CN110137104A - The teaching method of liquid processing device and liquid processing device - Google Patents
The teaching method of liquid processing device and liquid processing device Download PDFInfo
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- CN110137104A CN110137104A CN201910106647.5A CN201910106647A CN110137104A CN 110137104 A CN110137104 A CN 110137104A CN 201910106647 A CN201910106647 A CN 201910106647A CN 110137104 A CN110137104 A CN 110137104A
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- 238000012545 processing Methods 0.000 title claims abstract description 69
- 239000007788 liquid Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000006073 displacement reaction Methods 0.000 claims description 24
- 238000001514 detection method Methods 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 8
- 230000032258 transport Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 55
- 239000011248 coating agent Substances 0.000 description 53
- 238000000576 coating method Methods 0.000 description 53
- 238000003780 insertion Methods 0.000 description 23
- 230000037431 insertion Effects 0.000 description 23
- 239000003085 diluting agent Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001269238 Data Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 206010034703 Perseveration Diseases 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Coating Apparatus (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The teaching method of the present invention offer liquid processing device and liquid processing device, engage the holding section for the nozzle for carrying out liquid processing and the engaged part of nozzle conveying body in the liquid processing device to transport nozzle, can easily and securely set the position for being used to form the engaged part of engaging.Device is configured to, have: image pickup part, it is set to nozzle conveying body, to detect the first position and the second position of the engaged part when engaged part of nozzle conveying body is located at the first height and the second height horizontally respectively, and the image pickup part shoot when engaged part is located at the first height and the second height and is set to the object of the standby nozzle of progress to obtain image data；Control unit finds out the third place being used to form in the transverse direction of the engaging based on for forming the third height engaged between engaged part and holding section, and exports control signal to form engaging in third height and the third place.
Description
Technical field
The liquid processing device and the liquid processing device that the present invention relates to a kind of to be handled to substrate supply treatment fluid
Teaching method.
Background technique
In the manufacturing process of semiconductor device, supply the semiconductor crystal wafer (being recorded as wafer below) as substrate
To the liquid processing for the treatment of fluid.About liquid processing, such as exists to coating fluids such as wafer supply resists and form coated film
Processing.The device for forming the coated film is constituted sometimes are as follows: nozzle carries out standby standby unit from multiple nozzles with arm and selects one
Nozzle and the nozzle is kept, which is transported to above wafer and is handled.For example, the protrusion for being set to arm side is inserted
Enter into the recess portion for be set to nozzle side engage the protrusion with recess portion, thus carries out the holding of the nozzle.Nozzle arm structure
Become, other than laterally moving, additionally it is possible to be vertically moved to carry out the engaging.For example, remembering in patent document 1,2
It is loaded with such coating film forming apparatus.
Before handling wafer, carries out following position adjustment operation (teaching): determining relative to the recessed of each nozzle
Portion is inserted into the position (insertion position) of protrusion, and the position is stored to the control unit for being set to device.Moreover, carrying out position
Adjustment operation postbrachium is set when receiving nozzle to handle wafer, after the position of adjustment arm horizontally, declines arm
To make protrusion be moved to determined insertion position.For example, making arm movement manually by operator sometimes to adjust above-mentioned insert
Enter position.
In addition, it is necessary to inhibit the swing of the nozzle, when nozzle is kept by arm to handle to the specified position ejection of wafer
Liquid is accurately handled.It is when above-mentioned protrusion being inserted into recess portion therefore, it is necessary to reduce, be formed between protrusion and recess portion
Space.But also it needs to set above-mentioned insertion position in a manner of preventing from generating friction when protrusion is inserted into recess portion.Tool
It says to body, seeks to set insertion position in a manner of forming space around the side wall of the protrusion when protrusion is inserted into recess portion
It sets.According to such situation, the range appropriate that can be set as insertion position is very small.
Thus, when carrying out position adjustment operation with feeling based on the vision of operator, when resulting in the need for long operation
Between.In addition, also with following worry: the Adjustment precision between operator generates deviation, thus generates the bad of wafer, so that by
The decline of product quality made of wafer.Also, device perseveration and to each portion's applied force of device, vibration, thus sometimes to
Position when recess portion is inserted into protrusion changes at any time, needs to repeat above-mentioned position adjustment operation, therefore operate negative
Load is big.The method for solving such problems is not shown in above-mentioned patent document 1,2.
Patent document 1: Japanese Unexamined Patent Publication 2002-198304 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2012-23071 bulletin
Summary of the invention
Problems to be solved by the invention
The present invention is completed based on such situation, and its purpose is to provide a kind of following technologies: about making to carry out
The holding section of the nozzle of liquid processing engages to transport the liquid processing device of nozzle, Neng Gourong with the engaged part of nozzle conveying body
Set easily and accurately the position for being used to form the engaged part of engaging.
The solution to the problem
Liquid processing device of the invention is characterized in that having: nozzle, has the first holding section, and to described
The substrate that board holder is kept sprays treatment fluid to be handled；The standby region of nozzle uses the nozzle in the nozzle
Standby region carries out standby；Nozzle transports body, has engaged part, is formed between the engaged part and first holding section
To keep loading and unloading freely the nozzle, the nozzle conveying body carries out lifting moving and transverse shifting for first engaging, with
The nozzle transports the nozzle between the processing position on standby region and the substrate；Image pickup part, shooting difference position
Image data is obtained in the engaged part of the first height and the second height, to detect engaged part difference position respectively
The first position and the second position of the engaged part horizontally when first height and second height, alternatively,
The image pickup part is set to nozzle conveying body and for being located at the first height and second high in the engaged part
Shooting, which is set to, when spending carries out the object of the standby nozzle with standby region in the nozzle to obtain image data；It is high
Testing agency is spent, to detect the third height for being used to form the engaged part of first engaging；And control unit,
It finds out the third place being used to form in the transverse direction of first engaging based on described image data and the third height, and
And output control signal is to form engaging in the third height and the third place.
The teaching method of liquid processing device of the invention is characterized in that the liquid processing device has: nozzle has
First holding section, and treatment fluid is sprayed to the substrate kept by the board holder to be handled；The standby area of nozzle
Domain carries out the nozzle with standby region in the nozzle standby；Nozzle transports body, has engaged part, described engaged
It forms first between portion and first holding section to engage to keep loading and unloading freely the nozzle, the nozzle conveying body carries out
Lifting moving and transverse shifting, with the nozzle between the processing position on standby region and the substrate conveying described in
Nozzle；And control unit, output control signal are described in the teaching method to carry out the processing to the substrate
Liquid processing device detects the position to form the engaged part of first engaging and the position is stored in the control unit, described
Teaching method includes following process: being shot using the image pickup part for being set to the liquid processing device and is located at the first height and the
The engaged part of two height obtains image data, to detect the engaged part is respectively located at the first height and
The first position and the second position of the engaged part horizontally when two height, alternatively, being located in the engaged part
When the first height and the second height using the image pickup part shooting for being set to nozzle conveying body be set to the nozzle with to
Machine region carries out the object of the standby nozzle to obtain image data；Detection is used to form the described of first engaging
The third height of engaged part；And it is found out based on described image data and the third height and is used to form first engaging
Engaged part the third place horizontally, and the third place is stored in the control unit.
The effect of invention
According to the present invention, the engaged part of the nozzle conveying body of different height is located at using image pickup part shooting, alternatively, sharp
Image data is obtained with the image pickup part of nozzle conveying body is set to from the object of different height shooting nozzles.Device is constituted
For that can engage based on the image data and by what height detection mechanism detected for being formed between the holding section of nozzle
The height of above-mentioned engaged part finds out the position in the transverse direction for being used to form engaging.Thus, it is possible to which easily and securely setting is used
In the position for the engaged part for forming engaging.
