CN110537245B - 衬底处理装置及衬底处理方法 - Google Patents

衬底处理装置及衬底处理方法 Download PDF

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Publication number
CN110537245B
CN110537245B CN201880025759.1A CN201880025759A CN110537245B CN 110537245 B CN110537245 B CN 110537245B CN 201880025759 A CN201880025759 A CN 201880025759A CN 110537245 B CN110537245 B CN 110537245B
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Prior art keywords
substrate
speed
coating liquid
rate
period
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CN201880025759.1A
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English (en)
Chinese (zh)
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CN110537245A (zh
Inventor
和食雄大
佐川栄寿
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
CN201880025759.1A 2017-08-30 2018-07-27 衬底处理装置及衬底处理方法 Active CN110537245B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017165379A JP6873011B2 (ja) 2017-08-30 2017-08-30 基板処理装置および基板処理方法
JP2017-165379 2017-08-30
PCT/JP2018/028337 WO2019044314A1 (ja) 2017-08-30 2018-07-27 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
CN110537245A CN110537245A (zh) 2019-12-03
CN110537245B true CN110537245B (zh) 2023-05-02

Family

ID=65526446

Family Applications (1)

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CN201880025759.1A Active CN110537245B (zh) 2017-08-30 2018-07-27 衬底处理装置及衬底处理方法

Country Status (5)

Country Link
JP (1) JP6873011B2 (enExample)
KR (1) KR102296706B1 (enExample)
CN (1) CN110537245B (enExample)
TW (1) TWI669751B (enExample)
WO (1) WO2019044314A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI884963B (zh) * 2019-07-04 2025-06-01 日商東京威力科創股份有限公司 塗布方法及塗布裝置
JP7339150B2 (ja) * 2019-12-20 2023-09-05 ラピスセミコンダクタ株式会社 基板処理装置、基板処理方法
KR102682854B1 (ko) 2020-06-02 2024-07-10 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP7520665B2 (ja) * 2020-09-25 2024-07-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP7598821B2 (ja) * 2021-05-20 2024-12-12 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
JP2022178694A (ja) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス 塗布処理方法および塗布処理装置
KR102600411B1 (ko) * 2021-08-12 2023-11-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2023102138A (ja) * 2022-01-11 2023-07-24 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及びプログラム
KR102488391B1 (ko) 2022-01-11 2023-01-13 (주)예성글로벌 도어클로저 기능을 갖는 패닉바
JP2024127644A (ja) 2023-03-09 2024-09-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1102505A (zh) * 1993-03-25 1995-05-10 东京电子株式会社 形成涂膜的方法和装置
JPH09292717A (ja) * 1996-04-25 1997-11-11 Dainippon Screen Mfg Co Ltd 基板処理方法およびその装置
CN101647089A (zh) * 2007-03-15 2010-02-10 东京毅力科创株式会社 涂敷处理方法、涂敷处理装置和计算机能够读取的存储介质
CN101750898A (zh) * 2008-12-16 2010-06-23 东京毅力科创株式会社 涂敷处理方法及涂敷处理装置
JP2016096345A (ja) * 2015-12-04 2016-05-26 株式会社東芝 回転塗布装置および回転塗布方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3527459B2 (ja) 2000-04-12 2004-05-17 東京エレクトロン株式会社 塗布膜形成方法および塗布処理装置
JP5091722B2 (ja) * 2008-03-04 2012-12-05 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP4745358B2 (ja) * 2008-03-04 2011-08-10 株式会社東芝 回転塗布方法、および回転塗布装置
JP5485672B2 (ja) * 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5337180B2 (ja) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
JP2014050803A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 回転塗布装置および回転塗布方法
TWI666684B (zh) * 2015-11-16 2019-07-21 日商東京威力科創股份有限公司 塗佈膜形成方法、塗佈膜形成裝置及記憶媒體

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1102505A (zh) * 1993-03-25 1995-05-10 东京电子株式会社 形成涂膜的方法和装置
JPH09292717A (ja) * 1996-04-25 1997-11-11 Dainippon Screen Mfg Co Ltd 基板処理方法およびその装置
CN101647089A (zh) * 2007-03-15 2010-02-10 东京毅力科创株式会社 涂敷处理方法、涂敷处理装置和计算机能够读取的存储介质
CN101750898A (zh) * 2008-12-16 2010-06-23 东京毅力科创株式会社 涂敷处理方法及涂敷处理装置
JP2016096345A (ja) * 2015-12-04 2016-05-26 株式会社東芝 回転塗布装置および回転塗布方法

Also Published As

Publication number Publication date
TW201913728A (zh) 2019-04-01
JP2019046850A (ja) 2019-03-22
KR20190125469A (ko) 2019-11-06
TWI669751B (zh) 2019-08-21
JP6873011B2 (ja) 2021-05-19
KR102296706B1 (ko) 2021-09-01
WO2019044314A1 (ja) 2019-03-07
CN110537245A (zh) 2019-12-03

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