CN110114865A - 用于晶圆加工设备的缓冲腔室单元 - Google Patents

用于晶圆加工设备的缓冲腔室单元 Download PDF

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CN110114865A
CN110114865A CN201780081696.7A CN201780081696A CN110114865A CN 110114865 A CN110114865 A CN 110114865A CN 201780081696 A CN201780081696 A CN 201780081696A CN 110114865 A CN110114865 A CN 110114865A
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金台勋
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Abstract

本发明涉及一种用于晶圆加工设备的缓冲腔室单元。

Description

用于晶圆加工设备的缓冲腔室单元
技术领域
本发明涉及一种用于晶圆加工设备的缓冲腔室单元。
背景技术
晶圆加工设备用于对供制造半导体等的晶圆进行沉积、曝光、蚀刻、清洗等加工,这样的晶圆加工设备能够以下面提及的专利文献作为示例。
在晶圆加工设备中,与缓冲腔室单元(buffer chamber unit)一起使用负载锁定腔室单元(load lock chamber unit)、传送腔室单元(transfer chamber unit)、处理腔室单元(process chamber unit)、设备前端单元(EFEM unit,Equipment front end unit)等。
所述设备前端单元安装有装载口(load port),通过装载口将晶圆投入至晶圆加工设备内,或者在完成工艺后回收晶圆并运至外部;所述负载锁定腔室单元使晶圆在所述设备前端单元与所述传送腔室单元之间通过;所述传送腔室单元则内置有机械臂等,用于将通过所述负载锁定腔室单元投入的晶圆投入所述处理腔室单元,或者,将完成工艺的晶圆重新通过所述负载锁定腔室单元返还给所述设备前端单元;所述处理腔室单元则对通过所述传送腔室单元投入的晶圆进行蚀刻工艺。
所述缓冲腔室单元连接到所述设备前端单元,使得在所述负载锁定腔室单元与连接到所述设备前端单元的装载口之间往返的晶圆暂时停留,从而对该晶圆进行清除毒素等处理,并且在所述负载锁定腔室单元与所述设备前端单元之间起到例如缓冲的作用。
然而,根据现有的用于晶圆加工设备的缓冲腔室单元,因为需要对缓冲腔室单元进行例如清洗的修补、更换等作业,当将缓冲腔室单元从设备前端单元分离时,由于设备前端单元对外开放,因此需要停止晶圆加工设备本身,导致大幅降低工艺效率的问题。
并且,对于现有的用于晶圆加工设备的缓冲腔室单元,在对缓冲腔室单元完成例如清洗的修补及更换等作业后,当再次将缓冲腔室单元连接到设备前端单元时,为重新启动晶圆加工设备,需要进行例如对传送腔室单元内的机械臂等进行示教等的补正及验证作业,这也会降低工艺效率。
而且,根据现有的用于晶圆加工设备的缓冲腔室单元,在对晶圆加工设备的缓冲腔室单元进行补正、更换等作业后,将缓冲腔室单元重新连接到设备前端单元时,无法将缓冲腔室单元准确地重新结合至设备前端单元,并且,上述结合需要花费很长时间。
并且,根据现有的用于晶圆加工设备的缓冲腔室单元,当需要对投入缓冲腔室单元的晶圆进行加热时,存在无法对晶圆进行均匀加热的问题。
而且,根据现有的用于晶圆加工设备的缓冲腔室单元,用于排放包括从投入至缓冲腔室单元的晶圆去除的烟气(fume),以及工艺中使用的脱气(out gas)等毒素在内的空气的排放口形成于缓冲腔室单元的背面,使得从传送腔室单元、设备前端单元等流入的空气中的湿气、毒素等异物将在经过投入至缓冲腔室单元的晶圆后通过排放口排放至外部,由此,上述异物附着至晶圆导致不良等问题。
