CN110007113B - 测试插座 - Google Patents

测试插座 Download PDF

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Publication number
CN110007113B
CN110007113B CN201811376927.XA CN201811376927A CN110007113B CN 110007113 B CN110007113 B CN 110007113B CN 201811376927 A CN201811376927 A CN 201811376927A CN 110007113 B CN110007113 B CN 110007113B
Authority
CN
China
Prior art keywords
test socket
conductive powder
polymer
conductive
insulator layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811376927.XA
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English (en)
Chinese (zh)
Other versions
CN110007113A (zh
Inventor
龙德中
申东辉
柳基永
李昇东
全镇国
朴成圭
朴瑛植
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Okins Electronics Co Ltd
Original Assignee
SK Hynix Inc
Okins Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SK Hynix Inc, Okins Electronics Co Ltd filed Critical SK Hynix Inc
Publication of CN110007113A publication Critical patent/CN110007113A/zh
Application granted granted Critical
Publication of CN110007113B publication Critical patent/CN110007113B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Connecting Device With Holders (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201811376927.XA 2017-12-29 2018-11-19 测试插座 Active CN110007113B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0184088 2017-12-29
KR1020170184088A KR101967401B1 (ko) 2017-12-29 2017-12-29 테스트 소켓

Publications (2)

Publication Number Publication Date
CN110007113A CN110007113A (zh) 2019-07-12
CN110007113B true CN110007113B (zh) 2021-04-30

Family

ID=66163827

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811376927.XA Active CN110007113B (zh) 2017-12-29 2018-11-19 测试插座

Country Status (2)

Country Link
KR (1) KR101967401B1 (ko)
CN (1) CN110007113B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102664541B1 (ko) * 2021-11-10 2024-05-09 주식회사 티에프이 반도체 소자 테스트용 러버 소켓

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1808125A (zh) * 2004-12-06 2006-07-26 三星电子株式会社 用于测试半导体封装的连接器
CN101237105A (zh) * 2007-02-02 2008-08-06 富士康(昆山)电脑接插件有限公司 测试连接器
CN101344571A (zh) * 2007-07-10 2009-01-14 三星电子株式会社 插座以及使用该插座的测试设备和方法
CN203967308U (zh) * 2013-12-27 2014-11-26 惠州比亚迪电子有限公司 一种usb插座的连接组件
CN104884964A (zh) * 2012-12-28 2015-09-02 株式会社Isc 测试插座及插座构件
KR101588844B1 (ko) * 2014-12-30 2016-01-26 주식회사 아이에스시 코일형 탄소나노튜브를 가지는 검사용 커넥터
CN105452877A (zh) * 2013-07-24 2016-03-30 株式会社Isc 导电连接器及其制造方法
CN105527472A (zh) * 2014-10-17 2016-04-27 株式会社Isc 测试座
KR20160046621A (ko) * 2014-10-21 2016-04-29 삼성전자주식회사 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법
CN205879987U (zh) * 2016-06-28 2017-01-11 宝沃汽车（中国）有限公司 测试连接器工装及其夹具
KR101718865B1 (ko) * 2015-11-26 2017-03-22 (주)티에스이 검사용 소켓
CN107024605A (zh) * 2016-01-29 2017-08-08 泰克元有限公司 测试分选机用插接件
KR101769882B1 (ko) * 2016-02-15 2017-09-05 (주)티에스이 검사용 소켓

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101567296B1 (ko) * 2014-10-30 2015-11-10 주식회사 아이에스시 변색 가능한 테스트 소켓 및 그 제조 방법
KR101667929B1 (ko) * 2015-03-31 2016-10-20 (주)티에스이 실리콘 러버 소켓
KR102329801B1 (ko) * 2015-10-21 2021-11-22 삼성전자주식회사 테스트 소켓의 제조 방법 및 반도체 패키지의 테스트 방법

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1808125A (zh) * 2004-12-06 2006-07-26 三星电子株式会社 用于测试半导体封装的连接器
CN101237105A (zh) * 2007-02-02 2008-08-06 富士康(昆山)电脑接插件有限公司 测试连接器
CN101344571A (zh) * 2007-07-10 2009-01-14 三星电子株式会社 插座以及使用该插座的测试设备和方法
CN104884964A (zh) * 2012-12-28 2015-09-02 株式会社Isc 测试插座及插座构件
CN105452877A (zh) * 2013-07-24 2016-03-30 株式会社Isc 导电连接器及其制造方法
CN203967308U (zh) * 2013-12-27 2014-11-26 惠州比亚迪电子有限公司 一种usb插座的连接组件
CN105527472A (zh) * 2014-10-17 2016-04-27 株式会社Isc 测试座
KR20160046621A (ko) * 2014-10-21 2016-04-29 삼성전자주식회사 반도체 칩 패키지 테스트용 테스트 소켓 및 이의 제조 방법
KR101588844B1 (ko) * 2014-12-30 2016-01-26 주식회사 아이에스시 코일형 탄소나노튜브를 가지는 검사용 커넥터
KR101718865B1 (ko) * 2015-11-26 2017-03-22 (주)티에스이 검사용 소켓
CN107024605A (zh) * 2016-01-29 2017-08-08 泰克元有限公司 测试分选机用插接件
KR101769882B1 (ko) * 2016-02-15 2017-09-05 (주)티에스이 검사용 소켓
CN205879987U (zh) * 2016-06-28 2017-01-11 宝沃汽车（中国）有限公司 测试连接器工装及其夹具

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Publication number Publication date
CN110007113A (zh) 2019-07-12
KR101967401B1 (ko) 2019-04-10

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