CN210348781U

CN210348781U - Integrated infrared keyboard geminate transistor

Info

Publication number: CN210348781U
Application number: CN201921510237.9U
Authority: CN
Inventors: 张永兵; 傅文斌
Original assignee: Shenzhen Yongyu Photoelectric Co Ltd
Current assignee: Shenzhen Yongyu Photoelectric Co Ltd
Priority date: 2019-09-11
Filing date: 2019-09-11
Publication date: 2020-04-17
Anticipated expiration: 2029-09-11

Abstract

An integrated infrared keyboard geminate transistor, the utility model relates to the technical field of semiconductor elements, wherein an IR chip is fixedly arranged on a middle PCB, an IR electrode is fixedly arranged on the upper surface of the IR chip, an IR welding wire is fixedly arranged on the IR electrode, the other end of the IR welding wire is welded on the PCB in a penetrating way, and the IR electrode and the IR welding wire are both embedded in a first packaging adhesive; a PD chip is fixedly arranged on the PCB, a PD electrode is fixedly arranged on the upper surface of the PD chip, a PD bonding wire is fixedly arranged on the PD electrode, the other end of the PD bonding wire is welded on the PCB in a penetrating manner, and the PD chip, the PD electrode and the PD bonding wire are all embedded in the second packaging adhesive; the infrared signal transmitting and receiving device is characterized in that an IR chip for transmitting infrared signals and a PD chip for receiving infrared signals are integrally installed on the same PCB and are fixedly packaged by using packaging glue, the traditional independent powder elements are integrally installed, the production process steps are reduced, the butt joint operation during installation is eliminated, the installation precision is improved, and the installation yield is ensured.

Description

Integrated infrared keyboard geminate transistor

Technical Field

The utility model relates to a semiconductor element technical field, concretely relates to integrative infrared keyboard geminate transistor.

Background

An infrared receiving tube is a semiconductor element capable of changing the intensity of current flowing through it according to the intensity of light received, and is used in the fields of light control, infrared remote control, and the like.

The existing infrared keyboard geminate transistor comprises a group of infrared transmitting tubes and infrared receiving tubes which are independently arranged, two independent electrical components of the existing infrared keyboard geminate transistor need to be manufactured and installed independently, the manufacturing cost of the existing infrared keyboard geminate transistor is increased, and in the installation process, higher installation precision is needed to ensure the butt joint operation of equipment; in view of the above disadvantages, there is a need for improvements to existing infrared pair tubes.

Disclosure of Invention

An object of the utility model is to prior art's defect and not enough, provide a reasonable in design, convenient to use's infrared keyboard geminate transistor, its PD chip integration that will launch infrared signal's IR chip and receive infrared signal is installed on same PCB board to it is fixed to use the encapsulation to glue the encapsulation, and it installs traditional independent powder component integration, has reduced the process steps of production, and the butt joint operation when having got rid of the installation, has improved the installation accuracy, has guaranteed the yield of installation.

In order to achieve the above object, the utility model adopts the following technical scheme: the packaging structure comprises a PCB (printed circuit board), an IR chip, a first packaging adhesive, a PD (PD) chip and a second packaging adhesive, wherein the PCB is fixedly provided with the IR chip, the upper surface of the IR chip is fixedly provided with an IR electrode, the IR electrode is fixedly provided with an IR welding wire, the other end of the IR welding wire is welded on the PCB in a penetrating way, the PCB is fixedly provided with the first packaging adhesive, and the IR electrode and the IR welding wire are embedded in the first packaging adhesive; the PCB is fixedly provided with a PD chip, a PD electrode is fixedly arranged on the upper surface of the PD chip, a PD bonding wire is fixedly arranged on the PD electrode, the other end of the PD bonding wire is welded on the PCB in a penetrating mode, a second packaging adhesive is fixedly arranged on the upper surface of the PCB, the PD chip, the PD electrode and the PD bonding wire are all embedded in the second packaging adhesive, and the second packaging adhesive is arranged on the right side of the first packaging adhesive.

Furthermore, the right side wall of the first packaging adhesive and the left side wall of the second packaging adhesive are arranged in parallel.

Furthermore, the left side edge of the side wall of the first packaging adhesive is arranged in a downward inclined mode, the right side edge of the side wall of the second packaging adhesive is arranged in a downward inclined mode, and the upper side wall of the first packaging adhesive and the upper side wall of the second packaging adhesive are symmetrically arranged.

After the structure is adopted, the utility model discloses beneficial effect does: integrative infrared keyboard geminate transistor, its IR chip that will launch infrared signal and the PD chip integration of receiving infrared signal install on same PCB board to it is fixed to use the encapsulation to glue the encapsulation, and it installs traditional independent powdery component integration, has reduced the process steps of production, and has got rid of the butt joint operation when installing, has improved the installation accuracy, has guaranteed the yield of installation, the utility model has the advantages of simple structure sets up rationally, the cost of manufacture hangs down.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention.