在先技术文献
专利文献
(专利文献1)授权实用新型第20-0125881号,授权日期:1998年6月30日,实用新型名称:半导体晶圆蚀刻装置。
(专利文献2)公开实用新型第20-1997-0059843号,公开日期:1997年11月10日,实用新型名称:晶圆的蚀刻装置。
发明内容
发明要解决的技术问题
本发明的目的在于提供一种用于晶圆加工设备的缓冲腔室单元,无需中断晶圆加工设备的运行就能实现用于晶圆加工设备的缓冲腔室单元的分离和再结合。
本发明的另一目的在于提供一种用于晶圆加工设备的缓冲腔室单元,当对用于晶圆加工设备的缓冲腔室单元进行分离及再次结合时,无需对晶圆加工设备的构成要素进行例如示教等的为再次启动晶圆加工设备的补正及验证作业。
本发明的又一目的在于提供一种用于晶圆加工设备的缓冲腔室单元,能够迅速且正确地实现用于晶圆加工设备的缓冲腔室单元的再次结合,并且,能够在加工设备的运行期间感应到随着时间的变化或变形。
本发明的又一目的在于提供一种用于晶圆加工设备的缓冲腔室单元,在需要对投入用于晶圆加工设备的缓冲腔室单元的晶圆进行加热时,能对该晶圆进行均匀加热。
本发明的又一目的在于提供一种用于晶圆加工设备的缓冲腔室单元,使得用于晶圆加工设备的缓冲腔室单元所排放的包含异物的空气不会经过投入至用于晶圆加工设备的缓冲腔室单元的晶圆。
解决问题的技术方案
根据本发明的一侧面的用于晶圆加工设备的缓冲腔室单元,其连接到晶圆加工设备而成为连接在设备前端单元的装载口与负载锁定腔室单元之间的缓冲,包括:
单元壳体,其一面对所述晶圆加工设备的其它构成要素开放,从而供晶圆进出;晶圆容纳孔,其形成在所述单元壳体内,与所述单元壳体的开放的面连通,从而供所述晶圆进出,并容纳所述晶圆;门部件,开放或关闭所述单元壳体的开放的面,从而实现所述晶圆容纳孔对外部的开放或关闭;以及可拆卸腔室部件,可拆卸地安装在所述单元壳体,其内部形成有所述晶圆容纳孔;
当在所述单元壳体连接到所述晶圆加工设备的状态下,所述门部件对所述晶圆加工设备与所述单元壳体之间进行关闭时,所述可拆卸腔室部件能够从所述单元壳体分离。
发明的效果
根据本发明的一侧面的用于晶圆加工设备的缓冲腔室单元,通过采用门部件,当需要将用于晶圆加工设备的缓冲腔室单元从所述设备前端单元进行分离时,所述门部件对所述设备前端单元与所述用于晶圆加工设备的缓冲腔室单元之间进行隔离,不必中断晶圆加工设备的运行就能够实现用于晶圆加工设备的缓冲腔室单元的分离及再结合,不必为了重新运行晶圆加工设备而进行例如针对晶圆加工设备的构成要素的示教作业等补正及验证作业也能实现用于晶圆加工设备的缓冲腔室单元的分离及再结合。
附图说明
图1是概略显示应用本发明第一实施例的用于晶圆加工设备的缓冲腔室单元的晶圆加工设备的附图。
图2是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元关闭时的立体图。
图3是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元打开时的立体图。
图4是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元分离时的截面图。
图5是显示图4所示的用于晶圆加工设备的缓冲腔室单元分离后为打开状态时的截面图。
图6是显示根据本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的分解立体图。
图7是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的供放置可拆卸的腔室部件的单元壳体的部分的放大图。
图8是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的置于单元壳体的部分的放大图。
图9是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的分解立体图。
图10是图9所示的A部分的放大图。
图11是图10所示的内部供应管的截面图。
图12是应用于本发明的第二实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的内部供应管的截面图。
附图标记列表
100:用于晶圆加工设备的缓冲腔室单元
110:单元壳体
112:晶圆容纳孔
120:门部件
130:感应传感器部件
具体实施方式
下面结合附图对根据本发明的实施例的用于晶圆加工设备的缓冲腔室单元进行说明。
图1是概略显示应用本发明第一实施例的用于晶圆加工设备的缓冲腔室单元的晶圆加工设备的附图,图2是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元关闭时的立体图,图3是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元打开时的立体图,图4是显示本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元分离时的截面图,图5是显示图4所示的用于晶圆加工设备的缓冲腔室单元分离后为打开状态时的截面图,图6是显示根据本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的分解立体图,图7是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的供放置可拆卸的腔室部件的单元壳体的部分的放大图,图8是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的置于单元壳体的部分的放大图,图9是本发明的第一实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的分解立体图,图10是图9所示的A部分的放大图,图11是图10所示的内部供应管的截面图。
参照图1至图11,根据本实施例的用于晶圆加工设备的缓冲腔室单元100,包括:单元壳体110、晶圆容纳孔153及门部件120,其通过连接到晶圆加工设备10而成为连接在设备前端单元20的装载口50和负载锁定腔室单元60之间的缓冲。
所述装载口50形成于所述设备前端单元20,从而放置用于容纳并移动晶圆W的晶圆载体。
所述设备前端单元20使所述晶圆载体可拆卸地结合在所述装载口50,由此,能够通过所述装载口50将所述晶圆载体内的晶圆投入所述晶圆加工设备10内,或者,回收完成工艺的晶圆后重新投入所述晶圆载体从而搬至外部。
附图标记“30”是传送腔室单元,所述传送腔室单元30内置有机械臂等,能够将依次通过所述设备前端单元20及所述负载锁定腔室单元60的晶圆投入处理腔室单元40,或者将完成工艺的晶圆重新退回所述设备前端单元20。
所述负载锁定腔室单元60使得晶圆在所述设备前端单元20与所述传送腔室单元30之间通过。
附图标记“40”是处理腔室单元,所述处理腔室单元40连接在所述传送腔室单元30,对通过所述传送腔室单元30进入的晶圆进行加工。
附图标记“21”是形成在所述设备前端单元20的缓冲连接部,用于将所述用于晶圆加工设备的缓冲腔室单元100连接至所述设备前端单元20。
通过所述负载锁定腔室单元60与所述传送腔室单元30,容纳在连接于所述设备前端单元20的所述晶圆载体的晶圆被移动到所述处理腔室单元40,当移动到所述处理腔室单元40的晶圆完成加工后,所述晶圆再次通过所述传送腔室单元30及所述负载锁定腔室单元60被移送到所述设备前端单元20。
此时,在将通过所述传送腔室单元30从所述处理腔室单元40移动到所述设备前端单元20的晶圆容纳至所述晶圆载体之前,使其经过所述用于晶圆加工设备的缓冲腔室单元100,从而清除毒素等异物。
在本实施例中,所述用于晶圆加工设备的缓冲腔室单元100可拆卸地安装在所述单元壳体110,其内部包括供形成所述晶圆容纳孔153的可拆卸腔室部件150,当在所述单元壳体110连接到所述晶圆加工设备10的状态下,所述门部件120对所述晶圆加工设备10与所述单元壳体110之间进行关闭时,所述可拆卸腔室部件150能够从所述单元壳体110分离。
为使晶圆能够进出,所述单元壳体110的一面通过开放孔112对所述晶圆加工设备10的其它构成要素开放,在此处为对于所述设备前端单元20的所述缓冲连接部21开放。
具体地,所述单元壳体110构成为上下延伸且内部为中空的形态,并且,隔板115横跨所述单元壳体110内部的大约中央位置,由此,形成有所述晶圆容纳孔153的所述可拆卸腔室部件150能够位于所述单元壳体110的内部上侧。
所述晶圆容纳孔153形成于所述单元壳体110内的所述隔板115上侧,更具体地,形成于所述可拆卸腔室部件150的可拆卸主体151内部,与所述单元壳体110的开放的所述开放孔112连通,以实现所述晶圆的进出,并容纳所述晶圆。
在此,当所述可拆卸腔室部件150与所述单元壳体110形成为一体,而不是和所述单元壳体110分离的形态时,所述晶圆容纳孔153也可以直接形成在所述单元壳体110的所述隔板115上。
在所述可拆卸主体151的内部的所述晶圆容纳孔153的内壁上设置有晶圆容纳部152,晶圆容纳部152在上下方向上形成有多个槽(slot),从而堆叠多个晶圆。
所述门部件120能够开放或关闭所述单元壳体110的开放的所述开放孔112,从而实现晶圆容纳孔153对外部的开放或关闭。
所述门部件120沿着所述单元壳体110的前方,即,沿着形成在所述单元壳体110的开放的所述开放孔112的侧面的门引导孔116实现升降,由此,开放或关闭所述单元壳体110的所述开放孔112。
在此,虽然揭示了所述门部件120沿着上下方向升降的方式,但仅作为示例,能够采用例如沿着左右侧面方向滑行等开闭所述开放孔112的多种方式,这些方式均属于本发明的范畴。
如前所述,应用所述门部件120之后,当需要把所述用于晶圆加工设备的缓冲腔室单元100从所述设备前端单元20分离出来时,所述门部件120能够将所述设备前端单元20与所述用于晶圆加工设备的缓冲腔室单元100隔离,因此不必中断所述晶圆加工设备10就能实现所述用于晶圆加工设备的缓冲腔室单元100的分离及再结合,因此,不必为了重新运行晶圆加工设备10而进行例如针对所述晶圆加工设备10的构成要素的示教作业等补正及验证作业,也能实现用于晶圆加工设备的缓冲腔室单元100的分离及再结合。
在所述单元壳体110内的所述隔板115下部形成有下部孔111,所述下部孔111上设置有排放泵140等。
所述排放泵140用于吸入包括所述晶圆容纳孔153内的异物在内的空气后进行排放,能够采用例如风扇(fan)、利用文氏效应的气流放大器等。
在本实施例中,所述可拆卸腔室部件150形成有排放口154,所述排放口154用于将所述晶圆容纳孔153内包含异物的空气排放到所述晶圆容纳孔153外部,所述排放口154形成于所述可拆卸腔室部件150的底面,所述可拆卸腔室部件150的入口侧的两个侧壁形成有侧面排放件155,该侧面排放件155与所述排放口154连通,从而与所述排放口154一起对所述晶圆容纳孔153内的包含异物的空气进行排放。由此,所述用于晶圆加工设备的缓冲腔室单元100所排放的包含异物的空气不经过投入在所述用于晶圆加工设备的缓冲腔室单元100的晶圆,而是通过所述可拆卸腔室部件150的底面及两侧面得到排放,从而使得所述用于晶圆加工设备的缓冲腔室单元100所排放的包含异物的空气中的异物不会污染晶圆。
