CN110581144A - 薄膜晶体管组件、阵列基板和显示面板 - Google Patents

薄膜晶体管组件、阵列基板和显示面板 Download PDF

Info

Publication number
CN110581144A
CN110581144A CN201910887397.3A CN201910887397A CN110581144A CN 110581144 A CN110581144 A CN 110581144A CN 201910887397 A CN201910887397 A CN 201910887397A CN 110581144 A CN110581144 A CN 110581144A
Authority
CN
China
Prior art keywords
thin film
film transistor
substrate
source electrode
display panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910887397.3A
Other languages
English (en)
Other versions
CN110581144B (zh
Inventor
任艳伟
唐乌力吉白尔
李晓光
徐敬义
王跃林
贾磊
于亚楠
智国磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201910887397.3A priority Critical patent/CN110581144B/zh
Publication of CN110581144A publication Critical patent/CN110581144A/zh
Priority to US16/825,006 priority patent/US11201179B2/en
Application granted granted Critical
Publication of CN110581144B publication Critical patent/CN110581144B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78633Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with a light shield
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • H01L27/1225Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725Source or drain electrodes for field effect devices
    • H01L29/41733Source or drain electrodes for field effect devices for thin film transistors with insulated gate

Abstract

本发明提供了薄膜晶体管组件、阵列基板和显示面板。薄膜晶体管组件包括:设置在衬底上的第一薄膜晶体管和第二薄膜晶体管,其中,第一薄膜晶体管包括第一源极、第一漏极和第一有源层,第二薄膜晶体管包括第二源极和第二漏极,第一源极设置在第一有源层靠近衬底的一侧,第一漏极设置在第一有源层远离衬底的一侧,第二源极和第二漏极与第一漏极同层设置,且第一源极在衬底上的正投影和第二源极在衬底上的正投影有重叠区域。由此,本发明的薄膜晶体管组件可以大大缩小其平面占用面积,所以当其应用于显示面板时,可以有效减少遮挡薄膜晶体管的黑矩阵的面积,进而提升显示面板的开口率,即提高显示面板的光透过率,从而提高显示面板的显示亮度。

Description

薄膜晶体管组件、阵列基板和显示面板
技术领域
本发明涉及显示技术领域,具体的,涉及薄膜晶体管组件、阵列基板和显示面板。
背景技术
显示面板(panel)的透过率时影响显示装置显示效果的重要因素,但是由于显示面板的布线等局限性,不能够提高更好的提升显示面板的光透过率,从而导致显示面板整体亮度不足。
因此,关于显示面板的光透过率的提升有待深入研究。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此,本发明的一个目的在于提出一种薄膜晶体管组件,高薄膜晶体管组件可以有效提升使用该薄膜晶体管组件的显示面板的光透过率,提升显示面板的亮度。
在本发明的一个方面,本发明提供了一种薄膜晶体管组件。根据本发明的实施例,所述薄膜晶体管组件包括:设置在衬底上的第一薄膜晶体管和第二薄膜晶体管,其中,所述第一薄膜晶体管包括第一源极、第一漏极和第一有源层,所述第二薄膜晶体管包括第二源极和第二漏极,所述第一源极设置在所述第一有源层靠近所述衬底的一侧,所述第一漏极设置在所述第一有源层远离所述衬底的一侧,所述第二源极和所述第二漏极与所述第一漏极同层设置,且所述第一源极在所述衬底上的正投影和所述第二源极在所述衬底上的正投影有重叠区域。由此,第一薄膜晶体管的第一源极和第一漏极分别设置在第一有源层的下方和上方,且第一源极在衬底上的正投影和第二源极在衬底上的正投影有重叠(即第一薄膜晶体管和第二薄膜晶体管交叉设置),如此,相比现有技术中不同薄膜晶体管之间间隔且无交叉设置的方式,本发明的薄膜晶体管组件可以大大缩小其平面占用面积,所以当其应用于显示面板时,可以有效减少遮挡薄膜晶体管的黑矩阵的面积,进而提升显示面板的开口率,即提高显示面板的光透过率,从而提高显示面板的显示亮度。
根据本发明的实施例,所述第二源极在所述衬底上的正投影覆盖所述第一源极在所述衬底上的正投影。
根据本发明的实施例,在所述第一薄膜晶体管和所述第二薄膜晶体管的分布方向上,所述第二源极设置在所述第一漏极和所述第二漏极之间。
根据本发明的实施例,所述第一薄膜晶体管和所述第二薄膜晶体管均为顶栅结构薄膜晶体管,或所述第一薄膜晶体管和所述第二薄膜晶体管均为底栅结构薄膜晶体管。
在本发明的另一方面,本发明提供了一种阵列基板。根据本发明的实施例,所述阵列基板包括前面所述的薄膜晶体管组件。由此,该阵列基板中的薄膜晶体管的占用平面面积较小,可以有效缩减显示面板中黑矩阵的设置面积,从而提升显示面板的开口率,进而提高显示面板的显示亮度。
根据本发明的实施例,所述阵列基板还包括:遮光层,所述遮光层与所述第一源极同层且间隔设置。
根据本发明的实施例,所述阵列基板包括阵列分布的多个子像素,相邻两列所述子像素构成一个像素组,相邻两个所述像素组之间不设有薄膜晶体管,每个所述像素组中,两列所述子像素之间具有第一间隙,相邻两行所述子像素之间具有第二间隙,所述第一间隙和所述第二间隙具有重叠区域,所述薄膜晶体管组件设置在所述重叠区域处。
根据本发明的实施例,围绕每个所述薄膜晶体管组件依次设置有且呈2*2矩阵分布的第一子像素、第三子像素、第二子像素和第四子像素,其中,所述薄膜晶体管组件中的第一薄膜晶体管与所述第一子像素电连接,所述薄膜晶体管组件中的第二薄膜晶体管与所述第二子像素电连接。
在本发明的又一方面,本发明提供了一种显示面板。根据本发明的实施例,所述显示面板包括:前面所述的阵列基板。由此,该显示面板的开口率较大,光透过率较高,可以有效提升显示面板的亮度。
根据本发明的实施例,所述显示面板还包括:多个第一黑矩阵,多个所述第一黑矩阵与所述阵列基板相对设置,且所述第一黑矩阵在所述衬底上的正投影覆盖第一薄膜晶体管和第二薄膜晶体管在所述衬底上的正投影,其中,所述第一黑矩阵的宽度为15~25微米。
根据本发明的实施例,所述显示面板还包括:多个第二黑矩阵,多个所述第二黑矩阵与所述第一黑矩阵同层设置,所述第二黑矩阵在所述衬底上的正投影与相邻两个像素组之间的间隙在所述衬底上的正投影有重叠区域,其中,所述第二黑矩阵的宽度为5~10微米。
附图说明
图1是现有技术中显示面板的结构示意图。
图2是本发明一个实施例中薄膜晶体管组件的结构示意图。
图3是本发明另一个实施例中薄膜晶体管组件的结构示意图。
图4是本发明又一个实施例中阵列基板的截面结构示意图。
图5是本发明又一个实施例中阵列基板的平面结构示意图。
图6是本发明又一个实施例中阵列基板的平面结构示意图。
图7是本发明又一个实施例中阵列基板的平面结构示意图。
图8是图7中薄膜晶体管组件的局部方法示意图。
图9是本发明又一个实施例中阵列基板的平面结构示意图。
图10是本发明又一个实施例中显示面板的平面结构示意图。
图11是本发明又一个实施例中显示面板的截面结构示意图。
图12是本发明又一个实施例中显示面板的平面结构示意图。
图13是本发明又一个实施例中显示面板的截面结构示意图。
具体实施方式
下面详细描述本发明的实施例。下面描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。实施例中未注明具体技术或条件的,按照本领域内的文献所描述的技术或条件或者按照产品说明书进行。
目前,为了提高显示面板的显示质量和显示亮度,通过会提高显示面板的开口率,而目前显示面板的设置方式如图1(图1中的(a)为截面图,图1中的(b)为平面图,平面图中没有示出各层绝缘层)所示,在基板1的一个表面设置遮光层2,在基板1的表面上设置覆盖遮光层2的第一绝缘层3,在第一绝缘层3远离基板的表面上设置有源层4,在第一绝缘层3远离基板1的表面上设置覆盖有源层4的第二绝缘层5,在第二绝缘层5远离基板1的表面上设置栅极6,在第二绝缘层5远离基板1的表面上设置覆盖栅极6的第三绝缘层7,在第三绝缘层7远离基板1的表面上设置源极8和漏极9,且源极8和漏极9分别通过过孔与有源层4电连接,发明人发现,上述结构的显示面板(相邻两列子像素110之间的间隙中仅仅设置控制其中一列子像素的薄膜晶体管)中的薄膜晶体管的设置面积依然较大,故而在彩膜基板中需要设置面积较大的黑矩阵01来遮挡薄膜晶体管,而导致显示面板的开口率提高有限,导致显示亮度较差。为了更进一步的提升显示面板的开口率,发明人对薄膜晶体管的设置方式进行改进,可以有效减小黑矩阵的设置面积。具体方案如下:
在本发明的一个方面,本发明提供了一种薄膜晶体管组件。根据本发明的实施例,参照图2,薄膜晶体管组件包括:设置在衬底10上的第一薄膜晶体管20和第二薄膜晶体管30,其中,第一薄膜晶体管20包括第一源极21、第一漏极23和第一有源层22,第二薄膜晶体管30包括第二源极31和第二漏极33,第一源极21设置在第一有源层22靠近衬底10的一侧,第一漏极23设置在第一有源层22远离衬底10的一侧,第二源极31和第二漏极33与第一漏极23同层设置,且第一源极21在衬底10上的正投影和第二源极31在衬底上的正投影有重叠。由此,第一源极21设置在第一有源层22靠近衬底10的一侧,第一漏极23设置在第一有源层22远离衬底10的一侧,且第一源极在衬底上的正投影和第二源极在衬底上的正投影有重叠区域(即第一薄膜晶体管和第二薄膜晶体管交叉设置),如此,相比现有技术中不同薄膜晶体管之间间隔且无交叉设置的方式(如图1所示),本发明的薄膜晶体管组件可以大大缩小其平面占用面积,所以当其应用于显示面板时,可以有效减少遮挡薄膜晶体管的黑矩阵的面积,进而提升显示面板的开口率,即提高显示面板的光透过率,从而提高显示面板的显示亮度。
