CN110131970B - 一种硅晶片甩干机 - Google Patents
一种硅晶片甩干机 Download PDFInfo
- Publication number
- CN110131970B CN110131970B CN201910405608.5A CN201910405608A CN110131970B CN 110131970 B CN110131970 B CN 110131970B CN 201910405608 A CN201910405608 A CN 201910405608A CN 110131970 B CN110131970 B CN 110131970B
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- CN
- China
- Prior art keywords
- spin
- centrifugal
- drying
- silicon wafer
- barrel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 36
- 239000010703 silicon Substances 0.000 title claims abstract description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 238000001035 drying Methods 0.000 claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 7
- 210000000078 claw Anatomy 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 230000018044 dehydration Effects 0.000 abstract description 5
- 238000006297 dehydration reaction Methods 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005119 centrifugation Methods 0.000 abstract 1
- 150000003376 silicon Chemical class 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 30
- 238000004140 cleaning Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000003068 static effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/02—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles
- F26B11/022—Arrangements of drives, bearings, supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/02—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles
- F26B11/08—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles rotating about a vertical or steeply-inclined axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/16—Chambers, containers, receptacles of simple construction mainly closed, e.g. drum
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Centrifugal Separators (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910405608.5A CN110131970B (zh) | 2019-05-16 | 2019-05-16 | 一种硅晶片甩干机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910405608.5A CN110131970B (zh) | 2019-05-16 | 2019-05-16 | 一种硅晶片甩干机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110131970A CN110131970A (zh) | 2019-08-16 |
CN110131970B true CN110131970B (zh) | 2020-11-27 |
Family
ID=67574343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910405608.5A Active CN110131970B (zh) | 2019-05-16 | 2019-05-16 | 一种硅晶片甩干机 |
Country Status (1)
Country | Link |
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CN (1) | CN110131970B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114543504B (zh) * | 2022-04-21 | 2022-06-24 | 莱芜钢铁集团泰东实业有限公司 | 一种炼钢转炉钢水升温剂生产制备工艺及其干燥装置 |
CN116313937B (zh) * | 2023-05-16 | 2023-08-18 | 河北时硕微芯科技有限公司 | 滤波器晶圆旋转冲洗甩干机 |
CN116336761B (zh) * | 2023-05-30 | 2023-08-22 | 苏州智程半导体科技股份有限公司 | 一种基于晶圆电镀的电镀机烘干机构 |
CN116974141B (zh) * | 2023-09-22 | 2023-12-15 | 贵州华龙电子设备有限公司 | 多规格晶片甩干装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205940102U (zh) * | 2016-07-20 | 2017-02-08 | 洛阳鸿泰半导体有限公司 | 一种硅片甩干桶的开门自动化装置 |
CN106733933A (zh) * | 2016-12-30 | 2017-05-31 | 泰州泽成生物技术有限公司 | 一种微孔反应板快速立式洗板机 |
CN207320072U (zh) * | 2017-10-29 | 2018-05-04 | 江苏纳沛斯半导体有限公司 | 一种半导体制造用旋转冲洗甩干机 |
CN208238459U (zh) * | 2018-01-11 | 2018-12-14 | 苏州莱德泰克精密电子设备有限公司 | 一种晶体谐振器晶片桶式干燥机 |
CN208269518U (zh) * | 2018-01-11 | 2018-12-21 | 苏州莱德泰克精密电子设备有限公司 | 一种晶体谐振器晶片盘式干燥器 |
CN109248792A (zh) * | 2018-11-01 | 2019-01-22 | 象山蓝越食品机械制造有限公司 | 脱水机 |
-
2019
- 2019-05-16 CN CN201910405608.5A patent/CN110131970B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN205940102U (zh) * | 2016-07-20 | 2017-02-08 | 洛阳鸿泰半导体有限公司 | 一种硅片甩干桶的开门自动化装置 |
CN106733933A (zh) * | 2016-12-30 | 2017-05-31 | 泰州泽成生物技术有限公司 | 一种微孔反应板快速立式洗板机 |
CN207320072U (zh) * | 2017-10-29 | 2018-05-04 | 江苏纳沛斯半导体有限公司 | 一种半导体制造用旋转冲洗甩干机 |
CN208238459U (zh) * | 2018-01-11 | 2018-12-14 | 苏州莱德泰克精密电子设备有限公司 | 一种晶体谐振器晶片桶式干燥机 |
CN208269518U (zh) * | 2018-01-11 | 2018-12-21 | 苏州莱德泰克精密电子设备有限公司 | 一种晶体谐振器晶片盘式干燥器 |
CN109248792A (zh) * | 2018-11-01 | 2019-01-22 | 象山蓝越食品机械制造有限公司 | 脱水机 |
Also Published As
Publication number | Publication date |
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CN110131970A (zh) | 2019-08-16 |
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GR01 | Patent grant | ||
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. Address before: No.58 Yucheng Middle Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN ZHICHENG AUTOMATION EQUIPMENT Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |