.Such as, ion beam sputtering deposition can only complete a kind of sputtering of target simultaneously, therefore for multilayer film sample preparation, the deposition completing every layer material all needs the target more renewed, complicated operation, and experiment elapsed time is long, and service efficiency is low.Meanwhile, the realization of ion beam sputtering deposition places one's entire reliance upon ionogenic steady operation, and namely the every 10-20 of usual equipment work hour needs to safeguard, clean or change ion source and parts thereof to ion source, limits the use field of equipment and accepts scope.
Compare ion beam sputtering technology, magnetic-controlled sputtering coating equipment maintenance is more simple, development is more ripe, although use through long-time, the homogeneity of prepared film can be subject to the impact of target etched area, but can alleviate by regulating the methods such as Distribution of Magnetic Field, increase uniform slab, change depositional mode.As far back as the seventies in last century, magnetron sputtering technique is just used to the preparation of high-throughput sample, but the past is all the mode taking many targets magnetic control co-sputtering, the method accurately can not control often kind of raw material in the on-chip regularity of distribution, therefore directly cannot complete the linear gradient distribution of different components material, also need extra composition to characterize the regularity of distribution determining heterogeneity material, while reducing high-throughput conventional efficient, the covering in complete multicomponent material space can not be realized.
Utility model content
Technical problem to be solved in the utility model provides a kind of structure simple for above-mentioned prior art, applied range, and do not need to carry out extra target replacement operation, just can realize the high-throughput combined material chip presoma depositing device that plurality of raw materials is prepared according to the different components regularity of distribution.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of high-throughput combined material chip presoma depositing device, is characterized in that comprising:
Target frame, the front of described target frame has multiple installation position can installing target;
Target, comprises at least one, is arranged on the installation position of described target frame;
Set of permanent magnets, is arranged in described target frame, has multiple permanent magnet in described set of permanent magnets, and multiple described permanent magnet corresponds to described installation position and is arranged on the back side of described target, to adjust etched area length on target and etched area shape;
Substrate, is oppositely arranged, for deposition material with described target;
Mask, can cover on the substrate;
Mounting table, for placing substrate;
Drive unit, carries out for driving described mounting table rotating and moving.
Easily, high-throughput combined material chip presoma depositing device also comprises the mask more changing device for driving and change described mask.
In order to regulate the sputtering effect of target, high-throughput combined material chip presoma depositing device also comprises division board for isolating target and for regulating the regulating mechanism of deposition of material speed; Described division board to be connected on described target frame and to be arranged between two adjacent installation positions.
Selectively, described regulating mechanism comprises the exit slit device that can regulate material deposition rate and/or the shield that can regulate deposition of material scope;
Described slit arrangement covers and is arranged on the front of described target, described slit arrangement has a broad-adjustable slit;
Described shield is arranged on the side in described target front.
Preferably, described drive unit comprises the rotating mechanism for driving described mounting table to rotate and the transmission rig for driving mounting table and rotating mechanism to carry out two dimensional surface movement;
Described rotating mechanism is arranged on below described mounting table, and described transmission rig is arranged below described rotating mechanism.
Preferably, the multiple installation positions on described target frame are array distribution.
Compared with prior art, the utility model has the advantage of: high-throughput combined material chip presoma depositing device in the utility model, by target frame arranges multiple target, thus utilize magnetron sputtering technology can realize the gradient deposition of different components material, the depositional mode that sequential aggradation etc. are different, simplify the structure of high-throughput combined material chip Preparation equipment, make the power consumption needed for whole preparation process little, the consumption of target is also reduced greatly, improve the repeatability of technique, simultaneously convenient to the maintenance of combined material chip presoma deposition apparatus.This high-throughput combined material chip presoma depositing device can control monolayer material deposit thickness under atomic scale simultaneously, conveniently realize Homogeneous phase mixing under multiple material atomic scale, the realization of the amorphous mixtures in combined material chip preparation process can be completed, avoid thermodynamics window in conventional combination material chip preparation method and, to the restriction of diffusion heat treatments process, widen the range of application of this high-throughput combined material chip presoma depositing device.
Accompanying drawing explanation
Fig. 1 is high-throughput combined material chip presoma depositing device structural representation in the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
As shown in Figure 1, the high-throughput combined material chip presoma depositing device in the present embodiment, comprises target frame 1, target 2, set of permanent magnets 11, substrate 3, mask 4, mounting table 5, drive unit, mask more changing device 41, division board 6, regulating mechanism.
Target frame 1 has multiple installation position can installing target 2, the plurality of installation position is the front of array distribution at target frame 1.During use, according to the needs of deposition material, multiple simple substance target can be used, as required these simple substance targets are arranged on the specific installation position of target frame 1 respectively.Similar with existing general magnetic control sputtering device, set of permanent magnets 11 is provided with in target frame 1, in this set of permanent magnets 11, there is multiple permanent magnet, the plurality of permanent magnet corresponds respectively to the back side that installation position is arranged in target 2, for controlling the even etched area length formed on target 1 on the direction perpendicular with substrate 3 travel direction.Etched area length can change by regulating the regularity of distribution of each permanent magnet and the size of target 2 in set of permanent magnets 11 according to the difference of combined material chip size.In the present embodiment, can with on the perpendicular direction of substrate 12 travel direction, material deposition rate be identical by regulating the regularity of distribution of permanent magnet and the size of target 2 to ensure.
Mounting table 5 can place substrate 3, and mask 4 covers on substrate 3 as requested.After placement, substrate 3 and target 2 are oppositely arranged.During use, mask 4 can use mobile mask or discrete mask as required.When using discrete mask, then can place multiple mask 4 on mounting table 5, thus the replacing of mask 4 can be carried out as required.Replacing based on multiple different mask 4 requires to arrange mask more changing device 41, and this mask more changing device 41 can be arranged on mounting table 18 or other positions.As a mechanical manipulator can be installed as mask more changing device 41 on mounting table 18, carried out the replacing of different mask 4 by mechanical manipulator, and then mask 4 is covered as requested the top of substrate 3.
Conveniently realize substrate 3 rotation and movement, drive unit comprises the rotating mechanism 91 for driving mounting table 5 to rotate and the transmission rig 92 for driving mounting table 5 and rotating mechanism 91 to carry out two dimensional surface movement.Rotating mechanism 91 is arranged on below mounting table 5, and transmission rig 92 is arranged below rotating mechanism 91.Operationally, rotating mechanism 91 drives mounting table 5 to rotate, and then under the drive of mounting table 5, realizes the rotation of substrate 3.Transmission rig 92 can drive mounting table 5 to move in orthogonal both direction, and then realizes the movement of substrate 3 on two dimensional surface.
Division board 6 to be connected on target frame 1 and to be arranged between two adjacent installation positions, and during use, division board 6 can avoid influencing each other between adjacent target 2.
As required, regulating mechanism can be set to cover the exit slit device 7 be arranged on target 2 front, also can be set to the shield 8 being arranged on side, target 2 front.Regulating mechanism in the present embodiment comprises exit slit device 7 and shield 8 simultaneously, and shield 8 is arranged on the front end of exit slit device 7.Wherein exit slit device 7 having a broad-adjustable slit 71, during use, by regulating target 2 power and slit 71 width, and then the sedimentation rate of material can be regulated.And shield 8 by the difference of adjustable inclined surface apparatus inclination angle size to regulate the scope of deposition of material, thus can play the adjustment to institute's deposition material thickness on substrate 3.By the regulating effect of regulating mechanism, the thickness that can control deposition material on substrate 3 changes to micron dimension monatomic.
Utilize high-throughput combined material chip presoma depositing device in the present embodiment, the preparation method of the combined material chip drawn for iron-cobalt-nickel ternary material phasor is described high-throughput combined material chip preparation method.
