1337300 0:?9年11月16日修正替換頁 六、發明說明： 【發明所屬之技術領域】 [⑻]本發明涉及表面貼裝技術，尤其涉及一種表面貼裝對位 裝置及其對位方法。 【先前技術】1337300 0:? November 16th, revised replacement page VI, invention description: [Technical field of invention] [(8)] The present invention relates to surface mount technology, and more particularly to a surface mount alignment device and alignment method thereof . [Prior Art]
_]表面貼裝技術（Surface Mounting Technology，SMT )由於可靠性高、易於實現自動化等特點，已被廣泛應 用於電子元器件與印刷電路板之組裝β [0003] 目前’電子元器件可採用自動貼月設備實現電子元器件 與印刷電路板之焊盤之自動對位貼片，從而實現精確表 面貼裝。參見文獻Capson，G.W. ; Tsang, R.M.C，_]Surface Mounting Technology (SMT) has been widely used in the assembly of electronic components and printed circuit boards due to its high reliability and easy automation. [0003] At present, electronic components can be automatically used. The monthly device enables automatic alignment of the pads of electronic components and printed circuit boards for precise surface mounting. See the literature Capson, G.W.; Tsang, R.M.C,
Automatic visual measurement of surface-mount device placement, IEEE Transactions on Robotics and Automation > 1990,6( 1), 44- 52 。自動貼片設備通常具有視覺對位系統，於電子元器件 與印刷電路板之自動表面貼裝過程中，視覺對位系統之 影像感測器裝置，例如電荷耗.合（charged coupled device ’ CCD)攝像裝置，會對整個待貼裝之電子元器 件進行圖像感測及座標採集，再根據所採集待貼裝之電 子元器件之整個圖像之座標，將待貼裝之電子元器件與 於自動貼片設備中設定之座標點預先固定之印刷電路板 之焊盤進行對位貼片。 [0004] 惟，視覺對位系統之影像感測器裝置之視野範圍通常僅 為50mmx50min。由於視野範圍之限制，影像感測器裝置 通常只能直接獲取小尺寸（尺寸規格小於50mmx50mm) 096126558 表單編號A0101 第4頁/共23頁 0993409947-0 1337300 099年11月16日梭正替换頁 之電子元器件之整個圖像座標，故亦只能實現對小尺寸 之電子元器件進行自動對位貼片。當待貼裝之電子元器 件之尺寸較大時，例如尺寸規格為62mmx6mm之連接器零 件（Connector)，由於該尺寸已經超出了視覺對位系 統之影像感測器裝置之視野範圍，故無法準確獲得電子 元器件之整個圖像座標，從而無法實現準確地自動對位 貼片。因此，目前對於大尺寸電子元器件之對位貼片通 常需要人工來完成，這不僅耗費較多之人力與時間，而 且於對位貼片過程中還容易造成人為對位誤差，從而影 響待貼裝之電子元器件表面貼裝之品質。 【發明内容】 [0005] 有鑑於此，提供一種表面貼裝對位裝置及其對位方法實 屬必要，以使大尺寸電子元器件於表面貼裝過程中實現 準確自動對位。 [0006] 以下將以實施例說明一種表面貼裝對位裝置及其對位方 法。 [0007] 該表面貼裝對位裝置，用於將待貼裝之電子元器件表面 對位貼裝於印刷電路板之焊盤，該表面貼裝對位裝置包 括第一影像感測裝置，用於感測待貼裝之電子元器件之 輪廓之圖像；第二影像感測裝置，用於感測印刷電路板 之焊盤之輪廓之圖像；拾取貼片裝置，用於拾取並移動 待貼裝之電子元器件；以及中央控制處理裝置，該中央 控制處理裝置分別與第一影像感測裝置、第二影像感測 裝置及拾取貼片裝置相連，用於控制第一影像感測裝置 及第二影像感測裝置並進行圖像感測數據處理，從而得 096126558 表單編號A0101 第5頁/共23頁 0993409947-0 »37300 099年11月16日按正替換頁 到待貼裝之電子元器件之幾何中心座標及焊盤之幾何中 心座標，及用於控制拾取貼片裝置移動到待貼裝之電子 元器件之幾何中心座標拾取待貼裝之電子元器件，並移 動到焊盤之幾何中心座標進行對位貼片。 [0008] 該表面貼裝對位方法，用於將待貼裝之電子元器件表面 對位貼裝於印刷電路板之焊盤，其包括以下步驟：利用 第一影像感測裝置感測待貼裝之電子元器件之輪廓之圖 像，並利用中央控制處理裝置處理所採集之圖像感測數 據，從而得到待貼裝之電子元器件之幾何中心座標；利 用第二影像感測裝置感測印刷電路板之焊盤之輪廓之圖 像，並利用中央控制處理裝直表理所採集乏圖像感測數 據，從而得到待貼裝之電子元器件之幾何中心座標；移 動拾取貼片裝置到待貼裝之電子元器件之幾何中心座標 以拾取待貼裝之電子元器件，並移動到焊盤之幾何中心 座標進行對位貼片。 [0009] 與先前技術相比，該表面貼裝對位裝置及其對位方法， 首先，分別對待貼裝之電子元器件之輪廓以及印刷電路 板之焊盤之輪廓進行圖像感測，可克服影像感測裝置視 野範圍之限制，從而可實現大尺寸電子元器件之準確自 動對位貼片，有效提高大尺寸電子元器件之表面貼裝對 位貼片之效率；其次，通過對待貼裝之電子元器件以及 印刷電路板之焊盤進行圖像感測，處理獲得待貼裝之電 子元器件之幾何中心座標及焊盤之幾何中心座標，根據 獲得之座標移動拾取貼片裝置不僅可準確拾取電子元器 件，而且可實現待貼裝之電子元器件之幾何中心與焊盤 096126558 表單編號A0101 第6頁/共23頁 0993409947-0 1337300 [0010] [0011] [0012] [0013] 096126558 099年11月16日梭正替換頁 之幾何中心之準確對位，從而提高了大尺寸電子元器件 之表面貼裝對位貼片之精確度。 【實施方式】 下面結合附圖及實施例對本技術方案提供之表面貼裝對 位裝置及其對位方法作進一步說明。 請參閱圖1，本技術方案實施例提供之第一種表面貼裝對 位裝置10。該表面貼裝對位裝置10包括工作台110、中央 控制處理裝置120、第一影像感測裝置130、第二影像感 測裝置140及拾取貼片裝置15G。 該工作台110用於放置被感測物件，例如待貼裝之電子元 器件與印刷電路板。該工作台110與第一影像感測裝置 130、第二影像感測裝置140及拾取貼片裝置150相對設 置，使得第一影像感測裝置130與第二影像感測裝置140 可從工作台110之上方對放置於工作台110之被感測物件 進行圖像感測，並使得拾取貼片裝置150可從工作台110 上方對放置於工作台110之被感測物件進行拾取與貼片等 操作。 該中央控制處理裝置1 20分別與第一影像感測裝置1 30、 第二影像感測裝置14 0及拾取貼片裝置150相連，用於控 制第一影像感測裝置130及第二影像感測裝置140移動並 進行圖像感測；並處理第一影像感測裝置130及第二影像 感測裝置140所採集之圖像感測數據，根據第一影像感測 裝置130及第二影像感測裝置140所採集之圖像感測數據 ，分別計算得到第一影像感測裝置130感測之物件與第二 影像感測裝置140感測之物件之幾何中心於同一個坐標系 表單編號A0101 第7頁/共23頁 0993409947-0 1-337300 099年11月16日按正替换頁 中之座標；及用於控制拾取貼片裝置150移動並進行對位 貼片。 [0014] 該第一影像感測裝置1 30與第二影像感測裝置140用於感 測圖像數據。本實施例中，該第一影像感測裝置130用於 感測待貼裝之電子元器件之輪廓之圖像數據，例如待貼 裝之電子元器件之相對兩端部之輪廓之圖像數據；該第 二影像感測裝置140用於感測印刷電路板之焊盤之輪廓之 圖像數據，例如焊盤之相對兩端部之輪廓之圖像數據。 該第一影像感測裝置130包括一第一攝像感測頭131，例 如電荷耗合（charged coupled device，CCD)攝像 頭，該第二影像感測裝置一第二攝像感測頭141 - ，例如電荷耦合攝像頭。該測裝i 130於中央 .· . ； 控制處理裝置120之控制下沿被感測物件之輪廓移動並利 用第一攝像感測頭1 31從被感測物件之上方分別對被感測 物件（例如待貼裝之電子元器件）之輪廓進行圖像感測 。該第二影像感測裝置140於中央控制處理裝置120之控 制下沿被感測物件之輪廓移動並利用第二攝像感測頭141 從被感測物件之上方分別對被感測物件（例如印刷電路 板之焊盤）之輪廓進行圖像感測。由第一影像感測裝置 130與第二影像感測裝置140採集到之圖像感測數據傳輸 到中央控制處理裝置120進行數據處理。根攄第一影像感 測裝置130與第二影像感測裝置140採集到之圖像感測數 據計算得到被感測物件如待貼裝之電子元器件與焊盤之 幾何中心座標，並對獲得之座標進行存儲。 [0015] 該拾取貼片裝置150可為真空吸附式或機械式，其用於拾 096126558 表單編號A0101 第8頁/共23頁 0993409947-0 1337300 _ 099年11月16日接正替換頁 取被感測物件並進行移動對位貼片。例如拾取待貼裝之 電子元器件移動到印刷電路板之焊盤進行對位貼裝。該 拾取貼片裝置150可於中央控制處理裝置120之控制下移 動到待貼裝之電子元器件對應座標位置，對待貼裝之電 子元器件以真空吸附或機械方式進行拾取，並可於該中 央控制處理裝置120之控制下移動到印刷電路板之焊盤之 對應座標位置，將待貼裝之電子元器件與焊盤進行對位 貼片。 [0016] 請參閱圖2，本技術方案實施例提供之第二種表面貼裝對 位裝置20。該表面貼裝對位裝置20與表面貼裝對位裝置 10之不同之處在於，該第一影像感測裝置230包括兩個第 一攝像感測頭231，該第二影像感測裝置240包括兩個第 二攝像感測頭241。該第一影像感測裝置230與第二影像 感測裝置於中央控制處理裝置220之控制下移動並從被感 測物件上方進行圖像感測。此時，該兩個第一攝像感測 頭231之間之距離可調節，使兩個第一攝像感測頭231分 別位於被感測物件（例如待貼裝之電子元器件）之相對 兩端部，中央控制處理裝置220根據兩個第一攝像感測頭 231所感測之圖像數據計算得到被感測物件之幾何中心座 標。