所述排放口154形成为对应所述晶圆的外轮廓线的形态,从而尽量减少与所述晶圆重叠的部分。即,所述排放口154位于所述可拆卸腔室部件150的底面前方,其在所述可拆卸腔室部件150的中央部的宽度最小,其宽度随着接近所述可拆卸腔室部件150的两侧方向而相对地逐渐变宽,并且,以对应于所述晶圆的曲率逐渐变宽,从而最大程度地减少所述排放口154和所述晶圆的重叠部分。
附图标记“141”是对所述排放口154与所述排放泵140进行连接的连接管。
另一方面,所述用于晶圆加工设备的缓冲腔室单元100包括感应传感器部件130,该感应传感器部件130对作为所述晶圆加工设备10的其它构成要素的所述设备前端单元20的所述缓冲连接部21与所述单元壳体110是否按照所要求的位置与姿势结合进行感应。
作为示例,所述感应传感器部件130构成为压力感应传感器,该压力感应传感器安装在所述单元壳体110,并对接触所述缓冲连接部21的压力进行感应,由此感应所述用于晶圆加工设备的缓冲腔室单元100是否按照正确的位置与正确的姿势结合到所述缓冲连接部21。
除此之外,所述感应传感器部件130能够包括水平传感器、振动感应传感器、温湿度传感器、烟气感应传感器等。
为了正确地进行感应,能够在所述单元壳体110正面的互相分隔的位置安装多个所述感应传感器部件130。
按照上述构成,可以由所述感应传感器部件130感应到所述设备前端单元20与所述用于晶圆加工设备的缓冲腔室单元100是否以正确位置及正确姿势结合,因此不仅能够使从所述设备前端单元20分离出来的所述用于晶圆加工设备的缓冲腔室单元100迅速准确地再次结合,还能感应对所述设备前端单元20的所述用于晶圆加工设备的缓冲腔室单元100的连接状态随着时间变化的松弛或倾斜等随着时间的变化,和/或感应所述用于晶圆加工设备的缓冲腔室单元100的扭曲等变形,当所述用于晶圆加工设备的缓冲腔室单元100的变化超出一定程度时,向外部显示报警等从而在设备运行过程中针对随着时间的变化或变形做出预防性维护。
从外部供应吹扫气体(purge gas)、热气等喷射对象物质的外部供应管165以上下延伸的方式较长地形成在所述可拆卸腔室部件150的后方两侧角的外部;内部供应管160以上下延伸的方式较长地形成在所述可拆卸腔室部件150的后方两侧角的内部,该内部供应管160连通所述外部供应管165从而将通过所述外部供应管165供应的喷射对象物质均匀地分散到所述晶圆容纳孔121内部。
本实施例中,多个喷射孔161以相互不同的高度形成在所述内部供应管160,各个喷射孔161各自对应于所述晶圆容纳部152的各个槽,使得所述内部供应管160供应的喷射对象物质能够通过各个喷射孔161均匀地喷射到插入在所述晶圆容纳部152的各个槽的各个晶圆。因此,当所述喷射对象物质为吹扫气体(purge gas)时,可以对各个晶圆实现均匀反应,当所述喷射对象物质是含有热气的空气时,可以对各个晶圆均匀地加热。
另外,也可以将粘附式的硅胶加热器、膜式加热器等加热器附着在所述可拆卸腔室部件150的内面从而对所述可拆卸腔室部件150内部均匀地加热。
附图标记“170”是覆盖所述可拆卸腔室部件150从而实现保护的保护盖170,可以在拆卸所述可拆卸腔室部件150时去除。
附图标记“105”是安装在所述缓冲连接部21内部并且对所述晶圆容纳孔153内部进行拍摄及录像的内部摄像机,附图标记“106”是安装在所述保护盖170等处并且对所述用于晶圆加工设备的缓冲腔室单元100的外部进行拍摄及录像的外部摄像机106。由此,当所述用于晶圆加工设备的缓冲腔室单元100受到冲击而发生不良等现象时,能够对所述内部摄像机105及所述外部摄像机106的录像画面进行分析,从而掌握其原因。