需要说明的是,上述的“第一薄膜晶体管和第二薄膜晶体管交叉设置”是指第一薄膜晶体管20在衬底10上的正投影和第二薄膜晶体管30在衬底10上的正投影有重叠区域;“不同薄膜晶体管之间间隔且无交叉设置的方式”即是指不同薄膜晶体管在衬底上的正投影均没有重叠区域;“平面占用面积”是指在衬底上的正投影的面积大小。
根据本发明的实施例,为了更进一步的缩小薄膜晶体管组件的平面占用面积,参照图2,第二源极31在衬底10上的正投影覆盖第一源极21在衬底10上的正投影。由此,可以进一步缩小薄膜晶体管组件的平面占用面积,进而提升使用该薄膜晶体管组件的显示面板的开口率,从而提升显示面板的亮度。
根据本发明的实施例,第一源极与第一有源层之间的电连接的具体方式没有特殊要求,在一些实施例中,第一源极和第一有源层直接接触电连接;在另一些实施例中,第一源极和和第一有源层之间设置有绝缘层,第一有源层和第一源极通过绝缘层中设置的过孔实现电连接。
根据本发明的实施例,参照图2和图3,在第一薄膜晶体管20和第二薄膜晶体管30的分布方向上,第二源极31设置在第一漏极23和第二漏极33之间。由此,便于第二源极31、第一漏极23和第二漏极33的布线,而且还可以进一步的减少薄膜晶体管组件的平面占用面积,提升显示面板的开口率。
在本发明的一些实施例中,参照图2,第一薄膜晶体管和第二薄膜晶体管均为顶栅结构薄膜晶体管,具体结构为:第一源极21设置在衬底10的一个表面上;缓冲层40设置在衬底10的表面上,且覆盖第一源极21;第一有源层22和第二薄膜晶体管30的第二有源层32间隔设置在缓冲层40远离衬底10的一侧,第一源极21通过过孔与第一有源层32电连接;栅绝缘层50设置在缓冲层40远离衬底10的一侧,且覆盖第一有源层22和第二有源层32;第一薄膜晶体管的第一栅极24和第二薄膜晶体管的第二栅极34设置在栅绝缘层50远离衬底10的一侧;层间介质层60设置在栅绝缘层50远离衬底10的一侧,且覆盖第一栅极24和第二栅极32;第一漏极23、第二源极31和第二漏极33设置在层间介质层60远离衬底10的一侧,且第一漏极23通过过孔与第一有源层22电连接,第二源极31和第二漏极33分别通过过孔与第二有源层32电连接。
在本发明的另一些实施例中,参照图3,第一薄膜晶体管和第二薄膜晶体管均为底栅结构薄膜晶体管,具体结构为:第一源极21设置在衬底10的一个表面上;缓冲层40设置在衬底10的表面上,且覆盖第一源极21;第一栅极24和第二薄膜晶体管30的第二栅极34设置在缓冲层40远离衬底10的一侧;栅绝缘层50设置在缓冲层40远离衬底10的一侧,且覆盖第一栅极24和第二栅极34;第一有源层22和第二有源层32间隔设置在栅绝缘层50远离衬底10的一侧,且第一有源层22通过过孔与第一源极21电连接;层间介质层60设置在栅绝缘层50远离衬底10的一侧,且覆盖第一有源层22和第二有源层32;第一漏极23、第二源极31和第二漏极33设置在层间介质层60远离衬底10的一侧,且第一漏极23通过过孔与第一有源层22电连接,第二源极31和第二漏极33分别通过过孔与第二有源层32电连接。
根据本发明的实施例,上述各个结构的材料没有特殊限制要求,本领域技术人员可以根据实际需求灵活选择常规制作材料,比如:衬底的具体种类可以为玻璃衬底、聚合物衬底等;缓冲层、栅绝缘层、层间介质层等结构的具体材料可以选自氧化硅、氮化硅、氮氧化硅和新型有机绝缘材料等材料;第一有源层和第二有源层的材料可以选择非晶硅、多晶硅、铟镓锌氧化物(IGZO)等材料;第一源极、第一漏极、第二源极和第二漏极的形成材料可以选自银、铝、铜、钼、钕等金属或上述金属合金,还可以使透明导电氧化物(比如ITO、AZO等)。
在本发明的另一方面,本发明提供了一种阵列基板。根据本发明的实施例,阵列基板包括前面的薄膜晶体管组件。由此,该阵列基板中的薄膜晶体管的平面占用面积较小,可以有效缩减显示面板中黑矩阵的设置面积,从而提升显示面板的开口率,进而提高显示面板的显示亮度。
根据本发明的实施例,参照图4,阵列基板还包括:遮光层70,遮光层70与薄膜晶体管组件中的第一源极21同层且间隔设置。由此,遮光层的设置可以防止光照射到有源层的沟道区,而且遮光层和第一源极可以通过一步构图工艺制作得到,可以缩短制作流程的工艺;另外,遮光层与第一源极保持间隔设置(即遮光层与第一源极之间绝缘设置),可以避免遮光层中产生电压,进而避免该电压在有源层中产生电场,影响沟道的性能。本领域技术人员可以理解,当遮光层和第一源极同工艺形成时,第一源极的材料不易采用透光材料,比如ITO等材料,否则,会使得遮光层失去遮光作用。
根据本发明的实施例,参照图5,阵列基板包括阵列分布的多个子像素110,相邻两列子像素110构成一个像素组100,相邻两个像素组100之间不设有薄膜晶体管,每个像素组100中,两列子像素110之间具有第一间隙,相邻两行子像素110之间具有第二间隙,所述第一间隙和所述第二间隙具有重叠区域,薄膜晶体管组件设置在所述重叠区域处。由此,不仅控制同一列像素组中的两列子像素的薄膜晶体管均位于该两列子像素之间的间隙,而且上述设置方式可以充分利用子像素之间的间隙,进一步缩小薄膜晶体管组件的平面占用面积,进而提升使用该阵列基板的显示面板的开口率。
需要说明的是,上述“薄膜晶体管组件设置在所述重叠区域处”是指薄膜晶体管组中的大部分结构设置在重叠区域中(或者说薄膜晶体管组件在衬底上的大部分正投影落在重叠区域在衬底上的正投影内),只是有少部分结构(比如,与子像素连接的漏极)偏离重叠区域一点点。
根据本发明的实施例,参照图5,围绕每个薄膜晶体管组件依次设置有且呈2*2矩阵分布的第一子像素111、第三子像素113、第二子像素112和第四子像素114(即第一子像素111和第二子像素112对角线设置,第三子像素113和第四子像素114对角线设置),其中,薄膜晶体管组件中的第一薄膜晶体管与第一子像素111电连接,薄膜晶体管组件中的第二薄膜晶体管与第二子像素112电连接。由此,可以更为合理的布局薄膜晶体管组件的各个走线,合理利用间隙空间,尽可能的缩小薄膜晶体管组件的平面占用面积,提升显示面板的开口率,进而提高显示面板的显示亮度。
下面结合图5-图9(以顶栅结构薄膜晶体管为例,图中衬底、缓冲层、栅绝缘层和层间介质层等结构未示出)详细描述一下阵列基板的结构示意图:
参照图6,在衬底上设置第一有源层21和遮光层70,之后形成缓冲层,其中,第一有源层为条形结构,可以构成同一像素组100中所有第一薄膜晶体管的第一源极,即与遮光层同层设置的条形源极控制同一像素组100中一列第一薄膜晶体管,作为一列第一薄膜晶体管的第一源极;
参照图7和图8(图8是图7中薄膜晶体管组件局部的方大图),在缓冲层远离衬底的表面上设置第一有源层22和第二有源层32,且第一有源层22通过过孔(过孔位于第一有源层22与第一源极21交叉的位置)与第一源极21电连接,其中,遮光层70在衬底上的正投影覆盖第一有源层22的第一沟道区221在衬底上的正投影,以及覆盖第二有源层32的第二沟道区321在衬底上的正投影,即在图7和图8中,第一有源层的第一沟道区221和第二有源层的第二沟道区321将部分遮光层70覆盖,之后再设置栅绝缘层;
参照图9,在栅绝缘层远离衬底的表面上形成条形栅极,该条形栅极共同构成第一栅极24和第二栅极34,第一栅极24在衬底上的正投影覆盖第一沟道区221在衬底上的正投影,第二栅极34在衬底上的正投影覆盖第二沟道区321在衬底上的正投影,之后再形成层间介质层;
参照图5,在层间介质层远离衬底的表面上形成第一漏极23、第二源极31和第二漏极33(即第一漏极23、第二源极31和第二漏极33可以采用同一构图工艺形成),第二源极31在衬底上的正投影覆盖第一源极21在衬底上的正投影,即在图5中,第一源极21被第二源极31覆盖,其中,第一漏极23通过过孔与第一有源层22电连接,第二源极31通过过孔与第二有源层32电连接,第二漏极33通过过孔与第二有源层32电连接。如图5所示,第二源极31为条形结构,而第一漏极和第二漏极只是小片状结构,所以如前所述,在第一薄膜晶体管和第二薄膜晶体管的分布方向上,将第二源极设置在第一漏极和第二漏极之间,可以有效缩小薄膜晶体管组件的平面占用面积,进而缩小显示面板中黑矩阵的设置面积。
在本发明的又一方面,本发明提供了一种显示面板。根据本发明的实施例,所述显示面板包括:前面所述的阵列基板。由此,该显示面板的开口率较大,光透过率较高,可以有效提升显示面板的亮度。
根据本发明的实施例,参照图10和图11,显示面板还包括:多个第一黑矩阵81,多个第一黑矩阵81与阵列基板相对设置,且第一黑矩阵81在衬底10上的正投影覆盖第一薄膜晶体管和第二薄膜晶体管在衬底上的正投影,其中,第一黑矩阵的宽度D1为15~25微米,比如15微米、17微米、19微米、21微米、23微米或25微米。由此,本申请的第一黑矩阵的宽度与图1中的黑矩阵的宽度相当,但是本申请的一列第一黑矩阵可以同时覆盖两列子像素的薄膜晶体管,从而可以大大缩小显示面板中黑矩阵总的设置面积,提高显示面板的开口率。
本领域技术人员可以理解,参照图11,显示面板还包括:平坦层90,平坦层90设置在层间介质层60远离衬底的表面上,且覆盖第一漏极23、第二源极31和第二漏极33;公共电极91,公共电极91设置在平坦层90远离衬底的表面上;绝缘层92,绝缘层92设置在公共电极91远离衬底的表面上;像素电极93,像素电极93设置在绝缘层92远离衬底的表面上,且像素电极通过过孔与第一漏极和第二漏极电连接。由此,实现显示面板的显示功能。可以理解的是,显示面板还包括图中未示出的液晶层等其他常规显示面板所必备的结构,在此不再过多赘述。
根据本发明的实施例,参照图12和图13,显示面板还包括:多个第二黑矩阵82,多个第二黑矩阵82与第一黑矩阵81同层设置,第二黑矩阵82在衬底10上的正投影与相邻两个像素组100之间的间隙在衬底10上的正投影有重叠区域,其中,第二黑矩阵的宽度为5~10微米,比如5微米。6微米、7微米、8微米、9微米、10微米。由此,第二黑矩阵的设置可以防止相邻两列像素组的相邻两列子像素发生混光现象,影响显示面板的显示效果,但是由于第二黑矩阵的宽度较小,依然可以有效减少黑矩阵的整体设置面积,提升显示面板的开口率。
在一些实施例中,第二黑矩阵82在衬底10上的正投影覆盖相邻两列像素组100之间的间隙在衬底10上的正投影,如此,在缩小显示面板中黑矩阵总的设置面积的同时,更有效的防止不同子像素之间发生混光现象。
若第一黑矩阵不能将薄膜晶体管组的全部结构遮挡住,则本领域技术人员可以根据实际情况在相邻两行子像素之间设置一定宽度的第三黑矩阵(图中未示出),以此保证薄膜晶体管的良好工作性能。
根据本发明的实施例,上述显示面板可以应用于多种电子设备,比如可以应用于手机、笔记本、iPad、kindle、电视、游戏机等具有显示功能的电子设备。
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在本发明中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外,在不相互矛盾的情况下,本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。
尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (11)

1.一种薄膜晶体管组件,其特征在于,包括:设置在衬底上的第一薄膜晶体管和第二薄膜晶体管,其中,所述第一薄膜晶体管包括第一源极、第一漏极和第一有源层,所述第二薄膜晶体管包括第二源极和第二漏极,所述第一源极设置在所述第一有源层靠近所述衬底的一侧,所述第一漏极设置在所述第一有源层远离所述衬底的一侧,所述第二源极和所述第二漏极与所述第一漏极同层设置,且所述第一源极在所述衬底上的正投影和所述第二源极在所述衬底上的正投影有重叠。
2.根据权利要求1所述的薄膜晶体管组件,其特征在于,所述第二源极在所述衬底上的正投影覆盖所述第一源极在所述衬底上的正投影。
3.根据权利要求1所述的薄膜晶体管组件,其特征在于,在所述第一薄膜晶体管和所述第二薄膜晶体管的分布方向上,所述第二源极设置在所述第一漏极和所述第二漏极之间。
4.根据权利要求1~3中任一项所述的薄膜晶体管组件,其特征在于,所述第一薄膜晶体管和所述第二薄膜晶体管均为顶栅结构薄膜晶体管,或所述第一薄膜晶体管和所述第二薄膜晶体管均为底栅结构薄膜晶体管。
5.一种阵列基板,其特征在于,包括权利要求1~4中任一项所述的薄膜晶体管组件。
6.根据权利要求5所述阵列基板,其特征在于,还包括:
遮光层,所述遮光层与所述第一源极同层且间隔设置。
7.根据权利要求5或6所述阵列基板,其特征在于,包括阵列分布的多个子像素,相邻两列所述子像素构成一个像素组,相邻两个所述像素组之间不设有薄膜晶体管,每个所述像素组中,两列所述子像素之间具有第一间隙,相邻两行所述子像素之间具有第二间隙,所述第一间隙和所述第二间隙具有重叠区域,所述薄膜晶体管组件设置在所述重叠区域处。
8.根据权利要求7所述阵列基板,其特征在于,围绕每个所述薄膜晶体管组件依次设置有且呈2*2矩阵分布的第一子像素、第三子像素、第二子像素和第四子像素,其中,所述薄膜晶体管组件中的第一薄膜晶体管与所述第一子像素电连接,所述薄膜晶体管组件中的第二薄膜晶体管与所述第二子像素电连接。
9.一种显示面板,其特征在于,包括:
权利要求5~8中任一项所述的阵列基板。
10.根据权利要求9所述的显示面板,其特征在于,还包括:
多个第一黑矩阵,多个所述第一黑矩阵与所述阵列基板相对设置,且所述第一黑矩阵在所述衬底上的正投影覆盖第一薄膜晶体管和第二薄膜晶体管在所述衬底上的正投影,
其中,所述第一黑矩阵的宽度为15~25微米。
11.根据权利要求10所述的显示面板,其特征在于,还包括:
多个第二黑矩阵,多个所述第二黑矩阵与所述第一黑矩阵同层设置,所述第二黑矩阵在所述衬底上的正投影与相邻两个像素组之间的间隙在所述衬底上的正投影有重叠区域,其中,所述第二黑矩阵的宽度为5~10微米。
CN201910887397.3A 2019-09-19 2019-09-19 薄膜晶体管组件、阵列基板和显示面板 Active CN110581144B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910887397.3A CN110581144B (zh) 2019-09-19 2019-09-19 薄膜晶体管组件、阵列基板和显示面板
US16/825,006 US11201179B2 (en) 2019-09-19 2020-03-20 Thin film transistor assembly, array substrate and display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910887397.3A CN110581144B (zh) 2019-09-19 2019-09-19 薄膜晶体管组件、阵列基板和显示面板

