CN211230611U - Chip, chip assembly, core and multistage intercooler - Google Patents
Chip, chip assembly, core and multistage intercooler Download PDFInfo
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- CN211230611U CN211230611U CN201922498848.2U CN201922498848U CN211230611U CN 211230611 U CN211230611 U CN 211230611U CN 201922498848 U CN201922498848 U CN 201922498848U CN 211230611 U CN211230611 U CN 211230611U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
Abstract
The utility model relates to a heat exchange device technical field especially relates to a chip, chip subassembly, core and multistage intercooler, the chip has first runner and the second runner that distributes in the first direction and extend in the second direction in the first direction first runner with be formed with between the second runner and be used for the thermal-insulated portion of thermal-insulated first runner with the second runner, first direction with the second direction is perpendicular. The problem that strong heat exchange is easily produced between the cooling liquid in different cooling liquid flow channels in the current multi-stage intercooler can be solved.
Description
Technical Field
The utility model relates to a heat exchange device technical field especially relates to a chip, chip subassembly, core and multistage intercooler.
Background
At present, a multi-stage intercooler usually sets different high-temperature coolant flow channels and low-temperature coolant flow channels on the same chip, and because the temperature of the coolant flowing in each coolant flow channel is different, the coolant can conduct heat through the chip to generate strong heat exchange, so that the low-temperature coolant absorbs more heat, and finally a larger low-temperature radiator has to be adopted to radiate the low-temperature coolant.
SUMMERY OF THE UTILITY MODEL
The purpose of the disclosure includes that aiming at the problem that strong heat exchange is easily generated among cooling liquids in different flow channels in the conventional multi-stage intercooler, a chip assembly, a core body and the multi-stage intercooler are provided.
In order to achieve the purpose, the following technical scheme is adopted in the disclosure:
one aspect of the present disclosure provides a chip having a first flow channel and a second flow channel distributed in a first direction and extending in a second direction;
a heat insulating portion for thermally insulating the first flow path and the second flow path is formed between the first flow path and the second flow path in the first direction, and the first direction is perpendicular to the second direction.
Optionally, the thermal insulation portion is a through hole.
The technical scheme has the beneficial effects that: the first flow channel is separated from the second flow channel through the through hole, so that heat exchange between the first flow channel and the second flow channel through the material of the chip is reduced as much as possible, and the degree of heat exchange is further reduced.
Optionally, the thermal insulation portion is a bar-shaped hole extending in the second direction.
The technical scheme has the beneficial effects that: this can reduce the size of the heat insulating portion in the first direction as much as possible, and on the premise that the heat insulating portion has a good heat insulating effect, the increase in the width of the chip due to the heat insulating portion is reduced, so that the chip and the core body formed by the chip can maintain a small body size.
Optionally, there is one of the thermal insulation portions.
Optionally, there are at least two of the thermal insulation portions, each of the thermal insulation portions being distributed in the second direction.
The technical scheme has the beneficial effects that: thus, partial chip materials can be reserved between two adjacent heat insulation parts, the chips can still keep better integrity and strength after the heat insulation parts are additionally arranged, and the problem that the chips are easy to break in the heat insulation parts and the strength of the chips is reduced due to the fact that the heat insulation parts are additionally arranged is avoided as much as possible.
Optionally, a first liquid inlet and a first liquid outlet are formed at one end of the chip in the second direction, and the first flow channel is a U-shaped flow channel to communicate the first liquid inlet and the first liquid outlet.
The technical scheme has the beneficial effects that: the first flow channel is a U-shaped flow channel, so that the space on the chip can be fully utilized, the length of the first flow channel is increased, the flowing time of the cooling liquid is further increased, the cooling liquid fully absorbs heat, and the heat exchange efficiency is improved.
Optionally, a second liquid inlet and a second liquid outlet are formed at the other end of the chip in the second direction, and the second flow channel is a U-shaped flow channel to communicate the second liquid inlet and the second liquid outlet.
The technical scheme has the beneficial effects that: on the basis of enabling the first runner to be the U-shaped runner, make the second runner also be the U-shaped runner, space on can the more make full use of chip increases the length of second runner, and then increases the time that the coolant liquid flows in the second runner, makes the coolant liquid fully absorb the heat, further improves heat exchange efficiency.
Optionally, a position of an end of the first flow channel away from the first liquid inlet in the second direction corresponds to a position of the second liquid inlet and/or the second liquid outlet.
The technical scheme has the beneficial effects that: the length of the first flow channel is further prolonged, the flowing time of the cooling liquid in the first flow channel is prolonged, the cooling liquid absorbs more heat, and the heat exchange efficiency is further improved; and the first flow channel extends to the position corresponding to the second liquid inlet and/or the second liquid outlet in the second direction, so that the chip is covered by the flow channel as much as possible and exchanges heat with the cooling liquid, and the possibility of the chip having a high material thermal stress due to a high local temperature is reduced.
Optionally, a position of an end of the second flow channel away from the second liquid inlet in the second direction corresponds to a position of the first liquid inlet and/or the first liquid outlet.
The technical scheme has the beneficial effects that: the length of the second flow channel is prolonged, the flowing time of the cooling liquid in the second flow channel is prolonged, and the heat exchange efficiency is further improved; meanwhile, the chip can be further covered by the flow channel as much as possible, and the possibility that the chip has a problem of large thermal stress of the material due to high local temperature is further reduced.
Optionally, at the junction of the first flow channel and the first liquid inlet, the dimension of the first flow channel in the first direction is equal to the dimension of the first liquid inlet in the first direction;
and/or the size of the second flow channel in the first direction is equal to the size of the second liquid inlet in the first direction at the joint of the second flow channel and the second liquid inlet.
The technical scheme has the beneficial effects that: if the size of the first flow channel in the first direction is smaller than that of the first liquid inlet at the joint of the first flow channel and the first liquid inlet, when cooling liquid flows into the first flow channel from the first liquid inlet, the flow field is unevenly distributed, so that a vortex is generated in the first flow channel, and an unstable pressure difference is generated inside and outside the vortex, so that pressure pulses are continuously generated when the vortex acts on a chip, and the chip is possibly eroded and failed; and at the joint of the first flow channel and the first liquid inlet, the size of the first flow channel in the first direction is equal to the size of the first liquid inlet in the first direction, so that the possibility of uneven flow field distribution when cooling liquid flows into the first flow channel from the first liquid inlet can be reduced as much as possible, and the risk of erosion failure of the chip is further reduced. The size of the second liquid inlet in the first direction at the joint of the second liquid inlet and the second flow channel is equal to the size of the second liquid inlet in the first direction, so that the risk of chip erosion failure can be reduced.
Optionally, the size of the first flow channel is the same as the size of the second flow channel in the first direction.
The technical scheme has the beneficial effects that: in the multi-stage intercooler, the low-temperature radiator is sensitive to the heat load, the heat load of the low-temperature radiator is increased by increasing the width of a low-temperature cooling liquid flow passage, therefore, a large-volume low-temperature radiator is needed, if the volume of the low-temperature radiator exceeds a certain limit, the front-end module is difficult to arrange, meanwhile, the high-temperature radiator is sensitive to the resistance of the cooling liquid, and the width of the high-temperature cooling liquid flow channel needs to be increased as much as possible to reduce the resistance of the high-temperature cooling liquid flow channel to the cooling liquid, but theoretically, the high-temperature cooling liquid flow channel cannot be widened infinitely, the size of the first flow channel in the first direction is made the same as the size of the second flow channel in the disclosed embodiment, the size of the first flow passage and the second flow passage meets certain heat exchange requirements, and meanwhile, the heat load of the low-temperature radiator and the resistance of the high-temperature cooling liquid in the flow passage to the cooling liquid are limited to a lower level.
Another aspect of the present disclosure provides a chip assembly, including the above chip, the chip has a laminating face, the first runner with the second runner is in the recess that forms on the laminating face, two the chip passes through laminating face laminates each other, two the chip is mirror symmetry in the third direction, the third direction with the first direction with the second direction is perpendicular.
A third aspect of the present disclosure provides a core body comprising the above chip assembly.
Optionally, a chip unit including at least two chip assemblies stacked in a third direction in which one sealing member is disposed at each of both ends of the chip unit to cover and seal the heat insulating portion, and two sealing members are included.
The technical scheme has the beneficial effects that: in the core, be formed with the gas circulation passageway between two adjacent chip subassemblies, promptly, same tablet core piece is formed with gas circulation passageway and coolant liquid runner respectively in the both sides of third direction, and then realize the heat transfer between gas and the coolant liquid in the core, when being formed with thermal-insulated portion on the chip, especially when thermal-insulated portion is the through-hole, can communicate through this thermal-insulated portion between each gas circulation passageway in the core, adopt above-mentioned sealing member to cover thermal-insulated portion, then can play sealed effect, reduce the risk that gas flows out the core from thermal-insulated portion.
A fourth aspect of the present disclosure provides a multi-stage intercooler including the core described above.
The technical scheme provided by the disclosure can achieve the following beneficial effects:
according to the chip, the chip assembly, the core body and the multi-stage intercooler, the heat insulation part is arranged between the first flow channel and the second flow channel, so that the first flow channel and the second flow channel can be effectively thermally isolated, the degree of heat exchange among cooling liquids in different flow channels is further reduced, and the problem that the cooling liquids in the cooling liquid flow channels in the multi-stage intercooler are easy to generate strong heat exchange is solved; moreover, after the multistage intercooler adopts the chip provided by the embodiment of the disclosure, because the heat exchange degree between cooling liquids in different flow channels is reduced, the heat load of the low-temperature radiator is reduced, and further the volume of the low-temperature radiator is effectively reduced, after the low-temperature radiator and the condenser can be arranged in parallel in a certain installation space, the low-temperature radiator and the high-temperature radiator are arranged in a stacked manner in the flowing direction of ambient air, the original three-layer arrangement structure of the front-end module is changed into a two-layer arrangement structure, the wind resistance is effectively reduced, and the heat exchange capacity of the front-end module is improved.
Additional features of the disclosure and advantages thereof will be set forth in the description which follows, or may be learned by practice of the disclosure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings used in the description of the embodiments will be briefly described below. It should be apparent that the drawings in the following description are of some embodiments of the disclosure and that other drawings may be derived from those drawings by one of ordinary skill in the art without inventive faculty.
Fig. 1 is a schematic perspective view of an embodiment of a chip according to an embodiment of the present disclosure;
fig. 2 is a schematic top view of a chip according to an embodiment of the disclosure;
fig. 3 is a schematic top view structure diagram of another implementation of a chip provided in an embodiment of the present disclosure;
fig. 4 is a schematic perspective view of an embodiment of a chip assembly provided in an embodiment of the disclosure;
FIG. 5 is a schematic cross-sectional view taken at A-A of FIG. 4;
FIG. 6 is a schematic diagram illustrating a partial perspective structure of an embodiment of a chip assembly according to an embodiment of the present disclosure;
fig. 7 is a schematic perspective view of an embodiment of two chips overlapped by a flanging according to an embodiment of the present disclosure;
fig. 8 is a partial perspective view of an embodiment of a core according to an embodiment of the disclosure.
Reference numerals:
100-chip;
110-laminating the board surface;
120-a first flow channel;
121-a first end;
130-a thermal insulation;
140-a second flow channel;
141-a second end;
150-flanging;
200-a seal;
300-gas flow channel.
Detailed Description
The technical solutions of the present disclosure will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
In the description of the present disclosure, it should be noted that the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present disclosure, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.
As shown in fig. 1 to 8, one aspect of the present disclosure provides a chip 100, the chip 100 having a first flow channel 120 and a second flow channel 140 distributed in a first direction and extending in a second direction;
an insulation portion 130 for thermally isolating the first flow channel 120 and the second flow channel 140 is formed between the first flow channel 120 and the second flow channel 140 in a first direction, which is perpendicular to a second direction.
Specifically, the first flow channel 120 and the second flow channel 140 may extend linearly or in a zigzag manner; the chip 100 provided by the embodiment of the present disclosure is a plate, and the first direction and the second direction are two extending directions of the plate perpendicular to each other.
According to the chip 100 provided by the disclosure, the heat insulation part 130 is arranged between the first flow passage 120 and the second flow passage 140, so that the first flow passage 120 and the second flow passage 140 can be effectively thermally isolated, the degree of heat exchange among cooling liquids in different flow passages is further reduced, and the problem that the cooling liquids in the cooling liquid flow passages in the multi-stage intercooler are easy to generate strong heat exchange is solved; moreover, the existing engine front-end heat dissipation module generally comprises a low-temperature radiator, a high-temperature radiator and a condenser, and because the low-temperature radiator has a large volume, the low-temperature radiator, the high-temperature radiator and the condenser have to be arranged in a laminated manner in the flowing direction of ambient air to perform heat dissipation in order to adapt to an installation space, so that the wind resistance of the front-end module is increased, and the heat exchange capacity of the front-end module is influenced; after the multistage intercooler adopts the chip 100 provided by the embodiment of the disclosure, because the heat exchange degree between cooling liquids in different flow channels is reduced, the heat load of the low-temperature radiator is reduced, and further the volume of the low-temperature radiator is effectively reduced, after the low-temperature radiator and the condenser can be arranged in parallel in a certain installation space, the low-temperature radiator and the high-temperature radiator are arranged in a stacked manner in the flowing direction of ambient air, the original three-layer arrangement structure of the front-end module is changed into a two-layer arrangement structure, the wind resistance is effectively reduced, and the heat exchange capacity of the front-end module is improved. The multi-stage intercooler in the embodiment of the disclosure comprises a two-stage intercooler, three stages of intercoolers and even more stages of intercoolers.
Optionally, the insulation 130 is a through hole. The first flow channel 120 is separated from the second flow channel 140 by the through hole, so that heat exchange between the first flow channel 120 and the second flow channel 140 through the material of the chip 100 is reduced as much as possible, and the degree of heat exchange is further reduced. Of course, in addition to the thermal insulation portion 130 being a through hole, the thermal insulation portion 130 may be made of a material with a poor thermal conductivity, especially a material with a poor thermal conductivity compared to the material used for manufacturing the chip 100, so as to reduce the degree of heat exchange between the cooling liquids in different flow channels.
Optionally, the thermal insulation part 130 is a bar-shaped hole extending in the second direction. This can reduce the size of the heat insulating portion 130 in the first direction as much as possible, and reduce the increase in the width of the chip 100 due to the heat insulating portion 130 on the premise that the heat insulating portion 130 has a good heat insulating effect, thereby enabling the chip 100 and the core formed by the chip 100 to maintain a small size. Of course, the insulation 130 may also be square, circular, or other shapes.
Optionally, there is one thermal insulation 130; alternatively, there are at least two thermal insulation portions 130, and each thermal insulation portion 130 is distributed in the second direction, so that a part of the material of the chip 100 itself remains between two adjacent thermal insulation portions 130, and the chip 100 can still maintain good integrity and strength after the thermal insulation portions 130 are added, thereby avoiding the problem that the chip 100 is easily broken in the thermal insulation portions 130 and the strength of the chip 100 is reduced due to the addition of the thermal insulation portions 130.
Optionally, a first liquid inlet and a first liquid outlet are formed at one end of the chip 100 in the second direction, and the first flow channel 120 is a U-shaped flow channel to communicate the first liquid inlet and the first liquid outlet. The first flow channel 120 is a U-shaped flow channel, so that the space on the chip 100 can be fully utilized, the length of the first flow channel 120 is increased, the flowing time of the cooling liquid is further increased, the cooling liquid fully absorbs heat, and the heat exchange efficiency is improved.
Alternatively, a second liquid inlet and a second liquid outlet are formed at the other end of the chip 100 in the second direction, and the second flow channel 140 is a U-shaped flow channel to communicate the second liquid inlet and the second liquid outlet. On the basis that the first flow channel 120 is a U-shaped flow channel, the second flow channel 140 is also a U-shaped flow channel, so that the space on the chip 100 can be more fully utilized, the length of the second flow channel 140 is increased, the flowing time of the cooling liquid in the second flow channel 140 is further increased, the cooling liquid fully absorbs heat, and the heat exchange efficiency is further improved.
As shown in fig. 3, optionally, an end of the first flow channel 120 away from the first inlet port in the second direction is a first end 121, and a position of the first end 121 corresponds to a position of the second inlet port and/or the second outlet port. This further lengthens the first flow channel 120, increases the time for the cooling liquid to flow in the first flow channel 120, so that the cooling liquid absorbs more heat, further improving the heat exchange efficiency; moreover, the first flow channel 120 extends to a position corresponding to the second liquid inlet and/or the second liquid outlet in the second direction, so that the chip 100 is covered by the flow channel as much as possible and exchanges heat with the cooling liquid, and the possibility of a problem of large material thermal stress caused by high local temperature of the chip 100 is reduced.
Optionally, an end of the second flow channel 140 away from the second liquid inlet in the second direction is a second end 141, and a position of the second end 141 corresponds to a position of the first liquid inlet and/or the first liquid outlet. This lengthens the length of the second flow channel 140, increases the time for the cooling liquid to flow in the second flow channel 140, and further improves the heat exchange efficiency; meanwhile, the chip 100 can be further covered by the flow channel as much as possible, and the possibility that the chip 100 has a problem of large thermal stress of the material due to high local temperature is further reduced.
Optionally, at the junction of the first flow channel 120 and the first loading port, the dimension of the first flow channel 120 in the first direction is equal to the dimension of the first loading port in the first direction;
and/or, at the junction of the second flow channel 140 and the second liquid inlet, the dimension of the second flow channel 140 in the first direction is equal to the dimension of the second liquid inlet in the first direction.
If the size of the first flow channel 120 in the first direction is smaller than that of the first liquid inlet at the connection position of the first flow channel 120 and the first liquid inlet, when the cooling liquid flows into the first flow channel 120 from the first liquid inlet, the flow field distribution is uneven, so that a vortex is generated in the first flow channel 120, and because an unstable pressure difference is generated inside and outside the vortex, when the vortex acts on the chip 100, a pressure pulse is continuously generated, thereby possibly causing the problem of erosion failure of the chip 100; therefore, at the connection between the first flow channel 120 and the first liquid inlet, the dimension of the first flow channel 120 in the first direction is equal to the dimension of the first liquid inlet in the first direction, so that the possibility of uneven distribution of the flow field when the cooling liquid flows into the first flow channel 120 from the first liquid inlet can be reduced as much as possible, and the risk of erosion failure of the chip 100 is reduced. Having the dimension of the second flow channel 140 in the first direction equal to the dimension of the second inlet in the first direction at the connection of the second flow channel 140 and the second inlet may also reduce the risk of erosion failure of the chip 100. Of course, it is also possible that at the junction of the first flow channel 120 and the first loading port, the dimension of the first flow channel 120 in the first direction is larger or smaller than the dimension of the first loading port in the first direction, and/or that at the junction of the second flow channel 140 and the second loading port, the dimension of the second flow channel 140 in the first direction is larger or smaller than the dimension of the second loading port in the first direction.
Optionally, the size of the first flow channel 120 is the same as the size of the second flow channel 140 in the first direction. In the multi-stage intercooler, the low-temperature radiator is sensitive to the heat load, the heat load of the low-temperature radiator is increased by increasing the width of a low-temperature cooling liquid flow passage, therefore, a large-volume low-temperature radiator is needed, if the volume of the low-temperature radiator exceeds a certain limit, the front-end module is difficult to arrange, meanwhile, the high-temperature radiator is sensitive to the resistance of the cooling liquid, and the width of the high-temperature cooling liquid flow channel needs to be increased as much as possible to reduce the resistance of the high-temperature cooling liquid flow channel to the cooling liquid, but theoretically, the high-temperature cooling liquid flow channel cannot be widened infinitely, the size of the first flow channel 120 is made the same as the size of the second flow channel 140 in the first direction in the disclosed embodiment, while the first flow channels 120 and the second flow channels 140 are sized to meet certain heat exchange requirements, the heat load of the low-temperature radiator and the resistance to the cooling liquid in the high-temperature cooling liquid flow passage are limited to a low level. One of the first flow channel 120 and the second flow channel 140 is a high-temperature coolant flow channel, and the other is a low-temperature coolant flow channel.
As shown in fig. 4 to 6, another aspect of the present disclosure provides a chip assembly including two chips 100 provided in the embodiment of the present disclosure stacked in a third direction, the chip 100 having a bonding plate 110, the first flow channel 120 and the second flow channel 140 being grooves formed on the bonding plate 110, the two chips 100 being bonded to each other by the bonding plate 110, the two chips 100 being mirror-symmetrical in the third direction, and the third direction being perpendicular to the first direction and the second direction.
In the chip assembly provided by the embodiment of the disclosure, by using the chip 100 provided by the disclosure, the thermal insulation part 130 is disposed between the first flow channel 120 and the second flow channel 140, so that the first flow channel 120 and the second flow channel 140 can be effectively thermally isolated, and the degree of heat exchange between cooling liquids in different flow channels is further reduced. Further, by bonding the bonding plate surfaces 110 of the two chips 100, the heat insulating portion 130, the first flow channel 120, and the second flow channel 140 are independent from each other, and the possibility of the coolant flowing in different flow channels flowing through each other and leaking from the heat insulating portion 130 is reduced. The heat insulating portion 130 may be a through hole directly formed in the attachment plate surface 110, or may be a through hole formed in the bottom of the attachment plate surface 110 and recessed inward.
A third aspect of the present disclosure provides a core body including the chip assembly provided by the embodiments of the present disclosure.
The core body provided by the embodiment of the disclosure adopts the chip assembly provided by the disclosure, and the heat insulation part 130 is arranged between the first flow passage 120 and the second flow passage 140 on the chip 100, so that the first flow passage 120 and the second flow passage 140 can be effectively thermally isolated, the degree of heat exchange among cooling liquids in different flow passages is further reduced, and the problem that the cooling liquids in all the flow passages in the multi-stage intercooler are easy to generate strong heat exchange is solved.
Alternatively, the core provided by the embodiment of the present disclosure includes a chip 100 unit and two sealing members 200, the chip 100 unit includes at least two chip assemblies stacked in the third direction, and one sealing member 200 is disposed at each of both ends of the chip 100 unit in the third direction to cover and seal the thermal insulation portion 130. In the core, the gas flow channels 300 are formed between two adjacent chip assemblies, that is, the gas flow channels 300 and the coolant flow channels are formed on both sides of the same core piece 100 in the third direction, respectively, to further realize heat exchange between the gas and the coolant in the core, when the heat insulating part 130 is formed on the chip 100, particularly, when the heat insulating part 130 is a through hole, the gas flow channels 300 in the core are communicated with each other through the heat insulating part 130, and the heat insulating part 130 is covered with the sealing member 200, so that a sealing effect can be achieved, and the risk that the gas flows out of the core from the heat insulating part 130 is reduced. A flange 150 is formed on the chip 100, and the flange 150 prevents the gas from bypassing and leaking laterally. The sealing member 200 may preferably be a plate member, and may also be a bar or block.
A fourth aspect of the present disclosure provides a multi-stage intercooler, including a core provided in an embodiment of the present disclosure.
The multi-stage intercooler provided by the embodiment of the disclosure adopts the core body provided by the disclosure, and the heat insulation part 130 is arranged between the first flow passage 120 and the second flow passage 140 on the chip 100, so that the first flow passage 120 and the second flow passage 140 can be effectively thermally isolated, and further the degree of heat exchange between cooling liquids in different flow passages is reduced; the multi-stage intercooler can realize two-stage heat exchange at least through the first flow passage 120 and the second flow passage 140.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present disclosure, and not for limiting the same; while the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.
Furthermore, those skilled in the art will appreciate that while some of the embodiments described above include some features included in other embodiments, rather than others, combinations of features of different embodiments are meant to be within the scope of the disclosure and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. Additionally, the information disclosed in this background section is only for enhancement of understanding of the general background of the disclosure and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art that is already known to a person skilled in the art.
Claims (14)
1. A chip having a first flow channel and a second flow channel distributed in a first direction and extending in a second direction;
a heat insulating portion for thermally insulating the first flow path and the second flow path is formed between the first flow path and the second flow path in the first direction, and the first direction is perpendicular to the second direction.
2. The chip of claim 1, wherein the thermal insulating portion is a through hole.
3. The chip of claim 2, wherein the thermal insulating portion is a bar-shaped hole extending in the second direction.
4. The chip of claim 1, wherein one of said thermal insulating portions;
or, there are at least two thermal insulation portions, and each of the thermal insulation portions is distributed in the second direction.
5. The chip of claim 1, wherein a first liquid inlet and a first liquid outlet are formed at one end of the chip in the second direction, and the first flow channel is a U-shaped flow channel to communicate the first liquid inlet and the first liquid outlet.
6. The chip of claim 5, wherein a second liquid inlet and a second liquid outlet are formed at the other end of the chip in the second direction, and the second flow channel is a U-shaped flow channel to communicate the second liquid inlet and the second liquid outlet.
7. The chip of claim 6, wherein a position of an end of the first flow channel away from the first liquid inlet in the second direction corresponds to a position of the second liquid inlet and/or the second liquid outlet.
8. The chip of claim 7, wherein a position of an end of the second flow channel away from the second liquid inlet in the second direction corresponds to a position of the first liquid inlet and/or the first liquid outlet.
9. The chip of claim 6, wherein, at the junction of the first flow channel and the first loading port, the dimension of the first flow channel in the first direction is equal to the dimension of the first loading port in the first direction;
and/or the size of the second flow channel in the first direction is equal to the size of the second liquid inlet in the first direction at the joint of the second flow channel and the second liquid inlet.
10. The chip of any one of claims 1-9, wherein the first flow channel has the same dimensions as the second flow channel in the first direction.
11. A chip assembly comprising two chips of any one of claims 1-10 stacked in a third direction, the chips having a bonding surface, the first and second flow channels being grooves formed in the bonding surface, the two chips being bonded to each other through the bonding surface, the two chips being mirror-symmetrical in the third direction, the third direction being perpendicular to the first and second directions.
12. A core comprising the chip assembly of claim 11.
13. The core according to claim 12, comprising a chip unit including at least two of the chip assemblies stacked in a third direction in which both ends of the chip unit are each disposed with a sealing member to cover and seal the thermal insulation portion, and two sealing members.
14. A multi-stage intercooler comprising the core as set forth in claim 12 or 13.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922498848.2U CN211230611U (en) | 2019-12-31 | 2019-12-31 | Chip, chip assembly, core and multistage intercooler |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922498848.2U CN211230611U (en) | 2019-12-31 | 2019-12-31 | Chip, chip assembly, core and multistage intercooler |
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| CN211230611U true CN211230611U (en) | 2020-08-11 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112412614A (en) * | 2020-11-18 | 2021-02-26 | 浙江银轮机械股份有限公司 | Chip, core and intercooler |
| CN115341989A (en) * | 2022-08-12 | 2022-11-15 | 河南柴油机重工有限责任公司 | Integral two-stage cooling device for engine and engine |
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2019
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112412614A (en) * | 2020-11-18 | 2021-02-26 | 浙江银轮机械股份有限公司 | Chip, core and intercooler |
| CN112412614B (en) * | 2020-11-18 | 2022-02-08 | 浙江银轮机械股份有限公司 | Chip, core and intercooler |
| CN115341989A (en) * | 2022-08-12 | 2022-11-15 | 河南柴油机重工有限责任公司 | Integral two-stage cooling device for engine and engine |
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Effective date of registration: 20210423 Address after: 317200, No. 8, Feng Dong Road, Fuk Creek Street, Tiantai County, Zhejiang, Taizhou Patentee after: Zhejiang yinlun new energy thermal management system Co.,Ltd. Address before: 317200, No. 8, Feng Dong Road, Fuk Creek Street, Tiantai County, Zhejiang, Taizhou Patentee before: ZHEJIANG YINLUN MACHINERY Co.,Ltd. |
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