CN109791377B - 树脂掩膜剥离用洗涤剂组合物 - Google Patents

树脂掩膜剥离用洗涤剂组合物 Download PDF

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Publication number
CN109791377B
CN109791377B CN201780054413.XA CN201780054413A CN109791377B CN 109791377 B CN109791377 B CN 109791377B CN 201780054413 A CN201780054413 A CN 201780054413A CN 109791377 B CN109791377 B CN 109791377B
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China
Prior art keywords
component
detergent composition
mass
composition according
less
Prior art date
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CN201780054413.XA
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English (en)
Chinese (zh)
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CN109791377A (zh
Inventor
西勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
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Kao Corp
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/08—Liquid soap, e.g. for dispensers; capsuled
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN201780054413.XA 2016-09-09 2017-08-24 树脂掩膜剥离用洗涤剂组合物 Active CN109791377B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016176651A JP6860276B2 (ja) 2016-09-09 2016-09-09 樹脂マスク剥離用洗浄剤組成物
JP2016-176651 2016-09-09
PCT/JP2017/030352 WO2018047631A1 (ja) 2016-09-09 2017-08-24 樹脂マスク剥離用洗浄剤組成物

Publications (2)

Publication Number Publication Date
CN109791377A CN109791377A (zh) 2019-05-21
CN109791377B true CN109791377B (zh) 2023-03-28

Family

ID=61562305

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780054413.XA Active CN109791377B (zh) 2016-09-09 2017-08-24 树脂掩膜剥离用洗涤剂组合物

Country Status (5)

Country Link
JP (1) JP6860276B2 (ja)
KR (1) KR102455657B1 (ja)
CN (1) CN109791377B (ja)
TW (1) TW201817864A (ja)
WO (1) WO2018047631A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019111479A1 (ja) * 2017-12-07 2019-06-13 株式会社Ｊｃｕ レジストの剥離液
JP7020905B2 (ja) * 2017-12-27 2022-02-16 花王株式会社 樹脂マスク剥離用洗浄剤組成物
EP3763583A4 (en) 2018-03-07 2021-12-15 Koito Manufacturing Co., Ltd. VEHICLE CLEANING SYSTEM
JP7132214B2 (ja) * 2018-07-27 2022-09-06 花王株式会社 樹脂マスク剥離用洗浄剤組成物
CN112470079A (zh) * 2018-07-27 2021-03-09 花王株式会社 清洗方法
JP2022087052A (ja) * 2020-11-30 2022-06-09 花王株式会社 樹脂マスク剥離用洗浄剤組成物
CN117355798A (zh) * 2021-06-24 2024-01-05 日油株式会社 电路基板用树脂膜的剥离剂和电路基板的制造方法
JP7290194B1 (ja) 2022-10-19 2023-06-13 Jsr株式会社 半導体処理用組成物及び処理方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0212254A (ja) * 1988-06-30 1990-01-17 Mitsubishi Kasei Corp 現像液組成物
JPH07140676A (ja) 1993-11-16 1995-06-02 Ibiden Co Ltd エポキシ樹脂系フォトソルダーレジストの剥離液
KR100646793B1 (ko) * 2001-11-13 2006-11-17 삼성전자주식회사 씬너 조성물
CN1441043A (zh) * 2002-02-06 2003-09-10 希普利公司 清洁用组合物
US7098181B2 (en) * 2002-05-22 2006-08-29 Kao Corporation Liquid detergent composition
JP4104387B2 (ja) * 2002-07-08 2008-06-18 花王株式会社 剥離剤組成物
JP2004157284A (ja) * 2002-11-06 2004-06-03 Nippon Zeon Co Ltd レジスト剥離液
JP4202859B2 (ja) * 2003-08-05 2008-12-24 花王株式会社 レジスト用剥離剤組成物
KR20080059442A (ko) * 2005-10-13 2008-06-27 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 금속 상용성 포토레지스트 및/또는 희생 반사방지 코팅제거 조성물
US7960328B2 (en) * 2005-11-09 2011-06-14 Advanced Technology Materials, Inc. Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
JP2008214545A (ja) * 2007-03-06 2008-09-18 Lion Corp 液体洗浄剤組成物
WO2012133382A1 (ja) * 2011-03-28 2012-10-04 富士フイルム株式会社 平版印刷版の製版方法
US20140100151A1 (en) 2012-10-08 2014-04-10 Air Products And Chemicals Inc. Stripping and Cleaning Compositions for Removal of Thick Film Resist
FR3000235B1 (fr) * 2012-12-21 2016-06-24 Arkema France Procede de fabrication de masques nanolithographiques
WO2014197808A1 (en) * 2013-06-06 2014-12-11 Advanced Technology Materials, Inc. Compositions and methods for selectively etching titanium nitride
US10428271B2 (en) * 2013-08-30 2019-10-01 Entegris, Inc. Compositions and methods for selectively etching titanium nitride
CN110225667B (zh) 2013-09-11 2023-01-10 花王株式会社 树脂掩模层用洗涤剂组合物及电路基板的制造方法

Also Published As

Publication number Publication date
KR20190051965A (ko) 2019-05-15
JP6860276B2 (ja) 2021-04-14
JP2018041033A (ja) 2018-03-15
WO2018047631A1 (ja) 2018-03-15
KR102455657B1 (ko) 2022-10-17
CN109791377A (zh) 2019-05-21
TW201817864A (zh) 2018-05-16

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