CN110092172A - Substrate turnover device - Google Patents

Substrate turnover device Download PDF

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Publication number
CN110092172A
CN110092172A CN201910042829.0A CN201910042829A CN110092172A CN 110092172 A CN110092172 A CN 110092172A CN 201910042829 A CN201910042829 A CN 201910042829A CN 110092172 A CN110092172 A CN 110092172A
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CN
China
Prior art keywords
adsorption section
substrate
adsorption
guide rail
plate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910042829.0A
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Chinese (zh)
Inventor
西尾仁孝
高松生芳
上野勉
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN110092172A publication Critical patent/CN110092172A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The application provides a kind of substrate turnover device, the overturning that can simplify the structure of device and save space, further efficiently carry out substrate.The substrate turnover device (1) for overturning substrate (F) has: the first adsorption section (110)；Second adsorption section (160)；Make the turnover mechanism (200) of the first adsorption section (110) and the second adsorption section (160) integrally half revolution in the state that the adsorption plane of the adsorption plane of the first adsorption section (110) and the second adsorption section (160) is mutually opposed；The conveying mechanism (300) of adsorption section (100) in selectivity transfer the first adsorption section (110) and the second adsorption section (160), to be located in turnover mechanism (200) transmitting place (200a).

Description

Substrate turnover device
Technical field
The present invention relates to a kind of substrate turnover devices for overturning substrate.
Background technique
In general, the motherboard that glass substrate etc. is made of fragile material is broken into regulation via scribing process and disconnection process The substrate of size.When being supplied to these processes, motherboard suitably carries out positive and negative overturning.For example, being bonded two glass substrates And in the case where constituting motherboard, score line is formed on the two sides of motherboard.In this case, being formed with score line on the face of a side Later, by the positive and negative overturning of motherboard, score line is formed on the face of another party.In addition to this, there is also will be formed with score line Motherboard it is positive and negative overturning and be supplied to disconnect process the case where.
In patent document 1 below, disclosing makes in the two work interbay transport motherboards arranged in the horizontal direction The device of the positive and negative overturning of motherboard.The device has conveying mechanism that motherboard conveys in the horizontal direction and overturns motherboard Rotating mechanism.Adsorption plate is respectively equipped in conveying mechanism and rotating mechanism.The motherboard for being placed in the workbench of a side is rotated The adsorption plate of mechanism adsorbs and positive and negative overturning.Adsorption plate of the motherboard of positive and negative overturning from the adsorption plate of rotating mechanism to conveying mechanism Handover.Later, motherboard is conveyed to the workbench of another party by conveying mechanism and is placed in the workbench of another party.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-080336 bulletin
Summary of the invention
In the structure of patent document 1, when overturning motherboard, rotating mechanism make motherboard be moved to as defined in position it Afterwards, 180 degree is rotated at this location.Postrotational motherboard is conveyed and is loaded towards other workbench by conveying mechanism.In this way, Rotating mechanism and conveying mechanism independently move.Therefore, it is necessary to the mobile mechanism for being used to keep substrate mobile is respectively arranged on rotation Rotation mechanism and conveying mechanism.Therefore, become complicated for conveying the structure of the device of motherboard, in addition, due to two shiftings of setting Motivation structure, therefore there are device enlarged such problems on the whole.In addition, since rotating mechanism and conveying mechanism move respectively It is dynamic, therefore it's hard to say efficiently carry out the movement and overturning of substrate.
In view of the project, the object of the present invention is to provide one kind can make simplifying the structure and saving sky for device Between change, be further able to efficiently carry out the substrate turnover device of the overturning of substrate.
Major way of the invention is related to a kind of base board delivery device for overturning substrate.Substrate involved in which turns over Rotary device is configured to, and has: the first adsorption section；Second adsorption section；Turnover mechanism, adsorption plane and institute in first adsorption section State the second adsorption section adsorption plane it is mutually opposed in the state of make first adsorption section and second adsorption section integrally Half revolution；And conveying mechanism, selectivity transfer it is in first adsorption section and second adsorption section, turned over described The adsorption section of transmitting place is located in rotation mechanism.
According to this structure, the first adsorption section and the second adsorption section be used for substrate overturning when substrate transfer operation, The transfer movement of substrate, therefore the structure of substrate turnover device can be made to simplify.
In the substrate turnover device involved in the method, the turnover mechanism can be configured to, and have: guide rail makes institute State the first adsorption section and second adsorption section integrally half revolution；And directing plate, by the rail guidance and with institute The first adsorption section and second adsorption section is stated to be separately connected.The guide rail is via the directing plate and first adsorption section And second adsorption section is separately connected.Adsorption plane and the adsorption plane phase of second adsorption section in first adsorption section In the state of mutually opposed, the guide rail becomes circle, and the directing plate can rotate along the guide rail.
According to this structure, the first adsorption section and the second adsorption section are in the state that mutual adsorption plane is opposed, Neng Goujing It is rotated by directing plate along guide rail.Therefore, substrate can be to be clipped in the adsorption plane of the first adsorption section and the suction of the second adsorption section State between attached face swimmingly half revolution.That is, the overturning with substrate simultaneously makes the first adsorption section and the second adsorption section Integrally half revolution, therefore exchange the side for being located at transmitting place in the first adsorption section and the second adsorption section.Substrate quilt It is adsorbed positioned at the adsorption section of transmitting place, defined position is transferred to by conveying mechanism.In this way, with the positive and negative of substrate is carried out Overturning is simultaneously carried out for the absorption by base plate transfer to defined position.Therefore, it can be carried out efficiently the overturning of substrate And the transfer towards defined position.
In the substrate turnover device involved in the method, the turnover mechanism, which is also equipped with, supports the guide rail Support plate, the directing plate are connect via the guide rail with the support plate, and the conveying mechanism and the support plate link.
According to this structure, since conveying mechanism and support plate link, the first adsorption section or the second adsorption section via Directing plate and guide rail are connect with support plate.Therefore, adsorption section, directing plate, guide rail can integrally be transferred using conveying mechanism And support plate.
In the substrate turnover device involved in the method, the guide rail, the directing plate and support plate difference It is divided into two parts, is divided into the two-part guide rail to be combined and becomes circle, and so that a side is configured at institute The mode for stating transmitting place side is divided into the two-part support plate bearing respectively, is divided into the two-part directing plate Relative to be combined and become the circular guide rail, with the transmitting place and far from the transmitting place position it Between the mode that can mutually rotate combine, first adsorption section and second adsorption section respectively be divided into two-part institute Directing plate connection is stated, the conveying mechanism is only configured at the transmitting place side with being divided into the two-part support plate Support plate connection, selectivity transfer is located at the transmitting place side and via the guide rail and the directing plate and the branch The adsorption section of board connection.
According to this structure, even if being exchanged between the first adsorption section and the second adsorption section in the adsorption section for being located at transmitting place In the case where, the support plate positioned at transmitting place is also the same support plate being divided into two-part support plate always.Thus, Even if making the first adsorption section and the second adsorption section using turnover mechanism, integrally half revolution and exchanging is located at the suction of transmitting place Attached portion does not need to link conveying mechanism and adsorption section again at this time yet.Stated differently, since being only to exchange the branch that can be transferred The directing plate of board bearing and the position of adsorption section, therefore can be carried out efficiently the overturning of substrate.
In the substrate turnover device involved in the method, the turnover mechanism is configured to, and has: guide rail, with described One adsorption section and second adsorption section are separately connected；And directing plate, by the rail guidance, and make first absorption Portion and second adsorption section integrally half revolution.The directing plate via the guide rail and first adsorption section and Second adsorption section is separately connected, mutually right in the adsorption plane of first adsorption section and the adsorption plane of second adsorption section In the state of setting, the guide rail becomes circle, and the directing plate can relatively be rotated along the guide rail.
According to this structure, the first adsorption section and the second adsorption section can be via in the state that mutual adsorption plane is opposed Guide rail is rotated along directing plate.Therefore, as described above, the first adsorption section and second can be made simultaneously with the overturning of substrate Adsorption section integrally half revolution exchanges the position of the first adsorption section and the second adsorption section.
In the substrate turnover device involved in the method, the turnover mechanism, which is also equipped with, supports the directing plate Support plate, the guide rail connect via the directing plate with the support plate, and the conveying mechanism and the support plate link.
According to this structure, the first adsorption section or the second adsorption section are connect via directing plate and guide rail with support plate.Cause This, can integrally transfer adsorption section, directing plate, guide rail and support plate using conveying mechanism.
In the substrate turnover device involved in the method, the guide rail, the directing plate and support plate difference Be divided into two parts, be divided into the two-part directing plate in such a way that a side is configured at the transmitting place side respectively by It is divided into the two-part support plate bearing, is divided into the two-part guide rail to be combined and becomes circle, relative to The directing plate is combined in a manner of it can mutually rotate between the transmitting place and the position far from the transmitting place, First adsorption section is connect with the two-part guide rail is divided into respectively with second adsorption section, and the conveying mechanism is only Link with the support plate for being configured at the transmitting place side in the two-part support plate is divided into, selectivity transfer is located at The transmitting place side and the adsorption section being connect via the directing plate and the guide rail with the support plate.
It according to this structure, is the same bearing being divided into two-part support plate always positioned at the support plate of transmitting place Plate.Thus, even if making the first adsorption section and the second adsorption section integrally half revolution and exchange and be located at transfer using turnover mechanism The adsorption section of position does not need to link conveying mechanism and adsorption section again every time yet.In other words, only with respect to can transfer Support plate exchanges the position of guide rail and adsorption section, therefore can be carried out efficiently the overturning of substrate.
As described above, in accordance with the invention it is possible to provide a kind of structure that can simplify device and save space, further Efficiently carry out the substrate turnover device of the overturning of substrate.
Effect or even meaning of the invention is further clarified by the explanation of embodiment as shown below.Wherein, Illustration when embodiment as shown below is only by implementationization of the invention, the present invention are not remembered by the following embodiments and the accompanying drawings Any restrictions of the content of load.
Detailed description of the invention
Fig. 1 is the perspective view for indicating the surface structure of substrate turnover device involved in embodiment.
Fig. 2 is the perspective view for illustrating the adsorption section of substrate turnover device involved in embodiment.
(a) of Fig. 3 is the exploded perspective view of the adsorption plate of substrate turnover device involved in embodiment.(b) of Fig. 3 be For illustrating the partial enlarged view of the driving mechanism of the adsorption section of substrate turnover device involved in embodiment.
(a) of Fig. 4~(c) is the appearance for indicating the adsorption section sorbing substrate of substrate turnover device involved in embodiment Schematic diagram.
(a) of Fig. 5~(c) is the appearance for indicating the adsorption section sorbing substrate of substrate turnover device involved in embodiment Schematic diagram.
(a) of Fig. 6 is the perspective view of the turnover mechanism of the transmitting place side of substrate turnover device involved in embodiment, (b) of Fig. 6 is the perspective view of the turnover mechanism of the position of readiness side of substrate turnover device involved in embodiment.
Fig. 7 is the figure for indicating a part of turnover mechanism of substrate turnover device involved in embodiment, and is to decompose Perspective view.
(a) of Fig. 8~(d) is the overturning for illustrating substrate turnover device is carried out involved in embodiment substrate The schematic diagram of movement.
(a) of Fig. 9~(d) is the overturning for illustrating substrate turnover device is carried out involved in embodiment substrate The schematic diagram of movement.
Figure 10 is the block diagram for indicating the structure of substrate turnover device involved in embodiment.
Figure 11 is the flow chart of the movement of substrate turnover device involved in embodiment.
(a) of Figure 12 is the main view for indicating a part of structure of substrate turnover device involved in embodiment.Figure 12 (b) is the main view for indicating a part of structure of substrate turnover device involved in the modification 1 of embodiment.
Description of symbols
1, substrate turnover device；100, adsorption section；110, the first adsorption section；160, the second adsorption section；200, turnover mechanism； 200a, transmitting place；210,211, guide rail；220,221, support plate；230,231, directing plate；300, conveying mechanism；F, substrate.
Specific embodiment
Hereinafter, the embodiments of the present invention will be described with reference to the drawings.In addition, in the various figures, for convenience, being labeled with Mutually orthogonal X-axis, Y-axis and Z axis.X-Y plane is parallel to the horizontal plane, and Z-direction is vertical direction.Z axis positive side is top, Z axis negative side is lower section.
< embodiment >
The brittle material substrates such as glass substrate and ceramic substrate, PET (polyethylene terephthalate resin) substrate with And resin substrates such as polyimide resin substrate etc. (hereinafter simply referred to as " substrate ") become final products via various processing. Processing, removing as such processing, such as with the segmented element that substrate is cut to specified quantity is in cutting substrate In the case of the processing of end material that generates and clean processing etc. is carried out to the surface of substrate.Substrate is defeated for each processing It send to defined workbench and is conveyed at the end of processing in order to carry out next processing towards other workbench.Embodiment party Substrate turnover device 1 involved in formula is when from defined workbench towards next workbench conveying substrate F for making base The device of plate overturning.For example, in the cut off operation of cutting multilager base plate, what is initially cut off from the upper surface side of multilager base plate In the case of, after cutting off upper surface side, the face as lower face side is overturn to upper surface side, is cut off again.In this way In the case where, it needs to overturn substrate.In this case, overturn substrate using substrate turnover device 1.
About the type of substrate, for example, with the polyester resin such as polyimide resin, polyamide, PET, polyethylene, The organic matters such as resin substrate of the polyvinyl resins such as the polyolefin resins such as polypropylene, polystyrene, polyvinyl chloride etc. substrate ( Including film, sheet material.It is same as below), glass substrate, the inanimate matters substrate such as brittle material substrates such as ceramic substrate, pass through implementation The substrate F of the conveying of base board delivery device 1 involved in mode is resin substrate.Resin substrate can be by being laminated different substrate At, such as also can be set to substrate made of stacking gradually PET, polyimide resin, PET from lower layer.
The substrate F conveyed by substrate turnover device 1 also may be at being divided into via disconnection process along prescribed direction more Partial state.Such substrate F can be divided along prescribed direction, further split vertically with prescribed direction, after segmentation Substrate F becomes latticed.In substrate F in the state of such segmentation, " prescribed direction " refers to X-axis positive direction, defeated with substrate Send the direction of 1 conveying substrate F of device consistent.
[overall structure of substrate turnover device]
Fig. 1 is the perspective view for indicating the surface structure of substrate turnover device 1 involved in embodiment.As shown in Figure 1, base Plate turnover device 1 has adsorption section 100, turnover mechanism 200 and conveying mechanism 300.
The substrate F that substrate turnover device 1 is overturn for example exists as described above to be cut from what the upper surface side of self-reference substrate F was cut off The case where disconnected device etc. is sent directly into.In addition, the substrate F after overturning has the case where sending out towards original device, there is also towards other The case where device is sent out.Alternatively, substrate F there is also from disconnecting device etc., temporarily move to other positions from device after be admitted to The case where to substrate turnover device 1.In this regard, in embodiments, before being sent into substrate turnover device 1 and substrate F will be made The region of mounting substrate is referred to as " substrate-placing portion 2 " after overturning.In addition, the face for loading substrate F in substrate-placing portion 2 is claimed Make " mounting surface 2a ".
Substrate F is positioned in the mounting surface 2a in such substrate-placing portion 2.Substrate-placing portion 2 is that have for loading substrate F Flat surface, i.e. mounting surface component, such as also may include workbench, conveyer belt etc..There are many being formed in substrate-placing portion 2 Pore, the pressure assigning unit 3 that will be illustrated next pass through the pore and assign pressure to substrate F.
Pressure assigning unit 3 includes air voltage source, and is set to the lower surface in substrate-placing portion 2, assigns pressure to the lower surface of substrate F Power.Pressure assigning unit 3, which is passed through, assigns the lower surface of substrate F in many micro holes that the lower surface in substrate-placing portion 2 is formed Pressure.In the case where pressure assigning unit 3 assigns negative pressure relative to substrate F, substrate F is adsorbed by substrate-placing portion 2, at substrate F In the state being close to substrate-placing portion 2.In contrast, the feelings of negative pressure are not assigned relative to substrate F in pressure assigning unit 3 Condition and in the case where imparting positive pressure, substrate F and substrate-placing portion 2 are not at adsorbed state, therefore substrate F can be made to hold Easily separated from substrate-placing portion 2.
100 sorbing substrate F of adsorption section.Turnover mechanism 200 overturns the adsorbed substrate F in adsorption section 100.Conveying mechanism Adsorption section 100 is transferred to defined position by 300.
There are various substrates as described above using the substrate F that substrate turnover device 1 involved in embodiment is overturn.? This, in the case where substrate F is resin substrate, in sorbing substrate F, when mounting substrate F etc., in substrate F and adsorption plane or Air is accompanied between mounting surface, substrate F is easy to produce fold.The substrate F for generating fold impacts the quality of final products. In this regard, substrate F is set as resin substrate in the substrate turnover device 1 involved in embodiment.In addition, being fitted as adsorption section With the adsorption section 100 for having adsorb such substrate F structure with capable of not generating fold.
As shown in Figure 1, adsorption section 100 has the first adsorption section 110 and the second adsorption section 160.First adsorption section 110 and Two adsorption sections 160 have identical structure, and the adsorption plane of the first adsorption section 110 and the adsorption plane of the second adsorption section 160 are configured to It is mutually opposed.It is illustrated hereinafter, being conceived to the first adsorption section 110 being disposed above in Fig. 1.
Fig. 2 is the perspective view for illustrating the adsorption section 100 of substrate turnover device 1 involved in embodiment, specific next It says, is the perspective view of the first adsorption section 110.(a) of Fig. 3 is the adsorption plate 120 of substrate turnover device 1 involved in embodiment Exploded perspective view.(b) of Fig. 3 is the driving for illustrating the adsorption section 100 of substrate turnover device 1 involved in embodiment The partial enlarged view of mechanism 130.
As shown in Fig. 2, the first adsorption section 110 has adsorption plate 120 and driving mechanism 130.Adsorption plate 120 is actually to inhale The component of attached substrate F is made of as will be illustrated next multiple components.Driving mechanism 130 drives adsorption plate 120, So that it approaches and separates relative to substrate F.
As shown in (a) of Fig. 3, adsorption plate 120 has plate 121, pedestal 124 and adsorption element 125, from top according to Secondary stacking.Driving mechanism 130 is equipped in the upper surface of plate 121.As long as plate 121 has defined intensity and flexibility Such material, is not particularly limited, and is in embodiments aluminium.Plate 121 is the rectangle using X-direction as long side.Plate 121 are formed with multiple lesser holes 122, connect piping (not shown) in this some holes 122.
There are many small holes for the formation of pedestal 124, and are the stainless steels of thickness 1mm or so.Adsorption element 125 and substrate F It abuts.Adsorption element 125 be the surface of substrate F will not be caused to damage such material, as long as and porous component, It is not particularly limited.As such material, such as enumerates foamed plastic and blown rubber etc. with continuous air bubbles and foam Material, sponge etc..In embodiments, adsorption element 125 is sponge.In addition, " adsorption plane of the first adsorption section 110 " refers to this The adsorption plane of adsorption element 125.The adsorption plane of second adsorption section 160 is also same.
In the case where 120 sorbing substrate F of adsorption plate, the air sent from air voltage source (not shown) is matched by above-mentioned Pipe assigns air pressure to adsorption element 125 across the multiple holes formed on pedestal 124.
Adsorption plate 120 is adsorbed relative to the whole face of the upper surface of substrate F.Therefore, the plate of adsorption plate 120 is constituted 121, pedestal 124 and adsorption element 125 at least have the size bigger than the upper surface of substrate F.In addition, plate 121 pass through by It is arranged along the x axis using Y direction as the plate 123 of the rectangle of long side to be formed.In embodiments, plate 121 is by 27 The formation of plate 123, arranges in bamboo curtain splint shape.Then, the plate 123 of appropriate the piece number is divided into more by adsorption plate 120 as one group A region.In embodiments, adsorption plate 120 regard every three pieces plate 123 as one group, is in turn divided into region from X-axis negative side This nine regions 120A~120I.In (a) of Fig. 3, a part of region 120A~120I is shown.Except positioned at adsorption plate Region other than the region 120E in 120 center is equipped with the driving portion 140 etc. for constituting driving mechanism 130.It is set in the 120E of region There is the axis of centres 126.Next, being illustrated to driving mechanism 130.
Driving mechanism 130 has multiple driving portions 140, to adsorption plate 120 carry out driving make its relative to substrate F close to And separation.First limiter 131, second limiter 132, mobile member 133 and bearing are respectively equipped in multiple driving portions 140 Portion 150.In other words, driving mechanism 130 is by driving portion 140, first limiter 131, second limiter 132, mobile member 133 and supporting part 150 be set as one group of driving body, constituted by having driving body as multiple groups.In this regard, will be with driving As described above group centered on portion 140 is referred to as " driving body ".Specifically, driving portion 140 is cylinder.Hereinafter, " driving portion 140 " are labeled as " cylinder 140 ".
Next, being directed to driving body, (b) based on Fig. 3 is illustrated.In addition, (b) of Fig. 3 is provided at region 120A's The enlarged drawing of driving body.Cylinder 140 has main body 141, the piston rod 142 for being contained in main body 141, guides the outer of piston rod 142 Cylinder 143, the coupling member 144 set on the lower part of main body 141 and the interconnecting piece 145 set on main body 141.144 edge of coupling member Y direction is formed with hole 144a.
Supporting part 150 has support shaft 151, four 152, two, axis supporting member 153, lower side panel 154, epipleural 155 And two columns 156.Four axis 152 in Y-axis negative side and each setting two of positive side difference, be fixed on flat by the lower end surface of each axis 152 Plate 102.Two supporting members 153 form two hole 153a in the Z-axis direction respectively, and each axis 152 passes through each hole 153a.Two branch Bearing member 153 is formed with hole 153b in the Y-axis direction.
Support shaft 151 is by the bearing of cylinder 140 for the axis that can be rotated, and is the Y direction of plate 121 with adsorption plate 120 In parallel, and it is arranged on the direction vertical with plate 121.Support shaft 151 sequentially passes through the supporting member 153 of Y-axis negative side Hole 153b, the hole 144a of coupling member 144, Y-axis positive side supporting member 153 hole 153b.In addition, two mobile members 133 It is formed with hole 133a along the y axis respectively.In above-mentioned support shaft 151, support shaft 151 passes through mobile member from Y-axis positive side 133 hole 133a, support shaft 151 pass through the hole 133a of mobile member 133 from Y-axis negative side.As described above, coupling member 144 Set on the lower part of the main body 141 of cylinder 140, thus support shaft 151 rotatably with cylinder 140 and supporting part 150 connections.
It is formed with the hole 154a of rectangle in the center portion of lower side panel 154, it will in a manner of making hole 154a surround main body 141 Lower side panel 154 loads and is connected to the upper surface of four axis 152.Lower side panel 154 is across hole 154a in Y-axis negative side and positive side point Not She Zhi column 156, each column 156 upper surface connect epipleural 155.Here, the central portion in epipleural 155 is formed with hole 155a, outer cylinder 143 pass through hole 155a.
Two mobile members 133 are equipped with sliding block 134 on top respectively.What the lower surface that sliding block 134 is embedded in frame 4 was formed Mobile member 133 is set as that movement can be slided along the x axis by groove portion.Mobile member 133 is via support shaft 151 and supporting part 150 and cylinder 140 connect.Therefore, when mobile member 133 slides movement along the x axis, cylinder 140 and supporting part 150 Also sliding movement along the x axis.
In each driving body, two first limiters 131 are set, the first limiter 131 be set as not with two branch The lower part of bearing member 153 and be to be contacted along Z-direction by the axis 152 of supporting member 153.Second limiter 132 be located at than Set on central portion of the mobile member 133 close to the first adsorption section 110 of Y-axis positive side, in other words, the position close to the axis of centres 126 Mode and frame 4 link.
Driving body centered on the driving portion 140 constituted as described above drives as described below.From (not shown) In the case that air voltage source assigns positive pressure to cylinder 140, piston rod 142 is moved upward while being guided by outer cylinder 143.At this time Four axis 152 also cooperate the movement of piston rod 142, are moved upward while the sliding contact in the 153a of hole.Four axis 152 It is that region 120A is connect, therefore when axis 152 is moved upward, region 120A also rises with adsorption plate 120.So, though Right region 120A is moved upward, but limits moving distance using first limiter 131.
Above-mentioned structure is same in Fig. 1 and whole driving body shown in Fig. 2.But first limiter 131 Region of the size because cylinder 140 is arranged difference due to it is different.Set on region 120A~120D each first limiter 131 with The mode that adsorption plate 120 successively makes moving distance elongated in the case where rising from region 120D to region 120A is set to each bearing structure Part 153.Therefore, make on the 120A~120D of region when assigning positive pressure to each cylinder 140 for being respectively arranged on region 120A~120D When rising, region 120A~120D is deformed into the substantially arc-shaped bloated to 2 side of substrate-placing portion.
Further, when region, 120A~120D is moved upward, each cylinder 140 is rotated, and region 120A~120D It is tilted to a side of X-axis negative side.Region 120A~120D is deformed into the round and smooth circular arc bloated to 2 side of substrate-placing portion as a result, Shape.The inclination of each second limiter 132 difference restricted area 120A~120D is utilized at this time.Thereby, it is possible to by region 120A~ The shape of 120D is set as the arc-shaped of defined curvature.
As shown in Fig. 2, four above-mentioned driving bodies are similarly set to Y-axis negative side in the 120A~120D of region.In addition, Cylinder 140 is set to symmetrical position along the x axis in X-Y plane centered on the region 120E for being equipped with the axis of centres 126.Cause This, as described above, when region, 120A~120D is deformed into the arc-shaped of defined curvature, region 120F~120I is also the same Ground deformation, region 120A~120I are deformed into semicircle shape.
In addition, in embodiments, adsorption plate 120 is divided into region 120A~120I, but it is not limited to such division. According to the size of substrate F, the size for constituting the plate 121 of adsorption plate 120, pedestal 124 and adsorption element 125 can be appropriate Adjustment.Plate 121 is formed by multiple plates 123, and the size and the piece number of the plate 123 used can also be with appropriate adjustments.In addition, Quantity set on the driving portion 140 of adsorption plate 120 is also adjusted according to the size of substrate F.
The substrate F's that (c) of (a) based on Fig. 4~Fig. 5 carries out the first adsorption section 110 of structure as described above Absorption is illustrated.(a) of Fig. 4~Fig. 5 (c) is the adsorption section 100 for indicating substrate turnover device 1 involved in embodiment The schematic diagram of the appearance of sorbing substrate.Here, being the first adsorption section 110 by the explanation of adsorption section 100.In addition, (a) of Fig. 4~Fig. 5 (c) expression the case where seeing from Y-axis positive side.
In first adsorption section 110, when assigning positive pressure together to each cylinder 140 from air voltage source (not shown), each piston rod 142 stretch out upwards, along with this, region 120A~120I is moved upward.Wherein, since region 10E is not provided with cylinder 140, therefore be removed.Then, the moving distance in each region is limited by each first limiter 131.At this point, each cylinder 140 with It is tilted centered on each support shaft 151 to the side opposite with the axis of centres 126.Therefore, each mobile member 133 is to 126 side of the axis of centres Sliding movement.In addition, the moving distance of each mobile member 133 is limited by second limiter 132.As a result, as shown in (a) of Fig. 4, Region 120A~120I is deformed into the round and smooth arc-shaped with defined curvature.In this state, the first adsorption section 110 so that The mode that region 120E is abutted with substrate F at first is close.
As shown in (b) of Fig. 4, since the first adsorption section 110 is Chong Die with substrate F, assigned together to each cylinder 140 negative When pressure, piston rod 142 is moved downwards.Set on each region each first limiter 131 at a distance from substrate F from adsorption plate 120 Central portion it is successively elongated towards both ends.Therefore, from region 120E to region 120A and from region 120E to region 120I Successively abutted with substrate F.It is clipped in the air between substrate F and the first adsorption section 110 as a result, by the central portion direction from substrate F Both ends are driven out of, in the state of not accompanying air between substrate F and the first adsorption section 110, the first adsorption section 110 and substrate F Overlapping.In this state, air pressure is assigned to the first adsorption section 110, starts the absorption of substrate F.
As shown in (c) of Fig. 4, positive pressure is assigned together to each cylinder 140, the first adsorption section 110 is deformed into round and smooth circular arc Shape.Substrate F is transferred to turnover mechanism 200 by conveying mechanism 300.
As shown in (a) of Fig. 5, when to turnover mechanism 200 transfer substrate F when, substrate F loaded for center portion at first with The adsorption plane of second adsorption section 160 abuts.At this point, being assigned together to each cylinder 140 negative in the same manner as with (b) of Fig. 4 the case where Pressure, moves piston rod 142 downwards, adsorption plane of the substrate F from central portion to both ends successively with the second adsorption section 160 connects Closely.Then, as shown in (b) of Fig. 5, when substrate F is placed in the adsorption plane of the second adsorption section 160, the overturning of substrate F is carried out.
After the overturning for carrying out substrate F, as shown in (c) of Fig. 5,160 sorbing substrate F of the second adsorption section is utilized.Then, Assign positive pressure together to each cylinder 140 of the second adsorption section 160, the second adsorption section 160 from region 120A towards region 120E with And successively rise from region 120I towards region 120E, it is deformed into the arc-shaped of defined curvature.Second adsorption section 160 is conveyed Mechanism 300 is transferred to defined position, and loads substrate F.The situation and situation phase shown in (a) of Fig. 4 and (b) of Fig. 4 Together.So, the absorption of the substrate F based on adsorption section 100 is carried out.
As described above, the first adsorption section 110 and the second adsorption section 160 are identical structures.In the above description, Illustrate the case where the first adsorption section 110 is located above relative to the second adsorption section 160, but can also be same with the overturning of substrate F When make the first adsorption section 110 and the second adsorption section 160 integrally half revolution, be located above the second adsorption section 160.This Sample when each substrate F rotates, exchanges the upper and lower position of the first adsorption section 110 and the second adsorption section 160.Then, it is located above Adsorption section substrate F is transferred to turnover mechanism 200, alternatively, the substrate F after overturning is transferred to defined position.Here, In the turnover mechanism 200 of substrate turnover device 1, the position that substrate F is loaded is referred to as " transmitting place 200a ".Relative to This will be referred to as " non-transmitting place 200b " from the position that transmitting place 200a deviates in turnover mechanism 200.
Next, being illustrated to turnover mechanism 200.(a) of Fig. 6 is substrate turnover device 1 involved in embodiment Turnover mechanism 200 in the side transmitting place 200a perspective view, (b) of Fig. 6 be substrate involved in embodiment overturning dress Set the perspective view of the side non-transmitting place 200b in 1 turnover mechanism 200.Fig. 7 is the overturning dress of substrate involved in embodiment Set the exploded perspective view of the main portions of 1 turnover mechanism 200.Turnover mechanism 200 is respectively arranged on X-axis negative side and positive side.
As shown in (a) of Fig. 6, the turnover mechanism 200 in transmitting place 200a has guide rail 210 and support plate 220.Such as figure Shown in 6 (b), the turnover mechanism 200 in non-transmitting place 200b has guide rail 211 and support plate 221.Guide rail and support plate It is only the position difference of setting, is identical as component.In addition, turnover mechanism 200 has gear 201 and cover portion 202.
Further, as shown in fig. 7, turnover mechanism 200 has gear 203, has directing plate in the side transmitting place 200a 230, connecting plate 240, connecting elements 250, the first pedestal 260 and the second pedestal 270.Has connection in non-transmitting place 200b Plate 241, connecting elements 251, the first pedestal 261 and the second pedestal 271.Wherein, directing plate, connecting plate, connecting elements, first Pedestal and the second pedestal are symmetrical arranged in Z-Y axial plane along Y-axis respectively, can combine the component of Z axis negative side and positive side. In other words, directing plate, connecting plate, connecting elements, the first pedestal and the second pedestal are respectively by the way that a component to be divided into Two parts are configured.Especially, guide rail 210 and 211 is the component of semicircle shape, forms round shape when being combined with each other.Guide rail 210 are installed on support plate 220.
Connecting plate 240 is connect with directing plate 230.Multiple rotating members 232 are equipped in directing plate 230.The rotating member 232 It is embedded in the slot 212 of guide rail 210.As described above, guide rail 210 is semicircle shape.Thus, rotating member 232 in directing plate 230 with Semicircle shape is configured to along the mode of the slot 212 of guide rail 210.In addition, the shape of directing plate 230 is semicircle shape in Fig. 7, but As long as rotating member 232 cooperates with guide rail 210 and is configured to semicircle shape, directing plate 230 is also possible to rectangle in itself.Into one Step, rotating member 232 is cam follower.Thus, it is possible to the swimmingly moving in rotation in the slot 212 of guide rail 210 and 211.
Gear 203 is embedded in the hole 201a of the round for the center portion for being formed in gear 201.Hole 201a is clipped in Y Axis positive side and negative side are formed with the hole 201b of rectangle.Second pedestal 270 and 271 is respectively provided with two, is formed with recess portion 272.It is embedded in the 201b of hole other than the recess portion 272 of the second pedestal 270 and 271.In each recessed of second pedestal 270,271 Portion 272 is installed by the first pedestal 260 and 261.At this point, the first pedestal 260 and 261 is abutted with gear 201.Connecting elements 250 And 251 be respectively provided with two, has protrusion 252 and axis 253.Connecting elements 250 and 251 respective protrusions 252 are worn It crosses in the hole 233 that directing plate 230 and directing plate 231 are respectively above formed.Axis 253 is abutted with the first pedestal 260 and 261.
In such a configuration, two recess portions 242 of connecting plate 240 are connect with the frame 4 of the first adsorption section 110.Specifically For, as shown in Fig. 2, the both ends of Y-axis negative side and positive side in the frame 4 that the first adsorption section 110 has and recess portion 242 Connection.Therefore, directing plate 230, connecting plate 240 and connecting elements 250 are connect with the first adsorption section 110.For the second absorption Portion 160 is also same.
Due to such a structure, therefore when gear 201 and gear 203 rotate, the rotating member of directing plate 230 232 move along the slot 212 of guide rail 210, therefore directing plate 230 also moves.The driving of gear 201 can be driven by motor.Or Rack gear can also be arranged under gear 201 in person, form so-called rack and wheel.In (b) of Fig. 1 and Fig. 6, illustrate The case where equipped with the rack and wheel.
In addition, guide rail 210 and 211 forms round shape.Then, the rotating member 232 of directing plate 230 and 231 is embedding on one side Enter guide rail 210 and 211 respective slots move on one side, therefore directing plate 230 and 231 can be relative to guide rail 210 and 211 Rotation.Therefore, it can be rotated via the first adsorption section 110 that connecting plate 240 connects.In this way, the member of formation of turnover mechanism 200 In directing plate 230, connecting plate 240 and connecting elements 250 rotated together with the first adsorption section 110.The situation is in directing plate It 231, is also same in connecting plate 241 and connecting elements 251.
As shown in Figure 1, conveying mechanism 300 has lift component 310, guide rail 320, sliding block 330.Lift component 310 with turn over The support plate 220 of rotation mechanism 200 links.As described above, the directing plate 230 in the member of formation of turnover mechanism 200, connecting plate 240 and connecting elements 250 can rotate.In contrast, support plate 220 does not rotate.In other words, it is respectively arranged on transmitting place The support plate 220 and 221 of the side 200a and non-transmitting place 200b are fixed on the position.Therefore, with the liter of conveying mechanism 300 The support plate that drop component 310 links is arranged in the support plate 220 of the side transmitting place 200a.Thus, conveying mechanism 300 for example In the case where transferring the first adsorption section 110, the first adsorption section 110 is connected in connecting plate 240, connecting plate 240 and directing plate 230 connect It connects.In addition, since guide rail 210 is connect with support plate 220, also include positioned at the first adsorption section 110 of transmitting place 200a, It is transferred according to the sequence of guide rail 210, directing plate 230, connecting plate 240, support plate 220 and connecting elements 250.
