CN113340414A - Flat quadrant laser detector assembly and preparation method thereof - Google Patents
Flat quadrant laser detector assembly and preparation method thereof Download PDFInfo
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- CN113340414A CN113340414A CN202110641611.4A CN202110641611A CN113340414A CN 113340414 A CN113340414 A CN 113340414A CN 202110641611 A CN202110641611 A CN 202110641611A CN 113340414 A CN113340414 A CN 113340414A
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 230000003139 buffering effect Effects 0.000 claims description 6
- 238000004146 energy storage Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 5
- 230000002708 enhancing effect Effects 0.000 claims description 4
- 230000003321 amplification Effects 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000007493 shaping process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0204—Compact construction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J2001/0276—Protection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/44—Electric circuits
- G01J2001/4446—Type of detector
- G01J2001/446—Photodiode
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention belongs to the technical field of semiconductor photoelectric detectors, and discloses a flat quadrant laser detector component and a preparation method thereof, wherein the detector component comprises a photosensitive chip, an amplifying circuit and a device shell; the photosensitive chip and the amplifying circuit in the detector assembly are in a planar layout; the photosensitive chip is a quadrant photodiode and is used for converting the received laser signal into a pulse current signal; the amplifying circuit adopts a single-chip hollow structure with an outer circle and an inner circle or an inner square of the outer circle, and elements such as a transistor core, an amplifier chip, a resistor and the like are integrated on a circuit substrate through double-sided surface mounting and are used for converting a plurality of paths of pulse current signals output by the photosensitive chip into pulse voltage signals and amplifying, shaping and outputting the pulse voltage signals; the device shell consists of a tube seat containing a tube seat base body and a pin and a tube cap containing a tube cap base body and an optical window. The invention has the characteristics of compact structure, simple process, high overload resistance, low cost, high reliability and the like.
Description
Technical Field
The invention belongs to the technical field of semiconductor photoelectric detectors, and relates to a flat quadrant laser detector assembly and a preparation method thereof.
Background
The photoelectric detection system applied to laser tracking, laser positioning and free space laser communication mainly uses a quadrant structure laser detector component, and the system calculates and determines target position information according to the magnitude and the offset direction of the optical axis offset. In practical application, the quadrant laser detector assembly is installed at the front end of the laser system device and used for receiving laser echo signals indicating a target position. The quadrant laser detector component is particularly suitable for the development of a high-precision real-time tracking and positioning system due to the advantages of small size, high integration level, high response speed, outstanding photoelectric interference resistance and the like.
In a traditional quadrant laser detector assembly (application publication number: CN108662979A), a three-dimensional layout mode is mostly adopted for an internal photosensitive chip and an amplifying circuit, namely, the photosensitive chip is attached to the top surface of a 'convex' table of a tube seat substrate, four separate amplifying circuits are respectively attached to four side surfaces of the 'convex' table of the tube seat substrate, the amplifying circuits are connected in a three-dimensional welding mode, but the three-dimensional layout has the following defects: (1) the longitudinal size of the detector assembly is usually larger than 15mm, so that the application of the device in a system with compact longitudinal size is severely restricted; (2) the amplifying circuit is attached to the side surface of the convex table of the tube seat substrate, so that the amplifying circuit can only adopt single-side design layout, the design redundancy of the amplifying circuit is influenced, and the design difficulty is increased; (3) the amplifying circuit adopts four pieces of separated mounting and is interconnected in a three-dimensional welding mode, so that the complexity of the assembly process of the detector assembly is increased, and the reliability is reduced.
With the continuous development of systems such as laser tracking, laser positioning and the like, the object-limited laser detector assembly is miniaturized and has high reliability, and particularly, higher requirements are provided for the longitudinal size.
Disclosure of Invention
Objects of the invention
The purpose of the invention is: aiming at the defects and practical requirements in the prior art, a flat quadrant laser detector component with a photosensitive chip and an amplifying circuit in a plane layout mode and a preparation method thereof are provided.
(II) technical scheme
In order to solve the above technical problem, the present invention provides a flat quadrant laser detector assembly, which includes: the device comprises a photosensitive chip 1, an amplifying circuit 3 and a device shell; photosensitive chip 1 and amplifier circuit 3 equipartition are arranged in the device casing, and amplifier circuit 3 is the hollow structure of center trompil, and photosensitive chip 1 is located amplifier circuit 3's center trompil department, and photosensitive chip 1 and amplifier circuit 3 top surface coplane, photosensitive chip 1 receive laser signal and convert it into pulse current signal, and amplifier circuit 3 receives the multichannel pulse current signal of photosensitive chip 1 output and converts into pulse voltage signal, and the output after the amplification and shaping.
Wherein, the photosensitive chip 1 is fixed on the conduction band substrate 2 through a conductive adhesive; the conduction band substrate 2 is fixedly arranged in the device shell through an insulating adhesive.
The photosensitive chip 1 is a quadrant photodiode, the amplifying circuit 3 is a single-chip hollow structure with an outer circle and an inner circle or an outer circle and an inner square, and the amplifying circuit 3 is formed by integrating a transistor core, an amplifier chip and a resistance element on a circuit substrate through double-sided surface mounting.
The amplifying circuit 3 is further provided with welding holes 4, the welding holes 4 are connected with tube seat pins 6 arranged on the device shell in a one-to-one correspondence mode, and the amplifying circuit 3 is connected with a signal output electric appliance through the tube seat pins 6.
Wherein the device housing comprises a base 7 and a cap 13, the amplifying circuit 3 with the photo chip 1 is arranged on the base 7, the cap 13 is mounted on the base 7 while covering over the amplifying circuit 3.
The tube seat 7 comprises a tube seat base body 5 and tube seat pins 6, the body of the tube seat base body 5 is in a circular plate shape, a raised circular table surface II9 is arranged at the center of the body, a raised annular table surface I8 is arranged on the periphery of the body, and a circular concave surface 10 is arranged at the top of the table surface II 9; the tops of the table surface I8 and the table surface II9 are coplanar and are used for supporting and installing the amplifying circuit 3, and the heights of the table surface I8 and the table surface II9 are determined according to the space required by layout of electronic components on the back surface of the amplifying circuit 3; the concave surface 10 is used for positioning and installing the conduction band substrate 2 containing the photosensitive chip 1, the depth of the concave surface 10 is consistent with the thickness of the conduction band substrate 2, the diameter of the concave surface 10 is larger than that of the conduction band substrate 2, and the conduction band substrate 2 is in clearance fit with the concave surface 10.
The pin 6 of the tube seat is provided with a glass insulating material and is sintered with the metal base of the tube seat 7 to realize the connection of an electric appliance.
The tube cap 13 comprises a tube cap base body 11 and an optical window 12 arranged in the center of the tube cap base body 11, and the tube cap base body 11 and the optical window 12 form a device shell tube cap 13 through fusion sealing or brazing; the top of the pipe cap base body 11 is provided with an annular inclined buffering structure 14, and the inclined buffering structure 14 inclines outwards and downwards and is used for enhancing the high overload resistance of the pipe cap base body 11; the optical window 12 is used for incidence of a laser signal.
The tube seat 7 and the tube cap 13 are sealed by laser sealing welding, parallel sealing welding or energy storage sealing welding, and are used for sealing the photosensitive chip and the amplifying circuit with the outside air.
The invention also provides a preparation method of the flat quadrant laser detector component, which comprises the following steps: the photosensitive chip 1 is fixed on the conduction band substrate 2 through a conductive adhesive; the conduction band substrate 2 is fixedly arranged on the concave surface 10 structure of the tube seat base body 5 through an insulating adhesive, and the conduction band substrate and the concave surface meet the concentricity requirement; the amplifying circuit 3 is fixedly arranged on a table surface I8 and a table surface II9 of the base body 5 of the tube seat through insulating adhesives, and the welding holes 4 correspond to the pins 6 of the tube seat one by one; the electrode of each quadrant of the photosensitive chip 1 is connected with the corresponding port of the amplifying circuit 3 through a transfer lead wire in a welding spot of the conduction band substrate 2, and the port of the amplifying circuit 3 is connected to the corresponding tube seat pin 6 through a welding hole 4; the tube cap base body 11 and the optical window 12 form a device shell tube cap 13 through fusion sealing or brazing, and the requirement of air tightness is met; the tube seat 7 and the tube cap 13 are sealed by laser sealing welding, parallel sealing welding or energy storage sealing welding, and the requirement of air tightness is met.
(III) advantageous effects
The flat quadrant laser detector component and the preparation method thereof provided by the technical scheme have the following beneficial effects:
(1) the photosensitive chip and the amplifying circuit in the detector assembly are arranged in a plane mode, compared with the traditional three-dimensional layout, the longitudinal size of the device can be reduced by more than 50%, the use of the device in a compact laser tracking and laser positioning system is further expanded, and particularly the system with strict requirements on the longitudinal size is adopted.
(2) The amplifying circuit used by the invention adopts a single-chip hollow structure with an excircle and an inner circle (or an excircle and an inner square), and compared with a four-chip separated amplifying circuit of a traditional quadrant detector component, the cost of the amplifying circuit with a single-chip structure can be reduced by more than 30%; secondly, the amplifying circuit can be subjected to double-sided layout design, so that the design redundancy is improved, and the design difficulty is reduced; the mounting process is simple and can be completed only by one-time mounting; in the assembly process of the detector assembly, a three-dimensional welding process among four separated amplifying circuits is not needed, the welding number of leads is reduced by more than 60%, and the reliability of products is improved.
Drawings
FIG. 1 is a schematic view of a laser detector assembly prior to assembly.
FIG. 2 is a schematic illustration of the laser detector assembly in assembly.
FIG. 3 is a schematic cross-sectional view of the laser detector assembly after assembly.
In the figure: the light-sensitive chip comprises a photosensitive chip 1, a conduction band substrate 2, an amplifying circuit 3, a welding hole 4, a tube seat base body 5, tube seat pins 6, a tube seat 7, a table top I8, a table top II9, a concave surface 10, a tube cap base body 11, a light window 12, a tube cap 13 and an inclined buffer structure 14.
Detailed Description
In order to make the objects, contents and advantages of the present invention clearer, the following detailed description of the embodiments of the present invention will be made in conjunction with the accompanying drawings and examples.
Referring to fig. 1 to 3, the flat quadrant laser detector assembly provided by the present invention includes a photosensitive chip 1, an amplifying circuit 3 and a device housing; photosensitive chip 1 and amplifier circuit 3 equipartition are arranged in the device casing, and amplifier circuit 3 is the hollow structure of center trompil, and photosensitive chip 1 is located amplifier circuit 3's center trompil department, and photosensitive chip 1 and amplifier circuit 3 top surface coplane, photosensitive chip 1 receive laser signal and convert it into pulse current signal, and amplifier circuit 3 receives the multichannel pulse current signal of photosensitive chip 1 output and converts into pulse voltage signal, and the output after the amplification and shaping.
The photosensitive chip 1 is fixed on the conduction band substrate 2 through a conductive adhesive; the conduction band substrate 2 is fixedly arranged in the device shell through an insulating adhesive.
Referring to fig. 1, the photo-sensing chip 1 of the present embodiment is a quadrant photodiode, preferably a double four-quadrant photodiode, for converting a received laser signal into a pulse current signal. The amplifying circuit 3 can adopt a single-chip hollow structure with an outer circle and an inner circle or an inner square of the outer circle, and the hollow structure with the outer circle and the inner circle of the amplifying circuit 3 is shown in fig. 1; the amplifying circuit 3 is formed by integrating a transistor core, an amplifier chip, a resistor and other elements on a circuit substrate through double-sided surface mounting and is used for converting a plurality of paths of pulse current signals output by the photosensitive chip 1 into pulse voltage signals, amplifying, shaping and outputting the pulse voltage signals; the amplifying circuit 3 is further provided with welding holes 4, the welding holes 4 are in one-to-one correspondence connection with tube seat pins 6 arranged on the device shell, and the amplifying circuit 3 is connected with a signal output electric appliance through the tube seat pins 6.
The device housing comprises a stem 7 and a cap 13, the amplifying circuit 3 with the photosensitive chip 1 being arranged on the stem 7, the cap 13 being mounted on the stem 7 while being capped over the amplifying circuit 3.
The tube seat 7 comprises a tube seat base body 5 and tube seat pins 6, the body of the tube seat base body 5 is circular plate-shaped, a raised circular table surface II9 is arranged at the center of the body, a raised annular table surface I8 is arranged on the periphery of the body, and a circular concave surface 10 is arranged at the top of the table surface II 9; the tops of the table surface I8 and the table surface II9 are coplanar and used for supporting and installing the amplifying circuit 3 and enhancing the high overload resistance of the amplifying circuit 3, and the heights of the table surface I8 and the table surface II9 are based on the space required by layout of electronic components on the back surface of the amplifying circuit 3; the concave surface 10 is used for positioning and installing the conduction band substrate 2 containing the photosensitive chip 1, the depth of the concave surface 10 is consistent with the thickness of the conduction band substrate 2, the diameter of the concave surface 10 is larger than that of the conduction band substrate 2, and the conduction band substrate 2 is in clearance fit with the concave surface 10. The socket pins 6 are provided with glass insulation material and sintered with the metal base of the socket 7 for electrical connection.
The tube cap 13 comprises a tube cap base body 11 and an optical window 12 arranged in the center of the tube cap base body 11, the tube cap base body 11 and the optical window 12 form a device shell tube cap 13 through fusion sealing or brazing, the requirement of air tightness needs to be met, and the device shell tube cap has the characteristic of high overload resistance; the top of the pipe cap base body 11 is provided with an annular inclined buffering structure 14, and the inclined buffering structure 14 inclines outwards and downwards and is used for enhancing the high overload resistance of the pipe cap base body 11; the optical window 12 is used to ensure incidence of the laser signal.
The tube seat 7 and the tube cap 13 are sealed by laser sealing welding, parallel sealing welding or energy storage sealing welding and the like, and are used for ensuring that the photosensitive chip and the amplifying circuit are hermetically connected with the outside air.
The preparation method of the flat quadrant laser detector assembly comprises the following steps: the photosensitive chip 1 is fixed on the conduction band substrate 2 through a conductive adhesive; the conduction band substrate 2 is fixedly arranged on the concave surface 10 structure of the tube seat base body 5 through an insulating adhesive, and the conduction band substrate and the concave surface meet the concentricity requirement; the amplifying circuit 3 is fixedly arranged on a table surface I8 and a table surface II9 of the base body 5 of the tube seat through insulating adhesives, and the welding holes 4 correspond to the pins 6 of the tube seat one by one; the electrode of each quadrant of the photosensitive chip 1 is connected with the corresponding port of the amplifying circuit 3 through a transfer lead wire in a welding spot of the conduction band substrate 2, and the port of the amplifying circuit 3 is connected to the corresponding tube seat pin 6 through a welding hole 4; the tube cap base body 11 and the optical window 12 form a device shell tube cap 13 through fusion sealing or brazing, and the requirement of air tightness is met; the tube seat 7 and the tube cap 13 are sealed by laser sealing welding, parallel sealing welding or energy storage sealing welding, and the like, and the requirement of air tightness is required to be met.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A flat quadrant laser detector assembly, comprising: the device comprises a photosensitive chip (1), an amplifying circuit (3) and a device shell; photosensitive chip (1) and amplifier circuit (3) equipartition are put in the device casing, amplifier circuit (3) are the hollow structure of central trompil, photosensitive chip (1) is located the central trompil department of amplifier circuit (3), photosensitive chip (1) and amplifier circuit (3) top surface coplane, photosensitive chip (1) receive laser signal and convert it into pulse current signal, amplifier circuit (3) receive the multichannel pulse current signal of photosensitive chip (1) output and convert pulse voltage signal, output after the amplification plastic.
2. The flat quadrant laser detector assembly according to claim 1, characterized in that the photo-sensitive chip (1) is fixed to the conduction band substrate (2) by means of a conductive adhesive; the conduction band substrate (2) is fixedly arranged in the device shell through an insulating adhesive.
3. The flat quadrant laser detector assembly according to claim 1, characterized in that the photosensitive chip (1) is a quadrant photodiode, the amplifying circuit (3) is a monolithic hollow structure with an outer circle and an inner circle or an inner circle, and the amplifying circuit (3) is formed by integrating a transistor core, an amplifier chip and a resistor element on a circuit substrate through double-sided surface mounting.
4. The flat quadrant laser detector assembly as claimed in claim 2, characterized in that the amplifying circuit (3) is further designed with soldering holes (4), the soldering holes (4) are correspondingly connected with the socket pins (6) disposed on the device housing, so as to connect the amplifying circuit (3) with the signal output electrical apparatus via the socket pins (6).
5. Flat quadrant laser detector assembly according to claim 4, characterized in that the device housing comprises a base (7) and a cap (13), the amplifying circuit (3) with the photosensitive chip (1) being arranged on the base (7), the cap (13) being mounted on the base (7) while being capped over the amplifying circuit (3).
6. The flat quadrant laser detector assembly of claim 5, characterized in that the tube seat (7) comprises a tube seat base body (5) and tube seat pins (6), the body of the tube seat base body (5) is in a circular plate shape, a raised circular table II (9) is arranged in the center of the body, a raised annular table I (8) is arranged on the periphery of the body, and a circular concave surface (10) is arranged on the top of the table II (9); the tops of the table top I (8) and the table top II (9) are coplanar and used for supporting and installing the amplifying circuit (3), and the heights of the table top I (8) and the table top II (9) are based on the space required by layout of electronic components on the back of the amplifying circuit (3); the concave surface (10) is used for positioning and installing the conduction band substrate (2) containing the photosensitive chip (1), the depth of the concave surface (10) is consistent with the thickness of the conduction band substrate (2), the diameter of the concave surface (10) is larger than that of the conduction band substrate (2), and the conduction band substrate (2) is in clearance fit with the concave surface (10).
7. The flat quadrant laser detector assembly of claim 6, characterized in that the header lead pins (6) are provided with glass insulation and sintered with the metal base of the header (7) for electrical connection.
8. The flat quadrant laser detector assembly as claimed in claim 7, characterized in that the tube cap (13) comprises a tube cap base body (11) and an optical window (12) arranged in the center of the tube cap base body (11), the tube cap base body (11) and the optical window (12) are sealed by fusing or brazed to form a device housing tube cap (13); the top of the pipe cap base body (11) is provided with an annular inclined buffering structure (14), and the inclined buffering structure (14) inclines outwards and downwards and is used for enhancing the high overload resistance of the pipe cap base body (11); the optical window (12) is used for incidence of a laser signal.
9. The flat quadrant laser detector assembly of claim 8, wherein the tube base (7) and the tube cap (13) are sealed by laser sealing, parallel sealing or energy storage sealing for hermetically sealing the photosensitive chip and the amplifying circuit from the outside.
10. The method for preparing the flat quadrant laser detector assembly according to claim 9, characterized in that the process is as follows: the photosensitive chip (1) is fixed on the conduction band substrate (2) through a conductive adhesive; the conduction band substrate (2) is fixedly arranged on a concave surface (10) structure of the tube seat base body (5) through an insulating adhesive, and the conduction band substrate and the concave surface meet the concentricity requirement; the amplifying circuit (3) is fixedly arranged on a table surface I (8) and a table surface II (9) of the base body (5) of the tube seat through insulating adhesives, and the welding holes (4) correspond to the pins (6) of the tube seat one by one; electrodes of each quadrant of the photosensitive chip (1) are connected with the corresponding port of the amplifying circuit (3) through a transfer lead in a welding spot of the conduction band substrate (2), and the port of the amplifying circuit (3) is connected to the corresponding tube seat pin (6) through a welding hole (4); the tube cap base body (11) and the optical window (12) form a device shell tube cap (13) through fusion sealing or brazing, and the requirement of air tightness is met; the tube seat (7) and the tube cap (13) are sealed by laser sealing welding, parallel sealing welding or energy storage sealing welding, and the requirement of air tightness is met.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110641611.4A CN113340414A (en) | 2021-06-09 | 2021-06-09 | Flat quadrant laser detector assembly and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110641611.4A CN113340414A (en) | 2021-06-09 | 2021-06-09 | Flat quadrant laser detector assembly and preparation method thereof |
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| CN113340414A true CN113340414A (en) | 2021-09-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911139A (en) * | 2022-11-29 | 2023-04-04 | 山东中科际联光电集成技术研究院有限公司 | Overload-resistant light receiving module |
| CN117191881A (en) * | 2023-10-24 | 2023-12-08 | 莱芜职业技术学院 | Photoelectric synchronous detection chip and method for books |
-
2021
- 2021-06-09 CN CN202110641611.4A patent/CN113340414A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115911139A (en) * | 2022-11-29 | 2023-04-04 | 山东中科际联光电集成技术研究院有限公司 | Overload-resistant light receiving module |
| CN115911139B (en) * | 2022-11-29 | 2023-10-27 | 山东中科际联光电集成技术研究院有限公司 | Overload-resistant light receiving assembly |
| CN117191881A (en) * | 2023-10-24 | 2023-12-08 | 莱芜职业技术学院 | Photoelectric synchronous detection chip and method for books |
| CN117191881B (en) * | 2023-10-24 | 2024-04-16 | 莱芜职业技术学院 | Photoelectric synchronous detection chip and method for books |
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