CN110085540A - 一种定位精准的吸附力强的芯片拾取设备 - Google Patents
一种定位精准的吸附力强的芯片拾取设备 Download PDFInfo
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- CN110085540A CN110085540A CN201910354001.9A CN201910354001A CN110085540A CN 110085540 A CN110085540 A CN 110085540A CN 201910354001 A CN201910354001 A CN 201910354001A CN 110085540 A CN110085540 A CN 110085540A
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 31
- 238000004140 cleaning Methods 0.000 claims abstract description 75
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 230000000712 assembly Effects 0.000 claims abstract description 15
- 238000000429 assembly Methods 0.000 claims abstract description 15
- 230000003139 buffering effect Effects 0.000 claims description 7
- 239000010687 lubricating oil Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 12
- 238000010521 absorption reaction Methods 0.000 description 5
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- 230000006870 function Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
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- 238000010297 mechanical methods and process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
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Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910354001.9A CN110085540B (zh) | 2019-04-29 | 2019-04-29 | 一种定位精准的吸附力强的芯片拾取设备 |
Applications Claiming Priority (1)
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CN201910354001.9A CN110085540B (zh) | 2019-04-29 | 2019-04-29 | 一种定位精准的吸附力强的芯片拾取设备 |
Publications (2)
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CN110085540A true CN110085540A (zh) | 2019-08-02 |
CN110085540B CN110085540B (zh) | 2020-12-18 |
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CN201910354001.9A Active CN110085540B (zh) | 2019-04-29 | 2019-04-29 | 一种定位精准的吸附力强的芯片拾取设备 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110491822A (zh) * | 2019-08-05 | 2019-11-22 | 深圳市律远汇智科技有限公司 | 一种具有自动维护功能的芯片拾取装置 |
CN115083991A (zh) * | 2022-08-19 | 2022-09-20 | 深圳市鸿洋四洲科技有限公司 | 一种大功率瞬态抑制二极管吸取装置 |
CN116884907A (zh) * | 2023-08-30 | 2023-10-13 | 翼龙半导体设备(无锡)有限公司 | 一种ic半导体芯片封装设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102290373A (zh) * | 2010-06-17 | 2011-12-21 | 株式会社日立高新技术仪器 | 芯片焊接器、拾取方法以及拾取装置 |
JP2013033850A (ja) * | 2011-08-02 | 2013-02-14 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
CN103155125A (zh) * | 2010-09-28 | 2013-06-12 | 株式会社新川 | 半导体芯片拾取装置及使用该装置的半导体芯片拾取方法 |
CN106981444A (zh) * | 2015-11-12 | 2017-07-25 | 韩美半导体 | 热压键合装置 |
CN207593816U (zh) * | 2017-10-27 | 2018-07-10 | 东莞东聚电子电讯制品有限公司 | 一种同时拾取多个产品并可定位的拾取装置 |
-
2019
- 2019-04-29 CN CN201910354001.9A patent/CN110085540B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102290373A (zh) * | 2010-06-17 | 2011-12-21 | 株式会社日立高新技术仪器 | 芯片焊接器、拾取方法以及拾取装置 |
CN104299932A (zh) * | 2010-06-17 | 2015-01-21 | 株式会社日立高新技术仪器 | 芯片焊接器、拾取方法以及拾取装置 |
CN103155125A (zh) * | 2010-09-28 | 2013-06-12 | 株式会社新川 | 半导体芯片拾取装置及使用该装置的半导体芯片拾取方法 |
JP2013033850A (ja) * | 2011-08-02 | 2013-02-14 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
CN106981444A (zh) * | 2015-11-12 | 2017-07-25 | 韩美半导体 | 热压键合装置 |
CN207593816U (zh) * | 2017-10-27 | 2018-07-10 | 东莞东聚电子电讯制品有限公司 | 一种同时拾取多个产品并可定位的拾取装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110491822A (zh) * | 2019-08-05 | 2019-11-22 | 深圳市律远汇智科技有限公司 | 一种具有自动维护功能的芯片拾取装置 |
CN115083991A (zh) * | 2022-08-19 | 2022-09-20 | 深圳市鸿洋四洲科技有限公司 | 一种大功率瞬态抑制二极管吸取装置 |
CN115083991B (zh) * | 2022-08-19 | 2022-10-25 | 深圳市鸿洋四洲科技有限公司 | 一种大功率瞬态抑制二极管吸取装置 |
CN116884907A (zh) * | 2023-08-30 | 2023-10-13 | 翼龙半导体设备(无锡)有限公司 | 一种ic半导体芯片封装设备 |
CN116884907B (zh) * | 2023-08-30 | 2024-04-12 | 翼龙半导体设备(无锡)有限公司 | 一种ic半导体芯片封装设备 |
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Publication number | Publication date |
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CN110085540B (zh) | 2020-12-18 |
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Effective date of registration: 20240517 Address after: 518000 No. 2, zone a, floor 3, building B1, Shenzhen digital technology park, No. 16, Gaoxin South 7th Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee after: Carbon core microelectronics technology (Shenzhen) Co.,Ltd. Country or region after: China Address before: 314000 south side of Hongyun Road, Honghe Town, Xiuzhou District, Jiaxing City, Zhejiang Province Patentee before: Jiaxing Meite e-commerce Co.,Ltd. Country or region before: China |
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