CN110268536B - 热电元件 - Google Patents

热电元件 Download PDF

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Publication number
CN110268536B
CN110268536B CN201880010507.1A CN201880010507A CN110268536B CN 110268536 B CN110268536 B CN 110268536B CN 201880010507 A CN201880010507 A CN 201880010507A CN 110268536 B CN110268536 B CN 110268536B
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CN
China
Prior art keywords
substrate
thermoelectric
electrode part
terminal electrode
thermoelectric element
Prior art date
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Active
Application number
CN201880010507.1A
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English (en)
Chinese (zh)
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CN110268536A (zh
Inventor
成命锡
金兑熙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of CN110268536A publication Critical patent/CN110268536A/zh
Application granted granted Critical
Publication of CN110268536B publication Critical patent/CN110268536B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201880010507.1A 2017-02-06 2018-02-06 热电元件 Active CN110268536B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0016094 2017-02-06
KR1020170016094A KR102652928B1 (ko) 2017-02-06 2017-02-06 열전 소자
PCT/KR2018/001590 WO2018143780A1 (ko) 2017-02-06 2018-02-06 열전 소자

Publications (2)

Publication Number Publication Date
CN110268536A CN110268536A (zh) 2019-09-20
CN110268536B true CN110268536B (zh) 2023-10-27

Family

ID=63039994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880010507.1A Active CN110268536B (zh) 2017-02-06 2018-02-06 热电元件

Country Status (5)

Country Link
US (2) US11937506B2 (enExample)
JP (1) JP7293116B2 (enExample)
KR (2) KR102652928B1 (enExample)
CN (1) CN110268536B (enExample)
WO (1) WO2018143780A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7587509B2 (ja) * 2019-01-23 2024-11-20 エルジー イノテック カンパニー リミテッド 熱電素子
KR102794636B1 (ko) * 2020-01-13 2025-04-14 엘지이노텍 주식회사 발전장치
JPWO2021200265A1 (enExample) * 2020-03-30 2021-10-07

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068564A (ja) * 1998-08-18 2000-03-03 Dainippon Screen Mfg Co Ltd ペルチェ素子
JP2001160632A (ja) * 1999-12-02 2001-06-12 Yamaha Corp 熱電モジュール
CN101232071A (zh) * 2003-10-29 2008-07-30 京瓷株式会社 热电换能模块及其封装
JP2008244100A (ja) * 2007-03-27 2008-10-09 Yamaha Corp 熱電モジュールおよびその製造方法
CN101807662A (zh) * 2009-02-18 2010-08-18 财团法人工业技术研究院 热电元件及其制作方法、芯片堆叠结构及芯片封装结构
CN103137577A (zh) * 2011-12-01 2013-06-05 三星电子株式会社 热电冷却封装件及其热管理方法
KR20150084310A (ko) * 2014-01-13 2015-07-22 홍익대학교 산학협력단 써멀비아전극을 구비한 열전모듈 및 그 제조방법
CN106025055A (zh) * 2015-03-31 2016-10-12 Lg伊诺特有限公司 热电转换器及使用该热电转换器的除湿器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065224A (ja) 1996-08-19 1998-03-06 Tekunisuko:Kk サーモモジュール
JPH10190071A (ja) * 1996-12-20 1998-07-21 Aisin Seiki Co Ltd 多段電子冷却装置
JP4013446B2 (ja) 1999-04-01 2007-11-28 ヤマハ株式会社 ペルチェモジュールおよびそれを備えた光通信用モジュール
JP2002270906A (ja) 2001-03-13 2002-09-20 Aisin Seiki Co Ltd 熱電モジュール
JP4288927B2 (ja) 2002-11-05 2009-07-01 ヤマハ株式会社 多段熱電モジュール
JP4005937B2 (ja) 2003-03-25 2007-11-14 京セラ株式会社 熱電モジュールのパッケージ
CN100397671C (zh) * 2003-10-29 2008-06-25 京瓷株式会社 热电换能模块
JP4287262B2 (ja) * 2003-12-08 2009-07-01 株式会社東芝 熱電変換装置
JP4458906B2 (ja) 2004-04-05 2010-04-28 株式会社ルネサステクノロジ 半導体装置
JP4901350B2 (ja) * 2005-08-02 2012-03-21 株式会社東芝 熱電変換装置及びその製造方法
JP2010118475A (ja) * 2008-11-12 2010-05-27 Mitsumi Electric Co Ltd 熱電変換モジュール及び熱電変換装置
JP2010165840A (ja) * 2009-01-15 2010-07-29 Sumitomo Chemical Co Ltd 熱電変換モジュール及び熱電変換モジュールブロック
US20130019524A1 (en) 2011-07-18 2013-01-24 Roger Collin Plant container systems and structures
KR101324257B1 (ko) 2011-11-22 2013-11-01 한국기계연구원 열전 반도체 모듈 및 이의 제조방법
JP6559650B2 (ja) * 2014-02-26 2019-08-14 国立大学法人京都大学 多孔性配位高分子、及びその用途
JP6417130B2 (ja) 2014-07-02 2018-10-31 株式会社Kelk 熱電発電装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068564A (ja) * 1998-08-18 2000-03-03 Dainippon Screen Mfg Co Ltd ペルチェ素子
JP2001160632A (ja) * 1999-12-02 2001-06-12 Yamaha Corp 熱電モジュール
CN101232071A (zh) * 2003-10-29 2008-07-30 京瓷株式会社 热电换能模块及其封装
JP2008244100A (ja) * 2007-03-27 2008-10-09 Yamaha Corp 熱電モジュールおよびその製造方法
CN101807662A (zh) * 2009-02-18 2010-08-18 财团法人工业技术研究院 热电元件及其制作方法、芯片堆叠结构及芯片封装结构
CN103137577A (zh) * 2011-12-01 2013-06-05 三星电子株式会社 热电冷却封装件及其热管理方法
KR20150084310A (ko) * 2014-01-13 2015-07-22 홍익대학교 산학협력단 써멀비아전극을 구비한 열전모듈 및 그 제조방법
CN106025055A (zh) * 2015-03-31 2016-10-12 Lg伊诺特有限公司 热电转换器及使用该热电转换器的除湿器

Also Published As

Publication number Publication date
JP7293116B2 (ja) 2023-06-19
JP2020515051A (ja) 2020-05-21
KR102652928B1 (ko) 2024-03-29
KR20240046141A (ko) 2024-04-08
US20240188442A1 (en) 2024-06-06
US12274171B2 (en) 2025-04-08
KR20180091216A (ko) 2018-08-16
WO2018143780A1 (ko) 2018-08-09
CN110268536A (zh) 2019-09-20
KR102894274B1 (ko) 2025-12-02
US11937506B2 (en) 2024-03-19
US20210135078A1 (en) 2021-05-06

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