CN110035629A - The method that air sealing cover is carried out to microwave module using nanometer silver paste - Google Patents
The method that air sealing cover is carried out to microwave module using nanometer silver paste Download PDFInfo
- Publication number
- CN110035629A CN110035629A CN201910094327.2A CN201910094327A CN110035629A CN 110035629 A CN110035629 A CN 110035629A CN 201910094327 A CN201910094327 A CN 201910094327A CN 110035629 A CN110035629 A CN 110035629A
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- CN
- China
- Prior art keywords
- microwave module
- silver paste
- nanometer silver
- sealing cover
- air sealing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
Abstract
The invention discloses a kind of methods for carrying out air sealing cover to microwave module using nanometer silver paste, the air sealing cover of microwave module is realized using the principle reacted between nanometer silver paste and microwave module metal plating layer, specific operation process is as follows: certain thickness nanometer silver paste being coated in microwave module casing step position to be covered first, then microwave module cover board is placed on the fastening of the clamp devices such as casing step position special fastening tooling or clip, it is subsequently placed into heating cure in baking oven, the microwave module that capping is completed is taken out after the completion of solidifying carries out the detection of air-tightness leak rate.The present invention is highly reliable for microwave module, height is airtight, high efficiency capping provides a kind of practicable method.
Description
Technical field
The present invention relates to microwave module technology and new material application fields, and in particular to a kind of to use nanometer silver paste
The method that air sealing cover is carried out to microwave module.
Background technique
The microwave module electronic equipment assembly important as the military domains such as aerospace, airborne, missile-borne, mostly uses at present
High density interconnection substrate and chip-on-board, so that the highly integrated of microwave module, high speed, miniaturization and light-duty can be realized
Change.Microwave module after the assembly is completed, in order to protect component, bare chip inside microwave module etc. from environmental corrosion and machinery
It destroys, it is necessary to these components, bare chip etc. are encapsulated in airtight housing, to guarantee that microwave module being capable of long-time, Gao Ke
The work leaned on.Microwave current module capping mode has screw fastening, tin envelope (scolding tin capping), parallel seam welding and laser capping four
Kind, it can be reasonably selected according to module air-tightness requirement.Screw capping generally uses stainless steel sunk screw by microwave module cover board
It is fastened on shell, the microwave module after capping is generally unable to satisfy air-tightness standard；Tin envelope is to utilize scolding tin and microwave module
Solder reaction between metal plating layer is covered, and the yield rate that this method meets air-tightness requirement is lower；Parallel seam
Weldering is that the capping mode of module is realized using the iron-nickel alloy cover board of circular electrode electric resistance welding melting iron-nickel alloy or the thin gold of plating.
Laser capping is the airtight welding that microwave module is realized using the laser melting cover and housing of high-energy.
The present invention uses anti-between Novel engineering application material nanometer silver paste and microwave module metal plating layer (gold, silver etc.)
The principle answered realizes the air sealing cover of microwave module, it can be achieved that microwave module is highly reliable, high airtight, high efficiency capping.
Summary of the invention
It is an object of the invention to overcome the defect of above-mentioned existing microblogging module encapsulation method, provide a kind of using nano silver
The method that air sealing cover is carried out to microwave module is starched, Novel engineering application material nanometer silver paste and microwave module metal lining are utilized
It is reacted between layer (gold, silver etc.), Lai Shixian microwave module insulator is highly reliable, height is airtight, high efficiency capping.
Technical solution of the present invention: the method that air sealing cover is carried out to microwave module using nanometer silver paste, i.e., wait cover
Microwave module casing step position spot gluing equipment or spray printing device quantization coating or coating certain thickness and width are received by hand
Microwave module cover board is placed on the fastening of the clamp devices such as casing step position special fastening tooling or clip, then by rice silver paste
It is put into baking oven and toasts, react between nanometer silver paste and microwave module metal plating layer during heating cure, thus real
The air sealing cover of existing microwave module.Specifically comprise the following steps:
(1) certain thickness nanometer silver paste is coated in microwave module casing step position to be covered；
(2) cover board is sucked with vacuum WAND or tweezers clamps cover board, cover board is put into casing step position；
(3) cover and housing are fastened with special fastening tooling or with the suitable cushion block of clip clamping metal or polytetrafluoroethylene (PTFE) etc.；
(4) oven temperature and time are set, microwave module is put into baking oven and is toasted；
(5) after EP (end of program) to be baked, the air-tightness of microwave module is detected.
The microwave module case material includes copper alloy, aluminium alloy, iron-nickel alloy, silico-aluminum, ceramic cartridge, silicon substrate
Material and all case materials as microwave module.
Component in the nanometer silver paste containing epoxy resin or epoxy glue.
The outer surface of the microwave module shell needs the stronger material in conjunction with nanometer silver paste such as the soft gold of plating or fine silver
Material, plated thickness is greater than 0.1 μm, and coating surface cleaning is pollution-free.
The nanometer silver paste application pattern can choose the quantizations such as spot gluing equipment or spray printing device coating, also can choose hand
Work coating, preferred equipment quantization coating.
The nanometer silver paste applied thickness is 3 μm~100 μm, and nanometer silver paste application width is that cannot overflow after cover board fastens
Step width.
The microwave module cover board need to apply the preferred special fastening tooling of pressure, simple fastening clips folder with clamp
Sub-folder holds the suitable cushion block fastening cover and housing such as metal or polytetrafluoroethylene (PTFE), and cushion block size is less than the size of the cover plate.
Baking all material can bear at least 175 DEG C of baking temperature when the microwave module covers, the heatproof time at least 1
Hour.
Atmosphere preferred inert gas atmosphere when the microwave module baking oven toasts.
Advantages of the present invention:
1) simple process, easily operated, controllability is strong；
2) the quantization coating that nanometer silver paste can be realized by spot gluing equipment or spray printing device, to increase substantially production efficiency；
3) reliability, air-tightness, aesthetics and the process consistency of microwave module capping can be achieved.
Detailed description of the invention
Fig. 1 is microwave module gold plated copper shell structure figure in embodiment 1, and left side is non-capped configuration, and right side is nano silver
Starch capped configuration.
Fig. 2 is that nanometer silver paste covers the gold-plated copper shell microscope enlarged photograph of microwave module in embodiment 1.
Fig. 3 is that nanometer silver paste covers the gold-plated copper shell X-ray photograph of microwave module in embodiment 1.
Fig. 4 is the gold-plated silicon substrate shell of microwave module and covering plate structure figure in embodiment 2, and left side is silicon substrate cover board, and right side is
Silicon substrate shell.
Fig. 5 is that nanometer silver paste covers silicon substrate microwave module microscope photo in embodiment 2.
Fig. 6 is that nanometer silver paste covers silicon substrate microwave module microscope enlarged photograph in embodiment 2.
Fig. 7 is that nanometer silver paste covers silicon substrate microwave module X-ray photograph in embodiment 2.
Specific embodiment
Invention is further described in detail with reference to the accompanying drawings and embodiments.
Embodiment 1
(1) fifth wheels such as the gold-plated copper shell insulator mounting hole electronickelling of microwave module, Jin Houyou impulse- free robustness are examined first, so
It is toasted 0.5 hour with dehydrated alcohol ultrasonic cleaning nickel plating, golden microwave module shell, 50 DEG C, is welded with Sn96.5Ag3.0Cu0.5 afterwards
Insulator is soldered on shell by cream in 240 DEG C of thermal station, then dry with chloroform-dehydrated alcohol-dehydrated alcohol ultrasonic cleaning
Leak rate detection is carried out after net, leak rate detection is qualified, and (leak rate is less than 1 × 10-9Pa·m3/ s), clean can carry out subsequent envelope
Cover process；
(2) nanometer silver paste of 20 μm~30 μ m thicks is applied in microwave module casing step position to be covered；
(3) cover board is sucked with vacuum WAND, cover board is put into casing step position, lifts vacuum WAND；
(4) cushion block is placed on housing cover central location, is stepped up to fasten microwave module cover and housing with tweezers；
(5) setting baking oven highest baking temperature is 175 DEG C, is heated to 175 DEG C from room temperature, and 175 DEG C keep the temperature 1.5 hours, then with
Furnace is cooled to room temperature, and baking atmosphere is nitrogen atmosphere；
(6) appearance test and x-ray examination are carried out to capping situation；
(7) leak rate detection is carried out to capping microwave module after toasting, leak rate is 4.7 × 10-9Pa·m3/ s, meets gas
Close property requirement.
Fig. 1 is the gold-plated copper shell of microwave module in embodiment 1, and left side is not cover photo, and right side is nanometer silver paste capping
The gold-plated copper shell photo of microwave module afterwards, insulator has been welded on shell in figure, and leak detection leak rate is small after welding insulation
In 1 × 10-9Pa·m3/s.Fig. 2 is that nanometer silver paste covers the gold-plated copper shell microscope enlarged photograph of microwave module in embodiment 1,
The nanometer silver paste covered as can be seen from Figure 2 between cover and housing gap more uniformly, it is consistent, without obvious hole.Fig. 3 is
Nanometer silver paste covers the gold-plated copper shell X-ray photograph of microwave module in embodiment 1, and the nanometer silver paste covered as can be seen from Figure 3 exists
Phenomena such as more thickness is uniform, consistent, nothing is obvious empty and excessive without nanometer silver paste between cover and housing gap exists.To envelope
Microwave module after lid carries out leak rate detection and shows that its leak rate is 4.7 × 10-9Pa·m3/ s, according to GJB 548B-1014.2's
Examining condition A4, result leak rate of hunting leak is less than 5 × 10-9Pa·m3/ s, meets air-tightness requirement.
Embodiment 2
(1) first with the gold-plated silicon substrate shell of dehydrated alcohol ultrasonic cleaning microwave module and cover board, 50 DEG C are toasted 0.5 hour, are examined
It is covered again after no any pollutant；
(2) the gold-plated silicon substrate shell of microwave module is put into homemade frock clamp；
(3) nanometer silver paste of 20 μm~30 μ m thicks is applied in microwave module shell closure position to be covered；
(4) cover board is sucked with vacuum WAND, cover board is put into casing step position, lifts vacuum WAND；
(5) setting baking oven highest baking temperature is 175 DEG C, is heated to 175 DEG C from room temperature, and 175 DEG C keep the temperature 1.5 hours, then with
Furnace is cooled to room temperature, and baking atmosphere is nitrogen atmosphere；
(6) appearance test and x-ray examination are carried out to capping situation；
(7) leak rate detection is carried out to capping microwave module after toasting, leak rate is 4.9 × 10-9Pa·m3/ s, meets gas
Close property requirement.
It can be seen that capping appearance test and the X-ray procedure result table by Fig. 2 ~ Fig. 7 from embodiment 1 and embodiment 2
It is bright, the nanometer silver paste of capping between cover and housing gap more uniformly, it is consistent, without obvious hole/cavity, and without nano silver
Starching phenomena such as excessive exists.Microwave module after covering to embodiment 1 and embodiment 2 carries out leak rate detection and shows its leak rate difference
It is 4.7 × 10-9Pa·m3/s、4.9×10-9Pa·m3/ s, according to the examining condition A4 of GJB 548B-1014.2, result of hunting leak
Leak rate is less than 5 × 10-9Pa·m3/ s, meets air-tightness requirement.Temperature shock experiment, experiment condition are carried out to the sample after capping
According to GJB 360B-2009, -55~+125 DEG C, 50 circulations keep 30 min under limiting temperature, leak rate still less than 5 ×
10-9Pa·m3/s。
The above results show using the principle reacted between nanometer silver paste and microwave module metal plating layer (gold, silver etc.)
The air sealing cover of microwave module can be achieved, the present invention is highly reliable for microwave module, height is airtight, high efficiency capping provides one kind and cuts
Real feasible method.
Examples provided above is only the mode illustrated, is not considered as limiting the scope of the present invention, appoint
What is subject to the method for equivalent substitution or change according to the technical scheme of the invention and its inventive conception, should all cover of the invention
Within protection scope.
Claims (9)
1. the method for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that this method comprises the following steps:
(1) nanometer silver paste is coated in microwave module casing step position to be covered；
(2) cover board is sucked with vacuum WAND or tweezers clamps cover board, cover board is put into casing step position；
(3) metal or polytetrafluoroethylene (PTFE) cushion block are clamped with special fastening tooling or with clip, fastens cover and housing；
(4) baking oven baking temperature and time are set, microwave module is put into baking oven and is toasted；
(5) after EP (end of program) to be baked, the air-tightness of microwave module is detected.
2. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
The microwave module case material is copper alloy, aluminium alloy, iron-nickel alloy, silico-aluminum, ceramic cartridge, one in silica-base material
Kind.
3. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
Contain epoxy resin or epoxy glue component in the nanometer silver paste.
4. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
The soft gold of the outer surface plating of the microwave module shell or fine silver, plated thickness are greater than 0.1 μm, and coating surface cleaning nothing
Pollution.
5. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
The application pattern of the nanometer silver paste is using spot gluing equipment or spray printing device quantization coating, or coating by hand.
6. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
The applied thickness of the nanometer silver paste is 3 μm~100 μm, and nanometer silver paste application width is after cover board fastens, and nanometer silver paste does not overflow
The width of stepped locations out.
7. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
The size of the cushion block is less than the size of cover board.
8. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
When microwave module capping baking, roasted material can bear baking temperature more than or equal to 175 DEG C, the heatproof time be greater than or
Equal to 1 hour.
9. the method according to claim 1 for carrying out air sealing cover to microwave module using nanometer silver paste, it is characterised in that:
Atmosphere when the microwave module baking oven toasts is inert gas atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910094327.2A CN110035629A (en) | 2019-01-30 | 2019-01-30 | The method that air sealing cover is carried out to microwave module using nanometer silver paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910094327.2A CN110035629A (en) | 2019-01-30 | 2019-01-30 | The method that air sealing cover is carried out to microwave module using nanometer silver paste |
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| CN110035629A true CN110035629A (en) | 2019-07-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113029460A (en) * | 2021-02-03 | 2021-06-25 | 武汉英飞光创科技有限公司 | Leak detection method for optical device |
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| CN101562191A (en) * | 2008-06-29 | 2009-10-21 | 天水华天科技股份有限公司 | Photoelectric packaging part with cavity and production method thereof |
| CN102891240A (en) * | 2012-09-18 | 2013-01-23 | 惠州雷曼光电科技有限公司 | Light emitting diode (LED) with inverted structure and manufacturing method thereof |
| CN102935518A (en) * | 2012-10-31 | 2013-02-20 | 哈尔滨工业大学深圳研究生院 | Nano silver paste for chip mounting and method for preparing nano silver paste |
| CN203327442U (en) * | 2013-06-27 | 2013-12-04 | 无锡华测电子系统有限公司 | Novel combined airtight structure for microwave assembly |
| CN105689833A (en) * | 2016-03-24 | 2016-06-22 | 株洲天微技术有限公司 | Brazing sealing covering method and structure for shell and cover plate of microcircuit module |
| CN106128966A (en) * | 2016-07-15 | 2016-11-16 | 常州银河世纪微电子有限公司 | Environmental protection welded encapsulation technique |
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2019
- 2019-01-30 CN CN201910094327.2A patent/CN110035629A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562191A (en) * | 2008-06-29 | 2009-10-21 | 天水华天科技股份有限公司 | Photoelectric packaging part with cavity and production method thereof |
| CN102891240A (en) * | 2012-09-18 | 2013-01-23 | 惠州雷曼光电科技有限公司 | Light emitting diode (LED) with inverted structure and manufacturing method thereof |
| CN102935518A (en) * | 2012-10-31 | 2013-02-20 | 哈尔滨工业大学深圳研究生院 | Nano silver paste for chip mounting and method for preparing nano silver paste |
| CN203327442U (en) * | 2013-06-27 | 2013-12-04 | 无锡华测电子系统有限公司 | Novel combined airtight structure for microwave assembly |
| CN105689833A (en) * | 2016-03-24 | 2016-06-22 | 株洲天微技术有限公司 | Brazing sealing covering method and structure for shell and cover plate of microcircuit module |
| CN106128966A (en) * | 2016-07-15 | 2016-11-16 | 常州银河世纪微电子有限公司 | Environmental protection welded encapsulation technique |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113029460A (en) * | 2021-02-03 | 2021-06-25 | 武汉英飞光创科技有限公司 | Leak detection method for optical device |
| CN113029460B (en) * | 2021-02-03 | 2021-12-31 | 武汉英飞光创科技有限公司 | Leak detection method for optical device |
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Application publication date: 20190719 |
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| RJ01 | Rejection of invention patent application after publication |