Detailed description of the invention
Fig. 1 is the perspective view of resist apparatus for coating involved in first embodiment of the invention.
Fig. 2 is the top view of the resist apparatus for coating.
Fig. 3 is the longitudinal cross-sectional side view of the resist apparatus for coating.
Fig. 4 is the vertical profile side for indicating the vertical projections of recess portion and nozzle carrying arm of the nozzle of the resist apparatus for coating
View.
Fig. 5 is the perspective view of the carrying arm and the nozzle.
Fig. 6 is the sketch structure figure of the resist apparatus for coating.
Fig. 7 is the carrying arm for the state for being installed with jig respectively and the perspective view of the nozzle.
Fig. 8 is the perspective view of the jig with video camera.
Fig. 9 is the bottom view of the jig with video camera.
Figure 10 is the perspective view of the nozzle and the jig with camera shooting target.
Figure 11 is the longitudinal cross-sectional side view of the jig of the band camera shooting target.
Figure 12 is the top view of the jig of the band camera shooting target.
Figure 13 is the structure chart for being set to the control unit of the resist apparatus for coating.
Figure 14 is the explanatory diagram for indicating the process of the position adjustment operation carried out by the resist apparatus for coating.
Figure 15 is the explanatory diagram indicated in the image data obtain when the position adjustment operation.
Figure 16 is the explanatory diagram indicated in the image data obtain when the position adjustment operation.
Figure 17 has been expressed as determining insertion position and the explanatory diagram of the positional relationship of each coordinate that finds out.
Figure 18 is the side view for indicating the vertical projections of recess portion and nozzle carrying arm of nozzle.
Figure 19 is the longitudinal cross-sectional side view for indicating the variation of the jig with camera shooting target.
Figure 20 is the longitudinal cross-sectional side view for indicating the variation of the jig with camera shooting target.
Figure 21 is to be set to the nozzle of resist apparatus for coating and nozzle involved in second embodiment of the present invention to remove
Send the perspective view of arm.
Figure 22 is the structure chart for being set to the control unit of resist apparatus for coating of the second embodiment.
Figure 23 is the explanatory diagram of an example for the processing for indicating that the image about acquisition carries out.
Figure 24 is the flow chart for the processing that the resist apparatus for coating as involved in second embodiment carries out.
Figure 25 is the perspective view for indicating the other structures example of nozzle and nozzle carrying arm.
Figure 26 is the top view for indicating other examples of camera shooting target.
Figure 27 is the perspective view for indicating another other structures example of nozzle and nozzle carrying arm.
Figure 28 is the top view for indicating the other configurations example of video camera.
Description of symbols
W: wafer W；1,8: resist apparatus for coating；10,80: control unit；12: rotary chuck；21A~21D: nozzle；24:
Vertical recess；3: video camera mobile mechanism；33: nozzle carrying arm；34: cylinder；39: touch sensor；4: with video camera
Jig；43: video camera；5: the jig with camera shooting target.
Specific embodiment
(first embodiment)
Illustrate the work using liquid processing device of the invention referring to Fig. 1 as perspective view and Fig. 2 as top view
For the resist apparatus for coating 1 of first embodiment.Resist apparatus for coating 1 has two cups 11, and two cups 11 are stored respectively
It wafer W and is handled, two cups 11 are set as being arranged in the horizontal direction.Fig. 3 shows the longitudinal cross-sectional side view of cup 11.It is set in cup 11
It is equipped with the rotary chuck 12 as board holder, the back side central portion which adsorbs wafer W protects wafer W
It holds as level.
13 be rotating mechanism in figure, makes the rotation of rotary chuck 12 to make the wafer W kept by the rotary chuck 12 around vertical
Axis rotation.Make the diluent and resist direction of the central part that wafer W is supplied to from aftermentioned nozzle by the rotation of wafer W
The peripheral part of wafer W is stretched, Lai Jinhang rotary coating.Above-mentioned diluent is to carry out for improving resist for crystalline substance
The treatment fluid of the wetability of circle W prewetted.14 is for the exhaust pipes being exhausted in cup 11 in figure, in figure 15 for for from
The leakage fluid dram of removal relief liquor in cup 11.In figure 16 for in wafer W (not shown) transport mechanism and rotary chuck 12 it
Between join wafer W lifter pin.
When the orientation of two cups 11 is set as left and right directions, the rear in the center on the left and right directions of each cup 11
Side is provided with the turntable 17 rotated freely around vertical axis.Be provided on turntable 17 for load nozzle 21A~21D to
Board 18, nozzle 21A~21D this wait for carrying out on board 18 it is standby until being used as stopping.Constitute spray like this to board 18
The standby region of mouth, and the standby region of image pickup part is constituted as described later.
Each nozzle 21A~21C sprays different types of resist to wafer W respectively, and nozzle 21D is supplied to wafer W to be diluted
Agent.A nozzle in this four nozzle 21A~21D is kept using aftermentioned nozzle carrying arm and the nozzle is transported to wafer
Processing position on the central part of W supplies diluent or resist from the nozzle to wafer W, thus to wafer W at
Reason.In addition, as the nozzle for supplying resist, such as the nozzle of the more than three quantity of actual setting, but be set as herein
Three are provided only with to be illustrated.
Each nozzle 21A~21D is configured to mutually the same, typically illustrates nozzle 21A shown in Fig. 3.In Fig. 3, phase
For wafer W and cup 11, nozzle 21A is shown with the size bigger than actual size.Nozzle 21A has: nozzle body 22 makes to locate
Reason liquid circulates in the nozzle body 22 and the nozzle body 22 is to spraying the treatment fluid below vertical；Plate by conveying body
23, it is set to the upper side of nozzle body 22；And circular vertical recess 24, in the upper side court by conveying body 23
It is open upwards.In the side wall for the vertical recess 24 for constituting the first holding section, the circumferential direction of vertical recess 24 is provided with multiple sides
Square recess portion 25.In addition, 26 being the piping for supplying resist or diluent to each nozzle 21A~21D in figure.
Rear side on above-mentioned turntable 17 and to board 18 is provided with edge and is carrying out standby nozzle to board 18
The pillar 31 that the orientation of 21A~21D horizontally moves linearly.It is provided in pillar 31 and is carried out vertically along the pillar 31
Mobile lifting unit 32.The lifting unit 32 is provided with what the edge direction orthogonal with the moving direction of pillar 31 moved linearly
Nozzle carrying arm 33.It is provided in the front end of the nozzle carrying arm 33 as nozzle conveying body outstanding as circle downward
The cylinder 34 of the protrusion of shape.As shown in figure 3, cylinder 34 and N2The feed mechanism 35 and exhaust gear 36 of (nitrogen) gas connect.When
By from N2The N that gas supply mechanism 35 supplies2Gas make the flow path 37 being formed in cylinder 34 pressurize when, side protrusion 38 from
The side of cylinder 34 is prominent.The circumferential direction of cylinder 34 is provided with multiple side protrusions 38.Moreover, when right using exhaust gear 36
When flow path 37 is exhausted, side protrusion 38 submerges the side of cylinder 34.
Fig. 4 is the cross-sectional plan view of the cylinder 34 of nozzle carrying arm 33 and the vertical recess 24 of nozzle 21A~21D.Such as this
Shown in Fig. 4, the diameter L2 for constituting vertical recess 24 of the diameter L1 of the cylinder 34 of engaged part than nozzle 21A is slightly smaller, diameter L1
And the difference of the size of diameter L2 is, for example, 0.5mm.By forming cylinder 34 and vertical recess 24 like this, cylinder 34 can be inserted
Enter vertical recess 24.
Moreover, side protrusion 38 is prominent from cylinder 34 and enters in the state that cylinder 34 is inserted into vertical recess 24
Thus side recess portion 25 shown in Fig. 3 becomes the state that cylinder 34 is mutually clamped with vertical recess 24.Fig. 3, Fig. 4 are shown as this
Sample forms the state of engaging.In the state of foring engaging like this, nozzle carrying arm 33 be able to maintain each nozzle 21A~
21D, and to transport each nozzle 21A~21D between board 18 and the top for the wafer W being stored in each cup 11.In Fig. 1
In, as an example, showing nozzle carrying arm 33 remains the state of nozzle 21B.When side protrusion 38 is retracted from side recess portion 25
When, the engaging between cylinder 34 and vertical recess 24 releases.
When forming above-mentioned engaging to handle wafer W, in make that cylinder 34 is located in nozzle 21A~21D one
After the top of the vertical recess 24 of a nozzle, make the decline of nozzle carrying arm 33 that cylinder 34 be made to be inserted into vertical recess 24.For example,
When safeguarding the resist apparatus for coating 1, the position (being set as insertion position) of the cylinder 34 after being inserted into like this is carried out
It is stored in the position adjustment operation for being set to the memory of the aftermentioned control unit 10 as computer of resist apparatus for coating 1
(teaching).Position adjustment operation is carried out respectively to each nozzle 21A~21D.Carry out position adjustment operation after to wafer W into
When row processing, the output control signal of control unit 10 adjusts the insertion position stored in operation in position so that cylinder 34 is moved to,
To carry out the formation of above-mentioned engaging.
Hereinafter, moving direction of the pillar 31 illustrated in fig. 1 on turntable 17 is recorded as X-direction, by nozzle
The moving direction of carrying arm 33 is recorded as Y-direction, and short transverse is recorded as Z-direction.All directions X, Y, Z are orthogonal.Thus,
The position of above-mentioned cylinder 34 can be indicated with the three-dimensional system of coordinate of XYZ.Therefore, in order to make nozzle carrying arm 33 receive nozzle
21A~21D and to vertical recess 24 be inserted into cylinder 34 when, make the cylinder 34 so that X-coordinate, Y-coordinate respectively become stored X
Coordinate, Y-coordinate mode moved, later by make Z coordinate become stored Z coordinate in a manner of moved.This is inserted
The coordinate for entering the center of the lower surface of the cylinder 34 at position is set as P3 (X3, Y3, Z3).X3, Y3 are equivalent to the third in transverse direction
Position, Z3 are equivalent to third height.In addition, below, the position of cylinder 34 or the coordinate of cylinder 34 refer under cylinder 34
The position at the center on surface is recorded unless there are special.
In addition, as shown in figure 3, being for example provided with touch sensor 39 in cylinder 34.When the contact at insertion position
When the bottom surface of sensor 39 and vertical recess 24 contacts, detection letter is sent from the touch sensor 39 to aftermentioned control unit 10
Number, thus control unit 10 can obtain above-mentioned Z3.Thus, touch sensor 39 constitutes height detection mechanism.
In the first embodiment, when carrying out above-mentioned position adjustment operation, jig 4 and band with video camera are used
Image the jig 5 of target.Jig 4 with video camera is configured to detachable relative to nozzle carrying arm 33, according to from control
The control signal in portion 10 loads and unloads the jig 4 with video camera.The jig 4 with video camera is provided with to board 18 above-mentioned
Standby region 41.Jig 5 with camera shooting target is configured to detachable relative to nozzle 21A~21D, is carrying out position adjustment
When operation, the jig 5 of band camera shooting target is installed in nozzle 21A~21D by the user of device.Fig. 6 is to indicate to be provided with to take the photograph
The block diagram of the summary of the resist apparatus for coating 1 of the jig 4 of camera and the jig 5 with camera shooting target.In Fig. 6, on carrying out
The pillar 31, lifting unit 32, nozzle carrying arm 33 for stating each linear movement are expressed as arm mobile mechanism 3.
Pillar 31, lifting unit 32, nozzle carrying arm 33 have the motor for moving linearly respectively, and are provided with horse
Up to driver 27, which sends movement of the signal can control each motor.Moreover, from each motor is set to
Encoder exports pulse (encoder values) to control unit 10.Specifically, from the motor for laterally moving pillar 31 to control
Portion 10 exports corresponding with the position of pillar 31 horizontally encoder values, from make the motor of the lifting of lifting unit 32 to control unit 10
Corresponding with the position of lifting unit 32 in the up-down direction encoder values are exported, from moving nozzle carrying arm 33 along the longitudinal direction
Motor export corresponding with the front-rear direction of nozzle carrying arm 33 encoder values to control unit 10.Thus, it is possible to from each horse
The encoder values of the encoder output reached indicate above-mentioned coordinate P3, therefore the coordinate P3 for setting above-mentioned position adjustment operation is also
Determine encoder values when being inserted into cylinder 34 to vertical recess 24.In addition, motor driver is omitted in each figure other than Fig. 6
27 diagram.
Fig. 7 shows the nozzle carrying arm 33 for being installed with the jig with video camera 4 and is installed with the jig 5 with camera shooting target
Nozzle 21A.Referring to the jig 4 of oolemma video camera for Fig. 8 as upper surface side perspective view and Fig. 9 as bottom view.Band
The jig 4 of video camera have in the same manner as nozzle 21A~21D plate by conveying body 23, tool is formed with by conveying body 23 at this
The vertical recess 24 of standby side recess portion 25.Thus, it is possible in the vertical recess for the jig 4 with video camera for constituting the second holding section
It is formed and is engaged between 24 and the cylinder 34 of nozzle carrying arm 33, protected the jig 4 with video camera by forming engaging like this
It is held in nozzle carrying arm 33.Moreover, the lower side by conveying body 23 in the jig 4 with video camera is provided with video camera maintaining part
42, it is provided in the video camera maintaining part 42 for shooting the video camera 43 as image pickup part below vertical.
Then, oolemma images mesh for the top view of 0 perspective view, the longitudinal cross-sectional side view of Figure 11 and Figure 12 referring to Fig.1
Target jig 5.Jig 5 with camera shooting target is formed as circular cup-shaped, has circular recess portion 51.Band camera shooting target is controlled
Tool 5 is installed on each nozzle in the mode being embedded in the vertical recess 24 of nozzle 21A~21D, is configured to vertical with this recessed
Portion 24 is chimeric.
Central part in the bottom surface of above-mentioned recess portion 51 is provided with circular camera shooting target 52.In addition, opening in recess portion 51
Peristoma portion is provided with cricoid camera shooting target 53 along the open edge.Thus, camera shooting target 52,53 is arranged on different
Height.Camera shooting target 52,53 as object is the camera shooting object of video camera 43, to focus on the camera shooting target respectively
52,53 mode is shot to obtain image data.It is above-mentioned to determine based on the image data got as described later
X3, Y3 in the coordinate P3 (X3, Y3, Z3) of insertion position.For example, camera shooting target 52,53 is configured to the wall with recess portion 51
Whether the different color of the color in face, focused so that control unit 10 can readily recognize.
Then, 3 illustrate control unit 10 referring to Fig.1.61 be bus in figure.Bus 61 and the CPU for carrying out various operations
62, program storage unit 63, memory 64,65 and operation portion 66 connect.In addition, the touch sensor 39 of nozzle carrying arm 33
It is also connect with bus 61 with the video camera 43 of the jig 4 with video camera, touch sensor 39 is as described above to control unit 10
The detection signal of cylinder 34 is sent to be able to carry out the detection of the Z3 of coordinate P3, and the jig 4 with video camera is to control unit 10
Send image data.
