CN110118817A - Conducting wire testing apparatus and its detection method - Google Patents
Conducting wire testing apparatus and its detection method Download PDFInfo
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- CN110118817A CN110118817A CN201910471273.7A CN201910471273A CN110118817A CN 110118817 A CN110118817 A CN 110118817A CN 201910471273 A CN201910471273 A CN 201910471273A CN 110118817 A CN110118817 A CN 110118817A
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- 238000001514 detection method Methods 0.000 title claims abstract description 42
- 238000012360 testing method Methods 0.000 title claims abstract description 39
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- 238000000034 method Methods 0.000 claims description 25
- 230000033001 locomotion Effects 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 13
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
Abstract
The present invention discloses a kind of conducting wire testing apparatus and its detection method.The conducting wire testing apparatus includes: carrier, including first surface, and first surface includes first direction and second direction, and first direction is vertical with second direction；Sensor module is set on the first surface of carrier, and sensor module includes transmitting unit and receiving unit, and the surface of emission of transmitting unit and the receiving plane of receiving unit are parallel with first surface, and the surface of emission and receiving plane are spaced apart along first direction；Whether defective processor, the received electric signal of electric signal and receiving unit for being emitted according to transmitting unit detect conducting wire to be measured, and determine defective locations.Using the technical solution in the embodiment of the present invention, the defect location to conducting wire can be realized.
Description
Technical field
The present invention relates to panel detection field more particularly to a kind of conducting wire testing apparatus and its detection methods.
Background technique
In panel detection field, especially for the peripheral conducting wire (referring to Fig. 1) for being panel, current detection device can be examined
Certain conducting wire or certain TCH test channel exception are measured, but can not accomplish to carry out defect location to conducting wire.
Summary of the invention
The embodiment of the invention provides a kind of conducting wire testing apparatus and its detection method, it is fixed to the defect of conducting wire to can be realized
Position.
In a first aspect, the embodiment of the present invention provides a kind of conducting wire testing apparatus, which includes:
Carrier, including first surface, first surface include first direction and second direction, and first direction and described second
Direction is vertical；
Sensor module is set on the first surface of carrier, and sensor module includes transmitting unit and receiving unit, hair
The receiving plane of the surface of emission and receiving unit of penetrating unit is parallel with first surface, and the surface of emission and receiving plane are along first direction interval point
Cloth；
Processor, electric signal and the received electric signal of the receiving unit for being emitted according to the transmitting unit, inspection
It whether defective surveys the conducting wire to be measured, and determines defective locations.
In a kind of optional embodiment of first aspect, processor is located at carrier inside；Or processor is located at load
Outside body, it is provided with signal transmission interface on carrier and processor, with transmission telecommunications number.
In a kind of optional embodiment of first aspect, the surface of emission of transmitting unit and the receiving plane position of receiving unit
In in same level.Preferably, the shape of the surface of emission and receiving plane is identical or different；Preferably, across the center of the surface of emission
And it is parallel to the straight line of first direction, and it the center for passing through receiving plane and is parallel to the straight line of first direction and is overlapped；Preferably, it sends out
The shape in face is penetrated in rectangle, round or ellipse, the shape of receiving plane is in rectangle, round or ellipse；Preferably, the surface of emission and
The shape of receiving plane is in rectangle.
In a kind of optional embodiment of first aspect, surface of emission width in a second direction and receiving plane are along
Center spacing width of the width in two directions all less than adjacent two conducting wires to be measured；Alternatively, the width of the surface of emission in a second direction
2 times of the width of degree and receiving plane in a second direction all less than conductor width to be measured.
In a kind of optional embodiment of first aspect, conducting wire testing apparatus further comprises moving parts, movement
Component is fixedly connected with carrier, for driving carrier mobile.
In a kind of optional embodiment of first aspect, conducting wire testing apparatus further comprises image acquisition device, figure
As collector is fixedly connected with carrier, the center of the camera of image acquisition device, the center of the surface of emission, receiving plane center be in one
Straight line.
In a kind of optional embodiment of first aspect, conducting wire testing apparatus further comprises range sensor, away from
It is set to first surface from sensor, the detection direction of range sensor is perpendicular to first surface.
