CN110154418A - 一种导热性好的pi膜的制造方法 - Google Patents
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Abstract
本发明公开了一种导热性好的PI膜的制造方法。其具体制造方法为采取原位聚合的方法将所需的填料与溶剂和二胺、二酐混合反应制得带有所需填料的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。本方法制得的聚酰亚胺复合薄膜具有绝缘但导热良好的特点，可应用在LED照明等多个领域。
Description
技术领域
本发明涉及一种薄膜制造方法，具体涉及一种导热聚酰亚胺复合薄膜制造方法。
背景技术
聚酰亚胺(PI)是指主链上含有酰亚胺环的一类聚合物材料，是目前已经实现工业化的特殊高分子材料，具有优越的物理机械综合性能，优良的电气与化学稳定性，广泛的应用于高新技术领域。而聚酰亚胺薄膜是其中最早的商品之一同时又是用量最大的一种。这种新型耐高温有机聚合物薄膜是目前世界上性能最好的薄膜类绝缘材料和最贵的薄膜材料之一，被称为“黄金薄膜”。聚酰亚胺薄膜优良的性能使得其在诸多领域发挥着越来越重要的作用。聚酰亚胺薄膜与碳纤维、芳纶纤维一起，被认为是目前制约我国发展高技术产业的三大瓶颈性关键高分子材料。
目前，国内聚酰亚胺薄膜存在着产品质量差、综合性能不稳定、产品精细化程度不够、品种少等缺点，影响了其应用。本发明提供了一种导热的聚酰亚胺复合薄膜的制造方法，生产出的聚酰亚胺薄膜导热系数高且不导电，可应用在LED灯等多个行业。
发明内容
本发明目的在于提供一种导热性好的PI膜的制造方法。
对于一种导热性好的PI膜的制造方法，本发明所采取的技术方案为：一种导热聚酰亚胺复合薄膜的制造方法。其具体制造方法为采取原位聚合的方法将所需的填料与溶剂和二胺、二酐混合反应制得带有所需填料的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。作为优选，所采用的填料为纳米氮化硼颗粒，氮化硼摩擦系数低，耐高温，导热系数良好，可以有效改善聚酰亚胺性能。
作为优选，所采用制造聚酰胺酸的方法为先将纳米氮化硼与二氨基二苯醚混合溶入二甲基乙酰胺中，而后再缓慢加入均苯四甲酸二酐，当二氨基二苯醚与均苯四甲酸二酐摩尔数相等时体系黏度会快速增大，此时停止加入均苯四甲酸二酐。
作为优选，所采用的平面板材可以是钢化玻璃板，所采用薄膜厚度可以是20微米。
作为优选，生成聚酰胺酸在高温烘箱中进行亚胺化的温度开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。
作为优选，在生成聚酰亚胺薄膜后再在其上下铺一层环氧树脂层，利用压延机压延使其紧密结合，所采用的环氧树脂层的厚度可以是20微米。环氧树脂具有良好的绝缘性与耐化学性，与聚酰亚胺结合可得到高性能的复合材料。
与现有技术相比所具有的优势是：
1：本发明采用原位聚合将纳米氮化硼颗粒溶入聚酰胺酸中，而后再进行亚胺化生产聚酰亚胺，制作方法简单，纳米颗粒在聚酰亚胺中分散良好。
2：本发明生产的聚酰亚胺复合薄膜具有绝缘导热的特性，可应用在一些特殊的领域，如LED灯等领域。
具体实施方式
下面将结合本发明的方法进行实例描述，对本发明实例中的技术方案进行描述，显然，所述的实例仅仅是本发明一部分实例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明的保护范围。
例1：称取50g二氨基二苯醚，200g纳米氮化硼颗粒，将其溶于400g二甲基乙酰胺溶液中，边搅拌边缓慢加入63.2g均苯四甲酸二酐中，搅拌直至溶液黏度变大出现爬杆现象。将上述液体取出利用自动涂膜机将其均匀的涂覆在钢化玻璃板上，使其膜厚为20微米，接着将覆有聚酰胺酸溶液的钢化玻璃板放入高温烘箱中，控制升温保温速度，使其进行亚胺化，温度调控开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。最后等烘箱温度降低取出板材，将上面的聚酰亚胺薄膜剥落，再在其上下铺一层厚度为20微米的环氧树脂层，放入压延机中进行压延直至聚酰亚胺层与环氧树脂层紧密结合，最后取出材料即可制得具有导热的聚酰亚胺复合薄膜。
将普通PI导热系数与纳米氮化硼掺杂PI导热系数对比，结果如下表所示：
| 品名 | 普通PI | 氮化硼掺杂PI |
| 导热系数(W/mK) | 0.015 | 0.058 |
Claims (7)
1.一种导热性好的PI膜的制造方法。其特征在于其具体制造方法为采取原位聚合的方法将所需的填料与溶剂和二胺、二酐混合反应制得带有所需填料的聚酰胺酸。然后利用涂膜机将聚酰胺酸均匀的涂布在平面板材上，再将其放入高温烘箱中进行亚胺化生成所需的聚酰亚胺。最后取出产品将板材上的聚酰亚胺薄膜剥离后即可制得所需的聚酰亚胺层。接着将聚酰亚胺层放入中间，在其上下各铺一层环氧树脂层，利用压延机将其压延结合即可制得所需的材料。
2.根据权利要求1所述的一种导热性好的PI膜的制造方法，其特征在于所述的制造聚酰胺酸的方法为先将填料溶入二胺与溶剂中，而后再缓慢加入二酐，当二胺与二酐摩尔数相等时体系黏度会快速增大，此时停止加入二酐。
3.根据权利要求2所述的一种导热性好的PI膜的制造方法，其特征在于所述的二胺可以是44-二氨基二苯醚与对苯二胺等，所述的二酐可以是均苯四甲酸二酐与联苯四甲酸二酐，所述的填料可以为纳米级氮化硼填料，所述的溶剂可以是二甲基乙酰胺与二甲基甲酰胺。
4.根据权利要求1所述的一种导热性好的PI膜的制造方法，其特征在于所述的平面板材可以是钢化玻璃板材，也可以是不锈钢板材，涂在平面板材上薄膜的厚度可以是5-200微米。
5.根据权利要求1所述的一种导热性好的PI膜的制造方法，其特征在于高温烘箱中进行亚胺化的温度开始可以是80℃保温1H，接着100℃,150℃,200℃,250℃，300℃各保温30分钟。
6.根据权利要求1所述的一种导热性好的PI膜的制造方法，其特征在于二酐与二胺的质量总和可以占溶剂质量的10％到30％，所述的纳米氮化硼填料可以占二酐与二胺质量总和的1％到200％。
7.根据权利要求1所述的一种导热性好的PI膜的制造方法，其特征在于得到聚酰亚胺薄膜后再在其上下铺一层环氧树脂层进行压延使其紧密结合，环氧树脂层与聚酰亚胺层的厚度比可以为0.1-10。
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