CN110082997B

CN110082997B - Heat dissipation device and projection equipment

Info

Publication number: CN110082997B
Application number: CN201910257229.6A
Authority: CN
Inventors: 曾万军
Original assignee: Shenzhen Efun Technology Co ltd
Current assignee: Shenzhen Efun Technology Co ltd
Priority date: 2019-04-01
Filing date: 2019-04-01
Publication date: 2021-02-26
Anticipated expiration: 2039-04-01
Also published as: CN110082997A

Abstract

A heat dissipation device comprises a first radiator, a first heat conduction pad attached to the first radiator, a pressure module and a bracket for connecting the first radiator and the pressure module, wherein a heating source is clamped between the first heat conduction pad and the pressure module; the first radiator and the pressure module are connected through an elastic connecting piece, and the elastic connecting piece is used for keeping the first radiator and the pressure module to clamp the heating source; the first radiator and the pressure module are respectively provided with a fixed connecting part, and the bracket is provided with an adjustable connecting part corresponding to the fixed connecting part; the two fixed connecting parts are connected with the adjustable connecting part, and the distance is changed along with the movement of the adjustable connecting part when the elastic connecting part deforms. The heat dissipation device is completely and tightly mounted on the external equipment, so that the equipment is prevented from being damaged due to loosening of the heat dissipation device in the process of transportation or operation of the equipment; meanwhile, the heat dissipation device is connected to the support through the adjustable connecting portion and can move in a small range to enable the heating source to be attached to the heat conduction pad, and heat conduction and heat dissipation efficiency is improved.

Description

Heat dissipation device and projection equipment

Technical Field

The invention belongs to the technical field of hardware equipment, and particularly relates to a heat dissipation device and projection equipment.

Background

In recent years, the market of intelligent projection devices has been rapidly developed, and currently mainstream projection devices employ solid-state light sources as light emitting elements. The solid-state light source has the advantages of long service life, environmental protection, high luminous intensity, high color reduction degree and the like, but in the running process of the solid-state light source, electric energy which is not converted into light energy is inevitably converted into heat energy and is diffused to the periphery, and a heat dissipation device needs to be additionally arranged to take away the generated heat so as to ensure the normal work of the solid-state light source. As the power and brightness of solid-state light sources are gradually increased, the requirements of solid-state light sources for heat dissipation are becoming more and more stringent. In order to ensure sufficient contact between the heat dissipation device and the solid-state light source and efficient heat conduction, a heat conduction pad is usually added between the heat dissipation device and the solid-state light source. The heat conducting pad between the heat radiating device and the solid-state light source has certain elastic force, the heat conducting pad can become soft, slidable and deformable after heating, and the solid-state light source is fully contacted with the heat conducting pad under the action of the elastic connecting piece, so that higher heat conduction efficiency is obtained.

In traditional scheme, because the heat abstractor is comparatively heavy, when adopting the radiating scheme in both sides, the heat abstractor on both sides all must force fixed mounting inside projection equipment through the screw, prevent that projection equipment is in the in-process of transportation and work because of the heat abstractor is not hard up to lead to damaging, this just makes in the course of the work, solid-state light source generates heat and makes the heat conduction pad when soft, the laminating is drawn close to the heat conduction pad to the unable external force that accepts of solid-state light source, be difficult to guarantee compactness and heat conduction efficiency of solid-state light source and heat conduction pad laminating, the temperature that leads to solid-state light source is out of control easily.

Disclosure of Invention

The invention aims to provide a heat dissipation device, and aims to solve the technical problem that the traditional heat dissipation device cannot be completely and tightly mounted on external equipment and can be kept in close fit with a heat source.

The invention is realized in such a way that a heat dissipation device comprises a first radiator, a first heat conduction pad attached to the first radiator, a pressure module and a bracket for connecting the first radiator and the pressure module, wherein a heating source is clamped between the first heat conduction pad and the pressure module; the first radiator and the pressure module are connected through an elastic connecting piece, and the elastic connecting piece is used for keeping the first radiator and the pressure module to clamp the heating source; the first radiator and the pressure module are respectively provided with a fixed connecting part, and the bracket is provided with an adjustable connecting part corresponding to the fixed connecting part; the two fixed connecting parts are connected with the adjustable connecting part, and the distance is changed along with the movement of the adjustable connecting part when the elastic connecting part deforms.

Furthermore, the number of the adjustable connecting parts is two, each adjustable connecting part comprises an elastic part, an inner ring and an outer ring, and the inner ring is provided with an inner ring hole; the fixed connecting part comprises a fixed hole corresponding to the inner ring hole; two ends of the elastic piece are respectively connected with the inner side of the outer ring and the outer side of the inner ring, and the outer ring is connected with the body part of the bracket; the inner ring hole and the fixing hole are provided with a connecting piece in a penetrating way.

Furthermore, the elastic piece comprises an arc elastic piece, and the elastic piece is elastically deformed under the action of external force, so that the two inner annular holes move relatively.

Furthermore, a plurality of elastic pieces are arranged on the outer side of the inner ring, and the elastic coefficients of the elastic pieces are completely consistent or incompletely consistent.

Further, the support includes first support and second support, and the both ends of first support and the both ends of second support are equipped with the through-hole respectively, and connecting device passes through the through-hole with the side of first support with the second support butt joint in order to encircle first radiator and pressure module, and first support and second support are equipped with adjustable connecting portion respectively.

Furthermore, the pressure module comprises a second radiator and a second heat conduction pad attached to the second radiator, and a heating source is clamped between the first heat conduction pad and the second heat conduction pad; the first radiator and the second radiator are connected through an elastic connecting piece; the second radiator is provided with a fixed connecting part.

Furthermore, the second radiator, the second heat conduction pad, the first heat conduction pad and the first radiator are respectively provided with mounting holes corresponding to the positions, and the elastic connecting piece penetrates through the mounting holes and is fixed between the first radiator and the second radiator.

Further, the first radiator and the second radiator are provided with radiating fins or radiating piles.

Furthermore, a light outlet is arranged on the bracket.

It is a further object of this invention to provide a projection apparatus comprising a heat sink device as described above, the heat generating source comprising a solid state light source.

It is a further object of the present invention to provide a projection device comprising a heat sink device as described above.

The heat dissipation device provided by the invention has the following beneficial technical effects:

according to the heat dissipation device provided by the invention, the elastic connecting piece is utilized to apply a pressure between the first radiator and the pressure module, meanwhile, the two fixed connecting parts respectively arranged on the first radiator and the pressure module are connected with the adjustable connecting part on the bracket, and when the elastic connecting piece deforms, the distance between the two fixed connecting parts changes along with the movement of the adjustable connecting part. Therefore, the first radiator and the pressure module can move slightly under the action of the elastic force while the heat dissipation device is completely and tightly mounted on the external equipment, and the compression state of the heating source is kept. Therefore, when the heat dissipation device is fastened on external equipment, the equipment can be prevented from being damaged due to loosening of the heat dissipation device in the process of transportation or operation of the equipment; meanwhile, when the heating source works to generate heat, the heating source can be kept to be tightly attached to the first heat conducting pad, the heat conduction and heat dissipation efficiency is improved, and the damage or the influence on the service life of the heating source caused by the fact that the temperature exceeds a safety threshold value in the working process is prevented.

Drawings

FIG. 1 is a schematic view of a heat dissipating device provided by the present invention;

FIG. 2 is yet another schematic view of a heat dissipating device provided by the present invention;

FIG. 3 is a schematic view of a portion of a heat dissipating device provided by the present invention;

fig. 4 is an enlarged view of the adjustable attachment portion of the bracket provided by the present invention.

Reference numerals referred to in the above figures are detailed below:

10-a heat-generating source; 20-an elastic connector; 110-a first heat sink; 111-heat dissipation fins; 120-a first thermally conductive pad; 130-a fixed connection; a fixing hole 130 a; 140-mounting holes; 200-a pressure module; 210-a second heat sink; 220-a second thermally conductive pad; 300-a scaffold; 301-a through hole; 302 an adjustable connection; 3021-outer ring; 3022-an elastic member; 3023-inner ring; an inner ring bore 3023 a; 310-a first support; 311-light outlet; 320-second bracket.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

In order to explain the technical solution of the present invention, the following detailed description is made with reference to the specific drawings and examples.

Referring to fig. 1, the heat dissipation device includes a first heat sink 110, a first thermal pad 120 attached to the first heat sink 110, a pressure module 200, and a bracket 300 for connecting the first heat sink 110 and the pressure module 200, wherein a heat source 10 is sandwiched between the first thermal pad 120 and the pressure module 200; the first heat sink 110 and the pressure module 200 are connected through an elastic connector 20, and the elastic connector 20 is used for keeping the first heat sink 110 and the pressure module 200 to clamp the heat-generating source 10; the first heat sink 110 and the pressure module 200 are respectively provided with a fixed connecting part 130, and the bracket 300 is provided with an adjustable connecting part 302 corresponding to the fixed connecting part 130; the two fixed connection portions 130 are connected to the adjustable connection portion 302 and change a distance with the movement of the adjustable connection portion 302 when the elastic connection member 20 is deformed.

Specifically, the heat dissipation device provided by the embodiment of the present invention operates as follows:

the first heat conduction pad 120 is tightly attached to the first heat sink 110, the heat source 10 is arranged on the other side of the first heat conduction pad 120, the heat source 10 is clamped by the pressure module 200 and the first heat conduction pad 120, and the pressure module 200 is connected with the first heat sink 110 by the elastic connecting piece 20; the pressure module 200 and the fixed connection 130 on the first heat sink 110 are connected with the adjustable connection 302 of the bracket 300. The heat sink device may be mounted to an external device through the bracket 300. In this way, the first heat sink 110 can be fixedly attached to the external device while allowing a small amount of movement between the first heat sink 110 and the heat generating source 10. The first thermal pad 120 is attached to the first heat sink 110 without a seam, so that the maximum thermal conduction efficiency between the first heat sink 110 and the first thermal pad 120 is achieved; the heat source 10 is pressed towards the first thermal pad 120 by the elastic connecting member 20, and after the first thermal pad 120 is softened by heat, the heat source 10 can be in full contact with the first thermal pad 120, so as to achieve the maximum heat conduction efficiency between the heat source 10 and the first thermal pad 120, and further, the heat of the heat source 10 is conducted to the first heat sink 110 as soon as possible; the first heat sink 110 is continuously in full contact with the low-temperature air under the action of the fan, and is cooled efficiently by air cooling, so that heat conducted from the heat generating source 10 is finally dissipated into the air.

The heat dissipation device provided by the embodiment of the invention has the beneficial technical effects that:

according to the heat dissipation device provided by the invention, the elastic connecting piece 20 is utilized to apply a pressure between the first heat sink 110 and the pressure module 200, meanwhile, the two fixed connecting parts 130 respectively arranged on the first heat sink 110 and the pressure module 200 are connected with the adjustable connecting part 302 on the bracket 300, and when the elastic connecting piece 20 deforms, the distance between the two fixed connecting parts changes along with the movement of the adjustable connecting part 302. Thereby allowing the heat sink device to be completely and tightly mounted on the external device while allowing the first heat sink 110 and the pressure module 200 to move with a small amplitude by the elastic force, and maintaining the pressed state of the heat generating source 10. Therefore, when the heat dissipation device is fastened on external equipment, the equipment can be prevented from being damaged due to loosening of the heat dissipation device in the process of transportation or operation of the equipment; meanwhile, when the heat source 10 generates heat during operation, the heat source 10 can be kept to be closely attached to the first heat conduction pad 120, so that the heat conduction and dissipation efficiency is improved, and the heat source 10 is prevented from being damaged or affecting the service life because the temperature exceeds a safety threshold value during the operation process.

Optionally, a groove is provided on the inner side of the main body portion of the bracket 310, and the groove may be used to preliminarily position the clamped first heat sink 110 or pressure module 200, so that the first heat sink 110 or pressure module 200 is conveniently fixed on the inner ring 3023 by a connector; may also be used to clamp or snap the first heat sink 110 or the pressure module 200.

Further, referring to fig. 4, the number of the adjustable connection portions 302 is two, each adjustable connection portion 302 includes an elastic member 3022, an inner ring 3023 and an outer ring 3021, the inner ring 3023 is provided with an inner ring hole 3023 a; the fixing connection 130 includes a fixing hole 130a corresponding to the inner ring hole 3023a3023 a; the two ends of the elastic element 3022 are respectively connected with the inner side of the outer ring 3021 and the outer side of the inner ring 3023, and the outer ring 3021 is connected with the body part of the bracket 300; the inner ring hole 3023a and the fixing hole 130a are provided with a connecting member.

Specifically, the elastic member 3023 has an elastic force, and is deformed in a relative movement direction of the first heat sink 110 and the pressure module 200 when being applied with a force, and is deformed and restored after the external force is removed, so that the inner ring 3023 can be moved within the outer ring 3021 with a small amplitude.

Further, referring to fig. 4, the elastic member 3022 includes an arc-shaped elastic piece, which is elastically deformed by an external force to allow the two inner ring holes 3023a to move relatively.

Specifically, the elastic member 3023 may be an arc-shaped metal sheet having certain elasticity and toughness, and connecting the outer edge of the inner ring 3023 and the inner edge of the outer ring 3021. The number of the arc-shaped elastic pieces is preferably more than 2. Further, a plurality of arc-shaped elastic pieces can be uniformly arranged on two sides of the inner ring hole 3023a, and the bending directions of the arc-shaped elastic pieces on the same side of the inner ring hole 3023a are consistent, so as to facilitate elastic deformation. The bending directions of the plurality of arc-shaped elastic pieces positioned at both sides of the inner ring hole 3023a may be uniform or nonuniform.

Specifically, the elastic members 3023 in the direction in which the first heat sink 110 and the pressure module 200 move radially have a lower elastic coefficient than the elastic members 3023 in the direction in which the first heat sink 110 and the pressure module 200 move tangentially, and the inner ring 3023 is more easily moved in the radial direction by a small amount and is relatively fixed in the tangential direction. Specifically, the width of the elastic members 3023 in the direction in which the first heat sink 110 and the pressure module 200 move tangentially may be set smaller to achieve the above-described object. Thus, the first heat sink 110 and the pressure module 200 can radially move with a small amplitude, and are not easy to generate tangential displacement, and when the first heat conduction pad 120 and the second heat conduction pad 220 are heated and softened, the first heat conduction pad and the second heat conduction pad can be tightly attached to the heat source 10 under the action of the elastic connecting piece 20, so that the heat conduction efficiency is improved; meanwhile, the first heat sink 110 and the pressure module 200 have large mass, and the bracket 300 only allows the first heat sink 110 and the pressure module 200 to move within a certain range in a small amplitude, so that the machine is prevented from being damaged due to the integral swing of the heat dissipation device in the transportation and working processes of the machine.

Further, referring to fig. 4, a plurality of elastic members 3022 are disposed outside the inner ring 3023, and the elastic coefficients of the elastic members 3022 are completely or incompletely consistent.

Specifically, the inner ring 3023 has a low displacement ability in the direction of connecting the elastic members 3023 having a high elastic modulus, and the inner ring 3023 has a high displacement ability in the direction of connecting the elastic members 3023 having a low elastic modulus, so that a plurality of elastic members 3023 having an incompletely identical elastic modulus are provided on the outer side of the inner ring 3023, whereby the direction in which the inner ring 3023 is easily displaced can be selected.

Further, referring to fig. 1, the bracket 300 includes a first bracket 310 and a second bracket 320, through holes 301 are respectively formed at two ends of the first bracket 310 and two ends of the second bracket 320, the connecting device connects the first bracket 310 and the second bracket 320 through the through holes 301 to surround the side surfaces of the first heat sink and the pressure module 200, and the first bracket 310 and the second bracket 320 are respectively provided with an adjustable connection portion 302.

Specifically, for manufacturing and installation convenience, the bracket 300 is formed by connecting a first bracket 310 and a second bracket 320 end to end, and an inner ring 3023 which can move in one or more directions with a small amplitude is arranged on the first bracket 310; or on the second support 320; or on the first and

second supports

310 and 320, the fixed connection 130 of the first heat sink 110 and the pressure module 200 is fixed on the support 300 by an elastic connection, and the inner ring 3023 is always fixed, so that the first heat sink 110 and the pressure module 200 fixedly connected to the inner ring 3023 can be fixed on the support 300 tangentially while moving radially with a small amplitude; preferably, the first bracket 310 and the second bracket 320 are coupled together by a screw and a nut passing through the through hole 301.

Further referring to fig. 2 and 3, the pressure module 200 includes a second heat sink 210, a second thermal pad 220 attached to the second heat sink 210, and the heat source 10 is sandwiched between the first thermal pad 120 and the second thermal pad 220; the first heat sink 110 and the second heat sink 210 are connected by the elastic connection member 20; the second heat sink 210 is provided with a fixing connection portion 130.

Specifically, the bracket 300 clamps the first heat sink 110 and the second heat sink 210 and is fixedly connected to the housing of the machine, and the first heat sink 110 and the second heat sink 210 are respectively fixed on the bracket 300 through the inner ring 3023 and can be close to or far away from each other with a small amplitude; the second thermal pad 220 is seamlessly attached to the second heat sink 210 of the second heat sink 210, so that the maximum thermal conduction efficiency between the second heat sink 210 and the second thermal pad 220 is achieved; the heat source 10 is clamped between the first thermal pad 120 and the second thermal pad 220 under a certain pressure, so that after the second thermal pad 220 is heated and softened, the heat source 10 can be in full contact with the second thermal pad 220, the maximum heat conduction efficiency between the heat source 10 and the second thermal pad 220 is achieved, and further, the heat of the heat source 10 is conducted to the second heat sink 210 as soon as possible; the second heat sink 210 is sufficiently contacted with the low-temperature air by the fan, and is cooled down efficiently by air cooling, and finally dissipates the heat conducted from the heat generating source 10 into the air.

The beneficial effects of doing so are: in the scheme of arranging the heat sink on one side, the heat sink is only attached to one side of the heat source 10, and the solid-state light source has a certain thickness, so that the heat dissipation efficiency of the scheme is low, and meanwhile, the heat dissipation is not uniform, so that a higher temperature gradient exists in the working process of the heat source 10, and higher requirements are provided for the structural strength and the heat resistance of the heat source 10. According to the heat dissipation device provided by the embodiment of the invention, the first heat conduction pad 120 and the second heat conduction pad 220 are utilized to clamp the heating source 10 under the action of the elastic connecting piece 20 and then are respectively connected with the first radiator 110 and the second radiator 210, so that on one hand, the overall heat dissipation efficiency of the heat dissipation device is improved, on the other hand, the technical effect of simultaneously dissipating heat at two sides of the heating source 10 can be realized, the heat dissipation is more uniform, the temperature gradient of the heating source 10 in the working process is reduced, and the service life of the heating source 10 in normal work is prolonged.

Preferably, the first thermal pad 120 and the second thermal pad 220 are made of soft, elastic, easily softened, easily creeping, easily relaxed stress, and good thermal conductivity material, such as silica gel, etc.; preferably, the first heat sink 110 and the second heat sink 210 are made of a solid material with high thermal conductivity, such as aluminum, copper, etc.; optionally, the first heat sink 110 and the second heat sink 210 have grooves for accommodating heat conducting pads at positions where the heat conducting pads are disposed.

Further, referring to fig. 3, the second heat sink 210, the second thermal pad 220, the first thermal pad 120 and the first heat sink 110 are respectively provided with mounting holes 140 corresponding to the positions, and the elastic connecting member 20 passes through the mounting holes 140 and is fixed between the first heat sink 110 and the second heat sink 210.

Specifically, the first heat conduction pad 120, the second heat conduction pad 220, the first heat sink 110, the second heat sink 210, the heat source 10, and the heat dissipation fins 111 or heat dissipation studs of the first heat sink 110 and the second heat sink 210 are provided with mounting holes 140 for mounting the elastic connecting member 20, and the elastic connecting member 20 passes through the mounting holes 140 to fix the second heat sink 210 on the first heat sink 110 and provide a radial pressure to the first heat sink 110 and the second heat sink 210.

