CN110113884A - 新能源汽车用印制电路板的快速蚀刻装置及方法 - Google Patents
新能源汽车用印制电路板的快速蚀刻装置及方法 Download PDFInfo
- Publication number
- CN110113884A CN110113884A CN201910398791.0A CN201910398791A CN110113884A CN 110113884 A CN110113884 A CN 110113884A CN 201910398791 A CN201910398791 A CN 201910398791A CN 110113884 A CN110113884 A CN 110113884A
- Authority
- CN
- China
- Prior art keywords
- etching
- circuit board
- filter screen
- etching groove
- fast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000007921 spray Substances 0.000 claims description 20
- 239000003921 oil Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 239000010720 hydraulic oil Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910398791.0A CN110113884B (zh) | 2019-05-14 | 2019-05-14 | 新能源汽车用印制电路板的快速蚀刻装置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910398791.0A CN110113884B (zh) | 2019-05-14 | 2019-05-14 | 新能源汽车用印制电路板的快速蚀刻装置及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110113884A true CN110113884A (zh) | 2019-08-09 |
CN110113884B CN110113884B (zh) | 2021-03-23 |
Family
ID=67489892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910398791.0A Active CN110113884B (zh) | 2019-05-14 | 2019-05-14 | 新能源汽车用印制电路板的快速蚀刻装置及方法 |
Country Status (1)
Country | Link |
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CN (1) | CN110113884B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113747672A (zh) * | 2021-09-17 | 2021-12-03 | 深圳市民搏鸿通电子有限公司 | 一种新能源汽车用印制电路板的蚀刻装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560494A (zh) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及蚀刻方法 |
CN106817842A (zh) * | 2015-11-27 | 2017-06-09 | 苏州市亿利华电子有限公司 | 一种高效pcb板自动蚀刻装置 |
CN109587963A (zh) * | 2018-12-25 | 2019-04-05 | 奥士康科技股份有限公司 | 一种多层高阶hdi板蚀刻装置 |
CN109628935A (zh) * | 2019-01-16 | 2019-04-16 | 成都虹华环保科技股份有限公司 | 一种高效电解铜的碱性蚀刻液循环再生处理系统及再生方法 |
-
2019
- 2019-05-14 CN CN201910398791.0A patent/CN110113884B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560494A (zh) * | 2010-12-30 | 2012-07-11 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及蚀刻方法 |
CN106817842A (zh) * | 2015-11-27 | 2017-06-09 | 苏州市亿利华电子有限公司 | 一种高效pcb板自动蚀刻装置 |
CN109587963A (zh) * | 2018-12-25 | 2019-04-05 | 奥士康科技股份有限公司 | 一种多层高阶hdi板蚀刻装置 |
CN109628935A (zh) * | 2019-01-16 | 2019-04-16 | 成都虹华环保科技股份有限公司 | 一种高效电解铜的碱性蚀刻液循环再生处理系统及再生方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113747672A (zh) * | 2021-09-17 | 2021-12-03 | 深圳市民搏鸿通电子有限公司 | 一种新能源汽车用印制电路板的蚀刻装置 |
Also Published As
Publication number | Publication date |
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CN110113884B (zh) | 2021-03-23 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Fast etching device and method of printed circuit board for new energy vehicles Effective date of registration: 20230105 Granted publication date: 20210323 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210323 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Rapid etching device and method for printed circuit boards used in new energy vehicles Granted publication date: 20210323 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |