CN208270918U - Projector and radiating module - Google Patents
Projector and radiating module Download PDFInfo
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- CN208270918U CN208270918U CN201820835898.8U CN201820835898U CN208270918U CN 208270918 U CN208270918 U CN 208270918U CN 201820835898 U CN201820835898 U CN 201820835898U CN 208270918 U CN208270918 U CN 208270918U
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- heat
- radiating module
- projector
- conducting piece
- thermal seal
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Abstract
The utility model relates to a kind of projector and its radiating module, projector includes light source, light valve, radiating module and camera lens.Light source is for issuing illuminating bundle.Light valve is configured on the transmission path of illuminating bundle, and for illuminating bundle to be converted into image strip.Radiating module includes heat-conducting piece, cooling wafer, thermal seal and insulation coating member.Heat-conducting piece is connected to heat source.Cooling wafer is configured on heat-conducting piece.Thermal seal surrounds cooling wafer.It is insulated coating member cladding thermal seal and heat-conducting piece.Camera lens is configured on the transmission path of image strip and for image strip to be projected to outside projector.Projector is with good reliability and radiating module has good sealing effect.
Description
Technical field
The utility model relates to a kind of Optical devices and its radiating module, and in particular to a kind of projector and
Its radiating module.
Background technique
Projector is a kind of display device to generate picture whenever and wherever possible.The image-forming principle of projector is by light source die
Illuminating bundle caused by block is converted into image strip by light valve, then image strip is projected screen or metope by camera lens
On to form image.
Due to projector light valve running when can generate heat, need to be configured in projector radiating module come to light valve into
Row heat dissipation.A kind of configuration mode of radiating module is to contact light valve using heat-conducting piece, using the cooling heat-conducting piece of cooling wafer, and benefit
The heat of cooling wafer is taken away with water-cooling group.It is seeped in order to avoid accumulating on the water droplet of heat-conducting piece due to the heat exchange because of radiating module
To cooling wafer, generally cooling wafer can be coated using insulation, water droplet is isolated from outside cooling wafer.However, in order to reach
To preferable sealing effect, the sealing material such as sponge need to be attached on the inside of insulation, and it is more time-consuming.
" background technique " paragraph is used only to help to understand the content of the present invention, therefore is taken off in " background technique " paragraph
The content of dew may include some known technologies without constituting road known to those skilled in the art.In " background technique " paragraph institute
The content of exposure does not represent the content or the utility model one or more embodiment problem to be solved, practical at this
It has been readily known to those persons skilled in the art or has recognized before novel application.
Utility model content
The utility model provides a kind of projector and radiating module, can simplify assembling flow path and have good reliability.
The other objects and advantages of the utility model can be obtained from the technical characteristic disclosed by the utility model into one
The understanding of step.
It is up to one of above-mentioned or partially or in whole purpose or other purposes, an embodiment of the utility model propose one kind
Projector, including light source, light valve, radiating module and camera lens.Light source is for issuing illuminating bundle.Light valve is configured at illuminating bundle
On transmission path, and for illuminating bundle to be converted into image strip.Radiating module include heat-conducting piece, cooling wafer, insulation it is close
Sealing and insulation coating member.Heat-conducting piece is connected to heat source.Cooling wafer is configured on heat-conducting piece.Thermal seal is brilliant around refrigeration
Piece.It is insulated coating member cladding thermal seal and heat-conducting piece.Camera lens is configured on the transmission path of image strip and is used for shadow
As light beam is projected to outside projector.
It is up to one of above-mentioned or partially or in whole purpose or other purposes, an embodiment of the utility model propose one kind
Radiating module, is used for projector, and radiating module includes heat-conducting piece, cooling wafer, thermal seal and insulation coating member.Heat-conducting piece
It is connected to heat source.Cooling wafer is configured on heat-conducting piece.Thermal seal surrounds cooling wafer.It is close to be insulated coating member cladding insulation
Sealing and heat-conducting piece.
Based on above-mentioned, the embodiments of the present invention at least have effects that following one of advantage or.It is practical new at this
In the radiating module of type, in addition to surrounding cooling wafer using thermal seal, thermal seal more is coated using insulation coating member
And heat-conducting piece.Thermal seal can have good sealing effect for soft sealing structures such as sponge, foam or silica gel, and by
It is fixed by insulation coating member, is so then not required to paste on the inside of the insulation to coat cooling wafer as known way
The sealing material such as attached sponge, and the assembling flow path of radiating module can be simplified.In addition, as above being coated simultaneously using insulation coating member
Heat-conducting piece and thermal seal can still be adiabatic coating member barrier even if the water droplet on heat-conducting piece is seeped to outside thermal seal
And will not seep to the circuit system of projector or other electrical components, so that projector be made to have good reliability.
In order to make the above-mentioned features and advantages of the utility model more obvious and understandable, special embodiment below, and appended by cooperation
Attached drawing is described in detail below.
Detailed description of the invention
Fig. 1 is the schematic diagram of the projector of an embodiment of the present invention.
Fig. 2 is the partial cutaway schematic of the projector of Fig. 1.
Fig. 3 is the partial component exploded view of the radiating module of Fig. 2.
Fig. 4 and Fig. 5 is the locking accessory of the utility model other embodiments and the schematic diagram of heat insulating sleeve.
Fig. 6 is the partial component schematic diagram of the radiating module of another embodiment of the utility model.
Fig. 7 is the schematic diagram of the radiating module of another embodiment of the utility model.
Fig. 8 is the exploded view of the radiating module of Fig. 7.
Fig. 9 is the schematic diagram of the radiating module of another embodiment of the utility model.
Specific embodiment
Aforementioned and other technology contents, feature and effect in relation to the utility model refer to the one of attached drawing in following cooperation
In the detailed description of preferred embodiment, can clearly it present.The direction term being previously mentioned in following embodiment, such as: upper,
Under, it is left and right, front or rear etc., be only the direction with reference to attached drawing.Therefore, the direction term used is for illustrating not to be used to limit
The utility model processed.
Fig. 1 is the schematic diagram of the projector of an embodiment of the present invention.Referring to FIG. 1, the projector 100 of the present embodiment
Including light source 110, light valve 120 and camera lens 130.Light source 110 is, for example, laser light source and is used to issue illuminating bundle L1.Light source
110 be, for example, laser diode or light emitting diode, but not limited to this.Light valve 120 is, for example, digital micromirror elements (digital
Micro mirror device, DMD), silica-based liquid crystal panel (liquid crystal on silicon panel, LCoS
Panel) or liquid crystal display panel (liquid crystal display panel, LCD panel), but not limited to this.Light valve
120 are configured on the transmission path of illuminating bundle L1, and for illuminating bundle L1 to be converted into image strip L2.Camera lens 130 is matched
It is placed on the transmission path of image strip L2, and for image strip L2 to be projected to outside projector 100.
Fig. 2 is the partial cutaway schematic of the projector of Fig. 1.Referring to FIG. 2, the projector 100 of the present embodiment further includes
Radiating module 140.Radiating module 140 includes conductive structure 142, radiator structure 144, locking accessory 146 and heat-insulation assembly 148.It leads
The material of heat structure 142 is, for example, metal, and including pedestal 142a and heat-conducting piece 142b.Pedestal 142a carries heat-conducting piece 142b,
Heat-conducting piece 42b is connected to heat source, this heat source is, for example, light source 110 or light valve 120 (Fig. 2 is denoted as light source 110).It is light in heat source
In the embodiment in source 110, locking accessory 146 can be such that radiator structure 144, heat insulation layer 149 is closely combined with pedestal 142a.In heat source
In embodiment for light valve 120, locking accessory 146 can be such that radiator structure 144, heat insulation layer 149 is closely combined with heat-conducting piece 142b.
Radiator structure 144 is, for example, liquid-cooling heat radiation group (such as water-cooling group), and is configured on conductive structure 142.It locks
Part 146 passes through radiator structure 144, and is attached to pedestal 142a or heat-conducting piece 142b (Fig. 2 is schematically shown as locking accessory 146 and is attached to seat
Body 142a).Heat-insulation assembly 148 is configured at locking accessory 146, and obstructs between locking accessory 146 and radiator structure 144, to avoid
Conductive structure 142 is conducted back to by locking accessory 146 again after the heat transfer of conductive structure 142 to radiator structure 144.To dissipate
Thermal modules 140 can have good radiating efficiency.
In the present embodiment, radiating module 140 further includes cooling wafer 147 and heat insulation layer 149.Cooling wafer 147 configures
Between heat-conducting piece 142b and radiator structure 144, to cool down to heat-conducting piece 142b, and radiator structure 144 is conducted heat to.
Heat insulation layer 149 is configured between conductive structure 142 and radiator structure 144 and around cooling wafer 147, to prevent radiator structure
144 heat is directly conducted back to conductive structure 142.
Fig. 3 is the partial component exploded view of the radiating module of Fig. 2.Please refer to Fig. 2 and Fig. 3, specifically, the present embodiment
Radiator structure 144 has aperture 144a, and locking accessory 146 includes the locking section 146b and stopper section 146a being connected, locking section
146b pass through aperture 144a and by the threaded portion 146c of its end and screw lock (screw thread is sealed) in conductive structure 142.Heat-insulation assembly
148 include heat insulating sleeve 148a and heat insulating washer 148b, and heat insulating sleeve 148a and heat insulating washer 148b are sheathed on locking accessory 146
Locking section 146b.In the present embodiment, partial insulation sleeve 148a is located in aperture 144a.Heat insulating washer 148b is located at stopper section
Between 146a and radiator structure 144.
In the present embodiment, radiating module 140 further includes structure-reinforced gasket 141 and elastic component 143.Structure-reinforced gasket
141 are sheathed on the locking section 146b of locking accessory 146 and between stopper section 146a and heat insulating washer 148b.In the present embodiment
In, structure-reinforced gasket 141 is for increasing rigidity of the locking accessory 146 when locking.Elastic component 143 is, for example, compressed spring and set
Set on locking accessory 146 locking section 146b and be compressed between stopper section 146a and structure-reinforced gasket 141, with by its elasticity
Power makes structure-reinforced gasket 141, heat insulating washer 148b, radiator structure 144, heat insulation layer 149, cooling wafer 147, conductive structure
142 closely combine.In other embodiments, locking accessory can be not provided with elastic component for general flat head screw, locking accessory
It can be ladder screw, the utility model limits not to this.
In the present embodiment, the pyroconductivity of heat-insulation assembly 148 is, for example, less than 1, to provide good insulation effect, material
Matter is, for example, plastic cement or rubber.The outer diameter of heat insulating washer 148b is greater than the outer diameter of heat insulating sleeve 148a, makes heat insulating washer
148b can surround heat insulating sleeve 148a.In addition, locking accessory 146 has recess portion N, heat insulating sleeve 148a is enable firmly to configure
In in recess portion 148a.Fig. 4 and Fig. 5 is the locking accessory of the utility model other embodiments and the schematic diagram of heat insulating sleeve.Jacket
Cylinder 148a can be positioned only part as shown in Figure 4 in recess portion N (and part is located at outside recess portion N), or as shown in Figure 5 in locking accessory
146 without being sheathed on locking accessory 146 in the case where recess portion, and the utility model limits not to this.Fig. 6 is that the utility model is another
The partial component schematic diagram of the radiating module of one embodiment.Heat insulating sleeve 148a and heat insulating washer 148b can be illustrated in figure 6 one
Body forming, the utility model limit not to this.
Fig. 7 is the schematic diagram of the radiating module of another embodiment of the utility model.Fig. 8 is the decomposition of the radiating module of Fig. 7
Figure.Fig. 7 and Fig. 8 is please referred to, the radiating module 240 of the present embodiment is used for projector (projector 100 as shown in Figure 1).Heat dissipation
Module 240 includes heat-conducting piece 242, cooling wafer 247, thermal seal 246, insulation coating member 248 and radiator structure 244.It leads
Warmware 242 is, for example, the metalwork that thermal conductivity is greater than 70, and is connected to heat source, this heat source is, for example, light source 110 or light valve 120
(Fig. 2 is denoted as light source 110).
Cooling wafer 247 is configured on heat-conducting piece 242 and between radiator structure 244 and heat-conducting piece 242, to thermally conductive
Part 242 is cooled down, and conducts heat to radiator structure 244.Radiator structure 244 is, for example, liquid-cooling heat radiation group (such as water-cooling
Group).Thermal seal 246 surround cooling wafer 247, insulation coating member 248 be, for example, plastic parts (such as mylar) or rubber parts and
Coat thermal seal 246 and heat-conducting piece 242.
As described above, also being coated using insulation coating member 248 in addition to surrounding cooling wafer 247 using thermal seal 246
Thermal seal 246 and heat-conducting piece 242.In the present embodiment, the material of thermal seal 246 is different from insulation coating member 248
Material.Thermal seal 246 can have good sealing effect for soft sealing structures such as sponge, foam or silica gel, and
It is fixed, is so then not required to as known way in the insulation to coat cooling wafer by insulation coating member 248
Inside attaches the sealing material such as sponge, and can simplify the assembling flow path of radiating module.In addition, as above utilizing insulation coating member
248 coat heat-conducting piece 242 and thermal seal 246 simultaneously, even if aqueous vapor/water droplet on heat-conducting piece 242 is seeped to thermal seal
Outside 246, aqueous vapor/water droplet can still be adiabatic the barrier of coating member 248 and will not seep to the circuit system of projector 100 or other electrical property
Element, so that projector 100 be made to have good reliability.In the present embodiment, the thermal conductivity of thermal seal 246 is, for example, less than
1, and the thermal conductivity for being insulated coating member is, for example, less than 1, with good insulation effect.
Fig. 9 is the schematic diagram of the radiating module of another embodiment of the utility model.Referring to FIG. 9, the heat dissipation of the present embodiment
Module 340 is used for projector (projector 100 as shown in Figure 1).Radiating module 340 includes heat-conducting piece 342, insulation 349, dissipates
Heat structure 344, cooling wafer 347, at least one first locking accessory 346A (showing for two) and at least one second locking accessory
346B (is shown for two).Heat-conducting piece 342 is, for example, the metalwork that thermal conductivity is greater than 70, and is configured at projector 100
On pedestal 150.In the present embodiment, heat-conducting piece 342 is, for example, copper sheet, but not limited to this.Pedestal 150 be located at heat-conducting piece 342 with
Between the heat source of projector 100, heat-conducting piece 342 is connected to the heat source of projector 100, this heat source example across pedestal 150
Light valve 120 in this way.
Insulation 349 is, for example, plastic parts (such as mylar) or rubber parts and cladding heat-conducting piece 342.Radiator structure 344 is for example
It is liquid-cooling heat radiation group (such as water-cooling group) and is configured on heat-conducting piece 342.Cooling wafer 347 be configured at radiator structure 344 with
Between heat-conducting piece 342, to cool down to heat-conducting piece 342, and radiator structure 344 is conducted heat to.First locking accessory 346A is worn
Insulation 349 is crossed, and is attached to pedestal 150.Second locking accessory 346B passes through radiator structure 344, and is attached to heat-conducting piece 342.
As described above, insulation 349 is attached to pedestal using the first locking accessory 346A by the radiating module 340 of the present embodiment
150, and radiator structure 344 is attached to the heat-conducting piece 342 that insulated part 349 coats using the second locking accessory 346B, with by
Segmentation, which locks mode, combines multiple components of radiating module 340.It is such then be not required to as known radiating module with coil spring
The mode set on insulation is hooked to fix radiator structure, thus can avoid buckling deformation due to coil spring hooks the power set of insulation 349,
Using ensures that multiple components of radiating module 340 are closely in contact, and radiating module 340 is made to have good radiating efficiency.This
Outside, insulation 349 is attached to pedestal 150, Er Feili merely with the first locking accessory 346A since above-mentioned segmentation locks in mode
Insulation 349 is attached to pedestal 150 with the first locking accessory 346a and the second locking accessory 346b, therefore reaches standing balance and makes absolutely
Warmware 349 and the heat-conducting piece 342 coated by it will not because bear it is excessive excessively oppress heat source (such as light valve 120) due to locking power,
To avoid heat source damage.
