CN1100474C - 电子封装件及其制造方法 - Google Patents

电子封装件及其制造方法 Download PDF

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CN1100474C
CN1100474C CN98105317A CN98105317A CN1100474C CN 1100474 C CN1100474 C CN 1100474C CN 98105317 A CN98105317 A CN 98105317A CN 98105317 A CN98105317 A CN 98105317A CN 1100474 C CN1100474 C CN 1100474C
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solder flux
film carrier
flux mask
fexible film
type surface
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G·J·阿莫采尼
R·N·伊夫斯
M·V·皮尔森
T·A·图
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Abstract

本发明提供了一种电子封装件，该电子封装件包括在薄膜的两个主表面上拥有电子电路并在第一主表面上拥有许多焊料互连焊盘的柔性聚酰亚胺薄膜载体；在两主表面上置有焊剂掩模层，条件是相继要被安装在第一主表面上的各电路芯片间的区域内存在没有焊剂掩模的区域；以及许多微型组件是由焊料珠或隆起的焊料而连接在薄膜载体上。本发明也提供了一种制造电子封装件的方法，该方法包括将焊料珠或隆起的焊料热熔以使微型组件连接在载体上。

Description

电子封装件及其制造方法
本发明涉及一种电子封装件，尤其涉及一种布有珠状网络阵列的柔性薄板，以及它的制造方法。更具体地说，本发明涉及一种包含焊剂掩模并克服了柔性薄膜载体变形问题的布有珠状网络阵列(TBGA)的柔性薄板。
包含薄膜电路元件(作为电子封装件的一种整体部件)的电子封装件在工业界是众所周知的。Funari等人的美国专利4849856和Anschel等人的美国专利4914551中已对这类实例作了阐述。该两专利的受让人即为本发明的受让人。在这些电子封装结构中通常是采用焊料焊接的。有一种技术，电子器件或电子微型组件(半导体芯片)是以“倒装方式”定向安装在一种封装的薄膜结构中的。按这种定向，带有连接点的芯片表面是朝向薄膜电路元件的。芯片上的连接点与各薄膜电路导电元件间是以焊接结构进行电连接的，也称为可控压平芯片连接法(C4′S)。聚酰亚胺常用作柔性薄膜结构，而其上有以真空淀积的、层压的或粘合的金属层。
采用C-4型连接将半导体器件连接到有机柔性基体上存在制造问题。特别是由于有机基体的柔软性，在加工时和温度波动时往往会发生挠曲或弯曲。此外，为了大幅度降低各个微型组件安装到载体上的成本，已建议使整块载体所有焊珠进行热熔而不是对单个焊珠进行逐个连接。由于可焊材料极靠近每一焊盘，因此必须采用焊料掩模以使焊料只保持在每一焊盘上。虽然采用焊剂掩模可解决这一问题，但还会产生另外的问题。具体说，将焊剂掩模置于柔性薄膜载体上会使柔、脆弱的薄膜载体严重变形。然而，为了正常地实施掩模热熔工艺柔性薄膜载体也必须是相当平坦或平整的。因此，希望采用焊剂掩模而不会因采用焊剂掩模而带来柔性薄膜载体变形的问题。
本发明采用的焊剂掩模使得利用掩模热熔技术成为可能，即使不能完全消除变形问题，但能同时使变形明显地减少。
更具体地说，本发明涉及一种电子封装件，包含一种在两个主表面上有电子电路并在第一主表面上有许多焊料互连焊盘的柔性薄膜载体。该电子封装件还包括许多安装在柔性薄膜载体的第一主表面上的微型组件，这些微型组件通过焊盘上的焊珠连接到载体上。焊剂掩模层置于柔性薄膜载体的两个主表面上，条件是在第一主表面上相继要被安装的各微型组件之间的区域内没有焊剂掩模材料。
本发明也涉及制造上述公开的电子封装件的方法。该方法包括提供一种在两个主要表面上拥有电子电路、并在第一主表面上有许多焊料互连焊盘的柔性薄膜载体。柔性薄膜载体的两个主要表面上都置有焊剂掩模层，而在第一主表面上相继要被安装的相邻各微型组件之间的区域内没有焊剂掩模。拥有焊料珠的微型组件置于薄膜的角上而焊珠成对安装在相应的焊料互连焊盘上。然后对焊珠进行热熔操作以使芯片与柔性薄膜载体相连接。在相邻的各微型组件之间的表面上，因没有焊剂掩模材料，因而能显著地降低应力、减少变形。没有焊剂掩模材料的表面相对于刚性的、尚未消除的微小变形部分能起缓冲(hinge)作用。此外，在柔性薄膜载体的第二主表面上有焊剂掩模有助于提高焊接点的强度。
对本领域技术熟练人员来说可从下面详细说明中容易地了解本发明的其它目的和优点。其中图解及说明只是指本发明的优选实施方案，这只不过作为对实施本发明预期的最佳方式的举例说明。大家都知道，本发明可以有其它一般性的实施方案，在不违背本发明精神的前提下，它们的若干细节可有各种不同方式的变体。因此，附图及说明可看作是对本发明本质方面的说明，而不是对本发明的限制。
附图的简要说明
图1是按照本发明的、其上拥有微型组件的柔性薄膜载体的底视示意图。
图2是按照本发明的、其上拥有微型组件的柔性薄膜载体的顶视示意图。
图3是本发明电子封装件中所用的微型组件的横断面视图。
图4是图3横断面的顶视图。
图5是图3横断面的底视图。
为了便于理解本发明，可参阅附图，本发明电子封装件包括在载体两主表面拥有电子电路7的柔性薄膜载体1(见图3)。该柔性薄膜载体是一种介电材料并是一种热塑性或热固化的有机树脂。
典型的有机材料包括常规的FR-4环氧和高温树脂基层压板，其中高温树脂如环氧树脂类、聚酰亚胺类、氰酸酯类(三嗪类)、氟聚合物、苯并环丁烯类、聚亚苯基硫醚类、聚砜类、聚醚酰亚胺类、聚醚酮类、聚苯基喹噁啉类、聚苯并噻唑类以及聚苯基苯并双噻唑类。
优选的材料包括未改性的聚酰亚胺以及改性的聚酰亚胺，如聚酯酰亚胺、聚酰胺-酰亚胺-酯、聚酰胺-酰亚胺、聚硅氧烷-酰亚胺的聚酰亚胺以及其它混合的聚酰亚胺。这些材料在先有技术中是众所周知的，因此，不必作更详细的说明。
通常，聚酰亚胺包括下列重复单元：
式中n是提供分子量通常约10000-100000的相应重复单元数的整数。R是选自下式中的至少一个四价有机基团：
Figure C9810531700062
R5选自含1-4个碳原子的二价脂族烃基团及羰基、氧代、硫代，六氟异亚丙基及磺酰基基团，其中R4是选自下式中的至少一个二价基团：
式中R6是选自R2、硅及氨基基团的二价有机基团。可采用含两个或两个以上R和/或R1基团，特别是多系的含氨基基团的R1的聚合物。
市售聚酰亚胺前体(聚酰胺酸)是由DuPont公司以商品名为Pyralin销售的各种聚酰亚胺的前体。这类聚酰亚胺前体分为许多级，包括由DuPont公司提供的牌号为PI-2555、PI-2545、PI-2560、PI-5878、PIH-61454及PI-2540的Pyralin聚酰亚胺前体。这些前体中的某些前体是均苯四酸酐氧联的双苯胺(PMDA-ODA)聚酰亚胺前体。
市售的化学固化的聚酰亚胺是由DuPont公司以商品名Kapton销售的各种聚酰亚胺，这类聚酰亚胺包括H-Kapton、V-Kapton、HN-Kapton以及VN-Kapton，这些都是化学固化的聚酰亚胺。化学固化的聚酰亚胺通常是用酐固化剂如乙酐固化的。也可购得由UbeIndustries提供的Upilex聚酰亚胺。
优选的薄膜柔性载体是聚酰亚胺。该薄膜载体的厚度通常是约2-约10密耳(约0.005-0.025厘米)，优选约1-约3密耳(约0.0025-约0.0075厘米)。
在柔性薄膜载体1的第一主表面上有许多焊料互连焊盘8。通常的焊料互连焊盘8是铜或一种可钎焊材料。在焊料焊盘上置有供清洁焊料盘和在热熔操作时使焊料珠保持在一定位置上的粘度较高、固含量低的助焊材料。通常，助焊剂组合物是松香基材料。松香助焊剂的主要活性氧化物-还原成分是松香酸。某些松香助焊剂组合物的实例可在美国专利2715084、3478414、4168996、3730782及4441938中查到，这些专利中的公开内容已列入本文供参考。在本发明中采用的典型助焊剂组合物是由四元醇(Quadrol Polyol)，该四元醇是丙氧基化的胺，具体说是四羟基丙基乙二胺。另一种典型的助焊剂是Kester R-244C，它是一种含改性松香、二甘醇丁醚、石油稀释剂及一种有机增稠剂的不需清洗的助焊剂。理想的助焊剂是糊状或膏状形态并供低熔点易熔焊料的焊接。焊料膏可用来附着焊料珠或形成焊料珠。
