CN109727967A - Lens integration infrared tube mould group and the infrared sensor with the mould group - Google Patents
Lens integration infrared tube mould group and the infrared sensor with the mould group Download PDFInfo
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- CN109727967A CN109727967A CN201910046685.6A CN201910046685A CN109727967A CN 109727967 A CN109727967 A CN 109727967A CN 201910046685 A CN201910046685 A CN 201910046685A CN 109727967 A CN109727967 A CN 109727967A
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- infrared
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- mould group
- mirror lens
- circuit substrate
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- 230000010354 integration Effects 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 230000033001 locomotion Effects 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 3
- 238000009434 installation Methods 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a kind of lens integration infrared tube mould group and the infrared sensor with the mould group.Wherein, infrared tube mould group includes infrared emission chip, infrared receiver chip, circuit substrate, the first mirror lens and the second mirror lens.Infrared emission chip and infrared receiver chip are set on circuit substrate at certain intervals, and the first mirror lens and the second mirror lens are also set to circuit substrate at certain intervals, are formed interspace in advance between the two.First mirror lens have the first reflecting surface, the second mirror lens have the second reflecting surface, infrared emission chip issue infrared signal successively by the first reflecting surface, the second reflecting surface reflection after, into infrared receiver chip.Infrared tube mould group of the invention is integrated, and two chips can be accurately located, and bit errors are small, and consistency is high.Mould group after encapsulation can carry out welding installation as an independent entirety, without being welded respectively, simplify welding.
Description
Technical field
The invention belongs to technical field of electronic components more particularly to a kind of lens integration infrared tube mould group and tools
There is the infrared sensor of the mould group.
Background technique
Existing infrared emission and reception are mainly tradition DIP plug-in type or SMD patch type, infrared emission component to pipe
With receive component be 2 separated components, using when need by 2 components according to topology requirement weld install
Together, the contraposition difficulty of this mode separately welded is big, to the high operation requirements of worker, in practical applications, transmitting member
Always there are certain bit errors in device and reception component, comparison of coherence is poor.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of lens integration infrared tube mould group and have should
The infrared sensor of mould group, it is intended to solve infrared emission component in the prior art and receive the mode institute that component separately welds
Existing contraposition difficulty is big, the poor problem of consistency.
The invention is realized in this way a kind of lens integration infrared tube mould group, including infrared emission chip and red
Outer reception chip, the lens integration infrared tube mould group further include circuit substrate, the first mirror lens and the second reflection
Lens are laid with conducting wire on the circuit substrate, and the infrared emission chip is set at certain intervals with infrared receiver chip
It is placed on the circuit substrate, and is electrically connected respectively with the conducting wire on the circuit substrate；First mirror lens with
Second mirror lens is also set to the circuit substrate at certain intervals, is formed interspace in advance between the two；The infrared emission
Chip is in first mirror lens, and the infrared receiver chip is in second mirror lens；Described
One mirror lens has the first reflecting surface, and second mirror lens has the second reflecting surface, and the infrared emission chip issues
Infrared signal successively by first reflecting surface, the second reflecting surface reflection after, into the infrared receiver chip.
Further, the conducting wire on the circuit substrate includes the first conducting wire of mutually insulated isolation, second
Conducting wire and third conducting wire；The cathode of the infrared emission chip and infrared receiver chip is led with described first jointly
Electric line electrical connection, the anode of the infrared emission chip are electrically connected with second conducting wire, the infrared receiver chip
Anode be electrically connected with the third conducting wire.
Further, the first mirror lens is oppositely arranged with the second mirror lens, and along the centre bit of the circuit substrate
It sets symmetrical.
Further, the first reflecting surface of first mirror lens is a clinoplain, second mirror lens
Second reflecting surface is also a clinoplain, first reflecting surface and the second reflecting surface along it is described it is pre- interspace it is arranged symmetrically.
Further, there is the circuit substrate front, the back side and side, the conducting wire to be located at the front
On, the infrared emission chip, infrared receiver chip, the first mirror lens and the second mirror lens are all set in the circuit
On the front of substrate；It is provided with pad on the back side, there is inner conductive route inside the circuit substrate, the inside is led
One end of electric line is electrically connected with the conducting wire on the front, and the other end is electrically connected with the pad on the back side.
Further, there is the circuit substrate front, the back side and side, the conducting wire to be located at the front
On, the infrared emission chip, infrared receiver chip, the first mirror lens and the second mirror lens are all set in the circuit
On the front of substrate；Pad and surface conductance route, one end of the surface conductance route and institute are provided on the side
The conducting wire electrical connection on front is stated, the other end is electrically connected with the pad on the side.
Further, the side of the circuit substrate is plane.
