CN1102802C - 凸起粘合装置及方法 - Google Patents

凸起粘合装置及方法 Download PDF

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CN1102802C
CN1102802C CN97195532A CN97195532A CN1102802C CN 1102802 C CN1102802 C CN 1102802C CN 97195532 A CN97195532 A CN 97195532A CN 97195532 A CN97195532 A CN 97195532A CN 1102802 C CN1102802 C CN 1102802C
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electronic component
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今西诚
山本章博
大谷博之
江口信三
米泽隆弘
东和司
吉田幸一
广谷耕司
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Panasonic Holdings Corp
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Abstract

一种具有电子元件位置矫正装置的凸起粘合装置及粘合方法，当凸起粘合装置进行电子元件的矫正时，不会发生电子元件的破损及粘合不良，能提高电子元件的可靠性。该凸起粘合装置的电子元件位置矫正装置包括：放置并加热电子元件的载物台(1)；具有使电子元件定位用的边部的矫正板(2)，具有与该矫正板合作使电子元件定位用的边部的平板(4)，以及，为了将电子元件压靠到平板(4)上而对矫正板施加矫正力用的矫正弹簧(5)，并且，上述矫正板(2)可转动，上述电子元件位置矫正装置还具有设于上述电子元件与矫正弹簧之间的、成为矫正板的转动中心的支点。

