CN110416134A - A kind of the warpage preventing jig and its application method of substrate - Google Patents
A kind of the warpage preventing jig and its application method of substrate Download PDFInfo
- Publication number
- CN110416134A CN110416134A CN201910822473.2A CN201910822473A CN110416134A CN 110416134 A CN110416134 A CN 110416134A CN 201910822473 A CN201910822473 A CN 201910822473A CN 110416134 A CN110416134 A CN 110416134A
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- Prior art keywords
- material containing
- containing disk
- substrate
- cover board
- inner groovy
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 112
- 239000000696 magnetic material Substances 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims abstract description 16
- 229910017110 Fe—Cr—Co Inorganic materials 0.000 claims description 7
- 229910001004 magnetic alloy Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 230000005291 magnetic effect Effects 0.000 claims description 6
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 239000003302 ferromagnetic material Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000011505 plaster Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 12
- 101000623895 Bos taurus Mucin-15 Proteins 0.000 description 5
- WSNMPAVSZJSIMT-UHFFFAOYSA-N COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 Chemical compound COc1c(C)c2COC(=O)c2c(O)c1CC(O)C1(C)CCC(=O)O1 WSNMPAVSZJSIMT-UHFFFAOYSA-N 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/81908—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector involving monitoring, e.g. feedback loop
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
The invention discloses the warpage preventing jigs and its application method of a kind of substrate, belong to technical field of semiconductor chip encapsulation.It includes material containing disk and cover board, and the strong magnetic material installation site is arranged in array, and is uniformly arranged on around material containing disk unit；The material containing disk unit includes a deep inner groovy, a plurality of vacuum through holes and the shallow inner groovy for being disposed therein centre, and the shallow inner groovy is symmetricly set on the upper side and lower side of deep inner groovy, and corresponding deep inner groovy communicates；The cover board is covered on the top of material containing disk, and the cover board includes cover board body, a plurality of chip attachment opening, lock-bit component, lateral exhaust trench, longitudinal exhaust trench；The lock-bit component of the cover board is matched with the positioning element of material containing disk；The transverse direction exhaust trench and longitudinal exhaust trench are open with chip attachment and connect, and extend to the edge of cover board.The present invention makes substrate overcome substrate warping problems in the reflow process after pasting chip by applying suitable pressure.
Description
Technical field
The present invention relates to the warpage preventing jigs and its application method of a kind of substrate, belong to semiconductor chip packaging technology neck
Domain.
Background technique
Flip-chip technology refers on the I/O pad of chip deposition tin-lead ball, then overturns chip and heats, using molten
The technology that the tin-lead ball melted is combined with substrate, wherein Reflow Soldering is conventional heating technique, has the characteristics that be simple and efficient,
But it is using the mode heated comprehensively, and it is basal plate heated warpage which bring, which directly affects, especially for large scale
Substrate, warpage become apparent from, and it is exactly that pad and tin-lead ball spacing are uneven that this warpage bring, which directly affects, cause rosin joint or bridge
The problems such as connecing.
Summary of the invention
It is an object of the present invention to overcome the shortcomings of the prior art and provide a kind of warpage preventing jig of substrate and its
Application method solves the warpage issues that large size chip occurs in encapsulation process.
The object of the present invention is achieved like this:
A kind of warpage preventing jig of substrate of the present invention comprising material containing disk and cover board, the material containing disk include material containing disk ontology, answer
Several material containing disk units, strong magnetic material installation site and positioning element, a plurality of material containing disk units are neat one by one
It is arranged in material containing disk ontology, the strong magnetic material installation site is arranged in array, and is uniformly arranged on the week of material containing disk unit
It encloses, interior fixed ferromagnetic material；
The material containing disk unit includes a deep inner groovy, a plurality of vacuum through holes and the shallow inner groovy for being disposed therein centre, described
Shape, the size of deep inner groovy are matched with the shape of substrate, size；
The vacuum through holes are arranged in deep inner groovy, and number and size are arranged according to actual needs；
The shallow inner groovy is symmetricly set on the upper side and lower side of deep inner groovy, and corresponding deep inner groovy communicates；
The cover board is covered on the top of material containing disk, and the cover board includes cover board body, a plurality of chip attachment opening, lock-bit portion
Part, lateral exhaust trench, longitudinal exhaust trench；
The lock-bit component of the cover board is matched with the positioning element of material containing disk；
The opening size of the chip attachment opening is less than the size of deep inner groovy, but is greater than the size of chip to be mounted, described
Lateral exhaust trench and longitudinal exhaust trench are open with chip attachment and connect, and extend to the edge of cover board.
Optionally, the positioning element is cylindrical, and is respectively arranged at the center at the head and the tail both ends of material containing disk ontology.
Optionally, the rounded circle of the lock-bit component or ellipse circle.
Optionally, the ferromagnetic material in the strong magnetic material installation site is Fe-Cr-Co permanent magnetic alloy, the siderochrome cobalt
Permanent-magnet alloy contains 20% ~ 33% chromium, 3% ~ 25% cobalt, 3% molybdenum or 0.7% ~ 1.0% silicon.
Optionally, the cover board further includes radiator structure, and the surrounding of chip attachment opening is arranged in the radiator structure.
Optionally, the vacuum through holes are since center in multilayer type array arrangement from small to large.
It optionally, further include shallow trench in the deep inner groovy, the upper surface of deep inner groovy is arranged in the shallow trench,
Width is not less than the diameter of vacuum through holes, and the vacuum through holes all from lateral, longitudinal and oblique series connection.
Optionally, the material containing disk further includes engraved structure, and the engraved structure is set to the marginal zone of its deep inner groovy
Domain.
Optionally, the shallow inner groovy of the material containing disk is in hollow structure, and engraved structure adjacent thereto communicates.
A kind of application method of the warpage preventing jig of substrate of the present invention, its step are as follows:
Step 1: taking material containing disk, substrate is sequentially placed one by one in the deep inner groovy on material containing disk, the chip of substrate pastes
Fill region upward；
Step 2: taking cover board, cover board is placed on above material containing disk by the positioning element of material containing disk and the lock-bit parts match of cover board,
And under the attraction of magnetic force, cover board can apply pressure to substrate, and the chip attachment opening of cover board exposes the chip attachment area of substrate
Domain；
The work top of chip mounter, the work top of chip mounter are put in Step 3: substrate will be equipped with and be bonded the material containing disk of cover board
Fitted underneath has a vacuum equipment, and work top is further equipped with vacuum module, starts vacuum equipment, on the work top of chip mounter
Vacuum module substrate fixed to by the vacuum through holes of material containing disk and is fitted in deep inner groovy, it is fixed simultaneously to inhale flat substrate；
Step 4: chip to be loaded on to the chip attachment area of substrate by the mechanical arm of chip mounter by the chip attachment opening plaster of cover board
Domain；
Step 5: the warpage preventing jig of aforesaid substrate will press against substrate and carry out Reflow Soldering after completing attachment, by magneticaction, lid
Plate will apply always certain pressure force to substrate, can be effectively prevented substrate and warpage occur.
Beneficial effect
By design with magnetic material containing disk and cover board, apply suitable pressure makes a kind of warpage preventing jig of substrate of the present invention
Substrate overcomes substrate warping problems in the reflow process after pasting chip, to efficiently solve because substrate warp causes
Rosin joint and bridge joint the problems such as.
Detailed description of the invention
Fig. 1 is a kind of material containing disk schematic diagram of the embodiment one of the warpage preventing jig of substrate of the present invention；
Fig. 2 is the side view of Fig. 1；
Fig. 3 is a kind of cover plate schematic diagram of the embodiment one of the warpage preventing jig of substrate of the present invention；
Fig. 4 is the use schematic diagram of material containing disk and cover board；
Fig. 5 is a kind of material containing disk schematic diagram of the embodiment two of the warpage preventing jig of substrate of the present invention；
Fig. 6 is the side view of Fig. 5；
Fig. 7 is a kind of cover plate schematic diagram of the embodiment two of the warpage preventing jig of substrate of the present invention；
Fig. 8 is the use schematic diagram of material containing disk and cover board；
In figure:
Material containing disk I 10
I ontology 11 of material containing disk
Deep inner groovy I 12
Vacuum through holes I 13
Positioning element I 14
Positioning element II 15
Shallow inner groovy I 16
Strong magnetic material installation site I 19；
Cover board I 20
I ontology 21 of cover board
Chip attachment opening I 22
Lock-bit component I 24
Lock-bit component II 25
Lateral exhaust trench 27
Longitudinal exhaust trench 28；
Material containing disk II 30
II ontology 31 of material containing disk
Deep inner groovy II 32
Vacuum through holes II 33
Positioning element III 34
Positioning element IV 35
Shallow inner groovy II 36
Engraved structure 37
Strong magnetic material installation site II 39；
Cover board II 40
II ontology 41 of cover board
Chip attachment opening II 42
Lock-bit component III 44
Lock-bit component IV 45
Radiator structure I 46
Radiator structure II 47.
Specific embodiment
Detailed description of the preferred embodiments with reference to the accompanying drawing.It can be used for ease of explanation,
Spatially relative term (" in ... lower section ", " under ", " lower part ", " in ... top ", " top " etc.) it is as shown in the figure to describe
The relationship of one element or component and another element or component.In addition to orientation shown in figure, spatially relative term is also wrapped
Equipment is differently directed in including use or operating.Device can be oriented otherwise and (is rotated by 90 ° or in other orientations),
Therefore the opposite description in space used herein can carry out similar explanation.
Embodiment one
A kind of warpage preventing jig of substrate of the present invention, the jig are divided into material containing disk I 10 and I 20 two parts of cover board, as shown in Figure 1 to Figure 4
It is shown.Wherein, Fig. 1 is a kind of material containing disk schematic diagram of the embodiment one of the warpage preventing jig of substrate of the present invention；Fig. 2 is Fig. 1's
Side view；Fig. 3 is a kind of cover plate schematic diagram of the embodiment one of the warpage preventing jig of substrate of the present invention；Fig. 4 is material containing disk and lid
Plate uses schematic diagram.
Material containing disk I 10 includes I ontology 11 of material containing disk, a plurality of material containing disk Unit I, strong magnetic material installation site I 19, determines
Position component I 14 and positioning element II 15, with the signal in long strip of material containing disk I 10 in Fig. 1.A plurality of material containing disk Unit I one one
A proper alignment is equipped with gap, number and size are according to reality in I ontology 11 of material containing disk between adjacent material containing disk Unit I
It needs to design.Illustrated with material containing disk Unit I in 1*4 matrix in Fig. 1.Strong magnetic material installation site I 19 is arranged in array, uniformly
It is arranged in the gap around material containing disk Unit I and between adjacent material containing disk Unit I, makes the magnetic around material containing disk Unit I
Property is evenly distributed, and number and size are arranged according to actual needs.Fixation can be resistant to high temperature in strong magnetic material installation site I 19
The ferromagnetic materials such as Fe-Cr-Co permanent magnetic alloy.Generally, Fe-Cr-Co permanent magnetic alloy contain 20% ~ 33% chromium, 3% ~ 25% cobalt, 3% molybdenum or
0.7% ~ 1.0% silicon.
Positioning element I 14, the shape of positioning element II 15, number and setting position design according to actual needs, and with lid
Plate I 20 matches.It is cylindrical with positioning element I 14, positioning element II 15 in Fig. 1, and positioning element I 14, positioning element II
15 are respectively arranged at the center signal at the head and the tail both ends of I ontology 11 of material containing disk.
Material containing disk Unit I includes a deep inner groovy 12, a plurality of vacuum through holes I 13 and the shallow inner groovy for being disposed therein centre
Ⅰ16.Deep inner groovy I 12 be substrate resettlement area, as shown in Fig. 2, be used for bearing substrate, the chip attachment region of substrate upward,
Shape, the size of deep inner groovy I 12 are consistent with the shape of substrate, size, or the length-width ratio counterpart substrate side of deep inner groovy I 12
More 150 microns -200 microns of length and width.With its square signal of deep inner groovy I 12, the depth ratio of deep inner groovy I 12 in Fig. 1
The thickness of substrate is 200-400 microns big.
A plurality of vacuum through holes I 13 are arranged in array, and are uniformly arranged in the deep inner groovy I 12 of material containing disk Unit I,
Several and size is arranged according to actual needs, in order to fixed substrate during chip attachment.There are two shallow inner groovy I 16 is set,
It is symmetricly set on the upper side and lower side of deep inner groovy I 12, and is communicated with deep inner groovy I 12, convenient for picking and placing substrate with hand or tool,
As shown in Figure 2.Generally, the area of shallow inner groovy I 16 should be greater than 1cm2, to adapt to protrude into finger.
Cover board I 20 matches use with material containing disk I 10, and cover board I 20 is covered on the top of material containing disk I 10, as shown in figure 4, lid
Plate I 20 by the metal material that magnet attracts by that can be made, and generally, the material of cover board can be zinc-plated ferrimagnet.Fig. 3
Cover plate I 20 is also with signal in long strip.Cover board I 20 includes I ontology 21 of cover board, a plurality of chip attachment opening I 22, lock-bit portion
Part I 24, lock-bit component II 25, lateral exhaust trench 27, longitudinal exhaust trench 28.Chip attachment opening I 22 is also with rectangular in figure
Signal.The rounded circle of lock-bit component I 24, the oval circle of lock-bit component II 25, to indicate the directionality of cover board I 20.Cover board I 20
Lock-bit component I 24 matched with the positioning element I 14 of material containing disk I 10, the lock-bit component II 25 of cover board I 20 and material containing disk I 10
Positioning element II 15 matches.The opening size of chip attachment opening I 22 is less than the size of the deep inner groovy I 12 of material containing disk I 10, but
Greater than the size of chip to be mounted.When Reflow Soldering carries out, since part scaling powder understands volatilization gas because heated, covering
The inside of plate I 20 is additionally provided with lateral exhaust trench 27 and longitudinal exhaust trench 28, lateral exhaust trench 27 and longitudinal exhaust ditch
Slot 28 is connect with chip attachment opening I 22, and extends to the edge of cover board I 20, keeps the high-temperature gas flowed in Reflow Soldering suitable
The gas that will volatilize of groove the warpage preventing jig of the substrate is smoothly discharged.
A kind of application method of the warpage preventing jig of substrate of the present invention, its step are as follows:
Step 1: take material containing disk I 10, substrate is sequentially placed one by one in the deep inner groovy I 12 of material containing disk I 10, substrate
Chip attachment region upward；
Step 2: taking cover board I 20, the positioning element I 14 of material containing disk I 10 is matched with the lock-bit component I 24 of cover board I 20, material containing disk I
10 positioning element II 15 is matched with the lock-bit component II 25 of cover board I 20, cover board I 20 is placed on I 10 top of material containing disk, and in magnetic
Under the attraction of power, cover board I 20 can apply the pressure of 0.5Kg-1.5Kg to substrate, and the chip attachment opening I 22 of cover board I 20 is exposed
The chip attachment region of substrate；
The work top of chip mounter, the work top of chip mounter are put in Step 3: substrate will be equipped with and be bonded the material containing disk of cover board
Fitted underneath has a vacuum equipment, and work top is further equipped with vacuum module, starts vacuum equipment, on the work top of chip mounter
Vacuum module substrate is fixed by the vacuum through holes I 13 of material containing disk I 10 and is fitted in deep inner groovy I 12, it is fixed simultaneously to inhale
Flat substrate；
Step 4: chip to be mounted on to the chip of substrate by the mechanical arm of chip mounter by the chip attachment opening I 22 of cover board I 20
Pasting area；
Step 5: the warpage preventing jig of aforesaid substrate will press against substrate and carry out Reflow Soldering after completing attachment, by magneticaction, lid
I 20 pairs of substrates of plate will apply always certain pressure force, can be effectively prevented substrate and warpage occur.