焊剂掩模材料5置于柔性薄膜载体的第一主表面上，焊剂掩模层6置于柔性薄膜载体的第二主表面上。如图所示，在第一主表面上相继要被安装的相互邻近的各个微型组件间的区域内是没有焊掩模5的。这样一来，由于薄板上不含焊剂掩模的表面呈凹凸形，因而降低了X、Y和Z三个方向的变形。该凹凸表面相对于柔性薄膜载体中不呈凹凸的刚性变形部分来说能起缓冲作用。然而，这些表面能使柔性薄膜载体有足够的平整度，因此，接着可用助焊剂和焊料珠进行加工。该没有焊料的表面可以只是通过蚀刻方法在材料中刻出的一些槽，例如只需约1/8英寸(0.32厘米)宽，相互间隔不大于约0.1英寸(0.25厘米)。在本发明优选方面中，相继要被安装的、相邻的集成电路芯片间的所有表面没有焊剂掩模。
柔性薄膜载体第二主表面上的焊剂掩模材料6可避免在热熔温度下、当焊料珠9形成时相继被涂布的焊料沿电路线7(见图5)流动。此外，焊剂掩模材料6有助于提高焊接点的强度。根据需要，在柔性薄膜载体的第二主表面上也可存在没有焊剂掩模材料的区域。
焊剂掩模材料应提供一种永久性焊剂掩模，该材料包括光敏丙烯酸酯型和甲基丙烯酸酯型焊剂掩模材料以及环氧基焊剂掩模。焊剂掩模材料可以是液态或干膜。当材料呈液态时，可用喷涂或丝网印刷法将其涂在载体上。一种适用的焊剂掩模实例是DuPont公司提供的Vacrel8120。Vacrel 8120是一种厚约2密耳(0.005厘米)的可光成象的干膜，并且是基于多元醇丙烯酸酯单体、苄基苯酮、乙基-4-二甲氨基苯甲酸酯、N-甲基-2-吡咯烷酮和二氯甲烷制成的丙烯酸酯。其它可商购的适用焊剂掩模是ASM DF，也称为Laminar L-8404；PSR-4000；ASM UV固化的环氧树脂，Grace CM2001(3302型)以及Hysol SR8200。ASM DF是一种厚约2密耳(0.005厘米)光可成象的环氧基干膜。它含环氧树脂、丙二醇甲基醚乙酸酯、填料及有机锑盐。PSR-4000是含二甘醇单乙基乙酸酯的环氧基系统制成的液态光成象焊剂掩模。Grace CM2001(3202型)是一种含环氧树脂、乙二醇单丁醚乙酸酯、丙烯酸酯的低聚物、光引发剂及固化剂的液态丙烯酸酯系统。Hysol SR 8200是一种由环氧树脂和乙二醇单丁醚乙酸酯制成的不透明无光泽的光可成象焊剂掩模。ASM UV固化环氧除含较多稀释剂而成为液态外，其余与ASM DF相似。
对于焊剂掩模材料的热膨胀系数，理想的是尽可能与柔性薄膜载体的热膨胀系数紧密匹配，以使作用于电子封装件上的应力降至最小，特别是在加工期间生产的应力减至最小。此外，焊剂掩模组合物是众所周知的，因此不必作任何详细的说明。本领域技术熟练人员只要了解其应用领域是容易选择适用的焊剂掩模组合物的。
通常，焊剂掩模材料是以层压或刮涂在柔性薄膜载体的两个主表面上的。当用层压法时，如Vacrel，一般是在约90℃的真空条件下层压约60-约90秒，接着，将第一主表面上的焊掩模材料5进行光显影。具体地说，将掩模定位，然后掩模材料在光化光(如紫外光、X-射线或电子束)下曝光，通常是用约150毫焦耳的准直紫外光在约40℃下曝光。随后用溶剂如1％碳酸钠水溶液显影。可采用喷淋压力约50磅/英寸2(344.5千帕)、流量约171米/分的碳酸钠溶液显影。保留的掩模材料如在约150℃后烘烤约1小时，最后如用约2.5焦耳的紫外光固化。在正性光刻胶情况下，经曝光的那些部分在显影时被洗去，而焊料焊盘处的部分被保留下来，这样就在相继要被安装的相邻各个微型组件之间形成了没有焊剂掩模材料的区域。
接着，将具有焊料珠9的各个微型组件2安装到柔性薄膜载体第一主表面上相应的焊料焊盘8上。该焊料珠优选由熔点较低的焊料制成，如63 Sn 37 Pb、60 Sn 40 Pb低共熔点混合物焊料或在美国专利5553769中公开的低熔点焊料，该公开内容已列入本文供参考。通常这种低熔点焊料的熔点为约110°-约120°F(约43℃-约49℃)并含约44.5-44.7％铋、约22.5-22.7％铅、约8.0-约8.3％锡、约5.0-约5.3％镉和约17.5-18.1％铟。为了便于热熔操作，该焊料珠是由熔点较低的材料制成。
各微型组件适当地排列好后，该部件需经焊料热熔工艺处理，为了热熔焊料珠以互连到柔性薄膜载体上的焊料焊盘上，将该部件加热到约200℃至约230℃，一般加热到约220℃持续约3分钟。
在本公开内容中，仅对本发明的优选实施方案作了展示和说明，但是如上所述，本发明能以不同的其它组合形式及在不同的场合中使用，并能在不违背本发明概念(本文所述)的条件下加以变化或更改，这是易于理解的。