該兩個第二攝像感測頭241之間之距離亦可調節，使 兩個第二攝像感測頭2 41分別位於被感測物件（例如印刷 電路板之焊盤）之相對兩端部，中央控制處理裝置220根 據兩個第二攝像感測頭241所感測之圖像數據計算得到被 感測物件之幾何中心座標。當然，對於其他不規則形狀 之被感測物件，該第一影像感測裝置230可設置兩個以上 096126558 表單編號A0101 第9頁/共23頁 0993409947-0 1337300 099年11月16日修正替换頁 之第一攝像感測頭231，該複數第一攝像感測頭231可調 節沿被感測物件（例如待貼裝之電子元器件）之輪廓設 置。該第二影像感測裝置240可設置兩個以上之第二攝像 感測頭241，該複數第二攝像感測頭241可沿被感測物件 (例如焊盤）之輪廓設置。 [0017] 當然，亦可為該第一影像感測裝置230包括一第一攝像感 測頭231，且該第二影像感測裝置240包括複數第二攝像 感測頭241，或該第一影像感測裝置230包括複數第一攝 像感測頭231，且該第二影像感測裝置240包括一第二攝 像感測頭2 41。 [0018] 本技術方案實施例採用表面貼裝對位.裝置1 0將待貼裝之 電子元器件30與印刷電路板40之焊盤410進行對位，並將 待貼裝之電子元器件30貼裝到印刷電路板40之焊盤410。 [0019] 請參閱圖3，本技術方案實施例提供之待貼裝之電子元器 件30為大尺寸電子元器件，例如連接器零件。該待貼裝 之電子元器件30之俯視圖呈矩形。該待貼裝之電子元器 件30具有第一端部310及與第一端部310相對之第二端部 320，該第一端部310與第二端部320呈轴對稱。 [0020] 請參閱圖4，本技術方案實施例提供之印刷電路板40為軟 性電路板。該印刷電路板40具有焊盤410，該焊盤410之 形狀及尺寸與待貼裝之電子元器件30之形狀及尺寸相對 應，用於貼裝電子元器件30。本實施例中，該焊盤410對 應待貼裝之電子元器件30為矩形焊盤，該焊盤410具有第 一端部411及與第一端部411相對之第二端部412，該第 096126558 表單編號A0101 第10頁/共23頁 0993409947-0 1337300 _ 099年11月16日梭正替換頁 一端部411與第二端部412呈軸對稱。 [0021] 於進行表面對位貼裝之前，待貼裝之電子元器件30與印 刷電路板40可同時直接放置於表面貼裝對位裝置10之工 作台110相應位置，亦可通過相應之承載裝置承載後同時 放置於表面貼裝對位裝置10之工作台110相應位置。優選 地，為了提高表面貼裝之效率以及對位之精確度，可將 複數待貼裝之電子元器件30放置排列於相應之承載裝置 中，複數印刷電路板40亦可放置排列於相應之承載裝置 中。分別用於承載待貼裝之電子元器件30與印刷電路板 40之承載裝置可同時直接固定於表面貼裝對位裝置10之 工作台110相應位置，以使得第一影像感測裝置130可於 承載待貼裝之電子元器件30之承載裝置範圍上方進行圖 像感測，第二影像感測裝置140可於承載印刷電路板40之 承載裝置範圍上方進行圖像感測。 [0022] 請參閱圖5，結合本技術方案實施例提供之第一種表面貼 裝對位裝置1 0對本技術方案實施例表面貼裝對位方法進 行具體說明。該表面貼裝對位方法包括如下步驟。 [0023] 第一步，利用第一影像感測裝置130感測待貼裝之電子元 器件30之輪廓之圖像；並利用中央控制處理裝置120處理 所採集之圖像感測數據，從而得到該待貼裝之電子元器 件30之幾何中心座標。 [0024] 首先，中央控制處理裝置120控制第一影像感測裝置130 之第一攝像感測頭131移動到待貼裝之電子元器件30之第 一端部310，感測第一端部310之輪廓圖像。由第一影像 096126558 表單編號A0101 第11頁/共23頁 0993409947-0 1337300 099年11月16日梭正替换百 感測裝置130所採集之待貼裝之電子元器件30之第一端部 310之輪廓圖像感測數據傳輸到中央控制處理裝置120進 行數據處理，從而得到待貼裝電子元器件30之第一端部 310之輪廓之座標，並對獲得之座標進行存儲。 [0025] 其次，中央控制處理裝置120控制第一影像感測裝置130 之第一攝像感測頭131移動到該待貼裝之電子元器件30之 第二端部320感測第二端部320之輪廓圖像。由第二影像 感測裝置140所採集之待貼裝之電子元器件30之第二端部 320之輪廓圖像感測數據傳輸到中央控制處理裝置120進 行數據處理，從而得到第二端部320與第一端部310於同 一坐標系中之座標，並對獲得之:甚標'也杆#儲。當然， 如果待貼裝之電子元器件30為不果濟典可使第一攝 像感測頭131沿待貼裝之電子元器件30之輪廓移動，以獲 取更多之輪廓圖像數據，從而得到待貼裝之電子元器件 3 0之幾何中心座標。 [0026] 當然，如果採用本實施例提供之第二種表面貼裝對位裝 置20，第一影像感測裝置230包括兩個第一攝像感測頭 231時，可通過調節兩個第一攝像感測頭231距離，使得 兩個第一攝像感測頭231分別位於待貼裝之電子元器件30 之第一端部310與第二端部320，從而同時得到待貼裝電 子元器件30之第一端部310與第二端部320之輪廓於同一 坐標系中之座標，提高圖像感測之效率。當然，如果待 貼裝之電子元器件30為不規則形狀，可使複數第一攝像 感測頭131沿待貼裝之電子元器件30之輪廓設置，以獲取 更多之輪廓圖像數據，從而得到待貼裝之電子元器件30 096126558 表單編號Λ0101 第12頁/共23頁 0993409947-0 1337300 099年11月16日修正替换頁 之幾何中心座標。 [0027] 再次，利用中央控制處理裝置〗2〇計算處理待貼裝電子元 益件30之第一端部31〇與第二端部320之輪廓於同一坐標 系中之座標，由於待貼裝之電子元器件3〇之第一端部31〇 與第二端部320呈軸對稱，故，根據所得到之第一端部 310與第二端部320之輪廓之座標，可計算得到待貼裝之 電子元器件3 0幾何中心之座標。 [0028] 第二步，利用第二影像感測裝置丨40感測印刷電路板4〇之 焊盤410之輪廓之圖像；並利用中央控制處理裝置12〇處 理所採集之圖像感測數據，從而得到焊盤4〗〇之幾何中心 座標。 [0029] 首先，中央控制處理裝置12〇控制第二影像感測裝置14〇 之第二攝像感測頭141移動到印刷電路板4〇之焊盤41〇之 第一端部411 ’感測第一端部411之輪廓圖像。由第二影 像感測裝置140所採集之焊盤410之第一端部411之輪廓 圖像感測數據傳輸到中央控制處理裝置丨2〇進行數據處理 ’從而得到焊盤410之第一端部411與待貼裝之電子元器 件30之第一端部31〇和第二端部320之輪廓座標於同一坐 標系中之座標’並對獲得之座標進行存儲。 [0030] 其次，中央控制處理裝置12〇控制第二影像感測裝置14〇 之第二攝像感測頭141移動到焊盤41 〇之第二端部412， 感測第二端部412之輪廓圖像。由第二影像感測裝置14〇 所採集之焊盤410之第二端部412之輪廓圖像感測數據傳 輸到中央控制處理裝置120進行數據處理與存儲，從而得 096126558 表單編號· A0101 第13真/共23頁 0993409947-0 ^337300 到第二端部412與焊盤410之第一端部411之輪廓座標於 同一坐標系中之座標，並對獲得之座標進行存儲。當然 ，如果焊盤40為不規則形狀，可使第二攝像感測頭141沿 焊盤40之輪廓移動，以獲取更多之輪廓圖像數據，從而 得到焊盤4 0之幾何中心座標。 [0031] 同樣地，如果採用本實施例提供之第二種表面貼裝對位 裝置20 ’第二影像感測裝置24〇包括兩個第二攝像感測頭 241，可通過調節兩個第二攝像感測頭“I距離，使得兩 個第二攝像感測頭241分別位於焊盤41〇之第一端部411 與第二端部412，從而同時得到焊盤41〇之第一端部411 與第二端部412於同一個坐標系中之座，標:，提高圖像感測 之效率。g然，如果焊盤4 〇為不規則形:狀，可使複數第 二攝像感測頭1 41沿焊盤4〇之輪廓設置，以獲取更多之輪 廓圖像數據，從而得到焊盤4 〇之幾何中心座標。 [0032] 099 年 11 月 16 日' 再次，利用中央控制處理裝置120計算處理焊盤41〇之第 一端部411與第二端部412之輪廓於同一坐標系中之座標 ，由於焊盤410為矩形，其第一端部411與第二端部412 呈轴對稱，故，根據兩次感測所得到之焊盤41〇之第一端 部310與第二端部320之輪廓之座標值，可計算得到焊盤 410之幾何中心之座標值4於第—影像感測裝置13〇與 第二影像感測裝置14 G所感測之圖像數據均由中央控制處 理裝置120換算成於同―坐標系巾之座標，故中央控制 處理裝置12G計算處理後可得到與待貼裝之電子元器件3〇 之幾何中心座標於同-坐標系中之焊盤410之幾何中心座 標0 096126558 表單編號A0101 第丨4頁/共23頁 0993409947-0 1337300 099年11月16日修正替換頁 [0033] 第三步，移動拾取貼片裝置150到待貼裝之電子元器件30 之幾何中心座標以拾取待貼裝之電子元器件30，並移動 到焊盤41 0之幾何中心座標進行對位貼片。 [0034] 首先，中央控制處理裝置120可控制拾取貼片裝置150於 表面貼裝對位裝置10之工作台110上方移動，使得拾取貼 片裝置150之軸線移動到k定之座標位置。根據中央控制 處理裝置120處理並存儲之待貼裝之電子元器件30幾何中 心座標，中央控制處理裝置120控制拾取貼片裝置150移 動，使得拾取貼片裝置150之軸線移動到待貼裝之電子元 器件30幾何中心座標位置，以使拾取貼片裝置150可拾取 待貼裝之電子元器件30。 [0035] 其次，根據中央控制處理裝置120處理並存儲之焊盤410 之幾何中心座標，中央控制處理裝置120控制拾取貼片裝 置150移動，使得拾取貼片裝置150之軸線移動到焊盤 410幾何中心座標位置，進行貼片。這樣，待貼裝之電子 元器件30之幾何中心就會與焊盤410之幾何中心重合，從 而實現待貼裝之電子元器件30與焊盤410之間準確對位。 [0036] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0037] 圖1係本技術方案實施例提供之第一種表面貼裝對位裝置 之示意圖。 表單編號A0101 096126558 第15頁/共23頁 0993409947-0 T337300 099年11月16日按正替換頁 [0038] 圖2係本技術方案實施例提供之第二種表面貼裝對位裝置 之示意圖。 [0039] 圖3係本技術方案實施例提供之待貼裝之電子元器件之示 意圖。 [0040] 圖4係本技術方案實施例揭:供之待貼裝電子元器件之印刷 電路板之示意圖。 [0041] 圖5係本技術方案實施例提供之表面貼裝對位方法之示意 圖。 【主要元件符號說明】 [0042] 表面貼裝對位裝置：1 0，2 0'.Automatic visual measurement of surface-mount device placement, IEEE Transactions on Robotics and Automation > 1990, 6(1), 44-52. Automatic placement devices typically have a visual alignment system, an image sensor device for a visual alignment system, such as a charge coupled device (CCD), in an automated surface mount process for electronic components and printed circuit boards. The camera device performs image sensing and coordinate collection on the entire electronic component to be mounted, and then, according to the coordinates of the entire image of the electronic component to be mounted, the electronic component to be mounted is The pads of the printed circuit board that are pre-fixed at the coordinate points set in the automatic placement device are aligned. [0004] However, the field of view of the image sensor device of the visual alignment system is typically only 50 mm x 50 min. Due to the limitation of the field of view, the image sensor device can usually only obtain small size directly (size less than 50mmx50mm). 096126558 Form No. A0101 Page 4 / Total 23 Page 0993409947-0 1337300 November 16th, 2017 The entire image coordinates of electronic components, so it can only achieve automatic alignment of small-sized electronic components. When the size of the electronic component to be mounted is large, for example, a connector component having a size of 62 mm x 6 mm, since the size has exceeded the field of view of the image sensor device of the visual alignment system, it cannot be accurate. Obtaining the entire image coordinates of the electronic components makes it impossible to accurately and automatically align the patches. Therefore, at present, the alignment patches for large-sized electronic components usually need to be manually completed, which not only consumes a lot of manpower and time, but also easily causes artificial alignment errors in the process of alignment patching, thereby affecting the stickers to be posted. The quality of the surface mount of electronic components. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a surface mount alignment device and its alignment method to enable accurate automatic alignment of large-sized electronic components in a surface mount process. [0006] A surface mount alignment device and its alignment method will be described below by way of embodiments. [0007] the surface mount alignment device is configured to align a surface of an electronic component to be mounted on a pad of a printed circuit board, and the surface mount alignment device comprises a first image sensing device. An image for sensing a contour of an electronic component to be mounted; a second image sensing device for sensing an image of a contour of a pad of the printed circuit board; and a pick-and-place device for picking up and moving a mounted electronic component; and a central control processing device, wherein the central control processing device is respectively connected to the first image sensing device, the second image sensing device, and the pick and place device, and is configured to control the first image sensing device and The second image sensing device performs image sensing data processing, thereby obtaining 096126558 Form No. A0101 Page 5 / Total 23 Page 0993409947-0 »37300 November 16, 2010 Pressing the replacement page to the electronic component to be mounted The geometric center coordinates of the device and the geometric center coordinates of the pads, and the geometric center coordinates of the electronic components used to control the pick-and-place device to be mounted to pick up the electronic components to be mounted, and move to the pads Center coordinate perform alignment patches. [0008] The surface mount alignment method is for aligning the surface of the electronic component to be mounted on the pad of the printed circuit board, and the method includes the following steps: sensing the to-be-applied by using the first image sensing device Loading an image of the outline of the electronic component, and processing the acquired image sensing data by using a central control processing device to obtain a geometric center coordinate of the electronic component to be mounted; sensing by using the second image sensing device An image of the outline of the pad of the printed circuit board, and the collected image sensing data is collected by the central control processing to obtain the geometric center coordinates of the electronic component to be mounted; the mobile pick-and-place device is The geometric center coordinates of the electronic components to be mounted are used to pick up the electronic components to be mounted and move to the geometric center coordinates of the pads for alignment. [0009] Compared with the prior art, the surface mount alignment device and the alignment method thereof firstly perform image sensing on the outline of the mounted electronic component and the outline of the printed circuit board pad, respectively. Overcoming the limitation of the field of view of the image sensing device, thereby realizing accurate automatic alignment of large-sized electronic components, effectively improving the efficiency of surface-mounting of large-sized electronic components; secondly, by placing The electronic components and the pads of the printed circuit board perform image sensing, and obtain the geometric center coordinates of the electronic components to be mounted and the geometric center coordinates of the pads, and the moving pickup chip device according to the obtained coordinates is not only accurate Picking up electronic components and realizing the geometric center and pad of the electronic components to be mounted 096126558 Form No. A0101 Page 6 of 23 0993409947-0 1337300 [0011] [0012] [0013] 096126558 099 On November 16th, the shuttle was replacing the exact alignment of the geometric center of the page, thereby improving the accuracy of the surface mount alignment patch for large-sized electronic components. [Embodiment] The surface mount alignment device and the alignment method thereof provided by the present technical solution are further described below with reference to the accompanying drawings and embodiments. Referring to FIG. 1, a first surface mount alignment device 10 is provided in an embodiment of the present technical solution. The surface mount alignment device 10 includes a table 110, a central control processing device 120, a first image sensing device 130, a second image sensing device 140, and a pick and place device 15G. The stage 110 is used to place sensed objects, such as electronic components to be mounted and printed circuit boards. The work station 110 is disposed opposite to the first image sensing device 130 , the second image sensing device 140 , and the pick and place device 150 , so that the first image sensing device 130 and the second image sensing device 140 can be from the work table 110 . The image sensing of the sensed object placed on the workbench 110 is performed on the upper side, and the pick-and-place device 150 can perform picking and patching operations on the sensed object placed on the workbench 110 from above the worktable 110. . The central control processing device 120 is connected to the first image sensing device 130, the second image sensing device 140, and the pick and place device 150 for controlling the first image sensing device 130 and the second image sensing device. The device 140 moves and performs image sensing; and processes image sensing data collected by the first image sensing device 130 and the second image sensing device 140, according to the first image sensing device 130 and the second image sensing device. The image sensing data collected by the device 140 is calculated respectively to obtain the geometric center of the object sensed by the first image sensing device 130 and the object sensed by the second image sensing device 140 in the same coordinate system form number A0101. Page / Total 23 pages 0993409947-0 1-337300 On November 16, 099, the coordinates in the page are replaced; and used to control the pick-and-place device 150 to move and perform the alignment patch. [0014] The first image sensing device 130 and the second image sensing device 140 are configured to sense image data. In this embodiment, the first image sensing device 130 is configured to sense image data of a contour of an electronic component to be mounted, such as image data of contours of opposite ends of an electronic component to be mounted. The second image sensing device 140 is configured to sense image data of a contour of a pad of the printed circuit board, such as image data of contours of opposite ends of the pad. The first image sensing device 130 includes a first imaging sensing head 131, such as a charge coupled device (CCD) camera, and the second image sensing device, a second imaging sensing head 141 - , such as a charge. Couple the camera. The measuring device 130 moves along the contour of the sensed object under the control of the control device 120 and uses the first camera sensor 1 31 to respectively sense the object to be sensed from above the object to be sensed ( For example, the outline of the electronic component to be mounted is subjected to image sensing. The second image sensing device 140 moves along the contour of the sensed object under the control of the central control processing device 120 and uses the second camera sensing head 141 to respectively sense the detected object from above the sensed object (for example, printing) The outline of the pad of the board is image sensed. The image sensing data collected by the first image sensing device 130 and the second image sensing device 140 is transmitted to the central control processing device 120 for data processing. Calculating the geometric center coordinates of the sensed object, such as the electronic component to be mounted and the pad, based on the image sensing data collected by the first image sensing device 130 and the second image sensing device 140, and obtaining The coordinates are stored. [0015] The pick-and-place device 150 can be vacuum-adsorbed or mechanical, which is used for picking up 096126558 Form No. A0101 Page 8/23 pages 0993409947-0 1337300 _ November 16th, 99th, the replacement page is taken Sensing the object and moving the alignment patch. For example, the electronic components to be mounted are moved to the pads of the printed circuit board for placement. The pick-and-place device 150 can be moved to the corresponding coordinate position of the electronic component to be mounted under the control of the central control processing device 120, and the electronic components to be mounted are vacuum-adsorbed or mechanically picked up, and can be picked up in the center. Under the control of the control processing device 120, it moves to the corresponding coordinate position of the pad of the printed circuit board, and the electronic component to be mounted is aligned with the pad. [0016] Referring to FIG. 2, a second surface mount alignment device 20 is provided in an embodiment of the present technical solution. The surface mount alignment device 20 is different from the surface mount alignment device 10 in that the first image sensing device 230 includes two first camera sensing heads 231, and the second image sensing device 240 includes Two second camera sensing heads 241. The first image sensing device 230 and the second image sensing device are moved under the control of the central control processing device 220 and perform image sensing from above the sensed object. At this time, the distance between the two first imaging sensing heads 231 can be adjusted, so that the two first imaging sensing heads 231 are respectively located at opposite ends of the object to be sensed (for example, the electronic components to be mounted). The central control processing device 220 calculates the geometric center coordinates of the sensed object based on the image data sensed by the two first imaging sensor heads 231. The distance between the two second imaging sensing heads 241 can also be adjusted so that the two second imaging sensing heads 241 are respectively located at opposite ends of the sensing object (for example, the pads of the printed circuit board). The central control processing device 220 calculates the geometric center coordinates of the sensed object based on the image data sensed by the two second imaging sensor heads 241. Of course, for other irregularly shaped sensed objects, the first image sensing device 230 can be configured with more than two 096126558 Form No. A0101 Page 9 / Total 23 Pages 0993409947-0 1337300 November 16, 2017 Correction Replacement Page The first camera sensing head 231 can adjust the contour of the object to be sensed (for example, the electronic component to be mounted). The second image sensing device 240 can be provided with two or more second imaging sensing heads 241, and the plurality of second imaging sensing heads 241 can be disposed along the contour of the sensed object (for example, a pad). [0017] Of course, the first image sensing device 230 includes a first camera sensing head 231, and the second image sensing device 240 includes a plurality of second camera sensing heads 241, or the first image. The sensing device 230 includes a plurality of first camera sensing heads 231, and the second image sensing device 240 includes a second camera sensing head 241. [0018] Embodiments of the present technical solution adopt surface mount alignment. The device 10 aligns the electronic component 30 to be mounted with the pad 410 of the printed circuit board 40, and the electronic component 30 to be mounted. Mounted to the pad 410 of the printed circuit board 40. Referring to FIG. 3, the electronic component 30 to be mounted according to the embodiment of the present technical solution is a large-sized electronic component, such as a connector component. The top view of the electronic component 30 to be mounted has a rectangular shape. The electronic component 30 to be mounted has a first end portion 310 and a second end portion 320 opposite the first end portion 310, the first end portion 310 being axially symmetric with the second end portion 320. Referring to FIG. 4, the printed circuit board 40 provided by the embodiment of the present technical solution is a flexible circuit board. The printed circuit board 40 has a pad 410 having a shape and size corresponding to the shape and size of the electronic component 30 to be mounted for mounting the electronic component 30. In this embodiment, the pad 410 corresponds to the rectangular component of the electronic component 30 to be mounted, and the pad 410 has a first end 411 and a second end 412 opposite to the first end 411. 096126558 Form No. A0101 Page 10 of 23 0993409947-0 1337300 _ On November 16, 099, the shuttle replacement page end portion 411 is axially symmetric with the second end portion 412. [0021] Before performing surface alignment mounting, the electronic component 30 to be mounted and the printed circuit board 40 can be directly placed at the corresponding position of the workbench 110 of the surface mount alignment device 10 at the same time, or can be carried by corresponding loads. After the device is loaded, it is placed at the corresponding position of the table 110 of the surface mount alignment device 10. Preferably, in order to improve the efficiency of the surface mounting and the accuracy of the alignment, the plurality of electronic components 30 to be mounted may be placed in the corresponding carrying device, and the plurality of printed circuit boards 40 may also be placed in the corresponding bearing. In the device. The carrying device for carrying the electronic component 30 to be mounted and the printed circuit board 40 can be directly fixed to the corresponding position of the worktable 110 of the surface mount alignment device 10 at the same time, so that the first image sensing device 130 can be The image sensing is performed above the range of the carrying device carrying the electronic component 30 to be mounted, and the second image sensing device 140 can perform image sensing over the range of the carrying device carrying the printed circuit board 40. [0022] Please refer to FIG. 5, which illustrates a method for surface mount alignment of the first embodiment of the present invention in conjunction with the first surface mount alignment device 10 provided by the embodiment of the present technical solution. The surface mount alignment method includes the following steps. [0023] In the first step, the image of the outline of the electronic component 30 to be mounted is sensed by the first image sensing device 130; and the collected image sensing data is processed by the central control processing device 120, thereby obtaining The geometric center coordinates of the electronic component 30 to be mounted. [0024] First, the central control processing device 120 controls the first imaging sensor 131 of the first image sensing device 130 to move to the first end 310 of the electronic component 30 to be mounted, and senses the first end 310. Contour image. From the first image 096126558, the form number A0101, the 11th page, the 23rd page, the 0993409947-0 1337300, the first end 310 of the electronic component 30 to be mounted collected by the hundred sensing device 130 is replaced by the first end 310 of the electronic component 30 to be mounted. The contour image sensing data is transmitted to the central control processing device 120 for data processing, thereby obtaining the coordinates of the contour of the first end portion 310 of the electronic component 30 to be mounted, and storing the obtained coordinates. [0025] Next, the central control processing device 120 controls the first imaging sensor 131 of the first image sensing device 130 to move to the second end 320 of the electronic component 30 to be mounted to sense the second end 320. Contour image. The contour image sensing data of the second end portion 320 of the electronic component 30 to be mounted collected by the second image sensing device 140 is transmitted to the central control processing device 120 for data processing, thereby obtaining the second end portion 320. The coordinates in the same coordinate system as the first end portion 310, and obtained: the standard is also stored. Of course, if the electronic component 30 to be mounted is unsuccessful, the first camera sensor 131 can be moved along the contour of the electronic component 30 to be mounted to obtain more contour image data, thereby obtaining The geometric center coordinates of the electronic components to be mounted. [0026] Of course, if the second surface mount alignment device 20 provided by the embodiment is used, when the first image sensing device 230 includes two first camera sensing heads 231, the two first cameras can be adjusted. The distance between the sensing heads 231 is such that the two first imaging sensing heads 231 are respectively located at the first end portion 310 and the second end portion 320 of the electronic component 30 to be mounted, thereby simultaneously obtaining the electronic components 30 to be mounted. The contours of the first end portion 310 and the second end portion 320 in the same coordinate system improve the efficiency of image sensing. Of course, if the electronic component 30 to be mounted has an irregular shape, the plurality of first camera sensing heads 131 can be disposed along the contour of the electronic component 30 to be mounted to obtain more contour image data, thereby obtaining more contour image data, thereby Obtaining the electronic components to be mounted 30 096126558 Form No. 1010101 Page 12 of 23 0993409947-0 1337300 The geometric center coordinates of the replacement page were corrected on November 16, 2009. [0027] Again, the coordinates of the contours of the first end portion 31〇 and the second end portion 320 of the electronic component to be mounted 30 in the same coordinate system are calculated by the central control processing device ,2〇, due to the placement to be mounted. The first end portion 31 of the electronic component 3 is axially symmetric with the second end portion 320. Therefore, according to the obtained coordinates of the contours of the first end portion 310 and the second end portion 320, the to-be-applied The coordinates of the geometric center of the electronic components. [0028] In the second step, the image of the outline of the pad 410 of the printed circuit board 4 is sensed by the second image sensing device 40; and the collected image sensing data is processed by the central control processing device 12 , thereby obtaining the geometric center coordinates of the pad 4 〇. [0029] First, the central control processing device 12 controls the second imaging sensor 141 of the second image sensing device 14 to move to the first end portion 411 of the pad 41 of the printed circuit board 4' sensed A contour image of the one end portion 411. The contour image sensing data of the first end portion 411 of the pad 410 collected by the second image sensing device 140 is transmitted to the central control processing device 2 for data processing to obtain the first end of the pad 410. 411 and the contours of the first end portion 31 and the second end portion 320 of the electronic component 30 to be mounted are coordinated to the coordinates in the same coordinate system and the obtained coordinates are stored. [0030] Next, the central control processing device 12 controls the second imaging sensor 141 of the second image sensing device 14 to move to the second end 412 of the pad 41 , to sense the contour of the second end 412 image. The contour image sensing data of the second end portion 412 of the pad 410 collected by the second image sensing device 14A is transmitted to the central control processing device 120 for data processing and storage, thereby obtaining 096126558 Form No. A0101 No. 13 True/Total 23 pages 0993409947-0 ^337300 The contours of the second end portion 412 and the first end portion 411 of the pad 410 are coordinated to coordinates in the same coordinate system, and the obtained coordinates are stored. Of course, if the pad 40 is of an irregular shape, the second camera head 141 can be moved along the contour of the pad 40 to obtain more contour image data, thereby obtaining the geometric center coordinates of the pad 40. [0031] Similarly, if the second surface mount alignment device 20 ′ provided by the embodiment includes two second camera sensing heads 241, two second The imaging sensor head "I distance, such that the two second imaging sensing heads 241 are respectively located at the first end portion 411 and the second end portion 412 of the pad 41", thereby obtaining the first end portion 411 of the pad 41? The same as the second end portion 412 in the same coordinate system, the standard: to improve the efficiency of image sensing. g, if the pad 4 〇 is irregular: shape, can make a plurality of second camera sensor head 1 41 is placed along the contour of the pad 4〇 to obtain more contour image data, thereby obtaining the geometric center coordinates of the pad 4. [0032] November 16, 099 ' Again, using the central control processing device 120 The coordinates of the first end portion 411 and the second end portion 412 of the processing pad 41 are calculated in the same coordinate system. Since the pad 410 is rectangular, the first end portion 411 is axially symmetric with the second end portion 412. Therefore, according to the two sensing, the first end 310 and the second end 320 of the pad 41 are obtained. The coordinate value of the profile can be calculated to obtain the coordinate value 4 of the geometric center of the pad 410. The image data sensed by the first image sensing device 13A and the second image sensing device 14G are converted by the central control processing device 120. The coordinates of the coordinates of the coordinate system are formed, so that the central control processing device 12G can calculate the geometric center coordinates of the pad 410 in the same coordinate system as the geometric center coordinates of the electronic component to be mounted. 096126558 Form No. A0101 Page 4 / Total 23 Page 0993409947-0 1337300 November 16th, revised correction page [0033] The third step is to move the pick-and-place device 150 to the geometric center of the electronic component 30 to be mounted. The coordinates are used to pick up the electronic component 30 to be mounted and move to the geometric center coordinates of the pad 41 0 to perform the alignment patch. [0034] First, the central control processing device 120 can control the pick and place device 150 to be surface mounted. Moving over the table 110 of the alignment device 10 causes the axis of the pick-and-place device 150 to move to a coordinate position of k. The geometry of the electronic component 30 to be mounted is processed and stored according to the central control processing device 120. The heart coordinates, the central control processing device 120 controls the movement of the pick-and-place device 150 such that the axis of the pick-and-place device 150 is moved to the geometric center coordinate position of the electronic component 30 to be mounted, so that the pick-and-place device 150 can pick up the sticker to be attached. The electronic component 30 is mounted. [0035] Next, according to the geometric center coordinates of the pad 410 processed and stored by the central control processing device 120, the central control processing device 120 controls the movement of the pick-and-place device 150 so that the pick-and-place device 150 The axis is moved to the geometric center coordinate position of the pad 410 for patching. Thus, the geometric center of the electronic component 30 to be mounted coincides with the geometric center of the pad 410, thereby achieving accurate alignment between the electronic component 30 to be mounted and the pad 410. [0036] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0037] FIG. 1 is a schematic diagram of a first surface mount alignment device according to an embodiment of the present technical solution. Form No. A0101 096126558 Page 15 of 23 0993409947-0 T337300 November 16th, 2010, according to the replacement page [0038] FIG. 2 is a schematic diagram of a second surface mount alignment device according to an embodiment of the present technical solution. 3 is a schematic diagram of an electronic component to be mounted provided by an embodiment of the present technical solution. [0040] FIG. 4 is a schematic diagram of a printed circuit board for an electronic component to be mounted, according to an embodiment of the present technical solution. [0041] FIG. 5 is a schematic diagram of a surface mount alignment method provided by an embodiment of the present technical solution. [Main component symbol description] [0042] Surface mount alignment device: 1 0, 2 0'.
[0043] 電子元器件：30 人言 [0044] 工作台：1 1 0 [0045] 中央控制處理裝置：120，220 [0046] 第一影像感測裝置：130，230 [0047] 第二影像感測裝置：140，240 [0048] 第一攝像感測頭：131，231 [0049] 第二攝像感測頭：141，241 [0050] 拾取貼片裝置：150 [0051] 電子元器件之第一端部：310 [0052] 電子元器件之第二端部：320 [0053] 焊盤：410 096126558 表單編號A0101 第16頁/共23頁 0993409947-0 1337300 [0054] [0055] 焊盤之第一端部 焊盤之第二端部 411412 099年11月16日核正替換頁 096126558 表單編號A0101 第17頁/共23頁 0993409947-0[0043] Electronic components: 30 words [0044] Workbench: 1 1 0 [0045] Central control processing device: 120, 220 [0046] First image sensing device: 130, 230 [0047] Second image sense Measuring device: 140, 240 [0048] First camera sensing head: 131, 231 [0049] Second camera sensing head: 141, 241 [0050] Picking and mounting device: 150 [0051] First of electronic components End: 310 [0052] Second end of the electronic component: 320 [0053] Pad: 410 096126558 Form number A0101 Page 16 / Total 23 page 0993409947-0 1337300 [0054] [0055] First of the pad The second end of the end pad 411412 November 16th, 1999, the nuclear replacement page 096126558 Form number A0101 page 17 / 23 pages 0993409947-0