TW201938468A - Substrate overturning device capable of efficiently and well performing overturn of a substrate with simplified structure and saved space - Google Patents
Substrate overturning device capable of efficiently and well performing overturn of a substrate with simplified structure and saved space Download PDFInfo
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
本發明是關於使基板翻轉之基板翻轉裝置。The present invention relates to a substrate inversion device for inverting a substrate.
一般而言，由玻璃基板等脆性材料構成之母基板，在經過刻劃步驟與折斷步驟後，被分斷為既定尺寸之基板。在對上述之步驟供給時，母基板會適當地被表裡翻轉。例如，在將兩個玻璃基板貼合而構成母基板之場合，於母基板之兩面形成刻劃線。在此場合，係於一面形成刻劃線後，母基板被表裡翻轉，再於另一面形成刻劃線。此外，亦有已形成有刻劃線之母基板被表裡翻轉後，對折斷步驟供給之場合。In general, a mother substrate made of a brittle material such as a glass substrate is divided into substrates of a predetermined size after a scoring step and a breaking step. When the above-mentioned steps are supplied, the mother substrate is appropriately turned over the front and back. For example, when two glass substrates are bonded together to form a mother substrate, scribe lines are formed on both surfaces of the mother substrate. In this case, after the scribe line is formed on one side, the mother substrate is turned over from the front and back, and then the scribe line is formed on the other side. In addition, there are occasions when the mother substrate on which the scribe line has been formed is reversed on the front and back, and is supplied to the breaking step.
於以下之專利文獻1中，揭露有在於水平方向排列之兩個平台間搬送母基板時使母基板表裡翻轉之裝置。此裝置，具備將母基板於水平方向搬送之搬送機構、使母基板翻轉之旋轉機構。於搬送機構及旋轉機構，分別設置有吸附板體。載置於一方之平台之母基板，受旋轉機構之吸附板體吸附後被表裡翻轉。表裡翻轉後之母基板，從旋轉機構之吸附板體被移交給搬送機構之吸附板體。其後，母基板藉由搬送機構，被送往另一方之平台，載置於另一方之平台。
［現有技術文獻］
［專利文獻］The following Patent Document 1 discloses a device for inverting the front and back surfaces of a mother substrate when the mother substrate is transported between two platforms arranged horizontally. This device includes a transport mechanism that transports the mother substrate in a horizontal direction, and a rotation mechanism that reverses the mother substrate. Suction plates are respectively provided on the conveying mechanism and the rotating mechanism. The mother substrate placed on one platform is reversed by the surface and the surface after being adsorbed by the adsorption plate body of the rotating mechanism. The mother substrate after the surface is reversed is transferred from the adsorption plate body of the rotating mechanism to the adsorption plate body of the conveying mechanism. Thereafter, the mother substrate is transported to the platform of the other party by the transfer mechanism, and is placed on the platform of the other party.
[Existing Technology Literature]
[Patent Literature]
［專利文獻1］日本特開2014-080336號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-080336
［發明欲解決之課題］[Inventive Problems]
在專利文獻1之構成中，於使母基板翻轉時，在旋轉機構使母基板往既定之位置移動後，在該既定之位置使母基板旋轉180度。旋轉後之母基板，藉由搬送機構被搬送往其他平台並被載置。如上述，旋轉機構及搬送機構個別地移動。因此，有將用來使基板移動之移動機構設置於旋轉機構及搬送機構之各者之必要。因此，用來搬送母基板之裝置之構成變複雜，此外，由於移動機構被設置兩個，故會有裝置全體大型化之問題。進而，由於旋轉機構及搬送機構分別移動，故難謂基板之移動及翻轉被效率良好地進行。In the configuration of Patent Document 1, when the mother substrate is turned over, the rotation mechanism moves the mother substrate to a predetermined position, and then rotates the mother substrate 180 degrees at the predetermined position. The rotated mother substrate is transferred to another platform and placed by a transfer mechanism. As described above, the rotation mechanism and the conveyance mechanism are individually moved. Therefore, it is necessary to provide a moving mechanism for moving the substrate to each of the rotating mechanism and the conveying mechanism. Therefore, the structure of the apparatus for conveying the mother substrate becomes complicated, and since two moving mechanisms are provided, there is a problem that the entire apparatus is enlarged. Furthermore, since the rotation mechanism and the conveyance mechanism are moved separately, it is difficult to say that the substrate movement and inversion are performed efficiently.
鑑於上述課題，本發明，以提供可使裝置之構成簡化且省空間化且能良好地進行基板之翻轉效率之基板翻轉裝置為目的。
［用來解決課題之手段］In view of the above-mentioned problems, the present invention aims to provide a substrate inverting device that can simplify the structure of the device, save space, and can efficiently perform substrate inversion.
[Means for solving problems]
本發明之主要態樣，是關於使基板翻轉之基板翻轉裝置。此態樣之基板翻轉裝置，
具備
第一吸附部；
第二吸附部；
翻轉機構，在前述第一吸附部之吸附面與前述第二吸附部之吸附面互相對向之狀態下，使前述第一吸附部及前述第二吸附部一體地旋轉半圈；
搬送機構，使前述第一吸附部及前述第二吸附部之中，於前述翻轉機構中被定位於移送位置之吸附部選擇性地移送。The main aspect of the present invention relates to a substrate inversion device for inverting a substrate. This kind of substrate turning device,
With a first suction section;
Second adsorption section;
The turning mechanism, in a state where the adsorption surface of the first adsorption portion and the adsorption surface of the second adsorption portion are opposed to each other, integrally rotating the first adsorption portion and the second adsorption portion by half a circle;
The transport mechanism selectively transports the adsorption unit positioned at the transport position in the reversing mechanism among the first adsorption unit and the second adsorption unit.
根據此構成，由於第一吸附部及第二吸附部被兼用於基板翻轉時之基板之交付動作與基板之移送動作，故可將基板翻轉裝置之構成簡化。According to this configuration, since the first suction section and the second suction section are used for both the substrate delivery operation and the substrate transfer operation when the substrate is inverted, the structure of the substrate inversion device can be simplified.
本態樣之基板翻轉裝置中，
前述翻轉機構，
具備
導引軌道，使前述第一吸附部及前述第二吸附部一體地旋轉半圈；
導引板體，受前述導引軌道導引，連接於前述第一吸附部及前述第二吸附部之各者；
前述導引軌道，透過前述導引板體連接於前述第一吸附部及前述第二吸附部之各者，
在前述第一吸附部之吸附面與前述第二吸附部之吸附面互相對向之狀態時，前述導引軌道成為圓形狀，前述導引板體成為可沿著前述導引軌道旋轉。In this aspect of the substrate turning device,
The aforementioned turning mechanism,
With a guide rail, the first adsorption part and the second adsorption part are rotated integrally for half a turn;
The guide plate body is guided by the guide rail and is connected to each of the first adsorption portion and the second adsorption portion;
The guide rail is connected to each of the first adsorption section and the second adsorption section through the guide plate body,
When the suction surface of the first suction portion and the suction surface of the second suction portion face each other, the guide rail has a circular shape, and the guide plate body is rotatable along the guide rail.
根據此構成，第一吸附部與第二吸附部，在各自之吸附面互相對向之狀態時，可透過導引板體沿著導引軌道旋轉。因此，基板可在夾於第一吸附部之吸附面及第二吸附部之吸附面之間之狀態下順利地旋轉半圈。亦即，由於與基板之翻轉同時地，第一吸附部及第二吸附部一體地旋轉半圈，故於第一吸附部及第二吸附部中，位於移送位置者會交換。基板被位於移送位置之吸附部吸附，被搬送機構移送往既定之位置。如上述，與基板之表裡翻轉被進行同時地，用來將基板移送至既定之位置之吸附被進行。因此，可效率良好地進行基板之翻轉及往既定之位置之移送。According to this configuration, when the first suction portion and the second suction portion face each other, they can rotate along the guide rail through the guide plate body. Therefore, the substrate can be smoothly rotated for half a circle in a state sandwiched between the adsorption surface of the first adsorption portion and the adsorption surface of the second adsorption portion. That is, since the first adsorption section and the second adsorption section rotate integrally for half a turn at the same time as the substrate is turned over, those in the first adsorption section and the second adsorption section are exchanged at the transfer position. The substrate is sucked by the suction part located at the transfer position, and is transferred to the predetermined position by the transfer mechanism. As described above, at the same time as the front and back inversion of the substrate is performed, the suction for moving the substrate to a predetermined position is performed. Therefore, the substrate can be efficiently turned over and transferred to a predetermined position.
本態樣之基板翻轉裝置中，
前述翻轉機構，進一步具備支持前述導引軌道之支持板體，
前述導引板體，透過前述導引軌道連接於前述支持板體，
前述搬送機構，連結於前述支持板體。In this aspect of the substrate turning device,
The turning mechanism further includes a supporting plate supporting the guiding track,
The guide plate body is connected to the support plate body through the guide rail,
The conveyance mechanism is connected to the support plate.
根據此構成，由於搬送機構連結於支持板體，故第一吸附部或第二吸附部透過導引板體及導引軌道，連接於支持板體。因此，可將吸附部、導引板體、導引軌道、及支持板體藉由搬送機構一體地移送。According to this configuration, since the conveyance mechanism is connected to the support plate, the first suction portion or the second suction portion is connected to the support plate through the guide plate and the guide rail. Therefore, the suction part, the guide plate body, the guide rail, and the support plate body can be integrally transferred by the transfer mechanism.
本態樣之基板翻轉裝置中，
前述導引軌道、前述導引板體、及前述支持板體，分別被分割為兩半，
被分割為兩半之前述導引軌道，組合成為圓形，且，以其中一方配置於前述移送位置側之方式，分別受被分割為兩半之前述支持板體支持，
被分割為兩半之前述導引板體，相對於組合成為圓形之前述導引軌道，組合為可在前述移送位置與從前述移送位置離開之位置之間相互旋轉，
前述第一吸附部與前述第二吸附部，分別連接於被分割為兩半之前述導引板體，
前述搬送機構，僅連結於被分割為兩半之前述支持板體之中配置於前述移送位置之支持板體，位於前述移送位置側，將透過前述導引軌道及前述導引板體連接於前述支持板體之吸附部選擇性地移送。In this aspect of the substrate turning device,
The guide rail, the guide plate body, and the support plate body are divided into two halves, respectively.
The aforementioned guide rails divided into two halves are combined into a circle, and one of them is arranged on the side of the transfer position, and is respectively supported by the aforementioned support plate divided into two halves.
With respect to the aforementioned guide plate body divided into two halves, relative to the aforementioned guide rail combined into a circle, the combination is rotatable between the aforementioned transfer position and a position separated from the aforementioned transfer position,
The first adsorption part and the second adsorption part are respectively connected to the guide plate body divided into two halves,
The conveying mechanism is only connected to the support plate body arranged in the aforementioned transfer position among the support plate bodies divided into two halves, which is located on the side of the aforementioned transfer position and connects to the aforementioned through the guide rail and the guide plate body. The suction part of the supporting plate body is selectively transferred.
根據此構成，即使在位於移送位置之吸附部在第一吸附部與第二吸附部之間交換之場合，位於移送位置之支持板體，在被分割為兩半之支持板體之中，始終是相同之支持板體。因此，即使因翻轉機構而第一吸附部與第二吸附部一體地旋轉半圈，位於移送位置之吸附部交換，也沒有每次將搬送機構與吸附部重新連結之必要。亦即，只要將支持於可移送之支持板體之導引板體及吸附部之位置交換即可，故可將基板之翻轉效率良好地進行。According to this configuration, even when the suction portion located at the transfer position is exchanged between the first suction portion and the second suction portion, the support plate located at the transfer position is always divided among the support plates divided into two halves. It is the same support plate. Therefore, even if the first adsorption unit and the second adsorption unit rotate integrally for half a turn due to the turning mechanism, it is not necessary to reconnect the transport mechanism and the adsorption unit each time when the adsorption unit located at the transfer position is exchanged. That is, as long as the positions of the guide plate body and the suction part supported on the movable support plate body can be exchanged, the substrate can be efficiently turned over.
本態樣之基板翻轉裝置中，
前述翻轉機構，
具備
導引軌道，連接於前述第一吸附部及前述第二吸附部之各者；
導引板體，受前述導引軌道導引，使前述第一吸附部及前述第二吸附部一體地旋轉半圈；
前述導引板體，透過前述導引軌道連接於前述第一吸附部及前述第二吸附部之各者，
在前述第一吸附部之吸附面與前述第二吸附部之吸附面互相對向之狀態時，前述導引軌道成為圓形狀，前述導引板體成為可沿著前述導引軌道旋轉。In this aspect of the substrate turning device,
The aforementioned turning mechanism,
With a guide rail, connected to each of the first adsorption section and the second adsorption section;
The guide plate body is guided by the guide rail, so that the first adsorption portion and the second adsorption portion rotate integrally for half a turn;
The guide plate body is connected to each of the first suction section and the second suction section through the guide rail,
When the suction surface of the first suction portion and the suction surface of the second suction portion face each other, the guide rail has a circular shape, and the guide plate body is rotatable along the guide rail.
根據此構成，第一吸附部及第二吸附部，在各自之吸附面對向之狀態時，可透過導引軌道沿著導引板體旋轉。藉此，與上述同樣地，與基板之翻轉同時地，第一吸附部及第二吸附部之吸附部一體地旋轉半圈，可將第一吸附部及第二吸附部之位置交換。According to this configuration, when the first suction section and the second suction section face each other, they can rotate along the guide plate body through the guide rail. Thereby, similarly to the above, simultaneously with the inversion of the substrate, the adsorption sections of the first adsorption section and the second adsorption section rotate integrally for half a turn, and the positions of the first adsorption section and the second adsorption section can be exchanged.
本態樣之基板翻轉裝置中，
前述翻轉機構，進一步具備支持前述導引板體之支持板體，
前述導引軌道，透過前述導引板體連接於前述支持板體，
前述搬送機構，連結於前述支持板體。In this aspect of the substrate turning device,
The turning mechanism further includes a supporting plate supporting the guiding plate,
The guide rail is connected to the support plate body through the guide plate body,
The conveyance mechanism is connected to the support plate.
根據此構成，第一吸附部或第二吸附部，透過導引板體及導引軌道連接於支持板體。藉此，可將導引板體、導引軌道、及支持板體藉由搬送機構一體地移送。According to this configuration, the first suction portion or the second suction portion is connected to the support plate through the guide plate and the guide rail. Thereby, the guide plate body, the guide rail, and the support plate body can be integrally transferred by the transfer mechanism.
本態樣之基板翻轉裝置中，
前述導引軌道、前述導引板體、及前述支持板體，分別被分割為兩半，
被分割為兩半之前述導引板體，以其中一方配置於前述移送位置側之方式，分別受被分割為兩半之前述支持板體支持，
被分割為兩半之前述軌道，組合成為圓形，相對於前述導引板體，組合為可在前述移送位置與從前述移送位置離開之位置之間相互旋轉，
前述第一吸附部與前述第二吸附部，分別連接於被分割為兩半之前述導引軌道，
前述搬送機構，僅連結於被分割為兩半之前述支持板體之中配置於前述移送位置之支持板體，位於前述移送位置側，將透過前述導引板體及前述導引軌道連接於前述支持板體之吸附部選擇性地移送。In this aspect of the substrate turning device,
The guide rail, the guide plate body, and the support plate body are divided into two halves, respectively.
The aforementioned guide plate body divided into two halves is supported by the aforementioned support plate body divided into two in such a manner that one of them is disposed on the side of the transfer position,
The aforementioned track divided into two halves is combined to form a circle, and is combined to be rotatable with respect to the guide plate body between the aforementioned transfer position and a position separated from the aforementioned transfer position,
The first adsorption part and the second adsorption part are respectively connected to the guide rail divided into two halves,
The transfer mechanism is only connected to the support plate body which is arranged in the transfer position among the support plate bodies which are divided into two halves, is located on the transfer position side, and is connected to the aforementioned through the guide plate body and the guide rail The suction part of the supporting plate body is selectively transferred.
根據此構成，位於移送位置之支持板體，在被分割為兩半之支持板體之，始終是相同之支持板體。因此，即使因翻轉機構而第一吸附部與第二吸附部一體地旋轉半圈，位於移送位置之吸附部交換，也沒有每次將搬送機構與吸附部重新連結之必要。亦即，只要對可移送之支持板體，將導引軌道及吸附部之位置交換即可，故可將基板之翻轉效率良好地進行。
［發明之效果］According to this configuration, the supporting plate body located at the transfer position is always the same supporting plate body when it is divided into two. Therefore, even if the first adsorption unit and the second adsorption unit rotate integrally for half a turn due to the turning mechanism, it is not necessary to reconnect the transport mechanism and the adsorption unit each time when the adsorption unit located at the transfer position is exchanged. That is, as long as the position of the guide rail and the suction portion is exchanged for the supportable plate body that can be transferred, the substrate can be efficiently turned over.
[Effect of Invention]
如上述，根據本發明，可提供可使裝置之構成簡化且省空間化且能效率良好地進行基板之翻轉之基板翻轉裝置。As described above, according to the present invention, it is possible to provide a substrate reversing device that can simplify the configuration of the device, save space, and efficiently invert the substrate.
本發明之效果與意義，應可藉由於以下所示之實施形態之說明而更加明確。然而，以下所示之實施形態只不過是實施本發明時之一個例示，本發明並不受以下實施形態之記載內容任何限制。The effect and significance of the present invention should be made clearer by the description of the embodiment shown below. However, the embodiment shown below is only an example for implementing the present invention, and the present invention is not limited in any way by the content of the following embodiment.
以下，針對本發明之實施形態，參照圖式進行說明。另外，於各圖中，為求方便起見，標示有互相正交之X軸、Y軸、Z軸。X-Y平面平行於水平面，Z軸方向是鉛直方向。Z軸正側是上方，Z軸負側是下方。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing, for convenience, X-axis, Y-axis, and Z-axis that are orthogonal to each other are indicated. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is vertical. The positive side of the Z axis is upward, and the negative side of the Z axis is downward.
〈實施形態〉
玻璃基板及陶瓷基板等脆性材料基板或PET（聚對苯二甲酸乙二酯樹脂）基板及聚醯亞胺樹脂基板等樹脂基板等（以下，僅稱為「基板」），經過各種處理後，成為最終製品。作為如上述之處理，有例如將基板切斷為既定數量之分割要素之處理、將於切斷基板之場合產生之端材除去之處理、將基板之表面清淨化之處理等。基板，於各處理中被搬送往既定之載台，在處理結束後，為了進行下一個處理而被往其他載台搬送。實施形態之基板翻轉裝置1，是於將基板從既定之載台往下一個載台搬送時，用來使基板翻轉之裝置。例如，於將複數層之基板切斷之切斷步驟中，在最初從複數層之基板之上面側切斷之場合，在將上面側切斷後，會使下面側翻轉為上面側，再次進行切斷。在如上述之場合，有使基板翻轉之必要。在如上述之場合，以基板翻轉裝置1使基板翻轉。〈Implementation Mode〉
After various treatments, such as substrates of brittle materials such as glass substrates and ceramic substrates, resin substrates such as PET (polyethylene terephthalate resin) substrates and polyimide resin substrates (hereinafter, referred to as "substrates"), Become the final product. Examples of the processing as described above include processing for cutting the substrate into a predetermined number of divided elements, processing for removing end materials generated when the substrate is cut, and processing for cleaning and cleaning the surface of the substrate. The substrate is transported to a predetermined stage in each process, and after the process is completed, it is transported to another stage for the next process. The substrate reversing device 1 according to the embodiment is a device for reversing a substrate when the substrate is transferred from a predetermined stage to the next stage. For example, in the cutting step of cutting a plurality of substrates, when the substrate is first cut from the upper side of the plurality of substrates, after cutting the upper side, the lower side is turned to the upper side, and the cutting is performed again Off. In such a case, it is necessary to invert the substrate. In such a case, the substrate is inverted by the substrate inversion device 1.
於基板之種類中，有包含例如聚醯亞胺樹脂、聚醯胺樹脂、PET等聚酯樹脂、聚乙烯、聚丙烯等聚烯烴樹脂、聚苯乙烯、聚氯乙烯等聚乙烯樹脂等樹脂基板等有機質基板（包含薄膜或薄片，以下亦同）、玻璃基板或陶瓷基板等脆性材料基板等無機質基板。基板是樹脂基板之場合，可以是將不同基板積層而成，例如，將PET、聚醯亞胺樹脂、PET從下層依照此順序積層而成之基板亦可。Examples of the substrate include resin substrates such as polyimide resin, polyimide resin, polyester resin such as PET, polyolefin resin such as polyethylene and polypropylene, and polyethylene resin such as polystyrene and polyvinyl chloride. And other inorganic substrates such as organic substrates (including thin films or sheets, the same applies hereinafter), brittle material substrates such as glass substrates and ceramic substrates. When the substrate is a resin substrate, different substrates may be laminated. For example, a substrate obtained by laminating PET, polyimide resin, and PET in this order from the lower layer may be used.
被基板翻轉裝置1搬送之基板F，是在經過折斷步驟後於既定方向被分割為複數個之狀態亦可。如上述之基板F，於既定方向被分割，並進一步於相對於既定方向垂直地被分割亦可，被分割後之基板F，成為網格狀。於如上述般被分割後之狀態之基板F中，所謂「既定方向」是指X軸正方向，與基板翻轉裝置1搬送基板F之方向一致。The substrates F carried by the substrate inverting device 1 may be divided into a plurality of substrates in a predetermined direction after the breaking step. As described above, the substrate F may be divided in a predetermined direction, and may be further vertically divided with respect to the predetermined direction. The divided substrate F may be grid-shaped. In the substrate F that has been divided as described above, the "predetermined direction" refers to the positive direction of the X-axis, which is the same as the direction in which the substrate F is transported by the substrate inversion device 1.
[基板翻轉裝置之全體構成]
圖1是顯示實施形態之基板翻轉裝置1之外觀構成之立體圖。如圖1所示，基板翻轉裝置1具備吸附部100、翻轉機構200、搬送機構3000。[Overall structure of substrate turning device]
FIG. 1 is a perspective view showing an external configuration of a substrate inverting device 1 according to the embodiment. As shown in FIG. 1, the substrate reversing device 1 includes a suction unit 100, a reversing mechanism 200, and a transport mechanism 3000.
由基板翻轉裝置1翻轉之基板F，如上述般，可能是由從基板F之上面側切斷之切斷裝置等直接搬入。此外，翻轉後之基板F，可能往原本之裝置被搬出，也可能往其他之裝置被搬出。或者，基板F，也可能先從切斷裝置等被移往其他場所後，再被搬入基板翻轉裝置1。在此，在實施形態中，將於被搬入基板翻轉裝置1前、及使基板F翻轉後基板被載置之區域稱為「基板載置部2」。此外，於基板載置部2中，將載置基板F之面稱為「載置面2a」。As described above, the substrate F inverted by the substrate inverting device 1 may be directly carried in by a cutting device or the like that is cut from the upper surface side of the substrate F. In addition, the inverted substrate F may be carried out to the original device, or it may be carried out to another device. Alternatively, the substrate F may be moved from the cutting device to another location before being carried into the substrate inverting device 1. Here, in the embodiment, a region where the substrate is placed before being carried into the substrate inverting device 1 and after the substrate F is inverted is referred to as a "substrate placing portion 2". In addition, in the board | substrate mounting part 2, the surface which mounts the board | substrate F is called "mounting surface 2a."
基板F被載置於如上述之基板載置部2之載置面2a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。。基板載置部2，是具有用來載置基板F之平坦面，亦即載置面之構件，例如，包含平台或帶式輸送機等亦可。基板載置部2，形成有多數之細孔，接下來要說明的壓力賦予部3，是透過此細孔對基板F賦予壓力。The substrate F is placed on the mounting surface 2a of the substrate mounting section 2 as described above. Other fonts are used in the file. Please adjust the font (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). . The substrate mounting portion 2 is a member having a flat surface on which the substrate F is mounted, that is, a mounting surface. For example, it may include a platform or a belt conveyor. The substrate mounting portion 2 is formed with a large number of fine holes. The pressure applying portion 3 to be described below applies pressure to the substrate F through the fine holes.
壓力賦予部3，包含空壓源，設置於基板載置部2之下面，對基板F之下面賦予壓力。壓力賦予部3，是通過形成於基板載置部2之下面之多數之微小之孔，對基板F之下面賦予壓力。在壓力賦予部3對基板F賦予負壓之場合，基板F被吸附於基板載置部2，基板F成為密著於基板載置部2之狀態。相對於上述狀況，在壓力賦予部3對基板F不賦予負壓之場合、以及賦予正壓之場合，由於基板F與基板載置部2並非處於吸附狀態，故可容易使基板F從基板載置部2脫離。The pressure applying section 3 includes an air pressure source, is provided below the substrate mounting section 2, and applies pressure to the lower surface of the substrate F. The pressure applying portion 3 applies pressure to the lower surface of the substrate F through a plurality of minute holes formed in the lower surface of the substrate placing portion 2. When the pressure applying section 3 applies a negative pressure to the substrate F, the substrate F is attracted to the substrate placing section 2 and the substrate F is brought into close contact with the substrate placing section 2. In contrast to the above situation, when the pressure applying section 3 does not apply a negative pressure to the substrate F and when a positive pressure is applied, the substrate F and the substrate placing section 2 are not in an adsorbed state, so the substrate F can be easily carried from the substrate. Setting section 2 is disengaged.
吸附部100，吸附基板F。翻轉機構200，將吸附部100吸附之基板F翻轉。搬送機構300，將基板F往既定之位置搬送。The suction section 100 sucks the substrate F. The turning mechanism 200 turns the substrate F sucked by the suction part 100. The transfer mechanism 300 transfers the substrate F to a predetermined position.
藉由實施形態之基板翻轉裝置1而被翻轉之基板F，如上述般，有各種之基板。在此，基板F是樹脂基板之場合，若將基板F吸附時、將基板F載置時等，於基板F與吸附面或載置面之間有空氣介在，則於基板F容易有皺紋產生。產生了皺紋的基板F，會對最終製品之品質產生影響。因此，針對上述問題，於實施形態之基板翻轉裝置1中，假設基板F是樹脂基板。此外，作為吸附部，適用具備可不使基板F產生皺紋地吸附之構成之吸附部100。As described above, there are various substrates F that are inverted by the substrate inversion device 1 of the embodiment. Here, when the substrate F is a resin substrate, if there is air interposed between the substrate F and the adsorption surface or the mounting surface when the substrate F is adsorbed or placed on the substrate F, wrinkles are likely to occur on the substrate F. . The substrate F where wrinkles are generated will affect the quality of the final product. Therefore, in order to solve the above problems, in the substrate inversion device 1 of the embodiment, it is assumed that the substrate F is a resin substrate. Moreover, as the adsorption part, the adsorption part 100 provided with the structure which can adsorb | suck the board | substrate F without wrinkle is suitable.
吸附部100，如圖1所示，具備第一吸附部110、第二吸附部160。第一吸附部110、第二吸附部160具備相同之構成，第一吸附部110之吸附面與第二吸附部160之吸附面配置為互相對向。以下，針對於圖1中配置於上方之第一吸附部110進行說明。As shown in FIG. 1, the adsorption section 100 includes a first adsorption section 110 and a second adsorption section 160. The first adsorption section 110 and the second adsorption section 160 have the same configuration, and the adsorption surface of the first adsorption section 110 and the adsorption surface of the second adsorption section 160 are arranged to face each other. Hereinafter, the first adsorption part 110 arranged above in FIG. 1 will be described.
圖2是用來說明實施形態之基板翻轉裝置1之吸附部100之立體圖，具體而言，是第一吸附部110之立體圖。圖3（a）是實施形態之基板翻轉裝置1之吸附板體120之分解立體圖。圖3（b）是用來說明實施形態之基板翻轉裝置1之吸附部100之驅動機構130之局部擴大圖。FIG. 2 is a perspective view of the suction section 100 of the substrate inversion device 1 for explaining the embodiment, and specifically, is a perspective view of the first suction section 110. FIG. 3 (a) is an exploded perspective view of the adsorption plate body 120 of the substrate reversing device 1 of the embodiment. FIG. 3 (b) is a partially enlarged view for explaining the driving mechanism 130 of the suction section 100 of the substrate reversing device 1 of the embodiment.
如圖2所示，第一吸附部110，具備吸附板體120、驅動機構130。吸附板體120，是實際上吸附基板F之構件，如接下來說明般，由複數個構件構成。驅動機構130，以使吸附板體120相對於基板F接近及離開之方式進行驅動。As shown in FIG. 2, the first suction unit 110 includes a suction plate 120 and a driving mechanism 130. The adsorption plate body 120 is a member that actually adsorbs the substrate F, and is composed of a plurality of members as described below. The driving mechanism 130 drives the suction plate 120 to approach and move away from the substrate F.
如圖3（a）所示，吸附板體120，具備板體121、基座124、吸附構件125，從上方依照上述順序被積層。板體121，於上面設置驅動機構130。板體121，雖然只要是具有既定之強度及柔軟性之材質就不特別限定，但在實施形態中，是鋁。板體121，是以X軸方向為長邊之矩形狀。板體121，形成有複數個較小之孔122，於此等孔122連接不圖示之配管。As shown in FIG. 3 (a), the adsorption plate body 120 includes a plate body 121, a base 124, and an adsorption member 125, and is laminated in the above order from above. The plate body 121 is provided with a driving mechanism 130 thereon. The plate body 121 is not particularly limited as long as it has a predetermined strength and flexibility, but in the embodiment, it is aluminum. The plate body 121 has a rectangular shape having a long side in the X-axis direction. The plate body 121 is formed with a plurality of smaller holes 122, and these holes 122 are connected to pipes (not shown).
基座124，形成有多數之微小之孔，是厚度1 m文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。m程度之不銹鋼。吸附構件125，抵接於基板F。吸附構件125，只要是不會對基板F之表面給予損傷之材質且多孔質性之構件就不特別限定。作為如上述之材質，可列舉例如具有連續氣泡之發泡塑膠及發泡橡膠等發泡材料、海綿等。在實施形態中，吸附構件125是海綿。另外，「第一吸附部110之吸附面」，是指此吸附構件125之吸附面。第二吸附部160之吸附面亦同。The base 124 is formed with a large number of tiny holes, and other fonts are used in the thickness of 1 m. Please adjust the fonts (please set the Chinese characters to the new detailed style and the English characters to the Times New Roman). m stainless steel. The suction member 125 is in contact with the substrate F. The adsorption member 125 is not particularly limited as long as it is a material that does not damage the surface of the substrate F and is porous. Examples of the material described above include foamed materials such as foamed plastics and foamed rubbers having continuous cells, sponges, and the like. In the embodiment, the adsorption member 125 is a sponge. In addition, the "suction surface of the first adsorption part 110" means the adsorption surface of this adsorption member 125. The same applies to the adsorption surface of the second adsorption portion 160.
在吸附板體120將基板F吸附之場合，從不圖示之空壓源送來之空氣通過上述之配管，通過形成於基座124之多數之孔，對吸附構件125賦予空氣壓。When the adsorption plate body 120 adsorbs the substrate F, air sent from an air pressure source (not shown) passes through the above-mentioned piping and passes through a plurality of holes formed in the base 124 to apply air pressure to the adsorption member 125.
吸附板體120，對基板F上面之全面進行吸附。因此，構成吸附板體120之板體121、基座124、及吸附構件125，是至少比基板F之上面大之尺寸。此外，板體121，是將以Y軸方向為長邊方向之矩形狀之板體123於X軸方向排列而形成。在實施形態中，板體121，由27片板體123形成，且被排列為竹簾狀。此外，吸附板體120，將板體123以適當之片數作為一組，被區分為複數個區域。在實施形態中，將板體123以三片為一組，從X軸負側依序區分為區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I之九個區域。在圖3（a）中，顯示區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I之一部分。於除了位於吸附板體120之中央之區域120E以外之區域，設置構成驅動機構130之驅動部140等。於區域120E設置中央軸126。接著，針對驅動機構130進行說明。The suction plate 120 absorbs the entire surface of the substrate F. Therefore, the plate body 121, the base 124, and the suction member 125 constituting the suction plate body 120 are at least larger than the upper surface of the substrate F. In addition, the plate body 121 is formed by arranging rectangular plate bodies 123 having the Y-axis direction as the long side direction in the X-axis direction. In the embodiment, the plate body 121 is formed of 27 plate bodies 123 and arranged in a bamboo curtain shape. In addition, the plate body 120 is adsorbed, and the plate body 123 is divided into a plurality of regions by using an appropriate number of plates as a group. In the embodiment, the plate body 123 is divided into three groups, and the area is sequentially divided from the negative side of the X-axis into the area 120A. There are other fonts used in the file. Please adjust the font (Chinese characters should be set to new details, English characters Please set to Times New Roman). ~ Nine of the areas 120I. In Figure 3 (a), other fonts are used in the 120A file in the display area. Please adjust the font (for Chinese characters, please set the new detail style, for English characters, please set it to Times New Roman). ~ Part of area 120I. In a region other than the region 120E located in the center of the suction plate body 120, a driving portion 140 and the like constituting the driving mechanism 130 are provided. A central axis 126 is provided in the area 120E. Next, the driving mechanism 130 will be described.
驅動機構130具備複數個驅動部140，將吸附板體120以相對於基板F接近及離開之方式驅動。於複數個驅動部140之各個，設置第一止動器131、第二止動器132、移動構件133、支持部150。亦即，驅動機構130，具備複數個以驅動部140、第一止動器131、第二止動器132、移動構件133、以及支持部150為一組之驅動體而構成。在此，將以驅動部140為中心之如上述之組稱為「驅動體」。驅動部140，具體而言是氣壓缸。以下，「驅動部140」記載為「氣壓缸140」。The drive mechanism 130 includes a plurality of drive units 140 and drives the suction plate 120 to approach and move away from the substrate F. A first stopper 131, a second stopper 132, a moving member 133, and a support portion 150 are provided in each of the plurality of driving portions 140. That is, the driving mechanism 130 includes a plurality of driving bodies including a driving unit 140, a first stopper 131, a second stopper 132, a moving member 133, and a support unit 150 as a set. Here, the above-mentioned group centering on the driving unit 140 is referred to as a “driving body”. The driving unit 140 is specifically a pneumatic cylinder. Hereinafter, the "drive unit 140" is described as "the pneumatic cylinder 140."
接著，針對驅動體，基於圖3（b）進行說明。另外，圖3（b）是設置於區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。之驅動體之擴大圖。氣壓缸140，具備本體141、收容於本體141之活塞桿142、導引活塞桿142之外筒143、設置於本體141之下部之連結構件144、設置於本體141之連接部145。連結構件144，於Y軸方向形成有孔144a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。。Next, the driving body will be described based on FIG. 3 (b). In addition, Figure 3 (b) shows that other fonts are used in the file of area 120A. Please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). Enlarged view of the driver. The pneumatic cylinder 140 includes a main body 141, a piston rod 142 housed in the main body 141, an outer cylinder 143 that guides the piston rod 142, a connecting member 144 provided at a lower portion of the main body 141, and a connecting portion 145 provided at the main body 141. The connecting member 144 has holes 144a formed in the Y-axis direction. Other fonts are used in the file. Please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman type). .
支持部150，具備支持軸151、四個軸152、兩個支持構件153、下側板154、上側板155、兩個柱156。四個軸152，於Y軸負側與正側分別各設置兩個，各軸152之下端面固定於板體123。兩個支持構件153，分別於Z軸方向形成有兩個孔153a，於各孔153a使各軸152通過。兩個支持構件153，於Y軸方向形成有孔153b。The support portion 150 includes a support shaft 151, four shafts 152, two support members 153, a lower side plate 154, an upper side plate 155, and two posts 156. Two of the four shafts 152 are respectively provided on the negative side and the positive side of the Y-axis, and the lower end surface of each shaft 152 is fixed to the plate 123. The two supporting members 153 are formed with two holes 153a in the Z-axis direction, and each shaft 152 is passed through each hole 153a. The two supporting members 153 are formed with holes 153b in the Y-axis direction.
支持軸151，是將氣壓缸140可轉動地支持之軸，平行於吸附板體120亦即板體121之Y軸方向，並且，相對於板體121設置於垂直方向。支持軸151，依序通過Y軸負側之支持構件153之孔153b、連結構件144之孔144a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。、Y軸正側之支持構件153之孔153b。此外，兩個移動構件133，分別於Y軸方向形成有孔133a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。。於上述之支持軸151中，移動構件133之孔133a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。從Y軸正側被支持軸151通過，移動構件133之孔133a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。從Y軸負側被支持軸151通過。如上述，由於連結構件144設置於氣壓缸140之本體141之下部，故支持軸151，以可轉動之方式連接於氣壓缸140及支持部150。The support shaft 151 is a shaft that rotatably supports the pneumatic cylinder 140, is parallel to the Y-axis direction of the adsorption plate 120, that is, the plate 121, and is disposed in a vertical direction with respect to the plate 121. The support shaft 151 passes through the hole 153b of the support member 153 and the hole 144a of the connecting member 144 in sequence on the negative side of the Y-axis. Other fonts are used in the file. Please adjust the font (Chinese characters should be set to new details, English characters should be set (Times New Roman). The hole 153b of the support member 153 on the positive side of the Y-axis. In addition, the two moving members 133 are formed with holes 133a in the Y-axis direction. Other fonts are used in the file. Please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). . In the above-mentioned support shaft 151, other fonts are used in the document 133a of the hole 133a of the moving member 133, please adjust the font (please set the Chinese characters to the new detail style, and the English characters to the Times New Roman). Pass the support axis 151 from the positive side of the Y-axis. Other fonts are used in the hole 133a of the moving member 133. Please adjust the font (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). Passed by the support shaft 151 from the negative side of the Y-axis. As described above, since the connecting member 144 is disposed below the body 141 of the pneumatic cylinder 140, the support shaft 151 is rotatably connected to the pneumatic cylinder 140 and the supporting portion 150.
下側板154，於中央部分形成有矩形狀之孔154a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。，以孔154a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。包圍本體141之方式，下側板154載置、連接於四個軸152之上端面。下側板154，隔著孔154a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。於Y軸負側及正側分別設置柱156，於各自之柱156之上端面連接上側板155。在此，於上側板155，於中央部形成有孔155a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。，於孔155a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。有外筒143通過。The lower side plate 154 has a rectangular hole 154a formed in the central part. Other fonts are used in the file. Please adjust the font (please set the Chinese character to the new detail style and the English character to the Times New Roman). , Other fonts are used in the hole 154a file, please adjust the font (Chinese characters please set to new detail style, English characters please set to Times New Roman). In a manner to surround the body 141, the lower side plate 154 is placed and connected to the upper end faces of the four shafts 152. The lower side plate 154 has other fonts used in the file through the hole 154a. Please adjust the font (for Chinese characters, please set the new detail style, for English characters, please set it to Times New Roman). Pillars 156 are respectively provided on the negative side and the positive side of the Y-axis, and upper end plates 155 are connected to the upper end surfaces of the respective pillars 156. Here, in the upper plate 155, a hole 155a is formed in the central portion. Other fonts are used in the file. Please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). , There are other fonts used in Kong 155a file, please adjust the font (Chinese characters please set to new details, English characters please set to Times New Roman). There is an outer cylinder 143 to pass.
兩個移動構件133，分別於上部設置滑動部134。滑動部134，嵌入形成於機架部4下面之溝槽部，使移動構件133可於X軸方向滑動移動。移動構件133，透過支持軸151連接於支持部150及氣壓缸140。藉此，若移動構件133於X軸方向滑動移動，氣壓缸140及支持部150亦於X軸方向滑動移動。The two moving members 133 are provided with sliding portions 134 on the upper portions, respectively. The sliding portion 134 fits into a groove portion formed under the frame portion 4 so that the moving member 133 can slide and move in the X-axis direction. The moving member 133 is connected to the support portion 150 and the pneumatic cylinder 140 through the support shaft 151. Therefore, if the moving member 133 slides in the X-axis direction, the pneumatic cylinder 140 and the support portion 150 also slide in the X-axis direction.
第一止動器131，於每一個驅動體設置有兩個，設置於兩個支持構件153之下部，且不與於Z軸方向通過支持構件153之軸152接觸。第二止動器132，相對於設置於Y軸正側之移動構件133，以位於靠近第一吸附部110之中央部，亦即，靠近中央軸126之方式，連結於機架部4。Two first stoppers 131 are provided on each driving body, and are disposed below the two supporting members 153, and do not contact the shaft 152 passing through the supporting members 153 in the Z-axis direction. The second stopper 132 is connected to the frame portion 4 with respect to the moving member 133 provided on the positive side of the Y-axis so as to be located near the central portion of the first suction portion 110, that is, near the central shaft 126.
以如上述般構成之驅動部140為中心之驅動體，是如後述般驅動。在對氣壓缸140從不圖示之空壓源賦予正壓之場合，活塞桿142，一邊受外筒143導引，一邊往上方移動。此時，四個軸152亦配合活塞桿142之移動，一邊滑接於孔153a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。一邊往上方移動。由於四個軸152與吸附板體120亦即區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。連接，故若軸152往上方移動，則區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。亦會上升。雖在如上述般操作後區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。會往上方移動，但因第一止動器131而移動距離受到限制。The driving body centered on the driving unit 140 configured as described above is driven as described later. When a positive pressure is applied to the pneumatic cylinder 140 from an air pressure source (not shown), the piston rod 142 moves upward while being guided by the outer cylinder 143. At this time, the four shafts 152 also cooperate with the movement of the piston rod 142, while sliding into the hole 153a, other fonts are used in the file. Please adjust the font (Chinese characters should be set to new details, English characters should be set to Times New Roman ). Move one side up. Since other fonts are used in the file of the four shafts 152 and the adsorption plate 120, that is, the area 120A, please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). Connection, so if the axis 152 moves upwards, other fonts are used in the file of area 120A, please adjust the font (please set the Chinese characters to the new detail style, and the English characters to the Times New Roman). It will also rise. Although other fonts are used in the area 120A file after the operation as described above, please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). It moves upwards, but the movement distance is limited by the first stopper 131.
上述之構成，於被以圖1及圖2顯示之所有驅動體中皆相同。但是，第一止動器131之尺寸，隨著氣壓缸140被設置之區域而不同。設置於區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D之各第一止動器131，以在吸附板體120上升之場合，從區域120D往區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。依序移動距離變長之方式，設置於各支持構件153。藉此，若對設置於區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D之各個之各氣壓缸140賦予正壓而區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D上升，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D會變形為往基板載置部2側膨脹之大致圓弧狀。The above-mentioned structure is the same in all the driving bodies shown in FIGS. 1 and 2. However, the size of the first stopper 131 varies depending on the area where the pneumatic cylinder 140 is installed. There are other fonts used in the file set in the area 120A, please adjust the fonts (please set the Chinese characters to the new detailed style, and the English characters to the Times New Roman). ~ Each of the first stoppers 131 of the area 120D, when the suction plate 120 rises, other fonts are used in the file from the area 120D to the area 120A, please adjust the font (Chinese characters should be set to new detail, English Please set the text to Times New Roman). Each of the support members 153 is provided so that the moving distance becomes longer in order. Therefore, if other fonts are used in the file set in the area 120A, please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). Each of the air cylinders 140 to 120D is given a positive pressure, and other fonts are used in the file of area 120A. Please adjust the fonts (please set the Chinese characters to a new detail style and the English characters to Times New Roman). ～ The area 120D rises, and other fonts are used in the file of area 120A. Please adjust the font (for Chinese characters, please set to new detail style, for English characters, please set to Times New Roman). The region 120D is deformed into a substantially circular arc shape that expands toward the substrate mounting portion 2 side.
另外，若區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D往上方移動，則一方面各氣壓缸140轉動，另一方面區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D會往X軸負側傾斜。藉此，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D，變形為往基板載置部2側膨脹之圓滑之圓弧狀。此時，藉由各第二止動器132，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D之傾斜分別受到限制。藉此，可將區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D之形狀設定為既定曲率之圓弧狀。In addition, if other fonts are used in the area 120A file, please adjust the font (Please set the Chinese characters as the new detail style, and the English characters as the Times New Roman). ～ Area 120D moves upwards. On the one hand, each pneumatic cylinder 140 rotates. On the other hand, other fonts are used in the file of Area 120A. Please adjust the font. ). ~ Region 120D is inclined toward the negative side of the X axis. In this way, other fonts are used in the area 120A file. Please adjust the fonts (Chinese characters should be set to new details, English characters should be set to Times New Roman). The region 120D is deformed into a smooth arc shape that expands toward the substrate mounting portion 2 side. At this time, with each second stopper 132, other fonts are used in the file of area 120A, please adjust the font (please set the Chinese characters to the new detail style, and the English characters to the Times New Roman). The inclination of the ~ region 120D is restricted. In this way, other fonts can be used in the area 120A file. Please adjust the font (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). The shape of the ~ region 120D is set to an arc shape with a predetermined curvature.
上述之四個驅動體，如圖2所示，於區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D中Y軸負側亦設置有相同之驅動體。此外，氣壓缸140，於X-Y平面中，以設置有中央軸126之區域120E為中心，設置於對稱於X軸方向之位置。因此，如上述般，若區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120D變形為既定曲率之圓弧狀，區域120F文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I亦同樣地變形，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I變形為半圓形狀。The above four drivers, as shown in Figure 2, use other fonts in the area 120A file, please adjust the font (Chinese characters please set the new detailed style, English characters please set the Times New Roman). The same driving body is also provided on the negative side of the Y-axis in the ~ region 120D. In addition, the pneumatic cylinder 140 is disposed at a position symmetrical to the X-axis direction in the X-Y plane with the region 120E provided with the central axis 126 as the center. Therefore, as mentioned above, if other fonts are used in the area 120A file, please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). ～ The area 120D is deformed into an arc shape with a predetermined curvature. Other fonts are used in the area 120F file. Please adjust the font (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). ~ The area 120I is also deformed in the same way. Other fonts are used in the area 120A file. Please adjust the font (for Chinese characters, please set to new detail style, for English characters, please set to Times New Roman). The ~ region 120I is deformed into a semicircular shape.
另外，在實施形態中，吸附板體120，雖被區分為區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I，但並不限於如上述之區分。對應於基板F之尺寸，構成吸附板體120之板體121、基座124、及吸附構件125之尺寸被適當調整。板體121，雖由複數個板體123形成，但使用之板體123之尺寸及片數亦被適當調整。此外，設置於吸附板體120之驅動部140之數量，亦對應於基板F之尺寸來調整即可。In addition, in the embodiment, although the suction plate body 120 is divided into the area 120A, other fonts are used in the file, please adjust the font (please set the Chinese character to the new detail style, and the English character to the Times New Roman). ~ Area 120I, but it is not limited to the distinction as described above. Corresponding to the size of the substrate F, the sizes of the plate body 121, the base 124, and the suction member 125 constituting the suction plate body 120 are appropriately adjusted. Although the plate body 121 is formed of a plurality of plate bodies 123, the size and number of the plate bodies 123 used are also appropriately adjusted. In addition, the number of the driving portions 140 provided on the suction plate body 120 may also be adjusted according to the size of the substrate F.
關於由如上述之構成之第一吸附部110進行之基板F之吸附，基於圖4（a）～圖5（c）進行說明。圖4（a）～圖5（c），是顯示實施形態之基板翻轉裝置1之吸附部100吸附基板之狀態之示意圖。在此，吸附部100，是作為第一吸附部110來說明。此外，圖4（a）～圖5（c），是顯示從Y軸正側觀察之場合。The adsorption of the substrate F by the first adsorption unit 110 configured as described above will be described based on Figs. 4 (a) to 5 (c). 4 (a) to 5 (c) are schematic diagrams showing a state in which the substrate is adsorbed by the adsorption section 100 of the substrate inversion device 1 of the embodiment. Here, the adsorption section 100 is described as the first adsorption section 110. 4 (a) to 5 (c) are shown when viewed from the positive side of the Y-axis.
第一吸附部110，在從不圖示之空壓源對各氣壓缸140一起賦予正壓後，各活塞桿142往上方延伸，伴隨上述延伸，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I往上方移動。但是，區域120E，由於並沒有設置氣壓缸140，故為例外。此外，各區域之移動距離，受到各第一止動器131限制。此時，各氣壓缸140，以各支持軸151為中心，往與中央軸126相反之方向傾斜。因此，各移動構件133，往中央軸126之方向滑動移動。此外，各移動構件133之移動距離，受到第二止動器132限制。藉此，如圖4（a）所示，區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。～區域120I變形為具有既定曲率之圓滑之圓弧狀。在此狀態下，第一吸附部110，以區域120E最先抵接於基板F之方式接近。After the first suction unit 110 applies a positive pressure to each of the pneumatic cylinders 140 from an air pressure source (not shown), each piston rod 142 extends upward. With the above extension, other fonts are used in the area 120A file. Please adjust the font (Please set the Chinese characters as the new detailed style, and the English characters as the Times New Roman). ～ Area 120I moves upward. However, the area 120E is an exception because the air cylinder 140 is not provided. In addition, the moving distance of each area is restricted by each first stopper 131. At this time, each of the pneumatic cylinders 140 is tilted in a direction opposite to the central axis 126 with each supporting axis 151 as a center. Therefore, each moving member 133 slides in the direction of the central axis 126. In addition, the moving distance of each moving member 133 is restricted by the second stopper 132. Therefore, as shown in Figure 4 (a), other fonts are used in the area 120A file. Please adjust the fonts (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). The ~ region 120I is deformed into a smooth arc shape with a predetermined curvature. In this state, the first suction part 110 approaches so that the region 120E first comes into contact with the substrate F.
如圖4（b）所示，為了將第一吸附部110重疊於基板F，在對各氣壓缸140一起賦予負壓後，活塞桿142往下方移動。設置於各區域之各第一止動器131與基板F之距離，從吸附板體120之中央部往兩端部依序分離。因此，從區域120E～區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。、以及從區域120E～區域120I，依序抵接於基板F。藉此，介在於基板F與第一吸附部110之間之空氣，從基板F之中央部往兩端部被推出，在於基板F與第一吸附部110之間沒有空氣介在之狀態下，第一吸附部110重疊於基板F。在此狀態下，對第一吸附部110賦予空氣壓，開始基板F之吸附。As shown in FIG. 4 (b), in order to overlap the first suction part 110 on the substrate F, after a negative pressure is applied to each of the pneumatic cylinders 140, the piston rod 142 moves downward. The distance between each first stopper 131 provided in each area and the substrate F is sequentially separated from the central portion to the both end portions of the suction plate body 120. Therefore, other fonts are used in the files from the area 120E to the area 120A. Please adjust the fonts (please set the Chinese characters to the new detail style and the English characters to the Times New Roman). And the regions 120E to 120I are in contact with the substrate F in this order. Thereby, the air interposed between the substrate F and the first adsorption portion 110 is pushed out from the center portion of the substrate F to both end portions. In a state where no air is interposed between the substrate F and the first adsorption portion 110, the first An adsorption portion 110 is overlapped on the substrate F. In this state, air pressure is applied to the first suction section 110 and suction of the substrate F is started.
如圖4（c）所示，對各氣壓缸140一起賦予正壓，第一吸附部110變形為圓滑之圓弧狀。基板F，藉由搬送機構300被往翻轉機構200移送。As shown in FIG. 4 (c), a positive pressure is applied to each of the pneumatic cylinders 140, and the first suction part 110 is deformed into a smooth arc shape. The substrate F is transferred to the reversing mechanism 200 by the transfer mechanism 300.
如圖5（a）所示，在基板F被移送至翻轉機構200後，基板F，以中央部分最先抵接於第二吸附部160之吸附面之方式被載置。此時，與圖4（b）之場合同樣地，對各氣壓缸140一起賦予負壓，活塞桿142向下方移動，基板F，從中央部往兩端部依序接近第二吸附部160之吸附面。之後，如圖5（b）所示，基板F，被載置於第二吸附部160之吸附面後，進行基板F之翻轉。As shown in FIG. 5 (a), after the substrate F is transferred to the reversing mechanism 200, the substrate F is placed so that the central portion of the substrate F first contacts the suction surface of the second suction portion 160. At this time, as in the case of FIG. 4 (b), a negative pressure is applied to each of the pneumatic cylinders 140, the piston rod 142 moves downward, and the substrate F approaches the second suction portion 160 in sequence from the central portion to both end portions. Adsorption surface. After that, as shown in FIG. 5 (b), the substrate F is placed on the adsorption surface of the second adsorption part 160, and then the substrate F is inverted.
在基板F之翻轉被進行後，如圖5（c）所示，藉由第二吸附部160而基板F被吸附。之後，對第二吸附部160之各氣壓缸140一起賦予正壓，第二吸附部160，從區域120A文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。往區域120E及從區域120I往區域120E依序上升，變形為既定曲率之圓弧狀。第二吸附部160，藉由搬送機構300被移送至既定之位置，將基板F載置。上述動作，與圖4（a）及（b）所示之場合相同。在如上述般操作後，進行由吸附部10進行之基板F之吸附。After the inversion of the substrate F is performed, as shown in FIG. 5 (c), the substrate F is adsorbed by the second adsorption portion 160. After that, positive pressure is applied to each of the pneumatic cylinders 140 of the second suction section 160. The second suction section 160 uses other fonts from the file of the area 120A. Please adjust the font (Chinese characters should be set to new details and English characters). Please set to Times New Roman). The area 120E and the area 120I rise in order from the area 120E, and are deformed into a circular arc shape with a predetermined curvature. The second suction unit 160 is transferred to a predetermined position by the transfer mechanism 300 to place the substrate F. The above operations are the same as those shown in Figs. 4 (a) and (b). After the operation as described above, the adsorption of the substrate F by the adsorption section 10 is performed.
如上述，第一吸附部110及第二吸附部160，是相同之構成。在上述之說明中，雖以第一吸附部110相對於第二吸附部160位於上方來說明，但於與基板F之翻轉同時，第一吸附部110及第二吸附部160會一體地旋轉半圈，第二吸附部160位於上方。如上述，每次基板F旋轉，第一吸附部110與第二吸附部160之上下位置就會交換。此外，位於上方之吸附部，會將基板F往翻轉機構200移送，或者將翻轉後之基板F往既定之位置移送。在此，於基板翻轉裝置1之翻轉機構200中，將載置基板F之位置稱為「移送位置200a」。反之，於翻轉機構200中，將離開移送位置200a之位置稱為「非移送位置200b」。As described above, the first adsorption section 110 and the second adsorption section 160 have the same configuration. In the above description, although the first adsorption part 110 is positioned above the second adsorption part 160 for explanation, the first adsorption part 110 and the second adsorption part 160 will rotate integrally half at the same time as the substrate F is turned over The second suction portion 160 is positioned upward. As described above, each time the substrate F rotates, the upper and lower positions of the first suction section 110 and the second suction section 160 are exchanged. In addition, the suction portion located above will transfer the substrate F to the turning mechanism 200, or transfer the reversed substrate F to a predetermined position. Here, in the reversing mechanism 200 of the substrate reversing device 1, the position where the substrate F is placed is referred to as a “transfer position 200 a”. On the other hand, in the reversing mechanism 200, a position away from the transfer position 200a is referred to as a "non-transfer position 200b".
接著，針對翻轉機構200進行說明。圖6（a）是實施形態之基板翻轉裝置1之翻轉機構200中之移送位置200a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。側之立體圖。圖6（b）是實施形態之基板翻轉裝置1之翻轉機構200中之非移送位置200b側之立體圖。圖7是顯示實施形態之基板翻轉裝置1之翻轉機構200之主要部分之分解立體圖。翻轉機構200，分別設置於X軸負側及正側。Next, the turning mechanism 200 will be described. Figure 6 (a) shows the transfer position 200a of the flip mechanism 200 of the substrate flip device 1 according to the embodiment. Other fonts are used in the file. Please adjust the fonts (Chinese characters should be set to new details, English characters should be set to Times New. Roman). Side perspective view. FIG. 6 (b) is a perspective view of the non-transfer position 200b side of the reversing mechanism 200 of the substrate reversing device 1 of the embodiment. FIG. 7 is an exploded perspective view showing a main part of a reversing mechanism 200 of the substrate reversing device 1 of the embodiment. The turning mechanism 200 is disposed on the negative side and the positive side of the X axis, respectively.
如圖6（a）所示，移送位置200a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。中之翻轉機構200，具備導引軌道210、支持板體220。如圖6（b）所示，非移送位置200b中之翻轉機構200，具備導引軌道211、支持板體221。導引軌道及支持板體，只有設置位置之差異，作為構件則為相同。此外，翻轉機構200，具備齒輪201、蓋體202。As shown in Figure 6 (a), there are other fonts used in the file at the transfer position 200a. Please adjust the fonts (for Chinese characters, please set to new detail style, for English characters, please set to Times New Roman). The turning mechanism 200 includes a guide rail 210 and a support plate 220. As shown in FIG. 6 (b), the turning mechanism 200 in the non-transfer position 200b includes a guide rail 211 and a support plate 221. The guide rail and the support plate only have the difference in the setting position, and are the same as the components. The reversing mechanism 200 includes a gear 201 and a cover 202.
另外，翻轉機構200，如圖7所示，具備齒輪203，於移送位置200a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。側，具備導引板體230、連接板體240、連接構件250、第一基座260、第二基座270。於非移送位置200b，具備連接板體241、連接構件251、第一基座261、第二基座271。其中，導引板體、連接板體、連接構件、第一基座、及第二基座，分別於Z-Y軸平面中，設置為對稱於Y軸，可將Z軸負側及正側之構件組合。亦即，導引板體、連接板體、連接構件、第一基座、及第二基座，亦可謂分別將一個構件分割為兩半而配置。特別是導引軌道210及導引軌道211，是半圓狀之構件，若將此兩者互相組合，會形成圓形。導引軌道210，安裝於支持板體220。In addition, the flip mechanism 200, as shown in FIG. 7, is provided with a gear 203, and other fonts are used in the transfer position 200a. Please adjust the font (please set the Chinese character to the new detail style and the English character to the Times New Roman) . It includes a guide plate 230, a connection plate 240, a connection member 250, a first base 260, and a second base 270. The non-transfer position 200b includes a connection plate 241, a connection member 251, a first base 261, and a second base 271. Among them, the guide plate body, the connecting plate body, the connecting member, the first base, and the second base are respectively arranged in the ZY axis plane to be symmetrical to the Y axis, and the components on the negative side and the positive side of the Z axis can be set. combination. That is, the guide plate body, the connection plate body, the connection member, the first base, and the second base may be referred to as one member divided into two halves and arranged. In particular, the guide rail 210 and the guide rail 211 are semicircular members, and if these two are combined with each other, a circular shape is formed. The guide rail 210 is mounted on the support plate 220.
連接板體240，與導引板體230連接。於導引板體230，設置有複數個旋轉構件232。此旋轉構件232嵌入導引軌道210之溝槽212。如上述，導引軌道210是半圓狀。因此，旋轉構件232，於導引板體230中，以沿著導引軌道210之溝槽212之方式，配置為半圓狀。此外，導引板體230之形狀，在圖7中雖然是半圓狀，但只要旋轉構件232加上導引軌道210配置為半圓狀即可，導引板體230本身即使是矩形狀亦無妨。另外，旋轉構件232，是凸輪從動件。因此，可在導引軌道210及導引軌道211之溝槽212中圓滑地旋轉移動。The connection plate 240 is connected to the guide plate 230. The guide plate 230 is provided with a plurality of rotating members 232. The rotating member 232 is inserted into the groove 212 of the guide rail 210. As described above, the guide rail 210 is semicircular. Therefore, the rotating member 232 is arranged in a semicircular shape in the guide plate body 230 along the groove 212 of the guide rail 210. In addition, although the shape of the guide plate 230 is semicircular in FIG. 7, as long as the rotating member 232 and the guide rail 210 are arranged in a semicircular shape, the guide plate 230 itself may be rectangular. The rotating member 232 is a cam follower. Therefore, the guide rail 210 and the groove 212 of the guide rail 211 can be smoothly rotated and moved.
於形成於齒輪201之中央部分之圓形狀之孔201a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。，有齒輪203嵌入。隔著孔201a文件中有使用其他字體，請調整字體（中文字請設定為新細明體、英文字請設定為Times New Roman）。於Y軸正側及負側形成有矩形狀之孔201b。第二基座270及第二基座271分別有兩個，形成有凹部272。於孔201b，有第二基座270及第二基座271以外之構件嵌入。於此第二基座270及第二基座271之各者之凹部272，安裝第一基座260及第一基座261。此時，第一基座260及第一基座261，抵接於齒輪201。連接構件250及連接構件251分別有兩個，具有突部252與軸253。連接構件250及連接構件251之各者之突部252，通過形成於導引板體230及導引板體231之各者之孔233。軸253，抵接於第一基座260及第一基座261。There are other fonts used in the circular hole 201a file formed in the central part of the gear 201. Please adjust the font (for Chinese characters, please set the new detail style, for English characters, please set it to Times New Roman). There are gears 203 embedded. There are other fonts used in the file across the hole 201a, please adjust the font (Chinese characters should be set to new detail style, English characters should be set to Times New Roman). Rectangular holes 201b are formed on the positive and negative sides of the Y-axis. Each of the second base 270 and the second base 271 has two recesses 272. In the hole 201b, a member other than the second base 270 and the second base 271 is inserted. A first base 260 and a first base 261 are mounted on the recessed portion 272 of each of the second base 270 and the second base 271. At this time, the first base 260 and the first base 261 are in contact with the gear 201. The connection member 250 and the connection member 251 each have two protrusions 252 and a shaft 253. The protruding portion 252 of each of the connection member 250 and the connection member 251 passes through a hole 233 formed in each of the guide plate body 230 and the guide plate body 231. The shaft 253 is in contact with the first base 260 and the first base 261.
於上述之構成中，連接板體240之兩個凹部242，與第一吸附部110之機架部4連接。具體而言，如圖2所示，具備於第一吸附部110之機架部4之中，Y軸負側及正側之兩端部，連接於凹部242。因此，對於第一吸附部110，有導引板體230、連接板體240、及連接構件250被連接。對於第二吸附部160亦同。In the above configuration, the two recessed portions 242 of the connecting plate body 240 are connected to the frame portion 4 of the first suction portion 110. Specifically, as shown in FIG. 2, both end portions on the negative side and the positive side of the Y-axis of the frame portion 4 of the first suction portion 110 are connected to the recessed portion 242. Therefore, in the first suction portion 110, the guide plate 230, the connection plate 240, and the connection member 250 are connected. The same applies to the second adsorption portion 160.
由於是如上述之構成，故若齒輪201及齒輪203旋轉，導引板體230之旋轉構件232會沿著導引軌道210之溝槽212移動，故導引板體230亦會移動。齒輪201之驅動，可以馬達來驅動。或者，於齒輪201之下方設置齒條，形成所謂之齒條及小齒輪來驅動亦可。在圖1及圖6（b）中，是圖示此設置有齒條及小齒輪之場合。Since the structure is as described above, if the gear 201 and the gear 203 rotate, the rotating member 232 of the guide plate body 230 moves along the groove 212 of the guide rail 210, so the guide plate 230 also moves. The gear 201 can be driven by a motor. Alternatively, a rack may be provided below the gear 201 to form a so-called rack and pinion for driving. Fig. 1 and Fig. 6 (b) show a case where a rack and a pinion are provided.
此外，導引軌道210及導引軌道211，形成圓狀。此外，由於導引板體230及導引板體231之旋轉構件232一邊嵌入導引軌道210及導引軌道211之各者之溝槽一邊移動，故導引板體230及導引板體231，可相對於導引軌道210及導引軌道211旋轉。因此，透過連接板體240而連接之第一吸附部110，成為可旋轉。如上述，翻轉機構200之構成構件之中，導引板體230、連接板體240、及連接構件250與第一吸附部110一起旋轉。此狀況於導引板體231、連接板體241、及連接構件251中亦同。The guide rail 210 and the guide rail 211 are formed in a circular shape. In addition, since the rotating member 232 of the guide plate body 230 and the guide plate body 231 moves while being fitted into the grooves of each of the guide rail 210 and the guide track 211, the guide plate body 230 and the guide plate body 231 , Can be rotated relative to the guide track 210 and the guide track 211. Therefore, the first suction part 110 connected through the connection plate 240 is rotatable. As described above, among the constituent members of the reversing mechanism 200, the guide plate 230, the connection plate 240, and the connection member 250 rotate together with the first suction portion 110. This situation is also the same in the guide plate body 231, the connection plate body 241, and the connection member 251.
搬送機構300，如圖1所示，具備升降構件310、軌道320、滑動部330。升降構件310，連結於翻轉機構200之支持板體220。如上述，翻轉機構200之構成構件之中，導引板體230、連接板體240、及連接構件250是可旋轉的。反之，支持板體220則不旋轉。亦即，分別設置於移送位置200a側及非移送位置200b之支持板體220及支持板體221，固定於其設置位置。因此，與搬送機構300之升降構件310連結之支持板體，會是配置於移送位置200a側之支持板體220。因此，在搬送機構300移送例如第一吸附部110之場合，於連接板體240連接有第一吸附部110，連接板體240則是連接於導引板體230。此外，由於導引軌道210連接於支持板體220，故包含位於移送位置200a之第一吸附部110，連同導引軌道210、導引板體230、連接板體240、支持板體220、及連接構件250一起移送。As shown in FIG. 1, the transport mechanism 300 includes a lifting member 310, a rail 320, and a sliding portion 330. The lifting member 310 is connected to the supporting plate 220 of the turning mechanism 200. As described above, among the constituent members of the reversing mechanism 200, the guide plate 230, the connection plate 240, and the connection member 250 are rotatable. Conversely, the support plate 220 does not rotate. That is, the support plate 220 and the support plate 221 that are respectively provided on the side of the transfer position 200a and the non-transfer position 200b are fixed at their installation positions. Therefore, the support plate body connected to the lifting member 310 of the conveyance mechanism 300 will be the support plate body 220 disposed on the side of the transfer position 200a. Therefore, when the transfer mechanism 300 transfers, for example, the first suction section 110, the first suction section 110 is connected to the connection plate 240, and the connection plate 240 is connected to the guide plate 230. In addition, since the guide rail 210 is connected to the support plate 220, it includes the first suction part 110 located at the transfer position 200a, together with the guide rail 210, the guide plate 230, the connection plate 240, the support plate 220, and The connection members 250 are transferred together.
接著，針對由基板翻轉裝置1進行之基板F之翻轉動作，基於圖8（a）～圖9（d）進行說明。圖8（a）～（d）及圖9（a）～（d）是用來說明由實施形態之基板翻轉裝置1進行之基板F之翻轉動作之示意圖。另外，基板F，雖然因上述之吸附部100而在彎曲之狀態下被吸附及移送，但在圖8（a）～圖9（d）中，該彎曲之狀態之圖示省略。此外，於圖8（a）～圖9（d）中，是顯示將載置於載置面2a之基板F移送、翻轉，再度往載置面2a移送之場合。另外，為了使基板F之翻轉之前後容易分辨，以將最初載置於載置面2a之基板F之上面側塗黑之方式來圖示。Next, the inversion operation of the substrate F by the substrate inversion device 1 will be described with reference to FIGS. 8 (a) to 9 (d). FIGS. 8 (a) to (d) and FIGS. 9 (a) to (d) are schematic diagrams for explaining the inversion operation of the substrate F by the substrate inversion device 1 of the embodiment. In addition, the substrate F is sucked and transferred in a bent state by the above-mentioned suction part 100, but the illustration of the bent state is omitted in FIGS. 8 (a) to 9 (d). In addition, FIGS. 8 (a) to 9 (d) show the case where the substrate F placed on the placement surface 2 a is transferred, reversed, and transferred to the placement surface 2 a again. In addition, in order to make it easy to distinguish between before and after the substrate F is flipped, it is illustrated by blackening the upper surface side of the substrate F that is initially placed on the mounting surface 2a.
在如圖8（a）所示，於移送位置200a配置有第一吸附部110、於非移送位置200b配置有第二吸附部160之場合，如圖8（b）所示，第一吸附部110，藉由滑動部330在軌道320上滑動移動，被移送往載置有基板F之載置面2a。如圖8（c）所示，第一吸附部110吸附基板F，如圖8（d）所示，從載置面2a往翻轉機構200亦即載置面2a被移送。As shown in FIG. 8 (a), when the first suction section 110 is arranged at the transfer position 200a and the second suction section 160 is arranged at the non-transfer position 200b, as shown in FIG. 8 (b), the first suction section 110, the slide portion 330 slides on the rail 320 and is transferred to the mounting surface 2a on which the substrate F is placed. As shown in FIG. 8 (c), the first suction unit 110 suctions the substrate F, and as shown in FIG. 8 (d), the substrate F is transferred from the mounting surface 2 a to the turning mechanism 200, that is, the mounting surface 2 a.
如圖9（a）所示，於翻轉機構200中，隔著基板F，第一吸附部110之吸附面與第二吸附部160之吸附面以互相面對之方式被配置。在此狀態下，如圖9（b）所示，第一吸附部110、基板F、及第二吸附部160一體地旋轉半圈。此時，連接於第一吸附部110之導引板體230、連接板體240、及連接構件250與第一吸附部110一起旋轉。與上述狀況同樣地，在第二吸附部160方面也是連接於第二吸附部160之導引板體231、連接板體241、及連接構件251與第二吸附部160一起旋轉。藉此，第一吸附部110與第二吸附部160之位置交換。之後，解除由第一吸附部110進行之基板F之吸附，由新位於移送位置200a之第二吸附部160吸附基板F。As shown in FIG. 9 (a), in the reversing mechanism 200, the suction surface of the first suction section 110 and the suction surface of the second suction section 160 are disposed to face each other across the substrate F. In this state, as shown in FIG. 9 (b), the first suction section 110, the substrate F, and the second suction section 160 rotate integrally for half a turn. At this time, the guide plate body 230, the connection plate body 240, and the connection member 250 connected to the first suction portion 110 rotate together with the first suction portion 110. As in the case described above, the guide plate body 231, the connection plate body 241, and the connection member 251 connected to the second suction portion 160 also rotate with the second suction portion 160 in the second suction portion 160. Thereby, the positions of the first adsorption part 110 and the second adsorption part 160 are exchanged. Thereafter, the adsorption of the substrate F by the first adsorption section 110 is released, and the substrate F is adsorbed by the second adsorption section 160 newly located at the transfer position 200a.
如圖9（c）所示，藉由搬送機構300，第二吸附部160被往載置面2a移送。在將基板F載置於載置面2a之後，如圖9（d）所示，第二吸附部160返回翻轉機構200亦即移送位置200a。As shown in FIG. 9 (c), the second suction unit 160 is transferred to the mounting surface 2 a by the transfer mechanism 300. After the substrate F is placed on the placement surface 2a, as shown in FIG. 9 (d), the second suction unit 160 returns to the reversing mechanism 200, that is, the transfer position 200a.
另外，於上述之說明中，雖針對將載置於載置面2a之基板F移送、翻轉，再度往載置面2a移送之場合進行了說明，但於圖8（a）及圖9（b）中，基板F被載置之場所不同亦可。例如，即使是從切斷裝置被搬入之基板F被翻轉後，被往其他裝置搬送之路徑亦可。In addition, in the above description, the case where the substrate F placed on the placement surface 2a is transferred, turned over, and then transferred to the placement surface 2a is described. However, FIGS. ), The place where the substrate F is placed may be different. For example, even if the substrate F carried in from the cutting device is turned over, the path to be carried to another device may be used.
[基板翻轉裝置之動作]
接著，針對基板翻轉裝置1之動作進行說明。圖10是顯示基板翻轉裝置1之構成之方塊圖。如圖10所示，基板翻轉裝置1，具備：基板載置部2、壓力賦予部3、第一吸附部110、第二吸附部160、氣壓缸140、翻轉機構200、搬送機構300，另外，亦具備驅動用流量調整閥10、吸附用流量調整閥20、輸入部30、檢測部40、馬達50、控制部60。[Operation of substrate turning device]
Next, the operation of the substrate inversion device 1 will be described. FIG. 10 is a block diagram showing the configuration of the substrate inverting device 1. As shown in FIG. 10, the substrate inverting device 1 includes a substrate placing section 2, a pressure applying section 3, a first suction section 110, a second suction section 160, a pneumatic cylinder 140, a turning mechanism 200, and a transfer mechanism 300. It also includes a driving flow regulating valve 10, an adsorption flow regulating valve 20, an input unit 30, a detection unit 40, a motor 50, and a control unit 60.
輸入部30，受理基板翻轉裝置1移送之基板F之數目。檢測部40，檢測基板翻轉裝置1之吸附部100相對於基板F接近或離開時之位置。此外，以檢測藉由搬送機構300移送基板F時之基板F之位置之方式構成亦可。檢測部40，例如，可使用感測器、攝影裝置等。馬達50，驅動搬送機構300。The input unit 30 accepts the number of substrates F transferred by the substrate reversing device 1. The detection section 40 detects the position of the suction section 100 of the substrate turning device 1 when the suction section 100 approaches or leaves the substrate F. In addition, it may be configured to detect the position of the substrate F when the substrate F is transferred by the transfer mechanism 300. The detection unit 40 can use, for example, a sensor, an imaging device, and the like. The motor 50 drives the conveyance mechanism 300.
控制部60，包含：CPU等演算處理電路、ROM、RAM、硬碟等記憶體。控制部60，依照記憶於記憶體之程式控制各部。The control unit 60 includes a calculation processing circuit such as a CPU, a memory such as a ROM, a RAM, and a hard disk. The control unit 60 controls each unit in accordance with a program stored in the memory.
此外，基板翻轉裝置1，具備驅動用流量調整閥10及吸附用流量調整閥20。驅動用流量調整閥10，是對氣壓缸140進行負壓及正壓之切換之閥。驅動用流量調整閥10，設置於連接部145，該連接部145設置於氣壓缸140之本體141，該驅動用流量調整閥10是所謂之速度控制器。吸附用流量調整閥20，是對吸附部100進行負壓及正壓之切換之閥。吸附用流量調整閥20，設置於不圖示之配管，該配管連接於形成於板體121之複數個較小之孔122。In addition, the substrate inversion device 1 includes a driving flow rate adjusting valve 10 and a suction flow rate adjusting valve 20. The driving flow regulating valve 10 is a valve that switches the negative pressure and the positive pressure of the pneumatic cylinder 140. The driving flow adjustment valve 10 is provided at a connection portion 145 which is provided at the body 141 of the pneumatic cylinder 140. The driving flow adjustment valve 10 is a so-called speed controller. The adsorption flow adjustment valve 20 is a valve that switches the negative pressure and the positive pressure of the adsorption unit 100. The adsorption flow adjustment valve 20 is provided in a piping (not shown), and the piping is connected to a plurality of smaller holes 122 formed in the plate body 121.
圖11是顯示實施形態之基板翻轉裝置1之動作之流程圖。此控制，是由於圖10顯示之控制部60來執行。此外，於圖11之流程圖中，「開始」時之基板翻轉裝置1之狀態，是基板翻轉裝置1之第一吸附部110之吸附面與第二吸附部160之吸附面互相面對而被配置之狀態，此狀態，顯示於圖8（a）。此外，控制部60使壓力賦予部3對基板載置部2賦予負壓亦可。在此場合，由於基板F被吸附於基板載置部2，故在被第一吸附部110吸附為止之期間，不會從被載置之場所偏離。FIG. 11 is a flowchart showing the operation of the substrate reversing device 1 according to the embodiment. This control is performed by the control section 60 shown in FIG. 10. In addition, in the flowchart of FIG. 11, the state of the substrate inversion device 1 at the “start” is that the adsorption surface of the first adsorption portion 110 and the adsorption surface of the second adsorption portion 160 of the substrate inversion device 1 face each other and The configuration status, this status is shown in Figure 8 (a). The control unit 60 may apply a negative pressure to the substrate placing unit 2 by the pressure applying unit 3. In this case, since the substrate F is attracted to the substrate placing section 2, the substrate F does not deviate from the place where it is placed until it is adsorbed by the first attracting section 110.
在步驟S11中，控制部60，使馬達50驅動，使搬送機構300將第一吸附部110往載置面2a移送。步驟S11之動作，顯示於圖8（b）。In step S11, the control unit 60 drives the motor 50 to cause the transfer mechanism 300 to transfer the first suction unit 110 to the mounting surface 2a. The operation of step S11 is shown in Fig. 8 (b).
在步驟S12中，第一吸附部110吸附基板F。此時，控制部60，為了使由空壓源提供之正壓對各氣壓缸140賦予而使驅動用流量調整閥10切換。藉此，第一吸附部110之吸附板體120，變形為既定曲率之圓弧狀。在此狀態下，使第一吸附部110接近基板F。控制部60，為了使由空壓源提供之負壓對各氣壓缸140賦予而使驅動用流量調整閥10切換。藉此，第一吸附部110之吸附板體120，重疊於基板F。此動作顯示於圖4（a）。In step S12, the first adsorption unit 110 adsorbs the substrate F. At this time, the control unit 60 switches the driving flow adjustment valve 10 in order to apply the positive pressure supplied from the air pressure source to each of the pneumatic cylinders 140. Thereby, the adsorption plate body 120 of the first adsorption portion 110 is deformed into an arc shape with a predetermined curvature. In this state, the first suction part 110 is brought close to the substrate F. The control unit 60 switches the driving flow rate adjustment valve 10 in order to apply the negative pressure supplied from the air pressure source to each pneumatic cylinder 140. Thereby, the adsorption plate body 120 of the first adsorption portion 110 is overlapped on the substrate F. This action is shown in Figure 4 (a).
在第一吸附部110重疊於基板F後，控制部60，使壓力賦予部3對基板載置部2賦予正壓。或者，在控制部60原本使壓力賦予部3對基板載置部2賦予負壓之場合，即使是僅使壓力賦予部3解除負壓之控制亦可。藉此，基板F由於不是與基板載置部2吸附之狀態，故容易從基板載置部2分離。此外，控制部60，為了使由空壓源提供之負壓對第一吸附部110賦予而使吸附用流量調整閥20切換。藉此，第一吸附部110吸附基板F。此動作顯示於圖4（b）及圖8（c）。After the first suction section 110 is superposed on the substrate F, the control section 60 causes the pressure applying section 3 to apply a positive pressure to the substrate placing section 2. Alternatively, when the control unit 60 originally causes the pressure application unit 3 to apply a negative pressure to the substrate mounting unit 2, the control unit 60 may release the control of the negative pressure only by the pressure application unit 3. Thereby, since the substrate F is not in a state of being attracted to the substrate placing portion 2, it is easy to separate from the substrate placing portion 2. In addition, the control unit 60 switches the adsorption flow rate adjustment valve 20 in order to apply the negative pressure provided by the air pressure source to the first adsorption unit 110. Thereby, the first adsorption unit 110 adsorbs the substrate F. This action is shown in Figure 4 (b) and Figure 8 (c).
在步驟S13中，控制部60，使馬達50驅動，使搬送機構300將第一吸附部110往翻轉機構200亦即移送位置200a移送。步驟S13之動作，顯示於圖8（d）及圖9（a）。In step S13, the control unit 60 drives the motor 50 to cause the transfer mechanism 300 to transfer the first suction unit 110 to the reversing mechanism 200, that is, the transfer position 200a. The operation of step S13 is shown in Fig. 8 (d) and Fig. 9 (a).
在步驟S14中，控制部60，使翻轉機構200將基板F翻轉。此時，第一吸附部110與第二吸附部160與基板F之一起一體地旋轉半圈。步驟S14之動作，顯示於圖9（b）。In step S14, the control unit 60 causes the reversing mechanism 200 to reverse the substrate F. At this time, the first suction part 110 and the second suction part 160 rotate integrally with the substrate F by half a turn. The operation of step S14 is shown in Fig. 9 (b).
此外，在步驟S14中，控制部60，使第二吸附部160吸附基板F。控制部60，使吸附用流量調整閥20將由空壓源提供之負壓從第一吸附部110切換為第二吸附部160。In step S14, the control unit 60 causes the second suction unit 160 to suction the substrate F. The control unit 60 causes the adsorption flow adjustment valve 20 to switch the negative pressure provided by the air pressure source from the first adsorption unit 110 to the second adsorption unit 160.
在步驟S15中，控制部60，使馬達50驅動，使搬送機構300將第二吸附部160往載置面2a移送。步驟S15之動作，顯示於圖9（c）。此時，控制部60，為了使由空壓源提供之正壓對各氣壓缸140賦予而使驅動用流量調整閥10切換。藉此，第二吸附部160之吸附板體120變形為既定曲率之圓弧狀。步驟S15之動作，顯示於圖4（c）。In step S15, the control unit 60 drives the motor 50 to cause the transfer mechanism 300 to transfer the second suction unit 160 to the mounting surface 2a. The operation of step S15 is shown in Fig. 9 (c). At this time, the control unit 60 switches the driving flow adjustment valve 10 in order to apply the positive pressure supplied from the air pressure source to each of the pneumatic cylinders 140. Thereby, the adsorption plate body 120 of the second adsorption portion 160 is deformed into an arc shape with a predetermined curvature. The operation of step S15 is shown in Fig. 4 (c).
在步驟S16中，控制部60，為了使由空壓源提供之負壓對各氣壓缸140賦予而使驅動用流量調整閥10切換。藉此，基板F被載置於基板載置部2。步驟S16之動作，顯示於圖5（a）～（c）、圖9（d）。In step S16, the control unit 60 switches the driving flow adjustment valve 10 in order to apply the negative pressure supplied from the air pressure source to each pneumatic cylinder 140. Thereby, the substrate F is placed on the substrate placing section 2. The operation of step S16 is shown in Figs. 5 (a) to (c) and Fig. 9 (d).
在步驟S17中，判定是否續行基板F之翻轉。在沒有要翻轉之基板F之場合，基板F之翻轉結束。在續行基板F之翻轉之場合，重複步驟S11～步驟S16。In step S17, it is determined whether the inversion of the substrate F is continued. When there is no substrate F to be inverted, the inversion of the substrate F is completed. When the substrate F is reversed, steps S11 to S16 are repeated.
＜實施形態之效果＞
根據實施形態，以下之效果被發揮。＜ Effects of Implementation Mode ＞
According to the embodiment, the following effects are exhibited.
如圖3（a）所示，包含於吸附部100之板體121，是複數個板體123排列於X軸方向。此時，複數個板體123，排列為竹簾狀，可將各板體123折疊。因此，藉由將各板體123往既定之位置移動，亦即相對於基板F使接近或離開，吸附部100，可變形為圓滑之圓弧狀。As shown in FIG. 3 (a), the plate body 121 included in the adsorption section 100 is a plurality of plate bodies 123 arranged in the X-axis direction. At this time, the plurality of plate bodies 123 are arranged in a bamboo curtain shape, and each plate body 123 can be folded. Therefore, by moving each plate body 123 to a predetermined position, that is, approaching or leaving with respect to the substrate F, the suction portion 100 can be deformed into a smooth arc shape.
此外，基板翻轉裝置1，設置有形成有多數個微小之孔之基座124。因此，對吸附構件125賦予之空氣壓，藉由上述之多數個孔往吸附構件125傳達，並往吸附構件125之全面擴散。因此，吸附構件125，亦即吸附部100，可將基板F以均勻之空氣壓吸附。The substrate inverting device 1 is provided with a base 124 having a plurality of minute holes formed therein. Therefore, the air pressure given to the adsorption member 125 is transmitted to the adsorption member 125 through the plurality of holes described above, and diffuses to the entire surface of the adsorption member 125. Therefore, the adsorption member 125, that is, the adsorption portion 100, can adsorb the substrate F with uniform air pressure.
如圖4（a）～圖5（c）所示，吸附部100，從中央部往兩端部依序接近基板F。藉此，於吸附部100重疊於基板F時，介在於吸附部100與基板F之間之空氣，會從吸附部100抵接之部分往基板F之兩端部被推出。因此，於基板F與吸附部100之間不會有空氣聚集。其結果，於基板F不產生皺紋，可將基板F在良好之狀態下順利地搬送。As shown in FIGS. 4 (a) to 5 (c), the suction portion 100 approaches the substrate F in order from the central portion to the both end portions. Thereby, when the adsorption part 100 overlaps the substrate F, the air interposed between the adsorption part 100 and the substrate F is pushed out from the abutting part of the adsorption part 100 to both ends of the substrate F. Therefore, no air is accumulated between the substrate F and the adsorption part 100. As a result, no wrinkles are generated on the substrate F, and the substrate F can be smoothly conveyed in a good state.
此外，基板F在被移送後，被載置於載置面2a時，基板F從中央部向兩端部依序接近基板載置部2，基板F與基板載置部2重疊。此時，可不使空氣介在於基板F與基板載置部2之間地，將基板F載置於基板載置部2。因此，於基板F與基板載置部2之間不會有空氣聚集。其結果，於基板F不產生皺紋，可將基板F在良好之狀態下載置於載置面2a。另外，即使是在基板F已產生皺紋之場合，也可在於基板F沒有皺紋產生之狀態下重新載置。In addition, when the substrate F is placed on the placing surface 2 a after being transferred, the substrate F approaches the substrate placing portion 2 in sequence from the central portion to both end portions, and the substrate F and the substrate placing portion 2 overlap. At this time, the substrate F can be placed on the substrate placing portion 2 without interposing air between the substrate F and the substrate placing portion 2. Therefore, no air is accumulated between the substrate F and the substrate mounting portion 2. As a result, no wrinkles are generated on the substrate F, and the substrate F can be loaded on the mounting surface 2a in a good state. In addition, even in the case where the substrate F has been wrinkled, the substrate F may be remounted without the wrinkle being generated.
如圖3（a）所示，相對於各氣壓缸140設置之第一止動器131，設置為第一止動器131與基板F之距離從區域120E往區域120A及從區域120E往區域120I依序離開。藉此，若對各氣壓缸140賦予正壓，藉由第一止動器131之限制，可以從基板F之中央部往兩端部與基板F之距離變大之方式，使各區域位移。藉此，可使吸附部100變形為從兩端部朝向中央部往基板F之側膨脹之大致圓弧狀。因此，將基板F吸附時，可從中央部往兩端部依序重疊於基板F。As shown in FIG. 3 (a), with respect to the first stoppers 131 provided for each of the pneumatic cylinders 140, the distance between the first stoppers 131 and the substrate F is set from the area 120E to the area 120A and from the area 120E to the area 120I. Leave in order. With this, if a positive pressure is applied to each of the pneumatic cylinders 140, the restriction of the first stopper 131 can shift the areas from the central portion of the substrate F to the distance between the two end portions and the substrate F so as to increase. Thereby, the adsorption | suction part 100 can be deform | transformed to the substantially arc shape which expands from the both ends toward the center part toward the side of the board | substrate F. Therefore, when the substrate F is adsorbed, the substrate F can be sequentially superposed on the substrate F from the central portion to the both end portions.
此外，相對於各氣壓缸140，設置第二止動器132。藉此，吸附部100相對於基板F離開時，可調節吸附部100之各區域之傾斜。因此，可將吸附部100之形狀設定為既定曲率之圓弧狀。其結果，可以於基板F沒有皺紋產生之方式，將吸附部100重疊於基板F。此外，可將基板F以良好之狀態載置於載置面2a。A second stopper 132 is provided for each of the pneumatic cylinders 140. Thereby, when the adsorption section 100 is separated from the substrate F, the inclination of each region of the adsorption section 100 can be adjusted. Therefore, the shape of the suction part 100 can be set to an arc shape with a predetermined curvature. As a result, the adsorption part 100 can be superimposed on the substrate F so that the substrate F does not have wrinkles. In addition, the substrate F can be placed on the placement surface 2a in a good state.
如圖1所示，搬送機構300之升降構件310，僅連接於翻轉機構200之移送位置200a之支持板體220。因此，可將第一吸附部110或第二吸附部160選擇性地移送。因此，吸附部100亦兼用為移送功能，可將裝置簡化。As shown in FIG. 1, the lifting member 310 of the transfer mechanism 300 is only connected to the support plate 220 of the transfer position 200 a of the turning mechanism 200. Therefore, the first adsorption section 110 or the second adsorption section 160 can be selectively transferred. Therefore, the suction unit 100 also serves as a transfer function, and the device can be simplified.
如圖8（a）～圖9（d）所示，與基板F之翻轉被進行之同時，吸附基板F之吸附部100會交換。例如，在使基板F翻轉後，先使基板F往其他場所移動，並以其他吸附部吸附之繁雜的動作不會被進行，故可將基板F之翻轉效率良好地進行。此外，由於使基板F翻轉之位置與吸附部100交換之位置相同，故裝置之省空間化成為可能。As shown in FIGS. 8 (a) to 9 (d), at the same time as the substrate F is turned over, the adsorption part 100 that adsorbs the substrate F is exchanged. For example, after the substrate F is reversed, the substrate F is moved to another place first, and the complicated operation of being adsorbed by other adsorption parts is not performed, so the substrate F can be efficiently inverted. In addition, since the position where the substrate F is reversed is the same as the position where the suction section 100 is exchanged, space saving of the device becomes possible.
此外，在搬送機構300將吸附部100以移送位置200a與載置面2a之往復移動之方式移送之場合，由於移送路徑為一個，故可防止裝置之大型化。In addition, when the transfer mechanism 300 transfers the suction unit 100 to the reciprocating movement of the transfer position 200a and the mounting surface 2a, since there is only one transfer path, the size of the device can be prevented.
如圖7所示，翻轉機構200，僅使導引板體230、導引板體231旋轉，即可將第一吸附部110與第二吸附部160之位置交換。亦即，即使是位於移送位置200a之吸附部100，在第一吸附部110與第二吸附部160之間交換之場合，位於移送位置200a之支持板體，在被分割為兩半之支持板體220之中，始終是相同之支持板體。因此，即使因翻轉機構200而第一吸附部110與第二吸附部160一體地旋轉半圈，位於移送位置200a之吸附部100交換，也沒有每次將搬送機構300與吸附部100重新連結之必要。亦即，只要針對支持板體220將導引板體230、導引板體231及吸附部100交換即可，故可將基板F之翻轉效率良好地進行。As shown in FIG. 7, the turning mechanism 200 can rotate the guide plate 230 and the guide plate 231 to exchange the positions of the first suction part 110 and the second suction part 160. That is, even when the suction section 100 located at the transfer position 200a is exchanged between the first suction section 110 and the second suction section 160, the support plate located at the transfer position 200a is divided into two support plates The body 220 is always the same supporting plate body. Therefore, even if the first adsorption unit 110 and the second adsorption unit 160 rotate integrally for half a turn due to the turning mechanism 200, the adsorption unit 100 located at the transfer position 200a is exchanged, and the transport mechanism 300 and the adsorption unit 100 are not reconnected each time. necessary. That is, as long as the guide plate body 230, the guide plate body 231, and the suction part 100 are exchanged for the support plate body 220, the substrate F can be turned efficiently.
＜實施形態之變更例＞
（1）翻轉機構之構成
圖12（a）是顯示實施形態之基板翻轉裝置之構成之一部分之前視圖。圖12（b）是顯示實施形態之變更例1之基板翻轉裝置之構成之一部分之前視圖。在此，所謂前視圖，是指從X軸正側觀察之圖。在上述實施形態之基板翻轉裝置1中，如圖12（a）所示，是在於支持板體220及支持板體221，分別支持有導引軌道210及導引軌道211，導引板體230及導引板體231被連接於吸附部100之各者之狀態下旋轉半圈之構成，<Examples of changes in the embodiment>
(1) Structure of the turning mechanism FIG. 12 (a) is a front view showing a part of the structure of the substrate turning device of the embodiment. FIG. 12 (b) is a front view showing a part of the configuration of the substrate inverting device according to the first modification of the embodiment. Here, the front view is a view viewed from the positive side of the X axis. As shown in FIG. 12 (a), in the substrate inversion device 1 of the above embodiment, the support plate 220 and the support plate 221 support the guide rail 210 and the guide rail 211 and the guide plate 230 respectively. And the guide plate body 231 is connected to each of the adsorption parts 100 in a state of half a rotation,
相對於上述構成，在實施形態之變更例中，設定為相對於吸附部100，導引軌道210及導引軌道211分別被連接之構成。具體而言，如圖12（b）所示，於移送位置200a側，於支持板體220安裝導引板體230。導引軌道210，透過連接板體240與吸附部100連接。將導引板體230之旋轉構件232嵌入於導引軌道210之溝槽212。於非移送位置200b中亦同。只要是如上述般之構成，在於第一吸附部110透過連接板體240連接有導引軌道210之場合，位於移送位置200a之第一吸附部110，會藉由導引軌道210沿著導引板體230旋轉而旋轉。With respect to the above configuration, in a modification of the embodiment, a configuration is adopted in which the guide rail 210 and the guide rail 211 are connected to the suction unit 100, respectively. Specifically, as shown in FIG. 12 (b), a guide plate 230 is attached to the support plate 220 on the side of the transfer position 200 a. The guide rail 210 is connected to the suction unit 100 through the connection plate 240. The rotating member 232 of the guide plate body 230 is embedded in the groove 212 of the guide rail 210. The same applies to the non-transfer position 200b. As long as the structure is as described above, when the first suction section 110 is connected to the guide rail 210 through the connection plate 240, the first suction section 110 located at the transfer position 200a will be guided along the guide rail 210. The plate body 230 rotates and rotates.
如上述般，翻轉機構200，僅使導引軌道210及導引軌道211旋轉，即可將第一吸附部110與第二吸附部160之位置交換。因此，只要針對支持板體220將導引軌道210、導引軌道211及吸附部100交換即可，故可效率良好地進行基板F之翻轉。As described above, the turning mechanism 200 can rotate the guide rail 210 and the guide rail 211 to exchange the positions of the first suction section 110 and the second suction section 160. Therefore, as long as the guide rail 210, the guide rail 211, and the suction part 100 are exchanged for the support plate 220, the substrate F can be efficiently inverted.
（2）具備切換閥之場合
在上述之實施形態之基板翻轉裝置1中，於使各氣壓缸140驅動時，是藉由驅動用流量調整閥10來控制各活塞桿142之移動。在此，例如，某一區域之活塞桿142之移動比既定狀況早而該區域比鄰接之區域更早到達基板F之場合，吸附部100不會變形為往基板F之側膨脹之圓弧狀，而會變形為如波浪般之形狀。在如上述之場合，無法將介在於基板F與吸附部100之間之空氣推出，於基板F與吸附部100之間有空氣聚集，可能會成為於基板F有皺紋產生之原因。(2) When a switching valve is provided In the substrate reversing device 1 of the embodiment described above, when each pneumatic cylinder 140 is driven, the movement of each piston rod 142 is controlled by the driving flow adjustment valve 10. Here, for example, when the piston rod 142 of a certain area moves earlier than a predetermined condition and the area reaches the substrate F earlier than the adjacent area, the suction part 100 will not be deformed into an arc shape that expands to the side of the substrate F , And will deform into a wave-like shape. In the case as described above, the air between the substrate F and the adsorption section 100 cannot be pushed out, and there is air accumulation between the substrate F and the adsorption section 100, which may cause the occurrence of wrinkles on the substrate F.
針對上述問題，實施形態之變更例之基板翻轉裝置1，進一步具備不圖示之切換閥。藉由切換閥，對相鄰之氣壓缸140賦予空氣壓後，切換閥之開關被切換，對下一個氣壓缸140賦予空氣壓。In view of the above problems, the substrate inverting device 1 according to a modified example of the embodiment further includes a switching valve (not shown). After the switching valve is used to apply air pressure to the adjacent pneumatic cylinder 140, the switch of the switching valve is switched to apply air pressure to the next pneumatic cylinder 140.
具體而言，在吸附部100往上方移動之場合，對各氣壓缸140是賦予正壓。此時，並非對各氣壓缸140一起賦予正壓，而是從吸附部100之兩端往中央依序對相鄰之區域之氣壓缸140賦予正壓。在使吸附部100往下方移動之場合，從吸附部100之中央部往兩端部依序對相鄰之區域之氣壓缸140賦予負壓。Specifically, when the suction unit 100 is moved upward, a positive pressure is applied to each of the pneumatic cylinders 140. At this time, instead of applying positive pressure to the pneumatic cylinders 140 together, positive pressure is sequentially applied to the pneumatic cylinders 140 in adjacent areas from both ends of the adsorption unit 100 toward the center. When the suction unit 100 is moved downward, a negative pressure is sequentially applied to the pneumatic cylinders 140 in the adjacent areas from the central portion to the both end portions of the suction unit 100.
如上述般，藉由於基板翻轉裝置1設置切換閥，可控制對氣壓缸140賦予空氣壓之時機。因此，於吸附部100之各區域相對於基板F接近及離開之順序沒有變更產生，變形為既定曲率之圓弧狀。因此，吸附部100，以與基板F之間沒有空氣聚集之方式重疊，可吸附基板F。藉此，於基板F沒有皺紋產生。As described above, since the switching valve is provided in the substrate reversing device 1, the timing of applying air pressure to the pneumatic cylinder 140 can be controlled. Therefore, the order of approaching and leaving each area of the suction section 100 with respect to the substrate F is not changed, and the deformation is a circular arc shape with a predetermined curvature. Therefore, the suction part 100 overlaps the substrate F so that there is no air accumulation between the suction part 100 and the substrate F. Thereby, no wrinkles are generated on the substrate F.
（3）使第一止動器及第二止動器為可變之場合
於實施形態之基板翻轉裝置1中，第一止動器131之與基板F之距離，以可變之方式構成亦可。例如，將第一止動器131以螺絲嵌入支持部150，藉由該螺絲之嵌入量來調整第一止動器131之與基板F之距離亦可。此外，關於第二止動器132與移動構件133之距離，例如，只要構成為預先於機架部4設置複數個螺絲孔，選擇適當之螺絲孔，將第二止動器132安裝於機架部4，即可將第二止動器132與移動構件133之距離變更。(3) When the first stopper and the second stopper are made variable In the substrate reversing device 1 of the embodiment, the distance between the first stopper 131 and the substrate F is configured in a variable manner. can. For example, the first stopper 131 may be screwed into the support portion 150, and the distance between the first stopper 131 and the substrate F may be adjusted by the amount of the screw. In addition, regarding the distance between the second stopper 132 and the moving member 133, for example, as long as a plurality of screw holes are provided in the frame portion 4 in advance, an appropriate screw hole is selected, and the second stopper 132 is mounted on the frame. The unit 4 can change the distance between the second stopper 132 and the moving member 133.
只要如上述般構成，於想要使既定曲率變更之場合為有效。在如上述之場合，只要以螺絲調整第一止動器131之與基板F之距離、及第二止動器132之位置即可，沒有將第一止動器131及第二止動器132替換之必要。As long as it is comprised as mentioned above, it is effective when it is going to change a predetermined curvature. In the case described above, the distance between the first stopper 131 and the substrate F and the position of the second stopper 132 may be adjusted by screws. The first stopper 131 and the second stopper 132 are not adjusted. Necessary for replacement.
（4）使驅動部為馬達之場合
實施形態之基板翻轉裝置1，作為將吸附部100驅動之驅動部，代替氣壓缸140而採用馬達亦可。在此場合，馬達無法在維持驅動力之狀態下停止。因此，在於驅動部採用馬達之場合，有對馬達組合彈簧等彈性構件，以使壓力產生之必要。(4) When the driving unit is a motor, the substrate inverting device 1 according to the embodiment may be a motor that drives the suction unit 100 instead of the pneumatic cylinder 140. In this case, the motor cannot be stopped while maintaining the driving force. Therefore, when a motor is used as the driving unit, it is necessary to combine an elastic member such as a spring with the motor to generate a pressure.
相對於上述作法，實施形態之氣壓缸140，即使在被賦予正壓之狀態下因第一止動器131而移動受到限制，仍會在維持驅動力（壓力）之狀態下停止。此外，在對氣壓缸140賦予負壓之場合，亦會在吸附部100之各區域接觸基板F之後，在維持驅動力（壓力）之狀態下停止。亦即，氣壓缸140，可順利地使各區域停留於分離位置與抵接位置，於抵接位置亦即受第一止動器131限制之狀態下，將各區域以既定之壓力適當地往基板F按壓。In contrast to the above-mentioned method, even if the pneumatic cylinder 140 of the embodiment is restricted from moving by the first stopper 131 in a state where positive pressure is applied, it will stop while maintaining the driving force (pressure). In addition, when a negative pressure is applied to the pneumatic cylinder 140, after each area of the suction part 100 contacts the substrate F, it stops while maintaining a driving force (pressure). That is, the pneumatic cylinder 140 can smoothly keep each area in the separated position and the abutting position, and in a state where the abutting position is limited by the first stopper 131, each area is appropriately moved to a predetermined pressure. The substrate F is pressed.
因此，氣壓缸140可比馬達更順利地使各區域停留於分離位置與抵接位置，可更有效地將吸附部100吸附於基板F。Therefore, the pneumatic cylinder 140 can keep each area at the separation position and the abutment position more smoothly than the motor, and can more effectively adsorb the adsorption section 100 to the substrate F.
1‧‧‧基板翻轉裝置1‧‧‧ substrate turning device
100‧‧‧吸附部 100‧‧‧ Adsorption Department
110‧‧‧第一吸附部 110‧‧‧The first adsorption section
160‧‧‧第二吸附部 160‧‧‧Second adsorption section
200‧‧‧翻轉機構 200‧‧‧ flip mechanism
200a‧‧‧移送位置 200a‧‧‧ transfer position
210、211‧‧‧導引軌道 210, 211‧‧‧Guide track
220、221‧‧‧支持板體 220, 221‧‧‧ support plate
230、231‧‧‧導引板體 230, 231‧‧‧Guide plate
300‧‧‧搬送機構 300‧‧‧ transfer agency
310‧‧‧升降構件 310‧‧‧ Lifting member
320‧‧‧軌道 320‧‧‧ track
330‧‧‧滑動部 330‧‧‧Sliding section
F‧‧‧基板 F‧‧‧ substrate
圖1是顯示實施形態之基板翻轉裝置之外觀構成之立體圖。FIG. 1 is a perspective view showing an external configuration of a substrate inverting device according to an embodiment.
圖2是用來說明實施形態之基板翻轉裝置之吸附部之立體圖。 FIG. 2 is a perspective view for explaining a suction part of the substrate inverting device of the embodiment.
圖3（a）是實施形態之基板翻轉裝置之吸附板體之分解立體圖。圖3（b）是用來說明實施形態之基板翻轉裝置之吸附部之驅動機構之局部擴大圖。 FIG. 3 (a) is an exploded perspective view of a suction plate body of the substrate turning device of the embodiment. FIG. 3 (b) is a partially enlarged view for explaining the driving mechanism of the suction section of the substrate inversion device of the embodiment.
圖4（a）～（c）是顯示實施形態之基板翻轉裝置之吸附部吸附基板之狀態之示意圖。 4 (a)-(c) are schematic diagrams showing a state in which the substrate is adsorbed by the adsorption section of the substrate inversion device of the embodiment.
圖5（a）～（c）是顯示實施形態之基板翻轉裝置之吸附部吸附基板之狀態之示意圖。 5 (a) to 5 (c) are schematic diagrams showing a state where a substrate is adsorbed by an adsorption section of a substrate inverting device according to an embodiment.
圖6（a）是實施形態之基板翻轉裝置之移送位置側之翻轉機構之立體圖。圖6（b）是實施形態之基板翻轉裝置之待機位置側之翻轉機構之立體圖。 Fig. 6 (a) is a perspective view of a reversing mechanism on the transfer position side of the substrate reversing device according to the embodiment. Fig. 6 (b) is a perspective view of the turning mechanism on the standby position side of the substrate turning device of the embodiment.
圖7是顯示實施形態之基板翻轉裝置之翻轉機構之一部分之圖，是分解立體圖。 FIG. 7 is a view showing a part of a turning mechanism of the substrate turning device of the embodiment, and is an exploded perspective view.
圖8（a）～（d）是用來說明由實施形態之基板翻轉裝置進行之基板之翻轉動作之示意圖。 8 (a)-(d) are schematic diagrams for explaining a substrate reversing operation performed by the substrate reversing device of the embodiment.
圖9（a）～（d）是用來說明由實施形態之基板翻轉裝置進行之基板之翻轉動作之示意圖。 9 (a)-(d) are schematic diagrams for explaining a substrate inversion operation performed by the substrate inversion device of the embodiment.
圖10是顯示實施形態之基板翻轉裝置之構成之方塊圖。 FIG. 10 is a block diagram showing a configuration of a substrate inverting device according to the embodiment.
圖11是實施形態之基板翻轉裝置之動作之流程圖。 FIG. 11 is a flowchart of the operation of the substrate inversion device according to the embodiment.
圖12（a）是顯示實施形態之基板翻轉裝置之構成之一部分之前視圖。圖12（b）是顯示實施形態之變更例1之基板翻轉裝置之構成之一部分之前視圖。 FIG. 12 (a) is a front view showing a part of the configuration of the substrate inversion device according to the embodiment. FIG. 12 (b) is a front view showing a part of the configuration of the substrate inverting device according to the first modification of the embodiment.
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2018-015693 | 2018-01-31 | ||
| JP2018015693A JP7085743B2 (en) | 2018-01-31 | 2018-01-31 | Board reversing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201938468A true TW201938468A (en) | 2019-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108100376A TW201938468A (en) | 2018-01-31 | 2019-01-04 | Substrate overturning device capable of efficiently and well performing overturn of a substrate with simplified structure and saved space |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7085743B2 (en) |
| KR (1) | KR20190093152A (en) |
| CN (1) | CN110092172A (en) |
| TW (1) | TW201938468A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491817B (en) * | 2019-09-03 | 2024-04-26 | 罗博特科智能科技股份有限公司 | Adjustable sheet turning device |
| CN111660266B (en) * | 2020-06-15 | 2023-07-28 | 潍坊路加精工有限公司 | Turnover device |
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| JPH03279116A (en) * | 1990-03-23 | 1991-12-10 | Olympus Optical Co Ltd | Work reversing device |
| JPH05301212A (en) * | 1992-04-27 | 1993-11-16 | Hitachi Electron Eng Co Ltd | Green sheet non-contact reversing device |
| JPH06191638A (en) * | 1992-12-28 | 1994-07-12 | Matsushita Electron Corp | Obverse and reverse invert device and method of semiconductor device |
| JP2002099095A (en) * | 2000-09-25 | 2002-04-05 | Orc Mfg Co Ltd | Automatic both-side exposing device and method of using the same |
| JP3742000B2 (en) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | Press machine |
| JP4197129B2 (en) | 2003-03-19 | 2008-12-17 | シャープ株式会社 | Work transfer device |
| CN1890074B (en) * | 2003-12-04 | 2011-03-30 | 三星钻石工业股份有限公司 | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
| JP4467367B2 (en) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method, and substrate processing method |
| JP5334443B2 (en) | 2008-04-02 | 2013-11-06 | 日本メクトロン株式会社 | Plate work reversing device |
| JP5318482B2 (en) | 2008-07-23 | 2013-10-16 | ジャパンマリンユナイテッド株式会社 | Apparatus and method for reversing plate-like body |
| CN101844702B (en) * | 2010-06-21 | 2012-11-28 | 深南电路有限公司 | Panel turnover machine |
| DE102011055255A1 (en) | 2010-11-12 | 2012-05-16 | Schott Solar Ag | Arrangement i.e. turning device, for transporting and turning wafers to manufacture e.g. solar cell, has detour elements arranged at preset distance from shafts, where one shaft is connected with drive arranged outside device |
| KR102007042B1 (en) * | 2012-09-19 | 2019-08-02 | 도쿄엘렉트론가부시키가이샤 | Delamination device |
| JP2014080336A (en) | 2012-10-17 | 2014-05-08 | Mitsuboshi Diamond Industrial Co Ltd | Substrate dividing device |
| JP6059565B2 (en) * | 2013-03-13 | 2017-01-11 | 三星ダイヤモンド工業株式会社 | Adsorption reversing device |
| CN103754608B (en) * | 2014-01-07 | 2015-12-02 | 福耀玻璃工业集团股份有限公司 | A kind of glass turnover device |
| JP6560572B2 (en) * | 2015-09-14 | 2019-08-14 | 株式会社荏原製作所 | Inversion machine and substrate polishing equipment |
| CN205204160U (en) * | 2015-12-10 | 2016-05-04 | 卓达新材料科技集团有限公司 | Automatic plate turnover machine |
| JP6271683B2 (en) * | 2016-11-17 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | Adsorption reversing device |
| CN106956898B (en) * | 2017-03-08 | 2018-12-04 | 燕山大学 | Three-wave-length detection device and method for the flaw detection of six face of composite plate |
| CN206679858U (en) * | 2017-03-29 | 2017-11-28 | 京东方科技集团股份有限公司 | A kind of switching mechanism |
-
2018
- 2018-01-31 JP JP2018015693A patent/JP7085743B2/en active Active
-
2019
- 2019-01-04 TW TW108100376A patent/TW201938468A/en unknown
- 2019-01-17 CN CN201910042829.0A patent/CN110092172A/en active Pending
- 2019-01-29 KR KR1020190011450A patent/KR20190093152A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190093152A (en) | 2019-08-08 |
| CN110092172A (en) | 2019-08-06 |
| JP7085743B2 (en) | 2022-06-17 |
| JP2019131372A (en) | 2019-08-08 |
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