CN110100043A - Substrate board treatment and supporting pin - Google Patents
Substrate board treatment and supporting pin Download PDFInfo
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- CN110100043A CN110100043A CN201880005312.8A CN201880005312A CN110100043A CN 110100043 A CN110100043 A CN 110100043A CN 201880005312 A CN201880005312 A CN 201880005312A CN 110100043 A CN110100043 A CN 110100043A
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- substrate
- mask
- glass substrate
- board treatment
- supporting
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- 239000000758 substrate Substances 0.000 title claims abstract description 444
- 238000011282 treatment Methods 0.000 title claims abstract description 79
- 238000003825 pressing Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 230000008569 process Effects 0.000 claims abstract description 47
- 230000009471 action Effects 0.000 claims abstract description 12
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000007740 vapor deposition Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 194
- 239000010408 film Substances 0.000 description 101
- 230000033001 locomotion Effects 0.000 description 20
- 238000004544 sputter deposition Methods 0.000 description 18
- 208000037656 Respiratory Sounds Diseases 0.000 description 15
- 230000007547 defect Effects 0.000 description 15
- 238000011068 loading method Methods 0.000 description 14
- 230000032258 transport Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000001449 potential sputter etching Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- 238000005478 sputtering type Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Substrate board treatment of the invention is the device handled substrate, comprising: process chamber is handled the surface of the substrate in chamber；Back room, in the back room the mobile substrate adjacent with the process chamber, and the substrate is supported in the back room；Mask configures on the boundary position of the process chamber Yu the back room；And supporting mechanism, the substrate is supported in a manner of it can press the substrate towards the mask, to make the substrate be close to the mask when handling substrate, the supporting mechanism is set as that the pressing force at the deformation of the substrate and the mask and the back side of the corrective action in the substrate can be followed.
Description
Technical field
The present invention relates to a kind of substrate board treatment and supporting pins, are suitble to handle in vertical (vertical position) more particularly to one kind
Technology used in the processing substrate of the film process of vapor deposition, sputtering or the CVD of substrate processed etc. or heat treatment etc..
Patent application 2017-205427 based on October 24th, 2017 in Japanese publication of the application claims priority,
And here cite its content.
Background technique
In field of semiconductor devices or the field flat-panel monitor (FPD), as the method for forming various films, using splashing
It penetrates or is deposited.
For general sputtering equipment, sputtering cathode is provided in chamber.When using sputtering equipment carry out at
When film, in the chamber after decompression, with the opposite mode in interval as defined in being separated with the target being mounted on cathode configure mask and
Handled object (substrate).
In addition, also configuring mask and handled object (substrate) to evaporation source when being formed a film using evaporation coating device.
As the example of this device, as described in Patent Document 1, it is known that have vertical bit mask being pressed into base
The technology of the aligning guide of plate.In addition, as documented by patent document 2, it is known that following technology: the technology utilizes magnet
Substrate is kept to mask, and by mask registration to substrate, is formed a film in the state of maintaining positional relationship.
Patent document 1: Japanese Patent Publication 2010-165571 bulletin
Patent document 2: Japanese Patent Publication 10-317139 bulletin
But in the case where the substrate to the especially large area such as FPD is filmed, substrate or mask generate fluctuation sometimes
Deng deformation.As a result of which having the following problems: that is, generating what mask and substrate were not close between mask and substrate
Part, when film forming, generate unfavorable condition.
Moreover, in order to solve this problem and be intended to substrate strength pressing mask to eliminate above-mentioned deformation in the case where,
It is possible that generating the unfavorable condition that crackle or defect occur for substrate.Technology documented by patent document 1 can not solve the problems, such as this.
In addition, as documented by patent document 2, in the case where keeping mask and substrate using magnet, film forming
Particle will receive the influence in magnetic field.Especially sputtering particle is brought and is significantly affected in magnetic field.Mask is being kept using magnet as a result,
In the case where substrate, there are problems that magnetic field is possible to affect film-forming state.
Moreover, the case where the state for erecting substrate in the face of the substrate mode parallel with substantially vertical direction is formed a film
Under, i.e., in the case where the vertical film forming to form a film in the state that substrate is in vertical position (vertical), maintained in the face of substrate
The case where being formed a film in the state of level (level film forming) compares, and there are the close property of substrate and mask to be possible to further
The problem of variation.
Summary of the invention
The present invention is to propose in view of the foregoing, is intended to realize following purpose.
1, in substrate processing process, the close property of mask and substrate is improved.
2, prevent substrate from crackle or defect occurs.
3, the case where adverse effect is brought to processing substrate because of magnetic field is reduced.
4, the case where adverse effect is brought to processing substrate because of the deformation of substrate or mask is reduced.
The substrate board treatment of the 1st aspect of the present invention is the device handled substrate, comprising: process chamber, in chamber
Interior handles the surface of the substrate；Back room, in the back room the mobile base adjacent with the process chamber
Plate, and the substrate is supported in the back room；Mask configures the boundary position in the process chamber and the back room
On；And supporting mechanism, support the substrate in a manner of it can press the substrate towards the mask, thus to substrate into
It is close to the substrate with the mask when row processing, the supporting mechanism is set as that the substrate and the mask can be followed
Deformation and corrective action in the pressing force at the back side of the substrate.
In the substrate board treatment of the 1st aspect of the present invention, the supporting mechanism also can have supporting pin, described
Supporting pin extends along the direction orthogonal with the face of the mask, have when the supporting mechanism supports the substrate with the base
The front end that the back side of plate abuts, the supporting pin are configured as to extend and capable of keeping out of the way in the axial direction, so as to
Corrective action is in the pressing force at the back side of the substrate.
In the substrate board treatment of the 1st aspect of the present invention, the supporting pin also be can have: support shaft, be had
The front end abutted when the supporting pin presses the back side of the substrate with the back side of the substrate；And shaft supporting part,
Have with flexible elastomeric element, and so that the support shaft can be extended in the axial direction of the supporting pin and
The mode that can keep out of the way supports the support shaft, by the elongation of the support shaft and keeps out of the way, the supporting pin can adjust work
The pressing force at the back side for the substrate.
In the substrate board treatment of the 1st aspect of the present invention, the supporting pin can also with described in the substrate
The opposite mode in the back side is arranged on multiple positions of the supporting mechanism.
In the substrate board treatment of the 1st aspect of the present invention, the supporting pin also can have support shaft, the branch
Support axis has the front end abutted when the supporting pin presses the back side of the substrate with the back side of the substrate, institute
The front end for stating support shaft is formed dome shape.
In the substrate board treatment of the 1st aspect of the present invention, the supporting mechanism also be can have: clamping element support
Portion follows the elongation of the supporting pin and keeps out of the way and can extend and can keep out of the way on direction identical with the axial direction；With
Clamping element is supported by the clamping element support portion, and supports the edge part of the substrate.
In the substrate board treatment of the 1st aspect of the present invention, the clamping element support portion can also have with flexible
The elastomeric element of property, the elastomeric element follow the elongation of the supporting pin and keep out of the way and can extend in the axial direction and energy
Enough keep out of the way.
It, can also be at multiple positions of the peripheral portion of the substrate in the substrate board treatment of the 1st aspect of the present invention
On be provided with the clamping element.
In the substrate board treatment of the 1st aspect of the present invention, vapor deposition treatment can also be carried out in the process chamber.
In the substrate board treatment of the 1st aspect of the present invention, sputter process can also be carried out in the process chamber.
The supporting pin of the 2nd aspect of the present invention is used in the substrate board treatment of above-mentioned first method, comprising: support
Axis is installed on the substrate board treatment, the support shaft tool in a manner of extending along the direction orthogonal with the face of the mask
There is the front end abutted in supporting substrate with the back side of the substrate；And shaft supporting part, have with flexible elastomeric element,
And it can be extended by make the support shaft in the axial direction and support the support shaft in a manner of capable of keeping out of the way, pass through the support
The elongation of axis and keep out of the way, can corrective action in the pressing force at the back side of the substrate.
The substrate board treatment of the 1st aspect of the present invention is the device handled substrate, comprising: process chamber, in chamber
Interior handles the surface of the substrate；Back room, in the back room the mobile base adjacent with the process chamber
Plate, and the substrate is supported in the back room；Mask configures the boundary position in the process chamber and the back room
On；And supporting mechanism, support the substrate in a manner of it can press the substrate towards the mask, thus to substrate into
It is close to the substrate with the mask when row processing, the supporting mechanism is set as that the substrate and the mask can be followed
Deformation and corrective action in the pressing force at the back side of the substrate.Be close to supporting substrate surface and mask face the case where
Under, the deformation such as fluctuation actually occurs at least one of mask and substrate.In the past, this problem can not be eliminated.On the other hand,
According to aforesaid substrate processing unit, it can also make the mask being easily deformed when the surface for being close to supporting substrate in the past and the face of mask
The state that substrate and mask are sufficiently close to is in substrate.In addition, the region that substrate does not abut with mask will not occur, can obtain
Close property needed for processing substrate to film forming etc..Meanwhile the crackle of the substrate occurred when mask to be pressed into substrate can be prevented
Or defect etc..Thereby, it is possible to improve the treatment characteristic in the processing substrate of film forming etc..
