CN208478308U - Wafer grabbing device and semiconductor processing equipment - Google Patents
Wafer grabbing device and semiconductor processing equipment Download PDFInfo
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- CN208478308U CN208478308U CN201821323034.4U CN201821323034U CN208478308U CN 208478308 U CN208478308 U CN 208478308U CN 201821323034 U CN201821323034 U CN 201821323034U CN 208478308 U CN208478308 U CN 208478308U
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Abstract
The utility model provides a kind of wafer grabbing device and semiconductor processing equipment, the wafer grabbing device includes: mechanical arm, with the front end for grabbing wafer from wafer cassette, and it connects front end and drives the rear end of home of the nose motion into the wafer cassette between adjacent wafers；The motor being connected with the rear end of the mechanical arm；The wafer position inductor being set on the mechanical arm；And it is set to the level sensor on the mechanical arm.Wafer grabbing device and semiconductor processing equipment provided by the utility model can find whether the mechanical arm of crawl wafer tilts and accurately grab wafer in time, grab wafer surface defects and wafer breakage problem caused by wafer to avoid mechanical arm.
Description
Technical field
The utility model relates to the manufacturing field of semiconductor integrated circuit, in particular to a kind of wafer grabbing device and partly lead
Body process equipment.
Background technique
In the manufacturing process of semiconductor integrated circuit, as integrated circuit technology conducting wire is more and more narrow, energy consumption is increasingly
Low trend, every wafer are all extremely valuable.However, in actual production, it is often necessary to by mechanical arm by wafer from crystalline substance
It is mechanical frequent occurrence in wafer transportational process on the machine table for crawling out and transporting next manufacturing process in circle box
The problem of arm scratches wafer and leads to wafer loss, and often because scratching defect caused by no mechanical arm of discovery in time and not having
Have and prevents the risk point for causing the defect in time and great amount of cost is caused to lose.In order to solve this problem, we analyze machine
Tool arm scratches the reason of wafer, specific as follows: the spacing all very littles between adjacent two wafer placed in wafer cassette, if mechanical arm
The safe gap between adjacent wafers and wafer is not correctly found, then, mechanical arm is just because of distance when grabbing wafer
Wafer is excessively close and scrapes or collides wafer, and then the defects of cause crystal column surface to scratch, even results in the breakage of wafer, finally
Lead to wafer loss.In addition, because production equipment is all to operate without stopping production other than normal service in actual production
Operation, so, mechanical arm may generate the loosened screw etc. of solid mechanical arm after by prolonged mechanical movement
Problem and cause mechanical arm to tilt, and then the crawl position for causing mechanical arm originally to be corrected shifts, if without sending out in time
Existing problem, and it is to continue with crawl wafer, it also results in mechanical arm and scrapes when grabbing wafer or collide wafer and make
Crystal column surface generates the defects of scratch, even results in the breakage of wafer, eventually leads to wafer loss.Therefore, how to find in time
Whether the mechanical arm of crawl wafer tilts and guarantees that mechanical arm accurately grabs wafer and becomes and need solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of wafer grabbing device and semiconductor processing equipments, can find in time
Whether the mechanical arm of crawl wafer tilts and accurately grabs wafer, grabs crystal column surface caused by wafer to avoid mechanical arm and lacks
Sunken and wafer breakage problem.
To achieve the above object, the utility model provides a kind of wafer grabbing device, comprising:
Mechanical arm has the front end for grabbing wafer from wafer cassette, and, it connects front end and the front end is driven to transport
Move the rear end of the home into the wafer cassette between adjacent wafers；
For detecting the wafer position inductor of the placement location of every wafer in the wafer cassette, the wafer position sense
Device is answered to be set on the mechanical arm；
For detecting the level sensor of the horizontality of the mechanical arm, the level sensor is set to the machinery
On arm；And
For driving the motor of the manipulator motion, the rear end of the mechanical arm is connected.
Optionally, there are two the wafer position sensing apparatus, it is respectively arranged at the upper surface of the front end of the mechanical arm
On lower surface；Alternatively, the wafer position inductor only has one, and it is embedded in the front end of the mechanical arm, the crystalline substance
Circle position sensor has the measurement end exposed by the front end of the mechanical arm.
Optionally, the wafer position inductor is infrared inductor or laser range sensor or ultrasonic distance measurement sensing
Device.
Optionally, the level sensor is arranged on the front end of the mechanical arm.
Optionally, the level sensor is electronic gyroscope or laser leveler.
Optionally, when the level sensor be electronic gyroscope when, the wafer grabbing device include it is uniformly distributed
Three or more electronic gyroscopes on the front end of the mechanical arm.
Optionally, further include alarm, be connected with the level sensor.
It optionally, further include the information-storing device communicated to connect with the wafer position inductor.
Optionally, the front end of the mechanical arm is equipped with vacuum adsorption part.
The utility model also provides a kind of semiconductor processing equipment, comprising: machine table and wafer crawl dress
It sets.
Wafer grabbing device and semiconductor processing equipment provided by the utility model, detect machinery by level sensor
The horizontality of arm, with it is timely discovery crawl wafer mechanical arm whether run-off the straight, and then ensure mechanical arm be in it is horizontal
State, and the placement location of every wafer in the wafer cassette is detected by the way that wafer position inductor on the robotic arm is arranged,
So that the rear end motion of motor drive machinery arm with drive the nose motion of mechanical arm between adjacent two wafer safety away from
From, and then guarantee that the front end of mechanical arm can accurately grab out wafer from wafer cassette, it is possible thereby to which the mechanical arm is avoided to grab
Wafer surface defects caused by when wafer and wafer breakage problem.Further, the wafer grabbing device also has and water
The alarm that flat inductor is connected issues report when level sensor monitors that the heeling condition of mechanical arm is more than given threshold
Alert prompt.Further, the wafer grabbing device also has control chip and its link information memory, can be by wafer
The placement location of every wafer stores in the wafer cassette that position sensor detects so that mechanical arm be again introduced into it is described
When wafer cassette grabs wafer, motor can make the front end of mechanical arm quickly move to the safe distance between adjacent two wafer,
It improves efficiency.
Detailed description of the invention
Fig. 1 is the schematic top plan view of the wafer grabbing device of an embodiment of the present invention；
Fig. 2 a is the schematic side view of wafer grabbing device shown in FIG. 1；
Fig. 2 b is the schematic diagram of placement location of the detection wafer of wafer grabbing device shown in Fig. 2 a in wafer cassette；
Fig. 3 is the schematic side view of the wafer grabbing device of another embodiment of the utility model；
Fig. 4 is the schematic diagram of the crawl wafer of wafer grabbing device shown in Fig. 2 a.
Wherein, the reference numerals are as follows for attached drawing 1~4:
Mechanical arm -11；Front end -111；Rear end -112；Motor -12；Wafer position inductor -13；Level sensor -14；
Alarm -15；Control chip -16；Information-storing device -17；L1- infrared light；F1- wafer cassette；W1, W2, W3- wafer；H1- first
Distance value；H2- second distance value.
Specific embodiment
To keep the purpose of this utility model, advantages and features clearer, below in conjunction with 1~4 pair of the utility model of attached drawing
The wafer grabbing device and semiconductor processing equipment of proposition are described in further detail.It should be noted that attached drawing is all made of very
Simplified form and use non-accurate ratio, only to it is convenient, lucidly aid in illustrating the mesh of the utility model embodiment
's.
