CN201984258U - Liquid crystal base plate adhesion system - Google Patents

Liquid crystal base plate adhesion system Download PDF

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Publication number
CN201984258U
CN201984258U CN2011200401367U CN201120040136U CN201984258U CN 201984258 U CN201984258 U CN 201984258U CN 2011200401367 U CN2011200401367 U CN 2011200401367U CN 201120040136 U CN201120040136 U CN 201120040136U CN 201984258 U CN201984258 U CN 201984258U
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CN
China
Prior art keywords
mentioned
substrate
base plate
chamber
roller conveyor
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Expired - Fee Related
Application number
CN2011200401367U
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Chinese (zh)
Inventor
市村久
海津拓哉
中山幸德
石田刚
武田纮明
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Hitachi Ltd
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Hitachi Plant Technologies Ltd
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Publication date
Priority claimed from JP2010037597A external-priority patent/JP5495845B2/en
Priority claimed from JP2010078630A external-priority patent/JP5512349B2/en
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
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Publication of CN201984258U publication Critical patent/CN201984258U/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G02F1/13415—Drop filling process

Abstract

The utility model discloses a liquid crystal base plate adhesion system. The adhesion system adopting a simple layout structure aims to shorten the manufacture time of a liquid crystal panel and restrain the dust generation, is serially configured through a first transportation line (5) formed by a rotary drum conveyor for transporting lower base plates, a paste coating machine (7) used for coating encapsulant on the first transportation line (5), an electrode forming and short circuit used coating machine (8) configured on the lower reach side of the paste coating machine (7), a liquid crystal dripping device (9) enabling the liquid crystal material to drip, and a first checking room (10) for checking the state of the lower base plates (1). A second transportation line (6) formed by a rotary drum conveyor for transporting upper base plates (2), a base plate reversing device performing the base plate reversal in a fan-shaped manner and used for reversing the base plates at the terminal part of the second transportation line are formed in parallel on the first transportation line (5); a third transportation line (20) formed by a rotary drum conveyor and connected with the first transportation line (5) is arranged at a conflux point of the first transportation line (5) and the second transportation line (6); and a transmission room (12), a base plate adhesion room (15), an ultraviolet ray irradiation room (17) and a face plate checking room (18) are serially configured on the third transportation line (20).

Description

The crystal liquid substrate bonding system
Technical field
The utility model relates to the base plate bonding system, especially relates to seeking shortening to the bonding time of finishing, and has reduced the base plate bonding system of delivering to substrate by the robot in the system as far as possible.
Background technology
In the manufacturing of display panels, there is following operation, described operation is, in advance with under the liquid crystal drop to a side substrate, with the two sheet glass substrates that are provided with transparency electrode, the film transistor matrix extremely approaching interval about with a few μ m, bonding agent (the following sealant that also claims) bonding (back is called liquid crystal panel with the substrate after bonding) with the circumference that is arranged on substrate is enclosed in liquid crystal in the space that forms with this.
In the sealing of this liquid crystal, there is following adhesive bonding method etc., described adhesive bonding method is, with under the liquid crystal drop to the infrabasal plate of sealant being enclosed in mode that inlet is not set of depicting pattern as, in vacuum chamber, to form TFT (Thin Film Transistor: thin film transistor (TFT)) or the formation of the upper substrate of chromatic filter etc. the face of TFT or chromatic filter etc. dispose opposite to each other, make substrate up and down approaching.In TOHKEMY 2001-305563 communique, to disclose in order being transported in respect to this vacuum chamber and to have transported substrate, the preparation room has been set, made to be the environment identical in the vacuum chamber, carried out the discrepancy of substrate with the preparation room.In addition, in TOHKEMY 2001-305563 communique, make upper substrate and infrabasal plate and be positioned in and transport on the anchor clamps, on roller conveyor, transport, respectively the structure of delivering to upper table and lower table from the preparation room to bonding chamber.In this mode, with upper and lower base plate when transporting anchor clamps and carry, by mechanical arm to transporting the anchor clamps setting.In addition, make substrate, rise infrabasal plate by transporting anchor clamps to the delivering also after upper substrate has been remained on upper table of worktable, make transport anchor clamps and keep out of the way the preparation room after, be arranged on the structure on the lower table.
In addition, in TOHKEMY 2003-015101 communique, following system is disclosed, this system loads the chamber with infrabasal plate from first and transports to spacer dispersion equipment, closed material coating unit, injection equipment, the first preparation collating unit, assembly unit, with upper substrate from second load the chamber, from the second preparation alignment chamber, transport from the preparation room to above-mentioned assembly unit, with two substrates after assembly unit is bonding, substrate is sent to discharge mechanism through closed material curing system, annealing device, substrate cut.
In above-mentioned TOHKEMY 2001-305563 communique, because in the crystal liquid substrate package system, when the discrepancy of substrate is used for bonding chamber with base plate bonding, making preparation room and vacuum chamber interior is identical environment, and become two bonding substrates are transported in the preparation room of side's side, if the bonding end of two substrates, the then formation of discharging from the preparation room that is arranged on the opposing party, so, the big area that is provided with that needs that the configuration of device increases.In addition, because need make each preparation room and bonding chamber become vacuum state, so, need configuration to be used for these device, want spended time by the end of becoming vacuum state, there is boundary in the shortening single products aspect the production time.In addition, the relation that does not have record operation preceding fully with it.Have again, transport anchor clamps because upper and lower base plate uses to transporting of bonding chamber from the preparation room, so, also exist substrate to want the problem of spended time to transporting delivering of anchor clamps etc.
In addition, only put down in writing in the TOHKEMY 2003-015101 communique between each device and use the mobile member moving substrate, showed no sign of record and disclose and what kind of transports member with transport substrate, situation about delivering to each device.
But, upper substrate is being transported under the situation of bonder, exist to make TFT or chromatic filter form the situation that faces up and use roller conveyor to transport.Under this situation,, upper substrate need be reversed when bonder is transported into.
The substrate that discloses the packaging electronic part in the Japanese kokai publication hei 6-48554 communique keeps, and the device that reverses of Rotate 180 degree.In this device, become the central portion that makes the framework that has kept substrate and rotate the structure of reversing.
In addition, in TOHKEMY 2006-227181 communique, disclose to shining UV, with the hardening seal between the substrate and with the counter-rotating of the panel after bonding, the inversion set that irradiation UV light is used.
In above-mentioned Japanese kokai publication hei 6-48554 communique, become and clip substrate with framework and keep, make the central portion Rotate 180 degree of this framework, with the structure of substrate counter-rotating.
In this TOHKEMY 2006-227181 communique, disclosing is to make the liquid crystal panel counter-rotating after bonding under the state that sealant does not have to harden, and the situation of under the state that has pushed between the two panels, reversing.In this inverting method, also same with patent documentation 1, use the method that makes substrate 180 degree rotations aloft.Therefore, if with this mode substrate is reversed, then upset ambient air, drop on the dust that transports on the line etc. and fly up, this dust enters in the liquid crystal panel, becomes that action is not good, the essential factor of image quality reduction.
The utility model content
The purpose of this utility model is, realization is in order to seek the miniaturization of entire system, deliver the position and reduce the substrate of delivering by mechanical arm as far as possible, that can carry out accurately that roller conveyor carries out transports, and the substrate that transports is positioned in respectively on the worktable that is arranged on the device, sought bit time, upper and lower base plate system to the shortening that is transported into the time that is spent of bonding chamber.Have, other purpose of the present utility model is again, a kind of substrate inversion set that flies up of when making upper substrate counter-rotating dust etc. and liquid crystal panel bonding system that has used it thereof of as far as possible having suppressed is provided.
To first transport line by what roller conveyor that transports infrabasal plate or band conveyor constituted, transport the paste coating machine that applies sealant on the line to above-mentioned first, the short circuit that is configured in the downstream of above-mentioned paste coating machine forms with electrode uses coating machine, the liquid crystal dripping device that liquid crystal material is dripped, check the first testing fixture arranged in series of the state of infrabasal plate, transport to form in parallel on the line first and second transport line by what roller conveyor that transports upper substrate or band conveyor constituted, transport the line and second junction of two streams of transporting line above-mentioned first, be provided with and first transport that line is connected the 3rd transport line by what roller conveyor or band conveyor constituted, transport the above-mentioned the 3rd and in series dispose transfer chamber on the line, bonder, the UV exposure cell, the panel inspection chamber.
In addition, make the structure that substrate up and down roughly is transported into simultaneously bonding chamber, on roller conveyor or band conveyor, in the process of transporting, proofread and correct the inclination of infrabasal plate.
The coating unit that is used for the sealant of base plate bonding from coating, roughly in series dispose bonder, hardening seal device (UV irradiation unit) etc., and at infrabasal plate, about using in the transporting of liquid crystal panel after bonding the finishing respectively the roller conveyor of type of drive transport, can be in the inclination of the correction substrate nearby of each device, and upper and lower base plate can be transported into bonder simultaneously, bonding chamber, therefore, can significantly shorten the Production Time of liquid crystal panel, and owing to nearby carry out the slant correction of substrate at device, so, can improve coating, bonding precision.
Have again, in addition, the upper substrate inversion set that is arranged on the terminal part side of the roller conveyor that transports upper substrate comprises possessing from the state of roller conveyor to make progress, receive the step rate of a plurality of fingers that up are transported to the upper substrate on the stand, with possess a plurality of vacuum suction pads in the finger, make step rate at one end side have the parts of moving up and down, distolaterally has a portion of moving horizontally at another, make by the above-mentioned parts that move up and down and move up and down with post being arranged on moving on the stand, the portion that moves horizontally property along the line guide moves in the horizontal direction, with the structure of substrate counter-rotating.
In addition, make upper substrate up remained on and transport on the pallet, on roller conveyor, transport, on the upper substrate inversion set, the connect mechanism of above-mentioned pallet and the linking part that is provided with on the pivot arm of the reversing device that constitutes the upper substrate inversion set are linked, make pivot arm half rotation, make the structure of transporting pallet and being reversed by the upper substrate that it keeps.
By making said structure, when counter-rotating, substrate is not described circular arc 180 degree reversally, but an end that makes substrate is a plumbness, the counter-rotating of the action that the other end is moved horizontally, therefore, the area of the motion track of describing in the time of can making the substrate counter-rotating is for minimum, the area minimizing of splashing of the air that produces because of substrate counter-rotating can reduce the generation of dust as far as possible.In addition, maximization that can restraining device.That is, use in the system of this substrate inversion set, can prevent that dust from dropping to other device, the situation that the precision of bonded liquid crystal panel reduces has been sought the miniaturization of device.
Description of drawings
Fig. 1 is the vertical view of expression based on the configured in one piece of crystal liquid substrate bonding system of the present utility model.
Fig. 2 is the figure of schematic configuration of the concrete example of the indoor upper table of the base plate bonding in the presentation graphs 1.
Fig. 3 is the summary construction diagram that first of presentation graphs 1 transports a concrete example of the configuration of the detecting sensor on the line and action thereof.
Fig. 4 is the structural drawing based on an example of the structure of substrate inversion set of the present utility model in the presentation graphs 1.
Fig. 5 is another the routine structural drawing based on the structure of substrate inversion set of the present utility model in the presentation graphs 1.
Fig. 6 is the longitudinal section that the past process chamber of the base plate bonding chamber in the presentation graphs 1 is transported into substrate and transports the action of substrate to after-processing chamber.
Fig. 7 is expression other routine summary construction diagram based on the base plate bonding chamber of crystal liquid substrate bonding system of the present utility model.
Embodiment
Below, with reference to the accompanying drawings, an embodiment of liquid crystal panel package system of the present utility model is described.
Fig. 1 is the vertical view of the configured in one piece of expression liquid crystal panel package system of the present utility model, the 1st, infrabasal plate, the 2nd, upper substrate, the 3rd, substrate is transported into robot, the 4th, arrange agencie, 5 is first to transport line (main line), 6 is second to transport line (by-pass), the 7th, paste coating machine (sealing divider), the 8th, short circuit forms with electrode and uses coating machine, and the 9th, liquid crystal dripping device, 10 is first inspection chambers, the 11st, the substrate inversion set, the 12nd, transfer chamber, the 13rd, mechanical arm, the 14th, pre-treatment chamber, the 15th, base plate bonding chamber (vacuum chamber), the 16th, after-processing chamber, the 17th, ultraviolet exposure cell, 18 is second inspection chamber (panel inspection chambers), the 19th, adhesive base plate (liquid crystal panel), 20 is the 3rd to transport line.
In the figure, be provided with and transport first of infrabasal plate 1 and transport line (main line) 5 and transport and formed TFT (Thin Film Transistor: thin film transistor (TFT)) second of etc. upper substrate 2 transport line (by-pass) 6.Transporting first of the upper substrate 2 that has been cleaned and infrabasal plate 1 transports line 5 and second and transports line 6 and be made of roller conveyor or band conveyor.Roller conveyor or band conveyor with respect to the substrate moving direction in the configuration of ceding territory of left and right directions branch, with each can by separately driving mechanism respectively the mode of drive controlling constitute.Below, describe according to situation about constituting by roller conveyor.Upper and lower base plate is transported respectively on roller conveyor.
Transporting substrate that infrabasal plate 1 that nearby being provided with of line 5 will clean is transported into native system first is transported into robot 3 and is used for being transported into the arrange agencie 4 that robot 3 arranges infrabasal plate 1 from substrate.Infrabasal plate 1 transports line 5 from arrange agencie 4 to first and delivers, infrabasal plate 1 first transport on the line 5 with adhesive surface be on, move in the direction of arrow.First transport in the way of line 5 the paste coating machine (sealing divider) 7 that sealant (bonding agent) is applied into the ring-type of sealing on infrabasal plate 1 is being set at this.In series disposing discontinuously with this paste coating machine 7, the short circuit of coated with conductive paste forms with coating machine 8 with electrode.
Have again, form downstream with electrode, disposing the liquid crystal drop of the desirable amount liquid crystal dripping device 9 in the ring of the sealant that applies as described above down with coating machine 8 in this short circuit.Disposing first testing fixture 10 of the state of checking the sealant that applies, the liquid crystal material that drips etc. in the downstream of this liquid crystal dripping device 9.The infrabasal plate of being checked by first testing fixture 10 1 is transported line 20 and delivers to being arranged on the 3rd between the pre-treatment chamber 14 and second inspection chamber 18 by the mechanical arm 13 that is arranged on transfer chamber 12.The 3rd transports line 20 is also formed by roller conveyor.At first, infrabasal plate 1 is transported line 20 by the 3rd and is transported in the pre-treatment chamber 14 that substrate is transported into side.Have again, transport upper substrate 2 counter-rotating in substrate inversion set 11 is shown of transporting on the line 6, then, be transported in the pre-treatment chamber 14 by the mechanical arm 13 that is arranged on transfer chamber 12 second.Relevant this substrate inversion set 11 will be set forth details in the back.
Fig. 6 be expression explanation with upper and lower base plate in the past process chamber 14 be transported into base plate bonding chamber 15 carry out bonding, the figure of the state that bonding substrate is transported to after-processing chamber 16.
Mechanical arm 62 that keeps upper substrate 2 and be transported into base plate bonding chamber (vacuum chamber) 15 and the roller conveyor 61 that transports infrabasal plate 1 are set in pre-treatment chamber 14.In addition, in this pre-treatment chamber 14 the conveyor telescoping mechanism 60 that roller conveyor 61 is stretched is set, to open as if the family of power and influence 69 who is arranged between pre-treatment chamber 14 and the base plate bonding chamber 15, then roller conveyor 61 can be by this conveyor telescoping mechanism 60, crosses the family of power and influence 69 and constitutes with roller conveyor 66 ways of connecting of base plate bonding chamber 15.
If two substrates 1,2 is transported into pre-treatment chamber 14 up and down, the substrate that then is arranged on pre-treatment chamber 14 is transported into the family of power and influence of the inlet of side (not shown go out) and is closed, in the pre-treatment chamber 14 by the not shown vacuum pump exhaust that goes out, until reaching specified vacuum degree (about 150Torr, calling the partial vacuum in the following text).If become the state of partial vacuum in the pre-treatment chamber 14, then and the family of power and influence between the base plate bonding chamber 15 69 be opened, roller conveyor 61 stretches out to base plate bonding chamber 15 sides because of conveyor telescoping mechanism 60, is connected with the roller conveyor 66 of base plate bonding chamber 15.Infrabasal plate 1 is transported in the base plate bonding chamber 15 on this roller conveyor 61,66, and in addition, upper substrate 2 is transported in the base plate bonding chamber 15 by mechanical arm 62.At this moment, become the partial vacuum state in the base plate bonding chamber 15.In this pre-treatment chamber 14, be provided with and receive infrabasal plate 1 and the 3rd transport the roller conveyor 61 of line 20 and be used to the mechanical arm 62 that receives upper substrate 2 and deliver to the upper table (increased pressure board) 21 of base plate bonding chamber 15 to becoming of transporting of the lower table 65 of base plate bonding chamber 15.In addition, the details of the reception of the substrate in the base plate bonding chamber 15 1,2 will be set forth in the back.
The end of delivering as if the two substrates 1,2 in the base plate bonding chamber 15, these upper and lower base plates 1,2 are maintained at it respectively up and down on two worktable 21,65, then in the past the roller conveyor 61 that stretches out of process chamber 14 is retracted in the pre-treatment chamber 14, and the above-mentioned family of power and influence 69 is closed.After this, be deflated in the base plate bonding chamber 15, until becoming high vacuum (about 5 * 10 -3Torr).After this, one side is carried out the contraposition of two substrates 1,2 up and down, and one side descends upper table 21, and execution upper substrate 2 is bonding to infrabasal plate 1.If this bonding end is then returned the partial vacuum in the base plate bonding chamber 15, the family of power and influence 70 between base plate bonding chamber 15 and the after-processing chamber 16 is open.At this moment, after-processing chamber 16 becomes the state of partial vacuum.
In after-processing chamber 16 conveyor telescoping mechanism 68 is set also, if and base plate bonding chamber 15 between the family of power and influence 70 open, then be arranged on these conveyor telescoping mechanism 68 actions of after-processing chamber 16, roller conveyor 67 stretches out from after-processing chamber 16, is connected with the roller conveyor 66 of base plate bonding chamber 15.If (promptly by adhesive base plate that upper and lower base plate 1,2 is bonded, liquid crystal panel) 19 is transported into after-processing chamber 16, then roller conveyor is retracted in the after-processing chamber 16, and the family of power and influence between after-processing chamber 16 and the base plate bonding chamber 15 is closed, and making in the after-processing chamber 16 becomes atmospheric condition.If become atmospheric condition in the after-processing chamber 16, then the family of power and influence between after-processing chamber 16 and the ultraviolet exposure cell 17 (not shown go out) is opened, by the conveyor telescoping mechanism that is arranged on after-processing chamber 16 (not shown go out), be connected with the roller conveyor of ultraviolet exposure cell 17.After this, liquid crystal panel 19 is transported in the ultraviolet exposure cell 17 on this roller conveyor, and here, ultraviolet ray makes hardening seal to the sealant irradiation.If the sclerosis of sealant finishes, then liquid crystal panel 19 is transported on roller conveyor, is transported to second inspection chamber (panel inspection chamber) 18, carries out its inspection.
Like this, make chambers 14～18 is arranged in roughly linearity, in the transporting of substrate, a part is used mechanical arm, but roughly all uses the structure of roller conveyor, therefore, the area that is provided with of device can be suppressed at Min..
Fig. 2 is the figure of schematic configuration of the concrete example of the upper table in the base plate bonding chamber 15 in the presentation graphs 1, this figure (a) expression adhesion pin (adhesive cushion) mode, this figure (b) expression sheet of will adhering has been installed in mode on the upper table face, the 21st, upper table, the 22nd, the adhesive cushion installing plate, the 23rd, adhesion pin (adhesive cushion), the 24th, adhesion parts, the 25th, base plate, the 26th, elastic body, the 27th, pushing pin installing component, the 28th, pushing pin, the 29th, elastomeric element, the 30th, the adhesion sheet, in addition, to the part mark identical symbol corresponding with Fig. 1, the repetitive description thereof will be omitted.In addition, like this, describe mainly as the situation that has adopted adhesion pin mode.
Make based on the upper table 21 of adhesion pin (adhesive cushion) mode shown in Fig. 2 (a) and on the laminated body of base plate 25 and elastic body 26, to be provided with the structure that is installed in a plurality of adhesion pins 23 on the adhesive cushion installing plate 22, adhesion parts 24 are being set at leading sections of these adhesion pins 23.That is, with by using the not shown driving mechanism that goes out that adhesive cushion installing plate 22 is moved up and down, the leading section of each adhesion pin 23 (that is, elastic body 26 following) below upper table 21 is outstanding, and upper substrate 2 mode that keeps of adhering is constituted.Have, this adhesion pin (calling adhesive cushion in the following text) 23 made at its leading section adhesion parts 24 is set again, and portion is provided with the structure of the vacuum suction mouth that vacuum suction uses (not shown go out) in the central.Use this adhesive cushion 23 to receive upper substrate 2 from above-mentioned mechanical arm, and rise to always upper table 21 below, keep upper substrates 2 by adhesive cushion 23 like this.
In addition, upper table 21 is with by the not shown table-driving mechanism that goes out, and the mode that can move up and down constitutes.In addition, in bonding end, with these adhesive cushions 23 from adhesive base plate (liquid crystal panel) 19 (Fig. 1) when peeling off, upper table 21 is being pressed against under the state of this adhesive base plate 19 with table-driving mechanism, one side sprays gas from the vacuum suction mouth of the central portion of adhesive cushion 23 to the face of this adhesive base plate 19, one side in view of the above, can be peeled off adhesion parts 24 by the following lifting adhesive cushion 23 of upper table 21 from adhesive base plate 19.
The upper table 21 based on the mode that the adhesion sheet has been installed shown in Fig. 2 (b) is made following structure, promptly, roughly whole at the base plate 25 of upper table 21 is provided with adhesion sheet 30, and then, stickup face (adsorption plane) from upper table 21 perforations to the sheet 30 of adhering, a plurality of vacuum suction mouths (not shown go out) are set, upper table 21 is dropped to the upper substrate 2 that keeps by previous mechanical arm face near, in view of the above, the vacuum suction that utilization is undertaken by this vacuum suction mouth is drawn to this upper substrate 2 bonding plane and the maintenance of adhering of absorption sheet 30.Generally speaking, though make and become vacuum state in the vacuum chamber, even vacuum suction mechanism is set, vacuum adsorption force is also little, and is inoperative, but, in this concrete example, before receiving upper substrate 2 and keeping this upper substrate 2, owing to be the state of partial vacuum in the vacuum chamber (base plate bonding chamber (Fig. 1)) 15, so, vacuum adsorption force is played a role.
In addition, the bonding plane of adhesion sheet 30 is provided with cancellous concavo-convex as shown in the figure.Having, also can be to use in view of the above, upper substrate 2 to be raised up to the bonding plane of adhesion sheet 30 from a plurality of vacuum suction pads of upper table 21 by adhering sheet 30 and moving up and down in this structure again.
Under the situation of this adhesion sheet mode, for after bonding the finishing of upper and lower base plate 1,2, upper substrate 2 is peeled off from adhesion sheet 30, the pushing pin installing component 27 that possesses the driving mechanism that drives up and down is set.On this pushing pin installing component 27, a plurality of pushing pins 28 are set.In addition, elastomeric element 29 is set,, also can not damages the face of this upper substrate 2 even will push the face that pin 28 presses against upper substrate 2 at the leading section that pushes pin 28.Should push pin 28 to upper substrate 2 pushings by one side, one side rises upper table 21, upper substrate 2 can be peeled off from adhesion sheet 30.
In addition, gas flow path, the hole of gas ejection usefulness are set, in the time will push pin 28 and be pressed to the face of upper substrate 2,, can also easily upper substrate 2 be peeled off from upper table 21 by spraying gas to this face at the central portion of pushing pin 28 and elastomeric element 29.
Return Fig. 1, in base plate bonding chamber 15, upper and lower base plate 1,2 is the bonding and liquid crystal panel 19 that forms as described above, become and peeled off from upper table 21 (Fig. 2), by the state of mounting to the lower table 65 (Fig. 6), this liquid crystal panel 19 is handed on the roller conveyor 66 from this lower table 65, is transported to after-processing chamber 16.If liquid crystal panel is transported into after-processing chamber 16, then the family of power and influence 70 between base plate bonding chamber 15 and the after-processing chamber 16 is closed, and turns back to atmospheric condition in the after-processing chamber 16.
If become atmospheric condition in the after-processing chamber 16, then liquid crystal panel 19 is transported to ultraviolet exposure cell 17, and here, UV light (ultraviolet ray) is to the sealant irradiation, with hardening seal.Liquid crystal panel 19 behind the hardening seal is transported to second inspection chamber (that is, the panel inspection chamber) 18, here is examined.
Though be to make liquid crystal panel 19 by above-mentioned system architecture, but, in the crystal liquid substrate bonding system of this embodiment, because transporting in the line of substrate 1,2, major part is to be undertaken by roller conveyor, so, with comparing in the past by transporting of carrying out of mechanical arm, the possibility that exists the precision of the contraposition of upper and lower base plate 1,2 to reduce.Therefore, be necessary to prevent offset transporting the substrate that produces under the situation about stopping on the road, become with upper and lower base plate 1,2 when each treating apparatus is delivered, do not have the state of offset.Therefore, in this embodiment, upper and lower base plate 1,2 is being delivered nearby the detecting sensor that configuration is used to carry out contraposition to each treating apparatus.
Fig. 3 is the summary construction diagram that first of presentation graphs 1 transports a concrete example of the configuration of the detecting sensor on the line 5 and action thereof, the state that this figure (a) expression substrate (being that example is represented with infrabasal plate 1 here) is transported with normal posture, the state that this figure (b) expression substrate is transported with the state that has rotated, 31a, 31b are cylinders, 32a, 32b are power transmission shafts, 33a, 33b are CD-ROM drive motor, 34a, 34b are the substrate detecting sensors, to the part mark identical symbol corresponding with previous drawings, the repetitive description thereof will be omitted.In addition, other transport in the line (second～the 3rd) certainly also can be equally be modified to normal state with the posture of substrate.
Among this figure, each roller conveyor is configuration cylinder 31a, 31b about it respectively, is connected with the CD-ROM drive motor 33a, the 33b that are used to drive cylinder 31a, 31b about each through power transmission source 32a, 32b.The driving force of CD-ROM drive motor 33a, 33b is transmitted to cylinder 31a, 31b through power transmission source 32a, 32b, and in view of the above, cylinder 31a, 31b are driven in rotation.By under the state that infrabasal plate 1 is positioned on these cylinders 31a, the 31b, rotation drives these cylinders 31a, 31b, and infrabasal plate 1 is transported in the direction of arrow.
First transport on the line 5 at this, disposing the substrate detecting sensor 34a, the 34b that pass through of the right and left portion of detecting infrabasal plate 1 in the direction rectangular (left and right directions) with respect to carriage direction.If the worktable (not shown go out) that infrabasal plate 1 is transported to paste coating machine 7 (Fig. 1) nearby, then first transport the substrate detecting sensor 34a on the line 5, the right and left portion that 34b detects this infrabasal plate 1 by being arranged on this.If about substrate detecting sensor 34a, the 34b of each side in any one detect the limit portion of infrabasal plate 1, the then not shown control member that goes out is controlled, and the CD-ROM drive motor 33a of a detected side or 33b are stopped.When substrate detecting sensor 34a, 34b had detected the front end of each limit portion of infrabasal plate 1 simultaneously, control member was judged to be infrabasal plate 1 and is transported with correct state, CD-ROM drive motor 33a, 33b was added with changing be not rotated driving, transported infrabasal plate 1.
Therefore, if shown in Fig. 3 (b), infrabasal plate 1 is from direct of travel (below too), be rotated counterclockwise direction rotation (inclination) and be transported (promptly, the left lateral side of infrabasal plate 1 is transported slow than the right portion side), then (from direct of travel) substrate detecting sensor 34a, 34b of being configured in left and right sides do not detect infrabasal plate 1 simultaneously, and generation time is poor on it detects.Under situation about tilting like that shown in infrabasal plate 1 image pattern 3 (b), the substrate detecting sensor 34b on right side detects infrabasal plate 1 at first, and the CD-ROM drive motor 33b of the roller conveyor of driving substrate detecting sensor 34b side stops.At this moment, the CD-ROM drive motor 33a of substrate detecting sensor 34a side that does not detect the left lateral side of infrabasal plate 1 proceeds action, and cylinder 31a continues to rotate.Therefore, the left side side of infrabasal plate 1 keeps mobile status.If like this, with respect to the infrabasal plate 1 that is in the state that tilts at carriage direction, substrate detecting sensor 34b detects infrabasal plate 1, and then CD-ROM drive motor 33b stops.At this moment, another CD-ROM drive motor 33a is driven in rotation, and the left lateral side of infrabasal plate 1 is transported.By this action, infrabasal plate 1 so that the mode that the left lateral side of infrabasal plate 1 is advanced rotate.By this spinning movement, the left lateral side of infrabasal plate 1 becomes the detected state by substrate detecting sensor 34a, and the front end of the left lateral of infrabasal plate 1 is in the position identical with the front end of the right portion, and the inclination of infrabasal plate 1 obtains proofreading and correct.Like this, if the inclination of infrabasal plate 1 obtains proofreading and correct, substrate detecting sensor 34a, 34b all become the state of the front end of limit, the left and right sides portion that has detected infrabasal plate 1, and infrabasal plate 1 is transported in then also starting once more of the CD-ROM drive motor 33b on right side once more under the state that inclination obtains proofreading and correct.
In addition, this point is described in further detail, the mistiming of the detection of substrate detecting sensor 34a, 34b about the not shown control member that goes out is looked, detect rotation (inclination) state of substrate, and make CD-ROM drive motor 33a, 33b counter-rotating, infrabasal plate 1 is returned once more detect preceding assigned position.After this, along driving two CD-ROM drive motor 33a, 33b, cylinder 31a, 31b are rotated at carriage direction once more, infrabasal plate 1 is moved at the carriage direction of arrow along the direction rotation.In view of the above, can detect the front end of the right and left portion of infrabasal plate 1, confirm the situation that tilts to disappear by substrate detecting sensor 34a, 34b.Under the situation that the inclination of infrabasal plate 1 is not fully proofreaied and correct, carry out this repeatedly and move and proofread and correct, and carry out CD-ROM drive motor 33a, 33b stop to handle, it is poor to obtain detection time.Be judged as under the situation about differing from detection time in the scope that is in regulation at control member, think that infrabasal plate 1 is transported with normal state, infrabasal plate 1 is transported under the coating worktable of paste coating machine 7, and makes it here to stop.
The coating worktable of paste coating machine 7 is constituted as and can moves up and down, and makes by this coating worktable is risen, and comes the structure that infrabasal plate 1 is received to this coating worktable from the roller conveyor.Like this, left and right directions placement substrate detecting sensor 34a, 34b in the way of transporting line 5, with the testing result of these substrate detecting sensors 34a, 34b the CD-ROM drive motor of one side of the front end of the limit portion that has detected infrabasal plate 1 is stopped, and can detect the heeling condition of infrabasal plate 1 by difference detection time of obtaining these substrate detecting sensors 34a, 34b.In addition, carry out the detection of front end of the right and left portion of infrabasal plate 1 repeatedly, until the detection time of substrate detecting sensor 34a, 34b difference reach in the specialized range, in view of the above, carry out the correction of the inclination of infrabasal plate 1.In view of the above, there is no need to be provided for separately the worktable of the slant correction of infrabasal plate 1, and then, also there is no need to be provided with mechanical arm, can suppress the maximization of system.In addition, at the correction of this inclination, be that example is illustrated with infrabasal plate 1, still,, also can carry out same correction at transporting the upper substrate 2 that transports on the line 6 (Fig. 1) second.
First roller conveyor that transports line 5 is arranged mechanism 4, paste coating machine 7, short circuit and forms differentiation between each device of using coating machine 8, liquid crystal dripping device 9, first inspection chamber 10 and conveyer 12 with electrode, execution and above-mentioned same contraposition control in each is interval.In addition, in above-mentioned control method,, turn back to assigned position though be the inversion driving roller conveyor, carry out the detection of leading section of limit, the left and right sides portion of infrabasal plate 1 repeatedly, in view of the above, carry out the correction of the inclination of infrabasal plate 1, still, also can obtain the difference of detection time and the relation of correcting value in advance, store this relation,, proofread and correct with the poor correspondingly CD-ROM drive motor of drive controlling one side detection time.Like this, because be the position correction of carrying out infrabasal plate 1 on the line transporting, so, there is no need to carry out contraposition at the infrabasal plate 1 of mounting on worktable, can shorten when mounting is on worktable to bit time, and homework precision on each worktable improves.
In addition, in each above-mentioned device, the worktable that is used to carry out processing separately is being set, on each worktable, is possessing substrate positioning mechanism for the stop position of regulation infrabasal plate 1.This detent mechanism is by with respect to the substrate carriage direction, constitutes at two banking pins that move up and down of advancing of the right and left portion side of right angle orientation regulation infrabasal plate 1.If infrabasal plate 1 is transported on roller conveyor in the device, then this banking pin is projected on the roller conveyor always, so that the mobile of infrabasal plate 1 stopped, stopping advancing of this infrabasal plate 1.
In addition, each worktable of said apparatus is constituting by the mode that the not shown driving mechanism that goes out moves up and down, if infrabasal plate 1 is transported on this worktable by roller conveyor, roller conveyor stops, this worktable is risen, in view of the above, infrabasal plate 1 can be received on the work top from roller conveyor.In addition, also can on the roller conveyor that is arranged at worktable portion, reciprocating mechanism be set, make under roller conveyor moves to from work top, deliver substrate.
Fig. 4 is the structural drawing based on an embodiment of substrate inversion set 11 of the present utility model and substrate inverting method thereof in the presentation graphs 1, this figure (a) is the integrally-built summary construction diagram of this example of expression, this figure (b) is the structural drawing of the step rate among this figure of expression (a), the 40th, stand, the 41st, move and use post, the 42nd, step rate, the 43rd, move horizontally portion, the 44th, move up and down parts, the 45th, finger, the 46th, vacuum suction pad.
Transport on the roller conveyor of line 6 in formation second, chromatic filter formation is faced up, mounting upper substrate 2 transports to substrate inversion set 11.The roller conveyor that is arranged on the reversing device portion of substrate inversion set 11 constitutes in the mode that can move up and down.
Among Fig. 4 (a), on this substrate inversion set 11, the reversing device that is made of step rate 42 grades that possess with respect to carriage direction a plurality of fingers 45 (Fig. 4 (b)) of (width) direction elongation at the right angle of upper substrate 2 is set on stand 40.
Step rate 42 is made the structure that is provided with a plurality of fingers 45 on turning axle shown in Fig. 4 (b), on these fingers 45, the height of the regulation that begins with 45 the face from the finger is being provided with a plurality of vacuum suction pads 46 that adsorb upper substrate 2.Though omitted diagram, on vacuum suction pad 46, connected pipe arrangement from the negative pressure source of supplying with negative pressure.
This reversing device is shown in Fig. 4 (a), make following structure, promptly, by vacuum suction pad 46 upper substrate 2 absorption are remained on the finger 45 of step rate 42, promote the distolateral parts 44 that move up and down of step rate 42, make it to move, another distolateral parts 43 that move horizontally are moved to another avris at the avris of substrate carriage direction from stand 40 to vertical direction, in view of the above, upper substrate 2 is reversed up and down.
The finger 45 of step rate 42 is set between the cylinder of the roller conveyor that is arranged at reversing device portion and cylinder here.In the substantial middle portion of the substrate carriage direction of stand 40, be provided with in the end side of upper substrate 2 and be used to make one of step rate 42 distolateral to move up and down mobile that parts 44 rise and fall with post 41.In the part that moves with post 41, what be provided for making the end side that is arranged on step rate 42 moves up and down the CD-ROM drive motor that parts 44 move up and down (not shown go out).Make and move up and down parts 44 by this mobile structure that moves up and down with post 41 in CD-ROM drive motor edge.In addition,, move up and down parts 44 and be connected with counterweight, reduce the driving force of CD-ROM drive motor by rope though not shownly go out.Another distolateral moving horizontally at step rate 42 possesses the rolling mechanism that moves easily on linear guide on the parts 43.
Action to this routine substrate inversion set 11 describes.
At first,, then stop roller conveyor, the roller conveyor downward direction is moved if upper substrate 2 arrives on the substrate inversion set 11.By roller conveyor is fallen, upper substrate 2 is handed on the finger 45 of the step rate 42 that is possessed between cylinder and the cylinder.The upper substrate of being handed on the finger 45 2 is also kept by vacuum suction pad 46 vacuum suction that are arranged on the finger 45.If upper substrate 2 is adsorbed maintenance, then one of the step rate 42 distolateral parts 44 that move up and down rise along moving with post 41, and meanwhile, the parts 43 property guides along the line that move horizontally that another of step rate 42 is distolateral move in the horizontal direction.Then, before moving up and down parts 44 arrival peaks, moving horizontally parts 43 can move with the speed of stipulating in the horizontal direction, and by moving the center with post 41, moves to its opposition side.
In addition, also can make moving horizontally on the parts 43 drive motor is set, its revolving force is applied the structure that drives in the horizontal direction to moving horizontally parts 43.
If step rate 42 becomes plumbness, the rising change that then will move up and down parts 44 is controlled to falls direction.By carrying out above-mentioned action, upper substrate 2 is reversed up and down.
If moving horizontally parts 43 moves to the opposition side that moves with post 41, step rate 42 becomes horizontality, become the state that upper substrate 2 has reversed up and down, the mechanical arm 13 (Fig. 1) of the next transfer chamber 12 of this substrate inversion set 11 is reached from the position of finger 45 skews of step rate 42, keep upper substrate 2 by the absorption of the vacuum suction pad on the finger that is arranged on the mechanical arm side.In view of the above, upper substrate 2 is delivered to the mechanical arm 13 of transfer chamber 12 from the step rate 42 of substrate inversion set 11.
Like this, in this substrate inversion set 11, owing to make distolateral moving up and down of upper substrate 2, the other end is moved horizontally, so upper substrate 2 moves up and down parts 44 as the summit with step rate 42, and be the center with this summit, move according to the approaching roughly form of half fan type, compare with the situations of having rotated 180 degree, migration area diminishes.Therefore, do not have the situation that upsets ambient air, the generation of dust can be suppressed at Min., can also with dust to around the influence of device be suppressed at Min..
In addition, though in this example, the vacuum suction pad of mechanical arm is stretched out on the finger 45 of step rate 42, receive upper substrate 2, but, also can be that the foot of the vacuum suction pad 46 on the finger 45 that is arranged on step rate 42 is stretched out, the finger of mechanical arm 13 is inserted between upper substrate 2 and the finger 45, carry out delivering of upper substrate 2, still fabrication process efficient improves by this way.
Fig. 5 is the structural drawing based on other embodiment of substrate inversion set 11 of the present utility model and substrate inverting method thereof in the presentation graphs 1, this figure (a) is the integrally-built summary construction diagram of the embodiment of expression this other, this figure (b) is the structural drawing that the upper substrate among this figure of expression (a) transports pallet, the 50th, and stand, the 51st, upper substrate transports pallet, the 52nd, pivot arm, the 53rd, driving mechanism, the 54th, linking part, the 55th, crosspiece, the 56th, vacuum suction pad, the 57th, connect mechanism.
Among Fig. 5 (a), in this substrate inversion set 11, on stand 50, be provided with by transporting the reversing device that upper substrate 2 is reversed up and down that pallet 51 grades constitute.This reversing device is positioned in upper substrate 2 and transports on the pallet 51, and the central portion that transports pallet 51 is supported and rotates, and in view of the above, upper substrate 2 is reversed up and down.
Below, use and represent that upper substrate transports Fig. 5 (b) of a concrete example of pallet, the reversing device of the substrate inversion set 11 of key diagram 5 (a).
At the central portion of two parallel avris of the carriage direction that transports pallet 51, possesses connect mechanism 57 (Fig. 5 (b)) in order to engage with the linking part 54 of reversing device with upper substrate 2.In addition, transport pallet 51 shown in Fig. 5 (b), form, the vacuum suction pad 56 of the length of regulation is being set, on the top of this crosspiece 55 so that the finger of mechanical arm can be inserted by a plurality of crosspieces 55.
In this substrate inversion set 11, portion is being provided with the pallet rotary drive mechanism in the central.In this pallet rotary drive mechanism, in first both sides of carriage direction of transporting the upper substrate 2 of line 5 pivot arm 52 is set, be provided for making the driving mechanism 53 of pivot arm 52 rotations in one distolateral (rotation center side) of pivot arm 52, in the leading section side of pivot arm 52, the linking part 54 that is used for and transports pallet 51 bindings is being set.
Transport line 6 (Fig. 1) second and go up to be provided with and to transport pallet 51, upper substrate 2 faces up with chromatic filter and is transported into robot 3 (Fig. 1) from substrate and is positioned in and transports on the pallet 51 and be transported.At this moment, upper substrate 2 is by vacuum suction pad 56 vacuum suction that are arranged on the crosspiece that transports pallet 51 55 shown in Fig. 5 (b).Upper substrate 2 this second transport on the line 6 with transport pallet 51 by fortune to substrate inversion set 11.
Arrive on the substrate inversion sets 11 if transport pallet 51, the linking part 54 of leading section that then is arranged on the pivot arm 52 of its reversing device is linked by the connect mechanism 57 that is arranged on the central portion that transports pallet 51.If the linking part 54 of the front end of pivot arm 52 links with the connect mechanism 57 that transports pallet 51, then pivot arm 52 reverses upper substrate 2 up and down because of driving mechanism 53 rotates.Have again, the linking part 54 of pivot arm 52 constitutes rotationally, with respect to pivot arm 52 and transport between the connect mechanism 57 of pallet 51 and can rotate, be accompanied by the rotation of the arrow A direction of pivot arm 52, make and transport the direction rotation of pallet 51 at illustrated arrow B, C.If pivot arm 52 is at arrow A direction Rotate 180 degree, then upper substrate 2 is come the downside that transports pallet 51.
Upper substrate 2 is to be delivered to the mechanical arm 13 of transfer chamber 12 at the state of the bottom of transporting pallet 51 by hanging.That is, the finger of mechanical arm 13 is inserted between the vacuum suction pad 56 that transports pallet 51, and by the vacuum suction pad maintenance upper substrate 2 of the finger that is arranged on mechanical arm 13, the vacuum suction of the vacuum suction pad 56 that is provided with on the crosspiece 55 that transports pallet 51 stops.After this, mechanical arm leaves upper substrate 2 and transports 51 ones on pallet, upper substrate 2 is transported into pre-treatment chamber 14.Transport pallet 51 once more by the rotation of the reversing device of substrate inversion set 11, be provided with a side of vacuum suction pad, return second up and transport line 6, return the position that substrate is transported into robot 3.
As mentioned above, in this other embodiment, in substrate inversion set 11, not that upper substrate 2 complete Rotate 180 degree are reversed up and down, but distolaterally move by one that another is distolateral to move in vertical direction in general horizontal direction, the moving of substrate counter-rotating of upper substrate 2 can be suppressed at minimum zone as far as possible, therefore, can suppress the generation of the dust that accompanies with the counter-rotating of upper substrate 2 and fly upward, can suppress dust to around the influence of device.
Fig. 6 is the longitudinal section that the past process chamber 14 of the base plate bonding chamber 15 in the presentation graphs 1 is transported into substrate and transports the action of substrate to after-processing chamber 16, the 60th, the conveyor telescoping mechanism, the 61st, roller conveyor, the 62nd, mechanical arm, the 63rd, the finger, the 64th, absorption layer, the 69th, the family of power and influence, the 65th, lower table, the 66th, substrate is delivered the roller conveyor of usefulness, the 70th, the family of power and influence, the 68th, the conveyor telescoping mechanism, the 67th, roller conveyor, to the part mark identical symbol corresponding with Fig. 1, Fig. 2, the repetitive description thereof will be omitted.
Among this figure, in pre-treatment chamber 14 (Fig. 1), possess the roller conveyor 61 of flexible conveyor telescoping mechanism 60, mechanical arm 62 is set in its ceiling side in its downside setting.Between base plate bonding chamber 15 and pre-treatment chamber 14, the family of power and influence 69 is set, is retained as the specified vacuum degree in the base plate bonding chamber 15 usually.In addition, between base plate bonding chamber 15 and after-processing chamber 16 (Fig. 1), the family of power and influence 70 is set also.Base plate bonding chamber 15 becomes vacuum chamber as shown in the figure, wherein is provided with lower table 65 that keeps infrabasal plate 1 and the upper table 21 that keeps upper substrate 2.
On the roller conveyor 61 of pre-treatment chamber 14, conveyor telescoping mechanism 60 is set, to open as if the family of power and influence 69 between base plate bonding chamber 15 and the pre-treatment chamber 14, then the roller conveyor 61 of pre-treatment chamber 14 stretches out and is connected to the roller conveyor of base plate bonding chamber 15 by conveyor telescoping mechanism 60, the mode that infrabasal plate 1 is transported on the lower table 65 can be constituted.When base plate bonding, by the not shown driving mechanism that goes out, make upper table 21 to lower table 65 side shiftings, carry out the bonding of infrabasal plate 1 and upper substrate 2.
In the finger 63 of the mechanical arm 62 that is arranged at pre-treatment chamber 14 a plurality of absorption layers 64 are set.In addition, as explained above, upper table 21 sides in base plate bonding chamber 15, shown in Fig. 2 (a), a plurality of retractile adhesive cushions (adhesion pin) 23 also are set, and the adhesive cushion 23 of upper table 21 sides is fallen between the finger 63 of mechanical arm 62, can adhere to keep upper substrate 2.At the central part of these absorption layers 64 and adhesive cushion 23, the supply port of supplying with negative pressure (not shown go out) is set, by supplying with negative pressure to this supply port, absorption upper substrate 2.In addition, at negative pressure source, supplying tubing, omitted diagram.In addition, absorption layer 64 also can only be provided with the maintaining body based on this negative pressure, and the mechanism that adhesion keeps is not set.
As mentioned above, when carrying out the delivering of upper substrate 2, adsorb in order to utilize negative pressure, become the partial vacuum state in pre-treatment chamber 14 and the base plate bonding chamber 15, the negative pressure of supplying with to each absorption layer 64, each adhesive cushion 23 is the vacuum tightness height by comparison.
Constitute in the following manner, promptly, with upper substrate 2 in the past process chamber 14 when base plate bonding chamber 15 is delivered, after the two has kept upper substrate 2 by the adhesive cushion 23 of the absorption layer 64 of mechanical arm 62 sides and upper table 21 sides, stop the negative pressure feeding of the absorption layer 64 of mechanical arm 62 sides, make mechanical arm 62 and the roller conveyor 61 that stretched out forward process chamber 14 keep out of the way.After this, upper substrate 2 is risen to the face of upper table 21 by adhesive cushion 23, and is kept by these a plurality of adhesive cushions 23.Therefore, even gas clean-up, upper substrate 2 is also kept by clinging power, can not fall.
If the bonding end of infrabasal plate 1 and upper substrate 2 then upper table 21 being pressed against under the state of upper substrate 2, rises to the upside of comparing with the face of this upper table 21 with adhesive cushion 23, in view of the above, adhesive cushion 23 can be peeled off from the face of upper substrate 2.In addition, at this moment,, can easily adhesive cushion 23 be peeled off by gas from the negative pressure feeding mouth ejection malleation of the central portion that is arranged on adhesive cushion 23.
In addition, not shown adhesion sheet (adhesion parts) and a plurality of negative pressure feeding mouth that goes out is set on lower table 65, infrabasal plate 1 keeps in the mode that does not move.Under the situation that the parts of will adhering peel from infrabasal plate 1, lower table 65 does not move, and peels to pressure gas from the negative pressure feeding confession of the central portion that is arranged on the adhesion sheet.In addition, also downside pin can be set at the central portion of negative pressure feeding mouth, push substrate 1 with going up on the downside pin, in view of the above, the parts of will adhering peel from infrabasal plate 1.
The roller conveyor 61 that is arranged on pre-treatment chamber 14 becomes can pass through telescoping mechanism 60 to the flexible structure of base plate bonding chamber 15 sides, constitute in the following manner, promptly, when the family of power and influence 69 between pre-treatment chamber 14 and base plate bonding chamber 15 closes, process chamber 14 sides are shunk forward, open the family of power and influence 69, when infrabasal plate 1 is transported in base plate bonding chamber 15,15 sides are stretched out to the base plate bonding chamber, deliver the roller conveyor 66 of usefulness with the substrate that is arranged on base plate bonding chamber 15 and plug into, infrabasal plate 1 is handed to the lower table 65 of base plate bonding chamber 15 swimmingly.Lower table 65 is arranged on as between the roller conveyor 66 about the reception conveyor, for moving up and down driving mechanism is set.
In addition, the roller conveyor 67 that can stretch to base plate bonding chamber 15 sides by the conveyor telescoping mechanism 68 that is arranged on here is set in after-processing chamber 16, if infrabasal plate 1 and the bonding of upper substrate 2 are finished, the family of power and influence 70 between after-processing chamber 16 and the base plate bonding chamber 15 opens, then roller conveyor 67 stretches out to base plate bonding chamber 15 sides, the roller conveyor 66 of delivering usefulness with substrate is connected, the liquid crystal panel 19 that forms by base plate bonding from this roller conveyor 66 through roller conveyor 67, transported from base plate bonding chamber 15, transported to after-processing chamber 16.
In addition, here can roughly carry out simultaneously upper and lower base plate 1,2 to base plate bonding chamber 15 be transported into and up and down the mounting of worktable 21,65 keep, in view of the above, can significantly shorten the built-up time of liquid crystal panel.
As mentioned above, if upper and lower base plate 1,2 respectively in the past process chamber 14 be maintained at upper table 21, the lower table 65 of base plate bonding chamber 15, then the family of power and influence 69 is closed.In addition, the family of power and influence 70 between base plate bonding chamber 15 and the after-processing chamber 16 is closed in advance.If the family of power and influence 69 is closed, then making in the base plate bonding chamber 15 becomes high vacuum state from the partial vacuum state, carries out the bonding of upper and lower base plate 1,2.Though not shownly go out, but the outdoor setting in base plate bonding chamber 15 makes the driving mechanism that upper table 21 moves up and down, the driving mechanism that adhesive cushion 23 is moved up and down, the power transmission shaft that is arranged on these driving mechanisms links with upper table 21, adhesive cushion 23, make this driving mechanism action, adhesive cushion 23, upper table 21 are moved up and down, in view of the above, carry out the bonding of upper and lower base plate 1,2.When this is bonding, make upper table 21 to lower table 65 side shiftings.
If the bonding end of upper and lower base plate 1,2, then as previously mentioned, making becomes the partial vacuum state in the base plate bonding chamber 15, makes the after-processing chamber 16 that becomes the partial vacuum state in advance become high vacuum state.If become the partial vacuum state in the base plate bonding chamber 15, then the family of power and influence 70 opens, roller conveyor 67 stretches out in base plate bonding chamber 15 from after-processing chamber 16, substrate is delivered the thing of finishing that the upper and lower base plate 1,2 on the roller conveyor 66 of usefulness is bonded for liquid crystal panel 19 and is transported to after-processing chamber 16.If liquid crystal panel 19 is transported into after-processing chamber 16, then the family of power and influence 70 closes, and turns back to atmospheric condition in the after-processing chamber 16.Because return atmosphere in the after-processing chamber 16, liquid crystal panel 19 integral body are applied atmospheric pressure equably, the interval between the upper and lower base plate 1,2 becomes regular interval.Then, in Fig. 1, by constituting the 3rd roller conveyor that transports line 20, liquid crystal panel 19 is transported to ultraviolet exposure cell 17.Here, by to sealant irradiation ultraviolet radiation, hardening seal.If the sclerosis of sealant finishes, then by roller conveyor liquid crystal panel 19 is sent to panel inspection chamber 18 equally, its state is examined, and is sent to the not shown next operation that goes out.
Then, second embodiment based on the bonding chamber of crystal liquid substrate of the present utility model is described.
First embodiment of front is a following structures, promptly, for making the state in the base plate bonding chamber 15 be the state of the state of partial vacuum and high vacuum repeatedly, and pre-treatment chamber 14 and after-processing chamber 16 be set before and after it, in these sides the family of power and influence 69,70 being set respectively opens and closes, in view of the above, carry out upper and lower base plate 1,2 admittance and bonding after the sending of liquid crystal panel 19.Like this,, seek to shorten making the time that becomes vacuum state in the base plate bonding chamber 15, and prevent the reduction of the cleanliness in the base plate bonding chamber 15 by making partial vacuum state and high vacuum state repeatedly.
Below among Shuo Ming second embodiment, though make the structure identical with structure shown in Figure 1, but, pre-treatment chamber 14 and after-processing chamber 16 have been omitted, make upper and lower base plate 1,2 directly is transported into base plate bonding chamber 15 from transfer chamber 12, in addition, will be in the base plate bonding chamber structures that directly transport of 15 liquid crystal panels that form 19 to ultraviolet exposure cell 17.
Fig. 7 is the summary construction diagram of the part of the base plate bonding chamber 15 among this second embodiment of expression, and 15 ' is the base plate bonding device, the 76th, and epicoele, the 77th, cavity of resorption, the 78th, upper table, 78a are base plates, 78b is the adhesion parts, the 79th, and lower table, 79a are base plates, 79b is an elastic body, the 80th, horizontal pushing mechanism, the 81st, CD-ROM drive motor, the 82nd, ball-screw, the 83rd, the linear guide device, the 84th, support column, the 85th, sealing ring, the 86th, columnar part, the 87th, seal member, the 88th, lower table support column, the 89th, seal member, 90a, 90b is a Vacuum exhaust tube, the 91st, upper frame, the 92nd, drive division up and down, the 93rd, stand, the 94th, engaging mechanism, to the part mark identical symbol corresponding with the figure of front, the repetitive description thereof will be omitted.
Among this figure, in this second embodiment, the base plate bonding device 18 ' that is equivalent to the base plate bonding chamber 18 of Fig. 1 is done the vacuum chamber that is shaped as it and is split into two of epicoele 76 and cavity of resorption 77 and cuts apart structure, be transported into upper substrate 2 from the upper table 78 of transfer chamber 12 (Fig. 1) in epicoele 76, lower table 79 to cavity of resorption 77 is transported into infrabasal plate 1, in addition, the liquid crystal panel 19 (Fig. 1) that these upper and lower base plates 1,2 are bonded transports to ultraviolet exposure cell 17 (Fig. 1).In addition, in this second embodiment,, also be provided with and be used in the flexible telescoping mechanism of roller conveyor that transports upper and lower base plate 1,2, liquid crystal panel 19 in transfer chamber 12 and ultraviolet exposure cell 17 though not shownly go out.
Cavity of resorption 77 be almost fixed at the support column 84a of stand 93 sides, the state of 84b, substrate is set in cavity of resorption 77 delivers the roller conveyor of usefulness (not shown go out), the lower table 79 that can move up and down is set between this roller conveyor.The scope that moves up and down of this lower table 79 be so long as can receive infrabasal plate 1 on the above-mentioned roller conveyor, and do not move to and get final product with the roller conveyor position contacting.Lower table 79 is made the structure that is provided with elastic body 79b on base plate 79a, and the part of this elastic body 79b is joined with the infrabasal plate 1 that is transported into.
Lower table 79 is set in the cavity of resorption 77, is supported by a plurality of lower table support columns 88 that are arranged on the drive division up and down 92 on the stand 93.Between lower table support column 88 and cavity of resorption 77, seal member 89 is set, when in making the vacuum chamber that forms by epicoele 76 and cavity of resorption 77, becoming vacuum, air can not entered.
In addition, in this second embodiment, be provided for moving in the horizontal direction lower table 79, carry out the horizontal pushing mechanism 80 of the contraposition of upper substrate 2 and infrabasal plate 1.
Upper table 78 is made the structure that is provided with adhesion parts 78b on base plate 78a, same with first embodiment that illustrates previously, possess a plurality of vacuum suction pads that can move up and down (not shown go out), go up the upper substrate 2 that keeps by its vacuum suction pad at the mechanical arm 13 (Fig. 1) of transfer chamber 12 (Fig. 1) and receive, and be thus lifted to the substrate maintenance face of upper table 78 by the vacuum suction pad that is arranged on the upper table 78.A plurality of vacuum suction mouths of configuration (not shown go out) and adhesion parts 78b carry out vacuum suction by them to the upper substrate 2 that the vacuum suction pad by upper table 78 sides promotes on the face of upper table 78, and final adhesion maintenance.
This vacuum suction pad of upper table 78 is also after substrate 1,2 bonding, and the upper substrate 2 that is used for adhesion is remained on the liquid crystal panel 19 on the face of upper table 78 is peeled off.Promptly, if the bonding end of substrate 1,2, then with upper table 78 when the face of adhesive base plate (liquid crystal panel) 19 is peeled off, under the state of the face that pushes adhesive base plate 19 with the vacuum suction pad, upper table 78 is risen, in view of the above, the upper substrate 2 of liquid crystal panel 19 can be peeled off from the face of upper table 78.At this moment, by the face ejection gas of the vacuum suction mouth from the face that is arranged on upper table 78, can peel off the upper substrate 2 of this liquid crystal panel 19 easily to liquid crystal panel 19.
Epicoele 76 is connected with upper frame 91 through engaging mechanism (not shown go out), and upper table 78 is connected with upper frame 91 by a plurality of columnar parts 86.Between columnar part 86 and epicoele 76, seal member 87 is set, when in making the vacuum chamber that constitutes by epicoele 76 and cavity of resorption 77, becoming vacuum state, air can not entered in this vacuum chamber.
Epicoele 76 and upper table 78 move up and down by in order to drive the upper frame that is made of CD-ROM drive motor 81, ball screw 82 and linear steering device 83 driving mechanism up and down that upper frame 91 is arranged on four jiaos of device up and down.The sealing ring 85 that forms by rubber etc. in the connecting portion setting of epicoele 76 and cavity of resorption 77.If epicoele 76 and cavity of resorption 77 zoariums form vacuum chamber, then by the impermeability in sealing ring 85 these vacuum chambers of maintenance.
In addition, first embodiment of the correction of the inclination of infrabasal plate 1 and front is same, and as illustrated by Fig. 3, the detected value of the sensor that the substrate that uses detection to be configured in the assigned position of roller conveyor passes through carries out.In base plate bonding device 15 ', upper substrate 2 and infrabasal plate 1 roughly are transported into simultaneously, roughly deliver to upper table 78 and lower table 79 simultaneously.At this moment, epicoele 76 and cavity of resorption 77 leave, and become atmospheric condition.
As explained above, upper substrate 2 is as illustrated by Fig. 6, use is arranged on the vacuum suction pad of the upper table 78 of epicoele 76 sides, from mechanical arm 13 (Fig. 1) reception of transfer chamber 12 (Fig. 1), and uses vacuum suction and adhesion maintaining body to remain on upper table 78.Infrabasal plate 1 is received on the lower table by the roller conveyor 66 of the reception usefulness as shown in Figure 6 that is arranged on cavity of resorption 77 sides, and lower table 79 is risen, and infrabasal plate 1 is positioned on the lower table 79.The infrabasal plate 1 that is positioned on the lower table 79 uses a plurality of vacuum suction mouths that are arranged on the lower table 79 by vacuum suction, and keeps by having disposed a plurality of adhesion parts adhesions.In addition, on lower table 79, the table-driving mechanism that can move in the horizontal direction is set for the contraposition of upper substrate 2 and infrabasal plate 1.Its amount of movement as mentioned above because in advance in inclination of transporting correction substrate 1,2 on the roller conveyor of line etc., so, can pass through this minute movement for small, carry out the contraposition between the substrate 1,2.
If upper and lower base plate 1,2 is maintained at upper table 78 and lower table 79, epicoele 76 is fallen to cavity of resorption 77 sides, make these epicoeles 76 and cavity of resorption 77 zoariums, form vacuum chamber.If vacuum chamber forms, go out though then details is not shown, the engaging mechanism 94 that upper frame 91 is connected with epicoele 76 is thrown off, by driving mechanism about the upper frame upper table 78 is moved up and down.
Like this,, then the gas in the vacuum chamber is carried out exhaust, become high vacuum state (about 5 * 10 from Vacuum exhaust tube 90a, the 90b that is separately positioned on epicoele 76 sides and cavity of resorption 77 sides if vacuum chamber forms -3Torr).Under this state, be arranged on alignment mark on upper substrate 2 and the infrabasal plate 1 by camera (not shown go out) observation, obtain the position offset between these upper and lower base plates 1,2, drive lower table 79 in the horizontal direction, carry out contraposition.If contraposition finishes, then, upper table 78 to lower table 79 side shiftings, is carried out the bonding of upper and lower base plate 1,2 by driving mechanism about the upper frame.In view of the above, form liquid crystal panel 19 (Fig. 1).The bonding pushing force of this moment is measured by the pressure transducer that is arranged on the driving shaft that drives upper table 78, is pressed to predefined pressure.
If the bonding end of upper and lower base plate 1,2 then makes upper table 78 rise, the liquid crystal panel 19 that adhesion keeps is peeled off.Under the situation that the liquid crystal panel 19 that will the adhesion of this quilt keeps is peeled off, as explained above, simultaneously pushed the real estate of liquid crystal panel 19 by the vacuum suction pad of substrate reception usefulness, one side rises upper table 78, in view of the above, the liquid crystal panel 19 that this quilt can be adhered is peeled off.Stick at the vacuum suction pad under the situation of real estate of liquid crystal panel 19, supply with the gas that negative pressure is supplied with malleation, can peel off simply by substituting.In addition, when peeling off the liquid crystal panel 19 that is kept by adhesion from upper table 78, give the gas of malleation, can shorten the parts of should adhering by the vacuum suction confession from the face that is arranged on upper table 78, that is, and the time that the upper substrate 2 of liquid crystal panel 19 is peeled off.
Behind the upper and lower base plate 1,2, if upper table 78 is peeled off end from the upper substrate 2 of liquid crystal panel 19, then with the adhesion parts of infrabasal plate 1 side, that is, the infrabasal plate 1 of liquid crystal panel 19 is peeled off from lower table 79 bonding.In this case, the a plurality of base plate supports pins that are arranged on lower table 79 sides are risen on the face of lower table 79, make lower table 79 move to the below that is positioned at roller conveyor, in view of the above, infrabasal plate 1 side of liquid crystal panel 19 can be peeled off from the face of the lower table 49 that keeping it.If finish from lower table 79 stripper crystal panel 19, then make the base plate supports pin be lowered to the below of the face of lower table 79, in view of the above, this liquid crystal panel 19 is handed to substrate shown in Figure 6 and is delivered on the roller conveyor 66 of usefulness.If liquid crystal panel is handed on this roller conveyor 66, then atmosphere is imported in the vacuum chamber.If become the state identical in the vacuum chamber with atmospheric pressure, then epicoele 76 rises because of driving mechanism about the chamber, epicoele 76 separates from cavity of resorption 77, and roller conveyor stretches out from ultraviolet exposure cell 17 (Fig. 1), and the roller conveyor 66 of delivering usefulness with the substrate in the base plate bonding chamber 15 ' is connected.Then, liquid crystal panel 19 is sent to ultraviolet exposure cell 17, to the sealant irradiation ultraviolet radiation, makes hardening seal here.If the sclerosis of sealant finishes, then be sent to panel inspection chamber 18 as second testing fixture by roller conveyor, check.
Like this, in this second embodiment, owing to roughly simultaneously upper and lower base plate 1,2 is transported into base plate bonding device 15 ', and remain on upper table 78 and lower table 79, so, compare with situation about these upper and lower base plates 1,2 being transported into respectively in the past, can shorten the bonding needed time of substrate.
In addition, the roughly linearity that is configured as owing to the chambers that makes the bonding operation before of carrying out substrate, upper and lower base plate 1,2 transport the use roller conveyor, so, can make the structure of the worktable in each treating apparatus become roughly the same, can reduction means area is set, and can shorten the single products production time.
Have again, in the big substrate inversion set of the possibility that produces dust,, can suppress the influence of dust entire system by make the reversing device of the moving range that has suppressed substrate as far as possible.

Claims (10)

1. crystal liquid substrate bonding system, it is characterized in that, to first transport line, form with coating machine, make first inspection chamber, the transfer chamber arranged in series of the state of liquid crystal dripping device that liquid crystal material drips, inspection infrabasal plate with electrode by what the roller conveyor that transports infrabasal plate constituted to the short circuit in the downstream of above-mentioned first transporting on the line paste coating machine that applies sealant, being configured in above-mentioned paste coating machine
Transport to form in parallel on the line by what the roller conveyor that transports upper substrate constituted first and second transport line, in above-mentioned second end side of transporting line the substrate inversion set is set, the junction of two streams as the downstream of inversion set is provided with transfer chamber,
Transport the line and second junction of two streams of transporting line above-mentioned first, be provided with and first transport that line is connected the 3rd transport line by what roller conveyor constituted, transport the above-mentioned the 3rd and in series dispose transfer chamber, pre-treatment chamber, base plate bonding chamber, after-processing chamber, ultraviolet exposure cell and panel inspection chamber on the line.
2. crystal liquid substrate bonding system as claimed in claim 1 is characterized in that,
The aforesaid substrate inversion set,
Possess step rate, the state that described step rate has to make progress up is transported to next above-mentioned upper substrate of stand and a plurality of fingers that keep from the roller conveyor reception,
Above-mentioned step rate is made side setting at one end and is moved up and down parts, move horizontally portion in another distolateral setting, the above-mentioned parts that move up and down move up and down with post along being arranged on moving on the above-mentioned stand, and above-mentionedly move horizontally the structure that portion's property along the line guide moves in the horizontal direction.
3. crystal liquid substrate bonding system as claimed in claim 2 is characterized in that,
On each of a plurality of fingers of the above-mentioned step rate of aforesaid substrate inversion set a plurality of vacuum suction pads that absorption keeps above-mentioned upper substrate are set, above-mentioned vacuum suction spacer is equipped with the foot that is in a ratio of the height of regulation with the face of above-mentioned finger.
4. crystal liquid substrate bonding system as claimed in claim 1 is characterized in that,
In the aforesaid substrate inversion set,
Constitute reversing device by the pivot arm that is provided with linking part,
Make and up to keep above-mentioned upper substrate, on above-mentioned roller conveyor, transport the linking part that the connect mechanism that transports pallet that comes is attached at this pivot arm, make half rotation of above-mentioned pivot arm, the structure that the above-mentioned above-mentioned upper substrate that transports pallet and kept by it is reversed up and down.
5. crystal liquid substrate bonding system as claimed in claim 4 is characterized in that,
The aforesaid substrate inversion set is to make above-mentioned pallet when counter-rotating of transporting, and the above-mentioned pallet that transports can constitute in the above-mentioned mode of rotating between the linking part of pallet and above-mentioned pivot arm of transporting.
6. crystal liquid substrate bonding system as claimed in claim 1 is characterized in that,
Be provided with in above-mentioned pre-treatment chamber by what roller conveyor constituted and the above-mentioned the 3rd transport line and mechanical arm,
By the vacuum suction pad that is arranged on the mechanical arm above-mentioned upper substrate is kept transporting to above-mentioned base plate bonding chamber, receive by a plurality of absorption layers on the upper table that is arranged on the bonding chamber of aforesaid substrate, keep by a plurality of adhesive cushion adhesions on the maintenance face that is arranged on above-mentioned upper table
Transport line by the above-mentioned the 3rd and transport above-mentioned infrabasal plate, above-mentioned infrabasal plate is delivered to the lower table of above-mentioned base plate bonding chamber, transport line by above-mentioned mechanical arm and the above-mentioned the 3rd above-mentioned upper substrate and above-mentioned infrabasal plate roughly are transported into the base plate bonding chamber simultaneously.
7. crystal liquid substrate bonding system as claimed in claim 6 is characterized in that,
Transport the above-mentioned paste coating machine on the line, above-mentioned short circuit and form with electrode on the roller conveyor nearby of substrate inversion set that roller conveyor nearby and above-mentioned second with each device of coating machine, above-mentioned liquid crystal dripping device and above-mentioned first inspection chamber transports line being arranged on above-mentioned first, about with respect to the rectangular direction of substrate carriage direction, first, second detecting sensor of the leading section of limit, the left and right sides portion of configuration detection substrate
If any one detecting sensor in above-mentioned first, second detecting sensor detects passing through of substrate, the above-mentioned roller conveyor of the above-mentioned detecting sensor side of passing through that has detected substrate is stopped, continue the driving of the roller conveyor of above-mentioned another detection side, detect passing through of aforesaid substrate until another detecting sensor passed through that does not detect substrate.
8. crystal liquid substrate bonding system as claimed in claim 1 is characterized in that,
Transport the worktable portion that the above-mentioned paste coating machine on the line, above-mentioned short circuit are provided with on forming with coating machine, above-mentioned liquid crystal dripping device, above-mentioned first inspection chamber with electrode being arranged at above-mentioned first, worktable side at the stop position that is used for the regulation substrate, be arranged on and the rectangular direction of carriage direction the movable up and down detent mechanism that the leading section of the both ends side of substrate is stopped.
9. crystal liquid substrate bonding system as claimed in claim 1 is characterized in that,
The above-mentioned upper table that is arranged on the bonding chamber of aforesaid substrate is provided with elastic body in the side that above-mentioned upper substrate contacted of base plate,
Make to be provided with and a plurality ofly supply with the negative pressure feeding mouth of negative pressure to above-mentioned elastomeric surface, and be arranged to make a plurality of adhesive cushions can connect above-mentioned base plate and above-mentioned elastic body carries out structure up and down from above-mentioned base plate.
10. crystal liquid substrate bonding system as claimed in claim 7 is characterized in that,
The above-mentioned upper table that is arranged on the bonding chamber of aforesaid substrate is provided with the adhesion parts in the side that above-mentioned upper substrate contacted of base plate,
Make a plurality of negative pressure feeding mouths from above-mentioned base plate to the surface of above-mentioned adhesive part part that supply with negative pressure from are set, and for above-mentioned adhesion parts are peeled off from the face of above-mentioned upper substrate, and be arranged to make a plurality of pushing pins can connect above-mentioned base plate and above-mentioned adhesion parts carry out structure up and down.
CN2011200401367U 2010-02-23 2011-02-17 Liquid crystal base plate adhesion system Expired - Fee Related CN201984258U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102169253A (en) * 2010-02-23 2011-08-31 株式会社日立工业设备技术 Liquid crystal substrate bonding system

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9132578B2 (en) * 2011-11-29 2015-09-15 Corning Incorporated Apparatus and method for skinning articles
CN103579056B (en) * 2013-10-23 2016-12-07 苏州均华精密机械有限公司 The device of adhesion semiconductor chip
JP5837247B1 (en) * 2015-03-31 2015-12-24 株式会社日立製作所 Board assembly apparatus and board assembly method using the same
CN105460287B (en) * 2015-12-18 2019-06-11 轻工业西安机械设计研究院有限公司 Packaging box piece conveying device and delivery method
JP6619762B2 (en) 2017-03-27 2019-12-11 平田機工株式会社 Manufacturing system and manufacturing method
JP6733966B2 (en) * 2018-07-09 2020-08-05 Ａｉメカテック株式会社 Board assembly apparatus and board assembly method
CN109822583B (en) * 2019-01-09 2021-01-05 温州大学瓯江学院 UV glue automatic coating equipment for electronic products

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002107524A (en) * 2000-09-27 2002-04-10 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing color filter, and substrate for color filter
KR100490048B1 (en) * 2001-06-19 2005-05-17 삼성전자주식회사 In-line system for manufacturing liquid crystal display and method of manufacturing liquid crystal display using the same
KR100831282B1 (en) 2002-03-18 2008-05-22 엘지디스플레이 주식회사 manufacturing device for manufacturing of liquid crystal device and method thereof
KR100720419B1 (en) * 2002-03-22 2007-05-22 엘지.필립스 엘시디 주식회사 bonding device for liquid crystal display device
JP4373136B2 (en) * 2002-10-15 2009-11-25 芝浦メカトロニクス株式会社 Substrate assembly method and substrate assembly apparatus
KR100617034B1 (en) 2003-12-23 2006-08-30 엘지.필립스 엘시디 주식회사 bonding apparatus for liquid crystal display device and loading method using the same
JP2007047304A (en) * 2005-08-08 2007-02-22 Sharp Corp Manufacturing apparatus and method of liquid crystal display apparatus, and liquid crystal display apparatus
JP4379435B2 (en) * 2006-05-17 2009-12-09 株式会社日立プラントテクノロジー Board assembly apparatus and board assembly method using the same
JP5104257B2 (en) * 2007-12-03 2012-12-19 株式会社日立プラントテクノロジー Substrate bonding system
KR101247900B1 (en) * 2010-02-23 2013-03-26 가부시키가이샤 히타치플랜트테크놀로지 Liquid crystal substrate bonding system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102169253A (en) * 2010-02-23 2011-08-31 株式会社日立工业设备技术 Liquid crystal substrate bonding system

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