CN110535026A - Laser diode package structure - Google Patents
Laser diode package structure Download PDFInfo
- Publication number
- CN110535026A CN110535026A CN201810986244.XA CN201810986244A CN110535026A CN 110535026 A CN110535026 A CN 110535026A CN 201810986244 A CN201810986244 A CN 201810986244A CN 110535026 A CN110535026 A CN 110535026A
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- Prior art keywords
- support plate
- laser diode
- package structure
- diode chip
- diode package
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- 230000003287 optical effect Effects 0.000 claims abstract description 35
- 229920001971 elastomer Polymers 0.000 claims description 28
- 239000005060 rubber Substances 0.000 claims description 28
- 238000010276 construction Methods 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention provides a kind of laser diode package structure, including laser diode chip, the first support plate and the second support plate.Laser diode chip has the optical axis of projection source.First support plate has adjacent and is mutually vertical first surface and second surface.Laser diode chip is configured at the first surface of the first support plate.Second support plate has bonding land.The second surface of first support plate is connected on the bonding land of the second support plate, so that the first support plate is erectly set to the second support plate, and the optical axis of laser diode chip is parallel to the normal direction of the second support plate.
Description
Technical field
The present invention relates to a kind of encapsulating structure more particularly to a kind of laser diode package structures.
Background technique
Currently, due to often carrying out the engagement of perpendicular elements in such a way that convex block arranges in pairs or groups chip bonding, thus easily cause member
Part offset or inclination.For laser diode package structure, after the engagement for carrying out perpendicular elements, it is necessary to make two pole of laser
The optical axis of pipe is shone upwards with the direction perpendicular to support plate.Therefore, for the member of the high precision status requirement such as laser diode
For part, if only carrying out the engagement of perpendicular elements in such a way that convex block arranges in pairs or groups chip bonding, it is easy that finished product is made to have yield drop
Low problem.
Summary of the invention
The present invention provides a kind of laser diode package structure, the optical axis of laser diode can be made with scheduled angle or
It shines towards scheduled direction, is especially shone upwards with the direction perpendicular to support plate.
Laser diode package structure of the invention, including laser diode chip, the first support plate and the second support plate.Swash
Luminous diode chip has the optical axis of projection source.First support plate has adjacent and is mutually vertical first surface and the second table
Face.Laser diode chip is configured at the first surface of the first support plate.Second support plate has bonding land.Second table of the first support plate
Face is connected on the bonding land of the second support plate, and the first support plate is made erectly to be set to the second support plate, and laser diode chip
Optical axis is parallel to the normal direction of the second support plate.
In one embodiment of this invention, the second above-mentioned support plate has positioning groove.Bonding land is located in positioning groove,
And first a part of support plate be located on the bonding land in positioning groove.The normal direction of bonding land is parallel to laser diode core
The optical axis of piece.
In one embodiment of this invention, the second above-mentioned support plate has third surface.Third normal to a surface direction is flat
Row is in the optical axis of laser diode chip.Positioning groove is depressed in third surface, and laser diode chip is by being butted on third table
On face and it is located at by positioning groove.
In one embodiment of this invention, above-mentioned laser diode package structure further includes conductive rubber, is configured at sharp
Between luminous diode chip and the third surface of the second support plate.Wherein, the second support plate has line construction, and conductive rubber is electrical
It is connected to the line construction of laser diode chip and the second support plate
In one embodiment of this invention, above-mentioned positioning groove has the first side wall for being connected to bonding land.First side
The normal direction of wall is perpendicular to optical axis.First support plate includes the 4th surface relative to first surface.4th table of the first support plate
The a part in face is connected to the first side wall of positioning groove.
In one embodiment of this invention, above-mentioned positioning groove, which has, is connected to bonding land and relative to the first side wall
Second sidewall, the height of the first side wall are greater than the height of second sidewall.
In one embodiment of this invention, above-mentioned laser diode package structure further includes an at least conductive pin.First
Support plate includes first line structure, and the second support plate includes the second line construction.Each conductive pin is inserted in the first support plate and second and carries
Plate, and it is connected to first line structure and the second line construction.