In addition, the supporting mechanism can follow the deformation that substrate is occurred when supporting the substrate, in the substrate
The pressing force for acting on the back side of the substrate can be set in each position on face with adjusting.The supporting mechanism is propping up
When supportting the substrate, the movement of supported substrate can be followed, each of multiple positions on the face of the substrate
On can set the pressing force for acting on the back side of substrate with adjusting.
In the substrate board treatment of the 1st aspect of the present invention, the supporting mechanism has supporting pin, the supporting pin
Extend along the direction orthogonal with the face of the mask, have when the supporting mechanism supports the substrate with the institute of the substrate
The front end of back side abutting is stated, the supporting pin is configured as to extend and capable of keeping out of the way in the axial direction, makees so as to adjust
The pressing force at the back side for the substrate.Substrate is pressed towards mask by supporting pin as a result, and passes through branch
Support pin is close to substrate with it along mask.In addition, supporting pin with supporting pin pressing substrate pressing force will not become it is constant with
On mode be adjusted.Therefore, it is able to suppress the stress to substrate, prevents substrate from crackle or defect occurs.Thereby, it is possible to mention
Treatment characteristic in the processing substrate of high film forming etc..
In the substrate board treatment of the 1st aspect of the present invention, the supporting pin includes support shaft, has in the branch
Support pin presses the front end abutted when the back side of the substrate with the back side of the substrate；And shaft supporting part, have
There is flexible elastomeric element, and so that the support shaft can be extended and can be moved back in the axial direction of the supporting pin
The mode kept away supports the support shaft, by the elongation of the support shaft and keeps out of the way, the supporting pin can corrective action in institute
State the pressing force at the back side of substrate.Base is being pressed by the supporting pin and abutting supporting pin with substrate as a result,
When plate, by the flexible deformation of elastomeric element, the front end that can adjust support shaft when support shaft is extended and kept out of the way is being propped up
Support the position in the axial direction of pin.Thereby, it is possible to by supporting pin pressing substrate pressing force will not become it is constant more than in a manner of into
Row adjustment.Meanwhile, it is capable to be adjusted in such a way that the pressing force of supporting pin pressing substrate maintains defined pressing force.
In addition, in the substrate board treatment of the 1st aspect of the present invention, due to the supporting pin with the substrate
The opposite mode in the back side is arranged on multiple positions of supporting mechanism, no matter therefore which kind of size substrate, be also at base
The state that the entire surface of plate is suitably close to mask.
In addition, in the substrate board treatment of the 1st aspect of the present invention, since the front end of the support shaft is formed
Dome shape, therefore be formed as front end and the substrate progress point contact of the support shaft of dome shape.Therefore, needed for will not applying to substrate
Above pressing force.Meanwhile support shaft presses substrate to mask with the pressing force of proper range.In addition, generating fluctuation in substrate
In the case where Deng deformation, can also substrate be pressed to mask.
In addition, the supporting mechanism includes clamping element support in the substrate board treatment of the 1st aspect of the present invention
Portion follows the elongation of the supporting pin and keeps out of the way and can extend and can keep out of the way on direction identical with the axial direction；With
Clamping element is supported by the clamping element support portion, and supports the edge part of the substrate.Passing through supporting pin to mask as a result,
Pressing substrate and when making substrate along mask, will not the edge part (end) to the substrate abutted with clamping element apply it is unnecessary
Power.It is therefore prevented that substrate damage due tos substrate is there is a situation where crackle or defect etc..Meanwhile in the base for generating the deformations such as fluctuation
It, also can be by pressing substrate to mask using supporting pin, so that the substrate being deformed be made to be close to mask in the case where plate.
In addition, clamping element can support the edge part of the substrate with the state that clamping element is contacted with the end of substrate.
In addition, can also be arranged on mask and move axially apart from limiting unit to make clamping element follow supporting pin, it is described
Axial movement is apart from limiting unit for limiting the moving distance of clamping element in the axial direction.
In addition, the clamping element support portion has with flexible in the substrate board treatment of the 1st aspect of the present invention
The elastomeric element of property, the elastomeric element follow the elongation of the supporting pin and keep out of the way and can extend in the axial direction and energy
Enough keep out of the way.Thereby, it is possible to be realized in simple structure in order to which the control for making clamping element follow the pressing force in supporting pin is grasped
Required structure when making.
In addition, in the substrate board treatment of the 1st aspect of the present invention, since the clamping element is arranged in the substrate
Peripheral portion multiple positions on, therefore when handling substrate, prevent substrate due tos crackle or defect etc. occurs for substrate
Damaged situation.Meanwhile, it is capable to carry out processing substrate in the state of base plate alignment mask.Furthermore it is possible in vertical (vertical position)
Processing substrate is carried out in the state of supporting substrate.
In addition, in the substrate board treatment of the 1st aspect of the present invention, due to being carried out at vapor deposition in the process chamber
Reason, therefore when being formed a film by vapor deposition to substrate, prevent substrate due tos crackle or defect etc. occurs for processed substrate broken
The case where damage.Meanwhile, it is capable to prevent film forming characteristics to be deteriorated and being close to substrate with mask.
In addition, in the substrate board treatment of the 1st aspect of the present invention, due to being carried out at sputtering in the process chamber
The case where causing film forming characteristics to be deteriorated due to managing, therefore reduce the influence because of magnet to sputtering particle.Meanwhile it preventing because of base processed
Plate substrate damage there is a situation where crackle or defect etc..In addition, can prevent film forming special and being close to substrate with mask
Property be deteriorated.
The supporting pin of the 2nd aspect of the present invention is used in the substrate board treatment of above-mentioned first method, comprising: support
Axis is installed on the substrate board treatment, the support shaft tool in a manner of extending along the direction orthogonal with the face of the mask
There is the front end abutted in supporting substrate with the back side of the substrate；And shaft supporting part, have with flexible elastomeric element,
And it can be extended by make the support shaft in the axial direction and support the support shaft in a manner of capable of keeping out of the way, pass through the support
The elongation of axis and keep out of the way, can corrective action in the pressing force at the back side of the substrate.It is processed in order to make as a result,
The surface of substrate be close to the face of mask, can position appropriate be arranged supporting pin.It can be at necessary existing substrate
Reason dress centers the supporting pin.In addition, the region that substrate does not abut with mask will not be generated.At the substrate form a film etc.
Necessary close property can be obtained when reason.Meanwhile the crackle or defect etc. of the substrate generated when mask can be prevented to be pressed into substrate.
In addition, the configuration of supporting pin can accordingly be changed with the characteristic of the size, material or thickness of the substrate as process object etc..
Furthermore it is possible to adjust configuration or quantity of supporting pin etc. according to the degree of the deformation occurred in mask.Alternatively, can be according to base
The necessary close degree of plate and mask, adjusts configuration or quantity of supporting pin etc..
In the supporting pin of the 2nd aspect of the present invention, the part that supporting pin is abutted with substrate can be formed by resin.Tool
For body, the front end portion of support shaft can be constructed by resin.In addition, as the processing substrate dress to the 1st aspect of the present invention
Processing substrate in setting, can use substrate is handled in the case where real estate is the vertical position state of substantially vertical direction it is vertical
Processing, and can be that (horizontal) processing of approximate horizontal horizontal type handles substrate by real estate.In addition, in level
In the case where type processing, mask can be located at the upside of substrate.Alternatively, mask can be located at the downside of substrate.
The close property that can be improved mask and substrate during carrying out processing substrate can be obtained in mode according to the present invention
Effect.In addition, the effect that can prevent substrate from crackle or defect occurs can be obtained.In addition, magnetic field can be obtained can reduce to base
Plate handles the effect that bring influences.In addition, can obtain can reduce the deformation because of substrate or mask due to be brought to processing substrate
Dysgenic effect.
Detailed description of the invention
Fig. 1 is the schematic plan for indicating the substrate board treatment of first embodiment of the invention.
Fig. 2 is the solid of a part of the film forming room in the substrate board treatment for indicate first embodiment of the invention
Figure.
Fig. 3 is the side view of the maintaining part of the supporting mechanism in the substrate board treatment for indicate first embodiment of the invention
Figure.
Fig. 4 is the main view of the maintaining part of the supporting mechanism in the substrate board treatment for indicate first embodiment of the invention
Figure.
Fig. 5 is the axial sectional view of the supporting pin in the substrate board treatment for indicate first embodiment of the invention.