The presoma deposition method of the combined material chip that this iron-cobalt-nickel ternary material phasor is drawn specifically comprises the following steps:
Step one, be arranged on as the deposition iron of raw material, cobalt, nickel three kinds of element simple substance targets 2 respectively on the installation position of setting on target frame 1, on target frame 1, the permanent magnet 11 of arranged distribution can make etched area length on target be greater than 100mm;
Substrate 3 in the present embodiment is in equilateral triangle, the equilateral triangle substrate 3 circumcircle being of a size of three inches is placed on mounting table 5, ensure that summit in the substrate 3 of equilateral triangle parallels to the vertical line of this summit opposite side with the travel direction of substrate 3, and this summit is positioned at the front end of travel direction;
Usually carry out in vacuum environment in the deposition process of high-throughput combined material chip presoma, in the present embodiment, above-mentioned mounted high-throughput combined material chip presoma depositing device is placed in vacuum chamber, and in vacuum chamber, Ar gas is passed on the basis continuing to vacuumize, make the air pressure in vacuum chamber remain on 0.1-5Pa, require to keep passing into and vacuumizing work of Ar gas according to air pressure like this;
Step 2, open target 2 shielding power supply, target 2 is adjusted to normal ignition phase;
Require in step 3, the present embodiment that iron, cobalt, nickel three kinds of materials realize gradient linearity deposition successively in order on substrate 3, therefore according to the regularity of distribution of pre-designed iron, cobalt, nickel three kinds of materials and sedimentary sequence, substrate 3 at the uniform velocity moves through the below of each target 2 successively, utilize the preparation technology of magnetron sputtering to complete the deposition of iron on substrate 3, cobalt, nickel three kinds of constituent materialss, detailed process is as follows:
As required mask more changing device 41 work, mask 4 is moved to the top of substrate 3, makes mask 4 cover part substrate 3;
Shield 8 angle of adjustment iron simple substance generated beneath, slit 71 width of the exit slit device 7 regulating iron simple substance target power and iron simple substance target to cover, and then regulate the sedimentation rate of iron on substrate 3 for setting speed
In magnetron sputtering process, mounting table 5 is driven by transmission rig 92, thus drive substrate 3 to move through iron simple substance generated beneath relative to iron simple substance target with at the uniform velocity v1 (v1>0), in the process, mask 4 keeps static relative to substrate 3, and then the depositing time controlling material iron not masked 4 part any point of blocking on substrate 3 is t1, the deposit thickness of material iron controls at 2 ~ 3nm the most at last;
Utilize rotating mechanism 91 to drive mounting table 5 to rotate, thus drive substrate 3 relative to the clockwise rotation of original position 120 degree, keep mask 4 to be still in original position constant simultaneously;
Adjust the shield 8 of cobalt simple substance generated beneath, slit 71 width of the exit slit device 7 regulating cobalt simple substance target power and cobalt simple substance target to cover, and then regulate the sedimentation rate of cobalt on substrate 3 for setting speed
in magnetron sputtering process, mounting table 5 is driven by transmission rig 92, thus drive substrate 3 to move through cobalt simple substance generated beneath relative to cobalt simple substance target with at the uniform velocity v2 (v2>0), in the process, mask 4 keeps static relative to substrate 3, and then the depositing time controlling material cobalt not masked 4 part any point of blocking on substrate 3 is t2, the deposit thickness of material cobalt controls at 2 ~ 3nm the most at last;
Utilize rotating mechanism 91 to drive mounting table 5 to rotate, thus drive substrate 3 to continue to be rotated in a clockwise direction 120 degree relative to original position, keep mask 4 to be still in original position constant simultaneously;
Adjust the shield 8 of nickel simple substance generated beneath, slit 71 width of the exit slit device 7 regulating nickel simple substance target power and nickel simple substance target to cover, and then regulate the sedimentation rate of nickel on substrate 3 for setting speed
in magnetron sputtering process, mounting table 5 is driven by transmission rig 92, thus drive substrate 3 to move through cobalt simple substance generated beneath relative to nickel simple substance target with at the uniform velocity v3 (v3>0), in the process, mask 4 keeps static relative to substrate 3, and then the depositing time controlling material nickel not masked part any point of blocking on substrate 3 is t3, the deposit thickness of material cobalt controls at 2 ~ 3nm the most at last;