Further, it is respectively provided with a mounting plane on first mirror lens and the second mirror lens, it is described
The mounting plane of first mirror lens, the second mirror lens mounting plane and the circuit substrate on pad side
It is respectively positioned on the same side.
The present invention is in order to solve the above technical problems, additionally provide a kind of infrared sensor comprising above-mentioned any one
At lens integration infrared tube mould group and signal processing circuit, the lens integration infrared tube mould group and the signal
Manage circuit electrical connection.
Further, the infrared sensor further includes opaque baffle and movable part；The movable part and it is described not
Light transmission baffle is fixedly connected, and the opaque baffle follows the movement of the movable part to can enter or leave described pre- interspace.
Compared with prior art, the present invention beneficial effect is:
Lens integration infrared tube mould group of the invention is integrated, before module packaging, infrared emission chip with
And infrared receiver chip can be accurately located, and be fixed on one piece of circuit substrate, two chip bit errors are small, consistency
It is high.Lens integration infrared tube mould group after encapsulation can carry out welding installation as an independent entirety, due to two crystalline substances
Piece is integrated, without being welded respectively, has simplified welding.
Detailed description of the invention
Fig. 1 is the schematic side view for the lens integration infrared tube mould group that the embodiment of the present invention one provides；
Fig. 2 is the schematic top plan view of the circuit substrate of the lens integration infrared tube mould group in Fig. 1；
Fig. 3 is the infrared light of the inside of the lens integration infrared tube mould group of offer provided in an embodiment of the present invention
Light path schematic diagram；
Fig. 4 is the elevational schematic view of the circuit substrate of the lens integration infrared tube mould group in Fig. 1；
Fig. 5 is the schematic perspective view of lens integration infrared tube mould group provided by Embodiment 2 of the present invention；
Fig. 6 is the schematic perspective view of the circuit substrate of the lens integration infrared tube mould group in Fig. 5.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention；Term " first ", " second ", " third "
It is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance；In addition, unless otherwise specific regulation and limit
Fixed, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Embodiment one:
Referring to Figure 1, a kind of lens integration infrared tube mould group is present embodiments provided, including infrared emission chip 1,
Infrared receiver chip 2, circuit substrate 3, the first mirror lens 4 and the second mirror lens 5.
Foregoing circuit substrate 3 has front, the back side and side.Preferably, front, the back side are plane, and each side
It then can be plane, may not be plane.
Fig. 2 is referred to, conducting wire, infrared emission chip 1 and infrared receiver are laid on the front of foregoing circuit substrate 3
Chip 2 is set at certain intervals on the front of circuit substrate 3, and the specific value at the interval is preparatory according to specific application demand
It designs.Infrared emission chip 1 is oppositely arranged with infrared receiver chip 2, and symmetrical along the center of circuit substrate 3.First
Mirror lens 4 is oppositely arranged with the second mirror lens 5, and symmetrical along the center of circuit substrate 3.In this present embodiment,
One mirror lens 4, the second mirror lens 5 are all made of resin material production, and infrared emission chip 1 is embedded at the first mirror lens 4
Interior, infrared receiver chip 2 is in the second mirror lens 5.As it can be seen that the lens integration infrared tube mould group of the present embodiment can
Once it is packaged into integrated structure.
Infrared emission chip 1 is electrically connected with the conducting wire on 3 front of circuit substrate respectively with infrared receiver chip 2.Tool
Body, the conducting wire on front includes the first conducting wire 31, the second conducting wire 32 and the third of mutually insulated isolation
Conducting wire 33.Infrared emission chip 1 is electrically connected with the first conducting wire 31 jointly with the cathode of infrared receiver chip 2, infrared
The anode of transmitting chip 1 is electrically connected with the second conducting wire 32, and anode and the third conducting wire 33 of infrared receiver chip 2 are electrically connected
It connects.Infrared emission chip 1 can use the chip of 850nm~1310nm wavelength.
First mirror lens 4 and the second mirror lens 5 are also set at certain intervals on the front of circuit substrate 3, the two
Between formed and interspace 6 in advance.This is pre- to interspace and 6 leaves application end for, and application end interdicts optical path using lighttight baffle, leaves a blank in advance
The specific value of gap 6 is pre-designed according to specific application demand.
First mirror lens 4 has the first reflecting surface 41, and the second mirror lens 5 has the second reflecting surface 51, in this implementation
In example, the first reflecting surface 41 of the first mirror lens 4 is a clinoplain, and the second reflecting surface 51 of the second mirror lens 5 is also
One clinoplain, the first reflecting surface 41 and the second reflecting surface 51 along in advance interspace 6 be symmetrical arranged.Fig. 3 is referred to, infrared emission is brilliant
Piece 1 issue infrared signal successively by the first reflecting surface 41, the second reflecting surface 51 reflection after, into infrared receiver chip 2
It is interior.
Fig. 4 is referred to, pad 34 is provided on the back side of circuit substrate 3, there is inner conductive route inside circuit substrate 3
One end of (not shown), inner conductive route is electrically connected with the conducting wire on front, the weldering on the other end and the back side
Disk 34 is electrically connected.To which infrared emission chip 1, infrared receiver chip 2 on front can be realized with the pad 34 on the back side to be electrically connected
It connects.The lens integration infrared tube mould group of the structure is suitable for vertical patch during installation.
The lens integration infrared tube mould group of the present embodiment is integrated, before module packaging, infrared emission chip 1
And infrared receiver chip 2 can be accurately located, and be fixed on one piece of circuit substrate 3, two chip bit errors are small, unanimously
Property it is high.Lens integration infrared tube mould group after encapsulation can be as two kinds of SMT production technology (sides of an independent whole progress
Patch or vertical patch) demand, without being welded respectively, simplified welding since two chips are integrated, improved
Production efficiency.
The present embodiment additionally provides a kind of infrared sensor using said lens integration infrared tube mould group, this is infrared
Sensor includes above-mentioned lens integration infrared tube mould group, signal processing circuit, opaque baffle and movable part.Activity
Part is fixedly connected with opaque baffle, and lens integration infrared tube mould group is electrically connected with signal processing circuit.Opaque baffle
Being moved into or leave and pre- interspacing 6 for movable part can be followed.
As it can be seen that movable part can enter or leave pre- leave a blank when there is sensor external external force move movable part
Gap 6, to separate or not separate infrared light, signal processing circuit carries out at signal according to the curent change of infrared receiver chip
Reason can play the role of capturing the movement of (induction) sensor external or power.It is easily understood that the movable part of the present embodiment can
It is that the infrared sensor of the present embodiment can be used for incuding outer to be movable part, the swing component of reciprocally swinging etc. of linear motion
The pressure or motion conditions on boundary.
Embodiment two:
Fig. 5 and Fig. 6 is referred to, another lens integration infrared tube mould group is present embodiments provided, with embodiment one
Unlike, the circuit substrate 3 of the present embodiment is overleaf arranged on the basis of pad 34, is also provided on the side of circuit substrate 3
There are pad 35 and surface conductance route 36, one end of surface conductance route 36 is electrically connected with the conducting wire on front, another
One end is electrically connected with the pad 35 on side.To, infrared emission chip 1 and infrared receiver chip 2 can simultaneously with circuit base
Pad 35 on pad 34, side on 3 back side of plate is electrically connected.It can select vertical patch or side patch according to specific needs during installation
On circuit boards.
In order to make lens integration infrared tube mould group integrally can be preferably close to circuit board, the back side, the side of circuit substrate 3
Face is plane.Meanwhile first is respectively provided with a mounting plane, the first reflection on mirror lens 4 and the second mirror lens 5
The mounting plane 42 of lens 4, the second mirror lens 5 mounting plane 52 and circuit substrate 3 on pad 35 side it is equal
Positioned at the same side.Lens integration infrared tube mould group after the patch of side, the side of circuit substrate 3 can be close to circuit board, and
And first mirror lens 4 and the second mirror lens 5 can also be close to circuit board.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of lens integration infrared tube mould group, including infrared emission chip and infrared receiver chip, which is characterized in that
The lens integration infrared tube mould group further includes circuit substrate, the first mirror lens and the second mirror lens, the electricity
Conducting wire is laid on base board, the infrared emission chip and infrared receiver chip are set to the circuit at certain intervals
On substrate, and it is electrically connected respectively with the conducting wire on the circuit substrate；First mirror lens and the second mirror lens
Also it is set to the circuit substrate at certain intervals, is formed interspace in advance between the two；The infrared emission chip is embedded at institute
It states in the first mirror lens, the infrared receiver chip is in second mirror lens；The first mirror lens tool
Have the first reflecting surface, second mirror lens has the second reflecting surface, the infrared signal that the infrared emission chip issues according to
It is secondary by first reflecting surface, the second reflecting surface reflection after, into the infrared receiver chip.
2. lens integration infrared tube mould group as described in claim 1, which is characterized in that the conduction on the circuit substrate
Route includes the first conducting wire, the second conducting wire and the third conducting wire of mutually insulated isolation；The infrared emission
Chip is electrically connected with first conducting wire jointly with the cathode of infrared receiver chip, the anode of the infrared emission chip with
The second conducting wire electrical connection, the anode of the infrared receiver chip are electrically connected with the third conducting wire.