In one embodiment of this invention, the first above-mentioned support plate includes being set at least the 1 first of second surface to open
Hole.First aperture exposes local first line structure.Second support plate includes third surface and is set to third surface extremely
Few one second aperture.Second aperture exposes the second local line construction.Each conductive pin is located at corresponding first aperture and the
In two apertures.
In one embodiment of this invention, above-mentioned laser diode package structure further includes an at least conductive rubber.It leads
Electric colloid connects the second surface of the first support plate and the third surface of the second support plate, and is filled between the first aperture and conductive pin
Gap and the second aperture and conductive pin between gap.
In one embodiment of this invention, an above-mentioned at least conductive rubber includes that multiple conductive rubbers are respectively arranged at
An at least barrier structure is respectively arranged between one support plate and the second support plate, and between multiple conductive rubbers to be separated each other.
Based on above-mentioned, in laser diode package structure of the invention, laser diode chip has projection source
Optical axis, the first support plate have adjacent and are mutually vertical first surface and second surface.Then, by by laser diode chip
It is configured at the first surface of the first support plate, the second surface of the first support plate is connected on the bonding land of the second support plate, and then make
First support plate is erectly set to the second support plate, and the optical axis of laser diode chip is parallel to the normal direction of the second support plate.
Design whereby so that the optical axis of the laser diode of laser diode package structure of the invention with the direction perpendicular to support plate to
It is upper to shine.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make
Carefully it is described as follows.
Detailed description of the invention
Figure 1A to Fig. 1 C is the diagrammatic cross-section of the manufacturing method of the laser diode package structure of one embodiment of the invention；
Fig. 2A to Fig. 2 F is the section signal of the manufacturing method of the laser diode package structure of another embodiment of the present invention
Figure.
Drawing reference numeral explanation:
100,200: laser diode package structure
110,210: laser diode chip
120,220: the first support plate
121,221: first surface
122,222: second surface
123,223: adhesion layer
124: the four surfaces
130,230: the second support plate
131: positioning groove
132,137,232: bonding land
133,233: third surface
134: the first side wall
135: second sidewall
136: line construction
140,240: conductive rubber
224: first line structure
225: the first apertures
231: the second line constructions
234: the second apertures
235: the four surfaces
250: conducting wire
260: conductive pin
270: barrier structure
L: optical axis
Specific embodiment
Figure 1A to Fig. 1 C is the diagrammatic cross-section of the manufacturing method of the laser diode package structure of one embodiment of the invention.
Figure 1A is please referred to, the laser diode chip 110 in laser diode package structure 100 is configured at the first support plate
On 120.Specifically, in the present embodiment, laser diode chip 110 has the optical axis L of projection source, the first support plate 120
With adjacent and be mutually vertical first surface 121 and second surface 122.Then, laser diode chip 110 is configured at
On the first surface 121 of one support plate 120.In the present embodiment, the configuration method of laser diode chip 110 is, for example, first the
It is, for example, epoxy resin, chip coherent film (die attach that adhesion layer 123 is arranged on the first surface 121 of one support plate 120
Film, DAF), B rank (B-Stage) glue material, laser diode chip 110 is fixed on the first support plate followed by adhesion layer 123
On 120 first surface 121, but the present invention does not limit the configuration method of laser diode chip 110.
Then, Figure 1B is please referred to, forms positioning groove 131 on the second support plate 130.In the present embodiment, positioning is formed
The method of groove 131 be, for example, using the method that milling cutter is cut be cut into positioning groove 131 on the second support plate 130, but not with
This is limited.In other embodiments, the method that also can use laser processing forms positioning groove 131.In the present embodiment,
Two support plates 130 have bonding land 132 and third surface 133, and wherein bonding land 132 is located in positioning groove 131, and makes to position recessed
Slot 131 is depressed in third surface 133.In addition, positioning groove 131 also have be connected to bonding land 132 the first side wall 134, with
And it is connected to bonding land 132 and relative to the second sidewall of the first side wall 134 135.Wherein, the height of the first side wall 134 is greater than
The height of second sidewall 135.In addition, the second support plate 130 also has line construction 136, laser diode package structure 100 is more wrapped
Conductive rubber 140 is included, e.g. tin cream, elargol etc. has electric conductivity colloid, is configured on line construction 136.
Then, Fig. 1 C is please referred to, is set to the first support plate 120 erectly on the second support plate 130, and make laser diode
The optical axis L of chip 110 is located at the centre of laser diode package structure 100.Specifically, the first support plate 120 further includes phase
For the 4th surface 124 of first surface 121, the second surface 122 of the first support plate 120 is then connected to the second support plate 130
Bonding land 132 on, a part on the 4th surface 124 of the first support plate 120 is connected to the first side wall of positioning groove 131
134, and by laser diode chip 110 by being butted on third surface 133 and being located at by positioning groove 131.Then, using fixed
Vertical the first side wall 134 supports and fixes the first support plate 120 and laser diode chip 110 in the groove 131 of position, and then makes
First support plate 120 can be erectly set on the second support plate 130, and the optical axis L of laser diode chip 110 is made to be parallel to second
The normal direction of support plate 130.At this point, a part of the first support plate 120 is located on the bonding land 132 in positioning groove 131, engagement
The normal direction in area 132 is parallel to the optical axis L of laser diode chip 110, and the normal direction on third surface 133 is parallel to laser
The optical axis L of diode chip for backlight unit 110, and the normal direction of the first side wall 134 is perpendicular to optical axis L.
It must be it is noted that in the present embodiment, the second surface 122 of the first support plate 120 be connected to the second support plate 130
Bonding land 132 on method be, for example, first on the bonding land 132 of the second support plate 130 be arranged adhesion layer 137 be, for example, epoxy
The second surface 122 of first support plate 120 is fixed on the bonding land 132 of the second support plate 130 followed by adhesion layer 137 by resin
On, but the method that the present invention is not connected to the first support plate 120 on the bonding land 132 of second support plate 130 limits.
In addition, the second support plate 130 also has line construction 136, and laser diode package structure 100 further includes conducting resinl
Body 140.It then, in the present embodiment, can be first before being set to the first support plate 120 erectly on the second support plate 130
Conductive rubber 140 is configured on the line construction 136 of two support plates 130, as shown in Figure 1B.And when the first support plate 120 is erectly arranged
After on the second support plate 130, conductive rubber 140 can be made to be located at the third table of laser diode chip 110 and the second support plate 130
Between face 133, and then pass through the route knot that conductive rubber 140 is electrically connected at laser diode chip 110 and the second support plate 130
Structure 136, as shown in Figure 1 C.
It is worth noting that in the present embodiment, in addition to the first side wall 133 vertical in positioning groove 131 can be utilized
It supports and fixes except the first support plate 120 and laser diode chip 110, while the conductive rubber of certain altitude can also be produced
140, to provide support and fixation of first support plate 120 with laser diode chip 110 in the other side.In other words, in this implementation
It, can be by adjusting the position of positioning groove 131 and conductive rubber 140 on the second support plate 130, so that laser diode in example
The optical axis L of chip 110 is located at the centre of laser diode package structure 100.
Based on above-mentioned, in the present embodiment, laser diode package structure 100 may include laser diode chip 110,
One support plate 120 and the second support plate 130.Wherein, laser diode chip 110 has the optical axis L of projection source, the first support plate
120 have adjacent and are mutually vertical first surface 121 and second surface 122, and the second support plate 120 has bonding land 132.It connects
, laser diode chip 110 is configured to the first surface 121 of the first support plate 120, that is, by the of the first support plate 120
Two surfaces 122 are connected on the bonding land 132 of the second support plate 130.And then the first support plate 120 is made erectly to be set to the second support plate
130, and the optical axis L of laser diode chip 110 is parallel to the normal direction of the second support plate 130.It designs whereby, laser two can be made
The optical axis of pole pipe chip 110 is shone upwards with the direction perpendicular to the first support plate 120.
Fig. 2A to Fig. 2 F is the section signal of the manufacturing method of the laser diode package structure of another embodiment of the present invention
Figure.