Publications (2)

Publication Number Publication Date
CN110581144A true CN110581144A (zh) 2019-12-17
CN110581144B CN110581144B (zh) 2022-05-03

Family

ID=68813165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910887397.3A Active CN110581144B (zh) 2019-09-19 2019-09-19 薄膜晶体管组件、阵列基板和显示面板

Country Status (2)

Country Link
US (1) US11201179B2 (zh)
CN (1) CN110581144B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081723A (zh) * 2019-12-31 2020-04-28 厦门天马微电子有限公司 阵列基板、阵列基板的制作方法、显示面板以及显示装置
CN111403454A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 显示面板
CN114220819A (zh) * 2021-10-29 2022-03-22 长沙惠科光电有限公司 阵列基板及其制备方法、显示面板
WO2022193702A1 (zh) * 2021-03-19 2022-09-22 京东方科技集团股份有限公司 阵列基板、显示面板
WO2023134674A1 (zh) * 2022-01-14 2023-07-20 京东方科技集团股份有限公司 阵列基板以及显示面板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113809099B (zh) * 2021-09-02 2023-01-24 武汉华星光电技术有限公司 一种阵列基板及显示面板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105633099A (zh) * 2016-01-28 2016-06-01 京东方科技集团股份有限公司 一种阵列基板、其制作方法及显示面板
CN106168865A (zh) * 2016-06-28 2016-11-30 京东方科技集团股份有限公司 内嵌式触摸屏及其制作方法、显示装置
US20170170251A1 (en) * 2015-12-14 2017-06-15 Samsung Display Co., Ltd. Organic light-emitting device
CN206301805U (zh) * 2016-12-29 2017-07-04 厦门天马微电子有限公司 一种薄膜晶体管、阵列基板及显示装置
CN107248393A (zh) * 2017-07-24 2017-10-13 上海交通大学 像素驱动单元及其形成方法、显示背板、像素驱动电路
CN108022940A (zh) * 2016-10-28 2018-05-11 乐金显示有限公司 显示装置
CN108172595A (zh) * 2016-12-07 2018-06-15 三星显示有限公司 薄膜晶体管基底
US20190131365A1 (en) * 2017-10-31 2019-05-02 Lg Display Co., Ltd. Transparent display apparatus
CN109742131A (zh) * 2019-02-28 2019-05-10 上海天马微电子有限公司 显示面板及显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5675185A (en) * 1995-09-29 1997-10-07 International Business Machines Corporation Semiconductor structure incorporating thin film transistors with undoped cap oxide layers
JPH09260669A (ja) * 1996-03-19 1997-10-03 Nec Corp 半導体装置とその製造方法
US6219113B1 (en) * 1996-12-17 2001-04-17 Matsushita Electric Industrial Co., Ltd. Method and apparatus for driving an active matrix display panel
TWI589198B (zh) * 2014-10-30 2017-06-21 元太科技工業股份有限公司 主動元件電路基板
CN110211974B (zh) * 2019-06-12 2022-05-24 厦门天马微电子有限公司 一种阵列基板、显示面板及阵列基板的制造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170170251A1 (en) * 2015-12-14 2017-06-15 Samsung Display Co., Ltd. Organic light-emitting device
CN105633099A (zh) * 2016-01-28 2016-06-01 京东方科技集团股份有限公司 一种阵列基板、其制作方法及显示面板
CN106168865A (zh) * 2016-06-28 2016-11-30 京东方科技集团股份有限公司 内嵌式触摸屏及其制作方法、显示装置
CN108022940A (zh) * 2016-10-28 2018-05-11 乐金显示有限公司 显示装置
CN108172595A (zh) * 2016-12-07 2018-06-15 三星显示有限公司 薄膜晶体管基底
CN206301805U (zh) * 2016-12-29 2017-07-04 厦门天马微电子有限公司 一种薄膜晶体管、阵列基板及显示装置
CN107248393A (zh) * 2017-07-24 2017-10-13 上海交通大学 像素驱动单元及其形成方法、显示背板、像素驱动电路
US20190131365A1 (en) * 2017-10-31 2019-05-02 Lg Display Co., Ltd. Transparent display apparatus
CN109742131A (zh) * 2019-02-28 2019-05-10 上海天马微电子有限公司 显示面板及显示装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111081723A (zh) * 2019-12-31 2020-04-28 厦门天马微电子有限公司 阵列基板、阵列基板的制作方法、显示面板以及显示装置
CN111081723B (zh) * 2019-12-31 2022-04-29 厦门天马微电子有限公司 阵列基板、阵列基板的制作方法、显示面板以及显示装置
CN111403454A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 显示面板
WO2022193702A1 (zh) * 2021-03-19 2022-09-22 京东方科技集团股份有限公司 阵列基板、显示面板
CN114220819A (zh) * 2021-10-29 2022-03-22 长沙惠科光电有限公司 阵列基板及其制备方法、显示面板
WO2023134674A1 (zh) * 2022-01-14 2023-07-20 京东方科技集团股份有限公司 阵列基板以及显示面板

Also Published As

Publication number Publication date
CN110581144B (zh) 2022-05-03
US11201179B2 (en) 2021-12-14
US20210091123A1 (en) 2021-03-25

Similar Documents

Publication Publication Date Title
CN110581144B (zh) 薄膜晶体管组件、阵列基板和显示面板
US11968862B2 (en) Display substrate and display device
US20160315133A1 (en) Display device
US8692756B2 (en) Liquid crystal display device and method for manufacturing same
US9831276B2 (en) Display panel
US20150192832A1 (en) Liquid crystal display panel
US20140340603A1 (en) Pixel array substrate
US20180284517A1 (en) Display panel and display device
CN110824797B (zh) 透明显示面板、显示面板及其显示装置
KR20180085404A (ko) 트랜지스터 표시판
CN112034656B (zh) 阵列基板和显示装置
US11287711B2 (en) Display panel, method for manufacturing the same and display device
CN103943626A (zh) 一种tft阵列基板、显示面板和显示装置
KR20160047133A (ko) 유기 발광 표시 장치
US8018399B2 (en) Pixel array
KR20160085705A (ko) 디스플레이 패널
CN105824160B (zh) 显示面板
US10910411B2 (en) Array substrate, manufacturing method thereof and display panel
CN215895193U (zh) 显示面板和显示装置
US20130306972A1 (en) Thin film transistor array panel having improved aperture ratio and method of manufacturing same
CN112689791A (zh) 显示基板及液晶面板
US20160209690A1 (en) Display device
US20190146293A1 (en) Array substrate and manufacturing method thereof, and display panel
US8390769B2 (en) Liquid crystal display
US10247992B2 (en) Display device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant