CN220454711U

CN220454711U - Patch type pyroelectric infrared sensor

Info

Publication number: CN220454711U
Application number: CN202321617394.6U
Authority: CN
Inventors: 于磊; 张洁伟
Original assignee: SHANGHAI NICERA SENSOR CO Ltd
Current assignee: SHANGHAI NICERA SENSOR CO Ltd
Priority date: 2023-06-25
Filing date: 2023-06-25
Publication date: 2024-02-06
Anticipated expiration: 2033-06-25

Abstract

The patch type pyroelectric infrared sensor comprises a pyroelectric infrared sensor body and a patch base, wherein the pyroelectric infrared sensor body comprises a tube seat and a plurality of electric pins penetrating out of the tube seat, the patch base is connected with the tube seat, the patch base is provided with a plurality of through holes which extend along the whole height direction of the patch base and are the same as the electric pins in number, the lower ends of the electric pins penetrate into the through holes in a one-to-one correspondence manner, and the lower ends of the electric pins are hidden in the corresponding through holes; the bottom surface of paster base is equipped with a plurality of pad that correspond with a plurality of electrical pins one by one respectively, and each pad is connected with corresponding electrical pin electricity respectively. The utility model has the advantages of easy manufacture, low cost, good sealing property and heat insulation property and high patch mounting efficiency.

Description

Patch type pyroelectric infrared sensor

Technical Field

The utility model relates to a pyroelectric infrared sensor technology.

Background

Pyroelectric infrared sensors are a type of detector that converts infrared radiation signals into electrical signals. When the traditional pyroelectric infrared sensor is installed on an external PCB, holes are required to be drilled on the PCB and the traditional pyroelectric infrared sensor is welded through the manual jacks, so that the installation efficiency is low. For this reason, some manufacturers have proposed patch type pyroelectric infrared sensors. At present, in the existing patch type pyroelectric infrared sensor, a base is adopted to have the functions of a tube seat, a substrate and a patch, after the base is connected with a tube cap, tightness is difficult to ensure, and when the patch is carried out, heat is easy to conduct due to the fact that the base is directly connected with an external PCB (printed circuit board), and the requirement on the temperature resistance of a sensitive element is high; the patch type pyroelectric infrared sensor is directly installed on an external PCB circuit board through a pin patch, so that the assembly efficiency and the assembly quality are affected.

Disclosure of Invention

The utility model aims to provide the patch type pyroelectric infrared sensor which is easy to manufacture, low in cost, good in sealing performance and heat insulation performance and high in patch mounting efficiency.

The embodiment of the utility model provides a patch type pyroelectric infrared sensor, which comprises a pyroelectric infrared sensor body and a patch base, wherein the pyroelectric infrared sensor body comprises a tube seat and a plurality of electric pins penetrating out of the tube seat, the patch base is connected with the tube seat, the patch base is provided with a plurality of through holes which extend along the whole height direction of the patch base and are the same as the electric pins in number, and the lower ends of the electric pins penetrate into the through holes respectively in a one-to-one correspondence manner; the bottom surface of paster base is equipped with a plurality of pad that correspond with a plurality of electrical pins one by one respectively, and each pad is connected with corresponding electrical pin electricity respectively.

The utility model has at least the following advantages:

1. the patch base of the pyroelectric infrared sensor body is provided with the mounting pad electrically connected with the electrical pin of the pyroelectric infrared sensor body, and the patch is mounted on an external PCB circuit board through the mounting pad, so that the mounting efficiency is high, and the assembly quality is more stable;

2. the structure and the manufacturing process of the pyroelectric infrared sensor body are the same as those of the traditional pyroelectric infrared sensor, the SMD (surface mounted device) patch function is realized by connecting a patch base at the bottom of the tube seat of the pyroelectric infrared sensor body, the production process of the traditional pyroelectric infrared sensor is reserved, the production process is simplified, the manufacturing cost is reduced, and the air tightness of a product is ensured;

3. the substrate and the tube seat are reserved, so that the heat insulation performance of the product is better, and the temperature resistance requirement on the sensitive element is reduced.

Drawings

Fig. 1 to 4 show front, bottom, top and right views, respectively, of one embodiment of a patch type pyroelectric infrared sensor of the present utility model.

Fig. 5 is a schematic view showing an internal structure of one embodiment of the patch type pyroelectric infrared sensor of the present utility model.

Description of the embodiments

The utility model is further described below with reference to the accompanying drawings.

Please refer to fig. 1 to 5. The patch type pyroelectric infrared sensor according to an embodiment of the present utility model comprises a pyroelectric infrared sensor body 1 and a patch base 2.

The pyroelectric infrared sensor body 1 comprises a tube seat 11, a tube cap 12, a sensing element 13, a PCB substrate 14, a supporting member 15, and a plurality of electrical pins 16. The top surface of the cap 12 is provided with an infrared filter window 121, and the cap 12 is in sealing connection with the tube seat 11 and jointly defines an inner cavity 10. The sensing element 13, the PCB substrate 14 and the supporting component 15 are all arranged in the inner cavity 10, the PCB substrate 14 is fixed on the tube seat 11, the lower end of the supporting component 15 is fixed on the PCB substrate 14, and the sensing element 13 is supported on the supporting component 15 and is electrically connected with the PCB substrate 14. The PCB substrate 14 has a signal processing circuit that amplifies and the like the electric signal generated by the sensor. The upper ends of the plurality of electrical pins 16 are connected to the PCB substrate 14, and the lower ends of the plurality of electrical pins 16 extend out of the header 11. In the example of the figure, the number of the electrical pins 16 is four, and in other embodiments, the number of the electrical pins 16 may be three, or the like.

