CN110137123B - Wafer loading and unloading device and wafer unloading method - Google Patents
Wafer loading and unloading device and wafer unloading method Download PDFInfo
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- CN110137123B CN110137123B CN201910466953.XA CN201910466953A CN110137123B CN 110137123 B CN110137123 B CN 110137123B CN 201910466953 A CN201910466953 A CN 201910466953A CN 110137123 B CN110137123 B CN 110137123B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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Abstract
The invention relates to the technical field of wafer wet cleaning equipment, in particular to a wafer blanking device and a wafer blanking method. The wafer loading and unloading device comprises a wafer box conveying device, a wafer lifting device and an loading and unloading table board; the wafer box conveying device is used for conveying the wafer boxes along the first station, the second station and the third station; the wafer lifting device comprises a lifting driving part and a wafer positioning seat, the wafer positioning seat is used for lifting a wafer, and the lifting driving part can drive the wafer positioning seat to lift, so that the wafer positioning seat lifts the wafer in the wafer box at the second station to a preset position during feeding or supports the wafer above the second station to be placed in the wafer box at the second station during feeding. The wafer blanking method is a control method of a wafer loading and unloading device. The wafer loading and unloading device and the wafer unloading method provided by the invention save loading and unloading time and have higher efficiency.
Description
Technical Field
The invention relates to the technical field of wafer wet cleaning equipment, in particular to a wafer blanking device and a wafer blanking method.
Background
The existing wafer wet cleaning can be divided into three modes, namely multi-groove cleaning, rotary washing and spin-drying and single-chip corrosion cleaning, wherein the groove cleaning plays an important role in the wet cleaning in an efficient working mode. With the development of the semiconductor industry, the critical dimension of the device process technology is continuously reduced, and higher requirements are placed on the cleanliness of the wafer in each processing technology.
However, in the existing wafer loading and unloading device used in the process of performing slot type cleaning on the wafer, only one wafer box can exist on the loading and unloading table surface at the same time; by taking the feeding process as an example, after the wafer box with the wafers is manually placed on the feeding and discharging table board, the manipulator takes away the wafers in the wafer box, and then the empty wafer box is manually taken away to be replaced by the wafer box with the wafers, so that a certain time is wasted by the material changing box, and the efficiency is low.
In summary, how to overcome the above-mentioned defects of the existing tank cleaning process equipment is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a wafer blanking device and a wafer blanking method, which are used for relieving the technical problem of low efficiency of groove type cleaning process equipment in the prior art.
The invention provides a wafer loading and unloading device, which comprises a wafer box conveying device, a wafer lifting device and a loading and unloading table board;
the wafer box conveying device is used for conveying wafer boxes along the first station, the second station and the third station;
the wafer lifting device comprises a lifting driving part and a wafer positioning seat, the wafer positioning seat is used for lifting a wafer, the lifting driving part can drive the wafer positioning seat to lift, so that the wafer positioning seat lifts a wafer in a wafer box of the second station to a preset position during loading or lifts the wafer above the second station into the wafer box of the second station during unloading.
Preferably, as an implementable manner, the wafer loading and unloading device further comprises a controller, wherein a first wafer box detection sensor is installed at the first station, and a second wafer box detection sensor and a first wafer detection sensor are installed at the second station; the wafer box conveying device, the wafer lifting device, the first wafer box detection sensor, the second wafer box detection sensor and the first wafer detection sensor are all electrically connected with the controller;
the controller is used for controlling the wafer box conveying device to convey the wafer box at the first station to the second station when the first wafer box detecting sensor detects that a wafer box exists at the first station and the second wafer box detecting sensor detects that no wafer box exists at the second station; the controller is used for controlling the wafer lifting device to move up and down once when the second wafer box detection sensor detects that a wafer box is arranged at the second station; the controller is used for controlling the wafer box conveying device to convey the wafer box at the second station to the third station when the first wafer detection sensor detects that no wafer exists in the wafer box at the second station or when a wafer exists in the wafer box at the second station during blanking.
Preferably, as an implementation mode, the wafer loading and unloading device further comprises a material taking alarm, a third wafer box detection sensor is installed at a third station, and the material taking alarm and the third wafer box detection sensor are both electrically connected with the controller;
the controller is used for controlling the material taking alarm to give an alarm when the third sheet box detection sensor detects that the sheet box is arranged at the third station.
Preferably, as an implementation mode, the wafer loading and unloading device further comprises an abnormality alarm, a second wafer detection sensor is further installed at the first station, and the abnormality alarm and the second wafer detection sensor are both electrically connected with the controller;
the controller is used for controlling the abnormity alarm to give an alarm when the second wafer detection sensor detects that no wafer exists in the wafer box at the first station or when a wafer exists in the wafer box at the first station during blanking.
