CN109807481B - Laser processing equipment with straight-through micro-channel heat dissipation device - Google Patents
Laser processing equipment with straight-through micro-channel heat dissipation device Download PDFInfo
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- CN109807481B CN109807481B CN201910254842.2A CN201910254842A CN109807481B CN 109807481 B CN109807481 B CN 109807481B CN 201910254842 A CN201910254842 A CN 201910254842A CN 109807481 B CN109807481 B CN 109807481B
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- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 116
- 238000012545 processing Methods 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 123
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 11
- 238000009434 installation Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000443 aerosol Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention relates to the technical field of laser processing, in particular to laser processing equipment with a through type micro-channel heat dissipation device, which comprises a rack and a laser head arranged on the rack, wherein the laser head is provided with the through type micro-channel heat dissipation device, a semiconductor laser in the laser head is arranged on an upper cover plate of the through type micro-channel heat dissipation device, when the laser head works, a high-temperature area can be formed in the area of the upper cover plate provided with the semiconductor laser, and a liquid guide channel with a through long groove structure in the through type micro-channel heat dissipation device can ensure that enough liquid is reserved in a heat dissipation plate and promote the liquid in a heat dissipation cavity to flow, so that the high-temperature area can be rapidly cooled. The direct-type micro-channel heat dissipation device can stably, reliably, efficiently and quickly reduce the temperature of a high-temperature area, so that the semiconductor laser can stably and reliably work, the reliability of the use performance of the whole laser processing equipment is further ensured, and the laser processing equipment can stably, reliably, rapidly and efficiently process.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to laser processing equipment with a straight-through micro-channel heat dissipation device.
Background
Laser machining is the most common application of laser systems, with laser thermal machining being the most common form of application. Specifically, laser thermal processing refers to processing procedures including laser welding, laser cutting, surface modification, laser marking, laser drilling, micromachining and the like by using a thermal effect generated by projecting a laser beam onto the surface of a material. In laser thermal processing systems, semiconductor lasers are the core components used to generate high intensity laser beams.
In recent years, with the increase of user demands and the further research, the performance of high-power semiconductor lasers is rapidly improved. However, as the power of high power semiconductor lasers increases, the devices generate more and more heat. After the temperature of the semiconductor laser rises sharply, the output wavelength changes, the photoelectric conversion efficiency is reduced, the output power is reduced, and the processing efficiency and the processing precision are affected.
The traditional heat dissipation modes comprise semiconductor refrigeration, heat pipe heat transfer and spray cooling, and the heat dissipation modes can meet the temperature control of the laser, but have limited heat dissipation capacity and can not meet the heat dissipation requirement of the high-power laser.
Disclosure of Invention
The invention aims to provide laser processing equipment with a straight-through micro-channel heat dissipation device, and the laser processing equipment is used for solving the problem that the traditional heat dissipation mode in the prior art cannot meet the heat dissipation requirement of a high-power laser.
In order to achieve the purpose, the invention provides laser processing equipment with a through type micro-channel heat dissipation device, which comprises a rack and a laser head arranged on the rack, wherein the laser head is provided with the through type micro-channel heat dissipation device, the through type micro-channel heat dissipation device comprises a lower bottom plate, a heat dissipation plate and an upper cover plate which are sequentially stacked from bottom to top and have consistent shapes and sizes, a semiconductor laser in the laser head is arranged on the upper cover plate, when the laser head works, a high-temperature area is formed in the area of the upper cover plate, which is provided with the semiconductor laser,
wherein, the upper cover plate is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole and the liquid outlet hole are positioned at the same end of the upper cover plate, the heat dissipation plate is provided with a liquid inlet cavity corresponding to the liquid inlet hole, one end of the heat dissipation plate far away from the liquid inlet cavity is provided with a heat dissipation cavity, one side of the heat dissipation cavity far away from the liquid inlet cavity is provided with a micro-channel, the liquid inlet cavity and the heat dissipation cavity are communicated through a liquid guide channel, the liquid entering the heat dissipation cavity from the liquid guide channel can be vaporized by a high-temperature area on the upper cover plate to form vapor fog,
the liquid guide channel is a straight-through long groove connecting the liquid inlet cavity and the heat dissipation cavity, capillary channels are arranged in the liquid inlet cavity, the liquid guide channel, the heat dissipation cavity and the micro-channel along the length direction of the heat dissipation plate,
the back of heating panel with the corresponding position in heat dissipation chamber is equipped with the backward flow chamber, the microchannel is kept away from the one end in feed liquor chamber be equipped with the backward flow hole of backward flow chamber intercommunication the back of heating panel with the corresponding position in play liquid hole is equipped with backward flow and goes out the liquid hole, backward flow go out the liquid hole with the backward flow chamber passes through the backward flow channel intercommunication.
Optionally, the heat dissipation cavity is in a horn shape facing the microchannel opening, the microchannel is in a chevron shape with a protruding middle portion, and the two opened sides of the heat dissipation cavity and the two protruding sides of the microchannel form a long and narrow drainage channel.
Optionally, the drainage channel is a bell mouth shape opening to the liquid outlet of the drainage channel.
Optionally, the edge of the drainage channel close to the two opened sides of the heat dissipation cavity is provided with a smooth drainage part.
Optionally, the lower base plate, the heat dissipation plate and the upper cover plate are correspondingly provided with mounting holes.
Optionally, be equipped with the spout on the supporting beam of frame both sides, be equipped with on the supporting beam can along the slider that the spout removed, along the length direction of frame, two the slider is connected through the installation crossbeam, be equipped with the installation slider on the installation crossbeam, the laser head is located on the installation slider, the installation slider can be taken the laser head along the length direction of frame slides on the installation crossbeam.
By applying the technical scheme of the invention, the laser processing equipment with the through-type micro-channel heat dissipation device provided by the invention can stably, reliably, efficiently and quickly reduce the temperature of a high-temperature area by arranging the through-type micro-channel heat dissipation device, so that a semiconductor laser can stably and reliably work, the reliability of the service performance of the whole laser processing equipment is further ensured, and the laser processing equipment can stably, reliably, quickly and efficiently process.
Furthermore, the through-type micro-channel heat dissipation device disclosed by the invention has the advantages that the semiconductor laser on the upper cover plate can be well cooled by using a closed micro-channel phase change cooling mode, a good cooling effect is realized, and the through-type micro-channel heat dissipation device has the advantages of high cooling efficiency, good cooling effect and compact structure. Meanwhile, liquid entering the liquid inlet cavity can quickly enter the heat dissipation cavity and the micro-channel through the liquid guide channel in the through long groove structure, so that the liquid entering the heat dissipation cavity and the micro-channel can take away a large amount of heat, and the liquid cooling efficiency is greatly improved.
In order that the foregoing and other objects, features, and advantages of the invention will be readily understood, a preferred embodiment of the invention will be hereinafter described in detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram showing an overall structure of a laser processing apparatus having a through-type microchannel heat sink according to the present invention;
FIG. 2 is a schematic illustration of an exploded view of a through-type microchannel heat sink in a laser processing apparatus having a through-type microchannel heat sink in accordance with the present invention;
FIG. 3 is a schematic diagram showing a front view of a heat sink plate in a through-type micro-channel heat sink of a laser processing apparatus having a through-type micro-channel heat sink according to the present invention;
FIG. 4 is a schematic illustration of a backside view of a heat spreader plate in a through-type micro-channel heat spreader for a laser processing apparatus having a through-type micro-channel heat spreader in accordance with the present invention;
fig. 5 schematically illustrates a cross-sectional view of a through-type microchannel heat sink on a laser processing apparatus having a through-type microchannel heat sink of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure. While the invention will be described in conjunction with the preferred embodiments, it is not intended that features of the invention be limited to these embodiments. On the contrary, the invention is described in connection with the embodiments for the purpose of covering alternatives or modifications that may be extended based on the claims of the present invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be practiced without these particulars. Moreover, some of the specific details have been left out of the description in order to avoid obscuring or obscuring the focus of the present invention.
Referring to fig. 1 to 5, according to an embodiment of the present invention, there is provided a laser processing apparatus 00 with a through-type micro-channel heat sink, including a rack 01 and a laser head 07 arranged on the rack 01, where the laser head 07 is provided with a through-type micro-channel heat sink 08, where a semiconductor laser 6 in the laser head 07 is arranged on an upper cover plate 5 of the through-type micro-channel heat sink 08, and when the laser head 07 is in operation, a high temperature region 51 is formed in a region of the upper cover plate 5 where the semiconductor laser 6 is arranged. The high-temperature region 51 can be stably, reliably, efficiently and quickly reduced by arranging the through-type micro-channel heat dissipation device 08, so that the semiconductor laser 6 can stably and reliably work.
Specifically, referring to fig. 2 and fig. 1, in this embodiment, the through-type microchannel heat dissipation device includes a lower bottom plate 1, a heat dissipation plate 2, and an upper cover plate 3 that are sequentially stacked from bottom to top and have the same shape and size, the upper cover plate 3 is provided with a liquid inlet hole 30 and a liquid outlet hole 31, the liquid inlet hole 30 and the liquid outlet hole 31 are located at the same end of the upper cover plate 3, the heat dissipation plate 2 is provided with a liquid inlet cavity 20 corresponding to the liquid inlet hole 30, along a length direction V of the heat dissipation plate 2, one end of the heat dissipation plate 2 away from the liquid inlet cavity 20 is provided with a heat dissipation cavity 23, one side of the heat dissipation cavity 23 away from the liquid inlet cavity 20 is provided with a microchannel 24, the liquid inlet cavity 20 and the heat dissipation cavity 23 are communicated with each other through a liquid guide channel 22, and liquid entering the heat dissipation cavity 23 from the liquid guide channel 22 can be vaporized by a high temperature region 32 on the upper cover plate 3, forming a vapor mist.
That is, the liquid inlet hole 30, the liquid inlet chamber 20, the liquid guiding channel 22, the heat dissipation chamber 23 and the micro-channel 24 together form a liquid channel (as shown by the solid arrows in fig. 3 and 5), and the liquid entering the liquid guiding channel 22 from the liquid inlet hole 30 through the liquid inlet chamber 20 enters the micro-channel 24 through the heat dissipation chamber 23 under the pressure of the liquid inlet hole 30, and is partially or completely vaporized by the high temperature region 32 on the upper cover plate 3 in the heat dissipation chamber 23 and the micro-channel 24 to form the vapor fog. The liquid is vaporized into a gaseous state from a liquid state in the process of forming the aerosol, and a large amount of heat can be absorbed in the phase change process, so that the temperature of the high-temperature area 32 on the upper cover plate 3 is reduced, and the cooling effect can be well realized. Meanwhile, liquid entering the liquid inlet hole 30 can enter the heat dissipation cavity 23 and the micro-channel 23 through the liquid inlet cavity 20 and the liquid guide channel 22, and a large amount of heat can be taken away by the liquid entering the heat dissipation cavity 23 and the micro-channel 24, so that the liquid cooling efficiency is greatly improved.
The larger the area of the microchannels 24, the more heat is removed by vaporization. Therefore, in practical applications, the area of the microchannel 24 and the amount of liquid in the microchannel 24 should be increased as much as possible. In this embodiment, the micro-channel 24 in the heat dissipation chamber 23 is composed of a number of elongated slots. In other embodiments, the microchannels may also be formed by curved capillaries and/or curved slots.
In addition, in order to further increase the area of the liquid that can be vaporized and increase the flow rate of the liquid, referring to fig. 2-3, in this embodiment, capillary channels 220 are provided in the liquid inlet chamber 20, the liquid guide channel 22, the heat dissipation chamber 23 and the micro channel 24 along the length direction V of the heat dissipation plate 2. The capillary passage 220 can rapidly guide the liquid in the liquid inlet cavity 20 into the heat dissipation cavity 23 through the capillary phenomenon, and meanwhile, the dispersion area of the liquid can be increased, and the heat dissipation capacity of the heat dissipation cavity 23 is improved.
In order to ensure that enough liquid is retained in the heat dissipation plate and to promote the flow of the liquid in the heat dissipation chamber, referring to fig. 1-2, in this embodiment, the liquid guiding channel 22 is a straight-through elongated slot connecting the liquid inlet chamber 20 and the heat dissipation chamber 23, and the straight-through elongated slot can enable the liquid entering the liquid inlet chamber 20 to flow into the heat dissipation chamber 23 quickly, so that a large amount of liquid can be injected into the heat dissipation chamber 23, the flow of the liquid in the heat dissipation chamber 23 is promoted, and a large amount of heat can be taken away through the flow of the liquid.
In this embodiment, install semiconductor laser 4 on the upper cover plate 3, when semiconductor laser 4 worked, can produce a large amount of heats for form high temperature area 32 on the upper cover plate 3, high temperature area 32 can make the liquid vaporization that gets into in heat dissipation chamber 23 and the microchannel 24, and the vaporization process can absorb a large amount of heats, and then can make the temperature of semiconductor laser 4 descend, ensures that semiconductor laser 4 can reliable and stable work.
It should be noted that, the invention does not limit the specific type of the liquid and the specific material of the heat dissipation plate, and can be reasonably selected according to the actual needs. In this embodiment, the liquid is ethanol, and the heat dissipation plate 2 is formed by processing red copper, wherein the ethanol is beneficial to vaporization, and the red copper is beneficial to heat dissipation and is convenient to process. In other embodiments, the liquid may also be methanol or distilled water, and the heat dissipation plate may also be made of other materials, which is not limited in the present invention.
Further, as shown in fig. 2-5, in the present invention, a backflow cavity 25 is disposed at a position corresponding to the heat dissipation cavity 23 on the back surface of the heat dissipation plate 2, a backflow hole 240 communicated with the backflow cavity 25 is disposed at one end of the micro channel 24 away from the liquid inlet cavity 20, a backflow liquid outlet hole 21 is disposed at a position corresponding to the liquid outlet hole 31 on the back surface of the heat dissipation plate 2, and the backflow liquid outlet hole 21 and the backflow cavity 25 are communicated through a backflow channel 26.
That is, the return holes 240, the return cavity 25, the return channels 26, the return exit holes 21 and the exit holes 31 collectively form a return path (as indicated by the arrangement of the dashed arrows and the realized arrows in fig. 5). The liquid entering the heat dissipation cavity 23 and the micro-channel 24 is partially or completely vaporized by the high temperature area 51 on the upper cover plate 5 to form a large amount of vapor fog, the vapor fog and the liquid which is not vaporized are discharged through the flow-back hole 240, the flow-back cavity 25, the flow-back channel 26, the flow-back liquid outlet hole 21 and the liquid outlet hole 31 in sequence, and simultaneously, a large amount of heat is taken away, so that the temperature of the high temperature area 32 on the upper cover plate 3 is greatly reduced, and a good cooling effect is realized.
In addition, for better heat dissipation and better liquid flow, referring to fig. 2 to 5, in the present invention, the heat dissipation chamber 23 is in a bell mouth shape opened toward the microchannel 24, the microchannel 24 is in a mountain shape with a protruded middle portion, and both sides of the heat dissipation chamber 23 opened and both sides of the microchannel 24 protruded form an elongated flow guiding channel 230. The drainage channel 230 is a bell-mouth shape opened toward the liquid outflow portion of the drainage channel 22. The edges of the drainage channel 230 close to the two opened sides of the heat dissipation cavity 23 are provided with smooth drainage parts 231.
Specifically, referring to fig. 3, in the present embodiment, the heat dissipation chamber 23 is in a bell mouth shape, and the liquid entering the heat dissipation chamber 23 through the liquid guiding channel 22 can rapidly enter the micro channel 24, so as to increase the dispersion area of the liquid, that is, the area of the heat dissipation liquid in the heat dissipation chamber 23. Meanwhile, the long and narrow drainage channel 230 is arranged to be in a horn mouth shape which is opened towards the liquid outflow part of the drainage channel 22, the smooth drainage part 231 is arranged at the edge of the drainage channel 230, which is close to the opening two sides of the heat dissipation cavity 23, the side flow resistance of the capillary channel 220 to liquid is reduced, the flow speed of the liquid flowing into the micro channels 24 at the two sides is faster, the liquid flowing into the heat dissipation cavity 23 can flow into each micro channel 24 at the same time, and the heat dissipation effect is better realized. The liquid flow rate entering the micro-channel 24 is increased, the area of the liquid is increased, the heat dissipation capacity of the heat dissipation cavity 23 can be further improved, and a better heat dissipation effect is achieved.
Further, in order to facilitate the installation and to enable the lower base plate, the heat dissipation plate and the upper cover plate to be reliably sealed and tightly connected, referring to fig. 2-5, in the present invention, the lower base plate 1, the heat dissipation plate 2 and the upper cover plate 3 are correspondingly provided with mounting holes 11, and when the installation is performed, fastening bolts can be applied to penetrate through the mounting holes 11, so that the lower base plate 1, the heat dissipation plate 2 and the upper cover plate 3 are tightly connected together.
Further, referring to fig. 1, in this embodiment, a sliding groove 03 is provided on a supporting beam 02 on two sides of the rack 01, the sliding groove 03 is provided along a width direction X of the rack 01, a sliding block 04 capable of moving along the sliding groove 03 is provided on the supporting beam 02, along a length direction Y of the rack 01, the two sliding blocks 04 are connected through a mounting beam 05, a mounting sliding block 06 is provided on the mounting beam 05, the laser head 07 is provided on the mounting sliding block 06, and the mounting sliding block 06 can drive the laser head 07 to slide on the mounting beam 13 along the length direction Y of the rack 01. By combining the slide block 04 capable of moving along the width direction X of the machine frame 01 and the mounting slide block 06 capable of moving along the length direction Y of the machine frame 01, the laser head 07 can be moved to any position of a processing plane, and the processing and the use of the equipment are facilitated.
It should be noted that the present invention does not limit the specific type of the laser processing device, and may be a laser cutting device, a laser welding device, or a laser engraving device, and may be specifically applied according to actual production needs.
According to the embodiments, the laser processing equipment with the through-type micro-channel heat dissipation device provided by the invention can stably, reliably, efficiently and quickly reduce the temperature of a high-temperature area by arranging the through-type micro-channel heat dissipation device, so that a semiconductor laser can stably and reliably work, the reliability of the use performance of the whole laser processing equipment is further ensured, and the laser processing equipment can stably, reliably, rapidly and efficiently process.
Furthermore, the through-type micro-channel heat dissipation device disclosed by the invention has the advantages that the semiconductor laser on the upper cover plate can be well cooled by using a closed micro-channel phase change cooling mode, a good cooling effect is realized, and the through-type micro-channel heat dissipation device has the advantages of high cooling efficiency, good cooling effect and compact structure. Meanwhile, liquid entering the liquid inlet cavity can quickly enter the heat dissipation cavity and the micro-channel through the liquid guide channel in the through long groove structure, so that the liquid entering the heat dissipation cavity and the micro-channel can take away a large amount of heat, and the liquid cooling efficiency is greatly improved.
In summary, the above-mentioned embodiments are provided only for illustrating the principles and effects of the present invention, and not for limiting the present invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (6)
1. A laser processing device with a direct type microchannel heat dissipation device comprises a rack and a laser head arranged on the rack, and is characterized in that the laser head is provided with the direct type microchannel heat dissipation device, the direct type microchannel heat dissipation device comprises a lower base plate, a heat dissipation plate and an upper cover plate which are sequentially stacked from bottom to top and have consistent shapes and sizes, a semiconductor laser in the laser head is arranged on the upper cover plate, when the laser head works, a high-temperature area can be formed in the area on the upper cover plate provided with the semiconductor laser,
wherein, the upper cover plate is provided with a liquid inlet hole and a liquid outlet hole, the liquid inlet hole and the liquid outlet hole are positioned at the same end of the upper cover plate, the heat dissipation plate is provided with a liquid inlet cavity corresponding to the liquid inlet hole, one end of the heat dissipation plate far away from the liquid inlet cavity is provided with a heat dissipation cavity, one side of the heat dissipation cavity far away from the liquid inlet cavity is provided with a micro-channel, the liquid inlet cavity and the heat dissipation cavity are communicated through a liquid guide channel, the liquid entering the heat dissipation cavity from the liquid guide channel can be vaporized by a high-temperature area on the upper cover plate to form vapor fog,
the liquid guide channel is a straight-through long groove connecting the liquid inlet cavity and the heat dissipation cavity, capillary channels are arranged in the liquid inlet cavity, the liquid guide channel, the heat dissipation cavity and the micro-channel along the length direction of the heat dissipation plate,
the back of heating panel with the corresponding position in heat dissipation chamber is equipped with the backward flow chamber, the microchannel is kept away from the one end in feed liquor chamber be equipped with the backward flow hole of backward flow chamber intercommunication the back of heating panel with the corresponding position in play liquid hole is equipped with backward flow and goes out the liquid hole, backward flow go out the liquid hole with the backward flow chamber passes through the backward flow channel intercommunication.
