CN111916381A - Auxiliary material taking mechanism for wafer material placing box - Google Patents
Auxiliary material taking mechanism for wafer material placing box Download PDFInfo
- Publication number
- CN111916381A CN111916381A CN202010853899.7A CN202010853899A CN111916381A CN 111916381 A CN111916381 A CN 111916381A CN 202010853899 A CN202010853899 A CN 202010853899A CN 111916381 A CN111916381 A CN 111916381A
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- fixed
- plate
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- top surface
- vertical
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- 239000000463 material Substances 0.000 title claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims abstract description 40
- 238000009434 installation Methods 0.000 claims abstract description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a material taking auxiliary mechanism of a wafer material placing box, which comprises an installation horizontal plate, wherein a connecting plate is fixed on the top surface of the left part of the top surface of the installation horizontal plate, side fixing plates are fixed on the front part and the rear part of the top surface of the connecting plate, corresponding placing grooves are formed in the inner side walls of the two side fixing plates in the front and the rear directions, and wafers are placed in the corresponding two placing grooves. The wafer taking device can automatically push the wafer outwards, and is convenient for the taking mechanism to directly take the wafer without touching other wafers, so that when the wafer taking device has a certain error, other wafers cannot be touched, and the processing effect is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer material placing box material taking auxiliary mechanism.
Background
The existing wafer is generally required to be placed on a storage rack during processing, then the wafer is grabbed by a grabbing mechanism, and due to the fact that the distance between the wafers placed up and down is small, the height adjusting precision of the grabbing mechanism is very high when the grabbing mechanism grabs, and if the grabbing mechanism is not easy to touch other wafers, when the grabbing mechanism has damage or other problems inside, the grabbing precision cannot meet the requirements, the grabbing mechanism touches other wafers, and production is affected.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a wafer discharging box material taking auxiliary mechanism which can automatically push a wafer outwards, is convenient for a grabbing mechanism to grab the wafer directly without touching other wafers, so that when the grabbing mechanism has a certain error during material taking, other wafers cannot be touched, and the processing effect is ensured.
The technical solution of the invention is as follows:
a material taking auxiliary mechanism of a wafer discharging box comprises an installation horizontal plate, wherein a connecting plate is fixed on the top surface of the left part of the top surface of the installation horizontal plate, side fixing plates are fixed on the front part and the rear part of the top surface of the connecting plate, corresponding placing grooves are formed in the inner side walls of the two side fixing plates in the front and the rear directions, and wafers are placed in the corresponding two placing grooves;
a vertical supporting frame is fixed on the top surface of the right side of the horizontal mounting plate, a linear motor is fixed on the left side wall of a vertical main plate of the vertical supporting frame, a supporting frame is fixed on a sliding block of the linear motor, an intermediate supporting plate is fixed on the top surface of the middle part of a bottom plate of the supporting frame, a first pushing cylinder is fixed on the right side wall of the intermediate supporting plate, a push rod of the first pushing cylinder penetrates through the intermediate supporting plate and is fixed with a pushing plate, a horizontal fixing plate is fixed on the bottom surface of the pushing plate, a left vertical plate is fixed on the top surface of the left end of the horizontal fixing plate, a second pushing cylinder is fixed on the right side wall of the left vertical plate, a push rod of the second pushing cylinder penetrates through the left side wall of the left vertical plate and is fixed with a second pushing plate, an extension fixing plate is fixed on the left side wall of the second pushing plate, a grabbing adsorption block is fixed on, the grabbing and adsorbing block faces to the right side between the two side fixing plates.
The top surface of the bottom plate of the support frame is fixed with a guide rail, the bottom surface of the horizontal fixing plate is fixed with a guide sliding block, and the guide rail is inserted in a sliding groove formed in the bottom surface of the guide sliding block.
And a guide rod is fixed on the right side wall of the second pushing plate and is inserted in a guide through hole formed in the left vertical plate.
The front part and the rear part of the vertical support frame are respectively provided with a guide post, a guide support block is fixed on the bottom surface of the middle part of the bottom plate of the support frame, and the guide posts are inserted in vertical guide through holes formed in the guide support blocks.
And a guide sleeve is fixed on the inner side wall of the vertical guide through hole, and the guide column is inserted in the guide sleeve.
The vertical supporting frame comprises a fixed bottom plate and a fixed top plate, the top end of a vertical main plate is fixed on the bottom surface of the right part of the fixed top plate, the bottom end of the vertical main plate is fixed on the top surface of the right part of the fixed bottom plate, two guide posts are fixed on the top surfaces of the front part and the rear part of the fixed bottom plate, and the top surfaces of the guide posts are fixed on the bottom surface of the fixed top plate.