In the present embodiment, the support member 15 includes a pair of columns 151, and the sensor element 13 is supported on the pair of columns 151. Preferably, the Curie point of the sensor 13 is 260 ℃ or higher. For this purpose, the sensor 13 may be a high temperature resistant ceramic sensor chip.

The patch base 2 is connected to the stem 11. In the present embodiment, the patch base 2 and the stem 11 are adhesively connected by an adhesive. The bonding connection mode is convenient to implement, and the cost is low.

The patch base 2 is provided with a plurality of through holes 21 extending along the entire height direction of the patch base and having the same number as the electric pins 16, and the lower ends of the plurality of electric pins 16 penetrate into the plurality of through holes 21 in a one-to-one correspondence manner, respectively, and the lower ends of the electric pins 16 are hidden in the corresponding through holes 21. The bottom surface of the patch base 2 is provided with a plurality of mounting pads 26 corresponding to the plurality of electrical pins 16 one by one, and each mounting pad 26 is electrically connected to a corresponding electrical pin.

In the present embodiment, each of the mounting pads 26 is provided at an edge of the patch base 2 to facilitate patch mounting.

In this embodiment, the patch base 2 is a PCB board, the through holes 21 are vias of the PCB board, and each through hole 21 is electrically connected to the electrical pin 16 penetrating into the through hole and to the mounting pad 26 corresponding to the electrical pin 16 penetrating into the through hole. Each through hole 21 is soldered to the electrical pin 16 penetrating into the through hole by a conductive material including, but not limited to, solder or the like, or bonded by a conductive paste including, but not limited to, silver paste or the like. Each through hole 21 is connected to a corresponding mounting pad 26 through a copper foil lead on the PCB board.

The PCB is adopted as the patch base 2, so that the pad is more convenient to manufacture, and the manufacturing cost is low.

In other embodiments, the patch base 2 is made of ceramic or heat-resistant plastic, and the heat-resistant plastic is PI plastic, phenolic resin, or the like.

The pyroelectric infrared sensor of the embodiment is automatically mounted on an external PCB circuit board through a mounting pad by an SMD chip mounter, and has high mounting efficiency and more stable assembly quality. In addition, the structure and the manufacturing process of the pyroelectric infrared sensor body are the same as those of the traditional pyroelectric infrared sensor, the function of the SMD patch is realized by bonding a patch base at the bottom of the tube seat of the pyroelectric infrared sensor body, the production process of the traditional pyroelectric infrared sensor is reserved, the production process is simplified, the manufacturing cost is reduced, and the air tightness of the product is ensured. Meanwhile, the external dimension of the product is approximately the same as that of the traditional patch type pyroelectric infrared sensor, so that the product can be matched with the existing pyroelectric infrared sensor matching component for use, and the subsequent matching use of the product is facilitated.

Claims

1. A patch type pyroelectric infrared sensor comprises a pyroelectric infrared sensor body and a patch base; the pyroelectric infrared sensor body comprises a tube seat and a plurality of electric pins penetrating out of the tube seat; the patch base is connected with the tube seat and is provided with a plurality of through holes which extend along the whole height direction of the patch base and are the same as the electric pins in number, and the lower ends of the electric pins penetrate into the through holes respectively in a one-to-one correspondence manner;

the bottom surface of paster base is equipped with a plurality of pad that correspond with a plurality of electrical pins one by one respectively, and each pad is connected with corresponding electrical pin electricity respectively.

2. The patch type pyroelectric infrared sensor as recited in claim 1, wherein said patch base is a PCB board, said through holes are through holes of the PCB board, each through hole is electrically connected with an electrical pin penetrating into the through hole and with a mounting pad corresponding to the electrical pin penetrating into the through hole.

3. A patch type pyroelectric infrared sensor as recited in claim 2, wherein each of said through holes is connected to said electrical pins penetrating into said through holes by soldering or by bonding with conductive adhesive.

4. A patch type pyroelectric infrared sensor as recited in claim 1 wherein each of said mounting pads is provided at an edge of said patch base.

5. A patch type pyroelectric infrared sensor as recited in claim 1 wherein said patch base is adhesively attached to said tube mount.

6. The patch type pyroelectric infrared sensor as recited in claim 1, wherein said pyroelectric infrared sensor body comprises a cap, a tube seat, a sensing element, a PCB substrate and a supporting member;

the top surface of the pipe cap is provided with an infrared filter window, and the pipe cap is in sealing connection with the pipe seat and jointly defines an inner cavity; the sensing element, the PCB substrate and the supporting component are all arranged in the inner cavity, the PCB substrate is fixed on the tube seat, the lower end of the supporting component is fixed on the PCB substrate, and the sensing element is supported on the supporting component and is electrically connected with the PCB substrate; the upper ends of the plurality of electrical pins are connected with the PCB substrate.

7. A patch type pyroelectric infrared sensor as recited in claim 6 wherein said support member comprises a pair of posts, said sensing element being supported on a pair of posts.

8. A patch type pyroelectric infrared sensor as recited in claim 6 wherein said sensing element has a curie point of 260 ℃ or higher.

9. A patch type pyroelectric infrared sensor as recited in claim 1 or 6, wherein said number of said electrical pins is four.