An embodiment of the present invention provides a kind of wafer grabbing device, and refering to fig. 1, Fig. 1 is that the utility model one is implemented
The schematic top plan view of the wafer grabbing device of example, it can be seen from figure 1 that the wafer grabbing device includes mechanical arm 11, motor
12, wafer position inductor 13, level sensor 14, alarm 15, control chip 16 and information-storing device 17.Wherein, described
Mechanical arm 11 have for from wafer cassette grab wafer front end 111, and, connect the front end 111 and drive it is described before
End 111 moves to the rear end 112 of the home in the wafer cassette between adjacent wafers；The motor 12 and the mechanical arm
11 rear end 112 is connected, and for driving the rear end 112 of the mechanical arm 11 to move, and then drives front end 111 mobile；It is described
Wafer position inductor 13 is set on the mechanical arm 11, for detecting the placement location of every wafer in the wafer cassette；
The level sensor 14 is set on the mechanical arm 11, for detecting the horizontality of the mechanical arm 11；The alarm
Device 15 is connected with the level sensor 14, the inclination of the mechanical arm 11 for detecting in the level sensor 14
Information warning (warning note) is issued when degree is more than given threshold；The control chip 16 is electrically connected the motor
12, wafer position inductor 13, level sensor 14, alarm 15 and information-storing device 17, the control chip 16 are used for
Start and shut down motor 12, wafer position inductor 13, level sensor 14 and alarm 15 by low and high level, and
Corresponding working sequence is sent to motor 12, wafer position inductor 13, level sensor 14, information-storing device 17, to coordinate
The work of motor 12, wafer position inductor 13, level sensor 14, while every that wafer position inductor 13 is monitored
The location information of wafer is stored into information-storing device 17.The control chip 16 and information-storing device 17 can be embedded in described
In motor 12.
The wafer grabbing device is described in detail below:
Mechanical arm 11 has the front end 111 for grabbing wafer from wafer cassette, and, it connects front end 111 and drives institute
State the rear end 112 for the home that front end 111 moves in the wafer cassette between adjacent wafers.It can be seen from figure 1 that described
Mechanical arm 11 is a support construction, when grabbing wafer W1, the rear end 112 of the mechanical arm 11 by motor 12 driving and band
It moves the front end 111 and moves to home in wafer cassette between adjacent wafers, then, the front end 111 of the mechanical arm 11
Hold up the wafer W1 from the lower section of the wafer W1, then, the rear end 112 of the mechanical arm 11 by motor 12 driving again
It drives the front end 111 to move out from wafer cassette, the wafer W1 is crawled out from wafer cassette, it later will crawl
Wafer W1 out is transmitted on the board of corresponding wafer treatment process.It can be equipped on the front end 111 of the mechanical arm 11
Vacuum adsorption part, the vacuum adsorption part include vacuum chuck and the adsorption hole that is arranged on the vacuum chuck, are used
When the front end 111 of the mechanical arm 11 holds up the wafer W1, the wafer W1 vacuum suction is lived, to prevent the wafer
W1 is slided on the front end 111 of the mechanical arm 11 in transmit process or is fallen from the front end 111 of the mechanical arm 11, into
And cause the surface scratching or impaired of the wafer W1.
Motor 12 is connected with the rear end 112 of the mechanical arm 11, for driving the rear end 112 of the mechanical arm 11 to transport
It is dynamic, and then the front end 111 of the mechanical arm 11 is driven to move, as shown in Figure 1.After driving the mechanical arm 11 by motor 12
112 movement of end, to drive the front end 111 of the mechanical arm 11 from top to bottom to move along wafer cassette or transport from the bottom to top
It is dynamic, so that the wafer position inductor 13 on the front end 111 of the mechanical arm 11 can be to all wafers in wafer cassette
Placement location is incuded, then placement location of the available every wafer in wafer cassette；Needing to grab certain wafer
When W1, motor 12 can also drive the rear end 112 of the mechanical arm 11 to move, to drive 111 water of front end of the mechanical arm 11
The flat home being moved between wafer and wafer enables the front end 111 of the mechanical arm 11 by wafer to be captured
Hold up, motor 12 drives the rear end 112 of the mechanical arm 11 to move again at this time, with drive the front end 111 of the mechanical arm 11 from
It is moved out in wafer cassette, and the wafer of crawl is continued to be transmitted on the board of corresponding wafer treatment process.
Wafer position inductor 13 is set on the mechanical arm 11, for detecting every wafer in the wafer cassette
Placement location.The wafer position inductor 13 can only have one, and be embedded in the front end of the mechanical arm 11, and have
The measurement end being exposed by the front end 111 of the mechanical arm 11, it is possible thereby to by the measurement end to the mechanical arm 11
The edge of wafer in the front of front end 111 carry out position detection, as shown in Figure 2 a；Alternatively, the wafer position inductor 13
It can have two, be respectively arranged in the upper and lower surfaces of the front end of the mechanical arm 11, it is possible thereby to pass through two
Wafer position inductor 13 is to the wafer of 111 top of front end of the mechanical arm 11 and 111 lower section of front end of the mechanical arm 11
Wafer carry out position detection, as shown in Figure 3.The wafer position inductor 13 can pass for infrared inductor or laser ranging
Sensor or ultrasonic distance-measuring sensor.