一方面,在本实施例中,为了对所述可拆卸腔室部件150的对于所述隔板115的结合加以引导及固定,能够在所述隔板115和相对于所述隔板115的所述可拆卸腔室部件150的底面面板156形成互相咬合的引导固定突起180及引导固定槽部157,所述引导固定突起180与所述引导固定槽部157至少在三个分隔的位置互相咬合。
在此,所述引导固定突起180能够形成于所述隔板115,而所述引导固定槽部157则形成于所述底面面板156。
并且,各个引导固定槽部157形成为具有一定长度的长形,各个引导固定槽部157的长度方向的延长线能够在所述底面面板156的中央部等任意位置相交。
所述引导固定突起180包括:在所述隔板115上朝上方突出的突起主体181;形成于所述突起主体181的上方,趋向其上侧逐渐变窄的锥形形态的锥形上部件182。
在此,所述突起主体181能够是固定在所述隔板115上的形式,也能以在所述隔板115上升降的方式实现。以能够在所述隔板115上升降的所述突起主体181为例,在所述突起主体181的外表面形成螺纹,在所述隔板115形成插孔(未图标),在所述插孔的内面则形成能够和所述突起主体181的外表面上的螺纹咬合的螺纹,所述突起主体181在外力作用下以旋转的方式实现升降,从而调节相对于所述隔板115的高度。
所述引导固定槽部157包括:在所述底面面板156凹陷一定深度,趋向上侧逐渐变窄的倾斜面形态的插槽158;供经过所述插槽158的所述锥形上部件182插入并进行固定的固定槽159。
当所述可拆卸腔室部件150置于所述隔板115上时,三个位置以上的各引导固定突起180和各引导固定槽部157咬合。此时,相对较小的所述锥形上部件182的上部嵌入在相对较宽的所述插槽158的入口的任意地点后,所述锥形上部件182沿着所述插槽158的倾斜面滑行而得到引导,由此插入所述固定槽159并且得到固定。如此,即使将所述可拆卸腔室部件150大致地置于所述隔板115上,使三个地点以上的各个引导固定突起180和各个引导固定槽部157达到能够咬合的程度,也能使各引导固定突起180由各个引导固定槽部157得到引导从而准确稳定地结合,快速正确且简单实现所述可拆卸腔室部件150的结合。
附图标记“185”是附加固定部件185,其在各个引导固定突起180被固定到各个引导固定槽部157的状态下连接所述可拆卸腔室部件150的下部与所述隔板115,进一步固定所述可拆卸腔室部件150。
所述附加固定部件185包括:按压部187,其对置于所述隔板115上并通过各个引导固定突起180与各个引导固定槽部157得到初步固定的所述可拆卸腔室部件150的下部的凸缘部分加以按压从而进行固定;固定部186,和所述按压部187连接并且通过螺栓等结合方式可拆卸地固定在所述隔板115。
在所述可拆卸腔室部件150置于所述隔板115上并且通过各个引导固定突起180与各个引导固定槽部157得到初步固定的状态下,使所述按压部187按压所述可拆卸腔室部件150的下部的凸缘部分后,把所述结合方式紧固到所述固定部186而使得所述固定部186固定在所述隔板115,从而能够通过所述附加固定部件185进一步固定所述可拆卸腔室部件150。
下面参阅附图对本发明的另一个实施例的用于晶圆加工设备的缓冲腔室单元进行说明。在说明时,省略说明与本发明的第一实施例的记载内容重复的部分。
图12是应用于本发明的第二实施例的用于晶圆加工设备的缓冲腔室单元的可拆卸腔室部件的内部供应管的截面图。
参照图12,在本实施例中,在内部供应管260上以不同的高度形成多个喷射孔261,并且在同一高度,以不同方向形成多个喷射孔261。
即,在所述内部供应管260的相同高度上朝向不同方向的多个喷射孔261组成喷射孔组,所述喷射孔组在所述内部供应管260上以不同的高度,优选地,以对应于晶圆容纳部的各个槽的高度形成。
通过如前所述的结构,可以针对插入所述晶圆容纳部的各个槽的各个晶圆在同一高度以及多个地点喷射所述喷射对象物质,因此能够对所述晶圆均匀地供应气体并均匀地加热。