The program 6 for being incorporated into order (step group) is preserved, in program storage unit 63 to carry out the processing for wafer W
Operation is adjusted with position.Each portion output control signal by program 67 from from control unit 10 to resist apparatus for coating 1.As a result,
Control the movement in each portion of resist apparatus for coating 1.In addition, the program 67 carries out conduct based on image data as described later
The calculating of the coordinate P3 of insertion position.Program 67 is stored such as to be accommodated in hard disk, CD, magneto-optic disk, storage card and DVD
State in medium is stored in program storage unit 63.
Each coordinate P3 that operation stores nozzle 21A~21D in memory 64 is adjusted by position.Thus, to wafer W
When being handled, nozzle carrying arm 33 receives nozzle 21A~21D based on the data stored in the memory 64.It can update
The data of the memory 64.In addition, storing the image data got for coordinates computed P3 in above-mentioned memory 65
And the data such as aftermentioned coordinate P1, P2 obtained for coordinates computed P3.Operation portion 66 includes keyboard, touch panel etc.,
The user of device operates as defined in carrying out to make position adjust the processing that operation starts progress, instruction wafer W.
In addition, being illustrated to the summary of the position adjustment operation carried out by the resist apparatus for coating 1.In the position
It adjusts in operation, obtains image data using the jig 4 with video camera, determine nozzle 21A~21D's based on the image data
The position of vertical recess 24.But video camera 43 is located at the top of vertical recess 24 when shooting, so that focus focusing is in vertical
Recess portion 24.That is, the height of the cylinder 34 of the nozzle carrying arm 33 when shooting vertical recess 24 and the circle at insertion position
The height of column 34 is different.
Moreover, because the reasons such as error of the assembly precision of device, improve the precision of nozzle carrying arm 33 vertically moved
It is conditional.Although vertically being gone up and down that is, being configured to nozzle carrying arm 33 as has been described, actually have
When be direction relative to vertical shallow decline.In addition, there are deflections for video camera 43 sometimes.The deflection is due to assembling camera shooting member
The imaging surface for the video camera 43 that the reasons such as the structure member of the video cameras such as part, lens 43 generate and the vertical recess as subject
The deviation of 24 depth of parallelism.In addition, there are the deformations of photographing element in video camera 43 sometimes.That is, not only nozzle sometimes
Carrying arm 33 has error compared to design, and video camera 43 also has error compared to design.
Thus, there are following worries: even if from a height and position of the top of vertical recess 24 using video camera 43 into
Row is imaged to obtain the image data of vertical recess 24 and be determined X-coordinate, the Y-coordinate of insertion position based on the image data,
The insertion position is also not the position appropriate illustrated in the project of background technique, by cylinder 34 be inserted into vertical recess 24 when that
This rubs and generates particle.In the present embodiment, position adjustment operation is carried out to eliminate such nozzle carrying arm 33, camera shooting
The influence of error in the design of machine 43.
Then, the process of position adjustment operation is illustrated referring to the Figure 14 for the movement for showing nozzle carrying arm 33.Firstly, dress
Jig 5 with camera shooting target is installed on each nozzle 21A~21D by the user set, when operator carries out for making control unit 10
When the predetermined operation that position adjustment operation starts, nozzle carrying arm 33 is carried out on the standby region 41 to board 18 being moved to
Decline the vertical recess 24 to make cylinder 34 be inserted into the jig 4 with video camera after standby 4 top of jig with video camera.So
Afterwards, side protrusion 38 protrudes into the side recess portion 25 for being formed in vertical recess 24 from cylinder 34, nozzle carrying arm 33 with
Engaging is formed between jig 4 with video camera, to make nozzle carrying arm 33 keep the jig 4 with video camera.It sets in advance like this
Determine the position that nozzle carrying arm 33 receives the jig 4 with video camera.In addition, in memory 64, such as be stored with about each spray
The coordinate P3 of mouth 21A~21D is as initial value.
Then, make nozzle carrying arm 33 so that cylinder 34 respectively becomes in memory 64 in the position in X-direction, Y-direction
The mode of pre-stored X3, Y3 are moved to above nozzle 21A, by video camera 43 in the way of focusing on camera shooting target 52 into
Row shooting is to obtain image data ((a) of Figure 14).The image 54 got as described above is shown on the upside of Figure 15.In addition,
Since focus is not focused in camera shooting target 53, it is fuzzy for imaging target 53 in image 54.
Nozzle carrying arm 33 is set to carry out X-direction, the movement in Y-direction, so that the camera shooting target 52 for including in the image 54
Center it is consistent with the center Q1 of image 54.In addition, being designed as the center of the imaging area of video camera 43, i.e. image 54 herein
Center is aligned with the center of the lower surface of cylinder 34.Shown on the downside of Figure 15 carried out X-direction like this, the tune in Y-direction
The image 54 got in the state of whole.After being adjusted like this, the coordinate P1 (X1, Y1, Z1) of cylinder 34 is obtained.Such as
It is upper described, X-coordinate, Y-coordinate, Z coordinate can be expressed as to the encoder values exported from each motor, therefore control unit 10 for example can
It is enough to be retrieved as coordinate P1 (X1, Y1, Z1) (step S1) based on each encoder values made when the positioning of nozzle carrying arm 33 like this.
It is further possible to similarly obtain the Z3 of aftermentioned coordinate P2 and coordinate P3 based on encoder values.The X1 of above-mentioned coordinate P1,
Y1 is equivalent to the first position in transverse direction, and Z1 is equivalent to the first height.
Later, it changes the position in the Z-direction in all directions XYZ only to focus on camera shooting target 53, and obtains image
Data ((b) of Figure 14).The image 55 got like this is shown on the upside of Figure 16.Further, since focus is not focused in camera shooting
Target 52, therefore it is fuzzy for imaging target 52 in image 55.Nozzle carrying arm 33 is set to carry out X-direction, the shifting in Y-direction
It is dynamic, so that the center for the camera shooting target 53 for including in the image 55 is consistent with the center Q2 of image 55.It is shown on the downside of Figure 16
The image 55 got in the state of X-direction, the adjustment in Y-direction has been carried out like this.After being adjusted like this, obtain
Take the coordinate P2 (X2, Y2, Z2) (step S2) of cylinder 34.X2, Y2 of coordinate P2 is equivalent to the second position in transverse direction, and Z2 is suitable
In the second height.
Later, above-mentioned step S1, S2 is also repeatedly carried out about nozzle 21B~nozzle 21D, to obtain coordinate P1, P2.
Later, nozzle carrying arm 33 is moved such that the jig 4 with video camera is placed in standby region 41, the side protrusion of cylinder 34
38 withdraw from side recess portion 25 and release the engaging between nozzle carrying arm 33 and the jig 4 with video camera, nozzle carrying arm
33 rise, and cylinder 34 is exited from vertical recess 24.Later, by the user of device by the jig 5 with camera shooting target from each nozzle 21A
~21D is unloaded.
Then, nozzle carrying arm 33 declines after being moved to above nozzle 21A to make cylinder 34 be inserted into vertical recess 24,
When the bottom of the front end of cylinder 34 and vertical recess 24 contacts, detection signal is sent from touch sensor 39.Control unit 10
The Z3 (step S3) of coordinate P3 is obtained based on encoder values when sending the detection signal.In addition, hereafter carrying out background technique
Project in the setting for being suitably inserting position P3 that illustrates, in step S3, as long as cylinder 34 can be inserted into vertical recessed
Portion 24.
Figure 17 is hereinafter also referred to be illustrated.It can by the coordinate P1 got as described above and coordinate P2 and only
The coordinate P3 for getting Z coordinate is regarded as being located on straight line as shown in Figure 17.Thus, relationship represented by following formulas 1 at
It is vertical, X3, Y3 are calculated according to the formula 1, are determined the coordinate P3 as insertion position and are updated storage the data (step S4) of device 64.