A referring to figure 2., laser diode chip 210 has the optical axis L of projection source, and the first support plate 220 is with adjacent
And it is mutually vertical first surface 221 and second surface 222, wherein it is provided with line construction 224 on first surface 221, and
It is formed at least one first aperture 225 (schematically illustrating one in Fig. 2A) on two surfaces 222 and exposes local First Line
Line structure 224.In the present embodiment, the first aperture 225 can be for example is formed in the way of laser drill, but not as
Limit.
Then, laser diode chip 210 is configured on the first surface 221 of the first support plate 220.In the present embodiment
In, the configuration method of laser diode chip 210 is, for example, that adhesion layer first is arranged on the first surface 221 of the first support plate 220
223 be, for example, epoxy resin, and laser diode chip 210 is fixed on the first of the first support plate 220 followed by adhesion layer 223
On surface 221, a modular module is formed, but the present invention does not limit the configuration method of laser diode chip 210.
Then, B referring to figure 2., is configured at by the laser diode chip 210 in laser diode package structure 200
After on first support plate 220, conducting wire 250 is set between laser diode chip 210 and the first support plate 220, so that laser two
The first line structure 224 of pole pipe chip 210 and the first support plate 220 is electrically connected via conducting wire 250.
It then, is the schematic top plan view of Fig. 2 C referring to Fig. 2 C and Fig. 2 D, Fig. 2 D.In the present embodiment, it second carries
Plate 230 has third surface 233, the 4th surface 235, the second line construction 231, bonding land 232 and is set to third surface 233
At least one second aperture 234 (two are schematically illustrated in Fig. 2 D).Wherein, the second line construction 231 is set to the 4th surface
On 235, and the second aperture 234 is located in bonding land 232 and the second aperture 234 exposes the second local line construction
231.Laser diode package structure 200 further includes an at least conductive pin 260 (two are schematically illustrated in Fig. 2 D), wherein each
Conductive pin 260 is inserted in the second aperture 234 of the second support plate 230.In the present embodiment, the second aperture 234 can be for example benefit
It is formed with the mode of laser drill, but not limited to this.
Then, E referring to figure 2., is set to the first support plate 220 erectly on the second support plate 230, and make laser diode
The optical axis L of chip 110 is located at the centre of laser diode package structure 200.Specifically, by the second of the first support plate 220
Surface 222 is connected on the bonding land 232 of the second support plate 230, that is, the first aperture 225 of the first support plate 220 is corresponded to
Conductive pin 260 on second support plate 230 plugs.Then, it can be supported using conductive pin 260 vertical in bonding land 232 and solid
Fixed first support plate 220 and laser diode chip 210, and then the first support plate 220 is enable erectly to be set to the second support plate 230
On, and the optical axis L of laser diode chip 210 is made to be parallel to the normal direction of the second support plate 230.At this point, each conductive pin 260
Both ends are inserted in respectively in the first aperture 225 of the first support plate 220 and the second aperture 234 of the second support plate 230, to be electrically connected
First line structure 224 and the second line construction 231.It, in the present embodiment, can be by adjusting conductive pin for more being walked into ㄧ
260, the position of the first aperture 225 and the second aperture 234, so that the optical axis L of laser diode chip 210 is located at two pole of laser
The centre of pipe encapsulating structure 200.
In addition, laser diode package structure 200 further includes that an at least conductive rubber 240 (schematically illustrates two in Fig. 2 D
It is a).Specifically, referring to Fig. 2 C and Fig. 2 D, before the first support plate 220 is erectly set on the second support plate 230,
Conductive rubber 240 can be first configured on the bonding land 232 of the second support plate 230.And when the first support plate 220 is erectly set to second
After on support plate 230, using conductive rubber 240 connect the first support plate 220 second surface 222 and the second support plate 230 the
Three surfaces 233, and the gap and the second aperture 234 that are filled between the first aperture 225 and conductive pin 260 and conductive pin 260
Between gap, as shown in Figure 2 F.In other words, the laser diode core in the laser diode package structure 200 of the present embodiment
Piece 210 can be electrically connected at the second line construction 231 of the second support plate 230 by conductive rubber 240 and conductive pin 260.It is worth
One is mentioned that, laser diode package structure 200 of the invention can simultaneously by conductive pin 260 and conductive rubber 240 electrically and
It is mechanically connected on the second support plate 230, the connection relationship consolidated between the first support plate 220 and the second support plate 230 is provided.
Although must be noted that two conductive rubbers 240 are respectively arranged at the first support plate 220 and by the present embodiment
Between two support plates 230, but short circuit is caused in order to avoid each conductive rubber 240 contacts with each other, divided also between each conductive rubber
An at least barrier structure 270 (schematically illustrating two in Fig. 2 D) is not provided with to be separated each other.In the present embodiment, it obstructs
Structure 270 is, for example, groove, and but not limited to this.In other embodiments, barrier structure, which is also possible to barricade or other, makes respectively
The barrier structure to insulate between a conductive rubber.
In conclusion laser diode chip has projection source in laser diode package structure of the invention
Optical axis, the first support plate have adjacent and are mutually vertical first surface and second surface.Then, by by laser diode chip
It is configured at the first surface of the first support plate, the second surface of the first support plate is connected on the bonding land of the second support plate, and then make
First support plate is erectly set to the second support plate, and the optical axis of laser diode chip is parallel to the normal direction of the second support plate.
And in the present embodiment, it can be propped up using vertical the first side wall in positioning groove or using conductive pin vertical in bonding land
The first support plate and laser diode chip are supportted and fixed, and then is set to the first support plate erectly on the second support plate.It sets whereby
Meter, so that the laser diode of laser diode package structure of the invention is located at the centre of laser diode package structure,
And the optical axis of laser diode is made to shine upwards with the direction perpendicular to support plate.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle technical staff, without departing from the spirit and scope of the present invention, when can make a little change and retouching, therefore protection of the invention
Subject to range ought be defined depending on claim.
Claims (10)
1. a kind of laser diode package structure characterized by comprising
Laser diode chip, the optical axis with projection source；
First support plate has adjacent and is mutually vertical first surface and second surface, and the laser diode chip is configured at
The first surface of first support plate；And
Second support plate, has bonding land, and the second surface of first support plate is connected to the bonding land of second support plate
On, and so that first support plate is erectly set to second support plate, and the optical axis of the laser diode chip is flat
Row is in the normal direction of second support plate.
2. laser diode package structure according to claim 1, which is characterized in that second support plate has positioning recessed
Slot, the bonding land are located in the positioning groove, and a part of first support plate is located at the institute in the positioning groove
It states on bonding land, the normal direction of the bonding land is parallel to the optical axis of the laser diode chip.
3. laser diode package structure according to claim 2, which is characterized in that second support plate has third table
Face, the third normal to a surface are oriented parallel to the optical axis of the laser diode chip, the positioning groove recess
In the third surface, and the laser diode chip is by being butted on the third surface and being located at by the positioning groove.
4. laser diode package structure according to claim 2, which is characterized in that further include:
Conductive rubber is configured between the laser diode chip and the third surface of second support plate, wherein described
Two support plates have line construction, and the conductive rubber is electrically connected at the laser diode chip and second support plate
The line construction.
5. laser diode package structure according to claim 2, which is characterized in that the positioning groove, which has, to be connected to
The first side wall of the bonding land, for the normal direction of the first side wall perpendicular to the optical axis, first support plate includes phase
For the 4th surface of the first surface, it is recessed that a part on the 4th surface of first support plate is connected to the positioning
The first side wall of slot.
6. laser diode package structure according to claim 5, which is characterized in that the positioning groove, which has, to be connected to
The height of the bonding land and second sidewall relative to the first side wall, the first side wall is greater than the second sidewall
Highly.
7. laser diode package structure according to claim 1, which is characterized in that further include:
An at least conductive pin, first support plate include first line structure, and second support plate includes the second line construction, respectively
The conductive pin is inserted in first support plate and second support plate, and is connected to the first line structure and described second
Line construction.
8. laser diode package structure according to claim 7, which is characterized in that first support plate includes being set to
At least one first aperture of the second surface, at least one first aperture expose the local first line structure,
Second support plate includes third surface and at least one second aperture for being set to the third surface, and described at least 1 second opens
Hole exposes local second line construction, and each conductive pin is located at corresponding first aperture and opens with described second
In hole.
9. laser diode package structure according to claim 8, which is characterized in that further include:
An at least conductive rubber connects the second surface of first support plate and the third table of second support plate
Face, and the gap being filled between at least one first aperture and an at least conductive pin and described at least 1 second open
Gap between hole and an at least conductive pin.
10. laser diode package structure according to claim 9, which is characterized in that an at least conductive rubber packet
It includes multiple conductive rubbers to be respectively arranged between first support plate and second support plate, and between the multiple conductive rubber respectively
An at least barrier structure is provided with to be separated each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107117772A TWI659585B (en) | 2018-05-24 | 2018-05-24 | Laser diode package strcture |
| TW107117772 | 2018-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110535026A true CN110535026A (en) | 2019-12-03 |
Family
ID=67347932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810986244.XA Pending CN110535026A (en) | 2018-05-24 | 2018-08-28 | Laser diode package structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110535026A (en) |
| TW (1) | TWI659585B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112600066A (en) * | 2020-12-31 | 2021-04-02 | 深圳市利拓光电有限公司 | Laser diode packaging |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10116943A (en) * | 1996-10-11 | 1998-05-06 | Shinko Electric Ind Co Ltd | Stem with heat sink and manufacturing method thereof |
| CN1287700A (en) * | 1998-08-05 | 2001-03-14 | 精工爱普生株式会社 | Optical module and method of manufacture thereof |
| CN201303205Y (en) * | 2008-10-22 | 2009-09-02 | 华信光电科技股份有限公司 | Laser diode device |
| CN201323703Y (en) * | 2008-11-25 | 2009-10-07 | 苏州群策科技有限公司 | Soft-hard composite circuit board structure |
| CN103227410A (en) * | 2012-01-26 | 2013-07-31 | 日亚化学工业株式会社 | Semiconductor laser device |
| US20160190767A1 (en) * | 2014-12-26 | 2016-06-30 | Nichia Corporation | Semiconductor laser device, light source device, method of producing semiconductor laser device, and method of producing light source device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1132164C (en) * | 1999-08-04 | 2003-12-24 | 株式会社日立制作所 | Laser module, optical head comprising same, and optical information recording reproducing device |
| US8791492B2 (en) * | 2009-10-01 | 2014-07-29 | Excelitas Canada, Inc. | Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same |
| DE102013217796A1 (en) * | 2013-09-05 | 2015-03-05 | Osram Opto Semiconductors Gmbh | Optoelectronic component, optoelectronic device and method for producing an optoelectronic device |
-
2018
- 2018-05-24 TW TW107117772A patent/TWI659585B/en active
- 2018-08-28 CN CN201810986244.XA patent/CN110535026A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10116943A (en) * | 1996-10-11 | 1998-05-06 | Shinko Electric Ind Co Ltd | Stem with heat sink and manufacturing method thereof |
| CN1287700A (en) * | 1998-08-05 | 2001-03-14 | 精工爱普生株式会社 | Optical module and method of manufacture thereof |
| CN201303205Y (en) * | 2008-10-22 | 2009-09-02 | 华信光电科技股份有限公司 | Laser diode device |
| CN201323703Y (en) * | 2008-11-25 | 2009-10-07 | 苏州群策科技有限公司 | Soft-hard composite circuit board structure |
| CN103227410A (en) * | 2012-01-26 | 2013-07-31 | 日亚化学工业株式会社 | Semiconductor laser device |
| US20160190767A1 (en) * | 2014-12-26 | 2016-06-30 | Nichia Corporation | Semiconductor laser device, light source device, method of producing semiconductor laser device, and method of producing light source device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112600066A (en) * | 2020-12-31 | 2021-04-02 | 深圳市利拓光电有限公司 | Laser diode packaging |
| CN112600066B (en) * | 2020-12-31 | 2022-01-07 | 深圳市利拓光电有限公司 | Laser diode packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI659585B (en) | 2019-05-11 |
| TW202005214A (en) | 2020-01-16 |
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Application publication date: 20191203 |