In this step, different or the monolayer material thickness distribution difference of the every layer material thickness of the translational speed of substrate under each simple substance target needed for actual experiment can adjust accordingly, namely this substrate carries out deposition of material under staticly can being placed on each simple substance target, also can at the uniform velocity or speed change pass through under each simple substance target;
Step 4, now substrate 3 move to final position from zero position, mounting table 5 is driven to reset to starting position by transmission rig 92, substrate 3 continues rotation along clockwise direction 120 degree under the driving of rotating mechanism 91, thus substrate 3 is returned to original position;
When needs change mask 4, utilize the mask mask 4 that more more renews of changing device 41, then utilize mask more changing device adjustment mask 4 be positioned at the position required above substrate 3;
When not needing to carry out mask 4 and changing, namely in case of the present embodiment, directly utilize mask more changing device 41 drive mask 4 above substrate 3, move the distance of setting along the working direction of substrate 3;
Step 5, return step 3 and carry out cycle operation, until the deposit film total thickness of iron, cobalt, nickel three kinds of materials reaches setting thickness on substrate 3, when the deposit film cumulative thickness of iron, cobalt, nickel three kinds of materials reaches about 100nm on substrate 3 in the present embodiment, namely form high-throughput combined material chip presoma.
The combined material chip presoma prepared in this step carries out depositing according to the order of iron, cobalt, nickel successively and achieves three kinds of constituent materialss and deposits at on-chip gradient linearity.In actual applications, then adaptive adjustment can be carried out according to concrete distribution of material rule specific aim to the sedimentary sequence of material and depositional mode.
By the high-throughput combined material chip presoma that this high-throughput combined material chip presoma deposition method is made, the thickness superposed due to the intersection of iron, cobalt, nickel three kinds of materials is thin, stacking fold is many, be conducive to realizing the material mixing under iron, cobalt, nickel three kinds of material atom yardsticks, mixing is more abundant, and energy consumption is low.
Claims (6)
1. a high-throughput combined material chip presoma depositing device, is characterized in that comprising:
Target frame (1), the front of described target frame (1) has multiple installation position can installing target (2);
Target (2), comprises at least one, is arranged on the installation position of described target frame (1);
Set of permanent magnets (11), be arranged in described target frame (1), described set of permanent magnets has multiple permanent magnet in (11), multiple described permanent magnet corresponds to described installation position and is arranged on the back side of described target (2), to adjust etched area length on target (2) and etched area shape;
Substrate (3), is oppositely arranged, for deposition material with described target (2);
Mask (4), can cover on described substrate (3);
Mounting table (5), for placing substrate (3);
Drive unit, carries out rotating and moving for driving described mounting table (5).
2. high-throughput combined material chip presoma depositing device according to claim 1, is characterized in that: also include the mask more changing device (41) for changing described mask (4).
3. high-throughput combined material chip presoma depositing device according to claim 1, is characterized in that: also comprise division board (6) for isolating target (2) and for regulating the regulating mechanism of deposition of material speed; Described division board (6) is connected to described target frame (1) and goes up and be arranged between two adjacent installation positions.
4. high-throughput combined material chip presoma depositing device according to claim 3, is characterized in that: described regulating mechanism comprises the exit slit device (7) that can regulate material deposition rate and/or the shield (8) that can regulate deposition of material scope;
Described slit arrangement (7) covers and is arranged on the front of described target (2), described slit arrangement (7) has a broad-adjustable slit (71);
Described shield (8) is arranged on the side in described target (2) front.