Description

凸起粘合装置及方法
技术领域
本发明涉及在半导体电子元件的电极上形成凸起电极部的凸起粘合装置及其方法，更具体地，涉及具有电子元件位置矫正装置的凸起粘合装置及方法。
背景技术
以下参照图6-图11，说明传统的凸起粘合装置和凸起粘合方法。
图6是用金线13在电子元件3上形成凸起的凸起粘合装置的立体图。
在图中，由托盘10供给的电子元件3通过吸附夹11固定在温度升高了的载物台1上。毛细管12由超声波供给组件保持，并被施加超声波，利用穿过金线13的毛细管12，在电子元件3的电极上形成金的凸起。然后，在必需的部位形成了凸起的成品电子元件3通过吸附夹11被收入托盘10a。
图7为示出凸起形成工序的工序图。
首先，在工序(a)中，在毛细管12中穿过金线13，使金线13的顶端放电，在顶端形成球形。接着，在工序(b)中，使毛细管12下降而按压在电子元件3的电极14上。此时，施加超声波，使电极14和金线13接合(第一次粘合)。接着，在工序(c)中，使毛细管12上升，边进行环路控制边使毛细管再次下降，如工序(d)所示，毛细管12按压第一次粘合后的金块而将金线13切断(第二次粘合)。
以下详细说明电子元件的矫正部。
图8为电子元件矫正部的俯视图。
如图8所示，凸起粘合装置的矫正部包括设有吸附孔的载物台1、沿XY方向可动的矫正爪2及沿矫正爪2的Y方向施加矫正力的矫正弹簧5，电子元件3通过矫正爪2而在载物台1的吸附孔上移动，并通过真空吸附而被规定在载物台1上的位置。但是，因为对微小电子元件吸附力不足，所以使用图9所示的矫正部。
该矫正部如图9所示，包括载物台1、固定于载物台1端部的平板4、沿XY方向可动的矫正爪2及沿矫正爪2的Y方向施加矫正力用的矫正弹簧5。
在该矫正部中，因为很难将矫正爪安装得与平板4平行，所以，在电子元件3进行位置矫正时，一旦电子元件3因矫正爪2而受到矫正力时，电子元件的角部3a有时就会与平板4相碰撞而使电子元件破损。
图10为示出用传统的电子元件矫正装置进行工作的流程图。
将电子元件放置在凸起粘合装置的载物台1上，使吸附装置“ON”，进行电子元件的位置矫正，并利用该状态，对电子元件3进行粘合。但是，对于微小的电子元件，吸附孔无法适应电子元件的尺寸，并且，也无法按电子元件的尺寸将位于电子元件的矫正轨迹上的吸附孔堵塞，所以会产生吸附错误。
一般情况下，微小的电子元件容易破裂，因此，对于微小的电子元件，要求减小位置矫正时的冲击力，防止电子元件的破损。
发明内容
本发明的目的在于，提供一种具有这样的位置矫正装置的凸起粘合装置及使用该凸起粘合装置的凸起粘合方法，用该位置矫正装置进行电子元件的位置矫正时，电子元件不会破损、能非常可靠地进行电子元件的定位。此外，若发生吸附错误，电子元件容易冷却，会引起粘合不良，本发明的目的在于，通过防止吸附错误的发生，提供一种具有这样的位置矫正装置的凸起粘合装置及使用该凸起粘合装置的凸起粘合方法，用该位置矫正装置和方法进行电子元件的位置矫正，不会发生粘合不良，能非常可靠地进行电子元件的定位。
本发明的凸起粘合装置，具有电子元件的位置矫正装置，该位置矫正装置包括：放置并加热电子元件的载物台，具有使电子元件定位用的边部的矫正板，具有与该矫正板合作使电子元件定位用的边部的平板，以及，为了将电子元件压靠到平板上而对矫正板施加矫正力用的矫正弹簧，其特征在于，
所述矫正板可转动，
所述电子元件位置矫正装置还具有设于所述电子元件与所述矫正弹簧之间、成为所述矫正板的转动中心的支点。
如上所述，本发明的凸起粘合装置，其位置矫正装置的矫正板可以转动，并且在电子元件与矫正弹簧之间还设有成为矫正板的转动中心的支点，所以，对电子元件进行位置矫正时，矫正板能以该支点为中心作自由转动，因此，即使矫正板安装得有一定误差，其矫正用边与矫正用平板的矫正边之间不平行而存在一定的角度，利用矫正弹簧的弹簧力使矫正板以所述支点为中心作自由转动，就能调整矫正板与平板之间的角度，从而调整电子元件与平板之间的角度，使电子元件与矫正板及平板以面接合进行位置矫正，就能避免在矫正电子元件的位置时电子元件发生破损，从而提高电子元件的可靠性。
本发明的凸起粘合方法，其特征在于包括：
(a)将电子元件放置于载物台上的工序；
(b)利用形成于所述载物台的吸附孔使所述电子元件开始吸附的工序；
(c)利用排列形成于所述载物台的多个吸附孔吸附所述电子元件，同时使所述电子元件在移动轨迹上移动的工序；
(d)将矫正板抵靠在所述电子元件上，同时将所述电子元件压靠到固定于所述载物台的一定位置上的平板上，将所述电子元件的位置矫正为一定位置的工序；
(e)解除对位置矫正后的所述电子元件的吸附工序。
如上所述，本发明的凸起粘合方法，是将电子元件放置于载物台上之后，利用排列形成于载物台的多个吸附孔吸附该电子元件，同时使该电子元件沿这些吸附孔移动至规定位置，再由矫正板最后矫正为一定的位置，所以，能防止因电子元件的吸附错误引起的电子元件的冷却，能防止粘合不良，所以能提高电子元件的可靠性。
图面的简单说明
图1所示为本发明一实施形态的电子元件矫正状态的俯视图。
图2所示为本发明一实施形态的电子元件矫正状态的俯视图。
图3所示为本发明一实施形态的电子元件矫正状态的俯视图。
图4为示出本发明一实施形态中的吸附孔的配置和电子元件移动轨迹的俯视图。
图5为示出本发明一实施形态中的电子元件的矫正动作的流程图。
图6为传统的凸起粘合装置的立体图。
图7为示出传统的凸起形成的凸起粘合工序图。
图8为示出传统的电子元件的矫正状态的俯视图。
图9为示出传统的电子元件的矫正状态的俯视图。
图10为示出传统的电子元件的矫正装置进行动作的流程图。
实施发明的最佳形态
本发明记载的凸起粘合装置具有电子元件的位置矫正装置，该位置矫正装置包括：放置并加热电子元件的载物台，具有使电子元件定位用的边部的矫正板，具有与该矫正板合作使电子元件定位用的边部的平板，以及，为了将电子元件压靠到平板上而对矫正板施加矫正力用的矫正弹簧，并且，所述矫正板可转动，所述电子元件位置矫正装置还具有设于所述电子元件与所述矫正弹簧之间、成为所述矫正板的转动中心的支点。因为通过矫正板在矫正弹簧的弹簧力作用下围绕支点作转动，能使电子元件与矫正板和平板的各个面相接合而被矫正位置，所以能防止电子元件发生破损，并能提高电子元件的可靠性。
本发明的凸起粘合装置，在可转动的矫正板上，为了防止转动方向的过度转动，在与矫正弹簧成直角的方向设有平衡弹簧，与上述一样能防止电子元件发生破损。
本发明的凸起粘合装置，在平衡弹簧的一侧设有矫正弹簧，向平衡弹簧方向也施加矫正力，与上述一样能防止电子元件发生破损。
本发明所述的凸起粘合方法，其所使用的凸起粘合装置具有进行电子元件的矫正时位于电子元件的移动轨迹上、真空吸附电子元件的吸附孔，其包括如下工序：将电子元件放置于载物台上的工序；利用载物台的吸附孔使电子元件的吸附“ON”的工序；使电子元件沿排列于电子元件的移动轨迹上的吸附孔移动，并利用矫正板将电子元件压靠在平板上定位的工序；使电子元件的吸附“OFF”的工序，其具有如下作用：能防止因电子元件的吸附错误引起的电子元件的冷却，能防止粘合不良，所以能提高电子元件的可靠性。
以下参照图1至图5，说明本发明的实施形态。
(实施形态1)
图1为示出本发明一实施形态的电子元件的矫正状态的俯视图，电子元件3的一条边由平板4支承，另两条边由矫正板2的边部支承。矫正板2由矫正弹簧5沿弹簧方向施加矫正力，并设置成可以支点6为中心作转动。因此，进行电子元件的位置矫正时，电子元件3与矫正板2及平板4的各个面接触，位置得到矫正，故电子元件3不会受到集中性负荷，能防止电子元件3的破损，能提高电子元件3的可靠性。
(实施形态2)
图2为示出本发明一实施形态的电子元件的矫正状态的俯视图，对于与图1相同的构成省略说明。在图2中，与图1不同之处在于，在与矫正弹簧5成直角的方向设有平衡弹簧7。由于这样的结构，当矫正板2以支点6为中心作转动时，由于平衡弹簧7的弹簧力，可防止矫正板2的过度转动，能使矫正板2的面与电子元件3的面保持同一平面。因此，与实施形态1一样，能防止电子元件3的破损。
作为该实施例的具体例，电子元件3采用尺寸为1.4×1.3(mm)、厚度为0.3mm、材质为硅类的IC片，矫正弹簧5的矫正推压量调整为最大负载50g，电子元件3实际受到200g的负载。平衡弹簧7的最大负载分别为300g。
(实施形态3)
图3为示出本发明一实施形态的电子元件的矫正状态的俯视图，对于与图2相同的构成省略说明。在图3中，与图2不同之处在于，在与平衡弹簧7的作用力方向相同的方向设有矫正弹簧5b这一点，以及在平板4的一个角部设有缺口部，与电子元件3以两个面相接合这一点。由于这样的结构，沿平衡弹簧7的作用力方向也能施加矫正力，能更稳定地将电子元件3固定。
(实施形态4)
图4为示出本发明其它实施形态的吸附孔配置和电子元件的矫正轨迹的平面图，图5为示出其动作的流程图。在图4中，8a-8e为真空吸引电子元件3的吸附孔。
首先，一旦将电子元件3放置在载物台1的位置9a，电子元件3即被吸附孔8a吸附。此时，若电子元件3未被吸附孔8a吸附，电子元件3就会或者转动，或者附着在欲载置的喷嘴侧。在图4中，矫正板2已呈与电子元件3接触的状态，但当电子元件3被放置于载物台1时，电子元件3与矫正板尚未接触，电子元件3吸附之后才接触。然后，电子元件3在吸附孔8a-8e上移动。此时，因为所有的吸附孔都进行吸引，所以，电子元件3沿吸附孔有条不紊地移动，在位置9e处被固定(参照实施形态1及2)。然后，使吸附孔8a-8e的吸附“OFF”。由于这样的结构，能防止发生吸附错误，电子元件3不会冷却，能防止粘合不良。
另外，在该实施例中，吸附孔8设有5个，但对个数及其排列无限定，可以是各种各样的形态。此外，也可应用于能粘合多个电子元件的载物台。
产业上应用的可能性
如上所述，若采用本发明，进行电子元件的矫正时，因为负荷不会集中施加于电子元件的一点，所以能防止电子元件的破损。此外，因为能防止电子元件的冷却，故能防止发生粘合不良，有效地提高电子元件的可靠性。