The invention has the beneficial effects that: it can be automatic with the wafer toward outer propelling movement, conveniently snatchs the mechanism and directly snatchs and can not touch other wafers for when it has certain error when getting the material, also can not touch other wafers, guarantee the processing effect.
Drawings
FIG. 1 is a partial cross-sectional view of the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
fig. 3 is a partial cross-sectional view at two side fixing plates.
Detailed Description
Example (b): as shown in fig. 1 to 3, a wafer discharging box material taking auxiliary mechanism comprises an installation horizontal plate 10, a connecting plate 11 is fixed on the top surface of the left part of the top surface of the installation horizontal plate 10, side fixing plates 12 are fixed on the front part and the rear part of the top surface of the connecting plate 11, corresponding placing grooves 13 are formed on the inner side walls of the two side fixing plates 12, and wafers 100 are placed in the corresponding two placing grooves 13; the right ends of the two side fixing plates 12 are formed with arc-shaped parts extending oppositely;
a vertical supporting frame 20 is fixed on the top surface of the right side of the installation horizontal plate 10, a linear motor 21 is fixed on the left side wall of a vertical main plate of the vertical supporting frame 20, a supporting frame 30 is fixed on a sliding block 22 of the linear motor 21, a middle supporting plate 31 is fixed on the top surface of the middle part of a bottom plate of the supporting frame 30, a first pushing cylinder 32 is fixed on the right side wall of the middle supporting plate 31, a push rod of the first pushing cylinder 32 penetrates through the middle supporting plate 31 and is fixed with a pushing plate 33, a horizontal fixing plate 34 is fixed on the bottom surface of the pushing plate 33, a left vertical plate 35 is fixed on the top surface of the left end of the horizontal fixing plate 34, a second pushing cylinder 36 is fixed on the right side wall of the left vertical plate 35, a push rod of the second pushing cylinder 36 penetrates through the left side wall of the left vertical plate 35 and is fixed with a second pushing plate 37, an extension fixing plate 38 is fixed on the left side wall of the, the left end of the grasping suction block 39 protrudes to the left of the left end of the extension fixing plate 38, and the grasping suction block 40 faces to the right between the two side fixing plates 12.
Further, the top surface of the bottom plate of the supporting frame 30 is fixed with a guide rail 1, the bottom surface of the horizontal fixing plate 34 is fixed with a guide sliding block 341, and the guide rail 1 is inserted into a sliding groove formed in the bottom surface of the guide sliding block 341.
Furthermore, a guide rod 371 is fixed on the right side wall of the second pushing plate 37, and the guide rod 371 is inserted and sleeved in a guide through hole formed in the left vertical plate 35.
Further, the front part and the rear part of the vertical support frame 20 are both provided with guide posts 2, the bottom surface of the middle part of the bottom plate of the support frame 30 is fixed with a guide support block 3, and the guide posts 2 are inserted and sleeved in vertical guide through holes 4 formed in the guide support block 3.
Furthermore, a guide sleeve 5 is fixed on the inner side wall of the vertical guide through hole 4, and the guide column 2 is inserted in the guide sleeve 5.
Further, the vertical support frame 20 includes a fixed bottom plate 23 and a fixed top plate 24, the top end of the vertical main plate is fixed on the right bottom surface of the fixed top plate 24, the bottom end of the vertical main plate is fixed on the right top surface of the fixed bottom plate 23, two guide posts 2 are fixed on the top surfaces of the front part and the rear part of the fixed bottom plate 23, and the top surfaces of the guide posts 2 are fixed on the bottom surface of the fixed top plate 24.
In this embodiment, when it is used, the wafer 100 is placed in the corresponding two placing grooves 13, then, when it is used, the sliding block 22 of the linear motor 21 moves up and down, so that the grabbing adsorption block 39 is located below the right portion of the wafer 100 to be grabbed, then, the pushing rod of the first pushing cylinder 32 pushes the grabbing adsorption block 39 to move to the below of the wafer 100, then, the sliding block 22 of the linear motor 21 moves, the suction cup of the grabbing adsorption block 39 contacts and adsorbs the bottom surface of the wafer 100, grabbing is completed, then, the pushing rod of the second pushing cylinder 36 pushes the grabbing adsorption block, so that the wafer 100 moves to the left, so that the left portion of the wafer extends out of the two side fixing plates 12, which is convenient for the left grabbing mechanism to grab, and is very convenient.
The linear motor 21 and the pneumatic system of the grasping and adsorbing block 39 are all common structures, and detailed description is omitted.
Claims (6)
1. The utility model provides a material complementary unit is got to wafer magazine, includes installation horizontal plate (10), its characterized in that: a connecting plate (11) is fixed on the top surface of the left part of the top surface of the mounting horizontal plate (10), side fixing plates (12) are fixed on the front part and the rear part of the top surface of the connecting plate (11), corresponding placing grooves (13) in the front and the rear are formed in the inner side walls of the two side fixing plates (12), and wafers (100) are placed in the corresponding two placing grooves (13);
a vertical support frame (20) is fixed on the top surface of the right side of the horizontal mounting plate (10), a linear motor (21) is fixed on the left side wall of a vertical main plate of the vertical support frame (20), a support frame (30) is fixed on a sliding block (22) of the linear motor (21), an intermediate support plate (31) is fixed on the top surface of the middle part of a bottom plate of the support frame (30), a first pushing cylinder (32) is fixed on the right side wall of the intermediate support plate (31), a push rod of the first pushing cylinder (32) penetrates through the intermediate support plate (31) and is fixed with a push plate (33), a horizontal fixing plate (34) is fixed on the bottom surface of the push plate (33), a left vertical plate (35) is fixed on the top surface of the left end of the horizontal fixing plate (34), a second pushing cylinder (36) is fixed on the right side wall of the left vertical plate (35), a push rod of the second pushing cylinder (36) penetrates through the left side wall of the left vertical plate (, an extension fixing plate (38) is fixed on the left side wall of the second pushing plate (37), a grabbing adsorption block (39) is fixed on the top surface of the extension fixing plate (38), the left end of the grabbing adsorption block (39) extends out of the left end of the extension fixing plate (38) leftwards, and the grabbing adsorption block (40) faces to the right side between the two side fixing plates (12).
2. The wafer cassette reclaiming assist mechanism as claimed in claim 1, wherein: the top surface of the bottom plate of the support frame (30) is fixed with a guide rail (1), the bottom surface of the horizontal fixing plate (34) is fixed with a guide sliding block (341), and the guide rail (1) is inserted and sleeved in a sliding groove formed in the bottom surface of the guide sliding block (341).
3. The wafer cassette reclaiming assist mechanism as claimed in claim 1, wherein: a guide rod (371) is fixed on the right side wall of the second pushing plate (37), and the guide rod (371) is inserted in a guide through hole formed in the left vertical plate (35).
4. The wafer cassette reclaiming assist mechanism as claimed in claim 1, wherein: the front part and the rear part of the vertical support frame (20) are respectively provided with a guide post (2), the bottom surface of the middle part of the bottom plate of the support frame (30) is fixed with a guide support block (3), and the guide posts (2) are inserted in vertical guide through holes (4) formed in the guide support block (3).
5. The wafer cassette reclaiming assist mechanism as claimed in claim 4, wherein: and a guide sleeve (5) is fixed on the inner side wall of the vertical guide through hole (4), and the guide column (2) is inserted in the guide sleeve (5).
6. The wafer cassette reclaiming assist mechanism as claimed in claim 1, wherein: vertical support frame (20) are including PMKD (23) and fixed roof (24), and the top of vertical mainboard is fixed on the right part bottom surface of fixed roof (24), and the bottom mounting of vertical mainboard is on the right part top surface of PMKD (23), and two guide posts (2) are fixed on the top surface at the front portion and the rear portion of PMKD (23), and the top surface of guide post (2) is fixed on the bottom surface of fixed roof (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853899.7A CN111916381B (en) | 2020-08-24 | 2020-08-24 | Wafer blowing box material taking auxiliary mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010853899.7A CN111916381B (en) | 2020-08-24 | 2020-08-24 | Wafer blowing box material taking auxiliary mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111916381A true CN111916381A (en) | 2020-11-10 |
| CN111916381B CN111916381B (en) | 2024-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010853899.7A Active CN111916381B (en) | 2020-08-24 | 2020-08-24 | Wafer blowing box material taking auxiliary mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111916381B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023124033A1 (en) * | 2021-12-28 | 2023-07-06 | 苏州精濑光电有限公司 | Auxiliary positioning mechanism of cassette |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023124033A1 (en) * | 2021-12-28 | 2023-07-06 | 苏州精濑光电有限公司 | Auxiliary positioning mechanism of cassette |
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| Publication number | Publication date |
|---|---|
| CN111916381B (en) | 2024-06-28 |
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Effective date of registration: 20240522 Address after: No. 201 and 202, Building E4, Headquarters Economic Park, Yunlong Demonstration Zone, Zhuzhou City, Hunan Province, 412000 Applicant after: ZHUZHOU HONGYILONG INDUSTRIAL CO.,LTD. Country or region after: China Address before: 318050 side of Changpu village vegetable market, Lunan street, Luqiao District, Taizhou City, Zhejiang Province Applicant before: Taizhou Laolin Decoration Co.,Ltd. Country or region before: China |
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