In the present embodiment, the power that locks of the second locking accessory 346B locks power different from the first locking accessory 346A.More into
For one step, in the present embodiment, the second locking accessory 346B lock that power is greater than the first locking accessory 346A lock power, with
Make radiator structure 344, cooling wafer 347 and heat-conducting piece 342 closely phase by the biggish power of locking of the second locking accessory 346B
In conjunction with, and by the first locking accessory 346A it is lesser lock to try hard to avoid exempt from light valve 120 and bear excessive pressure and damage.
The first locking accessory 346A of the present embodiment includes the first locking section 346A2 and the first stopper section 346A1 being connected,
First locking section 346A2 passes through insulation 349 and is attached to pedestal 150.Similarly, the second locking accessory 346B packet of the present embodiment
The the second locking section 346B2 and the second stopper section 346B1 being connected are included, the second locking section 346B2 passes through radiator structure 344 and locks
Invest heat-conducting piece 342.That is, in the present embodiment, the first locking accessory 346A and the second locking accessory 346B lock respectively to
Different elements.
In one embodiment, radiating module 340 may also include at least one first elastic component and at least one second elastic component, institute
It states the first elastic component to be configured between the first stopper section 346A1 and insulation 349, second elastic component is configured at the second backstop
Between portion 346B1 and radiator structure 344, first elastic component and the configuration for stating the second elastic component Fig. 2 similar with the mode of action
And the configuration and the mode of action of elastic component 143 shown in Fig. 3, it is repeated no more in this.In addition, in one embodiment, radiating module
340 further include an at least heat-insulation assembly, and the heat-insulation assembly is configured at the second locking accessory 346B and barrier in the second locking accessory
Between 346B and radiator structure 344.The configuration of heat-insulation assembly Fig. 2 similar with the mode of action and heat-insulation assembly shown in Fig. 3
148 configuration and the mode of action, repeats no more in this.
In the present embodiment, the contact area between heat-conducting piece 342 and cooling wafer 347 be greater than heat-conducting piece 342 with
Contact area between light valve 120 is handed over promoting heat by the large contact area between heat-conducting piece 342 and cooling wafer 347
Change efficiency.
In conclusion the embodiments of the present invention at least have effects that following one of advantage or.It is practical new at this
In the radiating module of type, in addition to surrounding cooling wafer using thermal seal, thermal seal more is coated using insulation coating member
And heat-conducting piece.Thermal seal can have good sealing effect for soft sealing structures such as sponge, foam or silica gel, and by
It is fixed by insulation coating member, is so then not required to paste on the inside of the insulation to coat cooling wafer as known way
The sealing material such as attached sponge, and the assembling flow path of radiating module can be simplified.In addition, as above being coated simultaneously using insulation coating member
Heat-conducting piece and thermal seal can still be adiabatic coating member barrier even if the water droplet on heat-conducting piece is seeped to outside thermal seal
And will not seep to the circuit system of projector or other electrical components, so that projector be made to have good reliability.
The above descriptions are merely preferred embodiments of the present invention, when cannot be limited with this utility model implementation
Range, i.e., it is all according to simple equivalence changes made by the utility model claims book and description and modification, all still
Belong to the range of the utility model patent covering.In addition any embodiment or claim of the utility model are not necessary to reach this reality
With novel disclosed whole purposes or advantage or feature.In addition, abstract and denomination of invention are intended merely to auxiliary patent document inspection
Rope is used, and not is used to limit the interest field of the utility model.In addition, referred in this specification or claims " the
One ", the terms such as " second " are only to name the title of element (element) or distinguish different embodiments or range, and not use
Come the quantitative upper limit of restriction element or lower limit.
Description of symbols
100: projector
110: light source
120: light valve
130: camera lens
140,240,340: radiating module
141: structure-reinforced gasket
142: conductive structure
142a: pedestal
142b, 242,342: heat-conducting piece
143: elastic component
144,244,344: radiator structure
144a: aperture
146: locking accessory
146a: stopper section
146b: locking section
146c: threaded portion
147,247,347: cooling wafer
148: heat-insulation assembly
148a: heat insulating sleeve
148b: heat insulating washer
149,349: heat insulation layer
150: pedestal
246: thermal seal
248: insulation coating member
346A: the first locking accessory
346A1: the first stopper section
346A2: the first locking section
346B: the second locking accessory
346B1: the second stopper section
346B2: the second locking section
L1: illuminating bundle
L2: image strip
N: recess portion
Claims (18)
1. a kind of projector, which is characterized in that including light source, light valve, radiating module and camera lens,
The light source is for issuing illuminating bundle；
The light valve is configured on the transmission path of the illuminating bundle, and for the illuminating bundle to be converted into image light
Beam；
The radiating module includes heat-conducting piece, cooling wafer, thermal seal and is insulated coating member,
The heat-conducting piece is connected to heat source；
The cooling wafer is configured on the heat-conducting piece；
The thermal seal surrounds the cooling wafer；
The insulation coating member coats the thermal seal and the heat-conducting piece；
The camera lens is configured on the transmission path of the image strip and for the image strip to be projected to the projection
Outside machine.
2. projector as described in claim 1, which is characterized in that the radiating module further includes radiator structure, the refrigeration
Wafer configuration is between the radiator structure and the heat-conducting piece.
3. projector as claimed in claim 2, which is characterized in that the radiator structure includes liquid-cooling heat radiation group.
4. projector as described in claim 1, which is characterized in that the material of the thermal seal is wrapped different from the insulation
Cover the material of part.
5. projector as described in claim 1, which is characterized in that the material of the thermal seal includes sponge or silica gel.
6. projector as described in claim 1, which is characterized in that the material of the insulation coating member includes rubber or plastic cement.
7. projector as described in claim 1, which is characterized in that the thermal conductivity of the thermal seal is less than 1.
8. projector as described in claim 1, which is characterized in that the thermal conductivity of the insulation coating member is less than 1.
9. projector as described in claim 1, which is characterized in that the heat source includes the light source or the light valve.
10. a kind of radiating module, it to be used for projector, which is characterized in that the radiating module includes:
Heat-conducting piece is connected to heat source；
Cooling wafer is configured on the heat-conducting piece；
Thermal seal surrounds the cooling wafer；And
It is insulated coating member, coats the thermal seal and the heat-conducting piece.
11. radiating module as claimed in claim 10, which is characterized in that further include radiator structure, wherein the cooling wafer
It is configured between the radiator structure and the heat-conducting piece.
12. radiating module as claimed in claim 11, which is characterized in that the radiator structure includes liquid-cooling heat radiation group.
13. radiating module as claimed in claim 10, which is characterized in that the material of the thermal seal is different from described exhausted
The material of hot coating member.
14. radiating module as claimed in claim 10, which is characterized in that the material of the thermal seal includes sponge or silicon
Glue.
15. radiating module as claimed in claim 10, which is characterized in that the material of the insulation coating member includes rubber or modeling
Glue.
16. radiating module as claimed in claim 10, which is characterized in that the thermal conductivity of the thermal seal is less than 1.
17. radiating module as claimed in claim 10, which is characterized in that the thermal conductivity of the insulation coating member is less than 1.
18. radiating module as claimed in claim 10, which is characterized in that the heat source includes the light source or light of the projector
Valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820835898.8U CN208270918U (en) | 2018-05-31 | 2018-05-31 | Projector and radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820835898.8U CN208270918U (en) | 2018-05-31 | 2018-05-31 | Projector and radiating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208270918U true CN208270918U (en) | 2018-12-21 |
Family
ID=64688527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820835898.8U Active CN208270918U (en) | 2018-05-31 | 2018-05-31 | Projector and radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208270918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110082997A (en) * | 2019-04-01 | 2019-08-02 | 深圳市毅丰光电科技有限公司 | A kind of radiating element and projection device |
-
2018
- 2018-05-31 CN CN201820835898.8U patent/CN208270918U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110082997A (en) * | 2019-04-01 | 2019-08-02 | 深圳市毅丰光电科技有限公司 | A kind of radiating element and projection device |
| CN110082997B (en) * | 2019-04-01 | 2021-02-26 | 深圳市毅丰光电科技有限公司 | Heat dissipation device and projection equipment |
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