CN113507831A - Circuit board mounting system and circuit board mounting control method - Google Patents
Circuit board mounting system and circuit board mounting control method Download PDFInfo
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- CN113507831A CN113507831A CN202110796206.XA CN202110796206A CN113507831A CN 113507831 A CN113507831 A CN 113507831A CN 202110796206 A CN202110796206 A CN 202110796206A CN 113507831 A CN113507831 A CN 113507831A
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- circuit board
- dimensional tolerance
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- functional device
- mechanical arm
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/0882—Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The embodiment of the invention discloses a circuit board mounting system and a circuit board mounting control method, wherein a grabbing mechanism, an image acquisition system and a control device which are arranged in the circuit board mounting system are used for detecting the tolerance of an electronic product to be detected. Therefore, the added image recognition system can automatically recognize and judge whether the tolerance of a single part and the tolerance between parts meet the requirement, and the measurement precision and efficiency are improved. Meanwhile, the man-hour of manual measurement, data collection and arrangement, the cost of measurement equipment, auxiliary measurement tools and the like are saved, the operation error of workers is avoided, and the operation intensity of the workers is reduced.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a circuit board mounting system and a circuit board mounting control method.
Background
Electronic products play more and more important roles in life, and the quality requirements of people for the electronic products are improved. Therefore, it is important to control the dimensional tolerance of the electronic device in the production process of the electronic product. The technical problems to be solved are to rapidly and accurately judge the position accuracy of the electronic device installation and the processing capability of the electronic device production line.
Disclosure of Invention
In view of this, embodiments of the present invention provide a circuit board mounting system and a circuit board mounting control method, so as to improve the automation level and the detection accuracy of the detection process and reduce the working strength of workers.
According to a first aspect of embodiments of the present invention, there is provided a circuit board mounting system, the system comprising:
the fixing jig is provided with a plurality of accommodating grooves, and the accommodating grooves are used for bearing the circuit board;
a gripping mechanism comprising at least one robotic arm;
an image acquisition system comprising at least one camera;
and the control device is used for acquiring a detection image of the circuit board and/or the functional device in at least one node in the circuit board installation path from the image acquisition system, determining the dimensional tolerance in the installation process according to the detection image, and controlling the mechanical arm to take off the unqualified circuit board and/or functional device according to the dimensional tolerance.
Further, the at least one camera comprises a first camera located on the first node and/or a third camera located on the third node;
the at least one robotic arm comprises a first robotic arm located at the first node and/or a third robotic arm located at the third node;
the control device is used for controlling the first mechanical arm to attach the functional device to the circuit board, acquiring a first dimensional tolerance of the relative position of the functional device and the circuit board from the first camera, and taking off unqualified circuit boards and functional devices according to the first dimensional tolerance, and/or the control device is used for acquiring a third dimensional tolerance of the relative position of the accommodating groove and the circuit board from the third camera, and controlling the third mechanical arm to place the circuit board in the accommodating groove and take off unqualified circuit boards and fixing jigs according to the third dimensional tolerance.
Further, the at least one camera comprises a second camera located on the second node and/or a fourth camera located on the fourth node and a fifth camera located on the fifth node;
the at least one mechanical arm comprises a second mechanical arm located at the second node and/or a fourth mechanical arm located at the fourth node and/or a fifth mechanical arm located at the fifth node;
the circuit board mounting system further comprises a part track positioned at a second node and/or a whole board track positioned at a fourth node and/or a mounting track positioned at a fifth node, wherein the part track is used for conveying functional devices, the whole board track is used for conveying circuit boards, and the mounting track is used for conveying the fixed jigs;
the control device is further used for controlling the second camera to obtain a second dimensional tolerance of the pad position of the functional device, controlling the second mechanical arm to take away unqualified functional devices according to the second dimensional tolerance, and/or controlling the fourth camera to obtain the edge size of a circuit board on the whole supplied material and a fourth dimensional tolerance of the pad of the circuit board and the edge of the circuit board, and controlling the fourth mechanical arm to take away unqualified circuit boards according to the fourth dimensional tolerance, and/or controlling the control device to obtain the shape of the accommodating groove and a fifth dimensional tolerance of the relative position of each accommodating groove from the fifth camera, and controlling the fifth mechanical arm to take away unqualified fixing jigs according to the fifth dimensional tolerance.
In a second aspect, an embodiment of the present invention further provides a circuit board installation control method, where the method includes:
acquiring a detection image of a circuit board and/or a functional device in at least one node in a circuit board installation path;
determining the dimensional tolerance in the installation process according to the detection image;
and controlling the mechanical arm to attach the functional device to the circuit board according to the dimensional tolerance, and taking the unqualified circuit board and/or the functional device.
Further, the acquiring a detection image of the circuit board and/or the functional device in at least one node in the circuit board installation route specifically includes: acquiring a first detection image of the relative position of the circuit board and the functional device;
the determining of the dimensional tolerance in the installation process according to the detection image specifically includes: determining a first dimensional tolerance of the relative position of the circuit board and the functional device according to the first detection image;
controlling the mechanical arm to take off unqualified circuit boards and/or functional devices according to the dimensional tolerance, which specifically comprises the following steps: controlling the mechanical arm to attach a functional device on a circuit board according to the first dimensional tolerance, and taking off the unqualified circuit board and the functional device; and/or
Acquiring a third detection image of the relative position of the accommodating groove and the circuit board;
determining a third dimensional tolerance of the relative position of the accommodating groove and the circuit board according to the third detection image;
and controlling the mechanical arm to place the circuit board in the accommodating groove and take off the unqualified fixed jig and the circuit board according to the third dimensional tolerance.
Further, the taken circuit board and the functional device are mounted again;
detecting whether the first dimensional tolerance is qualified again;
and taking the circuit board and the functional device which are unqualified in the first dimensional tolerance away and repeating the steps until the first dimensional tolerance is qualified.
Further, acquiring a second detection image of the bonding pad of the functional device;
determining a second dimensional tolerance of the functional device pad location based on the second inspection image;
controlling the mechanical arm to take off unqualified functional devices according to the second dimensional tolerance; and/or
Acquiring a fourth detection image of the circuit board on the whole incoming material board;
determining the edge size of the circuit board on the whole incoming material plate and the fourth dimensional tolerance of the circuit board welding disc and the edge of the circuit board according to the fourth detection image;
and controlling the mechanical arm to take off the unqualified circuit board according to the fourth dimensional tolerance.
Further, the taken circuit board and the fixed jig are assembled again;
detecting whether the third dimensional tolerance is qualified again;
and taking the circuit board with the unqualified third dimensional tolerance and the fixed jig away and repeating the steps until the third dimensional tolerance is qualified.
Further, acquiring a fifth detection image of the fixed jig;
determining the shape of the accommodating groove of the fixing jig and a fifth dimensional tolerance of the relative position of each accommodating groove according to the fifth detection image;
and controlling the mechanical arm to take off the unqualified fixing jig according to the fifth dimensional tolerance.
Further, collecting at least one data of the first dimension tolerance, the second dimension tolerance, the third dimension tolerance, the fourth dimension tolerance and the fifth dimension tolerance;
matching the collected data with a process capability model prestored in the system, and analyzing to obtain a process capability index corresponding to the collected data;
and displaying the obtained process capability index.
According to the circuit board mounting system and the circuit board mounting control method, the tolerance of the electronic product to be tested is detected by the aid of the grabbing mechanism, the image acquisition system and the control device which are arranged in the circuit board mounting system. Therefore, the added image recognition system can automatically recognize and judge whether the tolerance of a single part and the tolerance between parts meet the requirement, and the measurement precision and efficiency are improved. Meanwhile, the man-hour of manual measurement, data collection and arrangement, the cost of measurement equipment, auxiliary measurement tools and the like are saved, the operation error of workers is avoided, and the operation intensity of the workers is reduced.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a circuit board mounting system according to an embodiment of the present invention;
FIG. 2 is a schematic view of the communication connection between the control device, the image capturing system and the grasping mechanism according to the embodiment of the invention;
FIG. 3 is a flow chart of a circuit board mounting control method of an embodiment of the invention;
FIG. 4 is a flowchart illustrating a process capability analysis according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a fixing jig according to an embodiment of the present invention;
FIG. 6 is a schematic view of a first dimensional tolerance location of an embodiment of the present invention;
FIG. 7 is a third dimensional tolerance position schematic of an embodiment of the present invention;
FIG. 8 is an enlarged schematic view of a third dimensional tolerance of the embodiment of the present invention at IV in FIG. 7;
FIG. 9 is a fourth dimensional tolerance position schematic of an embodiment of the present invention;
FIG. 10 is a fifth dimensional tolerance position schematic of an embodiment of the present invention.
Description of reference numerals:
1-a gripping mechanism;
11-a first robot arm; 12-a second mechanical arm; 13-a third mechanical arm; 14-a fourth mechanical arm; 15-a fifth robotic arm;
2-an image acquisition system;
21-a first camera; 22-a second camera; 23-a third camera; 24-a fourth camera; 25-a fifth camera;
31-mounting a rail; 32-a full slab track; 33-part rail;
4-fixing the jig; 41-a receiving groove;
5-defective product collection table;
6-feeding the whole plate; 61-a circuit board; 62-a functional device;
7-control device.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Meanwhile, it should be understood that, in the following description, a "circuit" refers to a conductive loop constituted by at least one element or sub-circuit through electrical or electromagnetic connection. When an element or circuit is referred to as being "connected to" another element or element/circuit is referred to as being "connected between" two nodes, it may be directly coupled or connected to the other element or intervening elements may be present, and the connection between the elements may be physical, logical, or a combination thereof. In contrast, when an element is referred to as being "directly coupled" or "directly connected" to another element, it is intended that there are no intervening elements present.
Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Surface Mount Technology (SMT), known collectively in english as Surface Mount Technology, is currently the most popular Technology and process in the electronic assembly industry. The surface-mounted device is a Circuit connecting technology which is used for assembling components on the surface of a leadless or short lead wire, mounting the components on the surface of a Printed Circuit Board (PCB) or the surface of other substrates, and welding and assembling the components by methods such as reflow soldering, dip soldering and the like.
The dimensional tolerance of the processed materials needs to be detected in the assembly process of the circuit board so as to ensure the quality requirement of the mounting process. The detection mode commonly used at present is to carry out artifical selective examination to the material, and artifical selective examination can not accurate feedback material reach quality standard, also can not provide sufficient basis for the engineer analysis problem.
Fig. 1 is a schematic diagram of a circuit board mounting system according to an embodiment of the present invention, fig. 2 is a schematic diagram of communication connection between a control device 7, an image capturing system 2, and a grasping mechanism 1 according to an embodiment of the present invention, and as shown in fig. 1-2, the circuit board mounting system according to the embodiment includes: the fixing jig 4 comprises a plurality of accommodating grooves 41, the accommodating grooves 41 are used for bearing the circuit board 61, the grabbing mechanism 1, the image acquisition system 2 and the control device 7. The grasping mechanism 1 includes at least one robot arm, the image capturing system 2 includes at least one camera, and the control device 7 is configured to acquire a detection image of the circuit board 61 and/or the functional device 62 in at least one node in the installation route of the circuit board 61 from the image capturing system 2, and determine a dimensional tolerance in the installation process based on the detection image. At the same time, the robot arm is controlled to remove the failed circuit board 61 and/or functional device 62 according to the dimensional tolerance. Through the circuit board mounting system in this embodiment, can carry out automatic subsides to circuit board 61 and functional device 62 and carry out tolerance detection simultaneously, promote measurement accuracy to reduce the manual operation degree of difficulty.
Optionally, the functional device 62 may be a device that is attached to the circuit board and can realize a certain function, such as a metal dome, a microphone speaker, a charging port, and the like.
Further, the circuit board mounting system in this embodiment may mount an LCP (liquid crystal polymer) flexible board, and the LCP flexible board may be combined with a metal elastic piece, a microphone speaker, and other functional devices to form an electronic device applied to an apparatus such as an earphone and a mobile phone. The containing groove 41 and the LCP flexible soft board are in clearance fit in the mounting process, so that the LCP flexible soft board is effectively positioned. LCP, known as Liquid crystal polymer in english, has properties such as high strength, high rigidity, high temperature resistance, low shrinkage, and high electrical insulation, and is widely used in the fields of electronic parts and various heat-resistant small electronic components.
Specifically, the robot arm in this embodiment may be a multi-joint robot arm, and may also be a rectangular coordinate robot arm. Considering that the fixing jig 4, the circuit board 61, and the functional device 62 are substantially on the same horizontal plane during the assembling process, it is preferable to use a rectangular coordinate robot, so that the equipment cost can be saved. The camera used with the mechanical arm can be one of CCD, CMOS and other cameras. The circuit board mounting system of the embodiment can automatically identify and judge whether the tolerance of a single part and the tolerance between parts meet the requirement through the added image identification system 2, thereby improving the measurement precision and efficiency. Meanwhile, the man-hour of manual measurement, data collection and arrangement, the cost of measurement equipment, auxiliary measurement tools and the like are saved, the operation error of workers is avoided, and the operation intensity of the workers is reduced.
Further, the at least one camera comprises a first camera 21 located at the first node, the at least one robot arm comprises a first robot arm 11 located at the first node, the control device 7 is configured to control the first robot arm 11 to attach the functional device 62 to the circuit board, and to obtain a first dimensional tolerance of the relative position of the functional device 62 and the circuit board 61 from the first camera 21, and to remove the rejected circuit board 61 and the functional device 62 according to the first dimensional tolerance.
In some embodiments, as shown in fig. 6, the first dimensional tolerance comprises a1, a2, B1, B2, C1, and C2. The 3 positions marked i, ii, and iii in fig. 6 are the positions of the metal dome, the charging port, and the 3 functional devices 62 of the microphone horn attached to the circuit board 61 in this embodiment. Wherein a1, a2 and B1, B2 and C1, C2 are length direction and width direction dimensional tolerances of the relative positions of the first, second and third functional devices 62 and the circuit board 61. The mutual position relation between the circuit board 61 and the functional device 62 can be judged by utilizing the first dimensional tolerance, and the accuracy of the mounting position of the functional device 62 on the circuit board 61 is further ensured. The relative position relation of the 3 functional devices 62 on the circuit board 61 can be judged by utilizing the first dimensional tolerance, and the accuracy of the installation positions of the metal elastic sheet, the microphone horn and the charging port on the circuit board 61 is further ensured.
Further, the at least one camera includes a second camera 22 located at a second node, the at least one robotic arm includes a second robotic arm 12 located at the second node, and the circuit board mounting system further includes a parts rail 33 located at the second node, the parts rail 33 being for transporting the functional device 62. The control device 7 is further configured to control the second camera 22 to obtain a second dimensional tolerance of the pad position of the functional device 62, and control the second mechanical arm 12 to remove the failed functional device 62 according to the second dimensional tolerance. The size of the pad of the functional device 62 can be screened by using the second dimensional tolerance, and the functional device 62 with the unqualified pad size is taken away in advance before the circuit board 61 is assembled, so that the mounting precision of the functional device 62 and the circuit board 61 is improved.
Further, the at least one camera includes a third camera 23 located at the third node, the at least one robot arm includes a third robot arm 13 located at the third node, and the control device 7 is further configured to obtain a third dimensional tolerance of the relative position of the accommodating groove 41 and the circuit board 61 from the third camera 23, control the third robot arm 13 to place the circuit board 61 in the accommodating groove 41 according to the third dimensional tolerance, and remove the circuit board 61 and the functional device 62 that are not qualified by the third dimensional tolerance.
In some embodiments, as shown in fig. 6-7, the third dimensional tolerance comprises D1, D2. Wherein D1 is a dimensional tolerance between the circuit board 61 and the receiving slot 41 in the length direction, and D2 is a dimensional tolerance between the circuit board 61 and the receiving slot 41 in the width direction. By detecting the third dimensional tolerance, the relative position accuracy of the accommodating groove 41 and the circuit board 61 is ensured, thereby providing a basis for further ensuring the position accuracy of the functional device 62 and the circuit board 61.
Further, the at least one camera includes a fourth camera 24 located at a fourth node, the at least one robot includes a fourth robot 14 located at the fourth node, the circuit board mounting system further includes a board finishing rail 32 located at the fourth node, the board finishing rail 32 is used for conveying the circuit board 61, the control device 7 is further used for controlling the fourth camera 24 to acquire the edge size of the circuit board 61 on the incoming finished board 6 and a fourth dimensional tolerance between the pad of the circuit board 61 and the edge of the circuit board 61, and controlling the fourth robot 14 to take away the unqualified circuit board 61 according to the fourth dimensional tolerance.
In some embodiments, as shown in fig. 9, the fourth dimensional tolerance includes E1, E2, A3, a4, B3, B4, C3, and C4. Wherein, E1, E2 are dimension tolerance of the circuit board length and width direction, and A3, a4, B3, B4, C3 and C4 are dimension tolerance of the circuit board 61 length and width direction of the pad relative to the outer edge of the circuit board 61. Wherein, I ', II ' and III ' bonding pads respectively correspond to the metal shrapnel, the charging port and the bonding pad position of microphone loudspeaker. Before the circuit board 61 placed on the fixing jig 4, the size of the circuit board 61 is detected, so that the position accuracy of the circuit board 61 and the fixing jig 4 and the position accuracy of the functional device 62 and the circuit board 61 during installation can be effectively improved. Meanwhile, the manipulator effectively reduces the operation difficulty of operators.
Further, the at least one camera includes a fifth camera 25 located at a fifth node, the at least one robot arm includes a fifth robot arm 15 located at the fifth node, the circuit board mounting system includes a mounting rail 31 located at the fifth node, and the mounting rail 31 is used to convey the fixing jig 4. The control device 7 is configured to obtain a fifth dimensional tolerance of the shapes of the accommodating grooves 41 and the relative positions of the accommodating grooves 41 from the fifth camera 25, and control the fifth robot arm 15 to take away the unqualified fixture 4 according to the fifth dimensional tolerance. The mounting rail 31 in this embodiment can automatically convey the fixing jig 4 to a corresponding node of the circuit board mounting system, and is matched with the grabbing mechanism 1 and the image acquisition system 2, so as to realize automatic assembly.
In some embodiments, mounting rails 31 may be used in conjunction with part rails 33 and/or full board rails 32, which may further increase the level of automation of the circuit board mounting system by having robotic arms disposed between the different rails.
In some embodiments, as shown in fig. 10, the fifth dimensional tolerance includes G1, G2, F1, and F2. Wherein G1 and G2 are respectively the dimensional tolerances in the length direction and the width direction between the accommodating grooves 41, and F1 and F2 are respectively the dimensional tolerances in the length direction and the width direction of a single accommodating groove 41. Before the circuit board 61 is placed on the fixing jig 4, the size of the accommodating groove 41 on the fixing jig 4 is detected, so that the fixing jig 4 with the dimensional tolerance meeting the requirement can be screened out, and the relative precision of the circuit board 61 and the fixing jig 4 during installation is further improved.
In other embodiments, the defective product collecting table 5 may be further disposed near the first robot arm 11, the second robot arm 12, the third robot arm 13, the fourth robot arm 14, and the fifth robot arm 15, and at least one of the fixing jigs 4, the circuit boards 61, and the functional devices 62, which are not qualified in dimensional tolerance, may be intensively placed on the defective product collecting table 5, so that the unqualified workpieces are intensively processed, and the environment in the factory building is cleaner.
In some embodiments, the circuit board mounting system may further include a fixing jig 4 loading conveyor located in front of the fifth node of the mounting rail 31, and the conveyor may adjust a conveying speed of the fixing jig 4 according to a current processing progress.
In other embodiments, a solder paste printing step and a solder paste detecting step are further included between the first node and the second node of the circuit board mounting system. Preferably, to improve the automation degree of the system, the solder paste printing and the solder paste detection can be set to be completed by the cooperation of the mechanical arm and the camera.
Furthermore, a reflow soldering process is arranged behind the first node of the circuit board mounting system. Reflow soldering refers to soldering by using a reflow oven, an infrared heating lamp or a heat gun, etc. to melt solder by controlled heating after one or more electronic components are connected to contact pads by using solder paste (a mixture of solder and flux), so as to achieve permanent bonding. After the reflow soldering, the work is taken out from the mounting rail 61.
The circuit board mounting system of the present embodiment performs circuit board mounting control according to the following flow, as shown in fig. 3, the flow includes:
step S100: acquiring a detection image of the circuit board 61 and/or the functional device 62 in at least one node in the circuit board installation path;
step S200: determining the dimensional tolerance in the installation process according to the detection image;
step S300: the robot arm is controlled to attach the functional device 62 to the circuit board and to remove the defective circuit board 61 and/or functional device 62 according to the dimensional tolerance.
By the circuit board installation control method, the circuit board 61 and the functional device 62 can be automatically mounted and subjected to tolerance detection, so that the measurement precision is improved, and the manual operation difficulty is reduced.
Further, acquiring a detection image of the circuit board 61 and/or the functional device 62 in at least one node in the circuit board installation route specifically includes: a first detection image of the relative position of the circuit board 61 and the functional device 62 is acquired. Determining the dimensional tolerance in the installation process according to the detection image, specifically: a first dimensional tolerance of the relative position of the circuit board 61 and the functional device 62 is determined from the first inspection image. Controlling the mechanical arm to take away unqualified circuit boards 61 and/or functional devices 62 according to the dimensional tolerance, specifically: the robot arm is controlled to attach the functional device 62 to the circuit board 61 based on the first dimensional tolerance, and to remove the defective circuit board 61 and the functional device 62. The first dimensional tolerance can be used for judging the position relation between the circuit board 61 and the functional device 62, so that the accurate determination of the mounting position of the functional device 62 on the circuit board 61 is ensured.
Preferably, the circuit board installation control method further includes mounting the removed circuit board 61 and the functional device 62 again, detecting whether the first dimensional tolerance is qualified again, removing the circuit board 61 and the functional device 62 which are unqualified in the first dimensional tolerance, and repeating the above steps until the first dimensional tolerance is qualified. In the embodiment, the circuit board 61 with unqualified first dimensional tolerance and the functional device 62 are repeatedly assembled, so that the intelligent level of the process system is improved.
Further, the circuit board installation control method further comprises the steps of obtaining a second detection image of the bonding pad of the functional device 62, determining a second dimension tolerance of the position of the bonding pad of the functional device 62 according to the second detection image, and controlling the mechanical arm to take the unqualified functional device 62 according to the second dimension tolerance. The second dimensional tolerance is used to screen the pad size of the functional device 62, and before the circuit board is assembled, the functional device 62 with the unqualified pad size is taken away in advance, so that the mounting precision of the functional device 62 and the circuit board 61 is improved. Meanwhile, the part rail 33 arranged at the second node can be matched with the manipulator and the mounting rail 31 to realize automatic conveying of the functional device 62.
Further, the circuit board installation control method further includes obtaining a third detection image of the relative position between the accommodating groove 41 and the circuit board 61, determining a third dimensional tolerance of the relative position between the accommodating groove 41 and the circuit board 61 according to the third detection image, and controlling the mechanical arm to place the circuit board 61 in the accommodating groove 41 and take away the unqualified fixing jig 4 and the circuit board 61 according to the third dimensional tolerance. The relative positional relationship of the accommodating groove 41 and the circuit board 61 is ensured by the third dimensional tolerance.
Preferably, the circuit board installation control method further includes reassembling the taken circuit board 61 and the fixing jig 4, detecting whether the third dimensional tolerance is qualified again, taking the circuit board 61 and the fixing jig 4 which are unqualified in the third dimensional tolerance away, and repeating the above steps until the third dimensional tolerance is qualified. In this embodiment, the circuit board 61 with the unqualified third dimensional tolerance and the functional device 62 are repeatedly assembled, so that the intelligence level of the process system is improved.
Further, the circuit board installation control method further comprises the steps of obtaining a fourth detection image of the circuit board 61 on the whole incoming material board 6, determining the edge size of the circuit board 61 on the whole incoming material board 6 and a fourth size tolerance between the circuit board 61 and the edge of the circuit board 61 according to the fourth detection image, and controlling the mechanical arm to take off unqualified circuit boards according to the fourth size tolerance. Before the circuit board 61 placed on the fixed jig 4, the size of the circuit board 61 is detected, and the relative position precision of the circuit board 61 and the fixed jig 4 during installation can be effectively improved. Meanwhile, the manipulator effectively reduces the operation difficulty of operators.
Further, a fifth detection image of the fixing jig 4 is obtained, the shape of the accommodating groove 41 of the fixing jig 4 and a fifth dimensional tolerance of the relative position of each accommodating groove 41 are determined according to the fifth detection image, and the mechanical arm is controlled to take away the unqualified fixing jig 4 according to the fifth dimensional tolerance. Before the circuit board 61 placed on the fixing jig 4 is fixed, the size of the accommodating groove 41 on the fixing jig 4 is detected, so that the relative accuracy of the circuit board 61 and the fixing jig 4 during installation is improved.
In another alternative implementation, as shown in fig. 4, the circuit board mounting system of the present embodiment performs circuit board mounting control according to the following flow. In this implementation, the collected dimensional tolerance is matched with the process capability model to determine the process capability of the process system, and the process includes:
step S100': collecting at least one data of a first size tolerance, a second size tolerance, a third size tolerance, a fourth size tolerance and a fifth size tolerance;
step S200': matching the collected data with a process capability model prestored in the system, and analyzing to obtain a process capability index corresponding to the collected data;
step S300': and displaying the obtained process capability index.
The process capability refers to the actual working capability of a process in a controlled state (steady state) for a certain period of time. The process capability index is the degree of process capability meeting the product quality standard requirements (specification range, etc.), or the actual process capability of a process in a controlled state (steady state) for a certain period of time. In the embodiment, the collected dimensional tolerances and the process capability model are used for comparative analysis, the process capability of the process system can be detected, manual measurement, data collection and data arrangement are omitted, and the product quality is further ensured.
Fig. 5 is a schematic structural view of the fixing jig 4 according to the embodiment of the present invention, and as shown in fig. 5, the fixing jig 4 is made of a steel sheet, and the receiving grooves 41 formed thereon are distributed in a rectangular array of 3 × 8. The fixing jig 4 can accommodate a plurality of circuit boards 61 at the same time.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A circuit board mounting system, the system comprising:
the fixing jig is provided with a plurality of accommodating grooves, and the accommodating grooves are used for bearing the circuit board;
a gripping mechanism comprising at least one robotic arm;
an image acquisition system comprising at least one camera;
and the control device is used for acquiring a detection image of the circuit board and/or the functional device in at least one node in the circuit board installation path from the image acquisition system, determining the dimensional tolerance in the installation process according to the detection image, and controlling the mechanical arm to take off the unqualified circuit board and/or functional device according to the dimensional tolerance.
2. The circuit board mounting system according to claim 1, wherein the at least one camera comprises a first camera located on a first node and/or a third camera located on a third node;
the at least one robotic arm comprises a first robotic arm located at the first node and/or a third robotic arm located at the third node;
the control device is used for controlling the first mechanical arm to attach the functional device to the circuit board, acquiring a first dimensional tolerance of the relative position of the functional device and the circuit board from the first camera, and taking off unqualified circuit boards and functional devices according to the first dimensional tolerance, and/or the control device is used for acquiring a third dimensional tolerance of the relative position of the accommodating groove and the circuit board from the third camera, and controlling the third mechanical arm to place the circuit board in the accommodating groove and take off unqualified circuit boards and fixing jigs according to the third dimensional tolerance.
3. The circuit board mounting system according to claim 1, wherein the at least one camera comprises a second camera located on a second node and/or a fourth camera located on a fourth node and/or a fifth camera located on a fifth node;
the at least one mechanical arm comprises a second mechanical arm located at the second node and/or a fourth mechanical arm located at the fourth node and/or a fifth mechanical arm located at the fifth node;
the circuit board mounting system further comprises a part track positioned at the second node and/or a whole board track positioned at the fourth node and/or a mounting track positioned at the fifth node, wherein the part track is used for conveying functional devices, the whole board track is used for conveying circuit boards, and the mounting track is used for conveying the fixed jigs;
the control device is further used for controlling the second camera to obtain a second dimensional tolerance of the pad position of the functional device, controlling the second mechanical arm to take away unqualified functional devices according to the second dimensional tolerance, and/or controlling the fourth camera to obtain the edge size of a circuit board on the whole supplied material and a fourth dimensional tolerance of the pad of the circuit board and the edge of the circuit board, and controlling the fourth mechanical arm to take away unqualified circuit boards according to the fourth dimensional tolerance, and/or controlling the control device to obtain the shape of the accommodating groove and a fifth dimensional tolerance of the relative position of each accommodating groove from the fifth camera, and controlling the fifth mechanical arm to take away unqualified fixing jigs according to the fifth dimensional tolerance.
4. A circuit board mounting control method, characterized in that the method comprises:
acquiring a detection image of a circuit board and/or a functional device in at least one node in a circuit board installation path;
determining the dimensional tolerance in the installation process according to the detection image;
and controlling the mechanical arm to attach the functional device to the circuit board according to the dimensional tolerance, and taking the unqualified circuit board and/or the functional device.
5. The circuit board installation control method according to claim 4, wherein the obtaining of the detection image of the circuit board and/or the functional device in at least one node in the circuit board installation route specifically includes: acquiring a first detection image of the relative position of the circuit board and the functional device;
the determining of the dimensional tolerance in the installation process according to the detection image specifically includes: determining a first dimensional tolerance of the relative position of the circuit board and the functional device according to the first detection image;
controlling the mechanical arm to take off unqualified circuit boards and/or functional devices according to the dimensional tolerance, which specifically comprises the following steps: controlling the mechanical arm to attach a functional device on a circuit board according to the first dimensional tolerance, and taking off the unqualified circuit board and the functional device; and/or
Acquiring a third detection image of the relative position of the accommodating groove and the circuit board;
determining a third dimensional tolerance of the relative position of the accommodating groove and the circuit board according to the third detection image;
and controlling the mechanical arm to place the circuit board in the accommodating groove and take off the unqualified fixed jig and the circuit board according to the third dimensional tolerance.
6. The circuit board mount control method according to claim 5, further comprising:
mounting the taken circuit board and the functional device again;
detecting whether the first dimensional tolerance is qualified again;
and taking the circuit board and the functional device which are unqualified in the first dimensional tolerance away and repeating the steps until the first dimensional tolerance is qualified.
7. The circuit board mount control method according to claim 5, further comprising:
acquiring a second detection image of a bonding pad of the functional device;
determining a second dimensional tolerance of the functional device pad location based on the second inspection image;
controlling the mechanical arm to take off unqualified functional devices according to the second dimensional tolerance;
and/or acquiring a fourth detection image of the circuit board on the whole incoming material board;
determining the edge size of the circuit board on the whole incoming material plate and the fourth dimensional tolerance of the circuit board welding disc and the edge of the circuit board according to the fourth detection image;
and controlling the mechanical arm to take off the unqualified circuit board according to the fourth dimensional tolerance.
8. The circuit board mount control method according to claim 5, further comprising:
reassembling the taken circuit board and the fixed jig;
detecting whether the third dimensional tolerance is qualified again;
and taking the circuit board with the unqualified third dimensional tolerance and the fixed jig away and repeating the steps until the third dimensional tolerance is qualified.
9. The circuit board mount control method according to claim 7, further comprising:
acquiring a fifth detection image of the fixed jig;
determining the shape of the accommodating groove of the fixing jig and a fifth dimensional tolerance of the relative position of each accommodating groove according to the fifth detection image;
and controlling the mechanical arm to take off the unqualified fixing jig according to the fifth dimensional tolerance.
10. The circuit board mount control method according to claim 9, further comprising:
collecting at least one of the first dimensional tolerance, the second dimensional tolerance, the third dimensional tolerance, the fourth dimensional tolerance, and the fifth dimensional tolerance;
matching the collected data with a process capability model prestored in the system, and analyzing to obtain a process capability index corresponding to the collected data;
and displaying the obtained process capability index.
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| CN202110796206.XA CN113507831B (en) | 2021-07-14 | 2021-07-14 | Circuit board mounting system and circuit board mounting control method |
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| CN202110796206.XA CN113507831B (en) | 2021-07-14 | 2021-07-14 | Circuit board mounting system and circuit board mounting control method |
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| CN113507831B (en) | 2022-09-16 |
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