Description of reference numerals:

the PCB comprises a PCB board 1, an IR chip 2, an IR electrode 3, an IR bonding wire 4, a first packaging adhesive 5, a PD chip 6, a PD electrode 7, a PD bonding wire 8 and a second packaging adhesive 9.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

Referring to fig. 1, the present embodiment includes a PCB 1, an IR chip 2, a first packaging adhesive 5, a PD chip 6, and a second packaging adhesive 9, wherein the PCB 1 is soldered with the IR chip 2, an IR electrode 3 is soldered on an upper surface of the IR chip 2, an IR bonding wire 4 is soldered on the IR electrode 3, another end of the IR bonding wire 4 is soldered on the PCB 1, the PCB 1 is formed with the first packaging adhesive 5, and the IR electrode 3 and the IR bonding wire 4 are both embedded in the first packaging adhesive 5; a PD chip 6 is welded on the PCB 1, a PD electrode 7 is welded on the upper surface of the PD chip 6, a PD bonding wire 8 is welded on the PD electrode 7, the other end of the PD bonding wire 8 is welded on the PCB 1 in a penetrating manner, a second packaging adhesive 9 is formed on the upper surface of the PCB 1 in a machine-made manner, the PD chip 6, the PD electrode 7 and the PD bonding wire 8 are all embedded in the second packaging adhesive 9, and the second packaging adhesive 9 is arranged on the right side of the first packaging adhesive 5; the right side wall of the first packaging adhesive 5 and the left side wall of the second packaging adhesive 9 are arranged in parallel; no. 5 upper side wall's of encapsulation glue left side limit downward sloping setting, No. two encapsulation glue 9 upper side wall's right side limit downward sloping setting, and No. 5 upper side wall of encapsulation glue and No. two encapsulation glue 9 upper side wall symmetry setting.

The working principle of the specific embodiment is as follows: the PCB board 1 is installed and connected with electricity, the IR chip 2 is electrified to emit infrared rays, the infrared rays are reflected by the first packaging adhesive 5 and enter the second packaging adhesive 9, the infrared rays are reflected by the second packaging adhesive 9 in the second packaging adhesive 9 and then irradiate on the PD chip 6, the PD chip 6 receives the infrared rays and generates light sensing current, and then electric signals are penetrated out through the PD bonding wire 8 to electrically control external elements.

After adopting above-mentioned structure, this embodiment beneficial effect does: the integrated infrared keyboard geminate transistor of the embodiment integrally installs the IR chip for transmitting the infrared signal and the PD chip for receiving the infrared signal on the same PCB, and is packaged and fixed by the packaging glue, the traditional independent powder element is integrally installed, the production process steps are reduced, the butt joint operation during installation is eliminated, the installation precision is improved, and the installation yield is ensured.

The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.

Claims

1. Integrative infrared keyboard geminate transistor, its characterized in that: the packaging adhesive comprises a PCB (1), an IR chip (2), a first packaging adhesive (5), a PD chip (6) and a second packaging adhesive (9), wherein the IR chip (2) is fixedly arranged on the PCB (1), an IR electrode (3) is fixedly arranged on the upper surface of the IR chip (2), an IR bonding wire (4) is fixedly arranged on the IR electrode (3), the other end of the IR bonding wire (4) is welded on the PCB (1) in a penetrating manner, the first packaging adhesive (5) is fixedly arranged on the PCB (1), and the IR electrode (3) and the IR bonding wire (4) are both embedded in the first packaging adhesive (5); the PD chip (6) is fixedly arranged on the PCB (1), the PD electrode (7) is fixedly arranged on the upper surface of the PD chip (6), the PD bonding wire (8) is fixedly arranged on the PD electrode (7), the other end of the PD bonding wire (8) is welded on the PCB (1) in a penetrating mode, No. two packaging glue (9) is fixedly arranged on the upper surface of the PCB (1), the PD chip (6), the PD electrode (7) and the PD bonding wire (8) are all embedded in the No. two packaging glue (9), and the No. two packaging glue (9) is arranged on the right side of the first packaging glue (5).

2. The integrated infrared keyboard pair transistor of claim 1, wherein: the right side wall of the first packaging adhesive (5) and the left side wall of the second packaging adhesive (9) are arranged in parallel.

3. The integrated infrared keyboard pair transistor of claim 1, wherein: no. one encapsulation glue (5) go up the left side limit downward sloping setting of lateral wall, No. two encapsulation glue (9) go up the right side limit downward sloping setting of lateral wall, and the last lateral wall of a encapsulation glue (5) and the last lateral wall symmetry setting of No. two encapsulation glues (9).