Further, referring to fig. 1 to 4, the first heat sink 110 and the second heat sink 210 are provided with heat dissipation fins 111 or heat dissipation studs.

Specifically, the heat dissipating fins 111 or heat dissipating piles of the first heat sink 110 and the second heat sink 210 are externally connected with an electric fan, the electric fan is preferentially started before the heat source 10 works, air is blown into the first heat sink 110 and the second heat sink 210, and the heat source 10 is electrified to work when and only when the electric fan works normally; the electric fan blows low-temperature air to the radiator, and diffuses heat conducted from the heat source 10 to the radiator into surrounding air, thereby realizing temperature control of the heat source 10.

Further, referring to fig. 1, the bracket 300 is provided with a light outlet 311.

Preferably, the side surfaces of the first bracket 310 and the second bracket 320 are respectively provided with a light outlet 311, one light outlet 311 faces a light outlet of the solid-state light source, the solid-state light source outputs light through the light outlet 311 for projection, and the other light outlet 311 is used for circuit connection. Optionally, the size of the light outlet 311 is larger than the size of the cross section of the solid-state light source, so that the light outlet portion of the solid-state light source can protrude from the light outlet 311 through the light outlet 311 if necessary.

It is a further object of the present invention to provide a projection apparatus comprising a heat dissipating device as described above, the heat generating source 10 comprising a solid state light source.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A heat dissipation device is characterized by comprising a first radiator, a first heat conduction pad attached to the first radiator, a pressure module and a bracket for connecting the first radiator and the pressure module, wherein a heating source is clamped between the first heat conduction pad and the pressure module;

the first radiator and the pressure module are connected through an elastic connecting piece, and the elastic connecting piece is used for keeping the first radiator and the pressure module to clamp the heating source;

the first radiator and the pressure module are respectively provided with a fixed connecting part, and the bracket is provided with an adjustable connecting part corresponding to the fixed connecting part;

the two fixed connecting parts are connected with the adjustable connecting part, and the distance is changed along with the movement of the adjustable connecting part when the elastic connecting part deforms;

the adjustable connecting part comprises an elastic part, an inner ring and an outer ring, and the inner ring is provided with an inner ring hole; the fixed connecting part comprises a fixed hole corresponding to the inner ring hole; two ends of the elastic piece are respectively connected with the inner side of the outer ring and the outer side of the inner ring, and the outer ring is connected with the body part of the bracket; and the inner ring hole and the fixing hole are provided with a connecting piece in a penetrating way.

2. The heat dissipating device of claim 1, wherein the number of adjustable connections is two.

3. The heat dissipating device of claim 2, wherein the elastic member comprises an arc-shaped elastic piece which is elastically deformed by an external force to allow the two inner annular holes to move relatively.

4. The heat dissipating device of claim 2, wherein a plurality of the elastic members are disposed outside the inner ring, and the elastic coefficients of the plurality of the elastic members are completely or incompletely uniform.

5. The heat dissipating device of claim 2, wherein the bracket comprises a first bracket and a second bracket, wherein two ends of the first bracket and two ends of the second bracket are respectively provided with a through hole, a connecting device is used for butting the first bracket and the second bracket through the through holes so as to surround the first heat sink and the side surface of the pressure module, and the first bracket and the second bracket are respectively provided with the adjustable connecting portion.

6. The heat dissipating device of claim 1, wherein the pressure module comprises a second heat sink, a second thermal pad attached to the second heat sink, and a heat source sandwiched between the first thermal pad and the second thermal pad;

the first radiator and the second radiator are connected through the elastic connecting piece;

the second radiator is provided with the fixed connection portion.

7. The heat dissipating device of claim 6, wherein the second heat sink, the second thermal pad, the first thermal pad and the first heat sink are each provided with a corresponding mounting hole, and an elastic connecting member is inserted through the mounting holes and fixed between the first heat sink and the second heat sink.

8. The heat dissipating device of claim 6, wherein the first heat sink and the second heat sink are provided with heat dissipating fins or heat dissipating studs.

9. The heat dissipating device of any of claims 1 to 8, wherein the support is provided with a light outlet.

10. A projection device comprising a heat sink device as claimed in any one of claims 1-9, and the heat generating source comprises a solid state light source.