Claims (19)

1.一种电子封装件，包含在薄膜载体的两个主表面上有电子电路并在薄膜载体的第一主表面上有许多焊料互连焊盘的柔性薄膜载体；在所述柔性薄膜载体的两主表面上置有焊剂掩模层，条件是在所述第一主表面上相继要被安装的相邻各微型组件间的区域内没有所述焊剂掩模；许多微型组件是安装在所述柔性薄膜载体的第一主表面上的，并由焊珠被成对地配置在所述第一主表面的互连焊盘上而将这些微型组件连接在所述柔性薄膜载体上。
2.权利要求1的电子封装件，其特征在于所述柔性薄膜载体是聚酰亚胺。
3.权利要求1的电子封装件，其特征在于两主表面上的所述焊剂掩模层材料是相同的。
4.权利要求1的电子封装件，其特征在于所述焊剂掩模层是永久性焊剂掩模材料。
5.权利要求1的电子封装件，其特征在于所述焊剂掩模是环氧基、丙烯酸酯或甲基丙烯酸酯基材料。
6.权利要求1的电子封装件，其特征在于所述柔性薄膜载体的第一主表面上的所述焊剂掩模有至少1/8英寸(0.32厘米)宽的槽。
7.权利要求1的电子封装件，其特征在于邻近各个微型组件间的所有区域内是没有所述焊剂掩模的。
8.权利要求1的电子封装件，其特征在于焊珠是易熔的锡/铅。
9.权利要求1的电子封装件，其特征在于在所述第二主表面上微型组件间存在没有所述焊剂掩模的区域。
10.一种制造权利要求1所述电子封装件的方法，包括下列步骤：
a.提供一种在薄膜载体的两主表面上有电子电路并在薄膜载体的第一主表面上有许多焊料互连焊盘的柔性薄膜载体；
b.在所述柔性薄膜载体的两主表面上提供焊剂掩模层，而相继要被安装的相邻各微型组件间区域存在没有所述焊剂掩模的区域；
c.将许多带焊珠的微型组件与所述柔性薄膜载体上的所述第一主表面上对应的焊料互连焊盘对准排列；及
d.借助加热使所述焊料珠热熔，从而将所述微型组件焊接到所述柔性薄膜载体上，从而制得所述电子封装件。
11.权利要求10的方法，其特征在于所述焊剂掩模层是层压在所述柔性薄膜载体上的，在柔性薄膜载体上的第一主表面上的所述焊剂掩模材料经受光学加工以提供没有焊剂掩模的区域。
12.权利要求10的方法，其特征在于所述焊剂掩模材料是刮板涂布在所述柔性薄膜载体两主表面上，对在所述柔性薄膜载体的所述第一主表面上的焊剂掩模进行光学加工以提供没有所述焊剂掩模材料的区域。
13.权利要求10的方法，其特征在于热熔操作是在约200℃至约230℃温度下实施的。
14.权利要求10的方法，其特征在于所述焊剂掩模材料是永久性焊剂掩模材料。
15.权利要求10的方法，其特征在于所述焊剂掩模材料是环氧基、丙烯酸酯或甲基丙烯酸酯基材料。
16.权利要求10的方法，其特征在于所述焊料珠是低熔点的锡/铅易熔材料。
17.权利要求10的方法，其特征在于还包括在焊接许多微型组件前在所述焊料互连焊盘上提供一种助焊材料。
18.权利要求10的方法，其特征在于所述助焊剂材料是松香基材料。
19.权利要求10的方法，其特征在于还包括在所述第二主表面上各个微型组件间形成没有焊剂掩模的区域。
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