Fig. 6 is the cross-sectional view of the clamp system in the substrate board treatment for indicate first embodiment of the invention.
Fig. 7 is cuing open for the holding operation of the clamp system in the substrate board treatment for indicate first embodiment of the invention
View.
Fig. 8 is to indicate showing for the process carried out in the film forming room of the substrate board treatment of first embodiment of the invention
Meaning property side view.
Fig. 9 is to indicate showing for the process carried out in the film forming room of the substrate board treatment of first embodiment of the invention
Meaning property side view.
Figure 10 is the process for indicating to carry out in the film forming room of the substrate board treatment of first embodiment of the invention
Schematic side elevation.
Figure 11 is the process for indicating to carry out in the film forming room of the substrate board treatment of first embodiment of the invention
Schematic side elevation.
Figure 12 is the process for indicating to carry out in the film forming room of the substrate board treatment of first embodiment of the invention
Schematic side elevation.
Figure 13 is the behaviour of the supporting pin and clamp system in the substrate board treatment for indicate first embodiment of the invention
The schematic cross sectional views of work.
Figure 14 is the behaviour of the supporting pin and clamp system in the substrate board treatment for indicate first embodiment of the invention
The schematic cross sectional views of work.
Figure 15 is the signal of a part of the film forming room in the substrate board treatment for indicate second embodiment of the present invention
Property main view.
Specific embodiment
In the following, being illustrated based on substrate board treatment of the attached drawing to first embodiment of the invention.In addition, this implementation
Mode is the purport invented in order to better understand and the content illustrated, in the case where not specifying, and it is unlimited
The fixed present invention.
Fig. 1 is the schematic plan for indicating the substrate board treatment in present embodiment, and in Fig. 1, appended drawing reference 1 is
Substrate board treatment.
The substrate board treatment 1 of present embodiment is such as being formed in the manufacturing process in liquid crystal display to as glass
The upper surface of substrate the case where forming TFT (Thin film transistor, thin film transistor (TFT)) etc. to by glass or resin shape
At substrate 11 heated under vacuum conditions, the reciprocating sputtering equipment of film process and etching process etc. or be used for
Manufacture the evaporation coating device of organic EL.
In the present embodiment, it is illustrated to the case where carrying out sputter process.
As shown in Figure 1, substrate board treatment (sputtering equipment) 1 has: loading and relief chamber 2 (chamber)；For being transported into and
Transport substantially rectangular glass substrate (substrate) 11；Film forming room's (chamber) 4 of pressure resistance；Using sputtering method on glass substrate 11 shape
At such as ZnO class or In2O3The envelope of the transparent conductive film of class etc.；With conveying room 3, setting is in film forming room 4 and loading and relief chamber
Between 2.Although the substrate board treatment 1 of present embodiment uses side sputtering type in Fig. 1, can also be sputtered using bottom
Formula or top sputtering type.
Film forming room 4A and loading and relief chamber 2A are provided in substrate board treatment 1.These multiple chambers 2,2A, 4,4A
It is formed to surround around conveying room 3, this chamber 2,2A, 4,4A are for example configured to be formed adjacent to each other two dresses
Load and relief chamber's (chamber) and multiple process chambers (chamber).For example, one loads and relief chamber 2 is as from from outside towards substrate
The load chamber that reason device (sputtering equipment) 1 is transported into glass substrate 11 functions.Another is loaded and relief chamber 2A is used as from base
Plate processing unit 1 is functioned to the relief chamber that outside transports glass substrate 11.Alternatively, it is also possible to be film forming room 4 and film forming
The structure of different film formation process is carried out in the 4A of room.
Between loading and relief chamber's (chamber) 2 and conveying room 3, loading and relief chamber (chamber) 2A and conveying room 3 it
Between, between film forming room's (chamber) 4 and conveying room 3 and between film forming room (chamber) 4A and conveying room 3 be formed with gate valve i.e.
It can.
Positioning element is configured in loading and relief chamber 2.Be placed on positioning element from outside be transported into loading and
The glass substrate 11 of relief chamber 2.Positioning element can set the position of glass substrate 11 and carry out the alignment of glass substrate 11.
It is provided in loading and relief chamber 2 for the rotary pump loaded and the inside of relief chamber 2 is slightly vacuumized
Deng thick exhaust portion.
As shown in Figure 1, being configured with conveyer (carrier robot) 3a in the inside of conveying room 3.
Conveyer 3a have rotary shaft, be installed on the rotary shaft mechanical arm, be formed in mechanical arm one end machinery
Hand and up and down motion device.Mechanical arm is by being capable of first and second curved master arm and first and second slave arm structure each other
It makes.Conveyer 3a can be such that the glass substrate 11 as carried object moves between chamber 2,2A, 3,4,4A.
Fig. 2 is the perspective view for indicating a part of the film forming room in present embodiment.
As shown in Figures 1 and 2, being internally provided in film forming room 4: mechanism and holding setting as supply filmogen
The backboard (cathode electrode) 6 of the target 7 of setting applies the power supply of negative potential sputtering voltage to backboard 6, leads to the inside of film forming room 4
Enter the gas introduction part of gas and carries out the high vacuum exhaustion portion of high turbomolecular pump vacuumized etc. to the inside of film forming room 4.
In the inside of film forming room 4, backboard 6, which is erect to be arranged in off normal, transports the farthest position mouth 4a between conveying room 3 and film forming room 4
On.
Target 7 is fixed with the substantially parallel front side faced of glass substrate 11 when handling substrate in backboard 6.Back
Plate (cathode electrode) 6 is the electrode for applying negative potential sputtering voltage to target 7.Backboard 6 and application negative potential sputtering voltage
Power supply connection.
The rear side of cathode electrode 6 is provided with magnetron magnetic circuit, which is used to form defined magnetic on target 7
?.Magnetron magnetic circuit is installed on head motion.There is head motion the shake of magnetron magnetic circuit to use driving device.The drive of head motion
Dynamic device is configured to shake magnetron magnetic circuit.
As shown in Figure 1, the inner space of film forming room 4 has front space when forming a film as the surface side of glass substrate 11
Rear space (back room) 4n of (process chamber) 4m and the back side as glass substrate 11.It is fixed with backboard (the cathode electricity of target 7
Pole) it 6 is configured in the front space 4m of film forming room 4.
As shown in Figures 1 and 2, the film forming being open towards front space 4m is provided in the rear space 4n of film forming room 4
Mouth 4b.For film forming mouth 4b, match on boundary position of front space (process chamber) 4m with rear space (back room) 4n
It is equipped with mask 20.
20 position alignment can be masked in process before film forming by mask registration portion (not shown).
As shown in Fig. 2, mask 20 has substantially rectangular mask frame 20a and is layed in the more of mask frame 20a in length and breadth
A timber 20b.Multiple timber 20b are used to delimit the inside region of mask frame 20a.
Mask frame 20a is by having the metals such as the SUS of rigidity to be formed.Timber 20b is formed by the metal foil of invar alloy etc..
It is masked the state of frame 20a stretching with the both ends of timber 20b, timber 20b is fixed on mask frame 20a.In mask frame
The inside of frame 20a is film-forming region by the region that the multiple timber 20b being laid in length and breadth are surrounded.
As shown in Figures 1 and 2, supporting mechanism (baseplate support device) 10 is internally provided in rear space 4n.Support
Mechanism 10 keeps (support) glass substrate 11 in film forming procedure in the mode opposite with target 7, and supporting mechanism 10 can be from outside
It is transported into glass substrate 11 and glass substrate 11 can be transported to outside.
Fig. 3 is the side view of the maintaining part in the supporting mechanism for indicate present embodiment.
As shown in Figures 2 and 3, supporting mechanism 10 is located at the downside of rear space 4n.Supporting mechanism 10 has rotary shaft 12
With maintaining part (pressing plate) 13.Rotary shaft 12 and transport mouth 4a and film forming at least one of mouth 4b substantially side by side, and with level
State extends.Maintaining part 13 is installed on rotary shaft 12, and supports the back side of glass substrate 11.
As shown in Fig. 2, being connected with rotary driving part 12A in rotary shaft 12.Rotary driving part 12A can make rotary shaft 12
It rotates about the axis.Rotary shaft 12 penetrates through the side wall for being used to form rear space 4n.Rotary driving part 12A is configured in film forming room's (chamber
Room) outside.
Substantially rectangular flat maintaining part 13 is installed via installing component 12a in rotary shaft 12.Maintaining part 13 exists
Rotary shaft 12 is installed under the plane of maintaining part 13 and the inconsistent position of the axis of rotary shaft 12.Rotary shaft 12 is followed around axis
Rotation, maintaining part 13 can make the glass substrate 11 kept by maintaining part 13 mobile.
As shown in Fig. 2, maintaining part 13 can be and the rotary shaft 12 generated by rotary driving part 12A be around the rotation of axis
Carry out spinning movement.In the upper side than rotary shaft 12, as general horizontal direction position horizontal mounting position with along big
The spinning movement of maintaining part 13 is able to carry out between the vertical processing position for causing vertical direction position to erect.
In the case that maintaining part 13 is in horizontal mounting position in supporting mechanism 10, the extension on the surface of maintaining part 13
It is provided on line and transports mouth 4a.In this state, supporting mechanism can be positioned in from the horizontal glass substrate 11 come that transports of conveying room 3
On 10.
On the other hand, in the case that maintaining part 13 is in vertical processing position in supporting mechanism 10, as shown in Fig. 2, energy
Back support glass substrate 11 of enough surface sides in maintaining part 13 from glass substrate 11.The surface side of maintaining part 13, which has, to be greater than
The profile of glass substrate 11.In the case where maintaining part 13 is in vertical processing position, the surface side of maintaining part 13 is set as several
The position of blocking film forming mouth 4b.In this state, the surface 11T of the glass substrate 11 supported by maintaining part 13 (referring to Fig. 5)
It is opposite with cathode electrode 6, can the surface 11T to glass substrate 11 form a film.
Fig. 4 is the main view of the maintaining part in the supporting mechanism for indicate present embodiment.
As shown in Figures 3 and 4, multiple supporting pins 30 are provided in maintaining part 13, which matches in maintaining part 13
It is abutted when being placed in vertical processing position with the back side 11B (referring to Fig. 5) of glass substrate 11.
Supporting pin 30, can be so that glass substrate 11 be close to mask 20 when maintaining part 13 is configured at vertical processing position
Mode pressed.
Multiple supporting pins 30 are distributed on the face of maintaining part 13 in the mode opposite with the back side 11B of glass substrate 11
Multiple positions on.
Fig. 5 is the axial sectional view for indicating the supporting pin of present embodiment.
Supporting pin 30 is along orthogonal with face (the surface 11T and back side 11B) of glass substrate 11 supported by maintaining part 13
The mode that direction extends is installed on maintaining part 13.
As shown in figure 5, supporting pin 30 has support shaft 31 and axis support tube 33.
Support shaft 31 has front end, which supports glass substrate 11 in maintaining part 13 and be configured at vertical processing position
When, it is abutted at the position of processing glass substrate 11 with the back side 11B of glass substrate 11.Axis support tube 33 has and has pliability
Elastomeric element 32, and support shaft 31 is supported as that can extend and can keep out of the way in the axial direction.Since support shaft 31 can
Elongation and can keep out of the way, therefore supporting pin 30 can corrective action in the pressing force of the back side 11B of glass substrate 11.Supporting pin 30
Construct supporting mechanism 10.
As shown in figure 5, being provided with the abutting part 34 abutted with glass substrate 11 in support shaft 31.The front end of abutting part 34
It is formed dome shape.Support shaft 31 is supported on the inside of the axis support tube 33 of tubular.Support shaft 31 is supported in the axis of tubular
The inside of cylinder 33 being capable of sliding axially along supporting pin 30.
Axis support tube 33 is fixed on pressing plate 13 on by fixed part 35 and with the nut 36 of 35 threaded engagement of fixed part.It is fixed
The base end side (opposite side of abutting part 34) of support shaft 31 is arranged in portion 35, and is located at the outside of support shaft 31.Pass through nut
36 rotate relative to fixed part 35, can adjust the position of fixed part 35 and axis support tube 33 in the axial direction of support shaft 31.It is logical
Crossing rotates nut 36 relative to fixed part 35, can adjust fixation position of the pressing plate 13 in the axial direction of axis support tube 33.
Nut 37 is provided on the terminus position of axis support tube 33, thus the cardinal extremity of threaded engagement support shaft 31.Pass through
Nut 37 is rotated relative to axis support tube 33, can adjust the axial setting position of axis support tube 33 and support shaft 31.Pass through benefit
The adjustment of setting position is carried out with nut 37, can adjust the size for the active force that elastomeric element 32 is occurred.That is, by making spiral shell
Mother 37 rotates, and can adjust the size of the pressing force acted on from abutting part 34 to glass substrate 11.
It is larger and close to branch with the internal diameter at the position of the front end side of support shaft 31 about the internal diameter of axis support tube 33
The lesser mode of internal diameter at the position of the base end side of axis 31 is supportted, internal diameter is set as multistage shape.In paraxial support tube 33
Circumference is provided with bushing 33a on the position of the front end side in portion.At the position of the base end side inside the paraxial support tube 33, with
Circumference is provided with bushing 33b on position of the predetermined distance far from bushing 33a.By bushing 33a, 33b, support shaft 31 can be opposite
It slides axially in axis support tube 33.Meanwhile between being sealed by bushing 33a, 33b between support shaft 31 and axis support tube 33
Gap.
For support shaft 31, step 31b is radially formed in support shaft 31.Than step 31b closer to branch
At the position for supportting the front end side of axis 31, support shaft 31 is relatively large in diameter, in the base end side than step 31b closer to support shaft 31
At position, the diameter of support shaft 31 is smaller.At than position of the step 31b closer to the front end side of support shaft 31, in support shaft
Bushing 33a is configured between 31 and axis support tube 33.Than step 31b closer at the position of the base end side of support shaft 31,
Bushing 33b is configured between support shaft 31 and axis support tube 33.
In the inside of axis support tube 33, in the step for the bushing 33b and support shaft 31 for being located at the base end side of axis support tube 33
Elastomeric element 32 is accommodated between 31b.Elastomeric element 32 can in the axial direction of support shaft 31 flexible deformation.
As the material of elastomeric element 32, spring, the resin of elastically deformable or silicon rubber etc. may be selected.Elastomeric element 32
It is arranged in around support shaft 31.Elastomeric element 32 is located between bushing 33b and the step 31b of support shaft 31, in elastomeric element
32 by bushing 33b and step 31b when being pressed, and elastomeric element 32 has an effect power (screen resilience or restoring force) along axial direction.It is being located at
It, being capable of court with support shaft 31 in the case that the abutting part 34 of the front end of support shaft 31 is with pressing force pressing substrate 11 more than regulation
The active force of elastomeric element 32 is adjusted to the mode of the mobile predetermined distance of base end side.
The front end side of abutting part 34 is formed dome shape.Abutting part 34 can be with the back side 11B of glass substrate 11 almost
Carry out point contact.In addition, the processing (processing substrate) of 34 pairs of abutting part sputterings etc. has heat resistance and vacuum-resistant.Abutting part 34
By having the resin for the intensity that can support glass substrate 11 to be formed.Abutting part 34 is by such as Vespel (E.I.Du Pont Company's manufacture, note
Volume trade mark) etc. polyimide resin formed.
Elastomeric element 32, axis support tube 33, bushing 33a, 33b, fixed part 35, nut 36 and the support of 37 tectonic axis of nut
Portion.
As shown in Figures 3 and 4, multiple clamping elements 40 are provided in maintaining part 13.Clamping element 40 is configured in maintaining part 13
When vertical processing position, glass substrate 11 is supported and abutting with the peripheral end surface of glass substrate 11.In maintaining part 13,
Clamping element 40 configures on multiple positions on 11 periphery of glass substrate.Clamping element 40 constructs supporting mechanism 10.
Fig. 6 is the cross-sectional view for indicating the clamp system of present embodiment, and Fig. 7 is the clamp system for indicating present embodiment
Keep the figure of operation.
As shown in FIG. 6 and 7, clamp system has clamping element 40, support portion 41, elastomeric element 42 and support base 43.
As shown in figure 4, in maintaining part 13 as being provided with multiple clamping elements 40 (clamp system) on the position on the outside of periphery.
Each of multiple clamping elements 40 drive mobile device relative to maintaining part 13 by clamping element (not shown)
Center be outside outer fix and center relative to maintaining part 13 be inside Support Position between can shake.
The upper surface (front end) of clamping element 40 is abutting part 40d.Abutting part 40d, which is included, is placed with glass in supporting pin 30
The bearing surface 44 abutted when glass substrate 11 with the peripheral end surface of glass substrate 11；With than bearing surface 44 more on the face of maintaining part 13
Central side protrusion 40a outstanding.Bearing surface 44 when being placed with glass substrate 11 in supporting pin 30, by with glass substrate 11
Peripheral end surface abut and carry out the alignment of glass substrate 11.Peripheral end surface of the protrusion 40a in bearing surface 44 and glass substrate 11
When abutting, prevent the surface 11T of glass substrate 11 far from maintaining part 13.
Abutting part 40d is corresponding with the recess portion 20d on the back side 20B that mask frame 20a is arranged in.In other words, from glass base
When the vertical direction observation of plate 11, the position of abutting part 40d is overlapped with the position of recess portion 20d.In this clamp system, if
Mask frame 20a along the axial movement of support shaft 31, is then abutted in such a way that mask frame 20a (mask 20) is close to clamping element 40
Portion 40d is abutted with recess portion 20d.Movement about mask 20 will be described later.
Bearing surface 44 is axially disposed on position corresponding with the front end of support shaft 31 support shaft 31.Protrusion 40a
It is arranged to the abutting part 34 than bearing surface 44 closer to the front end side in the axial direction for being located at support shaft 31.
About the material of construction clamping element 40, the bearing surface 44 that at least abuts with glass substrate 11 with supporting pin 30 by supporting
The formation such as 34 same material such as resin of socket part.
Clamping element 40 has position limiting holes 43a, lower opening of the position limiting holes 43a in clamping element 40.In position
The inside of limiting holes 43a is configured with support portion 41.In the example shown in Fig. 6, in the inside of position limiting holes 43a configured with branch
Support part 41, and support portion 41 and the separate cross-section structure of support base 43 are shown, but in the unshowned region Fig. 6, it supports
Portion 41 is connect with support base 43.Elastomeric element 42 is provided on the position adjacent with support portion 41 of support base 43.
Support portion 41 is prominent from support base 43 to clamping element 40 in the axial direction of support shaft 31, and support portion 41, which is inserted into, to be set
It is placed in the position limiting holes 43a of clamping element 40.Support portion 41 can be along the direction in-position that position limiting holes 43a is extended
Limiting holes 43a, and retreated from position limiting holes 43a.It is moved by support portion 41 along position limiting holes 43a, thus to clamp
The mode that the moving direction of part 40 becomes direction identical with the axial direction of support shaft 31 limits the movement of clamping element 40.
The base end side (opposite side of abutting part 40d) of support base 43 can be installed joltily by axis of rocking (not shown)
In maintaining part 13.Since support base 43 can shake, clamping element 40 being capable of phase between outer side position and Support Position
Maintaining part 13 is shaken.In addition, when loading glass substrate 11 in maintaining part 13, or glass base is being transported from maintaining part 13
When plate 11, it is clamped the shake of part 40.
Elastomeric element 42 configures between clamping element 40 and support base 43.Elastomeric element 42 occurs to press towards mask 20
The active force (screen resilience or restoring force) of abutting part 40d.Due to being limited by the support portion 41 being inserted into the limiting holes 43a of position
The movement of clamping element 40 processed, therefore elastomeric element 42 presses abutting part 40d along the mask 20 that is axially facing of support shaft 31.It is utilizing
More than regulation pressing force, can be towards support with clamping element 40 come when pressing positioned at the abutting part 40d of the front end of clamping element 40
The mode of the mobile predetermined distance of the base end side of base portion 43, adjusts the active force (screen resilience or restoring force) of elastomeric element 42.
The constructions such as support portion 41, elastomeric element 42, support base 43, position limiting holes 43a and axis of rocking (not shown) folder
Tight part support portion.
Clamping element 40 is configured to stretching for clamping element 40 and moves back stretching for work (elongation movement and avoidance operation) and support shaft 31
It moves back and synchronizes.That is, clamping element 40 and support shaft 31 are in a manner of close to mask frame 20a or far from mask frame 20a along branch
Support the axial synchronizing moving of axis 31.
Specifically, the abutting part 40d for being located at the front end of clamping element 40 is set to by the back with mask frame 20a
The abutting part 34 that the recess portion 20d of face 20B is abutted and is located at the front end of support shaft 31 presses the glass substrate 11 being close to mask 20
When, clamping element 40 is moved in the same direction with the axial movement of the support shaft 31 apart from identical degree.That is, being formed in support
The depth of recess portion 20d on the back side 20B of mask frame 20a in the axial direction of axis 31 is set to clamping element 40 and support shaft 31
Stretch that move back work (elongation movement and avoidance operation) synchronous.
In addition, the recess portion 20d and abutting part 40d of mask frame 20a are configured to that clamping element 40 is made to follow supporting pin 30
Axial movement is apart from limiting unit.
In addition, elastomeric element 42 is to the size of the active force of clamping element 40 and elastomeric element 32 to the active force of support shaft 31
Size be configured to it is different.Specifically, the active force of elastomeric element 42 is set to be greater than the work of elastomeric element 32
Firmly.This is because the weight supported by supporting pin 30 varies in weight with what is supported by clamping element 40.That is, supporting pin 30 to
It is contacted in the state of the orthogonal direction imparting elastic force in the face of glass substrate 11 with the surface of glass substrate 11 and supports glass base
The weight of plate 11.On the other hand, clamping element 40 is flat to the face with the glass substrate 11 in vertical position state (standing state)
In the state that capable direction assigns elastic force, with the weight of the state support glass substrate 11 contacted with the end face of glass substrate 11
Amount.
As shown in figure 4, the liter in supporting mechanism 10 configured with lifter pin 50 and for making the lifter pin 50 move up and down
Drop pin mobile device (not shown).Lifter pin 50 is arranged in maintaining part 13.Film forming room 4 (4A) is transported into glass substrate 11
When, or when transporting glass substrate 11 from film forming room 4 (4A), maintaining part of the lifter pin 50 from configuration on horizontal mounting position
13 protrude upward, and support the glass substrate 11 being located at than 13 upper side of maintaining part.
Lifter pin mobile device is configuration in film forming room's (chamber) 4, the driving devices such as the drive motor in outside of 4A.It rises
Drop pin mobile device has the structure for carrying out the elongation of lifter pin 50 by driving device or keeping out of the way.It can maintain chamber 4
It is closed in the state of, lifter pin 50 is driven by driving device.According to this structure, when film forming room 4,4A are transported into or are transported
When glass substrate 11, delivering for glass substrate 11 can be freely carried out between maintaining part 13 and the manipulator of conveyer 3a.
In the face of maintaining part 13, multiple lift pins 50 are configured with substantially uniform interval.Supporting pin 30 is to be located at this
In the face that mode between a little lifter pins 50 configured in maintaining part 13.
The elongation of lifter pin 50 and the direction kept out of the way are approximately axially parallel with supporting pin 30.
Then, the glass substrate 11 kept by supporting mechanism 10 is carried out about the substrate board treatment of present embodiment 1
The method of film forming is illustrated.In addition, in the following description, to the processing substrate of the film forming room 4 in Liang Ge film forming room 4,4A into
Row explanation.Since the structure in film forming room 4,4A for being close to glass substrate 11 with mask is identical, to film forming room 4A
It omits the description.
Firstly, being internally transported into glass substrate 11 from the outside of substrate board treatment 1.The glass substrate 11 being transported into carries first
It sets on the positioning element inside loading and relief chamber 2.Glass substrate 11 is registered to the specified position on positioning element as a result,.
Then, the glass base being positioned in by the robot support of conveyer 3a on loading and the positioning element of relief chamber 2
Plate 11.Glass substrate 11 is taken out from loading and relief chamber 2 by conveyer 3a.Also, by conveyer 3a and via
Conveying room 3 transports glass substrate 11 to film forming room 4.
Fig. 8~Figure 12 is the schematic side elevation for indicating the process carried out in the film forming room 4 of present embodiment.In addition,
In these Fig. 8~Figure 12, the structure illustrated in the above-described embodiment is omitted sometimes.
Firstly, the transport mouth 4a of open film forming room 4.For film forming room 4, as shown in figure 8, in supporting mechanism 10,
Rotary shaft 12 is rotated by rotary driving part 12A.Maintaining part 13 is in horizontal mounting position as a result,.Meanwhile by (not shown)
Lifter pin mobile device, lifter pin 50 are in from the surface of maintaining part 13 ready position outstanding.Meanwhile it as shown in fig. 7, clamping
The configuration of part 40 is kept out of the way on outer side position, and from the upper side position of maintaining part 13.
In this state, the glass substrate 11 for reaching film forming room 4 is positioned in the guarantor of supporting mechanism 10 by conveyer 3a
It holds in portion 13.
Firstly, conveyer 3a supports glass substrate 11 as the state with maintaining part 13 substantially side by side.In this state,
As shown in the arrow A of Fig. 9, until glass substrate 11 reaches the upper side position from the multiple lift pins 50 outstanding of maintaining part 13
Until, conveyer 3a is inserted into glass base from the side on the direction parallel with the face of maintaining part 13 towards the inside of film forming room 4
Plate 11.
Then, as shown in Figure 10, the manipulator of conveyer 3a is close to maintaining part 13.As a result, glass substrate 11 become pair
State in standard to the face of maintaining part 13 on specified position, glass substrate 11 are positioned on the lifter pin 50 of maintaining part 13.It connects
, after delivering glass substrate 11 to lifter pin 50 from carrier robot 3a, the arm of carrier robot 3a is from film forming room 4 to fortune
It send room 3 to retreat, and occludes the transport mouth 4a of film forming room 4.
Also, as shown in the appended drawing reference B of Figure 11, lifter pin 50 is moved by being set to the lifter pin of supporting mechanism 10
Dynamic device decline, lifter pin 50 is received into the downside of maintaining part 13, so that glass substrate 11 is positioned in maintaining part 13.
At this point, the abutting part 34 of front end for being located at supporting pin 30 abuts with the back side 11B of glass substrate 11 and supports glass
Substrate 11.
Then, mobile device is driven by clamping element (not shown), as shown in the arrow D of Fig. 7, (the folder of clamping element 40
Tight mechanism) it is mobile in a manner of close to maintaining part 13.
By stopping the movement of clamping element 40, so that the peripheral end surface of glass substrate 11 and configuration are around maintaining part 13
Each bearing surface 44 of multiple clamping elements 40 abuts.In this state, clamping element 40 is so that glass substrate 11 configures at film forming
Mode on reason position is aligned.The periphery of the locking glass substrate 11 of clamping element 40.Glass substrate 11 is kept support as a result,
In mechanism 10.At this point, supporting the weight of glass substrate 11 by the supporting pin 30 for being set to maintaining part 13.Additionally it is possible to by base
The weight of the support glass substrate 11 such as plate guide part.
Then, rotary shaft 12 is rotated by rotary driving part 12A.As a result, as shown in the arrow C of Figure 12, via
The maintaining part 13 of installing component 12a installation is rotated around the axis of rotary shaft 12.Maintaining part 13 is as a result, to reach vertical processing position
Mode erect.At this point, glass substrate 11 maintains the state kept by supporting pin 30 and clamping element 40.
Become the state that film forming mouth 4b is almost occluded by glass substrate 11 and maintaining part 13 as a result,.Meanwhile as shown in fig. 6,
Glass substrate 11 is close to mask 20.
In this state, mask 20 is masked position alignment in 20 face by mask registration portion (not shown).Specifically
For, position in the face of mask 20 and glass substrate 11 is detected by filming apparatus (not shown).According to the testing result, lead to
Mask registration portion is crossed to drive mask 20, to be masked the 20 profile contrapositions with glass substrate 11.
Figure 13 is the schematic cross sectional views for indicating the operation of supporting pin and clamp system in present embodiment, and Figure 14 is table
Show the schematic cross sectional views of the operation of the supporting pin and clamp system in present embodiment.
In the face for terminating mask 20 after position alignment, same mask registration portion (not shown) make mask 20 along with mask
The vertical direction in 20 face is mobile.As a result, as shown in figure 13, mask 20 is abutted with glass substrate 11.At this point, being configured at vertical place
The maintaining part 13 for managing position will not be mobile from vertical processing position.In order to be close to mask 20 with glass substrate 11, with mask 20
The mode moved along the direction close to glass substrate 11 drives mask 20, so that mask 20 is contacted with glass substrate 11.
At this point, the pressing force become other than the power for the self weight for supporting glass substrate 11 by supporting pin 30 will not act on glass
The state of substrate 11.In addition, the abutting part 40d of clamping element 40 invades the recess portion being arranged on the back side 20B of mask frame 20a
The inside of 20d, recess portion 20d and abutting part 40d are close.In addition, clamping element 40 invades the inside of recess portion 20d.Also, becomes and be located at
The state that recess portion 20d on the abutting part 40d and the back side 20B that mask frame 20a is arranged in of the front end of clamping element 40 is abutted.
In addition, being close to mask 20 with glass substrate 11 after mask 20 is contacted with glass substrate 11.Therefore, with
Mask 20 and glass substrate 11 on the direction vertical with the face of mask 20 further towards mode drive mask 20.At this point,
The maintaining part 13 in vertical processing position is not driven.
By the movement of mask 20, the glass substrate 11 contacted with mask 20 is masked 20 pressings.As a result, via glass base
Plate 11 presses supporting pin 30 and clamping element 40.
Then, as shown in figure 14, pass through the movement of mask 20, the back side 11B of glass substrate 11 pressing and glass substrate 11
The abutting part 34 of the supporting pin 30 of abutting.Support shaft 31 is axially moveable relative to axis support tube 33 as a result,.Supporting pin as a result,
Compressive deformation occurs for 30 elastomeric element 32.Since elastomeric element 32 carries out compressive deformation, support shaft 31 is by elastic portion
The elastic force pressing axis support tube 33 of part 32.Therefore, pressing force acts on glass substrate 11 from abutting part 34.For elastomeric element
For 32, in a manner of the pressing force to act on glass substrate 11 from abutting part 34 is less than specified value, presets elasticity number and (press
Pressure).
Equally, when the abutting part 34 of support shaft 31 is pressed against the glass substrate 11 being close to mask 20, such as Figure 14 institute
Show, the recess portion 20d on the abutting part 40d and the back side 20B that mask frame 20a is arranged in of the front end of clamping element 40 is abutted.
The elastomeric element 42 of clamping element 40 is compressed as a result,.Since elastomeric element 42 carries out compressive deformation, clamping element 40 is by bullet
Property component 42 elastic force press support base 43, support portion 41 moves along position limiting holes 43a.Clamping element 40 is along branch as a result,
Support the axial movement degree identical with the moving distance in the axial direction of support shaft 31 of axis 31.
In this way, clamping element 40 and support shaft 31 stretch that move back work synchronous.Therefore, the edge part of glass substrate 11 will not generate
Extra deformation.Therefore, crackle or defect will not occur for glass substrate 11.
In this way, becoming the state that glass substrate 11 is close to mask 20 when maintaining part 13 is configured at vertical processing position.
Meanwhile glass substrate 11 exposes from the opening portion formed by mask frame 20a.Glass substrate 11 is configured in and cathode electrode
On 6 opposite positions.
When the maintaining part 13 is configured at vertical processing position, the glass substrate 11 and the mask that are maintained on supporting mechanism 10
20 are close to.When maintaining part 13 is configured at vertical processing position, glass substrate 11 be maintained as the surface 11T of glass substrate 11 with
The substantially parallel state in the surface of cathode electrode 6.Film formation process is carried out in film forming room 4 in this state, in glass substrate 11
Surface 11T on form film.
In film formation process, sputter gas and reaction gas are supplied from gas introduction part to film forming room 4.In film formation process
In, sputtering voltage is applied to backboard (cathode electrode) 6 from external power supply.In addition, being existed in film formation process by magnetron magnetic circuit
Magnetic field as defined in being formed on target 7.As a result, in the front space 4m of film forming room 4, sputter gas is excited by plasma
Ion.The ion of sputter gas and the target 7 of cathode electrode 6 collide, the particle for the filmogen that flies out.Also, what is flown out from target 7
After the particle and reaction gas of filmogen combine, the particle and reaction gas of combined filmogen are attached to glass base
Plate 11.Film as defined in being formed on the surface 11T of glass substrate 11 as a result,.
After terminating film process, by mask registration portion (not shown), in the direction vertical with the face of mask 20
The upper mobile mask 20 of separate mode.As a result, as shown in fig. 6, mask 20 is far from glass substrate 11.Then, pass through rotary driving part
12A rotates rotary shaft 12.As a result, in the state of maintaining glass substrate 11 in maintaining part 13, maintaining part 13 is around rotary shaft
12 axis is rotated along the direction opposite with the arrow C of Figure 12.By the rotation of rotary shaft 12, maintaining part 13 is configured in level
It loads on position.In addition, being supported by shaking clamping element 40 along the direction opposite with the arrow D of Fig. 7 to release clamping element 40
Peripheral end parts of the junction 44 far from glass substrate 11.Locking of the clamping element 40 to glass substrate 11 is released as a result,.
Then, lifter pin mobile device rises lifter pin 50, and lifter pin 50 is prominent from the surface of maintaining part 13.By upper
The lifter pin 50 risen supports glass substrate 11, in this state, utilizes conveyer 3a along the side opposite with the arrow A of Fig. 9
To the taking-up glass substrate 11 from maintaining part 13.Finally, via conveying room 3, from loading and relief chamber 2 is to substrate board treatment 1
Outside transport glass substrate 11.Further, it is also possible to carry out other processing in other chambers.
Substrate board treatment (sputtering equipment) 1 according to the present embodiment, is arranged in multiple in the face of maintaining part 13
Supporting pin 30 presses glass substrate 11 and mask 20.At this point, being able to maintain that glass substrate 11 and the pressing force of mask 20 are no more than
The state of prescribed level.Thereby, it is possible to film process are carried out in the state of being close to glass substrate 11 with mask 20.As a result,
In the case where the deformation such as fluctuation occurs for mask 20 or glass substrate 11, glass substrate 11 can also be made to follow the change of mask 20
Shape.Therefore, glass substrate 11 can be made to be close to mask 20.Therefore, it can accurately set in mask 20 to glass substrate 11
Film-forming region.Meanwhile the variation of the film forming characteristics such as film thickness uniformity can be prevented.
Meanwhile, it is capable to move back with stretching for supporting pin 30 and (extend and keep out of the way) position for synchronously adjusting clamping element 40.As a result, by
The deformation of 30 heat absorbing glass substrate 11 of supporting pin.At this point, unnecessary load, glass substrate 11 will not be applied to glass substrate 11
Unnecessary deformation will not occur.Thereby, it is possible to extremely reduce glass substrate 11, there is a situation where crackle or defects.
In addition, being configured with multiple supporting pins 30 in the face of glass substrate 11 for maintaining part 13.Therefore, pass through
Supporting pin 30 presses glass substrate 11 at multiple spot.Thereby, it is possible to be configured with each supporting pin 30 position, that is, glass substrate
Pressing position in 11 face accordingly, makes supporting pin 30 press the size of the pressing force of glass substrate 11 according to each pressing position
It sets and different.As a result, in each of multiple pressing positions, supporting pin 30 can follow glass substrate 11 or mask 20
It deforms and assigns necessary pressing force to glass substrate 11.
Simultaneously as using supporting pin 30, therefore in the case where not utilizing magnet, so that glass substrate 11 and mask 20
The state of abutting carries out the film process of glass substrate 11.Thereby, it is possible to reduce due to magnet is influenced on sputtering particle bring
The case where causing film forming characteristics to be deteriorated.
In addition, although it is necessary to make the configuration of the supporting pin 30 in 13 face of maintaining part will not be to for steadily supporting glass
The configuration of the lifter pin 50 of substrate 11 affects, but can configure multiple supporting pins 30 with almost impartial interval.
In the following, being illustrated based on substrate board treatment of the attached drawing to second embodiment of the present invention.
Figure 15 is the schematic main view for indicating the film forming room of substrate board treatment of construction second embodiment of the present invention
Figure.The difference of present embodiment and above-mentioned first embodiment is the position of mask and glass substrate when handling substrate
It sets.Identical appended drawing reference is used to structure corresponding with above-mentioned first embodiment in addition to this, and the description thereof will be omitted.
In the present embodiment, in sputter process, glass substrate 11 is with horizontal shape of the i.e. processed surface close to horizontal plane
State is maintained at maintaining part 13.
In the present embodiment, as shown in figure 15, it is internally provided with supporting mechanism 10 in film forming room 4, the supporting mechanism
10 glass substrate 11 is remained in film forming procedure it is substantially parallel with horizontal plane.Supporting mechanism (baseplate support device) 10 can also
To have the heater for glass substrate 11.In addition, backboard (cathode electrode) 6 is arranged on and adds in film forming room 4
On the opposite upper side position of hot device.In film forming room 4, the unit as supply filmogen is additionally provided in addition to backboard 6
The power supply 6A of negative potential sputtering voltage is applied to backboard 6 and imports the gas introduction part 4s of gas into the film forming room 4.In addition,
The high vacuum exhaustion portion 4t that high turbomolecular pump vacuumized etc. is carried out to the inside of film forming room 4 is provided in film forming room 4.?
Backboard 6 is fixed with target with the substantially parallel lower face side faced of glass substrate 11.
Maintaining part 13 supports glass substrate 11 in the film process of glass substrate 11, from the back side of processed surface.It protects
It holds portion 13 and is set as the tabular more slightly larger than the chamfered shape of glass substrate 11.In the position as inside in face of maintaining part 13
It is upper to be configured with heater (not shown).Heater can be from the back side of glass substrate 11 to the glass being supported in maintaining part 13
Substrate 11 is heated.
It is same as first embodiment, in maintaining part 13 as being provided with multiple supporting pins on the position of inside in face
30.Supporting pin 30, which can be stretched relative to glass substrate 11 along vertical direction, moves back.Each of multiple supporting pins 30, which become, to abut
The state outstanding upward of portion 34.Supporting pin 30 erects setting in the face of maintaining part 13, to reduce heater to glass
The heat effect of substrate 11.
In addition, in maintaining part 13 as also having can be set multiple clamping elements 40 on the position on the outside of periphery.
Existing substrate board treatment is for example with following structure: that is, maintaining part corresponding with maintaining part 13 has just
Property, position adjustment can not be individually carried out on position in horizontal face.For this structure, in existing maintaining part and glass
It is right when being pressed into glass substrate 11 by mask 20 after being aligned and be allowed to be close in the case that the back side of glass substrate 11 abuts
Glass substrate 11 applies the pressing force of necessity or more.Also, become the center of glass substrate 11 because of the self weight of glass substrate 11
Sagging state downward nearby.In order to be close to the glass substrate 11 of the state with mask 20, existing maintaining part needs
Bigger pressing force.Therefore, occurs for glass substrate 11 higher a possibility that crackle or defect.
In addition, further applying pressing for necessity or more to the glass substrate 11 that fluctuation etc. occurs in existing maintaining part
Pressure.Therefore, in existing maintaining part, crackle occurs for glass substrate 11 or a possibility that defect is higher.
On the other hand, in the present embodiment, in the horizontal plane of maintaining part 13, each of multiple supporting pins 30
Configuration is on the pressing position in the face as the glass substrate 11 of multiple positions.Moreover, being located at each front end of supporting pin 30
Abutting part 34 can individually stretch and move back along vertical direction.Each of multiple positions in the horizontal plane position as a result, support
Pin 30 is stretched and is moved back according to the deformation of mask 20 or glass substrate 11.Therefore, the deformed shape of mask 20 can be imitated, with mask
20 modes being close to support glass substrate 11.
In the present embodiment, effect identical with above-mentioned first embodiment can be obtained.
In above-mentioned each embodiment, the case where being sputtering equipment to the substrate board treatments of embodiments of the present invention
It is illustrated, but aforesaid substrate processing unit is also possible to carry out the device of vapor deposition treatment.It in this case, can be not yet
Excessive pressing force is acted in the state of mask and glass substrate and is allowed to snugly into each other.
In the above-described embodiment, it is configured between the multiple lift pins 50 with equally spaced configuration in 13 face of maintaining part
There is supporting pin 30.That is, supporting pin 30 is in the face of maintaining part 13 with equally spaced configuration.
It in the present invention, also can be compared with the central portion of glass substrate 11 in glass on the basis of this structure
The peripheral portion of substrate 11 reduces the interval of configuration supporting pin 30.That is, can also with compared with the central portion of glass substrate 11
The peripheral portion of glass substrate 11 improves the mode of the density of supporting pin 30, configures multiple supporting pins 30.
In the present invention, it can also be configured compared with the central portion of glass substrate 11 in the peripheral portion of glass substrate 11
More supporting pins 30.In addition, can also reduce and match in the central portion of glass substrate 11 in the case where vertical substrate board treatment
It sets the interval of supporting pin 30 and configures multiple supporting pins 30.That is, can also with compared with the peripheral portion of glass substrate 11 in glass
The mode that the central portion of glass substrate 11 improves the density of supporting pin 30 is configured.
In the present invention, it can also be configured compared with the peripheral portion of glass substrate 11 in the central portion of glass substrate 11
More supporting pins 30.Alternatively, supporting pin 30 can also equably be configured in the face of maintaining part 13, and make between supporting pin 30
Every constant.
In addition, in the above-described embodiment, multiple supporting pins 30 are each configured to parastate, and but not limited to this.Example
Such as, the pressing direction of supporting pin 30 can also be made from the central direction in 11 face of glass substrate in the peripheral portion of glass substrate 11
Outside inclination.Alternatively, in the case where mask 20 is not for plane, additionally it is possible to accordingly with the shape of mask 20, be set as abutting
The normal direction in the face of the mask 20 on the part that portion 34 is contacted is parallel with the pressing direction of glass substrate 11 of supporting pin 30
Configuration.
In addition, in the above-described embodiment, by making mask 20 make glass substrate 11 and mask 20 close to maintaining part 13
It is close to, but as long as keeping glass substrate 11 and mask 20 relatively close, can also be pair in glass substrate 11 and mask 20
The structure for being close to glass substrate 11 with mask 20 and making maintaining part 13 work after quasi-.
In the following, being illustrated to concrete example of the invention.
Here, as shown in figure 4, showing the various sizes under supporting mechanism 10.
The size of glass substrate 11: 2500mm × 2200mm
Support shaft 31 stretches the size moved back: 0.5mm by the elastomeric element 32 in supporting pin 30
The interval of supporting pin 30: 300mm is configured in the face of maintaining part 13
By using this sputtering equipment (substrate board treatment 1), so as to prevent glass substrate from crackle or defect occurs,
And improve the close property of mask and substrate.
Description of symbols
1 ... substrate board treatment (sputtering equipment, film formation device)
2 ... loadings and relief chamber's (chamber)
3 ... conveying rooms (chamber)
3a ... conveyer (carrier robot)
4 ... film forming room (chamber)
4a ... transports mouth
4b ... film forming mouth
4m ... front space (process chamber)
4n ... rear space (back room)
6 ... backboards (cathode electrode)
7 ... targets
10 ... supporting mechanisms (base plate keeping device)
11 ... glass substrates (substrate)
12 ... rotary shafts
12a ... installing component
13 ... maintaining parts (pressing plate)
12A ... rotary driving part
20 ... masks
20a ... mask frame
20b ... timber
30 ... supporting pins
31 ... support shafts
31b ... step
32 ... elastomeric elements (shaft supporting part)
33 ... axis support tubes (shaft supporting part)
33a, 33b ... bushing (shaft supporting part)
34 ... abutting parts
35 ... fixed parts (shaft supporting part)
36 ... nuts (shaft supporting part)
37 ... nuts (shaft supporting part)
40 ... clamping elements (clamp system)
The protrusion 40a ...
40d ... abutting part
44 ... bearing surfaces
41 ... support portions (clamp system)
42 ... elastomeric elements (clamp system)
43 ... support bases (clamp system)
The position 43a ... limiting holes
50 ... lifter pins
Claims (11)
1. a kind of substrate board treatment, the substrate board treatment is the device handled substrate, comprising:
Process chamber is handled the surface of the substrate in chamber；
Back room, in the back room the mobile substrate adjacent with the process chamber, and supported in the back room
The substrate；
Mask configures on the boundary position of the process chamber Yu the back room；With
Supporting mechanism supports the substrate in a manner of it can press the substrate towards the mask, thus to substrate into
It is close to the substrate with the mask when row processing, the supporting mechanism is set as that the substrate and the mask can be followed
Deformation and corrective action in the pressing force at the back side of the substrate.
2. substrate board treatment according to claim 1,
The supporting mechanism has supporting pin,
The supporting pin extends along the direction orthogonal with the face of the mask, has when the supporting mechanism supports the substrate
The front end abutted with the back side of the substrate, the supporting pin are configured as to extend and capable of keeping out of the way in the axial direction,
So as to corrective action in the pressing force at the back side of the substrate.
3. substrate board treatment according to claim 2,
The supporting pin includes
Support shaft, with what is abutted when the supporting pin presses the back side of the substrate with the back side of the substrate
Front end；With
Shaft supporting part has with flexible elastomeric element, and so that the support shaft the supporting pin the axis
The mode that can be extended and can keep out of the way upwards supports the support shaft,
By the elongation of the support shaft and keep out of the way, the supporting pin can corrective action in the institute at the back side of the substrate
State pressing force.
4. substrate board treatment according to claim 2,
The supporting pin is arranged on multiple positions of the supporting mechanism in the mode opposite with the back side of the substrate.
5. substrate board treatment according to claim 2,
The supporting pin have support shaft, the support shaft have when the supporting pin presses the back side of the substrate with
The front end that the back side of the substrate abuts,
The front end of the support shaft is formed dome shape.
6. the substrate board treatment according to any one of claim 2 to claim 5,
The supporting mechanism includes
Clamping element support portion follows the elongation of the supporting pin and keeps out of the way and can extend on direction identical with the axial direction
And it can keep out of the way；With
Clamping element is supported by the clamping element support portion, and supports the edge part of the substrate.
7. substrate board treatment according to claim 6,
The clamping element support portion has the elastomeric element with pliability, and the elastomeric element follows the elongation of the supporting pin
And keeps out of the way and can extend and can keep out of the way in the axial direction.
8. substrate board treatment according to claim 6,
The clamping element is provided on multiple positions of the peripheral portion of the substrate.
9. according to claim 1 to the substrate board treatment described in any one of claim 8,
Vapor deposition treatment is carried out in the process chamber.
10. according to claim 1 to the substrate board treatment described in any one of claim 8,
Sputter process is carried out in the process chamber.
11. a kind of supporting pin, claim 1 is used in the substrate board treatment described in any one of claim 10, tool
Have:
Support shaft is installed on the substrate board treatment in a manner of extending along the direction orthogonal with the face of the mask, described
Support shaft has the front end abutted in supporting substrate with the back side of the substrate；With
Shaft supporting part has with flexible elastomeric element, and so that the support shaft can extend in the axial direction and energy
The mode enough kept out of the way supports the support shaft,
By the elongation of the support shaft and keep out of the way, can corrective action in the pressing force at the back side of the substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-205427 | 2017-10-24 | ||
| JP2017205427 | 2017-10-24 | ||
| PCT/JP2018/039265 WO2019082868A1 (en) | 2017-10-24 | 2018-10-23 | Substrate treatment device and support pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110100043A true CN110100043A (en) | 2019-08-06 |
| CN110100043B CN110100043B (en) | 2021-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880005312.8A Active CN110100043B (en) | 2017-10-24 | 2018-10-23 | Substrate processing apparatus and support pin |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6799147B2 (en) |
| KR (1) | KR102243370B1 (en) |
| CN (1) | CN110100043B (en) |
| TW (1) | TWI705152B (en) |
| WO (1) | WO2019082868A1 (en) |
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| WO2023286369A1 (en) | 2021-07-16 | 2023-01-19 | 株式会社アルバック | Vacuum processing device |
| WO2023160836A1 (en) * | 2022-02-25 | 2023-08-31 | Applied Materials, Inc. | Substrate support assembly, substrate processing apparatus method for fixing an edge support frame to a table frame, and method of manufacturing a portion of a display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622707A (en) * | 2003-11-27 | 2005-06-01 | 精工爱普生株式会社 | Method of manufacturing organic electro luminescence panel, manufacturing apparatus of organic electro luminescence panel, and organic electro luminescence panel |
| CN101667630A (en) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | Organic EL apparatus manufacturing installation and production method thereof as well as film-forming device and film-forming method |
| JP2013204097A (en) * | 2012-03-28 | 2013-10-07 | Hitachi High-Technologies Corp | Film deposition apparatus and film deposition method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29707686U1 (en) | 1997-04-28 | 1997-06-26 | Balzers Prozess Systeme Vertriebs- und Service GmbH, 81245 München | Magnetic holder for foil masks |
| JP2005281746A (en) | 2004-03-29 | 2005-10-13 | Seiko Epson Corp | Vapor deposition system, vapor deposition method, electro-optical device and electronic device |
| JP5238393B2 (en) * | 2008-07-31 | 2013-07-17 | キヤノン株式会社 | Film forming apparatus and film forming method using the same |
| JP5074429B2 (en) | 2009-01-16 | 2012-11-14 | 株式会社日立ハイテクノロジーズ | Deposition equipment |
| JP2012092395A (en) * | 2010-10-27 | 2012-05-17 | Canon Inc | Film formation method and film formation apparatus |
| JP2013093279A (en) * | 2011-10-27 | 2013-05-16 | Hitachi High-Technologies Corp | Organic el device manufacturing apparatus |
| KR101337491B1 (en) * | 2012-03-07 | 2013-12-05 | 주식회사 선익시스템 | Apparatus for Aligning Substrates and Method thereof |
| JP6310705B2 (en) * | 2014-01-22 | 2018-04-11 | 株式会社アルバック | Substrate holding apparatus and film forming apparatus |
-
2018
- 2018-10-23 CN CN201880005312.8A patent/CN110100043B/en active Active
- 2018-10-23 JP JP2019516025A patent/JP6799147B2/en active Active
- 2018-10-23 KR KR1020197018007A patent/KR102243370B1/en active IP Right Grant
- 2018-10-23 WO PCT/JP2018/039265 patent/WO2019082868A1/en active Application Filing
- 2018-10-23 TW TW107137361A patent/TWI705152B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622707A (en) * | 2003-11-27 | 2005-06-01 | 精工爱普生株式会社 | Method of manufacturing organic electro luminescence panel, manufacturing apparatus of organic electro luminescence panel, and organic electro luminescence panel |
| CN101667630A (en) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | Organic EL apparatus manufacturing installation and production method thereof as well as film-forming device and film-forming method |
| JP2013204097A (en) * | 2012-03-28 | 2013-10-07 | Hitachi High-Technologies Corp | Film deposition apparatus and film deposition method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6799147B2 (en) | 2020-12-09 |
| KR20190077591A (en) | 2019-07-03 |
| TW201923127A (en) | 2019-06-16 |
| WO2019082868A1 (en) | 2019-05-02 |
| TWI705152B (en) | 2020-09-21 |
| KR102243370B1 (en) | 2021-04-22 |
| JPWO2019082868A1 (en) | 2019-11-14 |
| CN110100043B (en) | 2021-09-03 |
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