CN208606731U - Substrate warp detection device - Google Patents
Substrate warp detection device Download PDFInfo
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- CN208606731U CN208606731U CN201820994126.9U CN201820994126U CN208606731U CN 208606731 U CN208606731 U CN 208606731U CN 201820994126 U CN201820994126 U CN 201820994126U CN 208606731 U CN208606731 U CN 208606731U
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- substrate
- sensor
- microscope carrier
- detection device
- warpage
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Abstract
The utility model relates to a kind of substrate warp detection devices comprising: microscope carrier is equipped with working face, and the working face of the microscope carrier is equipped with the rest area to place substrate；Positioning mechanism, on the working face of the microscope carrier, to position substrate；Sensor, to detect the marginal position of substrate；And control system, to receive the detection signal of the sensor.Aforesaid substrate warpage detection device, control system judge whether substrate has occurred warpage according to the detection signal of the sensor received, and whether the degree that warpage occurs influences the subsequent manufacturing.If it is detected that the warpage degree of substrate has exceeded the standard of normal warpage error, it can be determined as rejected product.Effectively prevent the case where fragment is generated in array substrate manufacturing process, and then equipment fault caused by avoiding because of fragment.
Description
Technical field
The utility model relates to field of display technology, more particularly to a kind of substrate warp detection device.
Background technique
The array substrate of field of display technology includes substrate, inorganic layer, metal layer etc..Specifically, substrate is array substrate
Basal layer, inorganic layer, metal layer etc. are then sequentially formed on substrate.Substrate is easy to happen during manufacture or storage to be stuck up
It is bent.Since the thickness of substrate is smaller, some subtle warpages are not easy to be found.If the substrate with warpage defect is used for array
In the production of substrate, when forming inorganic layer, metal layer, it is easy to result in because of the warpage defect of substrate in inorganic on substrate
The fragmentations such as layer, it is serious to may cause equipment fault.
Utility model content
Based on this, it is necessary to for the warpage issues of substrate, provide a kind of substrate warp of effectively detection substrate warp degree
Detection device.
A kind of substrate warp detection device, comprising:
Microscope carrier, is equipped with working face, and the working face of the microscope carrier is equipped with the rest area to place substrate；
Positioning mechanism, on the working face of the microscope carrier, to position substrate；
Sensor, to detect the marginal position of substrate；
And control system, to receive the detection signal of the sensor.
Aforesaid substrate warpage detection device, control system judge that substrate is according to the detection signal of the sensor received
No that warpage has occurred, whether the degree that warpage occurs influences the subsequent manufacturing.If it is detected that the warpage degree of substrate exceeds
The standard of normal warpage error, then can be determined as rejected product.It effectively prevents generating in array substrate manufacturing process
The case where fragment, and then equipment fault caused by avoiding because of fragment.
The microscope carrier is marble microscope carrier in one of the embodiments,.
The placement area edge of the microscope carrier is equipped with groove in one of the embodiments, and the sensor is set to described recessed
In slot.
The sensor is set as four in one of the embodiments, detects the position of four corners of substrate respectively
It sets.
The sensor is fibre optical sensor, ultrasonic distance-measuring sensor, laser ranging biography in one of the embodiments,
Sensor or infrared distance measuring sensor.
In one of the embodiments, the positioning mechanism include be fixed on the working face of the microscope carrier to fixed
Position two adjacent sides of substrate position locating piece and it is mobilizable on the working face of the microscope carrier to limit
The mobile locating part of substrate.
The locating piece is locating wheel in one of the embodiments, and the locating part is position-limited wheel.
The positioning mechanism further includes the driving group to drive the locating part mobile in one of the embodiments,
Part.
It in one of the embodiments, further include the alarm to receive the alarm signal of the control system.
It in one of the embodiments, further include the lift pin for picking and placing substrate.
Detailed description of the invention
Fig. 1 is the top view of the substrate warp detection device of an embodiment of the present invention.
Fig. 2 is substrate warp detection device A-A direction view shown in FIG. 1.
Fig. 3 places the structural schematic diagram in substrate warp detection device shown in Fig. 2 for no warp substrates.
Fig. 4 is that warp substrates place the structural schematic diagram in substrate warp detection device shown in Fig. 2.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figures 1 to 4, the substrate warp detection device 100 that an embodiment of the present invention provides comprising microscope carrier
110, the sensor 150 of the marginal position to position the positioning mechanism 130 of substrate, to detect substrate and to receive
The control system of the detection signal of sensor 150.
Wherein, microscope carrier 110 is equipped with working face 111.The working face 111 of microscope carrier 110 is equipped with the placement to prevent substrate
Area 113.Positioning mechanism 130 is set on the working face 111 of microscope carrier 110.
It should be noted that the size of rest area 113 is equal to the size of substrate, substrate is limited by positioning mechanism 130
It is placed in rest area 113.
The marginal position that substrate is detected by sensor 150, judges whether substrate has occurred warpage, the degree of warpage occurs
Whether the subsequent manufacturing is influenced.If it is detected that the warpage degree of substrate has exceeded the standard of normal warpage error, can incite somebody to action
It is determined as defect ware.When the warpage degree of the substrate only detected meets normal warpage error criterion, just the substrate is used
In the manufacture of array substrate, the case where fragment is generated in array substrate manufacturing process is effectively prevented, and then avoid because of fragment
Caused by equipment fault.
In the present embodiment, microscope carrier 110 is in a rectangular parallelepiped shape.As a result simple, it is easy to process.Working face 111 is the upper of microscope carrier 110
Surface.Certainly, microscope carrier 110 can also be in other rules such as cylindrical shape or irregular structure.
In the present embodiment, microscope carrier 110 is marble microscope carrier.Marble microscope carrier flatness is good and is unlikely to deform, and increases substrate
The accuracy of warpage detection.Certainly, microscope carrier 110 can also be on-deformable alloy microscope carrier etc..
According to the detection position of the warpage location settings sensor 150 of substrate.In the present embodiment, the warpage of substrate is withdrawn deposit
The case where surrounding of substrate tilts, therefore detecting substrate edges position by sensor 150 is the warpage situation that can determine whether substrate.
Specifically, 113 edge of rest area of microscope carrier 110 is equipped with groove 115 in the present embodiment, sensor 150 is set to institute
It states in groove 115, so as to detect the marginal position of substrate.
Preferably, in the present embodiment, the edge of the rest area 113 of microscope carrier 110 is set there are four groove 115, correspondingly, each
A sensor 150 is equipped in groove 115.I.e. sensor 150 is set as four, detects the position of four corners of substrate respectively
It sets.
As shown in figure 3, when substrate 200 is without warpage defect, after substrate 200 is placed into the rest area 113 of microscope carrier 110, base
The bottom surface of plate 200 is bonded with the plane where rest area 113 everywhere.Sensor 150 is at a distance from the edge of substrate 200
For H0.
However, as shown in figure 4, substrate 300 is placed into the rest area 113 of microscope carrier 110 when substrate 300 has warpage defect
Afterwards, the marginal position of substrate 300 tilts, and the marginal position of 200 bottom surface of substrate is not bonded with rest area.Setting sensor 150 with
The distance of the edge of substrate 300 is H, it is clear that H > H0.
It should be noted that being the life for not interfering with subsequent array substrate when the warpage defect very little of substrate 300
It produces, when only reaching a certain warpage critical value, just influences whether the production of array substrate.It is assumed herein that the warpage of substrate is critical
Value is Hm.Certainly, different according to the application environment of substrate, the specific warpage critical value for determining substrate.
In the present embodiment, sensor 150 is fibre optical sensor.The distance of reaction for adjusting sensor 150 is Hm, work as sensor
150 when can detect the edge of substrate 300, H < H0+Hm, the warpage defect of substrate is smaller, does not influence the system of subsequent array substrate
Make and subsequent application, substrate 300 are qualified product.When sensor 150 cannot detect the edge of substrate 300, H > H0+
Hm, the warpage defect of substrate is larger, and will affect the production and subsequent application of subsequent array substrate, and substrate 300 is unqualified
Product.
Certainly, sensor 150 is not limited to fibre optical sensor, can also be other distance measuring sensors, as ultrasonic distance measurement passes
Sensor, laser range sensor or infrared distance measuring sensor etc..Distance measuring sensor can directly measure the side of itself and substrate 300
The distance between edge H, then by comparing H and H0+Hm, judge whether substrate 300 is qualified.
It should be noted that sensor can also be arranged in the top of substrate.
Specifically, in a further embodiment, microscope carrier 110 is equipped with support frame.Sensor 150 is fixed at support frame
On, and it is located at the top of the rest area.It needs to compare H and H0-H at this timem, to judge whether substrate is qualified.
In the present embodiment, positioning mechanism 130 include be fixed on the working face 111 of microscope carrier 110 to position substrate
The locating piece 131 of the position of two adjacent sides and it is mobilizable on the working face 111 of microscope carrier 110 to limit
The mobile locating part 133 of substrate.
Specifically, locating piece 131 is locating wheel in the present embodiment, locating part 133 is position-limited wheel.When measurement, first by base
Plate prevents on the working face 111 of microscope carrier 110, so that substrate coincide with rest area 113 substantially.Then pass through travel limiter
133, so that two adjacent sides of substrate are abutted with the locating piece of respective side edge 131 respectively, so that substrate and placement
Area 113 fits like a glove.