Claims (6)

1.一种凸起粘合装置，具有电子元件位置矫正装置，该电子元件位置矫正装置包括：放置并加热电子元件的载物台，具有使电子元件定位用的边部的矫正板，具有与该矫正板合作使电子元件定位用的边部的平板，以及，为了将电子元件压靠到平板上而对所述矫正板施加矫正力用的矫正弹簧，其特征在于，
所述矫正板可转动，
所述电子元件位置矫正装置还具有设于所述电子元件与所述矫正弹簧之间、成为所述矫正板的转动中心的支点。
2.根据权利要求1所述的凸起粘合装置，其特征在于，在可转动的矫正板上，为了防止转动方向的过度转动，在与矫正弹簧成直角的方向设有平衡弹簧。
3.根据权利要求2所述的凸起粘合装置，其特征在于，在平衡弹簧的一侧设有矫正弹簧，向平衡弹簧方向也施加矫正力。
4.一种凸起粘合方法，其特征在于包括：
(a)将电子元件放置于载物台上的工序；
(b)利用形成于所述载物台的吸附孔使所述电子元件开始吸附的工序；
(c)利用排列形成于所述载物台的多个吸附孔吸附所述电子元件，同时使所述电子元件在移动轨迹上移动的工序；
(d)将矫正板抵靠在所述电子元件上，同时将所述电子元件压靠到固定于所述载物台的一定位置上的平板上，将所述电子元件的位置矫正为一定位置的工序；
(e)解除对位置矫正后的所述电子元件的吸附工序。
5.根据权利要求4所述的凸起粘合方法，其特征在于，在所述工序(d)中，所述电子元件边与所述矫正板抵靠着边在所述移动轨迹上移动。
6.根据权利要求5所述的凸起粘合方法，其特征在于，在所述电子元件被所述吸附孔吸附之后，所述矫正板与所述电子元件接触。
CN97195532A 1996-06-17 1997-06-17 凸起粘合装置及方法 Expired - Fee Related CN1102802C (zh)

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