(Z3-Z1): (Z1-Z2)=(X3-X1): (X1-X2)=(Y3-Y1): (Y1-Y2) formula 1
Wafer W is handled after position described above adjusts operation.Illustrate the processing of wafer W: making nozzle
Carrying arm 33 is located at top for spraying the nozzle 21D of diluent, makes cylinder 34 position in the X direction, in the Y direction
Position, which becomes, adjusts X3, Y3 that operation determines nozzle 21D by position respectively.The position of cylinder 34 in z-direction at this time
It is set to the position that specified amount is higher by than Z3.
Later, the decline of nozzle carrying arm 33, the position namely in Z-direction change, and cylinder 34 is inserted into vertical recessed
Portion 24, the position in Z-direction become Z3.That is, cylinder 34, which is moved to, adjusts the coordinate P3 that operation determines by position
(X3, Y3, Z3).Then, it is formed and is engaged between cylinder 34 and vertical recess 24, nozzle carrying arm 33 keeps nozzle 21D, and will
Nozzle 21D is transported to above the wafer W in cup 11.Then, diluent is sprayed from nozzle 21D to the central part of wafer W, passed through
The rotation of wafer W carries out rotary coating.That is, diluent is made to stretch in the whole surface of wafer W.
Then, nozzle carrying arm 33 is moved such that nozzle 21D is placed in board 18, makes nozzle carrying arm 33 and spray
Engaging between mouth 21D releases.Then, nozzle carrying arm 33 is located at one in nozzle 21A~21C for spraying resist
Above nozzle, such as nozzle 21A.The position of cylinder 34 in the X direction, position in the Y direction respectively become through position tune
X3, Y3 that whole operation determines nozzle 21A.The position in Z-direction at this time is the position that specified amount is higher by than Z3.
Later, the decline of nozzle carrying arm 33, the position namely in Z-direction change, and cylinder 34 is inserted into vertical recessed
Portion 24, the position in Z-direction become Z3.That is, cylinder 34, which is moved to, adjusts the coordinate P3 that operation determines by position
(X3, Y3, Z3).Then, it being formed and is engaged between cylinder 34 and vertical recess 24, nozzle carrying arm 33 keeps nozzle 21A, and
Nozzle 21A is transported to above the wafer W in cup 11.Then, resist is sprayed from nozzle 21A to the central part of wafer W, led to
The rotation of wafer W is crossed to carry out rotary coating.That is, it is against corrosion to be formed so that resist is stretched in the whole surface of wafer W
Agent film.Then, nozzle carrying arm 33 is moved such that nozzle 21A is placed in board 18, makes nozzle carrying arm 33 and nozzle
Engaging between 21A releases.
According to the resist apparatus for coating 1, the configuration of jig 4 with video camera for being installed in nozzle carrying arm 33 is being focused
In the height of the camera shooting target 52,53 of the jig 5 with camera shooting target of the installation of vertical recess 24 in nozzle 21A~21D, to obtain
The image data 54,55 for taking these camera shooting targets 52,53 of shooting to obtain.Moreover, based on image data 54,55 and to vertical recess
The Z coordinate of the insertion position (coordinate P3) of 24 insertion cylinders 34, to determine X-coordinate, the Y-coordinate of insertion position.Thus, prevent by
The side wall of cylinder 34 and vertical recess 24 contact with each other and justify being inserted into vertical recess 24 as illustrated by (a) of Figure 18
Such position that rubs is generated when column 34 is set as insertion position.Moreover, can be by the circle as illustrated by (b) of Figure 18
The position that the side wall of column 34 separates on complete cycle with the side wall of vertical recess 24 is set as insertion position.In addition, without by use
Family is felt to determine insertion position, therefore is able to suppress the deviation of the precision of each position adjustment operation and can be realized position
Set the shortening of the activity duration of adjustment operation.
In addition, in the above description, if being the imaging area of video camera 43, the i.e. center of image 54,55 and circle
The center of column 34 is in alignment with each other to be illustrated in the x-direction and the z-direction, but their center can also deviate.
The center of the imaging area of video camera 43 and the center of cylinder 34 are obtained in advance in X-direction, all directions of Y-direction
Bias.Moreover, by the side X exported as described above when imaging target 52,53 and being located at the center of image 54,55
The bias is added to the encoder values of, Y-direction, X-coordinate, the Y-coordinate of cylinder 34 can be obtained.In addition, being not limited to make above-mentioned
Step S1~S3 carried out by above-mentioned sequence, a certain step therein can also be set as first carry out or second into
Row.In addition, in each of the above-described embodiment, being configured to volume when detection images target 52,53 respective centers are located at the center of image
Code device value, but device is also configured to, and detection camera shooting target 52,53 is located at volume when the excentral specified position of image
Code device value.
Alternatively, it is also possible to be set as only being arranged camera shooting target 52,53 in either, for example camera shooting target 52 taken the photograph as band
As the structure of the jig 5 of target.In this case, the video camera 43 as the jig 4 with video camera, such as compared using the depth of field
Deep video camera, or use the video camera with automatic focusing function.Illustrate to use and is provided only with camera shooting target 52 like this
With camera shooting target jig 5 carry out position adjust operation, firstly, using configuration defined height and position band video camera
Jig 4 shot, the position of nozzle carrying arm 33 in the x-direction and the z-direction is adjusted based on obtained image data, come
Obtain above-mentioned coordinate P1.That is, carrying out above-mentioned steps S1 illustrated in fig. 14.
Later, the height of the jig 4 with video camera change specified amount is shot, based on obtained image data come
Adjust the position of nozzle carrying arm 33 in the x-direction and the z-direction.It is adjusted about the position, in addition to using camera shooting 52 generation of target
Other than camera shooting target 53, it is carried out similarly position adjustment with step S2 illustrated by Figure 14, to obtain above-mentioned coordinate P2.
In the case where constituent apparatus like this, it is not limited to from the mutually different two position acquisition image datas of height, it can also be from
Highly mutually different three or more position acquisition image datas, according to by so as to image target 52 in each image data
Center is located at the X-coordinate, Y-coordinate, Z coordinate that the mode at the center of image aligned to determine coordinate P3.
But the band camera shooting mesh by being respectively arranged at different height using target 52,53 will be imaged as described above
Target jig 5 is able to use the depth of field than shallower video camera 43, therefore has that can reduce the manufacturing cost of device this is excellent
Point.Figure 19 shows variation, i.e. the controlling with camera shooting target for having the jig with camera shooting target of camera shooting target 52,53 like this
Tool 56.As the jig 56 of band camera shooting target, camera shooting target 52 can be embedded in the bottom surface of recess portion 51.In addition, camera shooting mesh
Mark 53 can be embedded in the opening edge of recess portion 51.Figure 20 shows another variation of the jig with camera shooting target, i.e. band camera shooting
The jig 57 of target, as shown in Fig. 20, the jig 57 with camera shooting target can be formed as upward from the opening edge of recess portion 51
Side is prominent.
In addition, be not limited to setting touch sensor 39 to obtain the Z3 of coordinate P3 (X3, Y3, Z3), such as can also be
Laser displacement gauge is arranged in cylinder 34, obtained by measuring the distance between bottom surface of vertical recess 24 coordinate P3 (X3, Y3,
Z3 Z3).In addition it is also possible in advance in the bottom surface of the vertical recess 24 of nozzle 21A~21D setting camera shooting target, from taking the photograph band
The Z coordinate of cylinder 34 when the video camera 43 of the jig 4 of camera focuses on camera shooting target subtracts lens and the camera shooting of video camera 43
Thus the height difference H 2 of the lower surface of the lens of the distance between target H1 and known video camera 43 and cylinder 34 is calculated and is sat
Mark the Z3 of P3.If distance H1 and height difference H 2 are got in advance.Alternatively, it is also possible to be, the above-mentioned jig 4 with video camera
It is not provided in resist apparatus for coating 1, but is installed as needed by operator to carry out already described position and adjust operation.
(second embodiment)
Then, illustrated using centered on the difference between resist apparatus for coating 1 as the second embodiment party of the invention
The resist apparatus for coating 8 of formula.Figure 21 shows the nozzle carrying arm 33 of resist apparatus for coating 8, by video camera 43 can clap
The mode for taking the photograph vertical lower is set to the cylinder 34 of the nozzle carrying arm 33.Moreover, in the vertical recess of each nozzle 21A~21D
The central part of 24 bottom surface is embedded with camera shooting target 52, and the opening edge of vertical recess 24 is provided with camera shooting target 53.
It is but sharp without using the jig 4 with video camera and the jig 5 with camera shooting target in the resist apparatus for coating 8
Camera shooting target 52,53 is shot with the video camera 43 for being set to said nozzle carrying arm 33, thus carries out step illustrated in fig. 14
Rapid S1~S4 carrys out enforcing location adjustment operation.By be set as like this camera shooting target 52,53 be set to nozzle 21A~21D and
The structure of video camera 43 is set up in nozzle carrying arm 33, the above-mentioned step S1~S4 of ground automatic implementation can be participated in without artificial.
In addition, receiving nozzle in nozzle carrying arm 33 after carrying out position adjustment operation in resist apparatus for coating 8
21A~21D when handling wafer W, is taken the photograph when cylinder 34 is located at coordinate (X3, Y3, Z1) using the video camera 43
As obtaining image data.As shown in Figure 15, Z1 is the height that video camera 43 focuses on camera shooting target 52, like this
It include the camera shooting target 52 in the image data of acquisition.Figure 22 shows the control unit 80 for being set to the resist apparatus for coating 8.Control
Portion 80 processed has storage unit 71, and the storage unit 71, which is directed to, is stored in wafer W's by each nozzle that nozzle carrying arm 33 receives
The image data (be set as when processing image data to be illustrated) obtained in processing.
In addition, also being deposited other than storing coordinate P3 in the memory 64 for being set to control unit 80 for each nozzle
Above-mentioned Z1 is stored up, to image to above-mentioned camera shooting target 52.In addition, control unit 80 has alarm output section 72.The alarm
Output section 72 includes that monitor, loudspeaker are shown, sound when being determined as that device has occurred abnormal as described later with picture
Mode export the meaning.
The program 67 for being set to control unit 80 determines a need for carrying out again based on image data when above-mentioned processing
Position adjusts operation.The image obtained according to image data when above-mentioned processing is illustrated as image 44 when processing specific
An example: it camera shooting target 52 when detecting the processing newly got about a nozzle in image 44 and has just got before this
Displacement L3 between camera shooting target 52 when processing in image 44 (referring to Figure 23).By displacement L3 and defined feasible value
It is compared, when being determined as that displacement L3 is bigger than feasible value, carries out the position illustrated in step S1~S4 again about the nozzle
Set adjustment operation.When being determined as displacement L3 is feasible value or less, operation is adjusted without position.That is, finding out
After coordinate P3, determine whether to find out coordinate again based on by the image data for shooting camera shooting target 52
P3。
In addition, in the case where carrying out position adjustment operation again to obtain coordinate P3, position of the program 67 based on coordinate P3
It is without exception that in-migration determines that resist apparatus for coating 8 has.It indicates specific an example: calculating the coordinate newly got about a nozzle
Displacement L4 between Z3 and the coordinate Z3 just got before this.Thus, when the coordinate Z3 that will newly get is set as (α 1, β
1, γ 1) it when and the coordinate Z3 just got before this being set as (α 2, β 2, γ 2), calculates L4={ (α 1- α 2)2+(β1-β2)2
+(γ1-γ2)2}1/2.Displacement L4 is that correcting value as how many correct is carried out to coordinate Z3.
Such as displacement L4 is just calculated whenever obtaining coordinate Z3, control unit 80 is provided with storage unit 73, the storage
Displacement L4 of the portion 73 for each nozzle storage coordinate P3.That is, the historical record of the displacement L4 of each nozzle is deposited
It is stored in control unit 80, determines whether resist apparatus for coating 8 has occurred exception based on the historical record of displacement L4.Example
Such as, when about nozzle observation displacement L4 three times recently, then it is worth in the displacement L4 newly got bigger
In the case of, alarm is exported to be set as resist apparatus for coating 8, and exception has occurred.Do not have in this way in displacement L4 recently three times
Relationship in the case where, do not export alarm.
Figure 24 shows the process of the movement of the resist apparatus for coating 8, is illustrated also referring to the process.Such as anti-
After losing the just starting of agent apparatus for coating 8, the position adjustment operation of already described step S1~S4 is carried out.Later, as described
Start to handle wafer W, is located at the coordinate (X3, Y3, Z1) about the nozzle setting so that nozzle carrying arm in cylinder 34
In the state that 33 receive nozzle, image when obtaining the processing comprising camera shooting target 52.
For example, the top for a nozzle for being moved to nozzle carrying arm 33 in 24A~24D, with to a nozzle into
Row receives for the second time and more frequently, is changed into the state (step T1) that cylinder 34 is located at coordinate (X3, Y3, Z1), acquisition processing
When image data (step T2).Moreover, as shown in figure 23, calculating figure in the preceding processing once got about a nozzle
As in camera shooting target 52 and this time get processing when image in camera shooting target 52 between displacement L3.Determine the position
Whether shifting amount L3 is feasible value or less (step T3), in the case where being determined as feasible value situation below, declines nozzle carrying arm 33
So that the cylinder 34 is located at coordinate (X3, Y3, Z3), so that nozzle carrying arm 33 is kept nozzle 21A~21D, continue the place of wafer W
It manages (step T4).
When to be determined as displacement L3 in step T3 not be feasible value or less, above-mentioned step is executed about a nozzle
The position adjustment operation illustrated in S1~S4, obtains coordinate P3 (step T5).The seat newly got as calculating as described
The displacement L4 between the P3 and preceding coordinate P3 once got is marked, about the displacement L4 got three times recently, judgement is
The no displacement newly got then L4 bigger (step T6).That is, determining the historical record of the correcting value of coordinate P3
It is whether normal.In the not displacement that newly gets, then L4 is bigger or the times of acquisition of displacement L4 are following twice
In the case where, it is set as that resist apparatus for coating 8 is without exception, step is executed based on the coordinate P3 newly got in step T5 again
T1 later movement.The displacement for being judged to newly getting in step T6 is set as resist in the case that then L4 is bigger
There is abnormal, output alarm, the processing (step T7) that suspension is carried out by resist apparatus for coating 8 in apparatus for coating 8.
According to the resist apparatus for coating 8, effect same as resist apparatus for coating 1 is played.Also, by nozzle
Carrying arm 33 sets up video camera 43, and enforcing location adjustment can be carried out as needed when receiving nozzle 21A~21D as described above
Operation.Thus, it is possible to inhibit the number for carrying out position adjustment operation excessive, the treatment effeciency of the wafer W in specified time limit is improved.
In addition, can be no different according to resist apparatus for coating 8 based on the historical record of the displacement L4 of coordinate P3 come decision maker
Often.Thus, have the advantages that can to prevent to become the processing that wafer W is carried out it is abnormal this.
In the processing for carrying out wafer W in resist apparatus for coating 8, it is not limited to utilize video camera 43 only as described above
Camera shooting target 52 is shot, the structure member of the resist apparatus for coating 8 other than camera shooting target 52 can also be clapped
It takes the photograph, control unit 80 monitors the exception of the resist apparatus for coating 8 based on the image data got.
Specifically, when for example moved in nozzle carrying arm 33 to receive nozzle 21A~21D, shooting piping 26
Obtain image data.Then, control unit 10 can be determined different whether there is or not occurring in the piping 26 based on the image data got
Often vibration, if it is decided that for there are abnormal vibrations, then export above-mentioned alarm.In addition to this, in output control signal so that spray
After mouth carrying arm 33 keeps nozzle 21A~21D, shot using video camera 43 to obtain image data.It is also possible to root
Nozzle 21A~21D is detected according to the image data got like this to fall etc. and nozzle 21A~21D from nozzle carrying arm 33
The related exception of hold mode, above-mentioned alarm is exported in the case where detecting these exceptions.
In addition, being not limited to adjust operation in the position that timing as described above carries out in the resist apparatus for coating 8.Example
Such as, it is set as sending using higher level's computer to the control unit 80 of the resist apparatus for coating 8 and be removed about to resist apparatus for coating 8
The information of the sets of wafers of the wafer W sent.Moreover, being also possible to 80 control device of control unit in resist apparatus for coating 8
The movement in each portion, so as to be transported to resist to next sets of wafers processing terminate from the wafer W of a sets of wafers
Position is carried out in a period of until apparatus for coating 8 adjusts operation.In addition it is also possible to be, whenever right using resist apparatus for coating 8
It provides that the wafer W processing of number adjusts operation with regard to carrying out position, such as is also possible to whenever right using resist apparatus for coating 8
One wafer W, which is handled, adjusts operation with regard to enforcing location.Quilt alternatively, it is also possible to be, in change nozzle 21A~21D
The nozzle that nozzle carrying arm 33 is kept just carries out position adjustment operation.
In addition, the acquisition of the image data about the above-mentioned steps T2 by the process description of Figure 24, be also not necessarily limited to whenever
Nozzle carrying arm 33 keeps nozzle 21A~21D just to carry out the acquisition.Specifically, for example can also be in the beginning to sets of wafers
Wafer W when being handled and keep the acquisition that image data is carried out when nozzle 21A~21D, can also regularly carry out image
The acquisition of data.
In addition, being not limited to be set to vertical recess 24 as camera shooting target.Figure 25 show nozzle 21A upper surface and
The example of rectangular camera shooting target 58 is set from the position that vertical recess 24 rearward separates.In addition, in this embodiment, by video camera
The 43 ratio cylinders 34 being set in nozzle carrying arm 33 in a manner of it can shoot vertical lower lean on the lower surface of base end side.As
The video camera 43, such as the video camera deep using the depth of field can shoot camera shooting target 58 from different height.This
Outside, video camera 43 is shown extremely simplely in the accompanying drawings.
It is also in the case where setting such rectangular camera shooting target 58, when carrying out the adjustment operation of insertion position,
Nozzle carrying arm 33 is moved in the same manner as the case where above-mentioned circular camera shooting target 52 are set, so that camera shooting target 58
Center is located at the center of the image got.Obtaining in advance makes to image when target 58 is located at the center of image like this as volume
Corresponding between the X-coordinate and Y-coordinate and the X-coordinate of cylinder 34 and Y-coordinate that code device value obtains, thus, it is possible to calculate cylinder 34
X-coordinate and Y-coordinate.It is configured to that is, setting control unit 80, can be said based on the encoder values exported to obtain in Figure 15
X2, Y2 of X1, Y1 of bright coordinate P1, coordinate P2 illustrated in fig. 16.
As long as carrying out the static portion in standby nozzle 21A~21D to board 18 in this way, being set to camera shooting target
Position is not limited to be arranged in vertical recess 24.Also, video camera can also be set in cylinder 34 like that as shown in figure 21
43, and video camera 43 is set in nozzle carrying arm 33 as shown in fig. 25.Moreover, as shown in figure 21 like that in vertical recess
Setting camera shooting target 52 in 24, as shown in fig. 25 in the outside of vertical recess 24 setting camera shooting target 58.It is also possible to benefit
It is shot with 43 pairs of camera shooting targets 52,58 of each video camera, such as laterally moves nozzle carrying arm 33 so as to respectively image mesh
Mark 52,58 is located at the center of image, thus obtains X1, Y1 of coordinate P1.That is, being not limited to be based on from a video camera 43
The image data of acquisition carries out the detection of coordinate P3.Also, as camera shooting target, such as can be by the opening edge of vertical recess 24
Portion is set as camera shooting target, to replace that the camera shooting target is arranged in nozzle 21A~nozzle 21D vertical recess 24.That is, can
Vertical recess 24 is itself functioned as camera shooting target.
In the nozzle 21A shown in Figure 25, it is not limited to be arranged the camera shooting target that is square as camera shooting target 58 to make
It, can also be rounded as the camera shooting target 52 of the jig 5 with camera shooting target to image target.It however, it can be, pass through
Rectangular camera shooting target 58 is set, such as when carrying out position adjustment operation, the side of the camera shooting target 58 in detection image is inclined
Whether tiltedly (direction of camera shooting target 58), have occurred exception come detection device based on the testing result.Alternatively, it is also possible to be, structure
As the pillar 31 of bearing nozzles carrying arm 33 is rotated freely around vertical axis, become abnormal in the direction of camera shooting target 58
In the case of, rotate nozzle carrying arm 33 so that the direction is normal, thus elimination is abnormal.
It can also be constituted as shown in (a) of Figure 26 other than already described example as camera shooting target.The Figure 26
(a) shown in camera shooting target 59 be circle in the same manner as camera shooting target 52, but may be than imaging small dotted of target 52.
For example, may be constructed are as follows: so that the video camera for being set to nozzle carrying arm 33 43 is freely changed gradient, to shoot the camera shooting target
59, the camera shooting target 58 of position at the center for being located off image can be made to be moved in image by changing the gradient
The heart.That is, replace making as illustrated in fig. 15 nozzle carrying arm 33 in X direction, Y-direction move, and make video camera
Thus 43 change gradients carry out automatically tracking for the center for making camera shooting target 58 be located at image.Furthermore, it is also possible to according to from arm
The gradients of encoder values and video camera 43 that mobile mechanism 3 exports obtains X1, Y1 of already described coordinate P1, coordinate P2
X2,Y2.In addition, multiple camera shooting mesh can also be arranged as shown in (b) of Figure 26 in order to improve the Adjustment precision of insertion position
Mark 59.
In addition, being not limited to be set to nozzle carrying arm 33, also can be set in nozzle 21A~21D as video camera 43.
It is shown in Figure 27 and video camera 43 is set to the bottom surface of vertical recess 24 and is configured to the example of shooting top.The video camera
43 can shoot the lower surface of cylinder 34 when nozzle carrying arm 33 is located at each height.I.e. it is capable to distinguish in cylinder 34
Image data is obtained in the state of the first height, the second height.Thus, image data is obtained using the video camera 43, is made
Nozzle carrying arm 33, which is moved such that, is located at the center of image at the center of the lower surface of obtained Circle in Digital Images column 34, and obtains
Take coordinate P1 (X1, Y1, Z1).Also it can similarly obtain coordinate P2 (X2, Y2, Z2).That is, even if like this will camera shooting
Machine 43 is set to nozzle 21A~21D, is also able to carry out comparable dynamic with above-mentioned steps S1, S2 that illustrate in first embodiment
Make, and can by the same manner as first embodiment implementation steps S3, S4 come coordinates computed P3.
In the example shown in Figure 28, by video camera 43A, video camera 43B by relative in a manner of fixed to board 18 into
Row setting.Video camera 43A is arranged in such a way that optical axis is aligned with Y-direction, to be able to detect the position of cylinder 34 in the X direction.