Second aspect, the embodiment of the present invention provide a kind of conducting wire detection method, are used for conducting wire testing apparatus as described above,
The conducting wire detection method includes:
First surface is set to be parallel to the base plan where conducting wire to be measured；
It moves carrier along the length direction of conducting wire to be measured, high frequency electrical signal is emitted towards conducting wire to be measured by transmitting, is led to
It crosses receiving plane and receives electric signal；
According to transmitting unit emit electric signal and the received electric signal of receiving unit, detect conducting wire to be measured whether have it is scarce
It falls into, and determines defective locations.
In a kind of optional embodiment of first aspect, carrier along the length direction moving process of conducting wire to be measured,
First surface and the distance between base plan where conducting wire to be measured are constant；Length direction moving process of the carrier along conducting wire to be measured
In, across the surface of emission center and be parallel to projection of the straight line of first direction on the direction perpendicular to first surface with it is to be measured
The middle line of the length direction of conducting wire is overlapped；Preferably, carrier controls the first table along the length direction moving process of conducting wire to be measured
The constant mode of the distance between base plan where face and conducting wire to be measured specifically: in carrier moving process, detection first
When the first distance difference of the first distance between surface and base plan, the first distance at current time and previous moment, adjustment
First distance keeps constant first surface with the distance between base plan where conducting wire to be measured.
In a kind of optional embodiment of first aspect, the conducting wire detection method further include: carrier is along conducting wire to be measured
Length direction moving process in, acquire the image of conducting wire to be measured, and image is matched with pre-stored turning area image；
The turning area image to match if it exists with image then drives carrier rotation according to the corresponding angle of turning area image；If not depositing
In the turning area image to match with image, then carrier is made to keep linear motion.
As described above, sensor module can be placed in the upper of conducting wire to be measured when needing to carry out defect location to conducting wire
Side, allows the surface of emission of transmitting unit composition capacity plate antenna approximate with conducting wire to be measured, the receiving plane of receiving unit with it is to be measured
Conducting wire approximate can also constitute capacity plate antenna.When electric signal passes through, the surface of emission of transmitting unit and the receiving plane of receiving unit
Local test circuit can be formed with measured wire.
Since the surface of emission of the transmitting unit in the embodiment of the present invention and the receiving plane of receiving unit can be led with tested
Line forms local test circuit.Therefore, high frequency electrical signal is emitted towards conducting wire to be measured by the transmitting of transmitting unit, passes through reception
The receiving plane of unit receives electric signal, it will be able to detect whether conducting wire to be measured has with high frequency electrical signal based on the received electrical signal
Defect, and determine defective locations, it is a kind of practicability very strong basis in the conducting wire defect positioning method of electrical principles.
Detailed description of the invention
The present invention may be better understood from the description with reference to the accompanying drawing to a specific embodiment of the invention wherein,
The same or similar appended drawing reference indicates the same or similar feature.
Fig. 1 be the present embodiments relate to panel cabling schematic diagram.
Fig. 2 is the structural schematic diagram for the conducting wire testing apparatus that the embodiment of the present invention one provides；
Fig. 3 is the first surface of carrier provided in an embodiment of the present invention and the surface of emission of transmitting unit and receiving unit
The relative positional relationship schematic diagram of receiving plane；
Fig. 4 is the detection schematic diagram of conducting wire testing apparatus provided in an embodiment of the present invention；
Fig. 5 is the detection signal schematic representation of wire break defect provided in an embodiment of the present invention；
Fig. 6 is the detection signal schematic representation of conducting wire circuit defect provided in an embodiment of the present invention；
Fig. 7 be another embodiment of the present invention provides conducting wire testing apparatus structural schematic diagram；
Fig. 8 is the surface of emission of image collecting device provided in an embodiment of the present invention, the first surface of carrier and transmitting unit
And the relative positional relationship schematic diagram of the receiving plane of receiving unit；
Fig. 9 is the flow diagram of conducting wire detection method provided in an embodiment of the present invention.
Specific embodiment
The feature and exemplary embodiment of various aspects of the invention is described more fully below.In following detailed description
In, many details are proposed, in order to provide complete understanding of the present invention.
The embodiment of the invention provides a kind of conducting wire testing apparatus and its detection methods, are used for panel detection field, use
Technical solution in the embodiment of the present invention, can be to the defect location of conducting wire.
Fig. 2 is the structural schematic diagram for the conducting wire testing apparatus that one embodiment of the invention provides.
As shown in Fig. 2, the conducting wire testing apparatus includes: carrier 201, sensor module and processor 204.
Wherein, carrier 201 is for fixing sensor module.The space structure of carrier 201 is not limited to the example in Fig. 2,
It can be plate, be also possible to the body structure with accommodation space.
Carrier 201 have first surface, first surface it can be appreciated that carrier 201 bottom surface.
Sensor module includes transmitting unit 202 and receiving unit 203.
Wherein, transmitting unit 202 has the surface of emission, and receiving unit 203 has receiving plane.
Fig. 3 is the first surface of carrier provided in an embodiment of the present invention and the surface of emission of transmitting unit and receiving unit
The relative positional relationship schematic diagram of receiving plane.
As shown in figure 3, first surface includes first direction and second direction, first direction is vertical with second direction, transmitting
The surface of emission of unit 202 and the receiving plane of receiving unit 203 are parallel to the first surface of carrier 201.
The surface of emission and receiving plane are unobstructed relative to first surface, can be protrusion, are recessed or flush in the first table
Face.When it is implemented, sensor module can emit high frequency electrical signal towards conducting wire to be measured by the transmitting of transmitting unit 202, lead to
The receiving plane for crossing receiving unit 203 receives electric signal.
As shown in figure 3, the surface of emission of transmitting unit 202 and the receiving plane of receiving unit 203 are spaced apart along first direction.
When it is implemented, the surface of emission of transmitting unit 202 and the receiving plane of receiving unit 203 can be made to be located at conducting wire top to be measured and edge
The length direction of conducting wire to be measured is spaced apart.
Conducting wire to be measured is formed on substrate.
The electric signal and the received electric signal of receiving unit 203 that processor 204 can emit according to transmitting unit 202, inspection
It whether defective surveys conducting wire to be measured, and determines defective locations.
In some embodiments, processor 204 can be located inside carrier 201.
In some embodiments, processor 204 can be located at outside carrier 201.For example, on carrier 201 and processor 204
It is provided with signal transmission interface, electric signal and high frequency electrical signal can be transmitted to by processor 204 by signal transmission interface.
Fig. 4 is the detection schematic diagram of conducting wire testing apparatus provided in an embodiment of the present invention.
As shown in figure 4, when transmitting unit 202 and receiving unit 203 are placed in above conducting wire to be measured, transmitting unit 202
The surface of emission and the distance between conducting wire to be measured be d1, the distance between the receiving plane of receiving unit 203 and conducting wire to be measured are d2.
Since conducting wire to be measured has one fixed width,
The surface of emission of transmitting unit 202 can approximate composition capacity plate antenna C1 with conducting wire to be measured.
The receiving plane of receiving unit 203 can approximate composition capacity plate antenna C2 with conducting wire to be measured.
The one of pole plate of the surface of emission of transmitting unit 202 and the receiving plane of receiving unit 203 as capacity plate antenna, can
To be made of metal material.
The principle for leading to high-frequency signal according to capacitor, by loading high-frequency voltage signal to the surface of emission of transmitting unit 202, then
High-frequency voltage signal can be through capacity plate antenna C1, conducting wire and capacity plate antenna C2 to be measured, finally by the receiving plane of receiving unit 203
It receives.In conducting wire zero defect position, the high frequency voltage of detection signal and the load of transmitting unit 202 that receiving unit 203 receives
The fluctuation pattern of the waveform of signal is consistent.
Fig. 5 is the detection signal schematic representation of wire break defect provided in an embodiment of the present invention.
As shown in the dotted line frame in Fig. 5, if in a certain position open circuit occurs for conducting wire, the other parts phase with the conducting wire
Than the detection signal at the off position is without waveform.Therefore, processor is fed back to by the waveform for the abnormal signal that will test,
It can determine that without the conductor area of waveform open circuit occurs for the detection signal, that is, determine that the position of open circuit occurs for conducting wire.
Fig. 6 is the detection signal schematic representation of conducting wire circuit defect provided in an embodiment of the present invention.
As shown in the dotted line frame in Fig. 6, if in a certain position short-circuit (for example being short-circuited to conducting wire 2) occurs for conducting wire 1, and lead
The other parts of line 1 are compared, and the detection signal waveform at location of short circuit dies down due to being dispersed by conducting wire 2.Therefore, by will test
The waveform of abnormal signal feed back to processor, can determine that short circuit occurs for the conductor area that the detection signal waveform dies down, i.e.,
Determine that the position of short circuit occurs for conducting wire.
In some embodiments, the receiving plane of the surface of emission of transmitting unit 202 and receiving unit 203 can be located at different water
In plane, i.e. the distance between the surface of emission and conducting wire to be measured d1 and the distance between receiving plane and conducting wire to be measured d2 are unequal.
It in some embodiments, is raising accuracy in detection, the surface of emission of transmitting unit 202 and connecing for receiving unit 203
Receipts face is located in the same horizontal plane, i.e., between the distance between the surface of emission and conducting wire to be measured d1 and receiving plane and conducting wire to be measured away from
It is equal from d2.
Wherein, the shape of the surface of emission and receiving plane may be the same or different.
In some embodiments, the shape of the surface of emission is in rectangle, round or ellipse, and the shape of receiving plane is in rectangle, circle
Shape or ellipse.
In some embodiments, referring to Fig. 3, the shape of the surface of emission and receiving plane is in rectangle, across the center A of the surface of emission
And it is parallel to the straight line of first direction, and the center B for passing through receiving plane and it is parallel to the straight line AB of first direction and is overlapped, to protects
The surface of emission of transmitting unit 202 and the receiving plane of receiving unit 203 can be distributed along the length direction of conducting wire to be measured when card detection,
And then guarantee accuracy in detection.
In some embodiments, to avoid testing result from being influenced by adjacent wires, guarantee accuracy in detection, transmitting unit
The width of the receiving plane of 202 surface of emission width in a second direction and receiving unit 203 in a second direction is all less than phase
The center spacing width of adjacent two conducting wires to be measured；Or 2 times of the width all less than conducting wire to be measured, i.e. one-time detection can not be across
More two conducting wires.
As described above, sensor module can be placed in the upper of conducting wire to be measured when needing to carry out defect location to conducting wire
Side, allows the surface of emission of transmitting unit 202 composition capacity plate antenna C1 approximate with conducting wire to be measured, the reception of receiving unit 203
It face can also approximate composition capacity plate antenna C2 with conducting wire to be measured.When high frequency electrical signal passes through, the surface of emission of transmitting unit 202 and
The receiving plane of receiving unit 203 can form local test circuit with measured wire.
The receiving plane of the surface of emission and receiving unit 203 due to the transmitting unit 202 in the embodiment of the present invention can be with
Measured wire forms local test circuit.Therefore, electric signal is emitted towards conducting wire to be measured by the transmitting of transmitting unit 202, led to
Cross receiving unit 203 receiving plane receive electric signal, it will be able to detect based on the received electrical signal conducting wire to be measured whether have it is scarce
It falls into, and determines defective locations, be a kind of practicability very strong basis in the conducting wire defect positioning method of electrical principles.
In some embodiments, conducting wire testing apparatus further comprises moving parts (not shown), moving parts with
Carrier 201 is fixedly connected, for driving carrier 201 to move along the length direction of conducting wire to be measured, to realize the dynamic to conducting wire
Defect location.
In some embodiments, moving parts can have multidimensional freedom degree.
By taking three-dimensional freedom as an example, moving parts can drive carrier 201 to move along tri- directions X, Y, Z, that is to say, that
The transmitting unit 202 and receiving unit 203 that moving parts can drive carrier 201 and sensor module are along tri- sides X, Y, Z
To.
In conjunction with Fig. 1 and Fig. 4, moving parts can make sensor module by controlling its movement in the x direction and the y direction
Transmitting unit 202 and receiving unit 203 it is mobile along the length direction (including straight line portion and turn fractions) of conducting wire.Pass through
Moving parts are controlled in the movement of Z-direction, the transmitting unit 202 of sensor module and receiving unit 203 can be made to lead with to be measured
Line keeps preset distance.
In some embodiments, conducting wire testing apparatus further comprises range sensor (not shown).Distance-sensing
Device is set to first surface, and the detection direction of range sensor is perpendicular to first surface, for detecting the first surface of carrier 201
To the distance between base plan where conducting wire to be measured.
In some embodiments, base plan where the first surface that range sensor can will test to conducting wire to be measured
Between real-time range be sent to moving parts, distance reference value is preset in moving parts, moving parts can pass through comparison
Real-time range and distance reference value adjust it in the movement of Z-direction, make the transmitting unit 202 and receiving unit of sensor module
203 stablize with conducting wire to be measured in distance reference value, to guarantee the accuracy of testing result.
In some embodiments, the value range of distance reference value can be 80 ± 10um.
The specific implementation form of the unlimited set a distance sensor of the embodiment of the present invention.
Fig. 7 be another embodiment of the present invention provides conducting wire testing apparatus structural schematic diagram.
As shown in fig. 7, the conducting wire testing apparatus further comprises image acquisition device 205, for carrying out to conducting wire turning area
The angle of turn of teaching and measurement turning area position the automatic defect of conducting wire to realize.
Wherein, image acquisition device 205 is fixedly connected with carrier 201, enables image acquisition device 205 and sensor module
In transmitting unit 202 and receiving unit 203 move together.
Image acquisition device 205 shown in Fig. 7 is located at the side of the close transmitting unit 202 of carrier 201.Understandably
It is that image acquisition device 205 can also be located at the side of the close receiving unit 203 of carrier 201, herein without limitation.
In some embodiments, referring to Fig. 8, the center of the camera of image acquisition device 205 is (i.e. in image acquisition region
The heart), the center of the surface of emission, receiving plane center be in straight line, thus guarantee detection when camera, transmitting unit 202 hair
The receiving plane for penetrating face and receiving unit 203 can be distributed along the length direction of conducting wire to be measured, and then guarantee accuracy in detection.
Referring to Fig. 1, the turning area of periphery conducting wire shown in Fig. 1 includes 90 degree and 120 degree.
When it is implemented, teaching, typing conducting wire to be measured can be carried out first with 205 pairs of image acquisition device peripheral conducting wires
Turning area image at 90 degree and 120 degree, and establish the corresponding relationship between turning area image and curvature.
When detection, image acquisition device 205 in sensor module transmitting unit 202 and receiving unit 203 together along to
The length direction for surveying conducting wire is mobile.
In moving process, if image acquisition device 205 grabs 90 degree of corresponding turning area images, carrier 201 continues to move
After output waveform abnormal (exception caused by being not belonging to because of conducting wire defect) continues to move to offset2 after dynamic offset1, make to move
Component control vector 201 is that 90 ° of center of circle rotation is turned with receiving unit 203, to continue the length direction along conducting wire to be measured
It is mobile.
In moving process, if image acquisition device 205 grabs 120 degree of corresponding turning area images, carrier 201 continues to move
Output waveform abnormal (exception caused by Wave anomaly is not belonging to because of conducting wire defect herein) continues to move to after dynamic offset1
After offset2, make moving parts control vector 201 with 203 center of circle of receiving unit rotate 120 ° turn, with continue along to
The length direction for surveying conducting wire is mobile.
Wherein, offset1 and offset2 can be with reference to the signal in Fig. 8.
Fig. 9 is the flow diagram of conducting wire detection method provided in an embodiment of the present invention, is examined for conducting wire described above
Survey device.
As shown in figure 9, this method conducting wire detection method includes step 901 to step 903.
In step 901, first surface is made to be parallel to the base plan where conducting wire to be measured.
In step 902, move carrier along the length direction of conducting wire to be measured, transmitting emits high-frequency electrical towards conducting wire to be measured
Signal, receiving plane receive electric signal.
In step 903, the electric signal and the received electric signal of receiving unit emitted according to transmitting unit detects to be measured lead
Whether line is defective, and determines defective locations.
In some embodiments, conducting wire testing apparatus further comprises moving parts, moving parts and the fixed company of carrier 201
It connects, for driving carrier 201 to move along the length direction of conducting wire to be measured, the dynamic defect of conducting wire is positioned to realize.
In some embodiments, carrier 201 along the length direction moving process of conducting wire to be measured, lead with to be measured by first surface
The distance between base plan is constant where line, to guarantee the accuracy of testing result.
Specifically, in the length direction moving process in carrier 201 along conducting wire to be measured, it can use range sensor detection
When the first distance difference of the first distance between first surface and base plan, the first distance at current time and previous moment,
First distance is adjusted, keeps constant first surface with the distance between base plan where conducting wire to be measured.
In some embodiments, carrier 201 is along the length direction moving process of conducting wire to be measured, across the center of the surface of emission
And it is parallel in the length direction of projection and conducting wire to be measured of the straight line of first direction on the direction perpendicular to first surface
Line is overlapped, and avoids the problem of the testing result inaccuracy because caused by crossing over two conducting wires because of the surface of emission and receiving plane.
In some embodiments, pre-identification is carried out to any non-directional turning area images such as 90 °, 120 °, 150 ° of product,
And the angle of turn of pre-identification is stored, in length direction moving process of the carrier 201 along conducting wire to be measured, image can also be utilized
Collector 205 acquires the image of conducting wire to be measured, and the image of acquisition is matched with pre-stored turning area image.If it exists
The turning area image to match with the image of acquisition then drives carrier 201 to rotate according to the corresponding angle of turning area image；If no
In the presence of the turning area image to match with image, then carrier 201 is set to keep linear motion, to realize the hair in sensor module
Unit 202 and receiving unit 203 is penetrated to move across turning area and along the length direction of conducting wire to be measured automatically together.
As described above, sensor module can be placed in the upper of conducting wire to be measured when needing to carry out defect location to conducting wire
Side, allows the surface of emission of transmitting unit 202 composition capacity plate antenna approximate with conducting wire to be measured, the receiving plane of receiving unit 203
It can also approximate composition capacity plate antenna with conducting wire to be measured.When high frequency electrical signal passes through, the surface of emission of transmitting unit 202 and reception
The receiving plane of unit 203 can form local test circuit with measured wire.
The receiving plane of the surface of emission and receiving unit 203 due to the transmitting unit 202 in the embodiment of the present invention can be with
Measured wire forms local test circuit.Therefore, high frequency telecommunications is emitted towards conducting wire to be measured by the transmitting of transmitting unit 202
Number, electric signal is received by the receiving plane of receiving unit 203, it will be able to realize the failure to conducting wire based on the received electrical signal
Positioning.
It should be clear that all the embodiments in this specification are described in a progressive manner, each embodiment it
Between the same or similar part may refer to each other, the highlights of each of the examples are it is different from other embodiments it
Place.For device embodiment, related place may refer to the declaratives of embodiment of the method.Not office of the embodiment of the present invention
It is limited to particular step and structure described above and shown in figure.Those skilled in the art can understand the present invention in fact
It after the spirit for applying example, is variously modified, modification and addition, or the sequence between changing the step.Also, it is risen in order to concise
See, omits the detailed description to known method technology here.
Functional block shown in structures described above block diagram can be implemented as hardware, software, firmware or their group
It closes.When realizing in hardware, it may, for example, be electronic circuit, specific integrated circuit (ASIC), firmware appropriate, insert
Part, function card etc..When being realized with software mode, the element of the embodiment of the present invention is used to execute the program of required task
Or code segment.Perhaps code segment can store in machine readable media program or the data by carrying in carrier wave are believed
It number is sent in transmission medium or communication links." machine readable media " may include be capable of storage or transmission information any
Medium.The example of machine readable media includes electronic circuit, semiconductor memory devices, ROM, flash memory, erasable ROM
(EROM), floppy disk, CD-ROM, CD, hard disk, fiber medium, radio frequency (RF) link, etc..Code segment can via such as because
The computer network of special net, Intranet etc. is downloaded.
The embodiment of the present invention can be realized in other specific forms, without departing from its spirit and essential characteristics.For example, special
Determining algorithm described in embodiment can be modified, and system architecture is without departing from the substantially smart of the embodiment of the present invention
Mind.Therefore, current embodiment is all counted as being exemplary rather than limited, the model of the embodiment of the present invention in all respects
It encloses by appended claims rather than foregoing description defines, also, falls into the meaning of claim and complete in the range of equivalent
Portion changes all to be included among the range of the embodiment of the present invention.
Claims (10)
1. a kind of conducting wire testing apparatus characterized by comprising
Carrier, including first surface, the first surface include first direction and second direction, the first direction and described the
Two directions are vertical；
Sensor module is set on the first surface of the carrier, and the sensor module includes transmitting unit and receives single
The receiving plane of member, the surface of emission of the transmitting unit and the receiving unit is parallel with first surface, the surface of emission with it is described
Receiving plane is spaced apart along first direction；
Processor, high frequency electrical signal and the received electric signal of the receiving unit for being emitted according to the transmitting unit, inspection
It whether defective surveys the conducting wire to be measured, and determines defective locations.
2. the apparatus according to claim 1, which is characterized in that the processor is located at the carrier inside；Alternatively,
The processor is located at outside the carrier, is provided with signal transmission interface on the carrier and the processor, with
Transmit the electric signal.
3. the apparatus according to claim 1, which is characterized in that
The receiving plane of the surface of emission of the transmitting unit and the receiving unit is located in the same horizontal plane；
Preferably, the shape of the surface of emission and the receiving plane is identical or different；
Preferably, it across the center of the surface of emission and is parallel to the straight line of the first direction, and passes through the receiving plane
Center and the straight line coincidence for being parallel to the first direction；
Preferably, the shape of the surface of emission is in rectangle, round or ellipse, the shape of the receiving plane in rectangle, circle or
Ellipse；
Preferably, the shape of the surface of emission and the receiving plane is in rectangle.
4. the apparatus according to claim 1, which is characterized in that surface of emission width in a second direction and described connect
Center spacing width of the width of receipts face in a second direction all less than adjacent two conducting wires to be measured；
Preferably, the width of width and the receiving plane in a second direction of the surface of emission in a second direction is all less than institute
2 times for stating conductor width to be measured.
5. device according to claim 1-4, which is characterized in that described device further comprises moving parts,
The moving parts are fixedly connected with the carrier, for driving the carrier mobile.
6. device according to claim 5, which is characterized in that described device further comprises image acquisition device, the figure
As collector is fixedly connected with the carrier, the center of the camera of described image collector, the surface of emission center, described
The center of receiving plane is in straight line.
7. device according to claim 5, which is characterized in that described device further comprises range sensor, it is described away from
It is set to the first surface from sensor, the detection direction of the range sensor is perpendicular to the first surface.
8. a kind of conducting wire detection method, which is characterized in that such as described in any item conducting wire testing apparatus of claim 1-7 are used for,
The described method includes:
The first surface is set to be parallel to the base plan where the conducting wire to be measured；
Move the carrier along the length direction of the conducting wire to be measured, the transmitting emits high frequency telecommunications towards conducting wire to be measured
Number, the receiving plane receives electric signal；
According to electric signal and the received electric signal of the receiving unit that the transmitting unit emits, detecting the conducting wire to be measured is
It is no defective, and determine defective locations.
9. according to the method described in claim 8, it is characterized in that, the carrier is moved along the length direction of the conducting wire to be measured
In the process, the first surface and the distance between base plan where the conducting wire to be measured are constant；
Further include: the carrier along the length direction moving process of the conducting wire to be measured, across the surface of emission center and
It is parallel to projection and the width of the to be measured conducting wire of the straight line of the first direction on the direction perpendicular to the first surface
The middle line for spending direction is overlapped；
Preferably, the carrier is along the length direction moving process of the conducting wire to be measured, control the first surface with it is described
The constant mode of the distance between base plan where conducting wire to be measured specifically: in the carrier moving process, described in detection
First distance between first surface and the base plan, the first distance at current time and the first distance of previous moment are different
When, the first distance is adjusted, the distance between base plan keeps permanent where making the first surface and the conducting wire to be measured
It is fixed.
10. according to the method described in claim 9, it is characterized in that, which comprises
The carrier acquires the image of the conducting wire to be measured along the length direction moving process of the conducting wire to be measured, and by institute
The image for stating conducting wire to be measured is matched with pre-stored turning area image；
If in the pre-stored turning area image, there is turning area image identical with the image of the conducting wire to be measured, then press
According to the conducting wire angle of turn in the pre-stored turning area image matched, the carrier is driven to rotate；
If in the pre-stored turning area image, there is no turning area images identical with the image of the conducting wire to be measured, then
The carrier is set to keep linear motion.
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