CN109804106A - 附膜玻璃板的制造方法 - Google Patents

附膜玻璃板的制造方法 Download PDF

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CN109804106A
CN109804106A CN201780062922.7A CN201780062922A CN109804106A CN 109804106 A CN109804106 A CN 109804106A CN 201780062922 A CN201780062922 A CN 201780062922A CN 109804106 A CN109804106 A CN 109804106A
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glass plate
membrane
metal coating
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田中宏明
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Nippon Electric Glass Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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    • C23F1/02—Local etching
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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Abstract

本发明提供能够使侧面蚀刻的量变小的附膜玻璃板的制造方法。该附膜玻璃板的制造方法的特征在于，包括：在玻璃板(1)上形成具有至少含有贵金属的无机物膜(2)和形成于无机物膜(2)上的第一金属镀膜(3)的叠层膜(6)的工序；和使用蚀刻液使叠层膜(6)图案化的工序，蚀刻液含有2～5质量％的过氧化氢、0.25质量％以下的草酸二水合物和0.75质量％以下的草酸盐。

Description

附膜玻璃板的制造方法
技术领域
本发明涉及使包含金属镀膜等的叠层膜图案化的附膜玻璃板的制造方法。
背景技术
在电视、个人计算机、智能手机等所使用的显示装置中，使用表面设置有使金属膜图案化而成的电极膜的附膜玻璃板。这样的附膜玻璃板例如通过在玻璃板上形成金属膜后，在金属膜上形成抗蚀剂膜作为蚀刻掩模，使用蚀刻液对金属膜进行蚀刻并使其图案化而制造(专利文献1)。
现有技术文献
专利文献
专利文献1：日本特开2016－74582号公报
发明内容
发明所要解决的课题
已知在蚀刻时，在抗蚀剂膜的端部发生抗蚀剂膜的下方的金属膜被蚀刻的现象、所谓的侧面蚀刻。近年来，出于显示器的高精细化以及降低作为电极使用的金属网图案的辨识性的目的等，电极膜的线宽变细了。因此，侧面蚀刻的量变大时，会产生电极膜的线宽的偏差变大这样的问题。
本发明的目的在于，提供能够使侧面蚀刻的量变小的附膜玻璃板的制造方法。
用于解决课题的技术方案
本发明的附膜玻璃板的制造方法的特征在于，包括：在玻璃板上形成具有至少含有贵金属的无机物膜和形成于无机物膜上的第一金属镀膜的叠层膜的工序；和使用蚀刻液使叠层膜图案化的工序，蚀刻液含有2～5质量％的过氧化氢以及以总量计为1质量％以下的草酸二水合物和草酸盐。
在本发明中，优选含有草酸二水合物0.25质量％以下、草酸盐0.75质量％以下。
在本发明中，草酸盐优选为草酸钠。
在本发明中，第一金属镀膜优选利用无电解镀敷形成。
在本发明中，叠层膜优选在第一金属镀膜上还具有利用电解镀敷形成的第二金属镀膜。
在本发明中，第一金属镀膜优选含有镍。
在本发明中，第二金属镀膜优选含有铜。
发明效果
利用本发明，能够使侧面蚀刻的量变小。
附图说明
图1是用于对本发明的一个实施方式的附膜玻璃板的制造方法进行说明的示意截面图。
图2是用于对本发明的一个实施方式的附膜玻璃板的制造方法进行说明的示意截面图。
具体实施方式
以下，对优选的实施方式进行说明。但是，以下的实施方式只是示例，本发明并不限定于以下的实施方式。另外，在各附图中，有时实质上具有相同的功能的部件参照相同的符号。
图1和图2是用于对本发明的一个实施方式的附膜玻璃板的制造方法进行说明的示意截面图。
如图1所示，在玻璃板1上形成叠层膜6。在本实施方式中，叠层膜6由形成于玻璃板1上的无机物膜2、形成于无机物膜2上的第一金属镀膜3和形成于第一金属镀膜3上的第二金属镀膜4构成。
玻璃板1的材料没有特别限定，例如可以列举钠钙玻璃、无碱玻璃等，还可以为作为强化玻璃使用的铝硅酸盐玻璃。
玻璃板1的厚度没有特别限定，例如为10μm～300μm，优选为20μm～200μm，最优选为50μm～100μm。玻璃板1的厚度小于10μm时，有时玻璃板1因第一金属镀膜3的应力而翘曲或起皱，并且玻璃板1容易破损。另外，玻璃板1的厚度超过300μm时，玻璃板1基本没有可挠性，因此，有时无法用于曲面的显示器等。
无机物膜2至少含有贵金属。作为无机物膜2，例如可以列举对容易吸附于玻璃板1的氯化锡、氯化锌、氯化铜等赋予亚硫酸金钠、氯化银、硝酸银、六氯铂(IV)酸6水合物、氯化钯、氯化钌等而成的膜。无机物膜2除了上述的贵金属以外，例如还可以含有镍、钴、铜等的作为无电解镀敷的催化剂的金属。
在本实施方式中，例如无机物膜2如下所述地形成。将玻璃板1浸渍于含有锡、锌、铜中的一种或多种以上的溶液中，使它们的金属离子吸附于玻璃板1的表面，接着，浸渍于含有贵金属的水溶液中。由此，利用离子化倾向的差异，锡、锌、铜等金属离子与贵金属离子发生置换，在玻璃板1上形成以贵金属或贵金属化合物为主要成分的膜。然后，将形成有该膜的玻璃板1浸渍于还原性溶液中。由此，将膜的表面附近的贵金属还原，成为具有无电解镀敷的催化作用的状态。
无机物膜2的厚度例如为0.07μm～1.0μm，更优选0.1μm～0.7μm，最优选0.2μm～0.5μm。无机物膜2的厚度小于0.07μm时，有时第一金属镀膜3的生成速度会变慢。无机物膜2的厚度超过1.0μm时，有时不必要的贵金属会变多，从经济性的观点考虑，不优选。
第一金属镀膜3优选含有铜或镍。铜和镍是能够进行微细蚀刻的金属材料，因而优选。铜的电阻低，在无电解镀敷中，能够均匀地形成膜厚。镍与无机物膜2的密合性良好。
第一金属镀膜3的厚度例如为0.05μm～5.0μm，更优选0.1μm～1.0μm，最优选0.2μm～0.5μm。如果第一金属镀膜3的厚度小于0.05μm，则在利用电解镀敷在其上形成第二金属镀膜4的情况下，有时无法均匀地形成第二金属镀膜4的膜厚。第一金属镀膜3的厚度超过5.0μm时，有时成膜需要长时间，生产效率下降，或者制造成本增大。
第二金属镀膜4没有特别限定，考虑作为电极的用途时，优选电阻低，从该观点考虑，优选铜或镍。关于体积电阻率，在无电解镀铜和电解镀铜中为3μΩ·cm，在电解镀镍中为8μΩ·cm。另外，如上所述，铜和镍是能够进行微细蚀刻的金属材料，因而优选。
第二金属镀膜4的厚度例如为0.1μm～5.0μm，更优选0.3μm～3.0μm，最优选0.5μm～2.0μm。第二金属镀膜4的厚度小于0.1μm时，有时无法充分获得作为电极的导电性。第二金属镀膜4的厚度超过5.0μm时，有时成膜需要长时间，生产效率下降，或者制造成本增大。
由无电解镀铜构成第一金属镀膜3并由电解镀铜构成第二金属镀膜4时，可以在短时间内得到厚度均匀的低电阻率的叠层膜6。另外，由于第一金属镀膜3、第二金属镀膜4均由铜构成，所以利用蚀刻的微细加工变得容易。
由无电解镀铜构成第一金属镀膜3并由无电解镀铜构成第二金属镀膜4时，由于均由铜构成，所以利用蚀刻的微细加工变得容易。
由无电解镀铜构成第一金属镀膜3并由无电解镀镍或电解镀镍构成第二金属镀膜4时，由于表面由镍构成，所以耐腐蚀性优异。
由无电解镀镍构成第一金属镀膜3并由电解镀铜构成第二金属镀膜4时，能够使叠层膜6的电阻率变低。另外，能够形成厚度均匀的叠层膜6。另外，能够使用廉价的镀浴，并能够廉价且高生产率地形成低电阻的叠层膜6。
由无电解镀镍构成第一金属镀膜3并由无电解镀镍或电解镀镍构成第二金属镀膜4时，由于均由镍构成，所以利用蚀刻的微细加工变得容易。另外，由于表面由镍构成，所以耐腐蚀性优异。
如图1所示，在玻璃板1上形成叠层膜6后，在叠层膜6上形成抗蚀剂膜5。抗蚀剂膜5可以由一般的用于光刻法的抗蚀剂材料形成。抗蚀剂膜5具有与对叠层膜6进行蚀刻而形成的电极膜的图案相对应的图案。形成抗蚀剂膜5后，将玻璃板1浸渍于蚀刻液中，对叠层膜6进行蚀刻。本发明的蚀刻液含有2～5质量％的过氧化氢以及以总量计为1质量％以下的草酸二水合物和草酸盐。
图2是表示蚀刻后的叠层膜6的示意截面图。如图2所示，叠层膜6因被侧面蚀刻而向比抗蚀剂膜5的下方外侧端部5a更内侧后退。侧面蚀刻的量SE是从抗蚀剂膜5的下方外侧端部5a至叠层膜6的上方外侧端部6a的水平方向的距离。通过使用本实施方式的蚀刻液，能够使侧面蚀刻的量SE变小。以下，对本实施方式的蚀刻液进行说明。
本发明的蚀刻液含有2～5质量％的范围的过氧化氢。过氧化氢作为将第一金属镀膜3、第二金属镀膜4氧化的氧化剂发挥功能。过氧化氢的浓度小于2质量％时，侧面蚀刻的量(SE)会变大。过氧化氢的浓度超过5质量％时，会促进过氧化氢的自身分解并伴随急剧的温度上升，因而不优选。过氧化氢的浓度优选为2.5～5质量％的范围，更优选为3.5～5质量％的范围。
本发明的蚀刻液含有草酸二水合物和草酸盐。草酸二水合物、草酸盐作为用于溶解第一金属镀膜3、第二金属镀膜4而形成金属配位化合物的配位剂发挥功能。作为草酸盐，例如可以列举草酸钠、草酸铵等。草酸二水合物和草酸盐的总量为1质量％以下。草酸二水合物和草酸盐的总量超过1质量％时，侧面蚀刻的量会变大。草酸二水合物和草酸盐的浓度的总量优选为0.1质量％以上。草酸二水合物和草酸盐的浓度的总量小于0.1质量％时，蚀刻速度会变慢，例如直至蚀刻结束所需的时间变长。另外，草酸二水合物和草酸盐的浓度的总量优选为0.2～0.8质量％的范围，更优选为0.4～0.7质量％的范围。
草酸二水合物的浓度优选为0.25质量％以下，草酸盐的浓度优选为0.75质量％以下。草酸二水合物的浓度超过0.25质量％且草酸盐的浓度超过0.75质量％时，侧面蚀刻的量会变大。另外，草酸二水合物的浓度优选为0.025质量％以上，草酸盐的浓度优选为0.075质量％以上。草酸二水合物的浓度小于0.025质量％且草酸盐的浓度小于0.075质量％时，蚀刻速度会变慢，例如直至蚀刻结束所需的时间变长。草酸二水合物的浓度优选为0.05～0.2质量％的范围，更优选为0.1～0.15质量％的范围。另外，草酸盐的浓度优选为0.15～0.6质量％的范围，更优选为0.3～0.45质量％的范围。
本发明的蚀刻液还可以含有乙二醇、表面活性剂等。含有乙二醇时，其浓度例如可以为1.4～2.1质量％左右。
蚀刻时的蚀刻液的温度优选为50～70℃的范围。
实施例
以下，利用实施例对本发明进行更详细地说明，但本发明并不限定于这些实施例。
(实施例1～3和比较例1～4)
作为玻璃板，使用日本电气硝子公司制造的OA－10G。在该玻璃板的一个表面形成由无机物膜、第一金属镀膜和第二金属镀膜构成的叠层膜。无机物膜按照上述的方法形成。
作为第一金属镀膜，形成无电解镍镀膜，厚度为0.5μm。
作为第二金属镀膜，形成电解铜镀膜，厚度为2.0μm。
利用光刻法在如上所述地形成的叠层膜上形成图案化的抗蚀剂膜。抗蚀剂膜的线宽为800μm。
调制含有表1所示的浓度的草酸二水合物、作为草酸盐的草酸钠和过氧化氢的蚀刻液后，以65℃恒温保持，将形成上述抗蚀剂膜后的附膜玻璃板浸渍于充满蚀刻液的蚀刻液槽中，揺动蚀刻液槽，由此进行蚀刻。蚀刻液槽内的浸渍时间为表1所示的蚀刻时间。
测定图2所示的侧面蚀刻的量(SE量)，将结果示于表1。通过使用金属显微镜，测定从蚀刻后的抗蚀剂膜的下方外侧端部(图2的5a)至叠层膜6的上方外侧端部(图2的6a)的距离，进行侧面蚀刻的量(SE量)的测定。另外，通过利用SEM(扫描电子显微镜、ScanningElectron Microscope)的外观观察和利用EPMA(电子探针显微分析仪、Electron ProbeMicro Analyzer)的成分分析，确认抗蚀剂膜的下方以外有无叠层膜的残留(蚀刻残留)。
(实施例4)
使作为第一金属镀膜的无电解镍镀膜的厚度成为0.25μm，使作为第二金属镀膜的电解铜镀膜的厚度成为1.0μm，调制含有表1所示的草酸二水合物浓度、草酸钠浓度和过氧化氢浓度的蚀刻液，使蚀刻时间如表1所示，除此以外，与实施例1相同。
[表1]
如表1所示，可知使用了本发明的蚀刻液的实施例1～4与比较例1～3相比，侧面蚀刻的量(SE量)变小了。比较例4虽然侧面蚀刻的量(SE量)小，但由于过氧化氢的浓度超过了5质量％，所以因过氧化氢的自身分解而温度急剧地上升，因而不优选。
另外，由比较例1、比较例2和比较例3的比较可知，草酸二水合物和草酸钠的浓度变高时，侧面蚀刻的量(SE量)变大。因此可知，为了使侧面蚀刻的量(SE量)变小，优选将草酸二水合物和草酸盐的总量的浓度设为1质量％以下。
另外，如实施例4所示，通过使第一金属镀膜和第二金属镀膜的厚度变薄，能够缩短必要的蚀刻时间，并能够使侧面蚀刻量(SE量)变小。
符号说明
1…玻璃板
2…无机物膜
3…第一金属镀膜
4…第二金属镀膜
5…抗蚀剂膜
5a…抗蚀剂膜的下方外侧端部
6…叠层膜
6a…叠层膜的上方外侧端部

Claims (7)

1.一种附膜玻璃板的制造方法，其特征在于，包括：
在玻璃板上形成具有至少含有贵金属的无机物膜和形成于所述无机物膜上的第一金属镀膜的叠层膜的工序；和
使用蚀刻液使所述叠层膜图案化的工序，
所述蚀刻液含有2～5质量％的过氧化氢以及以总量计为1质量％以下的草酸二水合物和草酸盐。
2.如权利要求1所述的附膜玻璃板的制造方法，其特征在于：
含有0.25质量％以下的所述草酸二水合物、0.75质量％以下的所述草酸盐。
3.如权利要求1或2所述的附膜玻璃板的制造方法，其特征在于：
所述草酸盐为草酸钠。
4.如权利要求1～3中任一项所述的附膜玻璃板的制造方法，其特征在于：
通过无电解镀敷形成所述第一金属镀膜。
5.如权利要求1～4中任一项所述的附膜玻璃板的制造方法，其特征在于：
所述叠层膜在所述第一金属镀膜上还具有通过电解镀敷形成的第二金属镀膜。
6.如权利要求1～5中任一项所述的附膜玻璃板的制造方法，其特征在于：
所述第一金属镀膜含有镍。
7.如权利要求5或6所述的附膜玻璃板的制造方法，其特征在于：
所述第二金属镀膜含有铜。
CN201780062922.7A 2016-10-11 2017-09-15 附膜玻璃板的制造方法 Pending CN109804106A (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105411A (ja) * 2003-09-08 2005-04-21 Mitsubishi Chemicals Corp 銅エッチング液及びエッチング方法
CN102983101A (zh) * 2011-08-04 2013-03-20 东友Fine-Chem股份有限公司 液晶显示装置用阵列基板的制造方法
TW201337258A (zh) * 2012-03-15 2013-09-16 Jiang Hui Ping 感測試片及其製作方法
US20150191830A1 (en) * 2014-01-08 2015-07-09 Ebara Corporation Etching liquid, etching method, and method of manufacturing solder bump
JP2016074582A (ja) * 2014-10-03 2016-05-12 日本電気硝子株式会社 膜付きガラス板、タッチセンサ、膜及び膜付きガラス板の製造方法
CN105603425A (zh) * 2016-01-25 2016-05-25 熙腾电子科技（上海）有限公司 铜选择性蚀刻液和钛选择性蚀刻液

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005105411A (ja) * 2003-09-08 2005-04-21 Mitsubishi Chemicals Corp 銅エッチング液及びエッチング方法
CN102983101A (zh) * 2011-08-04 2013-03-20 东友Fine-Chem股份有限公司 液晶显示装置用阵列基板的制造方法
TW201337258A (zh) * 2012-03-15 2013-09-16 Jiang Hui Ping 感測試片及其製作方法
US20150191830A1 (en) * 2014-01-08 2015-07-09 Ebara Corporation Etching liquid, etching method, and method of manufacturing solder bump
JP2016074582A (ja) * 2014-10-03 2016-05-12 日本電気硝子株式会社 膜付きガラス板、タッチセンサ、膜及び膜付きガラス板の製造方法
CN105603425A (zh) * 2016-01-25 2016-05-25 熙腾电子科技（上海）有限公司 铜选择性蚀刻液和钛选择性蚀刻液

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