Next, the rotary movement for the substrate F that (d) of (a) based on Fig. 8~Fig. 9 carries out substrate turnover device 1 into Row explanation.(a) of (a) of Fig. 8~Fig. 8 (d) and Fig. 9~Fig. 9 (d) is for illustrating substrate involved in embodiment The schematic diagram of the rotary movement for the substrate F that turnover device 1 is carried out.In addition, substrate F is by above-mentioned adsorption section 100 with curved State absorption and transfer, but in (d) of (a) of Fig. 8~Fig. 9 middle diagram for omitting the curved state.In addition, Fig. 8's (a) it in~Fig. 9 (d), shows transfer and overturns the substrate F loaded on mounting surface 2a, transferred again to mounting surface 2a Situation.Further, the front and back of the overturning of substrate F in order to facilitate understanding, will be placed in the upper surface of the substrate F of mounting surface 2a at first Side is illustrated as black.
As shown in (a) of Fig. 8, configured in transmitting place 200a configured with the first adsorption section 110, in non-transmitting place 200b In the case where having the second adsorption section 160, as shown in (b) of Fig. 8, the sliding block 330 of the first adsorption section 110 slides on guide rail 320 It is mobile, thus it is transferred to the mounting surface 2a for being placed with substrate F.As shown in (c) of Fig. 8,110 sorbing substrate F of the first adsorption section, It is that transmitting place 200a is transferred from mounting surface 2a to turnover mechanism 200 as shown in (d) of Fig. 8.
As shown in (a) of Fig. 9, in turnover mechanism 200, the adsorption plane of the first adsorption section 110 and the second adsorption section 160 Adsorption plane is configured to face each other face across substrate F.In this state, as shown in (b) of Fig. 9, the first adsorption section 110, substrate F And the second integrally half revolution of adsorption section 160.At this point, the directing plate 230 being connect with the first adsorption section 110, connecting plate 240 And connecting elements 250 rotates together with the first adsorption section 110.In the same manner as it, about the second adsorption section 160, with second Directing plate 231, connecting plate 241 and the connecting elements 251 that adsorption section 160 connects also are rotated with the second adsorption section 160 together. The position of the first adsorption section 110 and the second adsorption section 160 is exchanged as a result,.Then, the substrate F based on the first adsorption section 110 is released Absorption, again be located at transmitting place 200a 160 sorbing substrate F of the second adsorption section.
As shown in (c) of Fig. 9, second adsorption section 160 is transferred to mounting surface 2a using conveying mechanism 300.By substrate F It is placed in after mounting surface 2a, as shown in (d) of Fig. 9, the second adsorption section 160 is back to turnover mechanism 200 and in other words transfers Position 200a.
In addition, in the above description, the substrate F for that will be placed in mounting surface 2a is transferred, is overturn and again to mounting The case where face 2a is transferred is illustrated, but in (d) of (a) of Fig. 8 and Fig. 9, and the position of mounting substrate F can not also Together.For example, it can be the routes substrate F that will be sent into from disconnecting device overturning and conveyed towards other devices.
[movement of substrate turnover device]
Next, being illustrated to the movement of substrate turnover device 1.Figure 10 is the structure for indicating substrate turnover device 1 Block diagram.As shown in Figure 10, substrate turnover device 1 has substrate-placing portion 2, pressure assigning unit 3, the suction of the first adsorption section 110, second Attached portion 160, cylinder 140, turnover mechanism 200 and conveying mechanism 300 are also equipped with driving flow rate regulating valve 10, absorption stream Amount adjustment valve 20, input unit 30, test section 40, motor 50 and control unit 60.
Input unit 30 receives the quantity for the substrate F that substrate turnover device 1 is transferred.Test section 40 detects substrate turnover device Position when 1 adsorption section 100 approaches and separates relative to substrate F.Pass through conveying mechanism alternatively, it is also possible to be configured to detection The position of substrate F during 300 transfer substrate F.Test section 40 is such as being able to use sensor, photographic device.Motor 50 driving conveying mechanisms 300.
The memories such as arithmetic processing circuits, ROM, RAM, hard disk such as including CPU of control unit 60.Control unit 60 is according to being stored in The program of memory controls each section.
In addition, substrate turnover device 1 has driving flow rate regulating valve 10 and absorption flow rate regulating valve 20.Driving is used Flow rate regulating valve 10 is the valve that the switching of negative pressure and positive pressure is carried out relative to cylinder 140.Driving flow rate regulating valve 10 is set to The interconnecting piece 145 being arranged in the main body 141 of cylinder 140 is so-called governor.Absorption flow rate regulating valve 20 be relative to Adsorption section 100 carries out the valve of the switching of negative pressure and positive pressure.Absorption flow rate regulating valve 20 is more set on being formed by with plate 121 The piping (not shown) that a lesser hole 122 connects.
Figure 11 is the flow chart for indicating the movement of substrate turnover device 1 involved in embodiment.The control is by Figure 10 institute The control unit 60 shown executes.In addition, in the flow chart of Figure 11, the state of the substrate turnover device 1 when " beginning " is the first suction The adsorption plane in attached portion 110 and the adsorption plane of the second adsorption section 160 face each other the state of configuration, and indicate in (a) of Fig. 8. In addition, control unit 60 can also make pressure assigning unit 3 assign negative pressure to substrate-placing portion 2.In this case, substrate F is carried by substrate The absorption of portion 2 is set, therefore during being adsorbed by the first adsorption section 110, substrate F will not deviate from the position of mounting.
In step s 11, control unit 60 drives motor 50, makes conveying mechanism 300 that first adsorption section 110 is transferred to load Set face 2a.The movement of step S11 is shown in (b) of Fig. 8.
In step s 12,110 sorbing substrate F of the first adsorption section.At this point, being based on air voltage source to assign to each cylinder 140 Positive pressure, control unit 60 make driving flow rate regulating valve 10 switch.The adsorption plate 120 of the first adsorption section 110 deforms established practice as a result, The arc-shaped of fixed curvature.In this state, make the first adsorption section 110 close to substrate F.Control unit 60 assigns each cylinder 140 Negative pressure based on air voltage source, therefore switch driving flow rate regulating valve 10.As a result, the adsorption plate 120 of the first adsorption section 110 with Substrate F overlapping.The movement is shown in (a) of Fig. 4.
When being overlapped the first adsorption section 110 on substrate F, control unit 60 assigns pressure assigning unit 3 to substrate-placing portion 2 Positive pressure.Alternatively, can also make to press in the case where control unit 60 makes pressure assigning unit 3 assign negative pressure to substrate-placing portion 2 The control of the releasing negative pressure of power assigning unit 3.Substrate F is not at the state adsorbed with substrate-placing portion 2 as a result, therefore is easy from base Plate mounting portion 2 separates.In addition, control unit 60 assigns the negative pressure based on air voltage source to the first adsorption section 110, therefore make absorption stream Amount adjustment valve 20 switches.First adsorption section, 110 sorbing substrate F as a result,.The situation is shown in (b) of Fig. 4 and (c) of Fig. 8 Out.
In step s 13, control unit 60 drives motor 50, is transferred to conveying mechanism 300 by the first adsorption section 110 and turns over Rotation mechanism 200 is transmitting place 200a.The movement of step S13 is shown in (d) of Fig. 8 and (a) of Fig. 9.
In step S14, control unit 60 makes turnover mechanism 200 overturn substrate F.At this point, the first adsorption section 110 and second is inhaled Attached portion 160 and substrate F rotates integrally half cycle together.Step S14 is shown in (b) of Fig. 9.
