TW336340B - Flexible thin film ball grid array containing solder mask - Google Patents
Flexible thin film ball grid array containing solder maskInfo
- Publication number
- TW336340B TW336340B TW086114060A TW86114060A TW336340B TW 336340 B TW336340 B TW 336340B TW 086114060 A TW086114060 A TW 086114060A TW 86114060 A TW86114060 A TW 86114060A TW 336340 B TW336340 B TW 336340B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder mask
- thin film
- grid array
- ball grid
- flexible thin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/828,205 US5818697A (en) | 1997-03-21 | 1997-03-21 | Flexible thin film ball grid array containing solder mask |
Publications (1)
Publication Number | Publication Date |
---|---|
TW336340B true TW336340B (en) | 1998-07-11 |
Family
ID=25251162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086114060A TW336340B (en) | 1997-03-21 | 1997-09-26 | Flexible thin film ball grid array containing solder mask |
Country Status (7)
Country | Link |
---|---|
US (2) | US5818697A (zh) |
JP (1) | JP3224772B2 (zh) |
KR (1) | KR100303408B1 (zh) |
CN (1) | CN1100474C (zh) |
MY (1) | MY118146A (zh) |
SG (1) | SG60206A1 (zh) |
TW (1) | TW336340B (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246548B1 (en) | 1997-03-24 | 2001-06-12 | Maxtor Corporation | Mechanically formed standoffs in a circuit interconnect |
US5962151A (en) * | 1997-12-05 | 1999-10-05 | Delco Electronics Corp. | Method for controlling solderability of a conductor and conductor formed thereby |
US6329605B1 (en) * | 1998-03-26 | 2001-12-11 | Tessera, Inc. | Components with conductive solder mask layers |
JP2000022039A (ja) * | 1998-07-06 | 2000-01-21 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US6194667B1 (en) * | 1998-08-19 | 2001-02-27 | International Business Machines Corporation | Receptor pad structure for chip carriers |
US6122187A (en) | 1998-11-23 | 2000-09-19 | Micron Technology, Inc. | Stacked integrated circuits |
US6861345B2 (en) * | 1999-08-27 | 2005-03-01 | Micron Technology, Inc. | Method of disposing conductive bumps onto a semiconductor device |
US6274474B1 (en) * | 1999-10-25 | 2001-08-14 | International Business Machines Corporation | Method of forming BGA interconnections having mixed solder profiles |
US6448106B1 (en) * | 1999-11-09 | 2002-09-10 | Fujitsu Limited | Modules with pins and methods for making modules with pins |
JP2001210919A (ja) * | 1999-11-17 | 2001-08-03 | Sharp Corp | フレキシブル配線板およびそれを用いた電子機器 |
US6413102B2 (en) * | 1999-12-22 | 2002-07-02 | Micron Technology, Inc. | Center bond flip chip semiconductor carrier and a method of making and using it |
US6573610B1 (en) * | 2000-06-02 | 2003-06-03 | Siliconware Precision Industries Co., Ltd. | Substrate of semiconductor package for flip chip package |
US6828517B2 (en) * | 2001-05-16 | 2004-12-07 | Bourns, Inc. | Position encoder |
AU2002309459A1 (en) * | 2001-06-13 | 2002-12-23 | Advanpack Solutions Pte Ltd | Method for forming a wafer level chip scale package, and package formed thereby |
US6573461B2 (en) * | 2001-09-20 | 2003-06-03 | Dpac Technologies Corp | Retaining ring interconnect used for 3-D stacking |
US6693384B1 (en) * | 2002-02-01 | 2004-02-17 | Alien Technology Corporation | Interconnect structure for electronic devices |
US6599768B1 (en) * | 2002-08-20 | 2003-07-29 | United Epitaxy Co., Ltd. | Surface mounting method for high power light emitting diode |
US20090065936A1 (en) * | 2005-03-16 | 2009-03-12 | Jenny Wai Lian Ong | Substrate, electronic component, electronic configuration and methods of producing the same |
TWI257136B (en) * | 2005-03-16 | 2006-06-21 | Advanced Semiconductor Eng | Method for manufacturing a bump of wafer level package |
US8533936B1 (en) * | 2011-01-26 | 2013-09-17 | Western Digital (Fremont), Llc | Systems and methods for pre-heating adjacent bond pads for soldering |
CN104384647B (zh) * | 2014-10-10 | 2016-06-29 | 中国电子科技集团公司第四十一研究所 | 用于超小肖特基二极管与石英基片薄膜电路吻合焊接方法 |
US10085338B2 (en) | 2015-09-24 | 2018-09-25 | Seagate Technology Llc | Printed circuit board with flux reservoir |
KR102458034B1 (ko) | 2015-10-16 | 2022-10-25 | 삼성전자주식회사 | 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈 |
US20170179069A1 (en) * | 2015-12-18 | 2017-06-22 | Jonathon R. Carstens | Ball grid array solder attachment |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480288A (en) * | 1982-12-27 | 1984-10-30 | International Business Machines Corporation | Multi-layer flexible film module |
US4720324A (en) * | 1985-10-03 | 1988-01-19 | Hayward John S | Process for manufacturing printed circuit boards |
US4615781A (en) * | 1985-10-23 | 1986-10-07 | Gte Products Corporation | Mask assembly having mask stress relieving feature |
US5201451A (en) * | 1987-03-11 | 1993-04-13 | International Business Machines Corp. | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
US5252846A (en) * | 1987-03-13 | 1993-10-12 | Kabushiki Kaisha Toshiba | Semiconductor memory device with an improved erroneous write characteristic and erasure characteristic |
US4965700A (en) * | 1988-05-26 | 1990-10-23 | International Business Machines Corporation | Thin film package for mixed bonding of chips |
KR920006736B1 (ko) * | 1989-11-08 | 1992-08-17 | 삼성전자 주식회사 | 반도체장치 및 그 제조방법 |
US5121299A (en) * | 1989-12-29 | 1992-06-09 | International Business Machines Corporation | Multi-level circuit structure utilizing conductive cores having conductive protrusions and cavities therein |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
US5057969A (en) * | 1990-09-07 | 1991-10-15 | International Business Machines Corporation | Thin film electronic device |
US5103293A (en) * | 1990-12-07 | 1992-04-07 | International Business Machines Corporation | Electronic circuit packages with tear resistant organic cores |
US5203075A (en) * | 1991-08-12 | 1993-04-20 | Inernational Business Machines | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
US5368884A (en) * | 1991-11-06 | 1994-11-29 | Nippon Paint Co., Ltd. | Method of forming solder mask |
US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
US5286991A (en) * | 1992-08-26 | 1994-02-15 | Pioneer Semiconductor Corporation | Capacitor for a BiCMOS device |
JPH07297560A (ja) * | 1994-04-28 | 1995-11-10 | Hitachi Ltd | 多層プリント配線基板およびその実装構造体 |
US5629835A (en) * | 1994-07-19 | 1997-05-13 | Olin Corporation | Metal ball grid array package with improved thermal conductivity |
JPH08192482A (ja) * | 1995-01-13 | 1996-07-30 | Fuji Kiko Denshi Kk | 異種材料積層板およびその製造方法 |
US5593083A (en) * | 1995-02-14 | 1997-01-14 | International Business Machines Corporation | Castellated nozzle and method of use therof |
US5585162A (en) * | 1995-06-16 | 1996-12-17 | Minnesota Mining And Manufacturing Company | Ground plane routing |
US5863812A (en) * | 1996-09-19 | 1999-01-26 | Vlsi Technology, Inc. | Process for manufacturing a multi layer bumped semiconductor device |
US5956605A (en) * | 1996-09-20 | 1999-09-21 | Micron Technology, Inc. | Use of nitrides for flip-chip encapsulation |
US5981314A (en) * | 1996-10-31 | 1999-11-09 | Amkor Technology, Inc. | Near chip size integrated circuit package |
US5938856A (en) * | 1997-06-13 | 1999-08-17 | International Business Machines Corporation | Process of removing flux residue from microelectronic components |
-
1997
- 1997-03-21 US US08/828,205 patent/US5818697A/en not_active Expired - Lifetime
- 1997-09-26 TW TW086114060A patent/TW336340B/zh active
- 1997-12-02 KR KR1019970065340A patent/KR100303408B1/ko not_active IP Right Cessation
-
1998
- 1998-02-20 CN CN98105317A patent/CN1100474C/zh not_active Expired - Fee Related
- 1998-02-23 MY MYPI98000773A patent/MY118146A/en unknown
- 1998-02-26 SG SG1998000429A patent/SG60206A1/en unknown
- 1998-03-19 JP JP06967198A patent/JP3224772B2/ja not_active Expired - Fee Related
- 1998-07-10 US US09/113,573 patent/US6187610B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5818697A (en) | 1998-10-06 |
MY118146A (en) | 2004-09-30 |
SG60206A1 (en) | 1999-02-22 |
JPH10270835A (ja) | 1998-10-09 |
KR19980079504A (ko) | 1998-11-25 |
US6187610B1 (en) | 2001-02-13 |
CN1195263A (zh) | 1998-10-07 |
JP3224772B2 (ja) | 2001-11-05 |
KR100303408B1 (ko) | 2002-04-27 |
CN1100474C (zh) | 2003-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent |