CN110246776B - 化学液控制阀及基板处理装置 - Google Patents

化学液控制阀及基板处理装置 Download PDF

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Publication number
CN110246776B
CN110246776B CN201910117565.0A CN201910117565A CN110246776B CN 110246776 B CN110246776 B CN 110246776B CN 201910117565 A CN201910117565 A CN 201910117565A CN 110246776 B CN110246776 B CN 110246776B
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China
Prior art keywords
flow path
valve chamber
wall
chemical liquid
opening
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Active
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CN201910117565.0A
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English (en)
Chinese (zh)
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CN110246776A (zh
Inventor
柏山真人
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication of CN110246776A publication Critical patent/CN110246776A/zh
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Publication of CN110246776B publication Critical patent/CN110246776B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Fluid-Driven Valves (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Valve Housings (AREA)
  • Lift Valve (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Multiple-Way Valves (AREA)
CN201910117565.0A 2018-03-07 2019-02-15 化学液控制阀及基板处理装置 Active CN110246776B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018040760A JP7029314B2 (ja) 2018-03-07 2018-03-07 薬液制御弁および基板処理装置
JP2018-040760 2018-03-07

Publications (2)

Publication Number Publication Date
CN110246776A CN110246776A (zh) 2019-09-17
CN110246776B true CN110246776B (zh) 2023-02-17

Family

ID=67882955

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910117565.0A Active CN110246776B (zh) 2018-03-07 2019-02-15 化学液控制阀及基板处理装置

Country Status (4)

Country Link
JP (1) JP7029314B2 (ja)
KR (1) KR102225758B1 (ja)
CN (1) CN110246776B (ja)
TW (1) TWI732178B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102326247B1 (ko) * 2020-02-21 2021-11-12 한국기술교육대학교 산학협력단 배기압 조절 장치
KR102355356B1 (ko) 2020-03-25 2022-01-25 무진전자 주식회사 반도체 공정의 약액 공급 관리 시스템

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134390A (ja) * 2015-01-15 2016-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2017092241A (ja) * 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置および処理液供給装置の制御方法
KR20170116155A (ko) * 2015-03-27 2017-10-18 가부시키가이샤 스크린 홀딩스 처리액 공급 장치 및 처리액 공급 장치의 제어 방법
JP2017207121A (ja) * 2016-05-18 2017-11-24 Ckd株式会社 流路ブロック、流体制御装置、及び、流路ブロックの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442913Y2 (ja) * 1984-11-30 1992-10-12
JP4319322B2 (ja) * 2000-03-22 2009-08-26 シーケーディ株式会社 流量調整弁の組立方法と、その組立方法により組み立てられた流量調整弁
JP2007058339A (ja) * 2005-08-22 2007-03-08 Asahi Organic Chem Ind Co Ltd 流体制御装置
JP2007058352A (ja) * 2005-08-22 2007-03-08 Asahi Organic Chem Ind Co Ltd 流体制御装置
KR20100012792U (ko) * 2010-01-22 2010-12-24 홍성정공(주) 압력보상형 유량제어 밸브
KR101660115B1 (ko) 2010-05-18 2016-09-26 시케이디 가부시키가이샤 약액 회로 장치
JP6196538B2 (ja) 2013-11-14 2017-09-13 旭化成株式会社 プレススルーパック包装体用蓋材及びその製造方法、並びに包装体
JP2015114966A (ja) * 2013-12-13 2015-06-22 アドバンス電気工業株式会社 流量制御弁及びこれを用いた流量制御装置
JP6238798B2 (ja) * 2014-03-10 2017-11-29 旭有機材株式会社 流量調整弁及びこれを備える流体制御装置
KR101821863B1 (ko) * 2015-11-19 2018-01-25 서문원 완충 유압 솔레노이드 밸브 및 그 솔레노이드 밸브의 작동방법
JP6588819B2 (ja) * 2015-12-24 2019-10-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016134390A (ja) * 2015-01-15 2016-07-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR20170116155A (ko) * 2015-03-27 2017-10-18 가부시키가이샤 스크린 홀딩스 처리액 공급 장치 및 처리액 공급 장치의 제어 방법
JP2017092241A (ja) * 2015-11-10 2017-05-25 株式会社Ｓｃｒｅｅｎホールディングス 処理液供給装置および処理液供給装置の制御方法
JP2017207121A (ja) * 2016-05-18 2017-11-24 Ckd株式会社 流路ブロック、流体制御装置、及び、流路ブロックの製造方法

Also Published As

Publication number Publication date
KR102225758B1 (ko) 2021-03-09
TWI732178B (zh) 2021-07-01
JP7029314B2 (ja) 2022-03-03
TW201938933A (zh) 2019-10-01
JP2019157888A (ja) 2019-09-19
KR20190106707A (ko) 2019-09-18
CN110246776A (zh) 2019-09-17

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