In addition, control unit 60 makes 160 sorbing substrate F of the second adsorption section in step S14.Control unit 60 makes absorption stream Negative pressure based on air voltage source is switched to the second adsorption section 160 from the first adsorption section 110 by amount adjustment valve 20.
In step S15, control unit 60 drives motor 50, makes conveying mechanism 300 that second adsorption section 160 is transferred to load Set face 2a.The situation is shown in (c) of Fig. 9.At this point, control unit 60 assigns the positive pressure based on air voltage source to each cylinder 140, because This switches driving flow rate regulating valve 10.The adsorption plate 120 of the second adsorption section 160 is deformed into the circle of defined curvature as a result, Arcuation.The situation is shown in (c) of Fig. 4.
In step s 16, control unit 60 assigns the negative pressure based on air voltage source to each cylinder 140, therefore makes driving flow Valve 10 is adjusted to switch.Substrate F is placed in substrate-placing portion 2 as a result,.The situation is shown in (a)~(c) of Fig. 5, (d) of Fig. 9 Out.
In step S17, judge whether the overturning for continuing substrate F.In the case where the substrate F not overturn, base The overturning of plate F terminates.In the case where continuing the overturning of substrate F, step S11~S16 is repeated.
The effect > of < embodiment
According to embodiment, effect below is realized.
As shown in (a) of Fig. 3, in plate 121 included by adsorption section 100, multiple plates 102 arrange along the x axis.This When, multiple plates 123 are arranged in bamboo curtain splint shape, can fold each plate 123.Therefore, defined by being moved to each plate 123 In other words position approaches and is separated relative to substrate F, thus, it is possible to adsorption section 100 is deformed into round and smooth arc-shaped.
In addition, substrate turnover device 1 is equipped with the pedestal 124 for foring many micro holes.Therefore, it is assigned to adsorption element 125 The air pressure given is transmitted by these many holes to adsorption element 125, is spread to the whole face of adsorption element 125.Therefore, structure is adsorbed Part 125 is that adsorption section 100 can press sorbing substrate F with uniform air.
As shown in (c) of (a)~Fig. 5 of Fig. 4, adsorption section 100 is from central portion towards both ends successively close to substrate F.By This, is when adsorption section 100 is Chong Die with substrate F, what the air being clipped between adsorption section 100 and substrate F was abutted from adsorption section 100 It drives out of at the both ends for being partially toward substrate F.Therefore, air is not generated between substrate F and adsorption section 100 to stockpile.As a result, Fold is not generated in substrate F, substrate F can be swimmingly conveyed with good state.
In addition, substrate F is successively approached from central portion towards both ends when substrate F is transferred and is placed in mounting surface 2a Substrate-placing portion 2, substrate F are Chong Die with substrate-placing portion 2.At this point, can be not accompanied between substrate F and substrate-placing portion 2 The mode of air loads substrate F in substrate-placing portion 2.Therefore, air is not generated between substrate F and substrate-placing portion 2 to deposit Product.Fold is not generated on substrate F as a result, substrate F can be placed in mounting surface 2a with good state.Further, even if In the case where having fold on substrate F, can also be loaded again with the state for not generating fold on substrate F.
As shown in (a) of Fig. 3, the first limiter 131 for being set to each cylinder 140 is set as, first limiter 131 and base The distance between plate F successively becomes larger from region 10E to region 120A and from region 10E to region 10I.As a result, when to each gas When cylinder 140 assigns positive pressure, by the limitation of first limiter 131, each region can be made to be displaced so that between substrate F away from Become larger from from the central portion of substrate F towards both ends.Thereby, it is possible to be deformed into adsorption section 100 from both ends towards central portion And the substantially arc-shaped bloated to the side substrate F.Therefore, in sorbing substrate F, can from central portion towards both ends successively with base Plate F overlapping.
In addition, being equipped with second limiter 132 in each cylinder 140.As a result, when adsorption section 100 is separated relative to substrate F, The inclination in each region of adsorption section 100 can be adjusted.Therefore, curvature as defined in the shape of adsorption section 100 capable of being set as Arc-shaped.As a result, can be Chong Die with substrate F by adsorption section 100 in a manner of making substrate F not generate fold.In addition, can Substrate F is placed in mounting surface 2a with good state.
As shown in Figure 1, the only bearing with the transmitting place 200a of turnover mechanism 200 of the lift component 310 of conveying mechanism 300 Plate 220 connects.Therefore, the first adsorption section 110 or the second adsorption section 160 can selectively be transferred.Therefore, adsorption section 100 Body also doubles as transferring, and can simplify device.
As shown in (d) of (a)~Fig. 9 of Fig. 8, the overturning with progress substrate F simultaneously changes the absorption of sorbing substrate F Portion 100.For example, without so that substrate F is temporally shifted to other positions after overturning substrate F and utilize other adsorption sections into Row adsorbs such compound action, therefore can be carried out efficiently the overturning of substrate F.In addition, due to the position for overturning substrate F It is identical as the position that adsorption section 100 is exchanged, it can be realized the saving spatialization of device.
In addition, move back and forth adsorption section 100 between transmitting place 200a and mounting surface 2a in conveying mechanism 300 In the case that mode is transferred, transfer route is one, therefore is capable of the enlargement of anti-locking apparatus.
As shown in fig. 7, turnover mechanism 200 only makes the rotation of directing plate 230,231 that can exchange the first adsorption section 110 and the The position of two adsorption sections 160.That is, in the adsorption section 100 positioned at transmitting place 200a in the first adsorption section 110 and the second adsorption section Between 160 in alternate situation, the support plate positioned at transmitting place 200a is also the beginning being divided into two-part support plate 220 Identical support plate eventually.Thus, even if first adsorption section 110 and the second adsorption section 160 are integrally revolved using turnover mechanism 200 Turn half cycle and exchange the adsorption section 100 for being located at transmitting place 200a, does not also need to re-start conveying mechanism 300 and absorption every time The connection in portion 100.In other words, directing plate 230,231 and adsorption section 100 are exchanged only with respect to support plate 220, therefore It can be carried out efficiently the overturning of substrate F.
The modification > of < embodiment
(1) structure of turnover mechanism
(a) of Figure 12 is the main view for indicating a part of structure of substrate turnover device involved in embodiment.Figure 12 (b) is the main view for indicating a part of structure of substrate turnover device involved in the modification 1 of embodiment.? This, main view refers to the figure seen from X-axis positive side.In the substrate turnover device 1 involved in above-mentioned embodiment, such as Figure 12 (a) shown in, support rails 210 and 211 are distinguished on support plate 220 and 221, directing plate 230 and 231 is configured to Half revolution in the state of respectively being connect with adsorption section 100.
In contrast, in the modification of embodiment, be configured to be separately connected relative to adsorption section 100 guide rail 210 with And 211.Specifically, as shown in (b) of Figure 12, in the side transmitting place 200a, directing plate 230 is installed in support plate 220.Guide rail 210 connect via connecting plate 240 with adsorption section 100.The rotating member 232 of directing plate 230 is embedded in the slot 212 of guide rail 210. It is also identical in non-transmitting place 200b.According to this structure, it is connected in the first adsorption section 110 via connecting plate 240 In the case where having guide rail 210, rotated by guide rail 210 along directing plate 230 positioned at the first adsorption section 110 of transmitting place 200a And it rotates.
It is inhaled in this way, turnover mechanism 200 only makes the rotation of guide rail 210 and 211 that can exchange the first adsorption section 110 and second The position in attached portion 160.Therefore, guide rail 210,211 and adsorption section 100 are exchanged only with respect to support plate 220, therefore can Efficiently carry out the overturning of substrate F.