2. The laser processing apparatus with a through-type microchannel heat sink according to claim 1, wherein the heat dissipation chamber is in a bell mouth shape opened toward the microchannel, the microchannel is in a chevron shape with a protruded middle portion, and both sides of the heat dissipation chamber opened and both sides of the microchannel protruded form an elongated flow guiding channel.
3. The laser machining apparatus with a through-type microchannel heat sink of claim 2, wherein the flow-directing channel is of a bell mouth shape open to a liquid outflow of the flow-directing channel.
4. The laser processing apparatus with a through-type microchannel heat sink of claim 2, wherein the flow-directing channel is provided with a smooth flow-directing portion near the edges of the two sides of the opening of the heat-dissipating cavity.
5. The laser processing apparatus with a through-type micro-channel heat sink of claim 1, wherein the lower base plate, the heat sink plate and the upper cover plate are correspondingly provided with mounting holes.
6. The laser processing apparatus with the through-type microchannel heat sink of claim 1, wherein the supporting beam on both sides of the rack has a sliding groove, the supporting beam has a sliding block capable of moving along the sliding groove, along the length direction of the rack, the two sliding blocks are connected by a mounting beam, the mounting beam has a mounting sliding block, the laser head is disposed on the mounting sliding block, and the mounting sliding block can drive the laser head to slide on the mounting beam along the length direction of the rack.
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| CN201910254842.2A CN109807481B (en) | 2019-04-01 | 2019-04-01 | Laser processing equipment with straight-through micro-channel heat dissipation device |
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| CN201910254842.2A CN109807481B (en) | 2019-04-01 | 2019-04-01 | Laser processing equipment with straight-through micro-channel heat dissipation device |
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| CN100370659C (en) * | 2005-04-18 | 2008-02-20 | 中国科学院长春光学精密机械与物理研究所 | Micro-channel heat sink structure for semiconductor laser head pumping source and preparing method thereof |
| US7424042B2 (en) * | 2006-09-22 | 2008-09-09 | Daylight Solutions, Inc. | Extended tuning in external cavity quantum cascade lasers |
| JP2008300596A (en) * | 2007-05-31 | 2008-12-11 | Sony Corp | Heat sink and semiconductor laser device |
| CN201402913Y (en) * | 2009-01-23 | 2010-02-10 | 北京工业大学 | Micro-channel heat sink of semiconductor laser |
| CN201682169U (en) * | 2009-11-11 | 2010-12-22 | 中国科学院理化技术研究所 | Micro-channel flow boiling heat sink for cooling high power solid laser |
| US8770823B2 (en) * | 2011-01-29 | 2014-07-08 | Gerald Ho Kim | Silicon-based cooling package for light-emitting devices |
| US8710526B2 (en) * | 2011-08-30 | 2014-04-29 | Abl Ip Holding Llc | Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism |
| CN102620590B (en) * | 2012-03-30 | 2014-02-12 | 中国科学院工程热物理研究所 | Micro-channel heat sink and performance testing device thereof |
| US8804782B2 (en) * | 2012-10-29 | 2014-08-12 | Coherent, Inc. | Macro-channel water-cooled heat-sink for diode-laser bars |
| CN104051952B (en) * | 2014-07-04 | 2017-06-16 | 成都三鼎日新激光科技有限公司 | A kind of interior microchannel cooling heat sink |
| CN206116864U (en) * | 2016-09-30 | 2017-04-19 | 西安炬光科技股份有限公司 | Microchannel liquid refrigeration piece |
| CN107565376A (en) * | 2017-10-13 | 2018-01-09 | 西安炬光科技股份有限公司 | A kind of heat sink insulated type capsulation structure for semiconductor laser and folded battle array |
| CN109038210A (en) * | 2018-08-13 | 2018-12-18 | 西安炬光科技股份有限公司 | A kind of novel liquid chiller and capsulation structure for semiconductor laser |
| CN109149325B (en) * | 2018-09-21 | 2019-11-22 | 清华大学 | A kind of mixed structure micro-channel heat sink |
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