5. high-throughput combined material chip presoma depositing device according to claim 1, is characterized in that: described drive unit comprises the rotating mechanism (91) for driving described mounting table (5) to rotate and the transmission rig (92) for driving mounting table (5) and rotating mechanism (91) to carry out two dimensional surface movement;
Described rotating mechanism (91) is arranged on described mounting table (5) below, and described transmission rig (92) arranges described rotating mechanism (91) below.
6. high-throughput combined material chip presoma depositing device according to claim 1, is characterized in that: the multiple installation positions on described target frame (1) are array distribution.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520821634.3U CN205077131U (en) | 2015-10-22 | 2015-10-22 | High flux composite material chip precursor deposition equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520821634.3U CN205077131U (en) | 2015-10-22 | 2015-10-22 | High flux composite material chip precursor deposition equipment |
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| CN205077131U true CN205077131U (en) | 2016-03-09 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105154843A (en) * | 2015-10-22 | 2015-12-16 | 宁波英飞迈材料科技有限公司 | High-flux composite material chip precursor deposition device and deposition method |
| CN108179384A (en) * | 2017-12-25 | 2018-06-19 | 浙江工业大学 | A kind of preparation method of surface graded film |
| CN109355621A (en) * | 2018-12-21 | 2019-02-19 | 张晓军 | It is a kind of to match controllable large area high throughput laminated film synthesizer and method |
| CN110616406A (en) * | 2018-11-29 | 2019-12-27 | 爱发科豪威光电薄膜科技(深圳)有限公司 | Magnetron sputtering coating machine |
| CZ309261B6 (en) * | 2020-12-18 | 2022-06-29 | Fyzikální ústav AV ČR, v. v. i | Thin optical semiconducting film, producing it, equipment for producing this layer and reading devices |
| TWI784332B (en) * | 2020-10-23 | 2022-11-21 | 大陸商業成科技（成都）有限公司 | Sputtering system |
| CN116770222A (en) * | 2022-03-09 | 2023-09-19 | 上海集成电路材料研究院有限公司 | High-flux film deposition equipment, etching equipment and method thereof |
-
2015
- 2015-10-22 CN CN201520821634.3U patent/CN205077131U/en not_active Withdrawn - After Issue
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105154843A (en) * | 2015-10-22 | 2015-12-16 | 宁波英飞迈材料科技有限公司 | High-flux composite material chip precursor deposition device and deposition method |
| CN105154843B (en) * | 2015-10-22 | 2017-12-15 | 宁波英飞迈材料科技有限公司 | High flux combined material chip presoma depositing device and its deposition process |
| CN108179384A (en) * | 2017-12-25 | 2018-06-19 | 浙江工业大学 | A kind of preparation method of surface graded film |
| CN108179384B (en) * | 2017-12-25 | 2020-08-18 | 浙江工业大学 | Preparation method of surface gradient film |
| CN110616406A (en) * | 2018-11-29 | 2019-12-27 | 爱发科豪威光电薄膜科技(深圳)有限公司 | Magnetron sputtering coating machine |
| CN109355621A (en) * | 2018-12-21 | 2019-02-19 | 张晓军 | It is a kind of to match controllable large area high throughput laminated film synthesizer and method |
| CN109355621B (en) * | 2018-12-21 | 2024-03-22 | 深圳市矩阵多元科技有限公司 | Large-area high-flux composite film synthesizing device and method with controllable proportion |
| TWI784332B (en) * | 2020-10-23 | 2022-11-21 | 大陸商業成科技（成都）有限公司 | Sputtering system |
| CZ309261B6 (en) * | 2020-12-18 | 2022-06-29 | Fyzikální ústav AV ČR, v. v. i | Thin optical semiconducting film, producing it, equipment for producing this layer and reading devices |
| CN116770222A (en) * | 2022-03-09 | 2023-09-19 | 上海集成电路材料研究院有限公司 | High-flux film deposition equipment, etching equipment and method thereof |
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