Embodiment two
A kind of warpage preventing jig of substrate of the present invention, the jig are divided into material containing disk II 30 and II 40 two parts of cover board, such as Fig. 5 to figure
Shown in 8.Wherein, Fig. 5 is a kind of material containing disk schematic diagram of the embodiment two of the warpage preventing jig of substrate of the present invention；Fig. 6 is Fig. 5's
Side view；Fig. 7 is a kind of cover plate schematic diagram of the embodiment two of the warpage preventing jig of substrate of the present invention；Fig. 8 is material containing disk and lid
Plate uses schematic diagram.
Material containing disk II 30 includes II ontology 31 of material containing disk, a plurality of material containing disk Unit II, strong magnetic material installation site II
39, positioning element III 34, positioning element IV 35, as shown in figure 5, the signal in long strip of II ontology of material containing disk 31.A plurality of material containings
Proper alignment is equipped with gap in II ontology 31 of material containing disk to disk Unit II one by one between adjacent material containing disk Unit II,
Several and size designs according to actual needs.Illustrated with material containing disk Unit II in 1*4 matrix in Fig. 5.Strong magnetic material installation site
II 39 are arranged in array, and are uniformly arranged in the gap around material containing disk Unit II and between adjacent material containing disk Unit II,
The magnetism around material containing disk Unit II is set to be evenly distributed, number and size are arranged according to actual needs.Strong magnetic material installation
Fixation can the ferromagnetic materials such as Fe-Cr-Co permanent magnetic alloy resistant to high temperature in position II 39.Generally, Fe-Cr-Co permanent magnetic alloy contains 20%
~ 33% chromium, 3% ~ 25% cobalt, 3% molybdenum or 0.7% ~ 1.0% silicon.
Positioning element III 34, the shape of positioning element IV 35, number and setting position design according to actual needs, and with lid
Plate II 40 matches.It is cylindrical with positioning element III 34, positioning element IV 35 in Fig. 5, and positioning element I 14, positioning element
II 15 are respectively arranged at the center signal at the head and the tail both ends of I ontology 11 of material containing disk.
Material containing disk Unit II includes the deep inner groovy II 32, a plurality of vacuum through holes II 33, shallow ridges for being disposed therein centre
Slot 34, shallow inner groovy II 36, engraved structure 37.Deep inner groovy II 32 is substrate resettlement area, as shown in fig. 6, for carrying base
Plate, upward, shape, the size of deep inner groovy II 32 are consistent with the shape of substrate, size, Huo Zheshen in the chip attachment region of substrate
The length and width on the length-width ratio counterpart substrate side of inner groovy II 32 are 150 microns -200 microns more.With its deep inner groovy II 32 in just in Fig. 5
Rectangular signal, the depth of deep inner groovy II 32 are 200-400 microns bigger than the thickness of substrate.
Vacuum through holes II 33 are distributed in deep inner groovy II 32, and number and size are arranged according to actual needs, and therefrom
The heart starts in multilayer type array arrangement from small to large.The upper surface of deep inner groovy II 32, shallow trench is arranged in shallow trench 34
34 width are not less than the diameter of vacuum through holes II 33, and the vacuum through holes II 33 all from lateral, longitudinal and oblique series connection, can
Vacuum pull is applied to substrate, which increases the forced area of substrate, be more advantageous to and fix base during chip attachment
Plate.
There are two shallow inner groovy II 36 is set, be symmetricly set on the upper side and lower side of deep inner groovy II 32, and with its deep indent
Slot II 32 communicates, convenient for picking and placing substrate with hand or tool.Generally, the area of shallow inner groovy II 36 should be greater than 1cm2, to adapt to
Protrude into finger.
In order to preferably substrate be made to radiate, hollow processing is carried out to material containing disk II 30, engraved structure 37 is set to depth
Fringe region in inner groovy II 32.Illustrated with engraved structure 37 in hollow strip in Fig. 5.Function is realized not influencing material containing disk
Under the premise of energy, hollow out shape is the bigger the better.Therefore, above-mentioned shallow inner groovy II 36 can also be in hollow structure, and with hollow out knot
Structure 37 communicates.
Cover board II 40 matches use with material containing disk II 30, and cover board II 40 is covered on the top of material containing disk II 30, such as Fig. 8 institute
Show, for cover board II 40 by that can be made by the metal material that magnet attracts, the material of cover board II 40 can be zinc-plated ferrimagnet.
Fig. 7 cover plate II 40 is also with signal in long strip.
Cover board II 40 includes II ontology 41 of cover board, a plurality of chip attachment opening II 42, lock-bit component III 44, lock-bit component
IV 45, radiator structure I 46, radiator structure II 47.Radiator structure I 46, the setting of radiator structure II 47 are in chip attachment opening II 42
Surrounding, it is preferably heated and radiate to be conducive to substrate.Chip attachment opening II 42 is also with rectangular signal in figure.Lock-bit component III
44 rounded circles, the oval circle of lock-bit component IV 45, to indicate the directionality of cover board II 40.The positioning element of material containing disk II 30
III 34 match with the lock-bit component III 44 of cover board II 40, the positioning element IV 35 of material containing disk II 30 and the lock-bit component of cover board II 40
IV 45 match, and the vacuum through holes II 33 of material containing disk II 30 and strong magnetic material installation site II 39 are not shown in Fig. 8.Chip attachment
Be open the deep inner groovy II 32 of II 42 exposings.
A kind of application method of the warpage preventing jig of substrate of the present invention, its step are as follows:
Step 1: material containing disk II 30 is taken, and the deep inner groovy II 32 substrate being successively put in one by one on material containing disk II 30, substrate
Chip attachment region upward；
Step 2: taking cover board II 40, the positioning element III 34 of material containing disk II 30 is matched with the lock-bit component III 44 of cover board II 40, is carried
The positioning element IV 35 of charging tray II 30 is matched with the lock-bit component IV 45 of cover board II 40, and cover board II 40 is placed on material containing disk II 30
Side, and under the attraction of magnetic force, cover board II 40 can apply the pressure of 1Kg-3.5Kg to substrate, and the chip attachment of cover board II 40 is opened
Mouth II 42 exposes the chip attachment region of substrates；
The work top of chip mounter, the work top of chip mounter are put in Step 3: substrate will be equipped with and be bonded the material containing disk of cover board
Fitted underneath has a vacuum equipment, and work top is further equipped with vacuum module, starts vacuum equipment, on the work top of chip mounter
Vacuum module substrate fixed to by the vacuum through holes II 33 of material containing disk II 30 and is fitted in deep inner groovy, it is fixed simultaneously to inhale flat base
Plate；
Step 4: chip to be mounted on to the core of substrate by the mechanical arm of chip mounter by the chip attachment opening II 42 of cover board II 40
Piece pasting area；
Step 5: the warpage preventing jig of aforesaid substrate will press against substrate and carry out Reflow Soldering after completing attachment, by magneticaction, lid
II 40 pairs of substrates of plate will apply always certain pressure force, can be effectively prevented substrate and warpage occur.
Above-described specific embodiment has carried out further the purpose of the present invention, technical scheme and beneficial effects
Ground is described in detail, it should be understood that being not used to limit this hair the foregoing is merely a specific embodiment of the invention
Bright protection scope.All within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should all wrap
Containing within protection scope of the present invention.
Claims (10)
1. a kind of warpage preventing jig of substrate, which is characterized in that it includes material containing disk and cover board,
The material containing disk includes material containing disk ontology, a plurality of material containing disk units, strong magnetic material installation site and positioning element, institute
Stating a plurality of material containing disk units, for proper alignment in material containing disk ontology, the strong magnetic material installation site is in array one by one
Arrangement, is uniformly arranged on around material containing disk unit, interior fixed ferromagnetic material；
The material containing disk unit includes a deep inner groovy, a plurality of vacuum through holes and the shallow inner groovy for being disposed therein centre, described
Shape, the size of deep inner groovy are matched with the shape of substrate, size；
The vacuum through holes are arranged in deep inner groovy, and number and size are arranged according to actual needs；
The shallow inner groovy is symmetricly set on the upper side and lower side of deep inner groovy, and corresponding deep inner groovy communicates；
The cover board is covered on the top of material containing disk, and the cover board includes cover board body, a plurality of chip attachment opening, lock-bit portion
Part, lateral exhaust trench, longitudinal exhaust trench；
The lock-bit component of the cover board is matched with the positioning element of material containing disk；
The opening size of the chip attachment opening is less than the size of deep inner groovy, but is greater than the size of chip to be mounted, described
Lateral exhaust trench and longitudinal exhaust trench are open with chip attachment and connect, and extend to the edge of cover board.
2. warpage preventing jig according to claim 1, which is characterized in that the positioning element is cylindrical, and sets respectively
It is placed in the center at the head and the tail both ends of material containing disk ontology.
3. warpage preventing jig according to claim 1, which is characterized in that the rounded circle of the lock-bit component or ellipse
Circle.
4. warpage preventing jig according to claim 1, which is characterized in that the strong magnetic in the strong magnetic material installation site
Material is Fe-Cr-Co permanent magnetic alloy, and the Fe-Cr-Co permanent magnetic alloy contains 20% ~ 33% chromium, 3% ~ 25% cobalt, 3% molybdenum or 0.7% ~ 1.0%
Silicon.
5. warpage preventing jig according to claim 1, which is characterized in that the cover board further includes radiator structure, described to dissipate
The surrounding of chip attachment opening is arranged in heat structure.
6. warpage preventing jig according to claim 1, which is characterized in that the vacuum through holes are since center in by small
To big multilayer type array arrangement.
7. warpage preventing jig according to claim 1 or 6, which is characterized in that it further include shallow trench in the depth inner groovy,
The upper surface of deep inner groovy is arranged in the shallow trench, and width is not less than the diameter of vacuum through holes, and from lateral, longitudinal direction and tiltedly
To all vacuum through holes of connecting.
8. warpage preventing jig according to claim 1, which is characterized in that the material containing disk further includes engraved structure, described
Engraved structure is set to the fringe region of its deep inner groovy.
9. warpage preventing jig according to claim 1 or 8, which is characterized in that the shallow inner groovy of the material containing disk is in hollow
Structure, and engraved structure adjacent thereto communicates.
10. a kind of application method of the warpage preventing jig of substrate, its step are as follows:
Step 1: taking material containing disk, substrate is sequentially placed one by one in the deep inner groovy on material containing disk, the chip of substrate pastes
Fill region upward；
Step 2: taking cover board, cover board is placed on above material containing disk by the positioning element of material containing disk and the lock-bit parts match of cover board,
And under the attraction of magnetic force, cover board can apply pressure to substrate, and the chip attachment opening of cover board exposes the chip attachment area of substrate
Domain；
The work top of chip mounter, the work top of chip mounter are put in Step 3: substrate will be equipped with and be bonded the material containing disk of cover board
Fitted underneath has a vacuum equipment, and work top is further equipped with vacuum module, starts vacuum equipment, on the work top of chip mounter
Vacuum module substrate fixed to by the vacuum through holes of material containing disk and is fitted in deep inner groovy, it is fixed simultaneously to inhale flat substrate；
Step 4: chip to be loaded on to the chip attachment area of substrate by the mechanical arm of chip mounter by the chip attachment opening plaster of cover board
Domain；
Step 5: the warpage preventing jig of aforesaid substrate will press against substrate and carry out Reflow Soldering after completing attachment, by magneticaction, lid
Plate will apply always certain pressure force to substrate, can be effectively prevented substrate and warpage occur.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910822473.2A CN110416134B (en) | 2019-09-02 | Warp-preventing jig for substrate and use method of warp-preventing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910822473.2A CN110416134B (en) | 2019-09-02 | Warp-preventing jig for substrate and use method of warp-preventing jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110416134A true CN110416134A (en) | 2019-11-05 |
| CN110416134B CN110416134B (en) | 2024-06-07 |
Family
ID=
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| CN114520169A (en) * | 2022-01-14 | 2022-05-20 | 苏州通富超威半导体有限公司 | Semiconductor packaging jig and application thereof |
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