Preferably, in the present embodiment, positioning mechanism 130 further includes the driving assembly to drive locating part 133 mobile, with
Realize the automatic positioning of substrate.
In the present embodiment, substrate warp detection device 100 further includes the alarm to receive control system alarm signal.
Specifically, when control system judges substrate warp defect greater than preset critical according to the detection signal of the sensor received
Value when being rejected product, transmits alarm signal to alarm, alarm sounds an alarm.Simultaneously control system can also control by
Underproof substrate is moved at rejected product collection or directly transports rejected product into corresponding device to improve substrate
Warpage defect etc..
Specifically, alarm can be alarm lamp, display etc..
In the present embodiment, substrate warp detection device 100 further includes the lift pin for picking and placing substrate, realizes substrate inspection
Survey the automatic clamping and placing of front and back.
Further, the substrate warp detection device with lift pin can be used in the easy warpage processing procedure of substrate, from
And realize that the automatic detection of middle warpage defect is made in substrate, the warpage defect of substrate is found in time.Specifically, the easy warpage system of substrate
Journey includes film forming processing procedure and high temperature anneal processes etc..
It should be noted that microscope carrier can pass through when warpage detection device 100 is applied in the easy warpage processing procedure of substrate
Element substitution on apparatus for manufacturing substrate, sensor can also be set on the elements such as the shell of apparatus for manufacturing substrate, and sensor
Detection signal can pass to the control system of apparatus for manufacturing substrate.
Aforesaid substrate warpage detection device, control system judge that substrate is according to the detection signal of the sensor received
No that warpage has occurred, whether the degree that warpage occurs influences the subsequent manufacturing.If it is detected that the warpage degree of substrate exceeds
The standard of normal warpage error, then can be determined as rejected product.It effectively prevents generating in array substrate manufacturing process
The case where fragment, and then equipment fault caused by avoiding because of fragment.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of substrate warp detection device characterized by comprising
Microscope carrier, is equipped with working face, and the working face of the microscope carrier is equipped with the rest area to place substrate；
Positioning mechanism, on the working face of the microscope carrier, to position substrate；
Sensor, to detect the marginal position of substrate；
And control system, to receive the detection signal of the sensor.
2. substrate warp detection device according to claim 1, which is characterized in that the microscope carrier is marble microscope carrier.
3. substrate warp detection device according to claim 1, which is characterized in that the placement area edge of the microscope carrier is equipped with
Groove, the sensor are set in the groove.
4. substrate warp detection device according to claim 1, which is characterized in that the sensor is set as four, point
Not Jian Ce substrate four corners position.
5. substrate warp detection device according to claim 1, which is characterized in that the sensor be fibre optical sensor,
Ultrasonic distance-measuring sensor, laser range sensor or infrared distance measuring sensor.
6. substrate warp detection device according to claim 1, which is characterized in that the positioning mechanism includes being fixed at
The locating piece of the position to position two adjacent sides of substrate on the working face of the microscope carrier and it is mobilizable be set to institute
State the locating part mobile to restricting substrate on the working face of microscope carrier.
7. substrate warp detection device according to claim 6, which is characterized in that the locating piece is locating wheel, described
Locating part is position-limited wheel.
8. substrate warp detection device according to claim 7, which is characterized in that the positioning mechanism further includes to drive
Move the mobile driving assembly of the locating part.
9. substrate warp detection device according to claim 1, which is characterized in that further include to receive the control system
The alarm of the alarm signal of system.
10. substrate warp detection device according to claim 1, which is characterized in that further include the liter for picking and placing substrate
Thimble drops.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820994126.9U CN208606731U (en) | 2018-06-26 | 2018-06-26 | Substrate warp detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820994126.9U CN208606731U (en) | 2018-06-26 | 2018-06-26 | Substrate warp detection device |
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| Publication Number | Publication Date |
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| CN208606731U true CN208606731U (en) | 2019-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820994126.9U Active CN208606731U (en) | 2018-06-26 | 2018-06-26 | Substrate warp detection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110118817A (en) * | 2019-05-31 | 2019-08-13 | 云谷（固安）科技有限公司 | Conducting wire testing apparatus and its detection method |
| CN111457852A (en) * | 2020-04-08 | 2020-07-28 | Tcl华星光电技术有限公司 | Substrate warping degree detection monitoring equipment and detection monitoring method |
-
2018
- 2018-06-26 CN CN201820994126.9U patent/CN208606731U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110118817A (en) * | 2019-05-31 | 2019-08-13 | 云谷（固安）科技有限公司 | Conducting wire testing apparatus and its detection method |
| CN111457852A (en) * | 2020-04-08 | 2020-07-28 | Tcl华星光电技术有限公司 | Substrate warping degree detection monitoring equipment and detection monitoring method |
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