CN201402913Y - Micro-channel heat sink of semiconductor laser - Google Patents
Micro-channel heat sink of semiconductor laser Download PDFInfo
- Publication number
- CN201402913Y CN201402913Y CN2009201051880U CN200920105188U CN201402913Y CN 201402913 Y CN201402913 Y CN 201402913Y CN 2009201051880 U CN2009201051880 U CN 2009201051880U CN 200920105188 U CN200920105188 U CN 200920105188U CN 201402913 Y CN201402913 Y CN 201402913Y
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- inlet opening
- heat sink
- cover plate
- channel heat
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Abstract
The utility model relates to a micro-channel heat sink of a semiconductor laser, which belongs to the semiconductor optic electronic technical field and comprises a cover plate (1), a water divertingbase (2) and a base plate (3) which are sequentially fixedly connected from top to bottom. A first water inlet (4) is arranged on the cover plate (1), micro-channel walls (5) are arranged on a lower surface of the cover plate (1), and a micro-channel used for cooling water to flow through is arranged between the adjacent micro-channel walls (5). The micro-channel heat sink has the advantages of lowering manufacturing difficulty and cost, raising mechanical strength by employing a three-layer component structure to replace an existing five-layer structure, and enhancing overall heat dissipationperformance by changing the height of the micro-channel walls. Moreover, the micro-channel heat sink adopting the structure is adaptable to preparation of any current semiconductor laser array and stack array.
Description
Technical field
The utility model relates to a kind of semiconductor laser micro-channel heat sink structure, belongs to field of semiconductor photoelectron technique.
Background technology
At present, the high-power semiconductor laser micro-channel heat sink generally adopts five layers of high heat conduction rectangular-shaped sheet of material with different inner engraved structures to combine the structure that constitutes little logical heat sink road.Accurate processing utilizes solder technology accurately to be closely linked to this structural requirement then to five floor height heat conduction rectangular-shaped sheet of material respectively.This structure has been introduced additional thermal resistance because microchannel sidewall (radiated rib) and microchannel roof (hot carrier layer) combine by solder technology, increases the overall thermal resistance of structure greatly; There are four interfaces to relate to welding process in the assembling process of total, make and weld the difficulty height; The micro-channel heat sink assembly is slab construction, lead that whole microchannel wall height remains unchanged in the district of microchannel, be unfavorable for that structure optimization and saving space and overall mechanical strength are poor, cause the microchannel decreased performance to increase the difficulty and the cost of manufacture of the assembling of high-power semiconductor laser micro-channel heat sink simultaneously.
The utility model content
In order to solve in the background technology since microchannel sidewall (radiated rib) and microchannel roof (hot carrier layer) by the solder technology introducing additional thermal resistance that combines, whole micro-channel heat sink is made more than the weld interface and microchannel assembly all is poor performance that slab construction causes, bad mechanical strength, manufacture difficulty is big, the problem that cost is high, the utility model provides a kind of novel micro-channel heat sink for semi-conductor laser, this micro-channel heat sink has not only reduced high-power semiconductor laser microchannel manufacture difficulty and cost of manufacture, has also improved the overall performance and the mechanical strength of device simultaneously.
To achieve these goals, the utility model has been taked following technical scheme.
Micro-channel heat sink for semi-conductor laser in the utility model comprises the cover plate, separating stand and the base plate that are connected successively from top to bottom.Cover plate is provided with first inlet opening, and the cover plate lower surface is provided with microchannel wall, is to be used for the microchannel that cooling water flows through between the adjacent microchannel wall;
Described separating stand comprises second inlet opening, first apopore and shunting layer, and shunting layer is divided into two parts up and down with separating stand, and top is divided into the district that becomes a mandarin, and the bottom is divided into the recirculating zone, and become a mandarin district and recirculating zone are connected by the break over region; The district that becomes a mandarin is an open spaces, is connected with second inlet opening, and the shape of microchannel wall adapts in shape and the cover plate in the district that becomes a mandarin, microchannel wall become a mandarin distinguish in, seal between cover plate and the separating stand; The recirculating zone is an open spaces and is connected with first apopore;
Described base plate is provided with the 3rd inlet opening and second apopore, and the 3rd inlet opening, second inlet opening and first inlet opening are connected, and second apopore is connected with first apopore; Seal between described base plate and the separating stand.
Described microchannel wall away from the height h1 of first inlet opening, one side greater than height h2 near first inlet opening, one side.
Described microchannel wall by height h1 along straight line or curvilinear motion to height h2.
Described curve is a parabola.
The utility model is compared with traditional structure and manufacture method and had the following advantages: 1) microchannel wall is that radiated rib and microchannel roof are that cover plate is integrated, avoid the additional thermal resistance of introducing when hierarchy connects in the background technology, improved device integral heat sink ability; 2) the utility model is made of three part assemblies, with five assemblies and more many interfaces of labyrinth compare, reduced connection difficulty and processing cost, also increased integrally-built mechanical strength simultaneously; 3) microchannel wall has changed the wall height of diverse location in the utility model according to the thermal source characteristics, background structure middle plateform assembly microchannel wall is subjected to flat component thickness to determine unalterable situation relatively, it is heat sink to be more conducive to optimize the acquisition high-performance, more saves the space simultaneously.
Description of drawings
Fig. 1 is a cover plate vertical view of the present utility model
Fig. 2 is the front view of Fig. 1
Fig. 3 is the vertical view of separating stand of the present utility model
Fig. 4 is the upward view of Fig. 3
Fig. 5 is the front view of Fig. 3
Fig. 6 is the base plate vertical view in the utility model
Fig. 7 is the front view of Fig. 6
Fig. 8 is an overall structure vertical view of the present utility model
Fig. 9 is the upward view of Fig. 8
Figure 10 is the front view of Fig. 8
Embodiment
Describe the utility model in detail below in conjunction with the drawings and specific embodiments, but the utility model is not limited to these embodiment:
The structure of present embodiment such as Fig. 8, Fig. 9 and shown in Figure 10 comprise cover plate 1, separating stand 2 and base plate 3, and cover plate 1 is positioned at the top of separating stand 2, is connected between the two.Base plate 3 is positioned at the below of separating stand 2, also is connected between the two.
The structure of cover plate 1 as shown in Figure 1 and Figure 2, cover plate 1 is kept right and is provided with first inlet opening 4, keep left at the lower surface of cover plate 1 and to be provided with microchannel wall 5, between two adjacent microchannel wall 5 for to be used for the microchannel that cooling water flows through, and microchannel wall 5 away from the height h1 of first inlet opening, 4 one sides greater than height h2 near first inlet opening, 4 one sides.Microchannel wall 5 by height h1 along straight line or curvilinear motion to height h2.Curve can be various parabolas.Microchannel wall 5 is an integral structure with cover plate 1, has reduced weld interface one, has also reduced thermal resistance simultaneously.
The structure of separating stand 2 such as Fig. 3, Fig. 4 and shown in Figure 5 comprise second inlet opening 6, first apopore 7, first location hole 8 and shunting layer 14, the first inlet openings 4 and second inlet opening, 6 equal diameters.Shunting layer 14 is located at separating stand 2 part that keeps left, and separating stand 2 is divided into two parts up and down, and top is divided into the district 9 that becomes a mandarin, and the bottom is divided into recirculating zone 12, and become a mandarin district 9 and recirculating zone 12 are connected by break over region 10.Becoming a mandarin and distinguishing 9 is an open spaces, is connected with second inlet opening 6, and the shape of microchannel wall 5 adapts in the shape in the district 9 that becomes a mandarin and the cover plate, and when the two connected, microchannel wall 5 was arranged in the district that becomes a mandarin.The bottom is divided into recirculating zone 12, and recirculating zone 6 is an open spaces also, is connected with first apopore 7, is fixed with base plate in the bottom of recirculating zone open spaces, forms the passage that cooling water flow out of.When cover plate 1 is connected with separating stand 2, first inlet opening 4 is accurately aimed at the external diameter of second inlet opening 6, like this, microchannel wall 5 is located in the district 9 that becomes a mandarin, and connects platform 11 sealings by first between the two, forms the passage of flow of cooling water.
The structure of base plate 3 such as Fig. 6, shown in Figure 7 which is provided with the 3rd inlet opening 15, second apopore 16 and second location hole 17.The 3rd inlet opening 15 and second inlet opening 6, second location hole 17 equate respectively with first apopore, 7 diameters with first location hole 8 and second apopore 16 on the separating stand.When base plate 3 was connected with separating stand 2, the 3rd inlet opening 15 was accurately aimed at second inlet opening, 6 external diameters, and first location hole 8 is accurately aimed at second location hole, 17 external diameters, and first apopore 7 is accurately aimed at second apopore, 16 external diameters.Connect platform 13 sealings at the position that base plate 3 is connected with separating stand 2 by second, form the exhalant canal of cooling water.
Present embodiment cover plate 1, base plate 3 all adopt oxygen-free copper or CuW alloy or surface metalation BeO etc., and separating stand 2 adopts the surface metalation plastics.Cover plate 1 is connected platform 11 and base plate 3 and is connected platform 13 connected modes employing conductive adhesive or welding with second with first.
During the utility model work: cooling water is entered by the inlet opening that first inlet opening 4, second inlet opening 6 and the 3rd inlet opening 15 constitute jointly, flow into the district 9 that becomes a mandarin on the separating stand 2 earlier, flow into recirculating zone 12 through the break over region on the separating stand 2 10 after flowing into the microchannel on the cover plate 1 again, flow out through first apopore 7 and second apopore, the 16 common apopores that constitute at last.
Claims (4)
1, a kind of micro-channel heat sink for semi-conductor laser is characterized in that: comprise the cover plate (1), separating stand (2) and the base plate (3) that are connected successively from top to bottom; Cover plate (1) is provided with first inlet opening (4), and cover plate (1) lower surface is provided with microchannel wall (5), is to be used for the microchannel that cooling water flows through between the adjacent microchannel wall (5);
Described separating stand (2) comprises second inlet opening (6), first apopore (7) and shunting layer (14), shunting layer (14) is divided into two parts up and down with separating stand (2), top is divided into the district (9) that becomes a mandarin, the bottom is divided into recirculating zone (12), and become a mandarin district (9) and recirculating zone (12) are connected by break over region (10); The district (9) that becomes a mandarin is an open spaces, is connected with second inlet opening (6), and the shape of microchannel wall (5) adapts in the shape in the district (9) that becomes a mandarin and the cover plate, microchannel wall (5) in the district (9) that becomes a mandarin, sealing between cover plate (1) and the separating stand (2); Recirculating zone (12) is an open spaces and is connected with first apopore (7);
Described base plate (3) is provided with the 3rd inlet opening (15) and second apopore (16), and the 3rd inlet opening (15), second inlet opening (6) and first inlet opening (4) are connected, and second apopore (16) is connected with first apopore (7); Sealing between described base plate (3) and the separating stand (2).
2, a kind of micro-channel heat sink for semi-conductor laser according to claim 1 is characterized in that: described microchannel wall away from the height h1 of first inlet opening (4) one sides greater than height h2 near first inlet opening (4) one sides.
3, a kind of micro-channel heat sink for semi-conductor laser according to claim 2 is characterized in that: described microchannel wall (5) by height h1 along straight line or curvilinear motion to height h2.
4, a kind of micro-channel heat sink for semi-conductor laser according to claim 3 is characterized in that: described curve is a parabola.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201051880U CN201402913Y (en) | 2009-01-23 | 2009-01-23 | Micro-channel heat sink of semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201051880U CN201402913Y (en) | 2009-01-23 | 2009-01-23 | Micro-channel heat sink of semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201402913Y true CN201402913Y (en) | 2010-02-10 |
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ID=41662712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201051880U Expired - Lifetime CN201402913Y (en) | 2009-01-23 | 2009-01-23 | Micro-channel heat sink of semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201402913Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN109807481A (en) * | 2019-04-01 | 2019-05-28 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with through type microchannel heat sink |
-
2009
- 2009-01-23 CN CN2009201051880U patent/CN201402913Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109794698A (en) * | 2019-04-01 | 2019-05-24 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with microchannel heat sink |
| CN109807481A (en) * | 2019-04-01 | 2019-05-28 | 苏州匠恒智造科技有限公司 | A kind of laser process equipment with through type microchannel heat sink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANXI FEIHONG LASER TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: BEIJING INDUSTRY UNIVERSITY Effective date: 20110310 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100124 NO. 100, PINGLEYUAN, CHAOYANG DISTRICT, BEIJING TO: 041600 YANBI VILLAGE, GANTING TOWN, HONGDONG COUNTY, SHANXI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110310 Address after: 041600 Shanxi Ganting town of Hongdong County, Yan Village Patentee after: Shanxi Feihong Laser Technology Co., Ltd. Address before: 100124 Chaoyang District, Beijing Ping Park, No. 100 Patentee before: Beijing University of Technology |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100210 |
|
| CX01 | Expiry of patent term |