Preferably, as an embodiment, the magazine conveying device includes a horizontal conveying member, a vertical conveying member, and a magazine positioning base; horizontal transfer part is used for the drive vertical transfer part is in first station the second station with horizontal migration between the third station, vertical transfer part is used for the drive the spool box positioning seat reciprocates, so that the spool box positioning seat lifts the spool box or places the spool box on going up on the unloading mesa.
Preferably, as an implementation mode, a temporary storage station is further arranged on the loading and unloading table top, the first station, the temporary storage station, the second station and the third station are respectively located at four corners of a rectangle and are sequentially arranged, and the horizontal conveying component is used for conveying the wafer box along the temporary storage station, the second station and the third station of the first station;
the horizontal conveying component comprises a first rodless cylinder and a second rodless cylinder, the length direction of the first rodless cylinder is parallel to the arrangement direction of the first station and the temporary storage station, and the length direction of the second rodless cylinder is parallel to the arrangement direction of the temporary storage station and the second station; and a cylinder barrel of the second rodless cylinder is fixedly connected with a piston of the first rodless cylinder, and the piston of the second rodless cylinder is fixed on the vertical conveying component.
Preferably, as an implementable mode, the wafer loading and unloading device further comprises an avoidance driving component, and the avoidance driving component is used for driving the lifting driving component to horizontally move so as to avoid the wafer box positioning seat at the second station or make the lifting driving component reset.
The invention also provides a wafer blanking method of the wafer blanking device, which comprises the following steps:
when the first wafer box detection sensor detects that a wafer box is arranged at the first station and the second wafer box detection sensor detects that no wafer box is arranged at the second station, the controller controls the wafer box conveying device to convey the wafer box at the first station to the second station;
when the second wafer box detection sensor detects that a wafer box is arranged at the second station, the controller controls the lifting driving part to drive the wafer positioning seat to ascend to a preset position;
when the wafer falls onto the wafer positioning seat, the controller controls the lifting driving part to drive the wafer positioning seat to descend and reset;
when the first wafer detection sensor detects that wafers exist in the wafer box at the second station, the controller controls the wafer box conveying device to convey the wafer box at the second station to the third station.
Preferably, as an implementation mode, the wafer loading and unloading device further comprises a material taking alarm, a third wafer box detection sensor is installed at a third station, and the material taking alarm and the third wafer box detection sensor are both electrically connected with the controller;
after the step of the controller controlling the cassette transfer device to transfer the cassette at the second station to the third station, the method further includes the steps of:
when the third film box detection sensor detects that a film box is arranged at the third station, the controller controls the material taking alarm to give an alarm.
Preferably, as an implementation mode, the wafer loading and unloading device further comprises an abnormality alarm, a second wafer detection sensor is installed at the first station, and the second wafer detection sensor and the abnormality alarm are both electrically connected with the controller;
when the first film cassette detection sensor detects that a film cassette is arranged at the first station, the controller controls the film cassette conveying device to convey the film cassette at the first station to the second station, and the method specifically comprises the following steps:
when the first wafer box detection sensor detects that a wafer box is arranged at the first station and the second wafer detection sensor detects that a wafer is arranged in the wafer box at the first station, the controller controls the abnormal alarm to give an alarm;
or, when the first wafer cassette detection sensor detects that the wafer cassette is at the first station and the second wafer detection sensor detects that no wafer is in the wafer cassette at the first station, the controller controls the wafer cassette conveying device to convey the wafer cassette at the first station to the second station.
Compared with the prior art, the invention has the advantages that:
the wafer loading and unloading device provided by the invention is provided with a wafer box conveying device, a wafer lifting device and an loading and unloading table board, wherein a first station, a second station and a third station are arranged on the loading and unloading table board; the wafer lifting device comprises a lifting driving component and a wafer positioning seat, the wafer positioning seat can lift a wafer, and the lifting driving component can drive the wafer positioning seat to lift.
During blanking, an empty wafer box can be placed on a first station, and a wafer box conveying device is started to convey the wafer box at the first station to a second station by the wafer box conveying device; then, starting the wafer lifting device, driving the wafer positioning seat to rise by using the lifting driving part so that the wafer positioning seat can bear the cleaned wafer above the second station and support the wafer, and then driving the wafer positioning seat to fall by using the lifting driving part so that the wafer positioning seat can drive the wafer to fall into a wafer box at the second station; and finally, starting the wafer box conveying device to convey the wafer box with the wafer at the second station to a third station, and manually taking away the wafer box with the wafer at the third station, so that the blanking is completed.
When the wafer box is loaded, the wafer box with the wafer to be cleaned can be placed on a first station, and the wafer box conveying device is started, so that the wafer box at the first station is conveyed to a second station by the wafer box conveying device; then, starting the wafer lifting device, driving the wafer positioning seat to rise by using the lifting driving component so that the wafer positioning seat can lift the wafer in the wafer box at the second station to a preset position for a manipulator to take, and then driving the wafer positioning seat to fall by using the lifting driving component so that the wafer positioning seat is reset; and finally, starting the sheet box conveying device to convey the empty sheet box at the second station to the third station, and manually taking away the empty sheet box at the third station, so that the feeding is completed.
Therefore, in the wafer loading and unloading device provided by the invention, two wafer boxes can be simultaneously stored on the loading and unloading table surface, namely, after the wafer box conveying device conveys the wafer box (for convenience of description, the wafer box can be defined as a previous wafer box) at the first station to the second station, one wafer box (for convenience of description, the wafer box can be defined as a next wafer box) can be supplemented at the first station, so that after the previous wafer box is conveyed to the third station, the wafer box conveying device can directly return to the first station and convey the next wafer box at the first station to the second station, the wafer box does not need to be waited for replacing the wafer box, the loading and unloading time is saved, and the efficiency is higher.
The invention also provides a wafer blanking method applied to the wafer loading and unloading device, the wafer loading and unloading device further comprises a controller on the basis of the wafer loading and unloading device, a first wafer box detection sensor is installed at the first station, a second wafer box detection sensor and a first wafer detection sensor are installed at the second station, and the wafer box conveying device, the wafer lifting device, the first wafer box detection sensor, the second wafer box detection sensor and the first wafer detection sensor are all electrically connected with the controller.
The wafer blanking method comprises the following steps:
step a, when a first wafer box detection sensor detects that a wafer box is arranged at a first station and a second wafer box detection sensor detects that no wafer box is arranged at a second station, a controller controls a wafer box conveying device to convey the wafer box at the first station to the second station;
b, when the second wafer box detection sensor detects that a wafer box is arranged at the second station, the controller controls the lifting driving part to drive the wafer positioning seat to ascend to a preset position;
c, after the wafer falls on the wafer positioning seat, the controller controls the lifting driving part to drive the wafer positioning seat to descend and reset;
and d, when the first wafer detection sensor detects that the wafer box at the second station contains the wafer, the controller controls the wafer box conveying device to convey the wafer box at the second station to the third station.
Therefore, the wafer blanking method provided by the invention only needs to take and place the wafer box manually, and the wafer box conveying device and the lifting driving part can automatically operate, so that the labor is further saved, and the efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic side view of a wafer loading and unloading apparatus according to an embodiment of the present invention;
fig. 2 is a schematic front view of a wafer loading and unloading apparatus according to an embodiment of the present invention;
fig. 3 is a schematic top view of a loading/unloading table top according to an embodiment of the present invention;
FIG. 4 is an isometric view of a loading and unloading table provided in the embodiments of the present invention;
FIG. 5 is an isometric view of a cassette transport device provided in accordance with an embodiment of the present invention;
fig. 6 is an isometric view of a wafer lifting device according to an embodiment of the invention.
Icon: 10-a cassette transport device; 20-a wafer lifting device; 30-a feeding and discharging table top; 40-a first cassette detection sensor; 50-a second cassette detection sensor; 60-a first wafer detection sensor; 70-third cassette detection sensor; 80-a second wafer detection sensor; 90-fourth cassette detection sensor; 100-avoidance of a driving assembly; 110-a cassette;
101-a horizontal transfer member; 102-a vertical transport component; 103-cassette positioning seat;
1011-a first rodless cylinder; 1012-a second rodless cylinder;
201-lifting drive means; 202-wafer positioning seat;
301-a first station; 302-a second station; 303-a third station; 304-a staging station.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "horizontal", "inside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention will be described in further detail below with reference to specific embodiments and with reference to the attached drawings.
Referring to fig. 1 to 6, the embodiment provides a wafer blanking device, which is provided with a wafer cassette conveying device 10, a wafer lifting device 20, and a loading and unloading table 30, wherein the loading and unloading table 30 is provided with a first station 301, a second station 302, and a third station 303, and the wafer cassette conveying device 10 can convey a wafer cassette 110 sequentially along the first station 301, the second station 302, and the third station 303; the wafer lifting device 20 comprises a lifting driving component 201 and a wafer positioning seat 202, wherein the wafer positioning seat 202 can lift a wafer, and the lifting driving component 201 can drive the wafer positioning seat 202 to lift.
During blanking, an empty cassette 110 can be placed on the first station 301, and the cassette conveying device 10 is started to convey the cassette 110 at the first station 301 to the second station 302 by using the cassette conveying device 10; then, starting the wafer lifting device 20, driving the wafer positioning seat 202 to ascend by using the lifting driving component 201, so that the wafer positioning seat 202 can receive the cleaned wafer above the second station 302 and hold the wafer, and then driving the wafer positioning seat 202 to descend by using the lifting driving component 201, so that the wafer positioning seat 202 can drive the wafer to fall into the wafer box 110 at the second station 302; finally, the wafer box conveying device 10 is started to convey the wafer box 110 filled with the wafers at the second station 302 to the third station 303, and then the wafer box 110 filled with the wafers at the third station 303 is manually taken away, so that the blanking is completed.
During loading, a wafer box 110 filled with wafers to be cleaned can be placed on the first station 301, and the wafer box conveying device 10 is started, so that the wafer box 110 at the first station 301 is conveyed to the second station 302 by the wafer box conveying device 10; then, starting the wafer lifting device 20, driving the wafer positioning seat 202 to rise by using the lifting driving component 201, so that the wafer positioning seat 202 can support the wafer in the wafer box 110 at the second station 302 to a preset position for a manipulator to take, and then driving the wafer positioning seat 202 to fall by using the lifting driving component 201, so that the wafer positioning seat 202 is reset; finally, the wafer box conveying device 10 is started to convey the empty wafer box 110 at the second station 302 to the third station 303, and then the empty wafer box 110 at the third station 303 is manually taken away, so that the loading is completed.
Therefore, in the wafer loading and unloading apparatus provided in this embodiment, two cassettes 110 can be simultaneously stored on the loading and unloading table 30, that is, after the cassette conveying apparatus 10 conveys the cassette 110 (for convenience of description, the cassette can be defined as a previous cassette) at the first station 301 to the second station 302, another cassette 110 (for convenience of description, the cassette can be defined as a next cassette) can be supplemented at the first station 301, so that after the previous cassette 110 is conveyed to the third station 303, the cassette conveying apparatus 10 can directly return to the first station 301 and convey the next cassette at the first station 301 to the second station 302, and there is no need to wait for replacing the cassette, thereby saving loading and unloading time and having high efficiency.
Preferably, referring to fig. 3 and 4, the wafer loading and unloading device provided in this embodiment further includes a controller, and the first wafer cassette detection sensor 40 is installed at the first station 301, the second wafer cassette detection sensor 50 and the first wafer detection sensor 60 are installed at the second station 302, and the wafer cassette conveying device 10, the wafer lifting device 20, the first wafer cassette detection sensor 40, the second wafer cassette detection sensor 50 and the first wafer detection sensor 60 are all electrically connected to the controller.
The wafer blanking method of the wafer loading and unloading device is described as an example, and the wafer blanking method comprises the following steps:
step a, when a first film box detection sensor 40 detects that a film box 110 is at a first station 301, and a second film box detection sensor 50 detects that no film box 110 is at a second station 302, a controller controls a film box conveying device 10 to convey the film box at the first station 301 to the second station 302;
step b, when the second cassette detection sensor 50 detects that the cassette 110 is at the second station 302, the controller controls the lifting driving part 201 to drive the wafer positioning seat 202 to ascend to a preset position;
step c, after the wafer falls on the wafer positioning seat 202, the controller controls the lifting driving part 201 to drive the wafer positioning seat 202 to descend and reset;
in step d, when the first wafer detecting sensor 60 detects that there is a wafer in the cassette 110 at the second station 302, the controller controls the cassette transferring device 10 to transfer the cassette 110 at the second station 302 to the third station 303.
According to the wafer blanking method, the wafer box 110 only needs to be taken and placed manually, and the wafer box conveying device 10 and the lifting driving part 201 can automatically operate, so that the labor is further saved, and the efficiency is improved.
When loading, the step c is replaced with the step c', and after the wafer positioning seat 202 lifts the wafer in the wafer box 110 to the preset position, the lifting driving component 201 is controlled to drive the wafer positioning seat 202 to descend and reset.
Step d is replaced by step d', when the wafer positioning seat 202 is reset and the first wafer detecting sensor 60 detects that there is no wafer in the cassette 110 at the second station 302, the controller controls the cassette transferring device 10 to transfer the cassette 110 at the second station 302 to the third station 303.
Further, with continued reference to fig. 3 and 4, a material taking alarm may be disposed in the wafer loading and unloading device, a third sheet cassette detection sensor 70 is installed at the third station 303, and both the material taking alarm and the third sheet cassette detection sensor 70 are electrically connected to the controller.
After the step d, the wafer blanking method further comprises the following steps:
step e, when the third film box detection sensor 70 detects that the film box 110 is arranged at the third station 303, the controller controls the material taking alarm to alarm.
That is to say, the material taking alarm is arranged in the wafer loading and unloading device, so that when the cassette is conveyed to the third station 303, the material taking alarm can be used for reminding an operator of taking away the cassette 110 in time to make room for the next cassette 110.
In addition, step d may specifically be the following steps:
when the first wafer detecting sensor 60 detects that there is a wafer in the cassette 110 at the second station 302 and the third cassette detecting sensor 70 detects that there is no cassette 110 at the third station 303, the controller controls the cassette transfer device 10 to transfer the cassette 110 at the second station 302 to the third station 303.
That is, the third cassette detecting sensor 70 is disposed at the third station 303, so that when the operator does not timely take the cassette 110 at the third station 303, the cassette conveying device 10 still conveys the cassette 110 at the second station 302 to the third station 303, which may cause equipment failure.
Further, with continued reference to fig. 3 and 4, an abnormality alarm may be added to the wafer loading and unloading device provided in this embodiment, and the second wafer detection sensor 80 is installed at the first station 301, so that both the abnormality alarm and the second wafer detection sensor 80 are electrically connected to the controller.
The following two cases are specifically included in step a:
in the first case: when the first wafer box detection sensor 40 detects that a wafer box is arranged at the first station 301 and the second wafer detection sensor 80 detects that a wafer is arranged in the wafer box 110 at the first station 301, the controller controls the abnormal alarm to give an alarm;
in the second case, when the first cassette detecting sensor 40 detects the presence of the cassette 110 at the first station 301 and the second wafer detecting sensor 80 detects the absence of a wafer in the cassette 110 at the first station 301, the controller controls the cassette transferring device 10 to transfer the cassette 110 at the first station 301 to the second station 302.
Wherein, the first condition is in the unloading in-process, and the condition that cassette 110 that operating personnel will be equipped with the wafer has been put to first station 301 department by mistake, that is to say, the unloading device on wafer that this embodiment provided can send alarm signal through unusual alarm when operating personnel maloperation to remind operating personnel in time to handle, prevent that equipment from moving unusually.
In the feeding process, the two cases in the step a can be replaced by the following two cases:
in the first situation, when the first wafer cassette detection sensor 40 detects that the wafer cassette 110 is at the first station 301 and the second wafer detection sensor 80 detects that no wafer exists in the wafer cassette 110 at the first station 301, the controller controls the abnormal alarm to alarm;
in the second case, when the first cassette detecting sensor 40 detects the presence of the cassette 110 at the first station 301 and the second wafer detecting sensor 80 detects the presence or absence of a wafer in the cassette 110 at the first station 301, the controller controls the cassette transferring device 10 to transfer the cassette 110 at the first station 301 to the second station 302.
Wherein, the first condition is the material loading in-process, and the condition that cassette 110 of not adorning the wafer has been put to first station 301 department to the operating personnel mistake, that is to say, the unloading device on wafer that this embodiment provided can send alarm signal through unusual alarm when operating personnel maloperation to remind operating personnel in time to handle, prevent that equipment from moving unusually.
Referring to fig. 5, a horizontal transfer member 101, a vertical transfer member 102, and a cassette positioning seat 103 may be provided in a specific structure of the cassette transfer device 10, wherein the horizontal transfer member 101 may drive the vertical transfer member 102 to move horizontally at the first station 301, the second station 302, and the third station 303, and the vertical transfer member 102 may drive the cassette positioning seat 103 to move up and down at the first station 301, the second station 302, and the third station 303.
The step of controlling the cassette conveying device 10 to convey the cassette at the first station 301 to the second station 302 by the controller in the step a includes the following steps:
step a1, the controller controls the horizontal conveying part 101 to drive the cassette positioning seat 103 to move below the first station 301;
step a2, when the cassette positioning seat 103 reaches the position right below the first station 301, the controller controls the vertical conveying component 102 to drive the cassette positioning seat 103 to move upwards so as to lift the cassette 110 at the first station 301 by the cassette positioning seat 103;
step a3, after the wafer cassette 110 at the first station 301 is lifted, the controller controls the horizontal conveying part 101 to drive the wafer cassette positioning seat 103 to move to the second station 302;
in step a4, when the cassette positioning seat 103 reaches the second station 302, the controller controls the vertical conveying part 102 to drive the cassette positioning seat 103 to move downwards for resetting, so that the cassette 110 on the cassette positioning seat 103 can fall at the second station 302.
Preferably, referring to fig. 6, an avoidance driving assembly 100 may be disposed in the wafer loading and unloading device, and the avoidance driving assembly 100 drives the lifting driving part 201 to move horizontally to avoid the cassette positioning seat 103 at the second station 302 or to reset the lifting driving part 201.
Step b of the wafer blanking method specifically comprises the following steps:
b1, when the second cassette detecting sensor 50 detects that there is a cassette 110 at the second station 302, the controller controls the horizontal conveying component 101 to drive the cassette positioning seat 103 to move away from the second station 302 (to the first station 301, the third station 303 or the temporary storage station 304, preferably the temporary storage station 304) to avoid the wafer positioning seat 202;
step b2, after the cassette positioning seat 103 leaves from the second station 302, the controller controls the avoidance driving component 100 to drive the lifting driving part 201 to move towards the second station 302 until the wafer positioning seat 202 reaches the position right below the second station 302;
in step b3, after the wafer positioning seat 202 reaches a position right below the second station 302, the controller controls the lifting driving part 201 to drive the wafer positioning seat 202 to move upward, so that the wafer positioning seat 202 passes through the inside of the wafer cassette 110 at the second station 302 and reaches a predetermined position to receive the wafer located above the second station 302.
Step d of the wafer blanking method specifically comprises the following steps:
step d1, when the first wafer detecting sensor 60 detects that there is a wafer in the wafer cassette 110 at the second station 302, the controller controls the avoiding driving assembly 100 to drive the lifting driving part 201 to move away from the lower side of the second station 302 (actually, the wafer positioning seat 202 moves away from the lower side of the second station 302) to avoid the wafer cassette positioning seat 103;
step d2, after the lifting driving part 201 is removed from the lower part of the second station 302, the controller controls the horizontal driving part to drive the cassette positioning seat 103 to move to the position right below the second station 302;
step d3, when the cassette positioning seat 103 reaches the position right below the second station 302, the controller controls the vertical conveying component 102 to drive the cassette positioning seat 103 to move upwards so as to lift the cassette 110 at the first station 301 by the cassette positioning seat 103;
step d4, after the cassette 110 at the second station 302 is lifted, the controller controls the horizontal conveying component 101 to drive the cassette positioning seat 103 to move to the position right below the third station 303;
step d5, when the cassette positioning seat 103 reaches the position right below the third station 303, the controller controls the vertical conveying component 102 to drive the cassette positioning seat 103 to move downwards for resetting, so that the cassette 110 on the cassette positioning seat 103 can fall at the third station 303.
Referring to fig. 5, a first rodless cylinder 1011 and a second rodless cylinder 1012 may be provided in a specific structure of the horizontal transfer part 101, the first rodless cylinder 1011 and the second rodless cylinder 1012 are vertically provided, and a cylinder of the second rodless cylinder 1012 is fixedly connected to a piston of the first rodless cylinder 1011, so that when the piston on the first rodless cylinder 1011 moves along the cylinder, the second rodless cylinder 1012 (the cassette positioning seat 103) can move along the length direction of the first rodless cylinder 1011; meanwhile, the piston of the second rodless cylinder 1012 is fixed to the vertical transfer member 102 so that the vertical transfer member 102 (cassette positioning seat 103) can move in the length direction of the second rodless cylinder 1012 while the piston of the second rodless cylinder 1012 moves along the cylinder tube.
Referring to fig. 3 and 4, a temporary storage station 304 is arranged on the feeding and discharging table 30, and the first station 301, the temporary storage station 304, the second station 302 and the third station 303 are respectively arranged at four corners of a rectangle and are sequentially arranged; meanwhile, the length direction of the first rodless cylinder 1011 is set to be parallel to the arrangement direction of the first station 301 and the temporary storage station 304, and the length direction of the second rodless cylinder 1012 is set to be parallel to the arrangement direction of the temporary storage station 304 and the second station 302, so that the stations on the feeding and discharging table board 30 can be well adapted to the structure of the horizontal conveying part 101, and an operator can fill the wafer box 110 and take the wafer box 110 at the same side of the equipment, and the structural layout is convenient.
The step a3 in the wafer blanking method specifically comprises the following steps:
step a31, after the film cassette 110 at the first station 301 is lifted, the controller controls the first rodless cylinder 1011 to work so that the piston of the first rodless cylinder 1011 drives the second rodless cylinder 1012 to move along the arrangement direction of the first station 301 and the temporary storage station 304, and further, the film cassette 110 at the first station 301 moves to the temporary storage station 304;
in step a32, when the cassette 110 arrives at the temporary storage station 304 and the second cassette detecting sensor 50 detects that there is no cassette 110 at the second station 302, the controller controls the second rodless cylinder 1012 to operate, so that the piston of the second rodless cylinder 1012 drives the vertical conveying member 102 to move along the arrangement direction of the temporary storage station 304 and the second station 302, and further, the cassette 110 at the temporary storage station 304 moves to the second station 302.
Preferably, a fourth cassette sensing sensor 90 may be installed at the escrow station 304, the cassette 110 at the escrow station 304 may be sensed by the fourth cassette sensing sensor 90, and the fourth cassette sensing sensor 90 may be electrically connected to the controller.
The step a32 specifically includes:
in step a321, when the fourth cassette detecting sensor 90 detects that there is a cassette 110 at the temporary storage station 304 and the second cassette detecting sensor 50 detects that there is no cassette 110 at the second station 302, the controller controls the second rodless cylinder 1012 to work so that the piston of the second rodless cylinder 1012 drives the vertical conveying member 102 to move along the arrangement direction of the temporary storage station 304 and the second station 302, and further, the cassette 110 at the temporary storage station 304 moves to the second station 302.
Preferably, the first wafer cassette detecting sensor 40, the second wafer cassette detecting sensor 50, the first wafer detecting sensor 60, the third wafer cassette detecting sensor 70, the second wafer detecting sensor 80, and the fourth wafer cassette detecting sensor 90 may be configured as a correlation sensor.
Particularly, a vertically extending cylinder can be arranged in the specific structure of the vertical conveying component 102, so that the telescopic action of the cylinder drives the wafer box positioning seat 103 to move up and down.
Particularly, a vertically extending cylinder may be disposed in the specific structure of the lifting driving component 201, so as to drive the wafer positioning seat 202 to move up and down through the telescopic action of the cylinder.
Particularly, a motor, a guide rail, a horizontally arranged screw rod and a nut matched with the screw rod can be arranged in the specific structure of the avoidance driving assembly 100, the guide rail is parallel to the screw rod, the guide rail is in sliding fit with the wafer lifting device 20, the nut is fixed on the wafer lifting device 20, an output shaft of the motor is fixedly connected with the screw rod, so that the controller can control the motor to work, the screw rod is driven to rotate by the motor, further, the nut can drive the wafer lifting device 20 to move along the guide rail, accurate positioning of the wafer positioning seat 202 in the horizontal direction is realized, and the wafer at the second station 302 can be smoothly lifted and can be moved to a proper position when the avoidance position is required.
Particularly, the controller can be a PLC or a single chip microcomputer.
In summary, the present invention discloses a wafer unloading apparatus and a wafer unloading method, which overcome many technical defects of the conventional tank cleaning process equipment. The wafer loading and unloading device and the wafer unloading method provided by the embodiment have the technical advantage of high loading and unloading efficiency.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A wafer blanking device is characterized by comprising a wafer box conveying device (10), a wafer lifting device (20) and a loading and unloading table surface (30);
the feeding and discharging table board (30) is provided with a first station (301), a second station (302) and a third station (303), and the wafer box conveying device (10) is used for conveying the wafer box (110) along the first station (301), the second station (302) and the third station (303);
the wafer lifting device (20) comprises a lifting driving part (201) and a wafer positioning seat (202), wherein the wafer positioning seat (202) is used for lifting a wafer, and the lifting driving part (201) can drive the wafer positioning seat (202) to lift so that the wafer positioning seat (202) lifts the wafer in a wafer box (110) at the second station (302) to a preset position during feeding or supports the wafer above the second station (302) to be placed in the wafer box (110) at the second station (302) during feeding;
the wafer loading and unloading device further comprises a controller and an abnormity alarm, a second wafer detection sensor (80) is further installed at the first station (301), and the abnormity alarm and the second wafer detection sensor (80) are both electrically connected with the controller; the controller is used for controlling the abnormal alarm to alarm when the second wafer detection sensor (80) detects that no wafer exists in the wafer box at the first station (301) during feeding or a wafer exists in the wafer box (110) at the first station (301) during feeding;
the wafer box conveying device (10) comprises a horizontal conveying component (101), a vertical conveying component (102) and a wafer box positioning seat (103); the horizontal conveying part (101) is used for driving the vertical conveying part (102) to horizontally move among the first station (301), the second station (302) and the third station (303), and the vertical conveying part (102) is used for driving the cassette positioning seat (103) to move up and down so that the cassette positioning seat (103) lifts the cassette (110) or places the cassette (110) on the loading and unloading table board (30);
the feeding and discharging table board (30) is further provided with temporary storage stations (304), the first station (301), the temporary storage stations (304), the second station (302) and the third station (303) are respectively located at four corners of a rectangle and are sequentially arranged, and the horizontal conveying part (101) is used for conveying the wafer boxes (110) along the first station (301), the temporary storage stations (304), the second station (302) and the third station (303);
the horizontal conveying component (101) comprises a first rodless cylinder (1011) and a second rodless cylinder (1012), the length direction of the first rodless cylinder (1011) is parallel to the arrangement direction of the first station (301) and the temporary storage station (304), and the length direction of the second rodless cylinder (1012) is parallel to the arrangement direction of the temporary storage station (304) and the second station (302); the cylinder barrel of the second rodless cylinder (1012) is fixedly connected with the piston of the first rodless cylinder (1011), and the piston of the second rodless cylinder (1012) is fixed on the vertical transmission component (102).
2. The wafer loading and unloading device as claimed in claim 1, wherein a first cassette detection sensor (40) is installed at the first station (301), and a second cassette detection sensor (50) and a first wafer detection sensor (60) are installed at the second station (302); the wafer box conveying device (10), the wafer lifting device (20), the first wafer box detection sensor (40), the second wafer box detection sensor (50) and the first wafer detection sensor (60) are all electrically connected with the controller;
the controller is used for controlling the wafer box conveying device (10) to convey the wafer box (110) at the first station (301) to the second station (302) when the first wafer box detecting sensor (40) detects that the wafer box (110) is at the first station (301) and the second wafer box detecting sensor (50) detects that the wafer box (110) is not at the second station (302); the controller is used for controlling the wafer lifting device (20) to move up and down once when the second wafer box detection sensor (50) detects that a wafer box (110) exists at the second station (302); the controller is used for controlling the wafer box conveying device (10) to convey the wafer box (110) at the second station (302) to the third station (303) when the first wafer detection sensor (60) detects that no wafer exists in the wafer box (110) at the second station (302) during feeding or when a wafer exists in the wafer box (110) at the second station (302) during feeding.
3. The wafer loading and unloading device as recited in claim 2, further comprising a material taking alarm, wherein a third cassette detection sensor (70) is installed at the third station (303), and both the material taking alarm and the third cassette detection sensor (70) are electrically connected to the controller;
the controller is used for controlling the material taking alarm to give an alarm when the third film box detection sensor (70) detects that the film box (110) is arranged at the third station (303).
4. The wafer loading and unloading device according to claim 1, further comprising an avoidance driving assembly (100), wherein the avoidance driving assembly (100) is used for driving the lifting driving part (201) to move horizontally to avoid the cassette positioning seat (103) at the second station (302) or reset the lifting driving part (201).
5. A wafer blanking method of the wafer loading and unloading device as claimed in claim 2 or 3, characterized by comprising the steps of:
when the first wafer box detection sensor (40) detects that a wafer box (110) is arranged at the first station (301), and the second wafer detection sensor (80) detects that a wafer is arranged in the wafer box (110) at the first station (301), the controller controls the abnormal alarm to give an alarm; or, when the first cassette detecting sensor (40) detects the presence of a cassette (110) at the first station (301), the second wafer detecting sensor (80) detects the absence of a wafer in the cassette (110) at the first station (301), and the second cassette detecting sensor (50) detects the absence of a cassette (110) at the second station (302), the controller controls the cassette transferring device (10) to transfer the cassette (110) at the first station (301) to the second station (302);
when the second wafer box detection sensor (50) detects that a wafer box (110) is arranged at the second station (302), the controller controls the lifting driving part (201) to drive the wafer positioning seat (202) to ascend to a preset position;
when the wafer falls onto the wafer positioning seat (202), the controller controls the lifting driving part (201) to drive the wafer positioning seat (202) to descend and reset;
when the first wafer detection sensor (60) detects that wafers exist in the wafer box (110) at the second station (302), the controller controls the wafer box conveying device (10) to convey the wafer box (110) at the second station (302) to the third station (303).
6. The wafer blanking method according to claim 5, wherein the wafer loading and unloading device further comprises a material taking alarm, a third wafer box detection sensor (70) is installed at the third station (303), and both the material taking alarm and the third wafer box detection sensor (70) are electrically connected with the controller;
after the step of the controller controlling the cassette transfer device (10) to transfer the cassette (110) at the second station (302) to the third station (303), the method further comprises the steps of:
when the third film box detection sensor (70) detects that the film box (110) is arranged at the third station (303), the controller controls the material taking alarm to give an alarm.
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| CN110524344B (en) * | 2019-08-20 | 2023-10-17 | 青岛高测科技股份有限公司 | Automatic equipment and processing method for grinding plane and chamfer of silicon rod |
| CN110993547B (en) * | 2019-11-12 | 2023-08-29 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN112820687B (en) * | 2019-11-18 | 2022-12-23 | 上海至纯洁净系统科技股份有限公司 | Wafer top lifting mechanism of wet process equipment |
| CN111156910B (en) * | 2020-03-09 | 2021-03-30 | 西安电子科技大学 | High-precision online rapid measuring device and method for thickness of aluminum substrate |
| CN111634687B (en) * | 2020-06-04 | 2021-08-10 | 无锡亚电智能装备有限公司 | Feeding mechanism and feeding method of wafer basket cleaning equipment |
| CN111916381A (en) * | 2020-08-24 | 2020-11-10 | 台州市老林装饰有限公司 | Auxiliary material taking mechanism for wafer material placing box |
| CN111933563A (en) * | 2020-09-03 | 2020-11-13 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading and unloading device |
| CN111834271B (en) * | 2020-09-15 | 2020-12-11 | 北京京仪自动化装备技术有限公司 | Wafer batch conveying mechanism |
| CN114361096A (en) * | 2022-01-04 | 2022-04-15 | 北京北方华创微电子装备有限公司 | Wafer lifting device and process chamber |
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