CN208848861U - A kind of Flip-Chip Using jig - Google Patents
A kind of Flip-Chip Using jig Download PDFInfo
- Publication number
- CN208848861U CN208848861U CN201821594542.6U CN201821594542U CN208848861U CN 208848861 U CN208848861 U CN 208848861U CN 201821594542 U CN201821594542 U CN 201821594542U CN 208848861 U CN208848861 U CN 208848861U
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- China
- Prior art keywords
- support plate
- flip
- chip
- substrate
- cover board
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- 239000000758 substrate Substances 0.000 claims abstract description 40
- 230000004807 localization Effects 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000002262 irrigation Effects 0.000 abstract 1
- 238000003973 irrigation Methods 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of Flip-Chip Using jigs, are related to chip encapsulation technology field.During aiming to solve the problem that flip-chip processing procedure, the calibration capability that traditional jig deforms substrate distortion is poor, and then the problem of influence flip stability and chip position precision.Its drip irrigation device includes support plate and cover board, and several magnet that can adsorb the cover board are provided on the support plate；Positioning device is provided between the support plate and cover board, the positioning device can limit the relative position of substrate Yu the support plate simultaneously；Several encapsulated holes opposite with flip region on substrate and several identifying holes opposite with localization region on substrate are offered on the cover board.The utility model reaches the torsional deformation that can reduce substrate, and then improves the stability of flip and the position precision of chip, and good work, high reliablity.
Description
Technical field
The utility model relates to chip encapsulation technology fields, more specifically, it relates to a kind of Flip-Chip Using jig.
Background technique
The form of chip package includes two kinds, respectively positive encapsulation and upside-down mounting.Conventional forward packing forms, in flip mistake
In journey to chip position required precision should not (50 μm of normal <), temperature is relatively low (normal 180 DEG C or less) during processing procedure,
Therefore substrate distortion caused by processing procedure is smaller, influences on position smaller.And temperature is higher (240 DEG C) during flip-chip packaged, it is right
Chip position required precision is high (10 μm of <).
Referring to Fig.1, substrate includes bottom plate 1, and several supporting plates 11 have been uniformly arranged on bottom plate 1.The middle section of supporting plate 11 is
Flip region, for connecting with chip, the vertex of supporting plate 11 is localization region, is positioned for machining.
The jig that country's flip-chip form uses at present is vacuum adsorption carrier or press strip, passes through vacuum adsorption carrier pair
Substrate carries out parital vacuum absorption, or the partial region using press strip fixed substrate.
But vacuum adsorption carrier or press strip are limited to the overlay area of substrate, (240 DEG C) are to base in high temperature process
The calibration capability of plate torsional deformation is poor, and then influences flip stability and chip position precision.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of Flip-Chip Using jig,
Its torsional deformation that can reduce substrate, and then improve the stability of flip and the position precision of chip.
To achieve the above object, the utility model provides following technical solution:
A kind of Flip-Chip Using jig, including support plate and cover board, be provided on the support plate it is several can adsorb it is described
The magnet of cover board；
Positioning device is provided between the support plate and cover board, the positioning device can limit substrate and the load simultaneously
The relative position of plate；
Offered on the cover board several encapsulated holes opposite with flip region on substrate and it is several with positioned on substrate
The opposite identifying hole in region.
Further, the fixing groove for magnet described in inlay card is offered on the support plate.
Further, it is offered on the support plate by the fixing groove circle in limited ring groove therein.
Further, the fixing groove is opened in end face of the support plate far from the cover board.
Further, the positioning device includes several positioning pins being carried on the support plate, and is opened in described
Location hole on cover board, with the detent fit；When substrate is connect with the support plate, several positioning pins are around described
Around substrate.
Further, the chamfered setting of the positioning pin end.
Further, several drainage holes are offered on the support plate.
In conclusion the utility model has the following beneficial effects:
1, cover board and support plate cooperate, and realize and cover to the whole face of substrate, only expose flip region and localization region, can be most
Limits ground protective substrate, substrate distortion is small, good work, high reliablity；
2, cover board and support plate are adsorbed by magnet, and can be avoided cover board or support plate contact causes to deform, Jin Erbao
The profile pattern and smoothness of card cover board and support plate improve the position precision of chip to guarantee the high flatness of substrate；
3, drainage hole is used, can guarantee the mobility of medical fluid when the thermally conductive of substrate, heat dissipation and washing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of substrate in background technique；
Fig. 2 is the top view of support plate in embodiment；
Fig. 3 is the top view of embodiment cover plate；
Fig. 4 is the partial elevation view of support plate in embodiment；
Fig. 5 is the bottom view of support plate in embodiment；
Fig. 6 is the partial sectional view of support plate in embodiment.
In figure: 1, bottom plate；11, supporting plate；2, support plate；21, the first positioning pin；22, the second positioning pin；23, drainage hole；24,
Magnet；25, fixing groove；26, limited ring groove；3, cover board；31, first positioning hole；32, encapsulated holes；33, big identifying hole；34, small knowledge
Other hole；35, half slot is positioned；36, second location hole.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Embodiment:
A kind of Flip-Chip Using jig, referring to Fig. 2 and Fig. 3 comprising support plate 2 and cover board 3, support plate 2 in the present embodiment
Material be A6061, the material of cover board 3 is blue steel piece, the equal chromium plating of surface both, so as to guarantee support plate 2 hardness and
The planarization and smoothness on surface.
Referring to Fig. 2 and Fig. 3, positioning device is provided between support plate 2 and cover board 3, positioning device includes connecting with support plate 2
Several positioning pins, and several location holes being opened on cover board 3；In view of difficulty of processing, positioning pin includes in the present embodiment
First positioning pin 21 and the second positioning pin 22, location hole include the first positioning hole 31, Yi Jiyu with the cooperation of the first positioning pin 21
Half slot 35 of positioning and second location hole 36 of second positioning pin 22 cooperation；It can be simultaneously between support plate 2 and cover board 3 in the present embodiment
Two substrates are fixed, so the quantity of the first positioning pin 21 is eight, the quantity of the second positioning pin 22 is then ten, wherein support plate
2 two long sides are respectively set there are four the second positioning pin 22, and there are two the middle positions that support plate 2 is arranged in.
Referring to Fig. 2, several drainage holes 23 are offered on support plate 2, the diameter of drainage hole 23 is 1mm in the present embodiment；Draining
Hole 23 can guarantee the mobility of medical fluid when the thermally conductive of substrate, heat dissipation and washing.
Referring to FIG. 1, FIG. 2 and FIG. 3, several encapsulated holes 32 and identifying hole, identifying hole packet in the present embodiment are offered on cover board 3
Include big identifying hole 33 and small identifying hole 34；When support plate 2, substrate and cover board 3 connect, substrate between support plate 2 and cover board 3, and
1 inlay card of bottom plate is between four the first positioning pins 21 and six the second positioning pins 22, so as to limit the relative position of substrate；
Encapsulated holes 32 on cover board 3 are opposite with the flip region at 11 middle part of supporting plate, so as to realize the encapsulation of chip and substrate；It is big to know
Other hole 33 and small identifying hole 34 are opposite with the localization region of 11 apex angle of supporting plate, so as to facilitate the processing of board to position.
Referring to Fig. 4, the diameter of the first positioning pin 21 is greater than the diameter of the second positioning pin 22 in the present embodiment, but height phase
Together；The chamfered setting in the end of first positioning pin 21 and the second positioning pin 22, so as to facilitate installation.
Referring to Fig. 5, several magnet 24 are provided on support plate 2, several magnet 24 are distributed in entire support plate 2, pass through magnet 24
Cover board 3 (referring to Fig. 3) is adsorbed, can be avoided cover board 3 or 2 contact of support plate causes to deform, and then guarantees cover board 3 and support plate
2 profile pattern and smoothness improves the position precision of chip to guarantee the high flatness of substrate.
Referring to Fig. 6, the fixing groove 25 for inlay card magnet 24 is offered on support plate 2, magnet 24 is in cylinder in the present embodiment
Shape；Limited ring groove 26 is also provided on support plate 2, limited ring groove 26 encloses fixing groove 25 in wherein；Magnet 24 is embedded in fixing groove
After in 25, using tool to limited ring groove 26 at, squeezed along the direction of fixing groove 25, necking carried out to fixing groove 25, so as to
Magnet 24 is enough prevented to be detached from from fixing groove 25；Fixing groove 25 is opened in the end face that support plate 2 is not in contact with substrate in the present embodiment,
So as to guarantee that support plate 2 is in contact with substrate the planarization and smoothness of end face.
Working principle is as follows:
Substrate is installed between support plate 2 and cover board 3, can be realized the positioning of three by positioning pin and location hole, is led to
The magnet 24 crossed on support plate 2 adsorbs cover board 3, can be realized being bonded for three；Cover board 3 carries out whole face covering to substrate, only
Expose flip region and localization region, to the maximum extent protective substrate, so as to reduce or even avoid the torsional deformation of substrate,
And then improve the stability of flip and the position precision of chip.
Claims (7)
1. a kind of Flip-Chip Using jig, it is characterised in that: including support plate (2) and cover board (3), be arranged on the support plate (2)
There are several magnet (24) that can adsorb the cover board (3)；
Be provided with positioning device between the support plate (2) and cover board (3), the positioning device can limit simultaneously substrate with it is described
The relative position of support plate (2)；
It is offered on the cover board (3) on several encapsulated holes opposite with flip region on substrate (32) and several and substrate
The opposite identifying hole in localization region.
2. Flip-Chip Using jig according to claim 1, it is characterised in that: offer and be used on the support plate (2)
The fixing groove (25) of magnet described in inlay card (24).
3. Flip-Chip Using jig according to claim 2, it is characterised in that: offer on the support plate (2) by institute
Fixing groove (25) circle is stated in limited ring groove therein (26).
4. Flip-Chip Using jig according to claim 3, it is characterised in that: the fixing groove (25) is opened in described
End face of the support plate (2) far from the cover board (3).
5. Flip-Chip Using jig described in any claim in -4 according to claim 1, it is characterised in that: the positioning
Device includes several positioning pins for being carried on the support plate (2), and be opened on the cover board (3), with the positioning pin
The location hole of cooperation；When substrate is connect with the support plate (2), several positioning pins are around around the substrate.
6. Flip-Chip Using jig according to claim 5, it is characterised in that: the positioning pin end is chamfered to be set
It sets.
7. Flip-Chip Using jig described in any claim in -4 according to claim 1, it is characterised in that: the support plate
(2) several drainage holes (23) are offered on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821594542.6U CN208848861U (en) | 2018-09-28 | 2018-09-28 | A kind of Flip-Chip Using jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821594542.6U CN208848861U (en) | 2018-09-28 | 2018-09-28 | A kind of Flip-Chip Using jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208848861U true CN208848861U (en) | 2019-05-10 |
Family
ID=66373997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821594542.6U Active CN208848861U (en) | 2018-09-28 | 2018-09-28 | A kind of Flip-Chip Using jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208848861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416134A (en) * | 2019-09-02 | 2019-11-05 | 星科金朋半导体（江阴）有限公司 | A kind of the warpage preventing jig and its application method of substrate |
-
2018
- 2018-09-28 CN CN201821594542.6U patent/CN208848861U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110416134A (en) * | 2019-09-02 | 2019-11-05 | 星科金朋半导体（江阴）有限公司 | A kind of the warpage preventing jig and its application method of substrate |
| CN110416134B (en) * | 2019-09-02 | 2024-06-07 | 星科金朋半导体（江阴）有限公司 | Warp-preventing jig for substrate and use method of warp-preventing jig |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 33 Xinghai street, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee after: Yuancheng Technology (Suzhou) Co.,Ltd. Address before: 215000 33 Xinghai street, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: Powertech Technology (Suzhou) Co.,Ltd. |