When the wafer position inductor 13 only has one, refering to Fig. 2 a, Fig. 2 a is wafer crawl dress shown in FIG. 1
The schematic side view set can be seen that the wafer position inductor 13 is embedded in the front end of the mechanical arm 11 from Fig. 2 a, when
When the wafer position inductor 13 detects the placement location of every wafer in the wafer cassette, Fig. 2 b is seen, Fig. 2 b is figure
Wafer grabbing device shown in 2a detects the schematic diagram of placement location of the wafer in wafer cassette, can be seen that from Fig. 2 b, works as institute
State wafer position inductor 13 be infrared inductor when, the wafer position inductor 13 to wafer cassette F1 emit infrared light L1,
To scan the entire wafer cassette F1 from top to bottom or from the bottom up, in moving process, the infrared light L1 of sending is connect
It can be reflected back after contacting the edge of every wafer W1, W2, W3 of the wafer cassette F1, and reflected described infrared
Light L1 can be received by the wafer position inductor 13, and then the wafer position inductor 13 can obtain in this wafer cassette F1
The placement location of each wafer.For example, the wafer W2 and wafer W1 in wafer cassette F1 are located at wafer slot adjacent in wafer cassette F1
It is interior, wafer is not placed there are also 1 wafer slot between wafer W3 and wafer W2, so, the wafer position inductor 13 is described
The placement location of wafer W1, W2 and W3 are detected in wafer cassette F1.The wafer position inductor 13 will the entire wafer cassette
After the completion of F1 scanning, that is, the placement location of all wafers in the wafer cassette F1 is got, motor 12 can drive described as a result,
The rear end 112 of mechanical arm 11 moves, to drive the front end 111 of the mechanical arm 11 to move to wafer to be captured and phase below
Home between adjacent wafer, to accurately crawl out wafer to be captured from wafer cassette.Refering to Fig. 4, Fig. 4
It is the schematic diagram of the crawl wafer of wafer grabbing device shown in Fig. 2 a, before grabbing the wafer W1, the front end 111 of mechanical arm 11
It is moved up and down on the outside of all wafers, the wafer position inductor 13 being arranged thereon detects all wafer W1, W2 and W3
Placement location, that is, 11 front end 111 spacing H1 and mechanical arm obtained between the wafer W1 and W2 are able to enter wafer
Safe distance below W1, such as need the in-position of 11 front end 111 of mechanical arm apart from the lower surface wafer W1 and apart from crystalline substance
The upper surface of circle W2 is all larger than H2 or more and is only safe distance, and H2 is greater than 0 and is less than H1；When grabbing wafer W1, the motor
12 can first drive the mechanical arm 11, and the front end 111 of the mechanical arm 11 is moved to apart from the wafer W1 following table
Face and the upper surface of wafer W2 are all larger than any home of H2, then the front end 111 of the mechanical arm 11 is driven to move up,
To hold up and adsorb the wafer W1, then continue that the mechanical arm 11 is driven to move out from wafer cassette F1, it will
The wafer W1 of crawl is transmitted on the board of corresponding wafer treatment process.When the mechanical arm 11 grabs the wafer W3
When, because the wafer W3 is located in the last one wafer slot of the wafer cassette F1, the in-position of 11 front end 111 of mechanical arm
It is the home for grabbing wafer W3 that lower surface apart from the wafer W3, which is greater than H2 or more, when the front end of the mechanical arm 11
Into the wafer W3 to be captured lower section and lower surface apart from the wafer W3 be greater than H2 when, the mechanical arm 11 is being grabbed
Wafer W3 would not be scraped by taking when the wafer W3.In addition, when the mechanical arm 11 when grabbing the wafer W3 into
One step requires bottom surface of the front end 111 of mechanical arm 11 apart from the wafer cassette F1 to be greater than H2 or more, so that it may guarantee mechanical arm 11
The bottom surface of the wafer cassette F1 will not be collided, and then prevents the mechanical arm 11 from knocking the entire wafer cassette F1 down.