综上,对本发明的特定实施例及附图进行了说明,但本发明所属领域普通技术人员能够在不脱离本专利申请范围所记载的本发明核心思想及领域的情况下对本发明进行各种修改及变形。上述修改及变形均应属于本发明的权利范围。
工业实用性
根据本发明的一侧面的用于晶圆加工设备的缓冲腔室单元,不必中断晶圆加工设备的运行就能够实现用于晶圆加工设备的缓冲腔室单元的分离及再结合,不必为了重新运行晶圆加工设备而进行例如针对晶圆加工设备的构成要素的示教作业等补正及验证作业也能实现用于晶圆加工设备的缓冲腔室单元的分离及再结合,因此在工业上具有很高的实用性。

Claims (4)

1.一种用于晶圆加工设备的缓冲腔室单元,其连接到晶圆加工设备而成为连接在设备前端单元的装载口与负载锁定腔室单元之间的缓冲,其特征在于,包括:
单元壳体,其一面对所述晶圆加工设备的其它构成要素开放,从而供晶圆进出;
晶圆容纳孔,形成在所述单元壳体内,与所述单元壳体的开放的面连通,从而供所述晶圆进出,并容纳所述晶圆;
门部件,开放或关闭所述单元壳体的开放的面,从而实现所述晶圆容纳孔对外部的开放或关闭;以及
可拆卸腔室部件,可拆卸地安装在所述单元壳体上,并且,其内部形成有所述晶圆容纳孔;
当在所述单元壳体连接到所述晶圆加工设备的状态下,所述门部件对所述晶圆加工设备与所述单元壳体之间进行关闭时,所述可拆卸腔室部件能够从所述单元壳体分离。
2.一种用于晶圆加工设备的缓冲腔室单元,其连接到晶圆加工设备而成为连接在设备前端单元的装载口与负载锁定腔室单元之间的缓冲,其特征在于,包括:
单元壳体,其一面对所述晶圆加工设备的其它构成要素开放,从而供晶圆进出;
晶圆容纳孔,形成在所述单元壳体内,与所述单元壳体的开放的面连通,从而供所述晶圆进出,并容纳所述晶圆;
门部件,开放或关闭所述单元壳体的开放的面,从而实现所述晶圆容纳孔对外部的开放或关闭;以及
感应传感器部件,感应所述晶圆加工设备的所述其它构成要素与所述单元壳体是否按照所要求的位置与姿势结合。
3.根据权利要求1所述的用于晶圆加工设备的缓冲腔室单元,其特征在于,
所述可拆卸腔室部件形成有排放口,所述排放口用于将所述晶圆容纳孔内的包含异物的空气排放到所述晶圆容纳孔外部,所述排放口形成于所述可拆卸腔室部件的底面,
在所述可拆卸腔室部件的入口侧的两个侧壁形成有侧面排放件,所述侧面排放件与所述排放口连通,从而与所述排放口一起对所述晶圆容纳孔内的包含异物的空气进行排放。
4.根据权利要求1所述的用于晶圆加工设备的缓冲腔室单元,其特征在于,
所述单元壳体包括隔板,
在所述隔板和所述可拆卸腔室部件的相对于所述隔板的面上形成有互相咬合的引导固定突起及引导固定槽部,供对所述可拆卸腔室部件对于所述隔板的结合加以引导并实现固定,
所述引导固定突起与所述引导固定槽部至少分别在三个相互分隔的位置上互相咬合,
所述引导固定突起,包括:
突起主体;以及
锥形上部件,形成于所述突起主体的上方,具有趋向其上侧逐渐变窄的锥形形态;
所述引导固定槽部,包括:
插槽,其凹陷一定深度,形成为趋向其上侧逐渐变窄的倾斜面形态;以及
固定槽,供经过所述插槽的所述锥形上部件插入并实现固定,
当将所述可拆卸腔室部件置于所述隔板上时,三个位置以上的各个所述引导固定突起和各个所述引导固定槽部咬合,相对较小的所述锥形上部件的上部嵌入相对较宽的所述插槽的入口的任意位置后,所述锥形上部件沿着所述插槽的倾斜面滑行而得到引导,由此插入所述固定槽并且得到固定。
CN201780081696.7A 2016-12-30 2017-11-10 用于晶圆加工设备的缓冲腔室单元 Pending CN110114865A (zh)

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