(2) has the case where switching valve
In the substrate turnover device 1 involved in above-mentioned embodiment, when driving each cylinder 140, pass through driving The movement of each piston rod 142 is controlled with flow rate regulating valve 10.Here, for example, the mobile ratio of the piston rod 142 in arbitrary region In the case that the region that regulation early, near the region connects early reaches substrate F, adsorption section 100 is not deformed into the side substrate F drum Such arc-shaped out, but it is deformed into shape as wave.In this case, it can not drive out of and be clipped in substrate F and inhale Air between attached portion 100 generates air between substrate F and adsorption section 100 and stockpiles, and can become and generate fold in substrate F The reason of.
In this regard, substrate turnover device 1 involved in the modification of embodiment is also equipped with switching valve (not shown).By cutting Valve is changed, when assigning air pressure to adjacent cylinder 140, the switch of switching valve is switched over, is assigned to next cylinder 140 Air pressure.
Specifically, in the case where adsorption section 100 is moved upward, positive pressure is endowed in each cylinder 140.At this point, simultaneously Non- to assign positive pressure together to each cylinder 140, the both ends direction from adsorption section 100 is central successively to the cylinder 140 in adjacent region Assign positive pressure.Make adsorption section 100 downwards move in the case where, from the central portion of adsorption section 100 towards both ends successively to The cylinder 140 in adjacent region assigns negative pressure.
In this way, the opportunity for assigning air pressure to cylinder 140 can be controlled by the way that switching valve is arranged in substrate turnover device 1. Thus, the sequence that each region of adsorption section 100 is close and isolated relative to substrate F does not generate change, is deformed into defined song The arc-shaped of rate.Therefore, adsorption section 100 is be overlapped in a manner of not generating air between substrate F and stockpile, being capable of sorbing substrate F.Fold is not generated on substrate F as a result,.
(3) first limiter and second limiter are set as variable situation
In the substrate turnover device 1 involved in embodiment, first limiter 131 can also be with structure at a distance from substrate F As variable.For example, it is also possible to first limiter 131 is embedded in supporting part 150 by screw, by the embedded quantity of the screw, Adjust the distance between first limiter 131 and substrate F.In addition, about second limiter 132 at a distance from mobile member 133, Such as multiple screw holes are set in frame 4 in advance, screw hole appropriate is selected, as long as being configured to install second limiter in frame 4 132, second limiter 132 can be changed at a distance from mobile member 133.
It is effective in the case where the change of the defined curvature of adsorption section 100 to be made as long as constituting as described above.? Under such circumstances, as long as using screw adjustment first limiter 131 at a distance from substrate F and the position of second limiter 132 It sets, does not need to exchange first limiter 131 and second limiter 132.
(4) the case where driving portion being set as motor
In substrate turnover device 1 involved in embodiment, as the driving portion driven to adsorption section 100, also can It enough substitutes cylinder 140 and uses motor.In this case, motor can not stop in the state of maintaining driving force.Therefore, it is driving In the case that portion uses motor, need to generate pressure to elastic components such as motor combination springs.
Even if in contrast, cylinder 140 involved in embodiment passes through the first limit in the state of being endowed positive pressure Device 131 limits movement, can also stop in the state of maintaining driving force (pressure).Even if in addition, being assigned to cylinder 140 In the case where negative pressure, when each region of adsorption section 100 is contacted with substrate F, also maintains driving force (pressure) and stop.In other words It says, each region can be swimmingly positioned at disengaged position and abutted position by cylinder 140, in abutted position i.e. by first limiter In the state of 131 limitations, each region is suitably pressed on into substrate F with defined pressure.
Thus, compared with motor, each region can be swimmingly positioned at disengaged position and abutted position by cylinder 140, energy Adsorb adsorption section 100 effectively to substrate F.

Claims (7)

1. a kind of substrate turnover device, overturns substrate, which is characterized in that
The substrate turnover device has:
First adsorption section；
Second adsorption section；
Turnover mechanism, in the state that the adsorption plane of the adsorption plane of first adsorption section Yu second adsorption section is mutually opposed Make first adsorption section and second adsorption section integrally half revolution；And
Conveying mechanism, selectivity transfer the quilt in the turnover mechanism in first adsorption section and second adsorption section It is positioned at the adsorption section of transmitting place.
2. substrate turnover device according to claim 1, which is characterized in that
The turnover mechanism has:
Guide rail makes first adsorption section and second adsorption section integrally half revolution；And
Directing plate is separately connected by the rail guidance and with first adsorption section and second adsorption section,
The guide rail is separately connected via the directing plate and first adsorption section and second adsorption section,
In the state that the adsorption plane of the adsorption plane of first adsorption section Yu second adsorption section is mutually opposed, the guide rail As circle, the directing plate can be rotated along the guide rail.
3. substrate turnover device according to claim 2, which is characterized in that
The turnover mechanism is also equipped with the support plate supported to the guide rail,
The directing plate is connect via the guide rail with the support plate,
The conveying mechanism and the support plate link.
4. substrate turnover device according to claim 3, which is characterized in that
The guide rail, the directing plate and the support plate are divided into two parts respectively,
It is divided into the two-part guide rail to be combined and becomes circle, and so that the guide rail of a side is configured at the transfer The mode of position side is divided into the two-part support plate bearing respectively,
It is divided into the two-part directing plate to become the circular guide rail relative to being combined, in the transfer position The mode that setting can mutually rotate between the position far from the transmitting place combines,
First adsorption section is connect with the two-part directing plate is divided into respectively with second adsorption section,
The conveying mechanism only with the support plate for being configured at the transmitting place side that is divided into the two-part support plate Connection, selectivity transfer are located at the transmitting place side and connect via the guide rail and the directing plate with the support plate Adsorption section.
5. substrate turnover device according to claim 1, which is characterized in that
The turnover mechanism has:
Guide rail is separately connected with first adsorption section and second adsorption section；And
Directing plate by the rail guidance, and makes first adsorption section and second adsorption section integrally half revolution,
The directing plate is separately connected via the guide rail and first adsorption section and second adsorption section,
In the state that the adsorption plane of the adsorption plane of first adsorption section Yu second adsorption section is mutually opposed, the guide rail As circle, the directing plate can relatively be rotated along the guide rail.
6. substrate turnover device according to claim 5, which is characterized in that
The turnover mechanism is also equipped with the support plate supported to the directing plate,
The guide rail is connect via the directing plate with the support plate,
The conveying mechanism and the support plate link.
7. substrate turnover device according to claim 6, which is characterized in that
The guide rail, the directing plate and the support plate are divided into two parts respectively,
It is divided into the two-part directing plate to be divided respectively in such a way that the directing plate of a side is configured at the transmitting place side It is cut into the two-part support plate bearing,
It is divided into the two-part guide rail to be combined and becomes circle, relative to the directing plate in the transmitting place The mode that can mutually rotate between the position far from the transmitting place combines,
First adsorption section is connect with the two-part guide rail is divided into respectively with second adsorption section,
The conveying mechanism only with the support plate for being configured at the transmitting place side that is divided into the two-part support plate Connection, selectivity transfer are located at the transmitting place side and connect via the directing plate and the guide rail with the support plate Adsorption section.
CN201910042829.0A 2018-01-31 2019-01-17 Substrate turnover device Pending CN110092172A (en)

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Application publication date: 20190806