When the wafer position inductor 13 tool there are two when, be another embodiment of the utility model refering to Fig. 3, Fig. 3
The schematic side view of wafer grabbing device, as can be seen from Figure 3, described two wafer position inductors 13 are respectively arranged at described
In the upper and lower surfaces of the front end of mechanical arm 11.It, can when the wafer position inductor 13 is laser range sensor
To launch laser up and down, and then detect the crystalline substance above and below wafer position inductor described in wafer cassette 13
Round placement location, the wafer position inductor 13 from top to bottom detect whole wafer box, to obtain every wafer
Placement location.
Level sensor 14 is set on the mechanical arm 11, for detecting the horizontality of the mechanical arm 11.It is described
Level sensor 14 is arranged on the front end of the mechanical arm 11, and the level sensor 14 can be electronic gyroscope or laser
Level meter can there are three above uniform cloth of the electronic gyroscope when the level sensor 14 is electronic gyroscope
It is located on the front end of the mechanical arm, such as uniformly distributed around the alarm 15.Refering to fig. 1 with Fig. 2 a, from Fig. 1 and
It can be seen that in Fig. 2 a, three electronic gyroscopes are set on the upper surface of the front end of the mechanical arm 11, and uniformly distributed
Around the alarm 15, three electronic gyroscopes are simultaneously monitored the levelness of the mechanical arm 11, make
No matter the mechanical arm 11 can be found in time towards when any direction run-off the straight, to ensure the mechanical arm 11 not
Horizontality can be on equidirectional.
Alarm 15 is connected with the level sensor 14, for sending out when knockdown occurs for the mechanical arm 11
Information warning out.It refering to fig. 1 with Fig. 2 a, can be seen that from Fig. 1 and Fig. 2 a, the alarm 15 is set to the mechanical arm 11
On the upper surface of front end, and three level sensors 14 laid respectively with surrounding are connected.When the horizontal induction
When device 14 senses that the inclined degree that the mechanical arm 11 occurs is more than given threshold (i.e. generation knockdown), the horizontal sense
Answer device 14 that signal is passed to the alarm 15, the alarm 15 issues information warning.The institute that the alarm 15 issues
Stating information warning may include issuing red optical signal, or issue whistle sound, with alert device personnel inspection equipment.
In addition, when there is the case where 11 knockdown of mechanical arm during grabbing wafer, the horizontal induction
Device 14 can pass information to the control chip 16 being electrically connected, and the control chip 16 can pass through low and high level
Switching is to shut down the motor 12, so that the motor 12 no longer drives the mechanical arm 11, the mechanical arm 11 stops
Only move.
Information-storing device 17 is communicated to connect with the wafer position inductor 13, can be embedded in the motor 12, is used
In the information that the storage wafer grabbing device generates during grabbing wafer.The letter that the information-storing device 17 can store
Breath includes: the placement location of every wafer in wafer cassette that the wafer position inductor 13 detects；Between wafer and wafer
Distance value；And when crawl wafer, the distance between the mechanical arm 11 and wafer to be grabbed value etc., to be used for mechanical arm
11 subsequent work.
An embodiment of the present invention provides a kind of semiconductor processing equipment, the process equipment include machine table and
The wafer grabbing device.The machine table may include oxidation furnace, curing oven, photoetching equipment, etching machine bench, gravity pouring machine
Platform, work-table of chemicomechanical grinding mill, cleaning machine etc., the wafer grabbing device are mounted on the wafer entrance of the machine table
Place.Wafer cassette equipped with wafer is placed on the wafer inlet of the machine table, the wafer grabbing device is by wafer cassette
In wafer process as described above, wafer is crawled out from wafer cassette accurately, is placed on the machine table
On, to be processed to the wafer.The wafer grabbing device can effectively avoid the mechanical arm from making the wafer of crawl
Therefore the defects of at scratching, being damaged, is equipped with the good of the wafer that the process equipment of the wafer grabbing device is produced
Rate is available to be effectively improved.
In conclusion wafer grabbing device provided by the utility model and semiconductor processing equipment, the wafer crawl dress
It sets including mechanical arm, motor, wafer position inductor, level sensor etc..Wherein, the mechanical arm has for from wafer cassette
The front end of middle crawl wafer, and, it connects front end and drives the nose motion into the wafer cassette between adjacent wafers
The rear end of home；The motor is connected with the rear end of the mechanical arm, for driving the manipulator motion；The crystalline substance
Circle position sensor is set on the mechanical arm, for detecting the placement location of every wafer in the wafer cassette；The water
Flat inductor is set on the mechanical arm, for detecting the horizontality of the mechanical arm；The alarm and the level
Inductor is connected, for issuing information warning in the mechanical arm run-off the straight.The semiconductor processing equipment includes adding
Work board and the wafer grabbing device.Wafer grabbing device and semiconductor processing equipment provided by the utility model can control
The mechanical arm is accurately placed in the home between adjacent wafers to be captured when grabbing wafer, meanwhile, in institute
When stating mechanical arm generation knockdown, it can find the problem and sound an alarm in time, to avoid the mechanical arm to the crystalline substance of crawl
Circle causes surface defect and wafer breakage problem, so that the yield for the wafer that the process equipment is produced is mentioned
It is high.
Foregoing description is only the description to the utility model preferred embodiment, not to any limit of the scope of the utility model
Fixed, any change, the modification that the those of ordinary skill in the utility model field does according to the disclosure above content belong to right and want
Seek the protection scope of book.
Claims (10)
1. a kind of wafer grabbing device characterized by comprising
Mechanical arm has the front end for grabbing wafer from wafer cassette, and, it connects front end and drives the nose motion extremely
The rear end of home in the wafer cassette between adjacent wafers；
For detecting the wafer position inductor of the placement location of every wafer in the wafer cassette, the wafer position inductor
It is set on the mechanical arm；
For detecting the level sensor of the horizontality of the mechanical arm, the level sensor is set to the mechanical arm
On；And
For driving the motor of the manipulator motion, the rear end of the mechanical arm is connected.
2. wafer grabbing device as described in claim 1, which is characterized in that there are two the wafer position sensing apparatus, point
It is not set in the upper and lower surfaces of the front end of the mechanical arm；Alternatively, the wafer position inductor only has one,
And it is embedded in the front end of the mechanical arm, the wafer position inductor has the measurement exposed by the front end of the mechanical arm
End.
3. wafer grabbing device as claimed in claim 2, which is characterized in that the wafer position inductor is infrared inductor
Or laser range sensor or ultrasonic distance-measuring sensor.
4. wafer grabbing device as described in claim 1, which is characterized in that the level sensor is arranged in the mechanical arm
Front end on.
5. wafer grabbing device as claimed in claim 4, which is characterized in that the level sensor is electronic gyroscope or swashs
Light level meter.
6. wafer grabbing device as claimed in claim 5, which is characterized in that when the level sensor is electronic gyroscope
When, the wafer grabbing device includes the electronic gyroscope of uniformly distributed three on the front end of the mechanical arm or more.
7. wafer grabbing device as described in claim 1, which is characterized in that further include alarm, with the level sensor
It is connected.
8. wafer grabbing device as described in claim 1, which is characterized in that further include being communicated with the wafer position inductor
The information-storing device of connection.
9. such as wafer grabbing device described in any item of the claim 1 to 8, which is characterized in that on the front end of the mechanical arm
Equipped with vacuum adsorption part.
10. a kind of semiconductor processing equipment characterized by comprising machine table and any one of claims 1 to 9 institute
The wafer grabbing device stated.
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| CN201821323034.4U CN208478308U (en) | 2018-08-16 | 2018-08-16 | Wafer grabbing device and semiconductor processing equipment |
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| CN201821323034.4U CN208478308U (en) | 2018-08-16 | 2018-08-16 | Wafer grabbing device and semiconductor processing equipment |
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| CN115267339A (en) * | 2022-07-20 | 2022-11-01 | 无锡卓海科技股份有限公司 | Automatic measuring system and method for film resistance |
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