CN109922602A - A kind of Anylayer plate Multifunction target mark mistake proofing design method - Google Patents
A kind of Anylayer plate Multifunction target mark mistake proofing design method Download PDFInfo
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- CN109922602A CN109922602A CN201910259313.1A CN201910259313A CN109922602A CN 109922602 A CN109922602 A CN 109922602A CN 201910259313 A CN201910259313 A CN 201910259313A CN 109922602 A CN109922602 A CN 109922602A
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- mistake proofing
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Abstract
The invention discloses a kind of Anylayer plate Multifunction target mark mistake proofing design methods, belong to wiring board manufacture technology field, when technical points include the following steps: that (1) does core material route, Copper treatment is drawn simultaneously respectively in wherein three sides workspace of core plate, only designs the identifiable target of unique one group of X-RAY in copper region respectively respectively drawing；(2) time outer layer plate is pressed；(3) X-RAY practices shooting；(4) laser hole, heavy copper/plating；(5) it is re-started when secondary outer-layer circuit produces by step (1) and draws copper and drawing one group of identifiable target of X-RAY of copper region design, this draws copper region, and with adjacent upper one to draw remaining white space of copper region in addition to target region Chong Die；It is not be overlapped with the region where all targets in front；(6) (2), (3), (4), (5) step are repeated, successively unique target is realized, realizes 100% mistake proofing；The present invention is intended to provide a kind of general Anylayer plate Multifunction target mark mistake proofing design method high in machining efficiency, at low cost and easy to operate；Processing for Anylayer plate.
Description
Technical field
The present invention relates to a kind of wiring board target error-preventing methods, and more specifically more particularly to a kind of Anylayer plate is more
Function target mistake proofing design method.
Background technique
In printed circuit board industry manufacturing process, the production of Anylayer high-order HDI plate is future developing trend, that is, is appointed
Meaning layer interconnection plate production technology always will appear target practice mistake in random layer interconnection plate production technology, leads to manufacturing scrap or returns
Work problem, the measure being usually taken be increase target between target at a distance from, on traveler remarks emphasize target co-ordinates or add
Strong upgrading employee's qualification, though can reduce the probability that malfunctions, cannot 100% mistake proofing, and for each process design specialized
Target is loaded down with trivial details and complicated for operation, and production efficiency reduces, and brings greatly production puzzlement, is that technology generally existing in industry is difficult
Topic.
Summary of the invention
It is an object of the invention in view of the above shortcomings of the prior art, provide a kind of high in machining efficiency, at low cost and grasp
Make the Anylayer plate Multifunction target mark mistake proofing design method of simple universal.
The technical scheme of the present invention is realized as follows: a kind of Anylayer plate Multifunction target mark mistake proofing design method, it should
Method includes the following steps:
(1) when doing core material route, Copper treatment is drawn simultaneously respectively in wherein three sides workspace of core plate, is respectively being drawn
The identifiable target of unique one group of X-RAY is only designed in copper region respectively；
(2) time outer layer plate is pressed；
(3) X-RAY practices shooting；
(4) laser hole, heavy copper/plating；
(5) it is re-started when secondary outer-layer circuit produces by step (1) and draws copper and only design unique one group of X- drawing copper region
The identifiable target of RAY, this is drawn copper region and draws remaining blank area of copper region in addition to target region with adjacent upper one
Domain overlapping；It is not be overlapped with the region where all targets in front；
(6) (2), (3), (4), (5) step are repeated, successively unique target is realized, realizes 100% mistake proofing.
A kind of above-mentioned Anylayer plate Multifunction target mark mistake proofing design method, in step (1), the width for drawing copper region
Degree is target diameter+(0.1~0.5mm), and length is { target diameter+(0.1-0.5mm) } * order.
Above-mentioned a kind of Anylayer plate Multifunction target mark mistake proofing design method, in step (1), in each side workspace
On, the target on core material and the target on other each laminates, in the horizontal direction according to plate where target
Pressing sequence is sequentially arranged at intervals.
A kind of above-mentioned Anylayer plate Multifunction target mark mistake proofing design method, in step (5), positioned at each layer target with
The spacing of the target of adjacent layer in the horizontal direction is 0.1~0.5mm.
A kind of above-mentioned Anylayer plate Multifunction target mark mistake proofing design method, identifiable target described in step (1)
In irregular triangle, it is used as postorder laser hole, mechanical through hole, line pattern and produces positioning reference holes.
The present invention after adopting the above method, compared with prior art, has the advantages that following:
(1) it efficiently solves and is scrapped or heavy industry caused by target practice mistake.
(2) employee is effectively avoided to see that the operational motion of single identification target improves production efficiency.