3. lens integration infrared tube mould group as described in claim 1, which is characterized in that the first mirror lens and second is instead
It penetrates lens to be oppositely arranged, and symmetrical along the center of the circuit substrate.
4. lens integration infrared tube mould group as described in claim 1, which is characterized in that the of first mirror lens
One reflecting surface is a clinoplain, and the second reflecting surface of second mirror lens is also a clinoplain, first reflection
Face and the second reflecting surface along it is described it is pre- interspace it is arranged symmetrically.
5. lens integration infrared tube mould group as described in claim 1, which is characterized in that the circuit substrate has just
Face, the back side and side, the conducting wire are located on the front, the infrared emission chip, infrared receiver chip, first
Mirror lens and the second mirror lens are all set on the front of the circuit substrate；Pad, institute are provided on the back side
Stating has inner conductive route inside circuit substrate, the conducting wire electricity on one end of the inner conductive route and the front
Connection, the other end are electrically connected with the pad on the back side.
6. lens integration infrared tube mould group as claimed in claim 1 or 5, which is characterized in that the circuit substrate has
Front, the back side and side, the conducting wire are located on the front, the infrared emission chip, infrared receiver chip, the
One mirror lens and the second mirror lens are all set on the front of the circuit substrate；Be provided on the side pad with
And surface conductance route, one end of the surface conductance route with it is described front on conducting wire be electrically connected, the other end and
Pad electrical connection on the side.
7. lens integration infrared tube mould group as claimed in claim 6, which is characterized in that the side of the circuit substrate is
Plane.
8. lens integration infrared tube mould group as claimed in claim 7, which is characterized in that first mirror lens and
It is respectively provided with a mounting plane on second mirror lens, the mounting plane of first mirror lens, the second mirror lens
Side on mounting plane and the circuit substrate with pad is respectively positioned on the same side.
9. a kind of infrared sensor, which is characterized in that it includes lens one as claimed in any of claims 1 to 8 in one of claims
Change infrared tube mould group and signal processing circuit, the lens integration infrared tube mould group and signal processing circuit electricity
Connection.
10. infrared sensor as claimed in claim 9, which is characterized in that the infrared sensor further includes opaque baffle
And movable part；The movable part is fixedly connected with the opaque baffle, and the opaque baffle follows the movable part
Movement can enter or leave described pre- interspace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910046685.6A CN109727967A (en) | 2019-01-18 | 2019-01-18 | Lens integration infrared tube mould group and the infrared sensor with the mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910046685.6A CN109727967A (en) | 2019-01-18 | 2019-01-18 | Lens integration infrared tube mould group and the infrared sensor with the mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109727967A true CN109727967A (en) | 2019-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910046685.6A Pending CN109727967A (en) | 2019-01-18 | 2019-01-18 | Lens integration infrared tube mould group and the infrared sensor with the mould group |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995010056A1 (en) * | 1993-10-05 | 1995-04-13 | Intelectron Products Company | Wide-angle motion detector with close-in reflector |
| JPH10223926A (en) * | 1997-02-13 | 1998-08-21 | Sharp Corp | Photo-coupling device |
| CN1901235A (en) * | 2005-07-21 | 2007-01-24 | 罗姆股份有限公司 | Surface mount type photo-interrupter and method for manufacturing the same |
| CN101387513A (en) * | 2008-08-28 | 2009-03-18 | 上海科勒电子科技有限公司 | Distance detecting induction device |
| CN101387514A (en) * | 2008-08-28 | 2009-03-18 | 上海科勒电子科技有限公司 | Distance detecting induction device |
| CN209357725U (en) * | 2019-01-18 | 2019-09-06 | 深圳成光兴光电技术股份有限公司 | Lens integration infrared tube mould group and the infrared sensor with the mould group |
-
2019
- 2019-01-18 CN CN201910046685.6A patent/CN109727967A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995010056A1 (en) * | 1993-10-05 | 1995-04-13 | Intelectron Products Company | Wide-angle motion detector with close-in reflector |
| JPH10223926A (en) * | 1997-02-13 | 1998-08-21 | Sharp Corp | Photo-coupling device |
| CN1901235A (en) * | 2005-07-21 | 2007-01-24 | 罗姆股份有限公司 | Surface mount type photo-interrupter and method for manufacturing the same |
| CN101387513A (en) * | 2008-08-28 | 2009-03-18 | 上海科勒电子科技有限公司 | Distance detecting induction device |
| CN101387514A (en) * | 2008-08-28 | 2009-03-18 | 上海科勒电子科技有限公司 | Distance detecting induction device |
| CN209357725U (en) * | 2019-01-18 | 2019-09-06 | 深圳成光兴光电技术股份有限公司 | Lens integration infrared tube mould group and the infrared sensor with the mould group |
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