Thus, video camera 43A, which is configured that, shoots the nozzle conveying arm 33, the figure of acquisition from nozzle conveying with the left and right directions of arm 33
The transverse direction of picture is consistent with X-direction.Video camera 43B is arranged in such a way that optical axis is aligned with X-direction, to be able to detect cylinder 34 in Y
Position on direction.Thus, video camera 43B is configured that shooting nozzle conveying with the front-rear direction of arm 33 from nozzle conveying uses
The transverse direction of arm 33, the image of acquisition is consistent with Y-direction.
For example, cylinder 34 is made to be located at some height, image is obtained from video camera 43A, 43B, makes nozzle carrying arm 33 preceding
Rear direction, right and left move up so that on the left and right directions at center and image on the left and right directions of each Circle in Digital Images column 34
Center it is consistent, obtain X1, Y1, Z1.The height of arm is changed similarly to be acted, can also obtain X2, Y2, Z2.Thus,
Coordinate P3 can be obtained configuration video camera 43A, 43B like this.In addition, multiple nozzles are with the side arranged in columns along Y-direction
Formula carried out to board 18 it is standby.It therefore, can be to being moved to position corresponding with each nozzle by the way that a video camera 43A is arranged
The cylinder 34 set is shot, and with coordinates computed P3 as described above, therefore a video camera 43A can only be arranged, but can also
To be configured respectively for each nozzle.That is, multiple video camera 43A can be set.Furthermore, it is possible to be directed to each spray
Multiple video camera 43B are arranged in mouth, to shoot to the cylinder 34 for being moved to position corresponding with each nozzle.
The present invention is not limited to already described embodiment, already described embodiment can suitably change or carry out group
It closes.Such as it is not limited to spray resist, diluent as treatment fluid, or supply is used to form the medicine of antireflection film
The structure of liquid, the medical fluid for being used to form insulating film, bonding agent.In addition, in the first embodiment, as the jig with video camera
4 standby region 41 is set to the position that can be joined using nozzle carrying arm 33, therefore is not limited to nozzle
21A~21D to be set as standby region on board 18, dedicated standby area can also be set from the position different to board 18
Domain.Alternatively, it is also possible to constitute are as follows: only one nozzle carried out to board 18 it is standby, nozzle carrying arm 33 not along Y-direction move
It is dynamic, horizontally also only move in X direction.That is, can also apply this hair in the case where only determining the X3 in X3, Y3
It is bright.
Claims (14)
1. a kind of liquid processing device, which is characterized in that have:
Nozzle has the first holding section, and sprays treatment fluid to the substrate kept by board holder to be handled；
The standby region of nozzle carries out the nozzle with standby region in the nozzle standby；
Nozzle transports body, has engaged part, forms first between the engaged part and first holding section and engages to fill
Unload and keep the nozzle freely, nozzle conveying body carries out lifting moving and transverse shifting, with the nozzle with to
The nozzle is transported between processing position on machine region and the substrate；
Image pickup part, shooting are located at the engaged part of the first height and the second height to obtain image data, to divide
The engaged part when engaged part is located at first height and second height is not detected horizontally
First position and the second position, alternatively, the image pickup part is set to the nozzle conveying body and in the engaged part
Shooting, which is set to, when being located at the first height and the second height carries out the standby nozzle with standby region in the nozzle
Object obtain image data；
Height detection mechanism, to detect the third height for being used to form the engaged part of first engaging；And
Control unit is found out based on described image data and the third height and is used to form the described by card of first engaging
The third place of conjunction portion horizontally, and control signal is exported to form engaging in the third height and the third place.
2. liquid processing device according to claim 1, which is characterized in that
The image pickup part is set to the nozzle conveying body and is located at the first height and the second height in nozzle conveying body
When shooting be set to the object for carrying out standby nozzle with standby region in the nozzle.
3. liquid processing device according to claim 2, which is characterized in that
The image pickup part has the second holding section, forms second between second holding section and the engaged part and engages, with
The nozzle conveying body is set to keep loading and unloading freely the image pickup part,
The liquid processing device is provided with the standby region of image pickup part, when nozzle conveying body keeps the nozzle, makes institute
State image pickup part carried out in the image pickup part with standby region it is standby.
4. liquid processing device according to claim 2, which is characterized in that
The image pickup part is set to the nozzle conveying body.
5. liquid processing device according to claim 4, which is characterized in that
The control unit is schemed obtained from the object after finding out the third place based on being shot as the image pickup part
As data, to determine whether to find out the third height and the third place again.
6. liquid processing device according to claim 5, which is characterized in that
The historical record of displacement of the control unit based on the third height and the third place that repeatedly find out, to determine at the liquid
Reason device has without exception.
7. the liquid processing device according to any one of claims 1 to 6, which is characterized in that
First holding section is the recess portion of upper side opening,
The object is set to the recess portion.
8. liquid processing device according to claim 7, which is characterized in that
The object includes the first object object and the second object that mutually different height is arranged in,
To focus on the first object object when the engaged part is located at first height and be located in the engaged part
The mode that second object is focused on when the second height is shot.
9. liquid processing device according to claim 8, which is characterized in that
The first object object and second object are set to jig, which is configured to load and unload certainly in the recess portion
Such as, and when being formed and being engaged between the recess portion and engaged part it is unloaded from the recess portion.
10. liquid processing device according to claim 1, which is characterized in that
The image pickup part shooting is located at the engaged part of the first height and the second height to obtain image data, to divide
First of the engaged part when engaged part is located at the first height and the second height horizontally is not detected
It sets and the second position.
11. liquid processing device according to claim 10, which is characterized in that
The image pickup part is set to the nozzle.
12. liquid processing device according to claim 10, which is characterized in that
It is also equipped with mobile mechanism, the mobile mechanism makes the nozzle conveying body along the longitudinal direction and left and right directions is mobile,
The liquid processing device is provided with multiple image pickup parts, to transport front-rear direction and the left side of body from the nozzle respectively
Right direction shoots nozzle conveying body.
13. a kind of teaching method of liquid processing device, the liquid processing device have:
Nozzle has the first holding section, and sprays treatment fluid to the substrate kept by board holder to be handled；
The standby region of nozzle carries out the nozzle with standby region in the nozzle standby；
Nozzle transport body, have engaged part, between the engaged part and first holding section formed first engage with
The nozzle is kept loading and unloading freely, the nozzle conveying body carries out lifting moving and transverse shifting, to use in the nozzle
The nozzle is transported between processing position on standby region and the substrate；And
Control unit, output control signal, to carry out the processing to the substrate,
In the teaching method, the liquid processing device detects the position to form the engaged part of first engaging and should
Position is stored in the control unit,
The teaching method includes following process:
Shooting is located at the engaged part of the first height and the second height to obtain image data, described in detecting respectively
The first position and the second position of the engaged part horizontally when engaged part is located at the first height and the second height,
It is set to alternatively, being shot when the engaged part is located at the first height and the second height in the standby region of the nozzle
The object of the standby nozzle is carried out to obtain image data；
Detection is used to form the third height of the engaged part of first engaging；And
The engaged part for being used to form first engaging is found out based on described image data and the third height in cross
Upward the third place, and the third place is stored in the control unit.
14. the teaching method of liquid processing device according to claim 13, which is characterized in that
The process for obtaining described image data is used in image pickup part used in the liquid processing device to carry out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018017432A JP6954160B2 (en) | 2018-02-02 | 2018-02-02 | Liquid treatment equipment and teaching method for liquid treatment equipment |
| JP2018-017432 | 2018-02-02 |
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| CN110137104A true CN110137104A (en) | 2019-08-16 |
| CN110137104B CN110137104B (en) | 2024-06-04 |
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| JP (1) | JP6954160B2 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20190094102A (en) | 2019-08-12 |
| JP2019134137A (en) | 2019-08-08 |
| KR102672392B1 (en) | 2024-06-04 |
| CN110137104B (en) | 2024-06-04 |
| JP6954160B2 (en) | 2021-10-27 |
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