(3) can do with laser hole positioning, mechanical through hole, laser hole, mechanical through hole location hole is omitted, drastically reduces
X-RAY target practice quantity, shortens the production cycle, reduces production cost.
(4) design target is in sealene triangle, effectively prevents laser hole, mechanical through hole, line pattern production because right
Title causes to identify mistake.
(5) production quality is effectively increased.
(6) stabilization easy to operate does not increase any production cost.
Specific embodiment
The present invention is described in further detail combined with specific embodiments below, but does not constitute to of the invention any
Limitation.
A kind of Anylayer plate Multifunction target mark mistake proofing design method of the invention, which is characterized in that under this method includes
State step:
(1) when doing core material route, Copper treatment is drawn simultaneously respectively in wherein three sides workspace of core plate, is respectively being drawn
The identifiable target of unique one group of X-RAY is only designed in copper region respectively；The width for drawing copper region is target diameter+(0.1
~0.5mm), length is { target diameter+(0.1-0.5mm) } * order.Meanwhile on the workspace of each side, it is located at core material
On target and the target being located on other each laminates, be successively spaced according to the pressing sequence of plate where target in the horizontal direction
Arrangement.The identifiable target is in irregular triangle, is used as postorder laser hole, mechanical through hole, line pattern production
Positioning reference holes.
(2) time outer layer plate is pressed；
(3) X-RAY practices shooting；
(4) laser hole, heavy copper/plating；
(5) it is re-started when secondary outer-layer circuit produces by step (1) and draws copper and only design unique one group of X- drawing copper region
The identifiable target of RAY, this is drawn copper region and draws remaining blank area of copper region in addition to target region with adjacent upper one
Domain overlapping；It is not be overlapped with the region where all targets in front.Positioned at each layer target and adjacent layer target in the horizontal direction
On spacing be 0.1~0.5mm.
(6) (2), (3), (4), (5) step are repeated, successively unique target is realized, realizes 100% mistake proofing.
Embodiment 1
Circuit board completes conventional sawing sheet, by taking 10 layer of 4 rank Anylayer HDI plate as an example, concrete implementation method first
Are as follows:
(1) width 7.5mm, length (7+0.1) * 4=are drawn when core material sandwich circuit respectively on two short sides of plate
28.4mm；The rectangle of 7.5*28.4mm is similarly drawn in long side；
(2) copper rectangle is drawn from a left side to by designing the identifiable first group of target of X-RAY, target in short side, long side respectively
Having a size of 4mm；
(3) after completing pressing, the X-RAY identification unique one group of target of internal layer goes out through-hole, the through-hole that X-RAY is gone out as
Laser hole, mechanical through hole location hole；
(4) first group of targeting regions are spread copper by secondary outer-layer circuit, and in internal layer core layer rectangular region, and first group of distance
Target 0.1mm design second group of target of design, second group of target and first group of target are similar；
(5) repeat the above steps (3) and (4), and X-RAY only has unique one group of target can recognize after every lamination is closed, and reaches and is
The mistake proofing of system property, and can be used for laser hole, mechanical through hole positioning.
Embodiment 2
Circuit board completes conventional sawing sheet, by taking 10 layer of 8 rank Anylayer HDI plate as an example, concrete implementation method first
Are as follows:
(1) width 7.5mm, length (7+0.5) * 8=60mm are drawn when core material sandwich circuit respectively on two short sides of plate；
The rectangle of 7.5*60mm is similarly drawn in long side；
(2) copper rectangle is drawn from a left side to by designing the identifiable first group of target of X-RAY, target in short side, long side respectively
Having a size of 7mm；
(3) after completing pressing, the X-RAY identification unique one group of target of internal layer goes out through-hole, the through-hole that X-RAY is gone out as
Laser hole, mechanical through hole location hole；
(4) first group of targeting regions are spread copper by secondary outer-layer circuit, and in internal layer core layer rectangular region, and first group of distance
Target 0.5mm design second group of target of design, second group of target and first group of target are similar；
(5) repeat the above steps (3) and (4), and X-RAY only has unique one group of target can recognize after every lamination is closed, and reaches and is
The mistake proofing of system property, and can be used for laser hole, mechanical through hole positioning.Reduce Anylayer production process, shorten the production cycle, drops
Low production cost, it is ensured that production quality.
Route board industry hardboard, the production of soft or hard combination Anylayer plate lamination, processing effect are carried out using method of the invention
Rate is high, at low cost, easy to operate general and Multifunction target mark mistake proofing design method, solves human factor X-RAY punching error,
Produce the loaded down with trivial details situation of the not general complexity of target.
Route board industry hardboard, the production of soft or hard combination Anylayer plate lamination, processing effect are carried out using method of the invention
Rate is high, at low cost, easy to operate general and Multifunction target mark mistake proofing design method, solves human factor X-RAY punching error,
Produce the loaded down with trivial details situation of the not general complexity of target.
Embodiment provided above is better embodiment of the invention, only is used to facilitate to illustrate the present invention, not to this hair
It is bright to make any form of restriction, any those of ordinary skill in the art, if not departing from the proposed skill of the present invention
In the range of art feature, using the equivalent embodiment for locally changing or modifying made by disclosed technology contents, and
Without departing from technical feature content of the invention, in the range of still falling within the technology of the present invention feature.
Claims (5)
1. a kind of Anylayer plate Multifunction target mark mistake proofing design method, which is characterized in that this method includes the following steps:
(1) when doing core material route, Copper treatment is drawn simultaneously respectively in wherein three sides workspace of core plate, in each area Tao Tong
The identifiable target of unique one group of X-RAY is only designed in domain respectively；
(2) time outer layer plate is pressed；
(3) X-RAY practices shooting；
(4) laser hole, heavy copper/plating；
(5) secondary outer-layer circuit produce when re-started by step (1) draw copper and draw copper region only design unique one group of X-RAY can
The target of identification, this is drawn copper region and draws remaining the white space weight of copper region in addition to target region with adjacent upper one
It is folded；It is not be overlapped with the region where all targets in front；
(6) (2), (3), (4), (5) step are repeated, successively unique target is realized, realizes 100% mistake proofing.
2. a kind of Anylayer plate Multifunction target mark mistake proofing design method according to claim 1, which is characterized in that step
(1) in, the width for drawing copper region is target diameter+(0.1~0.5mm), and length is { target diameter+(0.1-0.5mm) } *
Order.
3. a kind of Anylayer plate Multifunction target mark mistake proofing design method according to claim 1, which is characterized in that step
(1) in, on the workspace of each side, the target on core material and the target on other each laminates, in level side
It is sequentially arranged at intervals upwards according to the pressing sequence of plate where target.
4. a kind of Anylayer plate Multifunction target mark mistake proofing design method according to claim 1 or 3, which is characterized in that
It is 0.1~0.5mm positioned at the target of each layer and the target spacing in the horizontal direction of adjacent layer in step (5).
5. a kind of Anylayer plate Multifunction target mark mistake proofing design method according to claim 1, which is characterized in that step
(1) identifiable target described in is in irregular triangle, is used as postorder laser hole, mechanical through hole, line pattern production
Positioning reference holes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910259313.1A CN109922602B (en) | 2019-04-02 | 2019-04-02 | Multi-functional target error-proofing design method for Analyyer plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910259313.1A CN109922602B (en) | 2019-04-02 | 2019-04-02 | Multi-functional target error-proofing design method for Analyyer plate |
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| CN109922602A true CN109922602A (en) | 2019-06-21 |
| CN109922602B CN109922602B (en) | 2021-09-14 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103369866A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Method for manufacturing printed circuit board containing blind holes and manufactured printed circuit board |
| CN103415141A (en) * | 2013-08-29 | 2013-11-27 | 东莞市若美电子科技有限公司 | Inner core plate of sandwich plate and lamination error proof method of sandwich plate |
| CN204014257U (en) * | 2014-07-04 | 2014-12-10 | 定颖电子（昆山）有限公司 | Pcb board with Anti-dislocation sign |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
-
2019
- 2019-04-02 CN CN201910259313.1A patent/CN109922602B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2587131Y (en) * | 2002-10-25 | 2003-11-19 | 楠梓电子股份有限公司 | Aligning degree and expansion-contraction degree measuring construction for multiple-layer printed circuit board |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103369866A (en) * | 2012-04-01 | 2013-10-23 | 北大方正集团有限公司 | Method for manufacturing printed circuit board containing blind holes and manufactured printed circuit board |
| CN103415141A (en) * | 2013-08-29 | 2013-11-27 | 东莞市若美电子科技有限公司 | Inner core plate of sandwich plate and lamination error proof method of sandwich plate |
| CN204014257U (en) * | 2014-07-04 | 2014-12-10 | 定颖电子（昆山）有限公司 | Pcb board with Anti-dislocation sign |
| CN105764236A (en) * | 2015-04-29 | 2016-07-13 | 东莞生益电子有限公司 | Processing method of PCB, and PCB |
| CN105376964A (en) * | 2015-12-03 | 2016-03-02 | 中山市惠亚线路版有限公司 | Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
Non-Patent Citations (1)
| Title |
|---|
| 常选委: "Anylayer板靶标创新设计与应用", 《印制电路信息》 * |
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